CN106504977A - Probe clean method and probe cleaning device - Google Patents
Probe clean method and probe cleaning device Download PDFInfo
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- CN106504977A CN106504977A CN201510565831.8A CN201510565831A CN106504977A CN 106504977 A CN106504977 A CN 106504977A CN 201510565831 A CN201510565831 A CN 201510565831A CN 106504977 A CN106504977 A CN 106504977A
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- 239000000523 sample Substances 0.000 title claims abstract description 218
- 238000004140 cleaning Methods 0.000 title claims abstract description 125
- 238000000034 method Methods 0.000 title claims abstract description 97
- 238000009826 distribution Methods 0.000 claims abstract description 24
- 239000006061 abrasive grain Substances 0.000 claims abstract description 13
- 238000012360 testing method Methods 0.000 claims description 22
- 244000137852 Petrea volubilis Species 0.000 claims description 14
- 239000004576 sand Substances 0.000 claims description 13
- 238000005201 scrubbing Methods 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 2
- 239000012535 impurity Substances 0.000 abstract description 28
- 230000000694 effects Effects 0.000 abstract description 24
- 230000009286 beneficial effect Effects 0.000 abstract description 12
- 239000000463 material Substances 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- 239000003082 abrasive agent Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910001651 emery Inorganic materials 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The invention provides a kind of probe clean method and probe cleaning device, the probe clean method includes：Probe to be cleaned is provided；Scrub process is carried out to probe to be cleaned using hairbrush；Process is ground to probe to be cleaned using grinding layer；Adhesion process is carried out to probe to be cleaned using adhesion layer, the ability for removing variety classes impurity is enhanced, is improve the cleaning effect of probe.During milled processed, the probe clean method also by the first different milled processed of abrasive grain distribution density and the second milled processed the impurity adhered on probe is carried out slightly, fine grinding process, beneficial to taking into account Grinding Quality and cleaning efficiency.The probe clean method is further cleaned to the impurity adhered on probe using the method for carrying out the scrub process, the first milled processed, the second milled processed and adhesion process successively, and more preferably, cleaning effect is more preferable for cleaning effect.
Description
Technical field
The present invention relates to technical field of semiconductors, more particularly to a kind of probe clean method and probe sanitizer cartridge
Put.
Background technology
The whole manufacturing process of semiconductor device can be divided into wafer manufacture, wafer sort, wafer level packaging and most
Afterwards test etc. step.The wafer manufacture refers to the process for manufacturing semiconductor device on wafer, completes
After the manufacture of semiconductor device, the tube core (die) of multiple repetitions can be formed on wafer.On-Wafer Measurement is walked
In rapid, need to carry out testing electrical property to the tube core, to guarantee before encapsulation, the tube core on wafer is to close
The product of lattice, therefore wafer sort is to improve one of committed step of semiconductor device yield.
The generally equipment tested by wafer includes probe station (probe), and there is on the probe station probe
Card (probe card), the probe card includes at least one probe (probe needle), by the spy
Pin touches tube core on wafer to carry out testing electrical property.Specifically, one is usually provided with the tube core
Or multiple test solder joint (pad), the probe with described test solder joint need contact with each other, can just complete electricity
Property test.The accuracy of the electrical detection of tube core concerns the yield of product, in order to ensure wafer sort result
Accuracy, generally after the test for carrying out certain number of times, needs to be cleaned probe, is sticked to removing
The impurity of detecting probe surface, it is to avoid impurity causes to be short-circuited between different probes so that test result is produced
Error, reduces the true rate and accuracy rate of wafer sort result.
At present, no matter which kind of impurity detecting probe surface adheres to, and is used uniformly across hairbrush and is cleaned, as shown in figure 1,
Staff directly using the hairbrush 110 for being coated with isopropanol manual cleaning probe 120, but, this mode
Not only cleaning effect is not good enough, and cleaning efficiency is low, and after being cleaned to probe 120, probe tip (probe
Tip) 121 often it is damaged due to exerting oneself excessive or misoperation, reduces the service life of probe.
