CN102755980A - Wafer cleaning brush and wafer cleaning device - Google Patents
Wafer cleaning brush and wafer cleaning device Download PDFInfo
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- CN102755980A CN102755980A CN2011101031465A CN201110103146A CN102755980A CN 102755980 A CN102755980 A CN 102755980A CN 2011101031465 A CN2011101031465 A CN 2011101031465A CN 201110103146 A CN201110103146 A CN 201110103146A CN 102755980 A CN102755980 A CN 102755980A
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Abstract
The invention discloses a wafer cleaning brush, which comprises a brush bucket, wherein spiral-grain brush bristles are arranged at the outer circumferential surface of the brush bucket. The invention further discloses a wafer cleaning device, which comprises a wafer cleaning brush, wherein the wafer cleaning brush is pressed at the surface of a wafer and used for brushing the wafer in a rolling way; the wafer cleaning brush comprises the brush bucket; and the spiral-grain brush bristles are arranged at the outer circumferential surface of the brush bucket. According to the invention, as the brush bristles on the brush bucket are arranged in the form of spiral grains, the journey required for small particles to leave away from the wafer can be reduced, so that the particle cleaning efficiency is increased and a purpose of rapidly and completely cleaning the particles at the surface of the wafer is achieved. In addition, as second water spraying pipes with a plurality of brush bucket cleaning nozzles are additionally arranged in one row, the particles on the brush bucket can be flushed in time, so that the particles are prevented from being brought back to the surface of the wafer again; and furthermore, the wafer cleaning effect is guaranteed, and the wafer cleaning efficiency is effectively increased. Through additionally arranged movable separately-controlled nozzles, the flushing effect of a key area can be enhanced.
Description
Technical field
The present invention relates to a kind of semiconductor applications, relate in particular to a kind of wafer cleaning brush and wafer cleaning device.
Background technology
In wafer manufactory, the performance that the cleaning of leading portion operation (FEOL) is primarily aimed at gate oxide realizes.And the cleaning of back segment operation (BEOL) is to stress to make and the nearest relevant cleaning of staining thing of CMP with film, contact hole.Along with CMP uses in multiple application, to make and two big Ma Shi leather structure fabrication like inter-level dielectric (ILD), tungsten plug, it is strict more that the cleaning of back segment operation becomes.
Wherein, the emphasis that cleans behind the CMP is to remove all that bring in the glossing to stain thing.These stain any particle that thing comprises that abrasive grain, polished material bring and the chemistry that from abrasive material, brings is stained thing.These particles or because added pressure and mechanically embed crystal column surface in the CMP process; Because attraction that electrostatic force or atomic force (model moral gas force) and physically stick to polished crystal column surface, said electrostatic force are surface charges to be produced or the repulsive force relevant with the Zeta gesture.
Since phase early 1990s CMP technology is used in wafer manufactory, clean behind the CMP from initial and carry out the mega sonic wave cleaning with deionized water, develop into two-sided shampooing hairbrush (DSS) and deionized water wafer is carried out the physics shampooing.
See also Fig. 1-Fig. 4, wherein, Fig. 1 is the perspective view of existing wafer cleaning device; Fig. 2 is the structural representation of existing wafer cleaning device; Fig. 3 is the cooperation sketch map of existing wafer cleaning brush and wafer; Fig. 4 is the schematic side view of Fig. 3.Existing wafer cleaning device comprises: three rollers 110, a pair of wafer cleaning brush 120 and two rows are provided with some feed pipes 140 that are used to wash the wafer washer jet 141 of wafer 130.Said wafer cleaning brush 120 is separately positioned on the positive and negative of wafer 130, and said wafer cleaning brush 120 is clamped wafer 130 positive and negative surfaces and wafer 130 positive and negative surfaces are rolled scrub.Said wafer cleaning brush 120 comprises the bristle 122 of brush bucket 121 and the circumferential surface that is arranged at brush bucket 121, and the bristle 122 on the brush bucket 121 is cylindric staggered transversely arranged.When brush bucket 121 rotated, wafer 130 surfaces can receive bristle 122 rubbing action vertically downward, make wafer 130 lip-deep particles move downward on wafer 130 surfaces, the effect lower edge of bristle 122.
