CN103551344A - Full-automatic washing machine - Google Patents
Full-automatic washing machine Download PDFInfo
- Publication number
- CN103551344A CN103551344A CN201310534562.XA CN201310534562A CN103551344A CN 103551344 A CN103551344 A CN 103551344A CN 201310534562 A CN201310534562 A CN 201310534562A CN 103551344 A CN103551344 A CN 103551344A
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- China
- Prior art keywords
- washing machine
- wafer
- automatic washing
- spray equipment
- drawing mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000005406 washing Methods 0.000 title claims abstract description 31
- 238000001035 drying Methods 0.000 claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 9
- 238000004140 cleaning Methods 0.000 claims description 31
- 239000007921 spray Substances 0.000 claims description 30
- 230000007246 mechanism Effects 0.000 claims description 18
- 239000003463 adsorbent Substances 0.000 claims description 15
- 230000001680 brushing effect Effects 0.000 claims description 11
- 235000004443 Ricinus communis Nutrition 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000007599 discharging Methods 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 50
- 230000035611 feeding Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000003915 air pollution Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000005201 scrubbing Methods 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a full-automatic washing machine. The full-automatic washing machine comprises an enclosure, and a feeding device, a wafer fetching device, a mega sound washing device, a spinning-drying device and a discharging device which are arranged in the enclosure in sequence, wherein the wafer fetching device can be moved to convey materials among the feeding device, the mega sound washing device, the spinning-drying device and the discharging device. According to the full-automatic washing machine, all the devices for washing a wafer are integrated into one enclosure and the wafer fetching device is moved to convey the materials so as to realize the full-automatic washing of the wafer; and the washing efficiency of the wafer is improved and the production cost is saved.
Description
Technical field
The present invention relates to cleaning equipment field, particularly a kind of automatic washing machine.
Background technology
The chemical reagent that wafer attaches in processing procedure process or impurity must be cleaned via cleaning machine in good time.At present, be mostly to clean by manually wafer being put into cleaning machine, after having cleaned, again by manually taking out, and take in dryer and dry, operation inconvenience, and wasting manpower and material resources.
Summary of the invention
The invention provides a kind of automatic washing machine, realize the full-automation of wafer cleaning, improve wafer cleaning efficiency.
For solving the problems of the technologies described above, the invention provides a kind of automatic washing machine, comprising: casing, be successively set on feed arrangement, slice getting device, million sound cleaning devices, spin-drying device and drawing mechanism in described casing; Wherein, described slice getting device moving feeding between described feed arrangement, million sound cleaning devices, spin-drying device and drawing mechanism.
As preferably, described feed arrangement comprises tank and charging cylinder, and charging cylinder is arranged on sink top, for drawing the wafer that is placed on tank.
As preferably, described slice getting device comprises screw mandrel, be arranged on a plurality of manipulators on described screw mandrel and control each manipulator behavior get sheet cylinder.
As preferably, described million sound cleaning devices comprise the 1,000,000 sound spray equipment, wafer brushing device and the 2,000,000 sound spray equipment, and wherein, described wafer brushing device is arranged on the centre of described first, second million sound spray equipment.
As preferably, described first, second million sound spray equipment comprises respectively: mega sonic wave generator, spray equipment, adsorbent equipment and servomotor; Wherein, mega sonic wave generator and spray equipment are arranged at the top of adsorbent equipment, and for the wafer being placed on adsorbent equipment is sprayed to cleaning, described servomotor is controlled described adsorbent equipment rotation.
As preferably, the top of described spin-drying device adopts air jet system.
As preferably, described drawing mechanism adopts two symmetrically arranged material stock grooves.
As preferably, the top of described million sound cleaning devices, spin-drying device and drawing mechanism is controlled mobile by same cylinder.
As preferably, on described casing, on the position corresponding with take out device and drawing mechanism, be respectively arranged with window.
As preferably, the bottom of described casing is also provided with castor.
Compared with prior art, the present invention has the following advantages: the present invention adopts by each device for clean wafers is integrated in a casing, and by slice getting device moving feeding, realizes the automatic washing of wafer, improve the cleaning efficiency of wafer, saved production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of automatic washing machine in the embodiment of the invention;
Fig. 2 is the side view of automatic washing machine in the embodiment of the invention;
Fig. 3 is the structural representation of the 1,000,000 sound spray equipment in the embodiment of the invention.