Content of the invention
It is an object of the invention to provide a kind of probe clean method and probe cleaning device, existing to solve
The problems such as technology middle probe cleaning effect is not good, cleaning efficiency low, probe is easily damaged.
For solving above-mentioned technical problem, the invention provides a kind of probe clean method, including：
Probe to be cleaned is provided；
Scrub process is carried out to the probe to be cleaned using hairbrush；
Process is ground to the probe to be cleaned using grinding layer；And
Adhesion process is carried out to the probe to be cleaned using adhesion layer.
Optionally, in described probe clean method, above-mentioned probe to be cleaned is carried out using grinding layer
The step of milled processed, includes：
First milled processed is carried out to the probe to be cleaned using the first grinding layer；
Second milled processed is carried out to the probe to be cleaned using the second grinding layer；
Wherein, in first grinding layer, the distribution density of abrasive grain is less than the mill in second grinding layer
The distribution density of material granule.
Optionally, in described probe clean method, the scrub process is carried out successively, at the first grinding
Reason, the second milled processed and adhesion process.
Optionally, in described probe clean method, first grinding layer and the second grinding layer are sand
Paper, the sand grains distribution density of the sand paper that first grinding is adopted is for arrangement 1000～1200 in per inch length
Sand grains, the sand grains distribution density of the sand paper that second grinding layer is adopted is for arrangement in per inch length
1300～1500 sand grains.
Optionally, in described probe clean method, when carrying out the first milled processed, first grinding
Layer and the probe relative movement to be cleaned；When carrying out the second milled processed, second grinding layer and institute
State probe relative movement to be cleaned.
Optionally, in described probe clean method, the probe to be cleaned is with cantilever portion and pin
During the looper of tip, first grinding layer and the second grinding layer transfixion, the probe phase to be cleaned
For the normal direction of first grinding layer and the second grinding layer is moved.
Optionally, in described probe clean method, when the probe to be cleaned is staight needle, described treat
When the probe of cleaning is staight needle, first grinding layer and the second grinding layer transfixion are described to be cleaned
Normal direction and tangential movement of the probe relative to first grinding layer and the second grinding layer.
Optionally, in described probe clean method, when carrying out scrubbing process, the hairbrush is treated with described
The probe relative movement of cleaning.
Additionally, present invention also offers a kind of probe cleaning device, including for cleaning probe to be cleaned
Cleaning pad, for carrying the clean hatch of the cleaning pad and drive mechanism for driving clean hatch motion；
Wherein, hairbrush, grinding layer and adhesion layer are respectively equipped with the cleaning pad, and the hairbrush is used for treating to described
The probe of cleaning carries out scrub process, and the grinding layer is used for being ground process to the probe to be cleaned,
The adhesion layer is used for carrying out adhesion process to the probe to be cleaned.
Optionally, in described probe cleaning device, also include for fixing the test of wafer to be tested
Chuck and the wafer test platform for carrying the test chuck, the cleaning pad is adjacent to the test chuck.
Optionally, in described probe cleaning device, the grinding layer includes the first grinding being set up in parallel
Layer and the second grinding layer, in first grinding layer, the distribution density of abrasive grain is less than second grinding layer
In abrasive grain distribution density.
Optionally, in described probe cleaning device, first grinding layer, the second grinding layer and adhesion
Layer is detachably arranged in the upper of the cleaning pad.
Optionally, the first grinding layer, the second grinding layer and adhesion layer described in described probe cleaning device
Do not overlap each other.
Optionally, in described probe cleaning device, the cleaning pad is included for fixing the hairbrush
First cleaning pad and the second cleaning pad for fixing first grinding layer, the second grinding layer and adhesion layer.
Optionally, in described probe cleaning device, first grinding layer and the second grinding layer are sand
Paper, the adhesion layer are glued paper.