Yet; In order to improve the efficient of clearance of particles; To leave wafer 130 good more the short time more for particle, and it is short more good more to that is to say that particle arrives the required distance in wafer 130 edges, and obviously for wafer 130 lip-deep most of particles (removing the particle that is positioned at wafer 130 centre of surfaces); It is long moving downward the distance that arrives wafer 130 edges, so that has influenced the elimination efficiency of particle.In addition, under the effect of wafer washer jet 141, wafer 130 surface is gone up some particles and can be washed away by the flow di water of nozzle 141 ejections, and the brush bucket 121 that is rotated of some particle is taken away in addition.Because existing wafer cleaning device does not have special brush bucket washer jet, make that the particle on the brush bucket 121 can not timely and effectively be removed, and taken back again on wafer 130 surfaces, thereby make the elimination efficiency of particle be under some influence by brush bucket 121.
Therefore, how to provide a kind of and can realize that fast thoroughly the wafer cleaning brush and the cleaning device of cleaning particle are the technical problems that those skilled in the art need to be resolved hurrily.
Summary of the invention
The object of the present invention is to provide a kind of wafer cleaning brush and cleaning device; Bristle through brushing on the bucket is arranged to the spiral lines; Can reduce particle and leave the required distance of wafer, thereby the elimination efficiency of raising particle is realized fast the thoroughly purpose of the lip-deep particle of cleaning wafer.
In order to reach above-mentioned purpose, the present invention adopts following technical scheme:
A kind of wafer cleaning brush comprises the brush bucket, and the outer circumference surface of said brush bucket is provided with spiral lamination squeegee hair.
In above-mentioned wafer cleaning brush, said spiral lamination squeegee hair is divided into left and right sides two parts, is launched by brush bucket mediad brush bucket bilateral symmetry spiral respectively.
In above-mentioned wafer cleaning brush, the length of said brush bucket is grown to than the diameter of wafer and is lacked 6cm.
The invention also discloses a kind of wafer cleaning device; Comprise a pair of wafer cleaning brush; Said wafer cleaning brush is pressed in the positive and negative surface of said wafer respectively and wafer is rolled and scrubs, and each wafer cleaning brush comprises the brush bucket, and the outer circumference surface of said brush bucket is provided with spiral lamination squeegee hair.
In above-mentioned wafer cleaning device, said spiral lamination squeegee hair is divided into left and right sides two parts, is launched by brush bucket mediad brush bucket bilateral symmetry spiral respectively.
In above-mentioned wafer cleaning device, the length of said brush bucket is grown to than the diameter of wafer and is lacked 6cm.
In above-mentioned wafer cleaning device, said wafer cleaning device comprises that also two rows are provided with first sparge pipe of some wafer washer jets, and said first sparge pipe is arranged at the oblique upper of said wafer positive and negative respectively.
In above-mentioned wafer cleaning device, the wafer that the oblique upper of said wafer positive and negative also is respectively equipped with plurality of single control angle, hydraulic pressure and the water yield cleans flap nozzle.
In above-mentioned wafer cleaning device, said wafer cleaning device comprises that also two rows are provided with second sparge pipe of some brush bucket washer jets, and said second sparge pipe is arranged at the oblique upper of corresponding brush bucket respectively.
In above-mentioned wafer cleaning device, the brush bucket that the oblique upper of said brush bucket also is provided with plurality of single control angle, hydraulic pressure and the water yield cleans flap nozzle.
