201009352 六、發明說明： 【發明所屬之技術領域】 本發明，是有關藉由將探針接觸被檢查基板的配線（或 是導體模式圖）的檢查點來測量其配線的電氣特性的基板檢 查裝置，詳細的話，有關於具有可以不影響電氣特性的測量 的方式進行探針的前端部的清潔的探針前端部的清潔機構之 基板檢査裝置。 e 【先前技術】 基板檢查裝置，是藉由接近將複數根的探針植入被檢查 基板的配線的複數檢査點的檢查夾具，來測量配線的電氣特 性（例如電阻値）。由本案文件使用的用語「被檢査基板」 ，是包含形成有半導體封裝用的封裝基板、薄膜載體、印刷 電路基板、可撓性基板、多層配線基板、液晶顯示器和等離 子顯示器用的電極板等的複數條的配線，在基板檢查時與探 針接觸進行電氣特性測量的全部的基板。 ® 配線上的檢查點，是具有由比較軟的金屬，例如由焊錫 、焊錫球、焊錫膠等形成的情況，將複數枚的基板連續的檢 查的情況時，前端部尖的探針按壓在如此比較軟的金屬的話 ，焊錫的殘渣等會有附著於探針的情況。焊錫的殘渣等是附 著在探針時，會有無法正確地測量配線的電氣特性的情況。 因此，將數枚的基板檢査之後，必需將探針前端部的焊 錫的殘渣等除去。 因此，因爲習知，是從基板檢查裝置將檢查夾具取下， 在顯微鏡下，藉由手作業使用玻璃纖維製電刷進行探針前端 201009352 部的清潔，所以清潔作業時’是注意探針的前端部不會彎曲 的方式讓玻璃纖維製電刷接觸探針。 具體而言，探針前端部的清潔，是從基板檢査裝置將檢 査夾具取下，在顯微鏡下，使用玻璃纖維製電刷藉由手作業 從探針前端部將焊錫的殘渣等清除。此清潔作業，是使用玻 璃纖維製電刷，使探針的前端部不會彎曲的方式與探針進行 複數次接觸。接著，爲了將從探針前端部落下的焊錫殘渣等 除去，由耐綸電刷，將其周邊部清潔。將這種清潔作業，返 覆5〜10次。此時，爲了將焊錫的殘渣、灰塵等除去而使用 ® 吸塵器。 作爲具有清潔手段的基板檢査裝置，具有以下的專利文 獻。 [先行技術文獻] [專利文獻] [專利文獻1]日本特開2006-339472「探針防護觸針的 清潔裝置及清潔方法」（公開日：2006年12月14日）。 〇 專利文獻1，是揭示在載台上，各元件的電氣檢查用的 半導體晶圓及清潔裝置是分別被配置於不同的位置的構成。 在該構成中，清潔時，半導體晶圓上的檢査用的探針卡藉由 是朝清潔裝置的位置移動，將清潔電刷從橫及下方接觸探針 卡的觸針來進行其清潔。 [專利文獻2]日本特開2006-1 53673 (公開日：2006 年06月15曰）。 專利文獻2是揭示，爲了半導體封裝的測試，將其半導 -6 - 201009352 體封裝搬運直到試驗裝置的接點探針爲止使與其接觸的構成 。在該構成中，可取代半導體封裝，藉由將清潔構件吸著在 接點探針來進行接點探針的清潔。清潔構件是使用黏接構件 【發明內容】 (本發明所欲解決的課題） 以往的清潔作業，因爲是手（人工）作業所以需要花費 ® 很多時間。如此，將複數枚的基板檢査的情況，因爲清潔作 業會使基板檢查被中斷，所以全部的基板檢査終了爲止的合 計檢査時間是成爲相當長。且，會發生因手作業使探針前端 部的清淨化程度參差不一、檢查夾具的裝卸所產生的問題等 〇 即使是專利文獻1及2揭示的基板檢查裝置，清潔時也 有需要將基板檢査過程的流程停止來進行。 本發明的目的是提供一種基板檢查裝置，具有清潔機構 ® ，可以不中斷將複數基板連續地檢査的基板檢査的流程的方 式進行探針前端部的清潔》 本發明是的目的是提供一種基板檢查裝置，具有清潔機 構，不需要另外進行基板檢查用的驅動機構和時間就可進行 探針前端部的清潔。 本發明的目的是提供一種基板檢査裝置，具有電刷，可 以將被連續地實施的基板檢查的流程不中斷地進行的探針前 端部的清潔的方式被配置。 本發明的目的是提供一種基板檢査裝置，具有電刷，在 201009352 進行被連續地實施的基板檢查期間不需要進行清掃。 本發明的目的是提供一種基板檢查裝置，具有電刷，具 備可以長時間發揮清潔效果的特性。 進一步，本發明的目的是提供一種基板檢査裝置，具有 清潔機構，對於探針前端部的清潔的達成程度沒有參差不一 (用以解決課題的手段） 有鑑於上述目的，本發明的基板檢查裝置，其特徴是具 ® 備：搬運手段，具有：從搬入部直到搬出部爲止的搬運路、 及在該搬運路上由預定的間隔設置的被檢查基板保持部、及 將該被檢査基板保持部沿著前述搬運路移動的移動手段；及 檢查部，是設在前述搬運路的途中，將被保持在前述搬運手 段的前述被檢査基板保持部的被檢查基板依序檢査的檢查部 ，具備檢査夾具，藉由使設在該檢查夾具的複數探針與被檢 查基板上的配線的檢查點接觸來測量該配線的電氣特性；及 清潔手段，是在前述搬運路上被設在由預定的間隔設置的任 © 意的相鄰接的被檢查基板保持部之間的清潔手段，藉由前述 搬運手段的前述移動手段被移動，通過前述檢查部時進行前 述複數探針的清潔。 對於該基板檢査裝置，與在前述任意的相鄰接的被檢查 基板保持部之間所設置的前述清潔手段相鄰接的2個前述被 檢查基板保持部的各距離，是比前述任意的相鄰接的被檢査 基板保持部之間的距離更小也可以。 對於該基板檢查裝置，前述清潔手段是具備電刷，該電 -8- 201009352 刷，是具有沿著被前述移動手段移動的移動方向的纖維的流 動，且朝與前述移動方向相反的方向傾斜地被保持也可以。 對於該基板檢查裝置，前述電刷，是對於水平面呈約 30度至50度之間的任意的角度被傾斜保持也可以。 對於該基板檢查裝置，前述電刷，是由玻璃纖維所構成 也可以。 對於該基板檢査裝置，前述搬運手段，是具備旋轉台裝 置，其具有圓形載置台及將該圓形載置台旋轉驅動的旋轉驅 ^ 動手段，前述被檢查基板保持部，是由預定間隔被設在沿著 前述圓形載置台上的圓周的位置，且，前述清潔手段，是至 少1個設在位於前述圓形載置台上的前述被檢査基板保持部 的任意的相鄰接的2個被檢査基板保持部之間也可以。 對於該基板檢查裝置，前述搬運手段，是具備：2個前 述搬運路、及分別被配置於該2個搬運路的前述被檢査基板 保持部、及將該被檢査基板保持沿著各搬運路移動的移動手 段，前述2個搬運路的一部分的路徑是共通，在該共通的路 ® 徑上的任意的位置配置有前述檢査部，進一步，在前述2個 搬運路的至少一方設有1個前述清潔手段，將前述共通的前 述路徑上的前述檢査部，在前述2個被檢査基板保持部是隔 有預定時間間隔通過，另一方面，在該間隔之間，前述清潔 手段是通過前述共通的前述路徑也可以。 對於該基板檢查裝置，前述清潔手段，是從遠離前述檢 查夾具的探針前端部的位置朝向另一方開始移動，一邊與該 探針前端部接觸一邊進行清潔地移動直到遠離該探針前端部 的位置爲止後停止，其後，直到原來的位置爲止朝相反方向 201009352 移動地將該探針前端部清潔，返覆此往復移動也可以。 對於該基板檢查裝置，前述搬運手段，是由具有旋轉驅 動軸及圓形載置台的旋轉台形成，在呈圓周狀被保持於前述 圓形載置台的複數枚的被檢查基板之間，設有前述清潔手段 ，該清潔手段，是藉由前述旋轉驅動軸的旋轉，與前述被檢 査基板一起尋著相同的搬運路徑朝前述檢查部移動也可以。 且，本發明的基板檢查裝置中的複數探針的清潔方法， 其特徴是在藉由使設在檢査夾具的複數探針與被檢査基板上 的配線的檢査點接觸來測量該配線的電氣特性的檢查部，在 既定時間點，將複數前述被檢査基板依序搬運，另一方面， 在與前述既定時間點不同時間點，使具有電刷的清潔手段通 過前述檢查部地清潔前述複數探針。 [發明的效果] 依據本發明的話，可以不中斷將複數基板連續地檢査的 基板檢查的流程的方式進行探針前端部的清潔。 依據本發明的話，不必另外需要進行基板檢查用的驅動 機構和時間就可進行探針前端部的清潔。 依據本發明的話，可以提供一種電刷，可以將電刷被配 置成不需中斷將複數基板連續地檢查的基板檢査的流程的方 式進行的探針前端部的清潔。 依據本發明的話，可以提供一種電刷，在進行將複數基 板連續地檢查的基板檢查期間不需要進行清掃。 且，依據本發明的話，可以提供一種電刷，具備可長時 間發揮清潔效果的特性。 201009352 進一步，依據本發明的話，在探針前端部的清潔的達成 程度不會發生參差不一。 且，因爲將探針前端部清淨化零件設置在搬運路徑上， 利用將此零件移動的搬運移動方向，將探針的前端部清淨化 ，所以可以效率良好地進行探針的清潔。 【實施方式】 以下，對於具有本發明的探針前端部的清潔機構的基板 檢查裝置的實施例，一邊參照添付的圖面一邊詳細說明。在 各添付圖中，爲了理解容易，各構件的厚度、長度、形狀、 構件彼此的間隔等，是請留意有進行誇張、擴大、縮小、變 形、簡略化等的點。且，圖面中，對於相同要素是附加相同 參照符號並省略重複的說明。 [具有探針前端部的清潔機構的基板檢査裝置] 最初，對於基板檢查裝置整體，簡單地說明。 第1圖，是顯示本發明的一實施例的基板檢査裝置10 的槪略的結構的前視圖。該基板檢査裝置10，是具備供被 檢査基板的保持用的旋轉台裝置22(也稱爲「索引載台」 )。旋轉台22,是具備圓形載置台（或是載置台盤）22t及 旋轉驅動軸22s，朝例如箭頭所示的方向旋轉。 有關第2圖如後述，在第1圖的中央所示的旋轉台裝置 22中’複數枚的被檢查基板42被保持。且，基板檢查裝置 1〇’是具備上側檢查夾具28u、下側檢查夾具28d、控制裝 置1 1及校正照相機29。校正照相機29，是具備上側及下側 -11 - 201009352 照相機29u、29d，被檢査基板42是確認是否被保持於旋轉 台裝置22的預定的位置。來自校正照相機29的資訊，是由 畫像處理部16被處理後朝控制部14被送出。 又，在第2圖中，雖在被檢查基板42附加斜線，但是 其不是剖面的意思，而只是爲了容易與其他的要素區別。 在檢査夾具28的上側檢査夾具28u及下側檢査夾具 2 8d中，也安裝有複數探針32。上側檢査夾具28u及下側檢 査夾具28d，是各別藉由上側夾具驅動部26u及下側夾具驅 動部26d進行上昇及下降。 ® 控制裝置11，是具備操作盤12、控制部14、畫像處理 部1 6、測試器控制器1 8及掃描器20。 控制部14，是由無圖示的CPU、ROM、RAM等構成， 在ROM中被記憶有基板檢査用程式。在基板檢查時，依據 來自操作盤12的指示，將該基板檢查用程式從ROM讀出 至RAM並被實行。 測試器控制器18，是取得來自控制部14的檢查開始命 令的話，將掃描器20控制並實行被檢查基板的檢查。雖無 Θ 圖示，但是掃描器20,是具有：在被檢查基板的配線將電 流流動用的電源、及將與此電源及各探針32連接的訊號線 切換連接的開關群、及判別配線的良否用的判別部。 配線的檢査時，是將上側夾具驅動部26u及下側夾具驅 動部26d驅動，各別使上側檢査夾具28u及下側檢查夾具 28d下降及上昇，藉此，同時使複數探針的先端與被檢査基 板的配線上的預定的檢查點接觸。 接著，測試器控制器18,是依據預先被設定的開關群 -12- 201009352 的切換程式將被檢查基板的配線依序與電源連接，測量各配 線的電阻値，由判別部，從其測量電阻値判別該當配線的良 否。判別結果，是逐次從測試器控制器1 8朝控制部1 4被送 出，在檢查終了時，控制部14是將該當被檢查基板的最終 的檢查結果輸出。 [一實施例的旋轉台裝置的槪要] 第2圖，是將第1圖的旋轉台裝置22的一實施例的旋 轉台裝置22從上方所見的平面圖。旋轉台裝置22是搬運手 段，具備移動手段的圓形載置台22t及旋轉驅動軸22s，基 板檢查時，圓形載置台22t是藉由旋轉驅動軸22s如箭頭所 示朝順時針旋轉。 