In sum, the present invention is provided probe clean method and probe cleaning device.There is following beneficial effect
Really：
1st, the method that the probe clean method is carried out respectively using scrub process, milled processed and adhesion process,
Multistage cleaning treatment is carried out to the impurity adhered on probe, the ability for removing variety classes impurity is enhanced,
Improve the cleaning effect of probe；
2nd, during milled processed, also by the first different milled processed of abrasive grain distribution density and the second grinding
Process the impurity adhered on probe is carried out slightly, fine grinding process, beneficial to taking into account Grinding Quality and cleaning efficiency；
3rd, the probe clean method further using carry out successively the scrub process, the first milled processed,
The method of the second milled processed and adhesion process on probe adhere to impurity be cleaned, cleaning effect more preferably,
Cleaning effect is more preferable.
Description of the drawings
Fig. 1 is the structural representation that existing employing hairbrush removes impurity on probe；
Schematic flow sheets of the Fig. 2 for the probe clean method of the embodiment of the present invention one；
Structural representation when Fig. 3 is the cleaning staight needle of the embodiment of the present invention one；
Structural representation when Fig. 4 is the cleaning looper of the embodiment of the present invention one；
Schematic flow sheet when Fig. 5 cleans probe to be cleaned for the employing grinding layer of the embodiment of the present invention one；
Microgram when Fig. 6 a are not cleared up for the probe to be cleaned of the embodiment of the present invention one；
Fig. 6 b carry out the microgram after scrub process for the probe to be cleaned of the embodiment of the present invention one；
Fig. 6 c carry out the microgram after the first milled processed for the probe to be cleaned of the embodiment of the present invention one；
Fig. 6 d carry out the microgram after the second milled processed for the probe to be cleaned of the embodiment of the present invention one；
Fig. 6 e carry out the microgram after adhesion process for the probe to be cleaned of the embodiment of the present invention one；
Movement locus schematic diagram when Fig. 7 is the cleaning staight needle of the embodiment of the present invention one；
Fig. 8 preferably cleans movement locus schematic diagram during staight needle for the embodiment of the present invention one；
Main structure diagrams of the Fig. 9 for the probe cleaning device of the embodiment of the present invention two；
Figure 10 is the schematic top plan view of the probe cleaning device shown in Fig. 9.
Specific embodiment
Make into one below in conjunction with 2 to 10 pairs of probe clean methods proposed by the present invention of accompanying drawing and probe cleaning device
Step is described in detail.It should be noted that, accompanying drawing is compared in the form of simplifying very much and accurately using non-
Example, only in order to purpose that is convenient, lucidly aiding in illustrating the embodiment of the present invention.
【Embodiment one】
The schematic flow sheet of the probe clean method that Fig. 2 is provided for the present embodiment.As shown in Fig. 2 the spy
Pin clean method is comprised the following steps：
Step S1：Probe to be cleaned is provided；
Step S2：Scrub process is carried out to the probe to be cleaned using hairbrush；
Step S3：Process is ground to the probe to be cleaned using grinding layer；
Step S4：Adhesion process is carried out to the probe to be cleaned using adhesion layer.
As shown in Figures 3 and 4, the probe to be cleaned can be staight needle 210 or there is cantilever portion 221
With the looper 220 of needle tip 222, the shape for specifically not limiting the probe to be cleaned of the invention.
In the present embodiment, carry out scrubbing process when, it is for example different that the bristle surface of the hairbrush is coated with cleanout fluid
Propanol (IPA).The use of the cleanout fluid can accelerate the impurity of detecting probe surface to come off, and strengthen washing effect.
In preferred embodiment, the bristle of the hairbrush includes first kind bristle and Equations of The Second Kind bristle, described first
Hardness of the hardness of class bristle less than Equations of The Second Kind bristle.Here, for convenience of describing, first kind bristle is referred to as
Equations of The Second Kind bristle is referred to as hard bristle by soft bristle.Carry out scrub process when, the hard bristle and
Soft bristle can carry out scrub process to the probe to be cleaned simultaneously.On the one hand, due to soft bristle
Deformability and elasticity preferably, therefore, area that soft bristle is contacted with probe tip after deforming upon compared with
Greatly, the probe tip region that hard bristle cannot be touched can be brushed；On the other hand, the use of hard bristle
Can prevent as the deformation of soft bristle is excessive and cause probe some regions be touched by soft bristle.