Beneficial effect of the present invention is following:
Wafer cleaning brush of the present invention and wafer cleaning device are provided with spiral lamination squeegee hair through the outer circumference surface at the brush bucket.When the brush bucket rotates; Crystal column surface not only can receive rubbing action vertically downward; Also can receive horizontal rubbing action, thereby can play continuously, make most of particles (removing the particle that is positioned at crystal circle center) on the crystal column surface leave wafer under can be along the spiral lines oblique to the effect of edge, wafer left and right sides dispersed granules to the wafer both sides; Compare the existing required distance of wafer of leaving vertically downward and shorten, thereby effectively improved the efficient of removing the crystal column surface particle.Be divided into left and right sides two parts and work as said spiral lamination squeegee hair, respectively by the expansion of a brush bucket mediad brush bucket bilateral symmetry spiral, can be so that particle leaves the path of crystal column surface and shortens more, with the efficient of further raising wafer cleaning brush.
In addition, wafer cleaning device of the present invention, through setting up second sparge pipe that a row is provided with some brush bucket washer jets, said second sparge pipe is arranged at the oblique upper of said brush bucket.Through the flushing of brush bucket washer jet, can the particle on the brush bucket in time be washed away, prevent that these particles from being brought back to crystal column surface again, further guaranteed the effect that wafer cleans, effectively improved the efficient that wafer cleans.
In addition; Wafer cleaning device of the present invention; Through cleaning flap nozzle at the brush bucket that is respectively equipped with plurality of single control angle, hydraulic pressure and the water yield on first sparge pipe and on said second sparge pipe respectively; Can strengthen cleaning to the many wafers of particle with the edge of brush bucket respectively, thereby can realize better cleaning performance, further improve the wafer cleaning efficiency.
Description of drawings
Wafer cleaning brush of the present invention and wafer cleaning device are provided by following embodiment and accompanying drawing.
Fig. 1 is the perspective view of existing wafer cleaning device;
Fig. 2 is the structural representation of existing wafer cleaning device;
Fig. 3 is the cooperation sketch map of existing wafer cleaning brush and wafer;
Fig. 4 is the schematic side view of Fig. 3;
Fig. 5 is the structural representation of wafer cleaning device of the present invention;
Fig. 6 is the cooperation sketch map of wafer cleaning brush of the present invention and wafer;
Fig. 7 is the schematic side view of Fig. 6;
Fig. 8 installs the structural representation that wafer cleans the wafer cleaning device of flap nozzle additional for the present invention.
The specific embodiment
Below will do further to describe in detail to wafer cleaning brush of the present invention and wafer cleaning device.
Below with reference to accompanying drawings the present invention is described in more detail, has wherein represented the preferred embodiments of the present invention, should be appreciated that those skilled in the art can revise the present invention described here and still realize advantageous effects of the present invention.Therefore, following description is appreciated that extensively knowing to those skilled in the art, and not as limitation of the present invention.
For clear, whole characteristics of practical embodiments are not described.In following description, be not described in detail known function and structure, because they can make the present invention because unnecessary details and confusion.Will be understood that in the exploitation of any practical embodiments, must make a large amount of implementation details, for example, change into another embodiment by an embodiment according to relevant system or relevant commercial restriction to realize developer's specific objective.In addition, will be understood that this development possibly be complicated and time-consuming, but only be routine work to those skilled in the art.
For making the object of the invention, characteristic more obviously understandable, be further described below in conjunction with the accompanying drawing specific embodiments of the invention.What need explanation is, accompanying drawing all adopts the form of simplifying very much and all uses non-ratio accurately, only in order to convenient, the purpose of the aid illustration embodiment of the invention lucidly.
See also Fig. 5-Fig. 8, wherein, Fig. 5 is the structural representation of wafer cleaning device of the present invention; Fig. 6 is the cooperation sketch map of wafer cleaning brush of the present invention and wafer; Fig. 7 is the schematic side view of Fig. 6; Fig. 8 installs the structural representation that wafer cleans the wafer cleaning device of flap nozzle additional for the present invention.
Please consult Fig. 5 by emphasis, this wafer cleaning device comprises three runners 210 and a pair of wafer cleaning brush 220.Said runner 210 is held and is driven said wafer 230 and rotates.Said wafer cleaning brush 220 is pressed in the positive and negative surface of said wafer 230 respectively and wafer 230 surfaces is rolled and scrubs.
