CN103551344A - Full-automatic washing machine - Google Patents

Abstract

The invention discloses a full-automatic washing machine. The full-automatic washing machine comprises an enclosure, and a feeding device, a wafer fetching device, a mega sound washing device, a spinning-drying device and a discharging device which are arranged in the enclosure in sequence, wherein the wafer fetching device can be moved to convey materials among the feeding device, the mega sound washing device, the spinning-drying device and the discharging device. According to the full-automatic washing machine, all the devices for washing a wafer are integrated into one enclosure and the wafer fetching device is moved to convey the materials so as to realize the full-automatic washing of the wafer; and the washing efficiency of the wafer is improved and the production cost is saved.

Description

Automatic washing machine

technical field

The invention relates to the field of cleaning equipment, in particular to a fully automatic cleaning machine.

Background technique

The chemical reagents or impurities attached to the wafer during the manufacturing process must be cleaned in a timely manner by a cleaning machine. At present, most of the wafers are manually put into the cleaning machine for cleaning. After cleaning, they are manually taken out and dried in the dryer, which is inconvenient to operate and wastes manpower and material resources.

Contents of the invention

The invention provides a fully automatic cleaning machine, which realizes full automation of wafer cleaning and improves wafer cleaning efficiency.

In order to solve the above technical problems, the present invention provides a fully automatic cleaning machine, comprising: a casing, a feeding device sequentially arranged in the casing, a sheet taking device, a megasonic cleaning device, a drying device and a discharging device ; Wherein, the sheet taking device moves and feeds between the feeding device, the megasonic cleaning device, the spin-drying device and the discharging device.

Preferably, the feeding device includes a water tank and a feeding cylinder, and the feeding cylinder is arranged on the top of the water tank for sucking the wafers placed in the water tank.

Preferably, the film taking device includes a screw rod, a plurality of manipulators arranged on the screw mandrel, and a film taking cylinder for controlling the movement of each manipulator.

Preferably, the megasonic cleaning device includes a first megasonic shower device, a wafer scrubbing device and a second megasonic shower device, wherein the wafer scrubbing device is arranged between the first and second megasonic shower middle of the device.

Preferably, the first and second megasonic shower devices respectively include: a megasonic generator, a shower device, an adsorption device and a servo motor; wherein the megasonic generator and the shower device are arranged above the adsorption device, It is used to spray and clean the wafer placed on the adsorption device, and the servo motor controls the rotation of the adsorption device.

Preferably, the top of the spin-drying device adopts an air jet device.

Preferably, the discharge device adopts two symmetrically arranged storage tanks.

Preferably, the tops of the megasonic cleaning device, the spin-drying device and the discharge device are controlled to move by the same cylinder.

Preferably, windows are respectively provided on the casing at positions corresponding to the feeding device and the discharging device.

Preferably, the bottom of the casing is also provided with movable wheels.

Compared with the prior art, the present invention has the following advantages: the present invention integrates the various devices for cleaning the wafer into a casing, and moves and feeds the material by the taking-up device to realize fully automatic cleaning of the wafer, and improves the wafer cleaning efficiency. High cleaning efficiency, save production cost.

Description of drawings

Fig. 1 is the structural representation of fully automatic cleaning machine in a specific embodiment of the present invention;

Fig. 2 is a side view of a fully automatic washing machine in a specific embodiment of the present invention;

Fig. 3 is a schematic structural diagram of a first megasonic shower device in a specific embodiment of the present invention.

In the figure: 10-casing, 101-moving wheel, 102-window, 20-feeding device, 201-feeding cylinder, 202-water tank, 30-feeding device, 301-feeding cylinder, 302-manipulator, 303 -screw, 40-first megasonic spray device, 401-megasonic generator, 402-spray device, 403-adsorption device, 404-servo motor, 50-wafer scrubbing device, 60-second megasonic spray Shower device, 70-drying device, 80-discharging device, 90-cylinder.