爲了方便說明，在第2圖中，沿著圓形載置台22t的圓 周，使對應順時針的文字盤，將7點半的位置作爲P1，從 其朝順時針角度每次移動45度的位置，即，9點、10點半 、12點、1點半、3點、4點半及6點的位置是各別爲P2、 W P3、P4、P5、P6及P8。例如，12點的位置是成爲P4，6點 的位置是成爲P8。 在圓形載置台22t上，沿著圓周由等間隔設有8個被檢 査基板保持部（也稱爲工件支架）40，且各被載置1枚的被 檢查基板42。在第2圖中，各被檢查基板保持部40，是位 於對應從P1至P8的位置中。在P4的位置中，設有被檢查 基板42的檢查部30,依據圓形載置台22t的旋轉，使被載 置的被檢查基板42依序被搬入該檢查部30。在檢査部30 中，配置有檢查夾具28的上側檢查夾具28u及下側檢查夾 -13- 201009352 具28d。藉由圓形載置台22t被旋轉驅動軸22s驅動而旋轉 ，而形成將複數被檢査基板保持部上的被檢査基板42搬運 至檢査部30的圓形狀的搬運路。 如位於P8的被檢查基板保持部40所示，在被檢査基 板保持部40中，形成有開口 40w。因此，在被檢査基板保 持部40被設置檢查基板42時，該被檢查基板42的背面的 導體模式圖是從其開口 40w露出，對於其，下側檢查夾具 28d (第1圖）的探針32可以接觸P4的檢査部30。 基板檢査時，pi是成爲被檢査基板的搬入口，被檢查 ® 基板42是依序被載置於來到該位置的被檢查基板保持部40 。圓形載置台22t是每次被旋轉45度，依據該旋轉，被保 持在被檢查基板保持部40的被檢査基板42,是依序移動至 P2、P3的位置。被檢查基板42，是在P4的位置，藉由檢 査部30進行電氣特性的測量。該測量完成的話，圓形載置 台22t旋轉，被檢查基板42是被搬運至接著的P5的位置。 被檢查基板42是依序被搬運並到達P7的話，該被檢査基 板42,是從被檢查基板保持部40被取下。有關此一連的流 Q 程，將位置P1〜P3稱爲上流部，將位置P5〜P7稱爲下流 部。 在P4的位置中，對於被檢查基板42，檢查夾具28u是 從第2圖的紙面的表面上側接近，進一步，檢査夾具2 8d是 從背面下側接近，各檢査夾具28u、2 8d的探針是分別與形 成於被檢查基板42的表背的各面的配線的檢查點接觸。藉 此進行被檢查基板42的各配線的電氣特性的測量。終了的 話，上側檢查夾具28u及上側檢査夾具28u，是各別遠離被 -14- 201009352 檢查基板42的表面側及背面側，被進行測量的被檢査基板 42,是隨著圓形載置台22t的旋轉，如上述，朝下一個的 P5的位置被搬運。如此，返覆進行圓形載置台22t由預定 時間點每次旋轉45度並停止的動作。在P4的檢查部中， 由其預定時間點使被檢查基板42被搬入使檢查被進行，其 終了的話，由預定時間點使被檢査基板42被搬運至下一個 的位置。 ©且，如第2圖所示，在P2的位置中的被檢査基板保持 部40及P3的位置中的被檢查基板保持部40之間的圓形載 置台22t上的位置C1，設有清潔機構50。且，在P6的位置 中的被檢査基板保持部40及P7的位置中的被檢查基板保 持部40之間的圓形載置台22t上的位置C2，也設有另一個 清潔機構50。那些的清潔機構50是相同構造。 如上述，C1的位置雖是在P2的被檢查基板保持部40 及P3的被檢查基板保持部40之間，但是不需要變更那些 保持部之間的間隔。換言之，從C1的位置P2直到被檢査 ® 基板保持部40或是P3的被檢查基板保持部40爲止的距離 ，是比從P2的被檢査基板保持部40直到P3的被檢査基板 保持部40爲止的距離更小。同樣地，P6的被檢查基板保持 部40及P7的被檢査基板保持部40之間的C2的位置的清 潔機構50，也不會影響那些的間隔的大小。因此’即使在 C1及C2的位置設置清潔機構50，被檢査基板42被搬入檢 查部30的時間點不會變化。那些的清潔機構50是與圓形載 置台22t的旋轉一起移動。 且，在第2圖中，雖在C1及C2的位置設有清潔機構 -15- 201009352 50’但是清潔機構50，是可以設在任意的相鄰接的2個被 檢査基板保持部40之間。且，清潔機構50的數量雖至少爲 1個’但是依據清潔效果達成程度的需要性可以爲任意的數 量。 清潔機構50，是具備電刷部分52及將該電刷部分保持 的保持部54。在電刷部分52中被植入細的纖維例如玻璃纖 維纖維。在電刷部分52的電刷中，藉由使用具有比較大的 直徑粗度的纖維使電刷具有彈力性較佳。且，藉由將各纖維 的前端部較細形成，清潔時，使其前端部複數探針32之間 也可以。且，清潔時，各纖維進入相鄰接的探針32之間也 可以。 且，清潔機構50的電刷部分52是朝與進行方向相反的 方向傾斜（後傾）的方式被保持。且，被植入電刷部分52 的纖維的流動方向是從清潔機構50的移動地點朝後流動的 方向。換言之，其纖維的流動方向，是從P3的位置朝向P2 的位置的方向及從P7朝向P6的方向。 第3圖A，是電刷部分52的一部分的擴大圖。各纖維 是例如耐綸製或是PBT (聚對苯二甲酸丁二醇酯），其直徑 52 φ是約0.1mm，如其圖所示，各纖維的先端是形成錐面狀 。且，電刷部分52的纖維的長度是從約20至3 0mm，電刷 部分52的厚度是約2至4mm。 第3圖B中，說明C1或是C2中的清潔機構50是隨著 圓形載置台22t的旋轉而通過檢查部30的狀態用的簡略化 的前視圖。在此，清潔機構50’是圖面上左端者與圓形載 置台22t —起朝右側依順移動者。在檢查部30中，只有顯 201009352 示上側檢查夾具28u。下側檢査夾具28d也具有同樣的功能 β上側檢查夾具2 8u，是具備複數探針32,各探針是具備探 針軸部32s及探針前端部32ρ。探針軸部32s的後端部是與 掃描器20電連接。上側檢査夾具28u，是爲了檢査下一個 的被檢查基板而位於待機位置。 如第3圖B所示，清潔機構50的電刷部分52，是對於 圓形載置台22t的面傾斜約45度的角度的方式被保持於電 刷保持部54。電刷保持部54雖是簡略化顯示，但是由可以 調整電刷部52的傾斜角度的方式被固定於圓形載置台22t 上。其傾斜角度是從圓形載置台22t的面槪略30度至50度 左右之間的角度較佳。 且，如第3圖B所示，清潔機構50的電刷部分52的 纖維’是在檢查部30的前方雖爲正直地，但是通過檢查部 30時，是沿著上側檢查夾具28u的探針前端部32p的導引 托板3 2g彎曲。此時，藉由電刷部52的纖維的前端部附著 在探針前端部3 2p的焊錫的殘渣和氧化膜的破片等被掃落。 ® 通過檢查部30的話，清潔機構50的電刷部52的纖維是藉 由彈性回復正直。如此，被檢查基板42被搬入檢查部30時 ，或是檢查終了隨著被檢查基板42從檢査部30被搬出時的 圓形載置台2 2t的旋轉’使設在ci及C2的清潔機構50可 以進行檢査部30的探針前端部32p的清潔。因此，不需要 另外將清潔用的過程’且，也不需要爲了清潔而將檢查作業 中斷等。 清潔時爲了捕集從探針前端部32p被掃落的焊錫的殘渣 和氧化膜的破片等，依據需要，將吸塵器的取入口設在圓形 -17- 201009352 載置台22t上的Cl及C2的附近和檢查部30的附近也可以 [清潔機構的構造] 第4圖A至第4圖D，是說明清潔機構50的一實施例 的詳細的構造用的圖。 第4圖A是清潔機構50的立體圖，第4圖B是其清潔 機構50的側面圖。如那些的圖所示，在此實施例中，清潔 機構50，是具備2個電刷部分52及電刷保持部54。在第4 圖B中，上方所示的電刷部分52是進行上側檢査夾具28u 的探針的前端部32p的清潔用者，下方所示的電刷部分52 是進行下側檢查夾具28d的探針32的前端部32p的清潔用 者。但是，在第4圖A中，爲了簡略化，第4圖B的下方 所示的電刷部分52被省略。 各電刷部分52，是具備纖維玻璃等的纖維的束的部分 52a及將該纖維的束的部分52a植入的部分52b。電刷保持 部54,是挾持將纖維的束的部分5 2a植入的2個部分52b。 例如，圖示的方式將各部分52b藉由3根的螺絲固定。 與第3圖A的實施態樣相異，電刷部分52的各纖維是 使用具有約50至80/zm的直徑者也可以。相鄰接的探針32 的距離是例如40 #m，使用具有比該40//m小的直徑的纖 維的話，該纖維雖可以進入如此的探針之間，但是依據情況 ，也具有彈力性不足夠的情況。 且，如第4圖B所示，在電刷保持部54中，角度調整 托板5 4a是藉由螺絲被安裝。將該螺絲鬆緩就可以改變該托 201009352 板的固定位置。藉由改變該固定位置，該托板的端部的突出 的長度會改變，藉此’將纖維玻璃等的纖維的束的部分52a 按壓的位置因爲改變，藉此，可以改變纖維玻璃等的纖維的 束的部分52a的傾斜角度。 第4圖C，是顯示將清潔機構50安裝於環形狀部80的 狀態的立體圖。藉由橫跨該環形狀部80的開口部80a的方 式，使清潔機構50的電刷保持部54的2處被螺固。藉此’ 從該開口部，使第4圖B的下側所示的電刷部分52可以朝 ® 下方傾斜方向突出。此情況時，下側的電刷部分52的寬度 是使用比第4圖C所示的上側的電刷部分52的寬度更狹窄 者也可以。環形狀部80，當被固定於形成於圓形載置台22t 的開口部的某表側的面（上方的面）的情況時，且使用相同 大小的電刷部分的情況時，使用具有寬的開口部80a的環形 狀部80也可以。 電刷的寬度，是上側及下側檢查夾具28u、28d的探針 的列的長度，例如，在第3圖B中，必需比從紙面的表側 ® 朝背側並列的列的長度更大。其是爲了可以藉由電刷1次通 過探針的先端就可對於全部的探針進行焊錫的殘渣和氧化膜 的破片等的掃落。但是，例如，將清潔機構複數設置，依據 清潔機構的數量使其電刷部分通過探針的路徑不會重覆的方 式分割，讓各清潔的電刷部分分別分擔被分割的各路徑中的 探針的清潔也可以。 第4圖D，是顯示將第4圖C所示的環形狀部80固定 於圓形載置台22t的開口部56的某部分的背面的狀態的立 體圖。如該圖所示，寬度比電刷部分52更狹窄的電刷部分 -19- 201009352 53是被安裝於環形狀部80。電刷部分53，是具備纖維玻璃 等的纖維的束的部分53a及將其纖維的束的部分53a植入的 部分53b。如此，電刷部分53不從圓形載置台22t的表面 上突出，也可以從其背面經由開口部56突出。此情況時， 對於下側檢查夾具28d，使具有寬度的寬電刷部分突出也可 以。 第5圖，是本發明的其他的實施例的清潔機構60的立 體圖。該清潔機構60，是具備將電刷部分62及電刷部分62 保持的保持部64。電刷部分62,是具備：細的纖維例如玻 璃纖維纖維的束的部分62a、及將該纖維的束植入的部分62 。使用第3圖A所示的纖維也可以。電刷保持部64,是挾 持將纖維的束的部分62a植入的部分62b。 且，電刷保持部64，是藉由調整螺絲64a被安裝於固 定部65。藉由將該調整螺絲鬆緩來變更將電刷保持部64保 持的角度，可以調整電刷部分62的傾斜。固定部65是被固 定於圓形載置台22t的面上。 [穿梭型基板檢査裝置的槪要] 第6圖，是穿梭型基板檢查裝置70的簡略化的平面圖 。穿梭型基板檢查裝置70是具備清潔機構90。第2圖所示 的旋轉台裝置22,是雖是形成將複數被檢查基板保持部40 沿著圓形狀的路徑移動的搬運路，但第6圖所示的穿梭型基 板檢查裝置，是具備2個搬運路7 0L及7 0R的2個搬運路 ，那些的搬運路，是具有共通的搬運路70C。被檢查基板保 持部（托盤）74L是沿著如此的略矩形狀的搬運路70L及共 -20- 201009352 通搬運路70C移動，且，被檢查基板保持部（托盤）74R是 沿著略矩形狀的搬運路70R及共通搬運路70C移動。 