In figure: 10-casing, 101-castor, 102-window, 20-feed arrangement, 201-charging cylinder, 202-tank, 30-slice getting device, 301-get sheet cylinder, 302-manipulator, 303-screw mandrel, 40-the 1,000,000 sound spray equipment, 401-mega sonic wave generator, 402-spray equipment, 403-adsorbent equipment, 404-servomotor, 50-wafer brushing device, 60-the 2,000,000 sound spray equipment, 70-spin-drying device, 80-drawing mechanism, 90-cylinder.
The specific embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in detail.It should be noted that, accompanying drawing of the present invention all adopts the form of simplification and all uses non-ratio accurately, only in order to convenient, the object of the aid illustration embodiment of the present invention lucidly.
Please refer to Fig. 1～3, automatic washing machine provided by the invention, comprising: casing 10, be successively set on feed arrangement 20, slice getting device 30, million sound cleaning devices, spin-drying device 70 and drawing mechanism 80 in described casing 10; Described million sound cleaning devices comprise the 1,000,000 sound spray equipment 40, wafer brushing device 50 and the 2,000,000 sound spray equipment 60, and described wafer brushing device 50 is arranged on the centre of described first, second million sound spray equipment 40,60; Described slice getting device 30 is moving feeding between described feed arrangement 20, million sound cleaning devices, spin-drying device 70 and drawing mechanism 80.The present invention is by each device for clean wafers is integrated in a casing 10, and by slice getting device 30 moving feedings, realizes the automatic washing of wafer, improved the cleaning efficiency of wafer, saving production cost.
Continue referring to Fig. 1～3, described feed arrangement 20 comprises tank 202 and charging cylinder 201, and charging cylinder 201 is arranged on sink top, for drawing the wafer that is placed on tank 202.It is emphasized that wafer is placed under the horizontal liquid level in tank 202, avoids wafer to be subject to air pollution.Charging cylinder 201 moves to the 1,000,000 sound spray equipment 40 places by slice getting device 30, to carry out follow-up cleaning action after wafer is taken out.
As preferably, described slice getting device 30 comprises screw mandrel 303, be arranged on a plurality of manipulators 302 on described screw mandrel 303 and control each manipulator 302 actions get sheet cylinder 301.During work, described in the wafer got on sheet cylinder 301 driving mechanical hands 302 move, realize the automatic transfer of wafer between each device.
Please emphasis with reference to Fig. 3, described first, second million sound spray equipment 40,60 comprises respectively: mega sonic wave generator 401, spray equipment 402, adsorbent equipment 403 and servomotor 404; Wherein, mega sonic wave generator 401 and spray equipment 402 are arranged at the top of adsorbent equipment 403, and for the wafer being placed on adsorbent equipment 403 is sprayed to cleaning, described servomotor 404 is controlled described adsorbent equipment 403 rotations.Particularly, during work, mega sonic wave generator 401 and spray equipment 402 carry out million sound sprays to the wafer being adsorbed on adsorbent equipment 403 simultaneously, and servomotor 404 is controlled wafer rotation simultaneously, guarantees that wafer surface All Ranges is all cleaned totally.In the present embodiment, mega sonic wave generator is by high frequency vibrating effect and in conjunction with the chemical reaction of chemical, wafer is cleaned.Fluid molecule is done accelerated motion under the promotion of this sound wave, and maximum instantaneous velocity can reach 30cm/s.Therefore, can not form the bubble of Ultrasonic Cleaning sample, and only with fluid wave bump wafer surface at a high speed, make the fine particles of the pollutant that wafer surface adheres to be forced to remove and enter into cleaning fluid.Mega sonic wave cleaning polishing sheet can remove the particle that is less than 0.2 μ m in wafer surface, plays the effect that ultrasonic wave does not have.Therefore, described first, second million sound spray equipment 40,60 can play mechanical pad and two kinds of effects of Chemical cleaning simultaneously.