Therefore, scrub process is carried out simultaneously using hard bristle and soft bristle and can further enhances the effect that scrub is processed
Really, it is ensured that the impurity positioned at each region of probe can be removed.
The length of the bristle is chosen as 0.5～1mm, is adapted with the length of probe.Certainly, the present invention simultaneously
The concrete length of bristle is not limited, suitable bristle can be selected according to actual needs.
Carry out scrubbing process when, the hairbrush and the probe relative movement to be cleaned, so that hairbrush goes
Except the tip of probe tip to be cleaned is with the impurity of exterior domain, the effect of cleaning probe is reached.Preferably, institute
Hairbrush transfixion is stated, by way of the movement probe to be cleaned, makes hairbrush remove probe to be cleaned
The tip of needle point with the impurity of exterior domain, to reach the effect of cleaning probe.In other embodiment, can also make
The probe transfixion to be cleaned, by way of mobile hairbrush, makes hairbrush remove probe pin to be cleaned
The tip of point with the impurity of exterior domain, so as to reach the effect of cleaning probe.
Particularly, as shown in figure 5, above-mentioned be ground process using grinding layer to the probe to be cleaned
The step of include：
Step S31：First milled processed is carried out to the probe to be cleaned using the first grinding layer；
Step S32：Second milled processed is carried out to the probe to be cleaned using the second grinding layer.
Wherein, in first grinding layer, the distribution density of abrasive grain is less than the mill in second grinding layer
The distribution density of material granule.
In the present embodiment, first grinding layer for sand paper, emery cloth or coating or press-fitted can have abrasive material
Grinding pad of grain etc..Second grinding layer for sand paper, emery cloth or coating or press-fitted can also have abrasive material
Grinding pad of granule etc..
Optionally, the sand grains distribution density of the sand paper that first grinding layer is adopted is arrangement in per inch length
1000～1200 sand grains.The sand grains distribution density of the sand paper that second grinding layer is adopted is in per inch length
1300～1500 sand grains of arrangement.Here, the including but not limited to cited sand grains density of the present invention, real
When border is applied, can be adjusted accordingly as needed.
First grinding layer and the second grinding layer are contacted by the needle point tip with probe to be cleaned
Mode, grinding remove the impurity adhered on the tip of probe tip.
In the present embodiment, according to the doping property adhered on probe different such as size, material, adhesiveness, viscous
The differences such as attached region, it is preferred to use carry out the scrub process, the first milled processed successively, at the second grinding
Reason and the mode of adhesion process are cleaned to probe, thus, not only cleaning effect more preferably, and cleans effect
Rate is also higher.
The scrub process, first milled processed, second milled processed and adhesion process are carried out successively to probe
The micro- effect being cleaned see Fig. 6 a to Fig. 6 e, and two illustrated in all figures white bright spot is spy
Pin needle point；Wherein, the microgram of probe tip before Fig. 6 a are cleaning；Fig. 6 b for after carrying out scrub process,
The microgram of the probe tip；Fig. 6 c for after carrying out the first milled processed, the microgram of the probe tip；
Fig. 6 d for after carrying out the second milled processed, the microgram of the probe tip；Fig. 6 e are to carry out adhesion process
Afterwards, the final microgram of the probe tip.
As shown in Figure 6 b, carry out scrubbing when processing, the hairbrush can remove each beyond the tip of probe tip
Metal or the nonmetallic inclusion, the such as impurity of elongate strip such as the first size adhered on region or the first adhesiveness,
Reduce the attachment around two white bright spots in figure；Afterwards, as fig. 6 c, carry out at the first grinding
During reason, that is, coarse grinding treatment, first grinding layer can grind each beyond the tip for removing probe tip
Metal and the nonmetallic inclusion such as aluminum, silicon etc. such as the second size that adheres on region or the second adhesiveness, enter one
Step reduces the attachment in figure around two white bright spots；Then, as shown in fig 6d, carry out the second grinding
During process, that is, fine grinding is processed, and second grinding layer can further grind the point for removing probe tip
Metal and nonmetallic inclusion such as tungsten, aluminum, the carbon etc. such as the 3rd size that adheres on end or the 3rd viscosity so that figure
In the size of two white bright spots diminish and brighter (reducing the attachment on the tip of probe tip)；
Finally, as shown in fig 6e, when carrying out adhesion process, the adhesion layer can further to probe tip
Beyond tip and tip, on regional, un-cleared impurity is purged, further so that two in figure
White bright spot becomes smooth and clear, herein, it is to avoid it is secondary that the impurity come off during grinding is caused to probe
Pollution, it is ensured that cleaning quality；Afterwards, the cleaning of probe is completed.