在共通搬運路70C中，設有檢查部30。該檢查部30是 具備1個檢査夾具的者也可以，與第2圖的實施例同樣，在 上下方向具備檢查夾具，藉此，將形成於被檢查基板的雙面 的導體模式圖的測量同時進行也可以。 爲了方便說明，在第6圖中，將搬運路70L的一些的 位置，沿著箭頭顯示的路徑，從左下的位置朝左周圍，顯示 爲？[1、？2、？3、？4及？1^5。且，將搬運路7011的一些的 位置，沿著箭頭顯示的路徑，從右下的位置朝右周圍，顯示 爲PR1、P2、P3、P4及PR5。依此的話，托盤74L是位於 PL1的位置，托盤74R是位於PR1的位置，清潔機構70是 位於P3的位置，檢查部30是位於P4的位置。 各托盤的驅動，是例如，藉由被設在各通道的氣壓缸進 行。且，使在第2圖所示的旋轉台裝置22的被檢查基板保 持部40形成有開口 40 w的方式，在各托盤形成有開□，下 ® 側檢査夾具也可以從下側接續被檢査基板72。 PL1，是搬運路70L中的被檢查基板的搬入部及搬出部 ，PR1，是搬運路70R中的被檢查基板的搬入部及搬出部。 例如，在搬運路70L中，托盤74L是位於PL1時被檢査基 板72L是被載置在該托盤。之後，該托盤，是沿著搬運路 70L移動，通過共通搬運路70C的P2、P3朝位於P4中的 檢査部30移動。在該檢査部中，藉由具備複數探針的檢査 夾具使被檢査基板72的電氣特性被測量。該測量完成的話 ，托盤74L，是從P4移動並通過PL5，到達搬出部及搬入 -21 - 201009352 部的PL 1。在此，檢査終了的被檢査基板72是從托盤74L 被取走並使下一個的被檢查基板72被載置。 托盤74L，是在搬出部及搬入部的PL1，在將檢查完成 的被檢查基板取走將下一個的新的被檢查基板載置期間，靜 止於PL1。另一方面，其間，將新的被檢查基板72放置的 托盤74R，是沿著搬運路70R從PR1移動並通過共通搬運 路70C的P2、P3朝檢查部30移動，在此受到該被檢查基 板的檢査。如此，各搬運路中的被檢查基板因爲受到交互檢 查，所以可以去除被檢查基板的取出及載置用的多餘時間。 其結果可以短縮複數被檢查基板的檢査的合計時間。 清潔機構90,是具備電刷部分92及將其保持的保持部 94。電刷部分92,是具備：細的纖維例如玻璃纖維纖維的 束的部分92a、及將該纖維的束植入的部分92b。各纖維， 是與第3圖A的實施例同樣，例如是耐綸製，其直徑52φ 是約0.1mm，如其圖所示，各纖維的先端是形成錐面狀也可 以。且，電刷部分52的纖維的長度是約20至30mm，電刷 部分52的厚度是約2至4mm也可以。 電刷保持部94,是挾持將纖維的束的部分92a植入的 部分92b。且，電刷保持部94，是例如，藉由無圖示的調整 螺絲被安裝於托盤95，可以調整電刷部分92的安裝角度。 在第6圖中，電刷部分92,是朝與托盤95的進行方向相反 方向傾斜。其傾斜角度，是從托盤95的面約45度。但是， 設定成30度至50度程度之間的任意的角度也可以。 清潔機構90的托盤95，是例如，將搬運路70R及共通 搬運路70C移動的方式設置也可以。該情況，托盤95,是 201009352 在搬運路70R中，在與托盤74R保持於一定的間隔的狀態 下與托盤74R的動作同步移動。且，在共通搬運路70C中 ，托盤74L、74L不通過期間，使托盤95是通過共通搬運 路70C，不妨害那些的托盤的移動。因此，托盤95的移動 ，是也不會影響被載置於托盤74L、74L的被檢查基板的檢 査時間點。 進行檢査探針的清潔時，是托盤95,是通過共通搬運 路70C進入P4的檢查部30。在P4的位置中，清潔機構90 ® 的後傾的電刷部分92,是如第3圖所示，一邊掃過檢查夾 具的探針的前端部一邊通過探針的列。從其，朝向PR5移 動。 在此實施例，電刷部分92,是也一邊掃過檢查夾具的 探針的前端部一邊在通過探針的列的P4的位置設置吸塵器 的取入口，將落下的焊錫屑、其他的灰塵等捕集也可以。 且，爲了提高檢查部30的探針的清潔的頻率，在搬運 路70L也配置別的清潔機構，在托盤74L及74L不通過的1 ® 個期間，使別的清潔機構移動’在下一個的期間使清潔機構 90移動的方式，將那些交互地通過檢査部30來進行探針的 清潔也可以。 接著，使用清潔機構50或是90，說明將檢査夾具的探 針32清潔時的留意點。 一般，探針32因爲是垂直地延伸’如第3圖B所示’ 電刷部分，是有需要保持於與進行方向相反地傾斜的狀態。 在該狀態下，電刷部分是與探針的先端接觸的話’電刷部分 的纖維因爲可以與探針漸漸地接觸’所以不會衝擊探針。 -23- 201009352 且’作爲清潔用電刷，電刷部分是使用由比較軟的素材 所構成的電刷（例如PBT :聚對苯二甲酸丁二醇酯製電刷） ’進行探針前端部的清潔，也可取代其，電刷部分是使用由 比較硬的素材所構成的電刷（例如玻璃纖維製電刷），進行 探針前端部清潔較佳。 如上述，使用傾斜的電刷進行探針前端部的清潔的實施 例的話，就可去除附著在相鄰接的探針彼此的先端並使探針 彼此導通不良（短路）狀態的異物（例如焊錫等的導電物質 )’可以正確地實施檢查。特別是，該實施例，是如四端子 ® 測量方法，使測量探針彼此的分離距離縮短地配置，就可以 有效利用於去除檢查夾具的測量探針之間的異物。 [其他的實施例的旋轉台裝置的槪要] 第7圖，是將與第2圖不同的其他的實施例的旋轉台裝 置220從上方所見的平面圖。與第2圖的旋轉台裝置22同 樣的要素是附加同相的符號省略其說明。 與第2圖的旋轉台裝置22相異，在P2的位置中的被 @ 檢査基板保持部40及P3的位置中的被檢查基板保持部40 之間的圓形載置台22t上的位置C1中，可取代清潔機構50 ，而將上側探針前端部清淨化零件44Ru沿著半徑方向設置 。因此，探針前端部清淨化零件44Ru，是成爲與旋轉台22 裝置一體，在與前述被檢查基板42被搬運的搬運路徑相同 的路徑上移動。又，此設置位置是任意’未限定於位置p2 及P3之間。 通常，檢査部30中的檢査夾具28，是在不與上側探針 -24- 201009352 前端部清淨化零件44Ru接觸的位置被抬起被且被保持於該 位置》朝半徑方向延伸的（即與圓周方向相比在半徑方向較 長形成，可以覆蓋檢査夾具28u的探針領域）上側探針前端 部清淨化零件44Ru是來到位置P4時，上側檢查夾具28u， 是下降直到探針前端部32p (圖的9符號32p參照）輕微接 觸探針前端部清淨化零件44Ru的纖維先端的位置爲止（第 9圖參照）。由此階段，進行上側檢查夾具28u的探針前端 部的清潔動作。探針前端部清淨化零件44Ru，是已如第9 V 圖詳細說明，大體上是纖維朝向上方被植入的電刷。 在圖中雖未顯示，但是在載置台盤22t的背面也設有下 側探針前端部清淨化零件44Rd。同樣地，下側檢査夾具 2 8d’是上昇直到探針前端部輕微接觸下側探針前端部清淨 化零件44Rd的纖維先端的位置爲止，進行清潔動作。 清潔動作，是利用朝由旋轉台裝置22所産生的預定的 角度內的順時針方向及逆時針方向的往復旋轉移動來進行。 由此，電刷的纖維，是分別將上側檢查夾具28u及下側檢査 ® 夾具28d的探針前端部抹乾淨。對於檢查夾具28的探針， 爲了界定電刷的抹乾淨的方向，而規定此方向爲X方向。 在圖中雖未顯示，探針前端部的清潔作業時，爲了捕集落下 的焊錫屑、其他的灰塵等，而將吸塵器的取入口設在位置 P4的附近的適當的場所。 且，在載置台盤22t的位置P6及P7之間的位置C2， 別的上側探針前端部清淨化零件44Cu是沿著圓周方向被設 置。因此’探針前端部清淨化零件44Cu，是成爲與旋轉台 裝置22 —體’前述被檢查基板42是在與被搬運的搬運路徑 -25- 201009352 相同的路徑上移動。又，此設置位置，是不限定於位置P6 及P7之間’可以爲任意。上側探針前端部清淨化零件44Cu 是隨著旋轉台裝置22的旋轉來到位置P4時，進行探針前 端部的清潔動作。 上側探針前端部清淨化零件44Cu是來到位置P4時， 上側檢査夾具28u，是下降直到探針前端部輕微接觸上側探 針前端部清淨化零件44Cu的纖維先端的位置爲止。在圖中 雖未顯示，但是在載置台盤22t的背面也設有下側探針前端 部清淨化零件44Cd。同樣地，下側檢查夾具28d，是上昇 直到探針前端部輕微接觸下側探針前端部清淨化零件44Cd 的纖維先端的位置爲止，進行探針前端部的清潔動作。 清潔動作，是例如，利用氣壓缸38u進行。朝圓周方向 延伸的（即，與半徑方向相比在圓周方向較長形成）上側探 針前端部清淨化零件44Cu，是藉由氣壓缸38u在載置台盤 22t的半徑方向預定的長度往復移動的方式被驅動。氣壓缸 3 8u，是利用空氣壓將負荷（探針前端部清淨化零件44C) 驅動的致動器（作動機器），各種型式已被市售。可以藉由 例如，沿著上側探針前端部清淨化零件44Cu的移動方向附 設軌道（無圖示），將上側探針前端部清淨化零件44Cu藉 由氣壓缸有半徑方向向外驅動，在將空氣停止的階段藉由彈 簧驅動朝半徑方向向內驅動的構成進行。 進一步，上側探針前端部清淨化零件44Cu的圓周方向 的長度，是比可以覆蓋檢査夾具2 8u的探針領域的長度短時 ，在最初的探針前端部的清潔動作終了之後，將旋轉台22 些微旋轉使上側探針前端部清淨化零件44Cu朝圓周方向些 201009352 微移動，接著進行清潔動作。探針前端部清淨化零件44C 的圓周方向的長度’是即使無法將檢查夾具28u的探針領域 覆蓋，也可以藉由利用旋轉台22的旋轉將清潔動作分數次 進行。 藉由此清潔動作，電刷的纖維，是分別將上側檢査夾具 2 8u及下側檢査夾具28d的探針前端部，朝γ方向抹乾淨。 此清潔作業不是旋轉台裝置22每旋轉1周就被實行。 例如，從習知的經驗，將預定枚數（例如100枚）的基板檢 查之後’才使清潔動作被實行。或是由基板檢査裝置10所 獲得的基板檢査的資料，是如後述的「試作結果」，當檢查 閾値由預先決定的頻率超過時，清潔動作才被實行。 [其他的探針前端部清淨化零件] 第8圖，是顯示具有其他的探針前端部清淨化零件的旋 轉台裝置22的一部分擴大圖。 在第7圖中，探針前端部清淨化零件44R是沿著半徑 ® 方向被設置，探針前端部清淨化零件44C是沿著圓周方向 被設置。 對於其，第8圖的探針前端部清淨化零件44RC的1個 探針前端部清淨化零件，是成爲朝半徑方向及圓周方向延伸 的形狀。探針前端部清淨化零件44RC的形狀，是不限定於 圖所示的十字形狀。其形狀是使電刷朝半徑方向及圓周方向 延伸即可，例如，T字形狀、L字形狀等可以。探針前端部 清淨化零件44RC，也與旋轉台22成爲一體，前述被檢查基 板42是在與被搬運的搬運路徑相同的路徑上移動。又，此 -27- 201009352 設置位置可以爲任意。 此探針前端部清淨化零件44RC的設置處，是移動至由 第7圖所說明的旋轉台22的位置P4時，探針前端部32p 的清潔動作被進行。探針前端部清淨化零件44RC，是與第 7圖的說明同樣，X方向的往復移動是藉由旋轉台裝置22 的預定角度的往復旋轉而被驅動，Y方向的往復移動是藉由 例如氣壓缸3 8u藉由預定的長度的往復移動而被驅動。Y方 向的往復移動之後，將旋轉台些微旋轉移動，進一步藉由朝 Y方向的往復移動，將Y方向的清潔分數次進行也可以。 ® 當然，與第7圖的探針前端部清淨化零件同樣，在旋轉 台裝置22的上面及背面的雙方，分別設有上側及下側探針 前端部清淨化零件44RCu、44RCd。藉由探針前端部清淨化 零件44RC，可以將檢査夾具的探針前端部，藉由1個的探 針前端部清淨化零件分別朝X方向及Y方向抹乾淨。 [檢査夾具及探針前端部清淨化零件] 第9圖（A)及第9圖（B)，是說明檢査夾具28及探 Θ 針前端部清淨化零件44的詳細的圖。 在檢查夾具28中安裝有複數本的探針32。各探針32， 是由探針軸部32s及探針前端部3 2p構成，在探針32的後 端雖連接有與基板檢查裝置10的掃描器20連接的訊號線， 但是在圖中被省略。 探針先端清淨化零件44，是電刷固定構件44h、及由被 固定於這的複數本的電刷44也所構成，電刷44b是由電刷 軸部44S及纖維部44f所構成。探針先端清淨化零件44， -28- 201009352 是例如，利用被市售的整修電刷作爲印刷電路基板的清掃、 硏磨用，將複數個整修電刷植附在電刷固定構件44h的方式 固定形成也可以。纖維部44f，是例如，由玻璃纖維所構成 。被固定於電刷固定構件44h的整修電刷的數量雖是任意但 是在試作品中爲6〜20個程度。探針先端清淨化零件44， 是朝X方向或是Y方向往復移動時，爲了使纖維部44f與 探針前端部32p平均地接觸，不是在電刷固定構件44h正呈 格子狀植附，而是相鄰接的電刷列是呈半格子錯開植附者較 佳。 接著，說明有關使用探針前端部清淨化零件44將檢査 夾具28的探針32清潔時的留意點。 如第9圖（A)所示，檢査夾具28，是朝向被設在旋轉 台22的探針先端清淨化零件44下降時，探針先端清淨化零 件44不是在其正下方，且不與探針前端部3 2p衝突較佳。 檢查夾具28,是下降直到探針前端部32p些微接觸纖維部 44b的高度爲止並靜止之後，探針先端清淨化零件44是從 ^ 圖面所見左方朝向右方地橫方向移動，纖維部44b是將探針 前端部3 2p朝向另一方抹去（即擦除）。纖維部44也是到 達遠離探針前端部32p的位置時靜止，其後，朝向原來的位 置地橫方向移動，纖維部44b是將探針前端部32p朝相反方 向抹去。將這種清潔動作返覆所需要的次數。清潔動作終了 後，檢查夾具28是上昇直到原來的位置爲止。 如第9圖（B)所示，檢查夾具28,是朝向被設在旋轉 台22的探針先端清淨化零件44下降時，探針先端清淨化零 件44是位於其正下方的話，纖維部44f的先端會與探針前 -29- 201009352 端部3 2p衝突，使探針32成爲壓迫的狀態。在此狀態下， 探針先端清淨化零件44的橫方向的往復移動開始的話，會 從纖維部44f對於探針32施加過大的負荷，而會發生在一 些的探針32發生變形的現象。因此，在如第9圖（A)說 明的狀態下進行清潔動作較佳。 [穿梭型基板檢查裝置] 本實施例的清潔機構，不限定於利用旋轉台裝置22 0的 基板檢查裝置1〇。例如，第10圖，是說明在穿梭型基板檢 查裝置150所使用的基板保持部分的圖。穿梭型基板檢查裝 置150的基板保持部分以外，是與第7圖說明的基板試驗裝 置相同。且，基本的構成是與第6圖的穿梭型基板檢査裝置 70的結構相同。符號29是校正照相機。 第10圖的穿梭型基板檢查裝置150,大體上是將被檢 査基板72放置托盤74L或是74R是沿著預定的線道在板狀 的矩形載置台22-1上移動的構造。 即，被檢查基板72是被載置於位置P1中的左側托盤 74L的話，其左側托盤74L，是通過左側線道70L經由位置 P3，通過中央線道70C移動直到位置P5爲止，在位置P5 靜止並實施基板檢査。基板檢査終了後，通過左側線道70L 經由位置P6，返回至位置P1。 被設在位置P2中的右側托盤74R的被檢査基板72,是 通過右側線道70R經由位置P3,在先行的左側的基板的檢 查終了時點，將中央線道70C移動直到位置P5爲止，在位 置P5實施基板檢查。在基板檢查後，通過右側線道70L經 201009352 由位置P7，返回至位置P2。 在左側托盤74L的前進的路徑中，位置PI、P3、P4是 上流部，位置P5是檢査部，位置P6、P1是下流部。另一 方面，在右側托盤74R的前進的路徑中，位置P2、P3、P4 是上流部，位置P5是檢査部，位置P7、P2是下流部。 在片側的被檢查基板72的基板檢查進行時間，藉由進 行將相反側的被檢查基板72在托盤74L或是74R定位的設 置作業，來短縮複數枚的基板檢查的合計時間。 穿梭型基板檢查裝置150也可以具備清潔機構。 例如，對於右側托盤74R，可取代被檢查基板，而設置 由第9圖說明的探針前端部清淨化零件44。探針前端部清 淨化零件44，是半徑方向延伸探針前端部清淨化零件44R 、圓周方向延伸探針前端部清淨化零件44C及半徑方向及 圓周方向延伸探針前端部清淨化零件44RC的任一型式也可 以。 在右側托盤74R被設置的探針前端部清淨化零件44, ® 是在位置P5藉由氣壓缸（無圖示），朝X方向預定的長度 往復移動，進行檢査夾具28的探針前端部32p的清潔動作 。進一步’依據需要，朝Y方向預定的長度往復移動，進 行檢查夾具28的探針前端部3 2p的清潔動作。因此，探針 前端部清淨化零件44,是與托盤74R成爲—體，前述被檢 査基板72是在與被搬運的搬運路徑相同的路徑上移動。在 圖中雖未顯示，但是探針前端部的清潔作業時，爲了捕集落 下的焊錫屑、其他的灰塵等，吸塵器的取入口是被設在位置 P5的附近的適當的場所。 -31 - 201009352 此清潔作業，是例如，將預定枚數（例如100枚）的基 板在檢查之後被實行。或是由基板檢查裝置150所獲得的基 板檢査的資料，是如後述的「試作結果」，超越預定的閾値 時，使清潔動作被實行。 [試作結果] 例如，在基板檢查裝置10、150中，測量導體模式圖的 電阻値，判別其良否。例如，良否的判別基準，是若導體模 式圖的測量電阻値爲次式的檢查閾値以下的話判別爲良品， © 超越檢查閾値的話判別爲不良品。 檢查閾値=L + k ( Ω ) L :良品基板的導體模式圖電阻値 k:探針及導體模式圖的接觸電阻、探針前端部的焊 錫附著等的電阻 由一例說明的話，將1〇〇枚程度的基板檢查實施的話， 基板導體的測量電阻値會是超越檢査閾値的情況。此情況， © 由習知技術說明的方式，以手作業進行探針前端部的清潔， 使基板導體的測量電阻値回復至檢査閾値以下。 使用上述實施例說明的清潔機構，對於超越檢查閾値的 基板實施清潔動作。 清潔用電刷，電刷部分是由比較軟的素材所構成的電刷 (例如，使用PBT :聚對苯二甲酸丁二醇酯製電刷），對於 探針前端部朝X方向實施最大200次的清潔。但是，測量 電阻値是超過檢查閾値者。 -32- 201009352 可取代PBT製電刷，電刷部分是使用由比較硬的素材 所構成的電刷（例如玻璃纖維製電刷），對於探針前端部朝 X方向實施數十次程度的清潔。此結果，測量電阻値是成爲 幾乎檢查閾値以下。 接著，對於探針前端部，朝X方向實施數十次程度的 清潔，其後’朝Υ方向實施數十次程度的清潔。此結果， 可確認全部的測量電阻値是成爲檢査閾値以下。基板的導體 模式圖的測量電阻値的變動値的寬度是在1Ω以下。 依據這些的試作結果可了解，使用的電刷的材料，是比 軟的素材（ΡΒΤ)硬的素材（玻璃纖維）較佳。藉由對於探 針前端部朝一方向（例如X方向）實施數十次程度的清潔 的話’探針前端部是幾乎被清潔。進一步，藉由分別對於探 針前端部朝二方向（例如X方向及Υ方向）實施數十次程 度的清潔的話，探針前端部是完全地被清潔。 將清潔作業朝一方向或朝二方向，可藉由在基板檢查中 所獲得的被檢査基板的導體模式圖的測量電阻値超越檢查閾 w 値的頻率等被決定。 第7圖至第10圖爲止所示的實施例，與第2圖的實施 例相比，對於探針前端部的周面可以進行進一步的清潔。因 此’此實施例，特別適用於，使用在探針的前端部及檢查點 之間焊錫屑等殘存使那些的接觸電阻値變動而影響其結果測 量値的二端子測量法來實施基板檢查時的探針的清潔。 [實施例的優點、效果] 如以上說明，藉由在基板檢査裝置具備清潔機構，可發 -33- 201009352 生以下的優點、效果。 (ο μ有探針前端部的清潔機構的基板檢査裝置的實現 藉由本實施例，可以實現具有探針前端部的清潔機構的 基板檢查裝置。 (2)清潔作業的機械化 如習知技術說明，習知，是從基板檢査裝置將檢查夾具 取下’以手作業將檢查夾具的探針藉由電刷清潔。 © 藉由本實施例，可以達成清潔作業的機械化。在手作業 中將清淨化的品質程度管理是困難的。但是，藉由將清潔動 作機械化，可以將探針前端部的清淨化的品質程度一定地管 理。 (3 )清潔作業的自動化 藉由在基板檢査裝置具備清潔機構，可以達成清潔作業 的自動化。 © 在手作業中，基板檢査作業及探針先端的清潔作業是成 爲個別的作業。進一步，在專利文獻1及2所揭示的基板檢 査裝置，當清潔時，是將與複數枚的被檢查基板的流動個別 設置的清潔手段移動直到接點部、接點探針等的場所爲止來 清潔實行。 但是，在基板檢査裝置，藉由具備使被檢查基板在與被 搬運的搬運路徑相同的路徑上移動的清潔機構，就不會實質 上中斷基板檢査作業，探針先端的清潔作業就可以與基板檢 -34- 201009352 查作業一起由一連的過程實施。 即，將複數枚（例如100枚）的基板依序連續地進行基 板檢查時’從檢查夾具所見，藉由設置在被檢查基板的位置 與被檢查基板相同尋著搬運路徑移動的清潔機構，就實質上 不中斷被依序實施的基板檢査的流程，必要時可在短時間進 行探針前端部的清潔，並立即返回至基板檢査。 (4) 基板檢査時間的短縮 藉由在基板檢查裝置具備清潔機構，檢查夾具的取下 及再安裝成爲不需要。被檢查基板的配線被極度高密度化， 對應此的檢查夾具的探針配列也在極度高密度化被。因此， 將檢查夾具再安裝在基板檢查裝置時，爲了位置修正及決定 位置需要花費很多時間》藉由在基板檢査裝置具備清潔機構 ’檢查夾具的裝卸本身成爲不需要，在探針前端部的清潔所 需要的時間可以大幅地短縮。其結果，將一定的枚數的基板 檢査所需要的合計基板檢査時間可以大幅地短縮。 (5) 檢查夾具的位置偏離的消解 習知，在清淨化作業後將檢查夾具再安裝在基板檢査裝 置時，返覆每次一點的設置位置的修正並使最終的位置決定 安裝的方式進行位置設定。但是，在這種安裝位置設定作業 中，無論如何會在檢查夾具裝卸的前後引起位置偏離的問題 。但是，藉由將探針前端部的清潔機構組入基板檢查裝置， 探針前端部的清潔時的檢查夾具的裝卸本身成爲不需要，就 可消解在裝卸的前後發生的位置偏離的問題。 -35- 201009352 [替代例等] 以上，雖說明了具備本發明的清潔機構的基板檢查裝置 的較佳實施態樣，但是本發明並非被拘束於該實施態樣，本 行業者容易進行的追加、削除、改變等，也被包含於本發明 ，且，本發明的技術的範圍，是藉由添付的申請專利範圍的 記載來決定。 【圖式簡單說明】 ® [第1圖]顯示本發明的一實施例的具備旋轉台裝置的基 板檢查裝置的槪略的結構的前視圖。 [第2圖]將第1圖所示的旋轉台裝置從上方所見的擴大 平面圖。 [第3圖A]擴大第2圖所示的旋轉台的清潔機構的電刷 部分的一部分的槪略圖。 [第3圖B]說明第2圖所示的旋轉台的清潔機構是隨著 圓形載置台的旋轉而通過檢查部的狀態用的簡略化的槪念圖 〇 [第4圖A]第3圖B所示的清潔機構的立體圖。 [第4圖B]第3圖B所示的清潔機構的側面圖。 [第4圖C]顯示將第3圖B所示的清潔機構安裝於環形 狀部的構成的立體圖。 [第4圖D]顯示將安裝了其他的實施例的清潔機構的環 形狀部，安裝於圓形載置台的開口部的某部分的背面側的狀 態的立體圖。 -36- 201009352 [第5圖]其他的實施例的清潔機構的立體圖。 [第6圖]顯示本發明的其他的實施例的穿梭型基板檢查 裝置的結構的槪略的平面圖。 [第7圖]將第1圖的旋轉台裝置的其他的實施例的旋轉 台裝置從上方所見的擴大平面圖。 [第8圖]具有其他的實施例的探針前端部清淨化零件的 第7圖的旋轉台裝置的一部分的擴大平面圖。 [第9圖]第9圖（A)及第9圖（B)，是說明檢查夾 具及探針前端部清淨化零件的功能用的簡略化的前視圖。 [第10圖]說明本發明的其他的實施例的穿梭型的基板 檢查裝置所使用的基板保持部分用的平面圖。 【主要元件符號說明】 10 :基板檢查裝置 11 :控制裝置 1 2 :操作盤 1 4 :控制部 1 6 :畫像處理部 1 8 :測試器控制器 20 :掃描器 22 :旋轉台裝置 22-1 :矩形載置台 22s :旋轉驅動軸 22t :圓形載置台 26d :下側夾具驅動部 -37- 201009352 26u :上側夾具驅動部 28 :檢查夾具 28d :下側檢查夾具 2 8u :上側檢査夾具 29 :校正照相機 29u，29d :下側照相機 30 :檢查部 32 :探針 32g :導引托板 32p :探針前端部 32s :探針軸部 38u :氣壓缸 40:被檢查基板保持部 40w :開口 42 :被檢查基板 44 :探針先端清淨化零件 44b :電刷 44C :探針前端部清淨化零件 44Cd :下側探針前端部清淨化零件 44Cu:上側探針前端部清淨化零件 44f :纖維部 44h :電刷固定構件 44R :探針前端部清淨化零件 44RC :探針前端部清淨化零件 44RCu，44RCd :下側探針前端部清淨化零件 201009352 44Rd :下側探針前端部清淨化零件 44Ru :上側探針前端部清淨化零件 4 4 S :電刷軸部 50 :清潔機構 52 :電刷部分 52a :纖維的束的部分 52b :植入的部分 53 :電刷部分 53a :纖維的束的部分 53b :植入的部分 54 :電刷保持部 54a :角度調整托板 56 :開口部 60 :清潔機構 62 :電刷部分 62a :纖維的束的部分 62b :植入的部分 64 :電刷保持部 64a :調整螺絲 65 :固定部 70 :穿梭型基板檢查裝置 70C :共通搬運路 70L :搬運路 70R :搬運路 72 :被檢查基板 -39- 201009352 72L :被檢查基板 74L :左側托盤 74R :右側托盤 80 :環形狀部 80a :開口部 90 :清潔機構 92 :電刷部分 92a :纖維的束的部分 92b :植入的部分 94 :電刷保持部 95 :托盤 150:穿梭型基板檢查裝置 220 :旋轉台裝置201009352 VI. Description of the Invention: [Technical Field] The present invention relates to a substrate inspection apparatus for measuring electrical characteristics of a wiring by inspecting a wiring (or a conductor pattern) of a substrate to be inspected with a probe. In detail, there is a substrate inspection apparatus for a cleaning mechanism of a probe distal end portion that can clean the distal end portion of the probe so as not to affect the measurement of electrical characteristics. e [Prior Art] The substrate inspection device measures the electrical characteristics (e.g., resistance 値) of the wiring by an inspection jig that is close to a plurality of inspection points for implanting a plurality of probes into the wiring of the substrate to be inspected. The term "substrate to be inspected" used in the present document includes a package substrate on which a semiconductor package is formed, a film carrier, a printed circuit board, a flexible substrate, a multilayer wiring board, an electrode plate for a liquid crystal display, and a plasma display. A plurality of wirings are all substrates that are in contact with the probe for electrical characteristics measurement during substrate inspection. The inspection point on the wiring is formed by a relatively soft metal such as solder, solder ball, solder paste, etc., and when a plurality of substrates are continuously inspected, the probe at the tip end is pressed. In the case of a softer metal, the solder residue or the like may adhere to the probe. When the solder residue or the like is attached to the probe, the electrical characteristics of the wiring may not be accurately measured. Therefore, after inspecting a plurality of substrates, it is necessary to remove the solder residue or the like at the tip end portion of the probe. Therefore, as is conventionally, the inspection jig is removed from the substrate inspection device, and under the microscope, the front end of the probe is cleaned by using a glass fiber brush by a hand operation, so that the cleaning operation is 'pay attention to the probe. The front end portion is not bent in such a way that the glass fiber brush contacts the probe. Specifically, the cleaning of the tip end portion of the probe is performed by removing the inspection jig from the substrate inspection device, and removing the residue of the solder from the tip end portion of the probe by hand using a glass fiber brush under a microscope. This cleaning operation uses a glass fiber brush to make multiple contact with the probe in such a manner that the tip end portion of the probe does not bend. Next, in order to remove the solder residue or the like from the tip end of the probe, the peripheral portion is cleaned by a nylon brush. This cleaning operation is returned 5 to 10 times. In this case, use a vacuum cleaner to remove solder residue, dust, and the like. As a substrate inspection apparatus having a cleaning means, the following patent documents are available. [PRIOR ART DOCUMENT] [Patent Document 1] JP-A-2006-339472 "Cleaning device and cleaning method for probe protection stylus" (publication date: December 14, 2006).