Continue referring to Fig. 1～3, as preferably, the top of described spin-drying device 70 adopts air jet system, and the top of described wafer brushing device 50 adopts wafer brush to scrub wafer surface, and the impurity of guaranteeing to stick on wafer departs from wafer.It should be noted that, the bottom of described wafer brushing device 50 and spin-drying device 70 is identical with the structure of first, second million sound spray equipment 40,60, includes adsorbent equipment 403 and servomotor 404, therefore, when scrubbing wafer and drying wafer, wafer is all in High Rotation Speed state.Further, the top of described million sound cleaning devices, spin-drying device 70 and drawing mechanism 80 is controlled mobile by same cylinder 90, while working due to automatic washing machine, each device in casing 10 is all in work, and after having worked, the top of above-mentioned each device is driven by described cylinder 90, move to a side, be convenient to slice getting device 30 wafer of placing with each bottom of device is shifted out, guarantee the fluency of wafer cleaning.
Continue referring to Fig. 1～3, as preferably, described drawing mechanism 80 adopts two symmetrically arranged material stock grooves, the structure of described material stock groove is identical with tank 202, for preserving the wafer after having cleaned, same, wafer is positioned at below the liquid level of material stock groove, avoids secondary pollution.
Please emphasis with reference to Fig. 2, as preferably, the bottom of described casing 10 is also provided with castor 101, is convenient to move automatic washing machine according to concrete technology demand, uses manpower and material resources sparingly; On described casing 10, on the position corresponding with feed arrangement 20 and drawing mechanism 80, be respectively arranged with window 102, the wafer of being convenient to after staff puts into wafer to be cleaned and clean takes out.
In sum, automatic washing machine provided by the invention, comprising: casing 10, be successively set on feed arrangement 20, slice getting device 30, million sound cleaning devices, spin-drying device 70 and drawing mechanism 80 in described casing 10; Described million sound cleaning devices comprise the 1,000,000 sound spray equipment 40, wafer brushing device 50 and the 2,000,000 sound spray equipment 60, and described wafer brushing device 50 is arranged on the centre of described first, second million sound spray equipment 40,60; Described slice getting device 30 is moving feeding between described feed arrangement 20, million sound cleaning devices, spin-drying device 70 and drawing mechanism 80.The present invention adopts by each device for clean wafers is integrated in a casing 10, and by slice getting device 30 moving feedings, realizes the automatic washing of wafer, has improved the cleaning efficiency of wafer, saves production cost.
Obviously, those skilled in the art can carry out various changes and modification and not depart from the spirit and scope of the present invention invention.Like this, if within of the present invention these are revised and modification belongs to the scope of the claims in the present invention and equivalent technologies thereof, the present invention is also intended to comprise these change and modification.
Claims (10)
1. an automatic washing machine, is characterized in that, comprising: casing, be successively set on feed arrangement, slice getting device, million sound cleaning devices, spin-drying device and drawing mechanism in described casing; Wherein, described slice getting device moving feeding between described feed arrangement, million sound cleaning devices, spin-drying device and drawing mechanism.
2. automatic washing machine as claimed in claim 1, is characterized in that, described feed arrangement comprises tank and charging cylinder, and charging cylinder is arranged on sink top, for drawing the wafer that is placed on tank.
3. automatic washing machine as claimed in claim 1, is characterized in that, described slice getting device comprises screw mandrel, be arranged on a plurality of manipulators on described screw mandrel and control each manipulator behavior get sheet cylinder.
4. automatic washing machine as claimed in claim 1, it is characterized in that, described million sound cleaning devices comprise the 1,000,000 sound spray equipment, wafer brushing device and the 2,000,000 sound spray equipment, and wherein, described wafer brushing device is arranged on the centre of described first, second million sound spray equipment.
5. automatic washing machine as claimed in claim 4, is characterized in that, described first, second million sound spray equipment comprises respectively: mega sonic wave generator, spray equipment, adsorbent equipment and servomotor; Wherein, mega sonic wave generator and spray equipment are arranged at the top of adsorbent equipment, and for the wafer being placed on adsorbent equipment is sprayed to cleaning, described servomotor is controlled described adsorbent equipment rotation.
6. automatic washing machine as claimed in claim 1, is characterized in that, the top of described spin-drying device adopts air jet system.
7. automatic washing machine as claimed in claim 1, is characterized in that, described drawing mechanism adopts two symmetrically arranged material stock grooves.
8. automatic washing machine as claimed in claim 1, is characterized in that, the top of described million sound cleaning devices, spin-drying device and drawing mechanism is controlled mobile by same cylinder.
