CN206997305U - A kind of Sapphire wafer surface cleaning device for different roughness and size - Google Patents
A kind of Sapphire wafer surface cleaning device for different roughness and size Download PDFInfo
- Publication number
- CN206997305U CN206997305U CN201720694012.8U CN201720694012U CN206997305U CN 206997305 U CN206997305 U CN 206997305U CN 201720694012 U CN201720694012 U CN 201720694012U CN 206997305 U CN206997305 U CN 206997305U
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- carrying bench
- wafer carrying
- electric rotating
- rotating machine
- scrub
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Abstract
It the utility model is related to a kind of Sapphire wafer surface cleaning device for different roughness and size, including wafer carrying bench, clean pipe group, scrub body and PLC, wafer carrying bench center is provided with bulge loop, vacuum cup is provided with bulge loop, wafer carrying bench is provided with some clamps, wafer carrying bench bottom is provided with base, connection bearing one end is provided with swivel joint, swivel joint is provided with exhaust tube, swivel joint is connected with motor bearings, cleaning pipe group includes cleaning liquid pipe, DI and nitrogen tube, scrub body includes scrubbing disk, screw rod and the second electric rotating machine, scrub tray bottom and be provided with hairbrush, scrub disk and be connected with transmission cylinder, transmission cylinder is provided with adjusting air valve, second electric rotating machine bottom is provided with driving cog；Physics and chemical force effect effectively can be combined by the utility model, have it is versatile, efficient, stably, the characteristics of cleansing power is strong, cleaned suitable for the Sapphire wafer surface of different roughness and size.
Description
Technical field
A kind of Sapphire wafer surface cleaning device for different roughness and size is the utility model is related to, belongs to blue
Jewel wafer manufacture equipment technical field.
Background technology
Sapphire has the advantages that hardness is high, fusing point is high, translucency is good, electrical insulating property is excellent, stable chemical performance, extensively
Applied to high-tech sectors such as machinery, optics, information, surface is covered with various foreign-matter contaminations after sapphire processing, and two stain meeting
Device performance is influenceed, in the cleaning of sapphire wafer, is on the one hand based on requiring higher to cleaning chip surface degree, on the other hand
Because the limitation of existing equipment can not almost be common to the various sizes of chip of different roughness, so in the selection of cleaning
The technique of traditional wet-cleaning is more likely to, and is that scavenging period is longer the drawbacks of the mode of wet-cleaning is brought, cleans energy
Power is limited, the less stable of cleaning.
Utility model content
The purpose of this utility model is the defects of being directed to prior art, there is provided a kind of for different roughness and the indigo plant of size
Jewel wafer surface cleaning apparatus, can effectively by physics and chemical force effect be combined, have it is versatile, efficient, stably,
The characteristics of cleansing power is strong.
The utility model is achieved by the following technical solutions：
A kind of Sapphire wafer surface cleaning device for different roughness and size, including wafer carrying bench, cleaning pipe
Group, scrub body and PLC, wherein, the wafer carrying bench center is provided with bulge loop, and vacuum cup is provided with the bulge loop,
Some clamps are provided with the wafer carrying bench top surface edge, some clamps are set around one week uniform intervals of bulge loop, the chip
Microscope carrier bottom is provided with base, and the base bottom is provided with connection bearing, and described connection bearing one end passes through base and vacuum cup
It is connected, the other end is provided with swivel joint, and the swivel joint is provided with exhaust tube, and the exhaust tube is connected with vacuum pumping pump, institute
State swivel joint and be connected with motor bearings, the motor bearings is connected with the first electric rotating machine；
The cleaning pipe group includes cleaning liquid pipe, DI and nitrogen tube, and is located at chip three side at the top of platform, institute respectively
State cleaning liquid pipe and DI is provided with flow regulator, the nitrogen tube is provided with air pressure valve, the cleaning liquid pipe, DI
With electronic valve is equipped with nitrogen tube；
The scrub body includes scrubbing disk, screw rod and the second electric rotating machine, and the scrub tray bottom is provided with hairbrush, institute
State scrub disk to be located at vacuum cup, and be connected with transmission cylinder, the transmission cylinder is provided with adjusting air valve, the screw rod
One end and transmission cylinders, and outside is provided with support, second electric rotating machine is arranged on support, and bottom is provided with transmission
Tooth, the driving cog are used cooperatively with screw rod, first electric rotating machine, electronic valve, transmission cylinder and the second electric rotating machine
Electrically connected with PLC.