专利 Patent Document 1 discloses a configuration in which a semiconductor wafer and a cleaning device for electrical inspection of respective elements are disposed at different positions on a stage. In this configuration, at the time of cleaning, the probe card for inspection on the semiconductor wafer is moved toward the position of the cleaning device, and the cleaning brush is brought into contact with the stylus of the probe card from the lateral direction and the lower side to perform cleaning. [Patent Document 2] Japanese Laid-Open Patent Publication No. 2006-1 53673 (Publication Date: June 15, 2006). Patent Document 2 discloses a configuration in which a semi-conductive -6 - 201009352 body package is transported to a contact probe of a test device to be in contact with it for testing of a semiconductor package. In this configuration, instead of the semiconductor package, the contact probe can be cleaned by absorbing the cleaning member on the contact probe. The cleaning member is a bonding member. [Description of the Invention] (The problem to be solved by the present invention) The conventional cleaning operation requires a lot of time because it is a hand (manual) operation. As described above, in the case where a plurality of substrates are inspected, since the cleaning operation causes the substrate inspection to be interrupted, the total inspection time until the end of all the substrate inspections becomes relatively long. In addition, there are problems such as the degree of cleaning of the tip end portion of the probe due to hand work, problems associated with the attachment and detachment of the inspection jig, etc. Even in the substrate inspection device disclosed in Patent Documents 1 and 2, it is necessary to inspect the substrate during cleaning. The process of the process stops. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate inspection apparatus having a cleaning mechanism® for cleaning a probe tip end portion without interrupting a flow of substrate inspection for continuously inspecting a plurality of substrates. The device has a cleaning mechanism, and the front end portion of the probe can be cleaned without requiring a separate driving mechanism for the substrate inspection and time. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate inspecting apparatus having a brush that can be disposed in such a manner as to clean the front end portion of the probe which is continuously performed without any interruption. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate inspecting apparatus having a brush which does not need to be cleaned during the substrate inspection which is continuously performed in 201009352. SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate inspecting apparatus having a brush having a characteristic that a cleaning effect can be exhibited for a long period of time. Further, an object of the present invention is to provide a substrate inspection apparatus having a cleaning mechanism, and the degree of achievement of cleaning of the front end portion of the probe is not uniform (a means for solving the problem). In view of the above object, the substrate inspection apparatus of the present invention Further, the present invention is characterized in that: a transport path from the carry-in portion to the carry-out portion, and an inspected substrate holding portion provided at a predetermined interval on the transport path, and the substrate holding portion to be inspected The moving means for moving the transport path; and the inspection unit is an inspection unit that sequentially inspects the substrate to be inspected held by the inspection substrate holding portion of the transport means in the middle of the transport path, and includes an inspection jig Measuring the electrical characteristics of the wiring by contacting the plurality of probes provided on the inspection jig with the inspection points of the wiring on the substrate to be inspected; and cleaning means are provided at predetermined intervals on the conveyance path. Any means of cleaning between the adjacent inspected substrate holding portions, by the aforementioned movement of the aforementioned transport means Means is moved, said plurality of cleaning performed prior to the probe through the inspection unit. In the substrate inspection device, the distance between the two inspected substrate holding portions adjacent to the cleaning means provided between the adjacent adjacent inspection substrate holding portions is higher than the above-described arbitrary phase The distance between the adjacent inspected substrate holding portions may be smaller. In the substrate inspection apparatus, the cleaning means is provided with a brush, and the electric -8-201009352 brush has a flow of fibers along a moving direction that is moved by the moving means, and is inclined obliquely in a direction opposite to the moving direction. Keep it OK. In the substrate inspecting apparatus, the brush may be inclined and held at an arbitrary angle of about 30 to 50 degrees with respect to a horizontal plane. In the substrate inspection device, the brush may be made of glass fiber. In the substrate inspection apparatus, the conveying means includes a rotary table device having a circular mounting table and a rotary driving means for rotationally driving the circular mounting table, wherein the inspected substrate holding portion is separated by a predetermined interval Provided at a position along a circumference of the circular mounting