In the present embodiment, when carrying out the first milled processed, first grinding layer and the probe to be cleaned
Relative movement so that the regional beyond the tip of the first grinding layer grinding probe tip to be cleaned reaches
The effect of cleaning probe.When carrying out the second milled processed, second grinding layer and the probe to be cleaned
Relative movement so that the second grinding layer grinds the tip of probe tip to be cleaned, reaches the effect of cleaning probe
Really.
As shown in fig. 7, and combine and refer to Fig. 3, when the probe to be cleaned is staight needle 210, can make described
Staight needle 210 is moved in the ground flat of the first grinding layer and the second grinding layer；Specifically, described first
The ground flat of grinding layer and the second grinding layer is set to X/Y plane, and the probe to be cleaned can be along X
(i.e. the tangential movement of ground flat) is moved back and forth with Y direction.Meanwhile, make the staight needle 210 relative to
Ground flat Z axis movement (i.e. the normal direction movement of ground flat).For staight needle, using the side of multi-party Bit Grinding
Formula grinding removes the impurity adhered on the tip of probe tip, can more effectively go the removal of impurity, it is ensured that cleaning matter
Amount.Additionally, when the staight needle 210 is moved in the ground flat, the staight needle 210 can be made along certain track
Motion.As shown in figure 8, the movement locus of the staight needle 210 can be octagon, grinding can be improved and removed
The ability of impurity, milled processed are better, but not invention does not limit the concrete movement locus of the staight needle,
Can be elected according to actual grinding situation.
Preferably, first grinding layer and the second grinding layer transfixion, the staight needle 210 is relative to institute
State normal direction and the tangential movement of the first grinding layer and the second grinding layer.
With continued reference to Fig. 4, when the probe to be cleaned is looper 220, the looper 220 is made relative to the
The normal direction movement of one grinding layer and the second grinding layer, removes 220 needle point of looper to grind by way of pin bundle
The impurity adhered on tip, can so save cleaning time, and cleaning quality can also be guaranteed.
Preferably, first grinding layer and the second grinding layer transfixion, the looper 220 is relative to institute
State the normal direction movement of the first grinding layer and the second grinding layer.
The lapping mode of staight needle and looper is set to difference, this is because looper is in grinding, its own can
There is elastic rotation, such looper itself increases grinding contact surface, therefore it may only be necessary to control looper exist
Normal direction movement just can, and staight needle is not susceptible to deformation, so that multi-direction movement is protected with grinding in all directions
Card cleaning effect.
In the probe clean method that above-described embodiment is provided, the adhesion layer has adhesiveness.Wherein, described
Adhesion layer can be the sticking material of tool such as glued paper.
【Embodiment two】
As shown in Figure 9 and Figure 10, a kind of probe cleaning device, the probe sanitizer cartridge are present embodiments provided
Put including for cleaning the cleaning pad 310 of probe to be cleaned, for carrying the clean hatch 320 of cleaning pad 310
And the drive mechanism (not shown) for driving clean hatch 320 to move, wherein, on the cleaning pad 310
It is respectively equipped with hairbrush 311, grinding layer 312 and adhesion layer 313.The hairbrush 311 is used for described to be cleaned
Probe carry out scrub process, the grinding layer 312 is used for being ground process to the probe to be cleaned,
The adhesion layer 313 is used for carrying out adhesion process to the probe to be cleaned.
