CN203803846U - Wafer cleaning brush and wafer cleaning device - Google Patents
Wafer cleaning brush and wafer cleaning device Download PDFInfo
- Publication number
- CN203803846U CN203803846U CN201420241889.8U CN201420241889U CN203803846U CN 203803846 U CN203803846 U CN 203803846U CN 201420241889 U CN201420241889 U CN 201420241889U CN 203803846 U CN203803846 U CN 203803846U
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- wafer
- brush
- wafer cleaning
- bristle
- motor
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Abstract
The utility model discloses a wafer cleaning brush and a wafer cleaning device. A first motor connected with a brush shaft drives a brush barrel to move in a first direction of the surface of a wafer and also to swing side to side in the direction; when the brush barrel rotates, the surface of the wafer experiences vertically downward friction and horizontal friction at the same time, most of particles on the surface of the wafer leave the wafer along the moving direction of the brush barrel, the particles on the surface of the wafer are removed effectively, cleaning efficiency of particles is improved, and further, product yield of the subsequent process is increased; in addition, a wafer attractor and a first water spray pipe are added to the wafer cleaning device, the wafer cleaning brush and the wafer attractor are disposed on two sides of the wafer respectively so as to achieve intensive cleaning of the wafer; meanwhile, the first water spray pipe which rotates and which is disposed right above the wafer is used to flush the wafer, the surface and edge of the wafer are both flushed, and cleaning efficiency of the wafer is improved effectively.
Description
Technical field
The utility model relates to technical field of semiconductors, relates in particular to a kind of wafer cleaning brush and wafer cleaning device.
Background technology
In wafer fabrication, along with CMP technique is used in multiple application, make and two large Ma Shi leather structure fabrication as inter-level dielectric (ILD), tungsten plug, become stricter for the cleaning of wafer.
Wherein, after CMP technique, the emphasis of the cleaning to wafer is to remove all things of staining that bring in glossing.These are stained the chemistry bringing in particle that thing comprises that abrasive grain, polished material bring and abrasive material and stain thing.The reason that these particles retain in crystal column surface has: be stressed and mechanically embed crystal column surface, be subject to the attraction of electrostatic force or atomic repulsive force and adhesive silicon wafer surface physically.
Since phase early 1990s, since CMP technique is applied in wafer fabrication, after CMP technique to the cleaning way of wafer from initial by deionized water to carrying out mega sonic wave cleaning, develop into and wafer carried out to physics shampooing with two-sided shampooing hairbrush (DSS) and deionized water.Certainly, also having occurred that many wafer cleaning devices meet cleans the wafer after CMP technique.
Refer to Fig. 1-Fig. 4, wherein, the perspective view that Fig. 1 is existing wafer cleaning device; Fig. 2 is the structural representation of existing wafer cleaning device; Fig. 3 is the cooperation schematic diagram of existing wafer cleaning brush and wafer; Fig. 4 is the schematic side view of Fig. 3.Existing wafer cleaning device comprises: three rollers 110, a pair of wafer cleaning brush 120 and two rows are provided with some for rinsing the feed pipe 140 of wafer cleaning nozzle 141 of wafer 130.Wherein, described wafer 130 is positioned on roller 110, to keep the rotation status of wafer 130 when fixing wafer 130; Described wafer cleaning brush 120 is separately positioned on the positive and negative of wafer 130, and described wafer cleaning brush 120 is clamped the positive and negative surface of wafer 130 and rolled and scrubbed in the positive and negative surface of wafer 130; Two row's feed pipes 140 are arranged at respectively wafer oblique upper.Described wafer cleaning brush 120 comprises the bristle 122 of brushing bucket 121 and being arranged at the circumferential surface of brush bucket 121, and the bristle 122 of brushing on bucket 121 is cylindric staggered transversely arranged.In the time that brush bucket 121 rotates, wafer 130 surfaces can be subject to bristle 122 rubbing action vertically downward, and the lip-deep particle of wafer 130 is moved downward along wafer 130 surfaces under the effect of bristle 122, realize the cleaning to the positive and negative surface of wafer.
But, after using, above-mentioned wafer cleaning device finds, crystal column surface still remains more particle, does not effectively remove.Therefore, how providing a kind of wafer cleaning brush and the cleaning device that can realize thorough cleaning particle is those skilled in the art's technical problems urgently to be resolved hurrily.
Utility model content
The purpose of this utility model is to provide a kind of wafer cleaning brush and wafer cleaning device, to solve after wafer cleaning brush of the prior art and wafer cleaning device use, crystal column surface still remains more particle, there is no the phenomenon of effectively removing, the problem that causes the product yield of subsequent handling to reduce.