A kind of above-mentioned Sapphire wafer surface cleaning device for different roughness and size, wherein, the clamp is high
Degree is more than vacuum cup to the vertical range of wafer carrying bench upper surface.
A kind of above-mentioned Sapphire wafer surface cleaning device for different roughness and size, wherein, the base with
It is screwed connected between wafer carrying bench and connection bearing, the screw is externally provided with some screw washers, some screws
Pad is between base and wafer carrying bench.
The beneficial effects of the utility model are：
The utility model structure design is compact, easy to operate, has the advantage that：（1）The indigo plant that different size can be directed to is precious
Stone chip can adjust wafer carrying bench and clamp size, and the fixation for chip is spacing solid using vacuum cup vacuum suction and clamp
Determine double insurance, ensured stabilization of the chip on microscope carrier, avoid the caused slide plate phenomenon during scrub；（2）Can foundation
The quality and technological requirement of different product, the order and run time opened using cleaning pipe group on PLC control wafer carrying bench, with
And the time that disk pushes is scrubbed, matching is suitable；（3）Scrubbing hairbrush under disk can be different according to the selection of the roughness of wafer surface
Material, so for the chip of surface different roughness, the mechanism can realize cleaning function；（4）Using the on scrub body
Two electric rotating machines, which drive, scrubs the movable of disk, in the scrub of large-sized wafer, ensures the uniformity that whole chip is scrubbed,
Effectively physics and chemical force effect can be combined, have it is versatile, efficient, stably, the characteristics of cleansing power is strong.
Brief description of the drawings
Fig. 1 is the utility model structure diagram.
Fig. 2 is the utility model driving cog and screw rod cooperation schematic diagram.
（In figure, wafer carrying bench 1, cleaning pipe group 2, scrub body 3 and PLC 4, bulge loop 5, vacuum cup 6, clamp
7, base 8, screw 9, screw washer 10, connect bearing 11, swivel joint 12, exhaust tube 13, vacuum pumping pump 14, motor bearings
15, the first electric rotating machine 16, cleaning liquid pipe 17, DI 18 and nitrogen tube 19, flow regulator 20, air pressure valve 21, electronic valve
22, disk 23, the electric rotating machine 25 of screw rod 24 and second are scrubbed, hairbrush 26, is driven cylinder 27, adjusting air valve 28, support 29, transmission
Tooth 30）.
Embodiment
Specific embodiment of the present utility model is described further below in conjunction with the accompanying drawings.
A kind of Sapphire wafer surface cleaning device for different roughness and size, including wafer carrying bench, cleaning pipe
Group, scrub body and PLC, wherein, the wafer carrying bench center is provided with bulge loop, and vacuum cup is provided with the bulge loop,
Some clamps are provided with the wafer carrying bench top surface edge, some clamps are set around one week uniform intervals of bulge loop, the clamp
Highly it is more than vacuum cup to the vertical range of wafer carrying bench upper surface, the wafer carrying bench bottom is provided with base, the base
It is screwed with wafer carrying bench and being connected between bearing connected, the screw is externally provided with some screw washers, some spiral shells
Silk pad is between base and wafer carrying bench；
The base bottom is provided with connection bearing, and described connection bearing one end is connected through base with vacuum cup, another
End is provided with swivel joint, and the swivel joint is provided with exhaust tube, and the exhaust tube is connected with vacuum pumping pump, the swivel joint
Motor bearings is connected with, the motor bearings is connected with the first electric rotating machine；
The cleaning pipe group includes cleaning liquid pipe, DI and nitrogen tube, and is located at chip three side at the top of platform, institute respectively
State cleaning liquid pipe and DI is provided with flow regulator, the nitrogen tube is provided with air pressure valve, the cleaning liquid pipe, DI
With electronic valve is equipped with nitrogen tube；
The scrub body includes scrubbing disk, screw rod and the second electric rotating machine, and the scrub tray bottom is provided with hairbrush, institute
State scrub disk to be located at vacuum cup, and be connected with transmission cylinder, the transmission cylinder is provided with adjusting air valve, the screw rod
One end and transmission cylinders, and outside is provided with support, second electric rotating machine is arranged on support, and bottom is provided with transmission
Tooth, the driving cog are used cooperatively with screw rod, first electric rotating machine, electronic valve, transmission cylinder and the second electric rotating machine
Electrically connected with PLC.