Detailed ways

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that all the drawings of the present invention are in simplified form and use inaccurate scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

Please refer to Figures 1 to 3, the fully automatic cleaning machine provided by the present invention includes: a casing 10, a feeding device 20 sequentially arranged in the casing 10, a piece taking device 30, a megasonic cleaning device, and a drying device 70 and a discharge device 80; the megasonic cleaning device comprises a first megasonic shower device 40, a wafer scrubbing device 50 and a second megasonic shower device 60, and the wafer scrubbing device 50 is arranged on the first, In the middle of the second megasonic spraying device 40 , 60 ; the sheet taking device 30 moves and feeds between the feeding device 20 , the megasonic cleaning device, the spin-drying device 70 and the discharging device 80 . The present invention integrates various devices for cleaning wafers into one casing 10, and moves and feeds materials by the taking-out device 30, thereby realizing fully automatic cleaning of wafers, improving the cleaning efficiency of wafers, and saving production costs.

Please continue to refer to FIGS. 1-3 , the feeding device 20 includes a water tank 202 and a feeding cylinder 201 , and the feeding cylinder 201 is arranged on the top of the water tank for sucking wafers placed in the water tank 202 . It should be emphasized that the wafers are placed under the horizontal liquid level in the water tank 202 to avoid the wafers from being polluted by air. After the feeding cylinder 201 takes out the wafer, it is moved from the wafer taking device 30 to the first megasonic shower device 40 for subsequent cleaning.

Preferably, the film taking device 30 includes a screw rod 303 , a plurality of manipulators 302 arranged on the screw mandrel 303 , and a film taking cylinder 301 that controls the action of each manipulator 302 . When working, the chip picking cylinder 301 drives the wafer on the manipulator 302 to move, so as to realize the automatic transfer of the wafer between various devices.

Please focus on Fig. 3, the first and second megasonic shower devices 40, 60 respectively include: a megasonic generator 401, a shower device 402, an adsorption device 403 and a servo motor 404; wherein, the megasonic generator 401 And the spraying device 402 is arranged above the adsorption device 403 for spraying and cleaning the wafers placed on the adsorption device 403 , and the servo motor 404 controls the rotation of the adsorption device 403 . Specifically, during operation, the megasonic generator 401 and the spraying device 402 perform megasonic spraying on the wafer adsorbed on the adsorption device 403 at the same time, while the servo motor 404 controls the rotation of the wafer to ensure that all areas on the wafer surface are cleaned. In this embodiment, the megasonic wave generator cleans the wafer by the high-frequency vibration effect combined with the chemical reaction of the chemical cleaning agent. Under the impetus of this sound wave, the liquid molecules are accelerated, and the maximum instantaneous speed can reach 30cm/s. Therefore, no bubbles like ultrasonic cleaning will be formed, but only the high-speed fluid wave continuously impacts the wafer surface, so that the fine particles of pollutants attached to the wafer surface are forcibly removed and enter the cleaning solution. Megasonic cleaning of polishing pads can remove particles smaller than 0.2 μm on the wafer surface, which can play a role that ultrasonic waves cannot. Therefore, the first and second megasonic shower devices 40 and 60 can simultaneously perform two functions of mechanical wiping and chemical cleaning.

Please continue to refer to Fig. 1～3, as preferably, the top of described spin-drying device 70 adopts air spray device, and the top of described wafer scrubbing device 50 adopts wafer brush to scrub wafer surface, guarantees that the impurity adhering to the wafer is detached from wafer . It should be noted that the bottoms of the wafer scrubbing device 50 and the spin-drying device 70 have the same structure as the first and second megasonic shower devices 40, 60, and both include a suction device 403 and a servo motor 404. When spinning and drying the wafer, the wafer is in a state of high-speed rotation. Further, the tops of the megasonic cleaning device, drying device 70 and discharge device 80 are controlled by the same cylinder 90 to move, because when the fully automatic cleaning machine is working, all the devices in the casing 10 are working, and the work is completed. Finally, the tops of the above-mentioned devices are driven by the air cylinder 90 and moved to one side, which is convenient for the wafer taking device 30 to remove the wafers placed on the bottom of each device, ensuring the smoothness of wafer cleaning.

