CN204497200U - The clean board of ic substrate - Google Patents

Abstract

The utility model discloses a kind of clean board of ic substrate, comprise machine table main body, load port, cleaning chambers, feed flow and dynamical system, substrate load plate, shower nozzle and eraser is provided with in cleaning chambers, substrate load plate carries and drives substrate to rotate, shower nozzle gas jet and/or liquid, eraser comprises drive end, swing arm and rubbing head, this swing arm swings centered by drive end, swing arm is parallel to substrate load plate, rubbing head is arranged in swing arm, rubbing head along with contact substrate in the process of swing arm motion surface and produce mechanical force with clean substrate.Adopt clean board of the present utility model to clean ic substrate, can raise the efficiency, and remove stain.

Description

IC substrate cleaning machine

technical field

The utility model relates to the field of integrated circuit production and processing, in particular to a cleaning machine platform for semiconductor substrates.

Background technique

As the carrier of integrated circuit components, the performance of semiconductor substrates in their original state has attracted more and more attention from the industry. Studies have shown that semiconductor substrates go through as many necessary processing processes as possible to greatly improve the overall yield of substrate products. According to product needs, these possible processing processes include but are not limited to etching, developing, gluing and Grinding and other processes. Since each process is relatively independent, and the chemicals used in each process step are also different, the semiconductor substrate usually needs to be cleaned after one or several processes are completed. This is why the demand for cleaning machines in the semiconductor industry is extremely strong.

Cleaning machines commonly found in the semiconductor market usually use rinsing, immersion or spraying to clean the substrate. When the substrate is processed by rinsing or spraying, the substrate is placed in the cleaning chamber or rotated in the chamber, and the cleaning liquid is continuously sprayed from the nozzle to the substrate until the residual liquid and particles are removed and the substrate is taken out, and the cleaning process is over. . To clean the substrate by immersion, the substrate needs to be completely submerged in the cleaning solution, and after a period of immersion and reaction, the substrate is taken out and cleaned. Using the above-mentioned several cleaning methods can make the substrate cleaner to a certain extent, but they all have a common disadvantage, that is, there is a problem of insufficient cleaning strength because none of the cleaning methods involves mechanical cleaning. For some stubborn stains attached to the surface of the substrate, the above-mentioned cleaning methods are often unable to remove them, which eventually leads to a low cleanliness of the substrate.

Utility model content

Aiming at the problems existing in the prior art, the utility model develops a novel integrated circuit substrate cleaning machine, which can remove stubborn stains on the surface of the substrate and make the substrate cleaner.

In order to achieve the above object, the utility model provides the following technical solutions:

A cleaning machine for integrated circuit substrates, including a machine body, a loading port, a cleaning chamber, a liquid supply, and a power system. The cleaning chamber is provided with a substrate carrier, a nozzle, and an eraser. The substrate carrier carries and drives the substrate to rotate , the spray head sprays gas and/or liquid, the eraser includes a driving end, a swing arm and a wiping head, the swing arm swings around the driving end, the swing arm is parallel to the substrate carrier, the wiping head is arranged on the swing arm, and the wiping head During the movement with the swing arm, it contacts the surface of the substrate and generates mechanical force to clean the substrate.

Further, the substrate is placed on the substrate carrier, and the distance from the driving end to the wiping head is equal to the distance from the driving end to the center of the substrate.

Further, the eraser is a soft brush, a cloth brush or a sponge brush.

Further, the spray head includes a gas spray head, an atomizing spray head and a high-pressure spray head.

Further, the eraser stays at an initial position outside the substrate carrier in a non-operating state.

Further, a self-cleaning device for cleaning the eraser is provided at the initial position.

Further, when the shower heads are not working, they stay at their rest stations, and the rest stations are located outside the substrate carrier.

Further, a sump for collecting residual liquid is provided at the resting station.

Optionally, the driving end is a motor or a motor.