In order to solve the problems of the technologies described above, the utility model provides a kind of wafer cleaning brush and wafer cleaning device, and described wafer cleaning brush comprises: brush bucket, the bristle that is arranged at the circumferential surface of brush bucket, the brush axle that runs through described brush bucket and the first motor being connected with described brush axle; Described the first motor drives described brush bucket to swing along first direction in the time that the first direction of the first surface of wafer moves.
Optionally, in described wafer cleaning brush, the second brush axle that described brush axle comprises the first brush axle and is connected with described the first brush axle; Described the first brush axle runs through described brush bucket; Described the second brush axle is connected with described the first motor.
Optionally, in described wafer cleaning brush, described bristle is cylindrical bristle, and described cylindrical bristle is staggered transversely arranged.
Optionally, in described wafer cleaning brush, described bristle adopts flexible material.
Optionally, in described wafer cleaning brush, described bristle adopts polyvinyl alcohol.
The utility model also provides a kind of wafer cleaning device, and described wafer cleaning device comprises: described wafer cleaning brush, wafer adsorption device, the first sparge pipe and roller before; Wherein, described wafer cleaning brush and described wafer adsorption device are arranged at respectively the both sides of wafer; Described the first sparge pipe is arranged at directly over wafer; Described roller is arranged at the edge of wafer.
Optionally, in described wafer cleaning device, described wafer adsorption device comprises: suction tray, suction sheet, fixed disk, the second motor and drive rod; Wherein, described suction sheet is pasted on fixed disk surface; The described suction sheet that described drive rod runs through described fixed disk and described fixed disk surface is connected with described suction tray, and described the second motor drives described suction tray to move along described drive rod.
Optionally, in described wafer cleaning device, on described the first sparge pipe, be provided with some wafer cleaning nozzles.
Optionally, in described wafer cleaning device, described the first sparge pipe is breeches pipe.
Optionally, in described wafer cleaning device, also comprise the 3rd motor; Described the 3rd motor is connected with described the first sparge pipe.
Optionally, in described wafer cleaning device, the first sparge pipe rotates directly over described wafer described in described the 3rd motor control.
Optionally, in described wafer cleaning device, the second brush axle that described brush axle comprises the first brush axle and is connected with described the first brush axle; Described the first brush axle runs through described brush bucket; Described the second brush axle is connected with described the first motor.
Optionally, in described wafer cleaning device, described bristle is cylindrical bristle, and described cylindrical bristle is staggered transversely arranged.
Optionally, in described wafer cleaning device, described bristle adopts flexible material.
Optionally, in described wafer cleaning device, described bristle adopts polyvinyl alcohol.
In wafer cleaning brush provided by the utility model and wafer cleaning device, drive described brush bucket to swing along first direction when crystal column surface first direction moves by the first motor connecting at brush axle.In the time that brush bucket rotates, crystal column surface can be subject to vertically downward and the rubbing action of horizontal direction simultaneously, make the most of particles on crystal column surface to leave wafer along the mobile direction of brush bucket, compare existing wafer cleaning brush and wafer cleaning device, more effectively remove the particle of crystal column surface, improve the cleaning efficiency of particle, and then improved the product yield of subsequent handling; In addition, wafer cleaning device of the present utility model, sets up wafer adsorption device and the first sparge pipe, and described wafer cleaning brush and described wafer adsorption device are arranged at respectively the both sides of wafer to wafer frontside is strengthened to cleaning; In conjunction with being arranged at the flushing of described the first sparge pipe rotating directly over wafer to wafer, crystal column surface and edge are all rinsed again, guaranteed the effect of wafer cleaning, effectively raise the efficiency of wafer cleaning.
Brief description of the drawings
Fig. 1 is the perspective view of existing wafer cleaning device;
Fig. 2 is the structural representation of existing wafer cleaning device;
Fig. 3 is the cooperation schematic diagram of existing wafer cleaning brush and wafer;
Fig. 4 is the schematic side view of Fig. 3;
Fig. 5 is the structural representation of wafer cleaning brush in the utility model one embodiment;
Fig. 6 is the structural representation of wafer cleaning device in the utility model one embodiment;
Fig. 7 is the cooperation schematic diagram of wafer cleaning brush and wafer in the utility model one embodiment;
Fig. 8 is the structural representation of wafer adsorption device in the utility model one embodiment.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, wafer cleaning brush and the wafer cleaning device that the utility model proposes are described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.It should be noted that, accompanying drawing all adopts very the form of simplifying and all uses non-ratio accurately, only in order to convenient, the object of aid illustration the utility model embodiment lucidly.