During above-mentioned probe cleaning device application, the probe card 410 that will be loaded with probe to be cleaned is arranged at clearly
The top of clean pad 310, and cleaning pad 310 and the probe relative movement to be cleaned is made, and then clean spy
Pin；During cleaning, the hairbrush 311, grinding layer 312 and adhesion layer 313 are not carried out simultaneously, but point
Other process is cleaned to probe.
In the present embodiment, the probe cleaning device is also included for fixing the test card of wafer to be tested 420
Disk 330 and the wafer test platform 340 for bearing test chuck 330, the test chuck 330 are fixed on
On wafer test platform 340, and 310 network topology testing chuck 330 of the cleaning pad is arranged.Using being integrated with
The probe cleaning device of wafer sort function, beneficial to during wafer sort, cleans probe in time, improves production effect
Rate.
As preferred embodiment, the clean hatch 320 can under the driving of the drive mechanism up and down, water
Flat motion.The cleaning pad 310 is removably fixed on clean hatch 320, it is to avoid change cleaning
During pad 310, cleaning pad 310 is damaged and affects its life-span.
Further, the drive mechanism may include guide rail mechanism (not shown) and drive the guide rail machine
The motor (not shown) of structure motion.The guide rail mechanism can further include guide's X rail mechanism, Y-direction guide rail
Mechanism and Z-direction guide rail mechanism, guide's X rail mechanism, Y-direction guide rail mechanism, Z-direction guide rail mechanism can divide
Not Qu Dong cleaning pad 310 along X-axis, Y-axis and Z axis movement.
In the present embodiment, the hairbrush 311 can be arranged along the normal direction of 310 upper surface of cleaning pad or along clear
310 upper surface of clean pad tangentially-arranged, specifically, the present invention is simultaneously not construed as limiting, as long as being beneficial to hairbrush 311
Form the impurity for compressing contact and effectively removing on probe just may be used and probe to be cleaned between.
Preferably, the grinding layer 312 further includes that the first grinding layer 312a and second being set up in parallel grinds
Mill layer 312b, in the first grinding layer 312a, the distribution density of abrasive grain is less than the second grinding layer 312b
In abrasive grain distribution density, beneficial to taking into account Grinding Quality and cleaning efficiency.
Additionally, 310 upper surface of the cleaning pad itself can have adhesiveness and abrasiveness, for example described clear
The upper surface of clean pad 310 is made up of the material with adhesiveness and abrasiveness, so as to form the first grinding layer
312a, the second grinding layer 312b and adhesion layer 313.In other embodiment, the first grinding layer 312a and
Second grinding layer 312b is individually made up of the material with abrasiveness, and the adhesion layer 313 is by with adhesion
The material of property is made, and for example described first grinding layer 313 and the second grinding layer 314 are sand paper.The sand
Paper is had gum and is adhered on cleaning pad 310 by gum.The adhesion layer 315 is glued paper, described
Glued paper is had gum and is adhered on cleaning pad 310 by gum.
However, using arranging on cleaning pad 310 by the first grinding layer 312a for making with grinding-material and
Second grinding layer 312b, beneficial to replacing the first grinding layer 312a and the second grinding layer 312b in time, it is ensured that visit
The Grinding Quality of pin；In the same manner, using arranging on cleaning pad 310 by the adhesion that makes with adhesion material
Layer 315, also beneficial to replacing adhesion layer 313 in time, it is ensured that the sticking quality of probe.Additionally, so also sharp
In the care and maintenance of probe cleaning device, reduce cleaning cost.
Additionally, the first grinding layer 312a and the second grinding layer 312b are removably arranged at clearly
On clean pad 310, such as gum is adhered on cleaning pad 310.The adhesion layer 313 also can be accordingly with removable
The mode of unloading is arranged on cleaning pad 310.In addition, the first grinding layer 312a, the second grinding layer 312b and
Adhesion layer 313 is arranged side by side and does not overlap each other.