Please consult Fig. 5-Fig. 7 by emphasis, said each wafer cleaning brush 220 comprises brush bucket 221, and the outer circumference surface of said brush bucket 221 is provided with spiral lamination squeegee hair 222.Outer circumference surface through at brush bucket 221 is provided with spiral lamination squeegee hair 222; When brush bucket 221 rotates; Wafer 230 surfaces not only can receive rubbing action vertically downward; Also can receive horizontal rubbing action, thereby can play continuously, make wafer 230 lip-deep most of particles (removing the particle that is positioned at crystal circle center) leave wafer 230 under can be along the spiral lines oblique to the effect of edge, wafer 230 left and right sides dispersed granules to wafer 230 both sides; Compare and existingly leave the required path contraction of wafer vertically downward, thereby effectively improved the efficient of removing the crystal column surface particle.
Preferably, said spiral lamination squeegee hair 222 is divided into left and right sides two parts, is launched by brush bucket 221 mediad bilateral symmetry spirals respectively.That is to say that every part spiral lamination squeegee hair is respectively towards the oblique setting down of the corresponding end face of brush bucket 221.So, can be so that particle leaves the path on wafer 230 surfaces to be shortened more, with the efficient of further raising wafer cleaning brush.
Please consult Fig. 6 and Fig. 7 by emphasis, in the present embodiment, the length of said brush bucket 221 is grown to than the diameter of wafer 230 and is lacked 6cm, so, can stretch out 3cm at least to the two ends of wafer respectively when the two ends of brush bucket 221, and this outreach is D shown in Figure 6.So, can guarantee that near the particle the edge, wafer 230 left and right sides also can be by smooth removing.
Please consult Fig. 5 and Fig. 8 by emphasis, said wafer cleaning device comprises that also two rows are provided with first sparge pipe 240 of some wafer washer jets 241, and said first sparge pipe 240 is arranged at the oblique upper on said wafer 230 positive and negative surfaces respectively.These wafer washer jets 241 and first sparge pipe 240 can be continued to use existing parts; First sparge pipe 240 is transported to each wafer washer jet 241 with deionized water or other cleaning fluids; Then; Each wafer washer jet 241 washes facing to the top of wafer 230, and particle is dashed from wafer 230 surfaces.
Preferably, the oblique upper on the said wafer 230 positive and negative surfaces wafer that also is provided with plurality of single control angle, hydraulic pressure and the water yield cleans flap nozzle 251.Can wafer be cleaned flap nozzle 251 and be arranged on first sparge pipe 240, and the feed pipe 250 of the only control of other order.These wafers clean flap nozzle 251 can regulate the direction of nozzle, the hydraulic pressure and the water yield of current according to client's needs, cleans thereby can carry out emphasis to some zone.Cleaning is strengthened at the edge that can adopt these wafers to clean the many wafers 230 of 251 pairs of particles of flap nozzle, to realize better cleaning performance.
Please continue to consult Fig. 5, said wafer cleaning device comprises that also two rows are provided with second sparge pipe (meaning not shown in the figures) of some brush bucket washer jets 261, and said second sparge pipe is arranged at the oblique upper of corresponding brush bucket 221 respectively.The hydraulic pressure of said second sparge pipe is high with respect to the hydraulic pressure of said first sparge pipe.The flushing angle of said brush bucket washer jet 261 can be adjusted to brush bucket 221 positions, middle and lower part away from wafer 230, so that can strengthen the flushing dynamics, hinders wafer 230 and be unlikely to dash.Through the flushing of brush bucket washer jet 261, can the particle on the brush bucket 221 be washed away, prevent that these particles from being brushed bucket 221 and bringing back to wafer 230 surfaces again, guaranteed the effect that wafer 230 cleans, improved the efficient that wafer 230 cleans.