Please emphasis with reference to figure 5-Fig. 8.Fig. 5 is the structural representation of wafer cleaning brush in the utility model one embodiment, and Fig. 7 is the cooperation schematic diagram of wafer cleaning brush and wafer in the utility model one embodiment.As shown in Fig. 5 and Fig. 7, described wafer cleaning brush 222 comprises: brush bucket 10, the bristle 101 that is arranged at the circumferential surface of brush bucket 10, the brush axle 11 that runs through described brush bucket 10 and the first motor 12 being connected with described brush axle 11; Described the first motor 12 swings along first direction when driving the first direction of described brush bucket 10 first surfaces along wafer 1 to move.In the utility model embodiment, as shown in Figure 7, described first direction is vertically to move from top to bottom along the first surface of wafer 1.
Preferably, the second brush axle 14 that described brush axle 11 comprises the first brush axle 13 and is connected with described the first brush axle 13; Described the first brush axle 13 runs through described brush bucket 10; Described the second brush axle 14 is connected with described the first motor 12.
Preferably, described bristle 101 is cylindrical bristle, and described cylindrical bristle is staggered transversely arranged.
Preferably, described bristle 101 adopts flexible material, adopts polyvinyl alcohol at bristle 101 described in the utility model specific embodiment.Polyvinyl alcohol (being called for short PVA) outward appearance is white powder; it is a kind of purposes high molecular weight water soluble polymer quite widely; performance is between plastics and rubber; its purposes can be divided into fiber and the large purposes of non-fiber two, the resistance to water that has unique powerful cementability, epithelium pliability, flatness, oil resistivity, solvent resistance, protecting colloid, gas barrier performance, wearability and have through specially treated due to PVA.Therefore, adopt the cylindrical bristle of polyvinyl alcohol to brush wafer 1, not affecting wafer 1 surface can be by scratch, again can be thoroughly effective cleaning wafer.
Fig. 6 is the structural representation of wafer cleaning device in the utility model one embodiment.As shown in Figure 6, described wafer cleaning device comprises: wafer cleaning brush 222, wafer adsorption device 333 and the first sparge pipe 40 and roller 50; Wherein, described wafer cleaning brush 222 and described wafer adsorption device 333 are arranged at respectively the both sides of wafer 1; Described the first sparge pipe 40 is arranged at directly over wafer; Described roller 50 is arranged at the edge of wafer.
The use principle of the wafer cleaning device in the utility model:
Please continue to refer to Fig. 6, in the time treating cleaning wafer and clean, the first step, is positioned over wafer 1 on described roller 50; Second step, opens the first sparge pipe 40, and wafer 1 surface and edge are rinsed; The 3rd step, is used wafer adsorption device 333, the second surface of the wafer 1 that absorption process is rinsed, thus make wafer 1 depart from roller bearing 50; The 4th step, is fixed with absorption in the wafer adsorption device 333 of wafer 1 near wafer cleaning brush 222, and the first surface of wafer 1 is cleaned; The 5th step, is placed into the wafer 1 after cleaning on roller 50, again opens the first sparge pipe 40 wafer 1 surface and edge are rinsed; The 6th step, completes the cleaning to wafer 1, continues subsequent processing.
Concrete, in the time carrying out the 4th step, wafer cleaning brush 222 and described wafer adsorption device 333 are arranged at respectively the both sides of wafer 1, have carried out cleaning operation when wafer 1 is fixed; The main cleaning wafer first surface of being responsible for of described wafer cleaning brush 222, in the time that wafer first surface cleans, the brush axle 11 of wafer cleaning brush drives described brush bucket 10 to swing along first direction in the time that wafer first surface first direction moves by the first motor 12 being attached thereto; In the time that brush bucket 10 rotates, wafer first surface can be subject to vertically downward and the rubbing action of horizontal direction simultaneously, make the most of particles on wafer first surface to leave wafer along brush bucket 10 directions that move, compare existing wafer cleaning brush and wafer cleaning device, more effectively remove the particle of crystal column surface, improved the cleaning efficiency of particle.
Preferably, the wafer cleaning device in the utility model also comprises the 3rd motor 42; Described the 3rd motor 42 is connected with described the first sparge pipe 40, and described the 3rd motor 42 is controlled described the first sparge pipe 40 and rotated directly over described wafer; Wherein, described the first sparge pipe 40 is breeches pipe, on described the first sparge pipe 40, is provided with some wafer cleaning nozzles 41.