In order to preferably implement the present invention, the cleaning pad 310 is further included for fixing hairbrush 311
First cleaning pad (not shown) and for carrying the first grinding layer 312a, the second grinding layer 312b and adhesion layer
313 the second cleaning pad (not shown).Using hairbrush 311 is separated with grinding layer 312 and adhesion layer 313
Fixed mode, beneficial to material-saving, reduces production cost.This is because：During cleaning probe, generally many
Individual probe is cleaned simultaneously, and the plurality of probe often distribution form has differences, and then probe distribution
The cleaning area size of formation is also differed, and the coverage rate and spy of the grinding layer 312 and adhesion layer 313
Pin is distributed the cleaning area size correlation to be formed, and as the cleaning region that probe distribution is formed changes, holds
The second cleaning pad for being loaded with grinding layer 312 and adhesion layer 313 is also required to change, to adjust 312 He of grinding layer
The coverage rate of adhesion layer 315, thus, first cleaning pad need not be changed.
The cleaning pad 310 is chosen as cuboid or square body structure, beneficial to effectively utilizes space, improves profit
With rate.When the cleaning pad 310 is rectangular structure, the size preferred length 103mm of the cleaning pad 310,
Width 100mm.However, the present invention includes but is not limited to the preferred size, can be according to actual needs
It is adjusted accordingly.
The probe cleaning device of the present embodiment may include multiple cleaning pads 310, the chi of the plurality of cleaning pad 310
Very little equal difference, for cleaning the probe in plurality of specifications probe card, to improve the suitability.The cleaning pad 310
Size can according to grinding range of movement and Chip scale specifically be adjusted.
Additionally, practice have shown that, above-mentioned probe clean method and probe cleaning device can be used in different size spy
Probe cleaning on pin card, cleaning effect are preferable.
In sum, the present invention is provided probe clean method and probe cleaning device, with following beneficial effect
Really：
First, the probe clean method that the present invention is provided is using scrub process, milled processed and adhesion process point
The method not carried out, carries out multistage cleaning treatment to the impurity adhered on probe, enhances deimpurity
Ability, improves the cleaning effect of probe.
Secondly, during milled processed, also by different the first milled processed and second of abrasive grain distribution density
Milled processed on probe adhere to impurity carry out slightly, fine grinding process, beneficial to take into account Grinding Quality and cleaning imitate
Rate.
Again, according to the doping property such as difference such as size, material, adhesiveness that adheres on probe, the spy
Pin clean method is further using carrying out the scrub process, the first milled processed, the second milled processed successively
The impurity adhered on probe is cleaned with the method for adhesion process, more preferably, cleaning effect is more for cleaning effect
High.
Foregoing description is only the description to present pre-ferred embodiments, not any limit to the scope of the invention
Fixed, any change that the those of ordinary skill in field of the present invention is done according to the disclosure above content, modification belong to
Protection domain in claims.
Claims (15)
1. a kind of probe clean method, it is characterised in that include：
Probe to be cleaned is provided；
Scrub process is carried out to the probe to be cleaned using hairbrush；
Process is ground to the probe to be cleaned using grinding layer；And
Adhesion process is carried out to the probe to be cleaned using adhesion layer.
2. probe clean method as claimed in claim 1, it is characterised in that the step of being ground process to the probe to be cleaned using grinding layer includes：
First milled processed is carried out to the probe to be cleaned using the first grinding layer；
Second milled processed is carried out to the probe to be cleaned using the second grinding layer；
Wherein, in first grinding layer, the distribution density of abrasive grain is less than the distribution density of the abrasive grain in second grinding layer.
3. probe clean method as claimed in claim 2, it is characterised in that carry out the scrub process, the first milled processed, the second milled processed and adhesion process successively.
4. probe clean method as claimed in claim 2 or claim 3, it is characterized in that, first grinding layer and the second grinding layer are sand paper, the sand grains distribution density of the sand paper that first grinding layer is adopted is 1000～1200 sand grains of arrangement in per inch length, and the sand grains distribution density of the sand paper that second grinding layer is adopted is for 1300～1500 sand grains of arrangement in per inch length.
5. probe clean method as claimed in claim 2 or claim 3, it is characterised in that when carrying out the first milled processed, first grinding layer and the probe relative movement to be cleaned；When carrying out the second milled processed, second grinding layer and the probe relative movement to be cleaned.