Please continue to refer to FIGS. 1 to 3. As a preference, the discharge device 80 adopts two symmetrically arranged storage tanks. The structure of the storage tank is the same as that of the water tank 202, and is used to store the cleaned wafers. Similarly, the wafers It is located below the liquid level of the storage tank to avoid secondary pollution.

Please refer to Fig. 2 emphatically, as a preference, the bottom of the casing 10 is also provided with movable wheels 101, which is convenient to move the automatic cleaning machine according to specific process requirements, saving manpower and material resources; the casing 10 is connected with the feeding device 20 and Windows 102 are respectively provided at corresponding positions of the discharging device 80 , so that the staff can put in the wafers to be cleaned and take out the cleaned wafers.

In summary, the fully automatic cleaning machine provided by the present invention includes: a casing 10, a feeding device 20 sequentially arranged in the casing 10, a sheet taking device 30, a megasonic cleaning device, a spin-drying device 70 and Discharging device 80; said megasonic cleaning device comprises a first megasonic shower device 40, a wafer scrubbing device 50 and a second megasonic shower device 60, and said wafer scrubbing device 50 is arranged on said first and second megasonic shower devices. In the middle of the megasonic spraying devices 40 and 60 ; the sheet taking device 30 moves and feeds between the feeding device 20 , the megasonic cleaning device, the spin-drying device 70 and the discharging device 80 . The present invention integrates various devices for cleaning wafers into a casing 10, and moves and feeds materials by the taking-out device 30 to realize fully automatic cleaning of wafers, improve the cleaning efficiency of wafers, and save production costs.

Obviously, those skilled in the art can make various changes and modifications to the invention without departing from the spirit and scope of the invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and equivalent technologies thereof, the present invention also intends to include these modifications and variations.

Claims (10)

1. A full-automatic washing machine, characterized in that, comprising: a casing, a feeding device arranged in the casing, a sheet-taking device, a megasonic cleaning device, a spin-drying device and a discharge device successively; wherein, The sheet taking device moves and feeds materials among the feeding device, the megasonic cleaning device, the spin-drying device and the discharging device. 2. The fully automatic cleaning machine according to claim 1, wherein the feeding device comprises a water tank and a feeding cylinder, and the feeding cylinder is arranged on the top of the water tank for sucking the wafers placed in the water tank. 3 . The fully automatic cleaning machine according to claim 1 , wherein the film taking device comprises a screw rod, a plurality of manipulators arranged on the screw mandrel, and a film taking cylinder for controlling the movement of each manipulator. 4 . 4. The fully automatic cleaning machine as claimed in claim 1, wherein said megasonic cleaning device comprises a first megasonic shower device, a wafer scrubbing device and a second megasonic shower device, wherein said wafer The scrubbing device is arranged in the middle of the first and second megasonic shower devices. 5. The fully automatic cleaning machine according to claim 4, wherein said first and second megasonic spraying devices respectively comprise: a megasonic wave generator, a spraying device, an adsorption device and a servo motor; wherein, The megasonic generator and the spraying device are arranged above the adsorption device for spraying and cleaning the wafers placed on the adsorption device, and the servo motor controls the rotation of the adsorption device. 6. The fully automatic washing machine according to claim 1, characterized in that, the top of the spin-drying device adopts an air jet device. 7. The fully automatic washing machine according to claim 1, characterized in that, the discharge device adopts two symmetrical storage tanks. 8 . The fully automatic cleaning machine according to claim 1 , wherein the megasonic cleaning device, the spin-drying device and the tops of the discharge device are controlled to move by the same cylinder. 9. The fully automatic washing machine according to claim 1, characterized in that windows are respectively arranged on the positions corresponding to the feeding device and the discharging device on the casing. 10. The fully automatic cleaning device according to claim 1, characterized in that, movable wheels are also arranged at the bottom of the casing.

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