Working method of the present utility model is：
By sapphire wafer as on vacuum cup, chip is blocked by the way that clamp is spacing, clamp is highly less than chip upper table
Face to wafer carrying bench vertical range, and by PLC control vacuum pumping pump pumping chip is entered it is vacuum adsorbed and card
The spacing dual fixation of plate, wafer carrying bench height can be adjusted by increasing or decreasing screw washer between wafer carrying bench and base, and
There is the first electric rotating machine to drive wafer carrying bench rotation, electronic valve switching sequence and time are controlled by PLC, manage cleaning
Group is sprayed water by chip and jet cleaning, while controls transmission cylinder pressure with adjusting air valve, is making so as to adjust scrub disk
With the pressure on chip, control transmission Telescopic-cylinder drives scrub disk to move up and down, the second electric rotating machine is controlled with PLC
Forward or reverse, so as to coordinate driving screw rod to be moved forward and backward in support by driving cog and screw rod, drive before scrubbing disk
After move, to chip multi-azimuth cleaning, cleansing power is strong, efficient stable, and versatility is good.
It is described above, the only preferable embodiment of the utility model, but the scope of protection of the utility model is not
This is confined to, any one skilled in the art can readily occur in the technical scope that the utility model discloses
Change or replacement, should all cover in the scope of protection of the utility model.Therefore, the scope of protection of the utility model should be with
The protection domain of claims is defined.
Claims (3)
1. a kind of Sapphire wafer surface cleaning device for different roughness and size, including wafer carrying bench, cleaning pipe group,
Scrub body and PLC, it is characterized in that, the wafer carrying bench center is provided with bulge loop, and vacuum cup is provided with the bulge loop,
Some clamps are provided with the wafer carrying bench top surface edge, some clamps are set around one week uniform intervals of bulge loop, the chip
Microscope carrier bottom is provided with base, and the base bottom is provided with connection bearing, and described connection bearing one end passes through base and vacuum cup
It is connected, the other end is provided with swivel joint, and the swivel joint is provided with exhaust tube, and the exhaust tube is connected with vacuum pumping pump, institute
State swivel joint and be connected with motor bearings, the motor bearings is connected with the first electric rotating machine；
The cleaning pipe group includes cleaning liquid pipe, DI and nitrogen tube, and is located at chip three side at the top of platform respectively, described clear
Lotion pipeline and DI are provided with flow regulator, and the nitrogen tube is provided with air pressure valve, cleaning liquid pipe, DI and the nitrogen
Electronic valve is equipped with tracheae；
The scrub body includes scrubbing disk, screw rod and the second electric rotating machine, and the scrub tray bottom is provided with hairbrush, the brush
Dishwashing is located at vacuum cup, and is connected with transmission cylinder, and the transmission cylinder is provided with adjusting air valve, described screw rod one end
With being driven cylinders, and outside is provided with support, and second electric rotating machine is arranged on support, and bottom is provided with driving cog,
The driving cog is used cooperatively with screw rod, first electric rotating machine, electronic valve, transmission cylinder and the second electric rotating machine with
PLC electrically connects.