table, wherein the cleaning means is at least one of two adjacent ones of the inspection substrate holding portions provided on the circular mounting table. It is also possible to check between the substrate holding portions to be inspected. In the substrate inspection apparatus, the conveyance means includes two conveyance paths, and the inspection target substrate holding portion disposed in each of the two conveyance paths, and the substrate to be inspected is moved along each conveyance path. In the moving means, the path of a part of the two transport paths is common, and the inspection unit is disposed at an arbitrary position on the common path of the path, and at least one of the two transport paths is provided. In the cleaning means, the inspection unit on the common path is passed through the predetermined time interval between the two inspected substrate holding portions, and the cleaning means passes through the common between the intervals. The aforementioned path is also possible. In the substrate inspection apparatus, the cleaning means moves from a position away from the distal end portion of the probe to the other end of the inspection jig, and moves cleanly while being in contact with the distal end portion of the probe until it is away from the distal end portion of the probe. After the position is stopped, the probe tip end portion is cleaned in the opposite direction 201009352 until the original position, and the reciprocating movement may be repeated. In the substrate inspection apparatus, the conveyance means is formed by a rotary table having a rotary drive shaft and a circular mount, and is provided between a plurality of inspection substrates held in a circumferential shape on the circular mount. In the cleaning means, the cleaning means may be moved toward the inspection unit by the same conveyance path as the substrate to be inspected by the rotation of the rotary drive shaft. Further, in the substrate inspection apparatus of the present invention, the method of cleaning the plurality of probes is characterized in that the electrical characteristics of the wiring are measured by bringing the plurality of probes provided on the inspection jig into contact with the inspection points of the wiring on the substrate to be inspected. The inspection unit sequentially transports the plurality of substrates to be inspected at a predetermined time point, and simultaneously cleans the plurality of probes by the inspection unit at a different time point from the predetermined time point. . [Effects of the Invention] According to the present invention, the tip end portion of the probe can be cleaned without interrupting the flow of the substrate inspection for continuously checking the plurality of substrates. According to the present invention, it is not necessary to separately perform the driving mechanism for the substrate inspection and the cleaning of the probe tip end portion. According to the present invention, it is possible to provide a brush which can be configured to clean the tip end portion of the probe without interrupting the flow of the substrate inspection for continuously checking the plurality of substrates. According to the present invention, it is possible to provide a brush which does not require cleaning during substrate inspection in which a plurality of substrates are continuously inspected. Further, according to the present invention, it is possible to provide a brush having a characteristic that the cleaning effect can be exhibited for a long period of time. 201009352 Further, according to the present invention, the degree of achievement of cleaning at the front end portion of the probe does not vary. Further, since the probe tip end cleaning and cleaning component is placed on the conveyance path, the tip end portion of the probe is cleaned by the conveyance direction in which the component is moved, so that the probe can be cleaned efficiently. [Embodiment] Hereinafter, an embodiment of a substrate inspection apparatus having a cleaning mechanism of a probe tip end portion of the present invention will be described in detail with reference to an added drawing. In each of the additional drawings, for the sake of easy understanding, the thickness, the length, the shape, and the interval between the members of each member are noted, and attention is paid to exaggeration, enlargement, reduction, deformation, simplification, and the like. In the drawings, the same reference numerals will be given to the same elements, and overlapping description will be omitted. [Substrate Inspection Apparatus of Cleaning Mechanism Having Probe Front End Section] First, the entire substrate inspection apparatus will be briefly described. Fig. 1 is a front elevational view showing a schematic configuration of a substrate inspecting apparatus 10 according to an embodiment of the present