Further, the cleaning platform also includes a centering device and a manipulator.

Using the cleaning machine in the utility model to clean the substrate not only has reliable performance and higher cleanliness, but also has higher efficiency and meets the needs of the market.

Description of drawings

Fig. 1 is a perspective view of the side view direction of the cleaning machine platform of the present invention.

Fig. 2 is a perspective view of the cleaning machine platform of the present invention in a top view direction.

Fig. 3 is a schematic structural view of the cleaning chamber in the cleaning machine of the present invention.

4a, 4b and 4c are structural schematic diagrams of the eraser used in the cleaning chamber of the cleaning machine of the present invention.

specific embodiment

Below in conjunction with accompanying drawing, the utility model is described further in detail:

Figures 1-4 show specific embodiments of the cleaning machine for integrated circuit substrates of the present utility model, wherein Figures 1-2 are perspective views revealing the structure of the cleaning machine from the side view direction, and Figure 2 reveals the cleaning machine from the top view direction. The perspective view of the machine structure, Figure 1-Figure 2 shows the important components of the cleaning machine as a whole and the layout of each module inside the cleaning machine. Figure 3-4 shows the internal structure and components of the cleaning chamber of the cleaning machine. Figure 3 is a schematic diagram of the structure of the cleaning chamber in the cleaning machine. Figures 4a, 4b and 4c are the wipers used in the cleaning chamber of the cleaning machine. Schematic diagram of the structure of the remover.

The cleaning machine as a whole includes a machine main body 101 , a loading port 102 , a cleaning chamber 103 , a centering device 104 , a liquid supply and power system 105 and a manipulator 106 . Wherein, two loading ports 102 are arranged outside the main body 101 of the machine, one is responsible for storing uncleaned semiconductor substrates, and the other is used for collecting cleaned substrates. The main body 101 of the machine is in the form of a vertical cuboid as a whole, and four cleaning chambers 103 are arranged in internal partitions. As shown in FIG. 1 and FIG. 2 , the four cleaning chambers 103 are divided into two groups, and each group includes two cleaning chambers stacked one above the other. Two sets of cleaning chambers are arranged around the manipulator 106 . Each cleaning chamber 103 can clean the substrate independently without affecting each other, thereby greatly improving the cleaning efficiency and saving time. The four cleaning chambers 103 are arranged in groups and stacked around the manipulator 106 to facilitate the manipulator 106 to take and place the substrate. The centering device 104 is set between the upper and lower cleaning chambers 103 on the side of the main body 101 of the machine. Before the substrate enters each cleaning chamber 103, it will be centered on the centering device 104 to ensure that the substrate will be placed accurately in the future. at the cleaning position in the cleaning chamber 103 . In the illustrated embodiment, the cleaning machine is provided with two manipulators in total: 106a and 106b. The two manipulators 106a and 106b have the same grabbing function and movement range, and can reach each cleaning chamber 103 and each loading port. 102. One of the two manipulators is used to deliver uncleaned substrates to the inside of the cleaning machine, while the other is used to take out the cleaned substrates from the cleaning chamber 103 and send them out of the cleaning machine. The purpose of doing this is to Prevent the manipulator 106 from being polluted by the chemicals in the cleaning chamber 103 , thereby contaminating the substrate.

Other areas inside the cleaning machine are filled by the liquid supply and power system 105, where the space at the end of the main body 101 of the machine is mainly used to place modules related to power supply and control systems, while the previous one is located in one of the cleaning chambers The space below 103 is occupied by the liquid supply system, and the liquid supply system is responsible for providing various chemicals required in the cleaning process.