Concrete, in described the first sparge pipe 40 rotates directly over described wafer 1, spray and rinse the deionized water of crystal column surface and the mixed liquor of citric acid, the pattern of described the first sparge pipe 40 is fork-shaped, can rinse fully the surface of wafer 1 and the edge of wafer 1, in conjunction with the cleaning of 222 pairs of wafers of described wafer cleaning brush, be equivalent to that wafer 1 has been carried out to strengthening and clean, further improve the cleaning efficiency of particle, thereby improved the yield of product in subsequent handling.
Fig. 8 is the structural representation of wafer adsorption device in the utility model one embodiment.As shown in Figure 8, described wafer adsorption device 333 comprises: suction tray 20, suction sheet 21, fixed disk 22, the second motor 23 and drive rod 24; Wherein, described suction sheet 21 is pasted on fixed disk 22 surfaces; The described suction sheet 21 that described drive rod 24 runs through described fixed disk 22 and described fixed disk 22 surfaces is connected with described suction tray 20, and described the second motor 23 drives described suction tray 20 to move along described drive rod 24.Preferably, the diameter of described suction tray 20 is more than or equal to the diameter of described wafer 1, and the diameter of described fixed disk 22 equals the diameter of described suction tray 20, realizes preferably wafer adsorption device 333 absorption of wafer 1 is fixed.
Concrete, under the driving of described the second motor 23, described suction tray 20 is fixed wafer 1 with vacuum suction form, the suction sheet 21 of pasting by fixed disk 22 surfaces, to reaction forces of second surface of wafer 1, has further been fixed the position of wafer; When described the second motor 23 drives described suction tray 20 to superpose with described fixed disk 22 by drive rod 24, now for wafer is fixed to obtain the most firm moment.
Preferably, the second brush axle 14 that described brush axle 11 comprises the first brush axle 13 and is connected with described the first brush axle 13; Described the first brush axle 13 runs through described brush bucket 10; Described the second brush axle 14 is connected with described the first motor 12.
Preferably, described bristle 101 is cylindrical bristle, and described cylindrical bristle is staggered transversely arranged, and when being conducive to wafer cleaning brush 222 and carrying out wafer cleaning, crystal column surface particle removes.
Preferably, described bristle 101 adopts flexible material; Described bristle 101 adopts polyvinyl alcohol.Polyvinyl alcohol (being called for short PVA) outward appearance is white powder; it is a kind of purposes high molecular weight water soluble polymer quite widely; performance is between plastics and rubber; its purposes can be divided into fiber and the large purposes of non-fiber two, the resistance to water that has unique powerful cementability, epithelium pliability, flatness, oil resistivity, solvent resistance, protecting colloid, gas barrier performance, wearability and have through specially treated due to PVA.Therefore, adopt the cylindrical bristle of polyvinyl alcohol to brush wafer, not affecting crystal column surface can be by scratch, again can be thoroughly effective cleaning wafer.
To sum up, in wafer cleaning brush provided by the utility model and wafer cleaning device, drive described brush bucket to swing along first direction when crystal column surface first direction moves by the first motor connecting at brush axle.In the time that brush bucket rotates, crystal column surface can be subject to vertically downward and the rubbing action of horizontal direction simultaneously, make the most of particles on crystal column surface to leave wafer along the mobile direction of brush bucket, compare existing wafer cleaning brush and wafer cleaning device, more effectively remove the particle of crystal column surface, improve the cleaning efficiency of particle, and then improved the product yield of subsequent handling; In addition, wafer cleaning device of the present utility model, sets up wafer adsorption device and the first sparge pipe, and described wafer cleaning brush and described wafer adsorption device are arranged at respectively the both sides of wafer to wafer frontside is strengthened to cleaning; In conjunction with being arranged at the flushing of described the first sparge pipe rotating directly over wafer to wafer, crystal column surface and edge are all rinsed again, guaranteed the effect of wafer cleaning, effectively raise the efficiency of wafer cleaning.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model utility model.Like this, if these amendments of the present utility model and within modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to including these changes and modification.
Claims (15)
1. a wafer cleaning brush, is characterized in that, comprising: brush bucket, the bristle that is arranged at the circumferential surface of brush bucket, the brush axle that runs through described brush bucket and the first motor being connected with described brush axle; Described the first motor drives described brush bucket to swing along first direction in the time that the first direction of the first surface of wafer moves.
2. wafer cleaning brush as claimed in claim 1, is characterized in that, the second brush axle that described brush axle comprises the first brush axle and is connected with described the first brush axle; Described the first brush axle runs through described brush bucket; Described the second brush axle is connected with described the first motor.