In like manner, the oblique upper of said brush bucket 221 also is provided with the brush bucket cleaning flap nozzle (meaning not shown in the figures) of plurality of single control angle, hydraulic pressure and the water yield.Can the brush bucket be cleaned flap nozzle and be arranged on second sparge pipe, and the feed pipe of the only control of other order.Equally, can adopt these brush buckets to clean flap nozzle cleaning is strengthened at the edge of the many brush buckets of particle, thereby can realize better cleaning performance, further improve the wafer cleaning efficiency.
In sum, wafer cleaning brush of the present invention and wafer cleaning device are provided with spiral lamination squeegee hair through the outer circumference surface at the brush bucket.When the brush bucket rotates; Crystal column surface not only can receive rubbing action vertically downward; Also can receive horizontal rubbing action, thereby can play continuously, make most of particles (removing the particle that is positioned at crystal circle center) on the crystal column surface leave wafer under can be along the spiral lines oblique to the effect of edge, wafer left and right sides dispersed granules to the wafer both sides; Compare the existing required distance of wafer of leaving vertically downward and shorten, thereby effectively improved the efficient of removing the crystal column surface particle.Be divided into left and right sides two parts and work as said spiral lamination squeegee hair, respectively by the expansion of a brush bucket mediad brush bucket bilateral symmetry spiral, can be so that particle leaves the path of crystal column surface and shortens more, with the efficient of further raising wafer cleaning brush.
In addition, wafer cleaning device of the present invention, through setting up second sparge pipe that a row is provided with some brush bucket washer jets, said second sparge pipe is arranged at the oblique upper of said brush bucket.Through the flushing of brush bucket washer jet, can the particle on the brush bucket in time be washed away, prevent that these particles from being brought back to crystal column surface again, further guaranteed the effect that wafer cleans, effectively improved the efficient that wafer cleans.
In addition; Wafer cleaning device of the present invention; Through cleaning flap nozzle at the brush bucket that is respectively equipped with plurality of single control angle, hydraulic pressure and the water yield on first sparge pipe and on said second sparge pipe respectively; Can strengthen cleaning to the many wafers of particle with the edge of brush bucket respectively, thereby can realize better cleaning performance, further improve the wafer cleaning efficiency.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, belong within the scope of claim of the present invention and equivalent technologies thereof if of the present invention these are revised with modification, then the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. a wafer cleaning brush comprises the brush bucket, it is characterized in that, the outer circumference surface of said brush bucket is provided with spiral lamination squeegee hair.
2. according to the said wafer cleaning brush of claim 1, it is characterized in that said spiral lamination squeegee hair is divided into left and right sides two parts, launch by brush bucket mediad brush bucket bilateral symmetry spiral respectively.
3. according to the said wafer cleaning brush of claim 1, it is characterized in that the length of said brush bucket is grown to than the diameter of wafer and lacked 6cm.
4. wafer cleaning device; Comprise a pair of wafer cleaning brush, said wafer cleaning brush is pressed in the positive and negative surface of said wafer respectively and wafer is rolled and scrubs, and each wafer cleaning brush comprises the brush bucket; It is characterized in that the outer circumference surface of said brush bucket is provided with spiral lamination squeegee hair.
5. according to the said wafer cleaning device of claim 4, it is characterized in that said spiral lamination squeegee hair is divided into left and right sides two parts, launch by brush bucket mediad brush bucket bilateral symmetry spiral respectively.
6. according to the said wafer cleaning device of claim 4, it is characterized in that the length of said brush bucket is grown to than the diameter of wafer and lacked 6cm.
7. according to the said wafer cleaning device of claim 4, it is characterized in that said wafer cleaning device comprises that also two rows are provided with first sparge pipe of some wafer washer jets, said first sparge pipe is arranged at the oblique upper of said wafer positive and negative respectively.
8. according to any said wafer cleaning device in the claim 4 to 7, it is characterized in that the wafer that the oblique upper of said wafer positive and negative also is respectively equipped with plurality of single control angle, hydraulic pressure and the water yield cleans flap nozzle.