In the cleaning machine of the present invention, the design of the cleaning chamber 103 is unique, which provides conditions for more efficient and cleaner cleaning of the substrate. The substrate carrier 201 is arranged in the cleaning chamber 103, and the substrate carrier 201 is arranged in the middle of the cleaning chamber 103. After the substrate 208 is centered in the centering device 104, the manipulator 106 will grab the substrate 208 and place it on the substrate carrier. At this time, the center of the substrate 208 is also the center of the substrate holding plate 201 . In order to prevent the chemical liquid from splashing around during the cleaning process, a circle of sputtering shield 207 is arranged around the outer periphery of the substrate carrier 201 to block the chemical liquid at the sputtering place. Since it is still necessary to spray and wash the substrate 208 with cleaning agents during the cleaning process, there are multiple nozzles with different functions in the cleaning chamber 103, namely: gas nozzle 202a, high-pressure nozzle 202b and atomization nozzle 202c, which are used for To achieve different cleaning purposes. Among them, the gas nozzle 202a is mainly used to spray nitrogen gas, which is used to dry the substrate 208 after cleaning; the main purpose of the high-pressure nozzle 202b is to spray the cleaning solution to the surface of the substrate 208 at a higher pressure value, and rinse it off by the impact force. Some of the more stubborn stains; the main purpose of the atomizing nozzle 202c is to ensure that the surface of the substrate 208 is wetted by the cleaning solution so that the cleaning solution reacts with the chemical components that need to be removed on the surface of the substrate 208 . Under the flushing of these nozzles, most of the stains on the surface of the substrate 208 can basically be removed, but some stubborn gels, particles, etc. may still be firmly attached to the surface of the substrate 208, for this type of stains close to the general It is difficult to remove the shower, so it is necessary to introduce a mechanical force with a certain direction and strength to remove it, which is what the existing cleaning machines lack.

In order to solve this problem, the utility model is also provided with an eraser 203 in the cleaning chamber 103, and this eraser includes a driving end 204, a swing arm 301 and a wiping head 302. Wherein the swing arm 301 can swing in a circle with the driving end 204 as the center, and the swing arm 301 is parallel to the substrate carrier 201. Since the substrate 208 is placed flat on the substrate carrier 201, the swing arm 301 is also parallel to the substrate carrier 201. Substrate 208 . In addition, the height of the swing arm 301 should be suitable, so that the wiping head 302 on the swing arm 301 can contact the substrate 208 and exert a certain pressure on the substrate 208 during the swing process. In order to work with the eraser 203, the substrate carrier 201 needs to drive the substrate 208 to rotate at a high speed, and the cleaning liquid sprayed from the nozzle lubricates the surface of the substrate 208, so that when the eraser 203 gradually approaches the center of the substrate 208 from the outside of the substrate 208, The wiping head 302 of the eraser 203 can rub against the surface of the substrate 208, thereby wiping or brushing the entire surface of the substrate 208 from the outside to the inside, peeling off stubborn stains, and can also more efficiently remove those that are not stubborn dirt. The driving end 204 of the eraser 203 is arranged on the outside of the substrate 208. The driving end 204 can be a motor or a motor. By manipulating the driving end 204 to control the swing arm 301 to swing back and forth multiple times, the substrate 208 can be cleaned more cleanly. In order to make full use of the space, the wiping head 302 is preferably arranged at the end of the swing arm 301. The wiping head 302 can be made of soft bristles made of chemical industry, or a soft cloth head, or a sponge, so as to ensure the cleaning effect. At the same time, it is not easy to scratch the substrate 208, so that the eraser 203 constitutes a corresponding practical brush, and Fig. 4a, 4b and 4c respectively show three kinds of corresponding brushes as the eraser 203 in the present embodiment: Fig. 4a reveals soft bristles Brush 302a, Figure 4b discloses cloth brush 302b, Figure 4c discloses sponge brush 302c. A more important point is that the distance d from the driving end 204 to the wiping head 302 should be equal to the distance from the driving end 204 to the center of the substrate 208, so as to ensure that the eraser 203 can wipe the entire surface of the substrate 208 without There will be omissions or blind spots.