3. wafer cleaning brush as claimed in claim 1, is characterized in that, described bristle is cylindrical bristle, and described cylindrical bristle is staggered transversely arranged.
4. wafer cleaning brush as claimed in claim 3, is characterized in that, described bristle adopts flexible material.
5. wafer cleaning brush as claimed in claim 3, is characterized in that, described bristle adopts polyvinyl alcohol.
6. a wafer cleaning device, is characterized in that, comprising: wafer cleaning brush as claimed in claim 1, wafer adsorption device, the first sparge pipe and roller; Wherein, described wafer cleaning brush and described wafer adsorption device are arranged at respectively the both sides of wafer; Described the first sparge pipe is arranged at directly over wafer; Described roller is arranged at the edge of wafer.
7. wafer cleaning device as claimed in claim 6, is characterized in that, described wafer adsorption device comprises: suction tray, suction sheet, fixed disk, the second motor and drive rod; Wherein, described suction sheet is pasted on fixed disk surface; The described suction sheet that described drive rod runs through described fixed disk and described fixed disk surface is connected with described suction tray, and described the second motor drives described suction tray to move along described drive rod.
8. wafer cleaning device as claimed in claim 6, is characterized in that, is provided with some wafer cleaning nozzles on described the first sparge pipe.
9. wafer cleaning device as claimed in claim 6, is characterized in that, described the first sparge pipe is breeches pipe.
10. wafer cleaning device as claimed in claim 6, is characterized in that, also comprises the 3rd motor; Described the 3rd motor is connected with described the first sparge pipe.
11. wafer cleaning devices as claimed in claim 10, is characterized in that, the first sparge pipe rotates directly over described wafer described in described the 3rd motor control.
12. wafer cleaning devices as claimed in claim 6, is characterized in that, the second brush axle that described brush axle comprises the first brush axle and is connected with described the first brush axle; Described the first brush axle runs through described brush bucket; Described the second brush axle is connected with described the first motor.
13. wafer cleaning devices as claimed in claim 6, is characterized in that, described bristle is cylindrical bristle, and described cylindrical bristle is staggered transversely arranged.
14. wafer cleaning devices as claimed in claim 6, is characterized in that, described bristle adopts flexible material.
15. wafer cleaning devices as claimed in claim 6, is characterized in that, described bristle adopts polyvinyl alcohol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420241889.8U CN203803846U (en) | 2014-05-12 | 2014-05-12 | Wafer cleaning brush and wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420241889.8U CN203803846U (en) | 2014-05-12 | 2014-05-12 | Wafer cleaning brush and wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203803846U true CN203803846U (en) | 2014-09-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420241889.8U Expired - Fee Related CN203803846U (en) | 2014-05-12 | 2014-05-12 | Wafer cleaning brush and wafer cleaning device |
Country Status (1)
| Country | Link |
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| CN (1) | CN203803846U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104438187A (en) * | 2014-11-28 | 2015-03-25 | 上海华力微电子有限公司 | Crystal edge cleaning device |
| CN105513994A (en) * | 2014-09-22 | 2016-04-20 | 沈阳芯源微电子设备有限公司 | Mechanism for preventing pollution to back of wafer |
| CN106486394A (en) * | 2015-09-02 | 2017-03-08 | 钛昇科技股份有限公司 | Wafer leveling device |
| CN114899132A (en) * | 2022-07-12 | 2022-08-12 | 太原市立科致业科技有限公司 | Semiconductor wafer cleaning equipment is used in processing of intelligence electronic detector |
-
2014
- 2014-05-12 CN CN201420241889.8U patent/CN203803846U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105513994A (en) * | 2014-09-22 | 2016-04-20 | 沈阳芯源微电子设备有限公司 | Mechanism for preventing pollution to back of wafer |
| CN105513994B (en) * | 2014-09-22 | 2018-02-02 | 沈阳芯源微电子设备有限公司 | A kind of mechanism for preventing wafer rear from polluting |
| CN104438187A (en) * | 2014-11-28 | 2015-03-25 | 上海华力微电子有限公司 | Crystal edge cleaning device |
| CN106486394A (en) * | 2015-09-02 | 2017-03-08 | 钛昇科技股份有限公司 | Wafer leveling device |
| CN114899132A (en) * | 2022-07-12 | 2022-08-12 | 太原市立科致业科技有限公司 | Semiconductor wafer cleaning equipment is used in processing of intelligence electronic detector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140903 Termination date: 20190512 |