9. according to any said wafer cleaning device in the claim 4 to 7, it is characterized in that said wafer cleaning device comprises that also two rows are provided with second sparge pipe of some brush bucket washer jets, said second sparge pipe is arranged at the oblique upper of corresponding brush bucket respectively.
10. according to the said wafer cleaning device of claim 9, it is characterized in that the brush bucket that the oblique upper of said brush bucket also is provided with plurality of single control angle, hydraulic pressure and the water yield cleans flap nozzle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101031465A CN102755980A (en) | 2011-04-25 | 2011-04-25 | Wafer cleaning brush and wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101031465A CN102755980A (en) | 2011-04-25 | 2011-04-25 | Wafer cleaning brush and wafer cleaning device |
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| CN102755980A true CN102755980A (en) | 2012-10-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011101031465A Pending CN102755980A (en) | 2011-04-25 | 2011-04-25 | Wafer cleaning brush and wafer cleaning device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993919A (en) * | 2017-11-21 | 2018-05-04 | 长江存储科技有限责任公司 | Chemical liquids spray tube and cleaning device for wafer cleaning |
| CN110838433A (en) * | 2018-08-17 | 2020-02-25 | 台湾积体电路制造股份有限公司 | Method and system for cleaning wafer |
| CN113118100A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Wafer cleaning device and cleaning method |
| CN113327841A (en) * | 2021-05-28 | 2021-08-31 | 华海清科股份有限公司 | Wafer cleaning system and cleaning method capable of keeping cleaning roller clean |
| US12027382B2 (en) | 2021-12-03 | 2024-07-02 | Applied Materials, Inc. | Surface cleaning with directed high pressure chemistry |
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| US7185384B2 (en) * | 2002-08-29 | 2007-03-06 | Intel Corporation | Wafer cleaning brush |
| CN101091604A (en) * | 2006-06-19 | 2007-12-26 | 东京应化工业株式会社 | Washing roller |
| CN101409224A (en) * | 2007-10-11 | 2009-04-15 | 细美事有限公司 | Brush assembly and substrate cleaning device having the same |
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2011
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Patent Citations (6)
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| US5144711A (en) * | 1991-03-25 | 1992-09-08 | Westech Systems, Inc. | Cleaning brush for semiconductor wafer |
| US6299698B1 (en) * | 1998-07-10 | 2001-10-09 | Applied Materials, Inc. | Wafer edge scrubber and method |
| US20020050015A1 (en) * | 2000-10-30 | 2002-05-02 | Jong-Woon Oh | Cleaning apparatus for semiconductor wafer |
| US7185384B2 (en) * | 2002-08-29 | 2007-03-06 | Intel Corporation | Wafer cleaning brush |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107993919A (en) * | 2017-11-21 | 2018-05-04 | 长江存储科技有限责任公司 | Chemical liquids spray tube and cleaning device for wafer cleaning |
| CN110838433A (en) * | 2018-08-17 | 2020-02-25 | 台湾积体电路制造股份有限公司 | Method and system for cleaning wafer |
| CN110838433B (en) * | 2018-08-17 | 2022-06-10 | 台湾积体电路制造股份有限公司 | Method and system for cleaning wafer |
| CN113118100A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Wafer cleaning device and cleaning method |
| CN113118100B (en) * | 2019-12-31 | 2022-09-06 | 清华大学 | Wafer cleaning device and cleaning method |
| CN113327841A (en) * | 2021-05-28 | 2021-08-31 | 华海清科股份有限公司 | Wafer cleaning system and cleaning method capable of keeping cleaning roller clean |
| CN113327841B (en) * | 2021-05-28 | 2022-07-29 | 华海清科股份有限公司 | Wafer cleaning system and cleaning method capable of keeping cleaning roller clean |
| US12027382B2 (en) | 2021-12-03 | 2024-07-02 | Applied Materials, Inc. | Surface cleaning with directed high pressure chemistry |
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Application publication date: 20121031 |