6. probe clean method as claimed in claim 5, it is characterized in that, when the probe to be cleaned is the looper with cantilever portion and needle tip, first grinding layer and the second grinding layer transfixion, the probe to be cleaned are moved relative to the normal direction of first grinding layer and the second grinding layer.
7. probe clean method as claimed in claim 5, it is characterized in that, when the probe to be cleaned is staight needle, first grinding layer and the second grinding layer transfixion, the probe to be cleaned is relative to the normal direction of first grinding layer and the second grinding layer and tangential mobile.
8. probe clean method as claimed in claim 1, it is characterised in that carry out scrubbing when processing, the hairbrush and the probe relative movement to be cleaned.
9. a kind of probe cleaning device, it is characterised in that include for cleaning the cleaning pad of probe to be cleaned, for carrying the clean hatch of the cleaning pad and drive mechanism for driving the clean hatch motion；Wherein, hairbrush, grinding layer and adhesion layer is respectively equipped with the cleaning pad, the hairbrush is used for carrying out the probe to be cleaned scrub process, and the grinding layer is used for being ground the probe to be cleaned process, and the adhesion layer is used for carrying out adhesion process to the probe to be cleaned.
10. probe cleaning device as claimed in claim 9, it is characterised in that also include that the cleaning pad is adjacent to the test chuck for fixing the test chuck of wafer to be tested and wafer test platform for carrying the test chuck.
11. probe cleaning devices as claimed in claim 10, it is characterized in that, the grinding layer includes the first grinding layer being set up in parallel and the second grinding layer, distribution density of the distribution density of abrasive grain less than the abrasive grain in second grinding layer in first grinding layer.
12. probe cleaning devices as claimed in claim 11, it is characterised in that first grinding layer, the second grinding layer and adhesion layer are detachably arranged on the cleaning pad.
13. probe cleaning devices as claimed in claim 11, it is characterised in that first grinding layer, the second grinding layer and adhesion layer are not overlapped each other.
14. probe cleaning devices as claimed in claim 11, it is characterised in that the cleaning pad is included for fixing first cleaning pad and the second cleaning pad for fixing first grinding layer, the second grinding layer and adhesion layer of the hairbrush.
Probe cleaning device in 15. such as claim 11 to 14 as described in any one, it is characterised in that first grinding layer and the second grinding layer are sand paper, the adhesion layer are glued paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510565831.8A CN106504977A (en) | 2015-09-07 | 2015-09-07 | Probe clean method and probe cleaning device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510565831.8A CN106504977A (en) | 2015-09-07 | 2015-09-07 | Probe clean method and probe cleaning device |
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| CN106504977A true CN106504977A (en) | 2017-03-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510565831.8A Pending CN106504977A (en) | 2015-09-07 | 2015-09-07 | Probe clean method and probe cleaning device |
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| CN (1) | CN106504977A (en) |
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| CN108172498A (en) * | 2017-11-23 | 2018-06-15 | 南昌易美光电科技有限公司 | cleaning method based on chip thinning |
| CN109530345A (en) * | 2018-10-18 | 2019-03-29 | 武汉华星光电半导体显示技术有限公司 | Probe cleaning device and probe clean method |
| CN110328169A (en) * | 2019-05-09 | 2019-10-15 | 德淮半导体有限公司 | Tester table, probe cleaning device and its clean method |
| CN112557874A (en) * | 2020-12-04 | 2021-03-26 | 上海华岭集成电路技术股份有限公司 | Method for automatically controlling grinding pin in wafer test process |
| CN113030534A (en) * | 2021-05-27 | 2021-06-25 | 琉明光电(常州)有限公司 | Blunt cleaning device is fallen with syringe needle to LED chip electrical property detection |
| CN114798534A (en) * | 2022-03-28 | 2022-07-29 | 苏州汉天下电子有限公司 | Probe cleaning device |
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| CN114798534B (en) * | 2022-03-28 | 2023-08-11 | 苏州汉天下电子有限公司 | Probe cleaning device |
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