2. a kind of Sapphire wafer surface cleaning device for different roughness and size as claimed in claim 1, it is special
Levy and be, the clamp is highly more than vacuum cup to the vertical range of wafer carrying bench upper surface.
3. a kind of Sapphire wafer surface cleaning device for different roughness and size as claimed in claim 1, it is special
Levy and be, be screwed and be connected between the base and wafer carrying bench and connection bearing, the screw is externally provided with some spiral shells
Silk pad, some screw washers are between base and wafer carrying bench.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720694012.8U CN206997305U (en) | 2017-06-15 | 2017-06-15 | A kind of Sapphire wafer surface cleaning device for different roughness and size |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720694012.8U CN206997305U (en) | 2017-06-15 | 2017-06-15 | A kind of Sapphire wafer surface cleaning device for different roughness and size |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206997305U true CN206997305U (en) | 2018-02-13 |
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ID=61445902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720694012.8U Active CN206997305U (en) | 2017-06-15 | 2017-06-15 | A kind of Sapphire wafer surface cleaning device for different roughness and size |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206997305U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107413690A (en) * | 2017-06-15 | 2017-12-01 | 江苏吉星新材料有限公司 | A kind of Sapphire wafer surface cleaning device and method for different roughness and size |
| CN109550717A (en) * | 2018-12-21 | 2019-04-02 | 苏州恒力翔自动化设备有限公司 | A kind of Full-automatic wafer scrubbing unit |
| CN111167780A (en) * | 2019-12-30 | 2020-05-19 | 瀚天天成电子科技（厦门）有限公司 | Pressure regulating cleaning equipment |
| CN113617779A (en) * | 2021-07-21 | 2021-11-09 | 江西高佳光电科技有限公司 | Cleaning equipment for optical lens |
| CN114431766A (en) * | 2022-01-27 | 2022-05-06 | 王群英 | Glass plate dirt removing equipment for dining room dining table of hospital |
| CN109550717B (en) * | 2018-12-21 | 2024-04-26 | 苏州恒力翔自动化设备有限公司 | Full-automatic wafer scrubbing machine |
-
2017
- 2017-06-15 CN CN201720694012.8U patent/CN206997305U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107413690A (en) * | 2017-06-15 | 2017-12-01 | 江苏吉星新材料有限公司 | A kind of Sapphire wafer surface cleaning device and method for different roughness and size |
| CN109550717A (en) * | 2018-12-21 | 2019-04-02 | 苏州恒力翔自动化设备有限公司 | A kind of Full-automatic wafer scrubbing unit |
| CN109550717B (en) * | 2018-12-21 | 2024-04-26 | 苏州恒力翔自动化设备有限公司 | Full-automatic wafer scrubbing machine |
| CN111167780A (en) * | 2019-12-30 | 2020-05-19 | 瀚天天成电子科技（厦门）有限公司 | Pressure regulating cleaning equipment |
| CN113617779A (en) * | 2021-07-21 | 2021-11-09 | 江西高佳光电科技有限公司 | Cleaning equipment for optical lens |
| CN114431766A (en) * | 2022-01-27 | 2022-05-06 | 王群英 | Glass plate dirt removing equipment for dining room dining table of hospital |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Zhejiang Zhaojing New Material Technology Co.,Ltd. Assignor: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. Contract record no.: X2022980008188 Denomination of utility model: A surface cleaning device for sapphire wafer with different roughness and size Granted publication date: 20180213 License type: Common License Record date: 20220627 |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230104 Address after: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee after: Youran Walker (Beijing) Technology Co.,Ltd. Address before: 212200 new materials Industrial Park, Youfang Town, Yangzhong City, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU JESHINE NEW MATERIAL Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230706 Address after: 050035 No. 369, Zhujiang Avenue, high tech Zone, Shijiazhuang, Hebei Patentee after: TUNGHSU GROUP Co.,Ltd. Address before: 100102 20628, Floor 2, Building A1, No. 1, Huangchang West Road, Dougezhuang, Chaoyang District, Beijing Patentee before: Youran Walker (Beijing) Technology Co.,Ltd. |