9. automatic washing machine as claimed in claim 1, is characterized in that, on described casing, on the position corresponding with take out device and drawing mechanism, is respectively arranged with window.
10. Full-automatic as claimed in claim 1, is characterized in that, the bottom of described casing is also provided with castor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310534562.XA CN103551344A (en) | 2013-11-01 | 2013-11-01 | Full-automatic washing machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310534562.XA CN103551344A (en) | 2013-11-01 | 2013-11-01 | Full-automatic washing machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103551344A true CN103551344A (en) | 2014-02-05 |
Family
ID=50005794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310534562.XA Pending CN103551344A (en) | 2013-11-01 | 2013-11-01 | Full-automatic washing machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103551344A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105195465A (en) * | 2015-09-21 | 2015-12-30 | 同济大学 | Fully-automatic optical element cleaning device with ultrasonic-megasonic composite frequency |
| CN105921432A (en) * | 2016-05-16 | 2016-09-07 | 苏州辰轩光电科技有限公司 | Diamond double-side brush-washing machine |
| WO2020077649A1 (en) * | 2018-10-15 | 2020-04-23 | 杭州众硅电子科技有限公司 | Cmp wafer cleaning apparatus |
| CN114247682A (en) * | 2021-11-25 | 2022-03-29 | 安徽微芯长江半导体材料有限公司 | Special post-cutting cleaning device and cleaning method for silicon carbide wafer |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1049139A2 (en) * | 1999-04-27 | 2000-11-02 | Applied Materials, Inc. | Semiconductor substrate cleaning system |
| US20050153557A1 (en) * | 2004-01-12 | 2005-07-14 | Chan-Woo Cho | Apparatus and method for treating susbtrates |
| CN102097293A (en) * | 2010-11-19 | 2011-06-15 | 嘉盛半导体(苏州)有限公司 | Cleaning machine table for semiconductor package products and cleaning process thereof |
| CN201877413U (en) * | 2010-10-11 | 2011-06-22 | 北京自动化技术研究院 | Mechanical arm for fetching silicon wafer |
| CN102513301A (en) * | 2011-12-29 | 2012-06-27 | 清华大学 | Megasonic cleaning device for wafer |
| CN103252705A (en) * | 2013-05-15 | 2013-08-21 | 清华大学 | Chemical mechanical polishing device |
| CN203250724U (en) * | 2013-04-25 | 2013-10-23 | 盛美半导体设备（上海）有限公司 | Wafer cleaning device |
-
2013
- 2013-11-01 CN CN201310534562.XA patent/CN103551344A/en active Pending
Patent Citations (7)
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|---|---|---|---|---|
| EP1049139A2 (en) * | 1999-04-27 | 2000-11-02 | Applied Materials, Inc. | Semiconductor substrate cleaning system |
| US20050153557A1 (en) * | 2004-01-12 | 2005-07-14 | Chan-Woo Cho | Apparatus and method for treating susbtrates |
| CN201877413U (en) * | 2010-10-11 | 2011-06-22 | 北京自动化技术研究院 | Mechanical arm for fetching silicon wafer |
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Non-Patent Citations (1)
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| 刘玉玲等: "微电子工艺中的清洗技术", 《洗净技术》, no. 5, 31 July 2003 (2003-07-31), pages 15 - 19 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105195465A (en) * | 2015-09-21 | 2015-12-30 | 同济大学 | Fully-automatic optical element cleaning device with ultrasonic-megasonic composite frequency |
| CN105195465B (en) * | 2015-09-21 | 2017-07-18 | 同济大学 | A kind of ultrasonic wave mega sonic wave combination frequency full-automatic optical element cleaning device |
| CN105921432A (en) * | 2016-05-16 | 2016-09-07 | 苏州辰轩光电科技有限公司 | Diamond double-side brush-washing machine |
| WO2020077649A1 (en) * | 2018-10-15 | 2020-04-23 | 杭州众硅电子科技有限公司 | Cmp wafer cleaning apparatus |
| CN114247682A (en) * | 2021-11-25 | 2022-03-29 | 安徽微芯长江半导体材料有限公司 | Special post-cutting cleaning device and cleaning method for silicon carbide wafer |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140205 |
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| RJ01 | Rejection of invention patent application after publication |