Both the eraser 203 and the spray head 202 in this embodiment have a working state and a non-working state. The eraser 203 and the shower head 202 both stay in the side space inside the cleaning chamber 103 and outside the substrate carrier 201 when they are not working. Generally, only in the working state, the eraser 203 and the spray head 202 will swing to the working position in the middle of the cleaning chamber 103 and above the substrate 208 . Wherein the stop position when the eraser 203 is not working is its initial position, when the eraser 203 stays to the initial position, a self-cleaning device 205 is arranged directly below the wiper head 302, which is used to clean the wiper head 302 after use Finally, the wiping head 302 is cleaned to ensure that the wiping head 302 is clean when cleaning next time. When the gas shower head 202 a is not working, it stays at the idle station, and the idle station is located outside one side of the substrate carrier 201 . The high-pressure nozzle 202b and the atomizing nozzle 202c are set together, and when they are not working, they will also stay at the rest station. It is opposite to the idle position of the gas shower head 202a. At the stop position of the high-pressure spray head 202b and the atomizing spray head 202c, a liquid collection tank 206 is provided to collect the residual liquid dripped at the nozzle nozzle position after cleaning, so as to keep the cleaning chamber 103 clean.

In addition, the operation process of this embodiment is described to a certain extent, so that readers can more truly appreciate the superiority of the present utility model.

When in use, the uncleaned substrate is picked up by the manipulator 106a and transported to the inside of the cleaning machine. First, the substrate is placed on the centering device 104 for centering; after the centering is completed, the manipulator 106a continues to take out the substrate and place the Transfer to one of the cleaning chambers 103 for cleaning. After the cleaning is completed, another manipulator 106 b takes out the cleaned substrate and transports the substrate to the corresponding loading port 102 . Since the cleaning machine has multiple cleaning chambers 103, the above process can be performed alternately in each cleaning chamber 103, thereby greatly improving the cleaning efficiency.

The above embodiments are intended to illustrate the principles and effects of the present utility model, and are not intended to limit the technical solutions of the present invention, and are only for reference and understanding by those skilled in the art and the public.

Claims (10)

1. the clean board of an ic substrate, comprise machine table main body, load port, cleaning chambers, feed flow and dynamical system, it is characterized in that, substrate load plate is provided with in described cleaning chambers, shower nozzle and eraser, described substrate load plate carries and drives substrate to rotate, described shower nozzle gas jet and/or liquid, described eraser comprises drive end, swing arm and rubbing head, this swing arm swings centered by described drive end, described swing arm is parallel to described substrate load plate, described rubbing head is arranged in described swing arm, described rubbing head is with described swing arm motion, with the surface contact of described substrate, produce mechanical force with clean described substrate.

2. the clean board of ic substrate as claimed in claim 1, it is characterized in that, described substrate is positioned on described substrate load plate, and described drive end is equal to the distance in the center of circle of described substrate with described drive end to the distance of described rubbing head.

3. the clean board of ic substrate according to claim 1, is characterized in that, described eraser is fur brush, leftover of bolt of cloth brush or sponge brush.

4. the clean board of ic substrate according to claim 1, is characterized in that, described shower nozzle comprises gas tip, atomizer and high-pressure nozzle.

5. the clean board of ic substrate according to claim 1, is characterized in that, described eraser rests on the initial position be positioned at outside described substrate load plate in non operating state.

6. the clean board of ic substrate according to claim 5, is characterized in that, described initial position is provided with the self-stripping unit for cleaning this eraser.

7. the clean board of ic substrate according to claim 1, is characterized in that, described shower nozzle rests on the respective station that stops when not working, described in the station that stops be positioned at the outside of described substrate load plate.

8. the clean board of ic substrate according to claim 7, is characterized in that, described in station place of stopping be provided with collecting tank for collecting raffinate.

9. the clean board of ic substrate according to claim 1, is characterized in that, described drive end is motor or motor.

10. the clean board of ic substrate according to claim 1, is characterized in that, described clean board also comprises centralising device and manipulator.