invention. The substrate inspection apparatus 10 is provided with a rotary table device 22 (also referred to as an "index stage") for holding the substrate to be inspected. The turntable 22 is provided with a circular mount (or mounting tray) 22t and a rotary drive shaft 22s, and rotates in a direction indicated by, for example, an arrow. As will be described later with reference to Fig. 2, in the rotary table device 22 shown in the center of Fig. 1, a plurality of inspected substrates 42 are held. Further, the substrate inspection apparatus 1A' includes an upper inspection jig 28u, a lower inspection jig 28d, a control device 11 and a correction camera 29. The correction camera 29 is provided with upper and lower sides -11 - 201009352 cameras 29u, 29d, and the inspected substrate 42 is a predetermined position for confirming whether or not it is held by the rotary table device 22. The information from the correction camera 29 is processed by the image processing unit 16 and sent to the control unit 14. Further, in Fig. 2, although the oblique line is added to the substrate to be inspected, it is not a cross-section, but is merely for distinguishing it from other elements. In the upper inspection jig 28u and the lower inspection jig 28d of the inspection jig 28, a plurality of probes 32 are also mounted. The upper inspection jig 28u and the lower inspection jig 28d are raised and lowered by the upper jig drive unit 26u and the lower jig drive unit 26d, respectively. The control device 11 includes an operation panel 12, a control unit 14, an image processing unit 16, a tester controller 18, and a scanner 20. The control unit 14 is composed of a CPU, a ROM, a RAM, and the like (not shown), and a substrate inspection program is stored in the ROM. At the time of substrate inspection, the substrate inspection program is read from the ROM to the RAM in accordance with an instruction from the operation panel 12. When the tester controller 18 acquires the inspection start command from the control unit 14, the scanner 20 controls and executes the inspection of the substrate to be inspected. The scanner 20 has a power supply for flowing a current to a wiring of the substrate to be inspected, a switch group for switching a signal line connected to the power source and each probe 32, and a discrimination wiring. The discriminating part of the good or bad. In the inspection of the wiring, the upper jig drive unit 26u and the lower jig drive unit 26d are driven, and the upper inspection jig 28u and the lower inspection jig 28d are lowered and raised, respectively, whereby the apex of the plurality of probes is simultaneously Check the predetermined checkpoint contact on the wiring of the substrate. Next, the tester controller 18 connects the wiring of the substrate to be inspected to the power source in accordance with the switching program of the switch group -12-201009352 which is set in advance, and measures the resistance 各 of each wiring, and the measuring unit measures the resistance from the wiring.値 Determine whether the wiring is good or not. The result of the discrimination is sent from the tester controller 18 to the control unit 14 one by one, and at the end of the inspection, the control unit 14 outputs the final inspection result of the substrate to be inspected. [Summary of the rotary table device of the embodiment] Fig. 2 is a plan view showing the rotary table device 22 of the embodiment of the rotary table device 22 of Fig. 1 as seen from above. The rotary table device 22 is a transporting means, and includes a circular mounting table 22t and a rotary drive shaft 22s for moving means. When the substrate is inspected, the circular mounting table 22t is rotated clockwise by the rotary drive shaft 22s as indicated by an arrow. For convenience of explanation, in the second drawing, along the circumference of the circular mounting table 22t, the clockwise corresponding dial has a position of 7:30 as P1, and a position shifted by 45 degrees from the clockwise angle. That is, the positions of 9:00, 10:30, 12:1, 1:30, 3, 4:30, and 6:00 are P2, W P3, P4, P5, P6, and P8, respectively. For example, the position at 12 o'clock is P4, and the position at 6 o'clock is P8. On the circular mounting table 22t, eight inspected substrate holding portions (also referred to as workpiece holders) 40 are provided at equal intervals along the circumference, and one inspected substrate 42 is placed one by one. In Fig. 2, each of the inspected substrate holding portions 40 is located at a position corresponding to P1 to P8. In the position of P4, the inspection unit 30 of the inspection substrate 42 is provided, and the inspected substrate 42 to be placed is sequentially carried into the inspection unit 30 in accordance with the rotation of the circular mount 22t. In the inspection unit 30, an upper inspection jig 28u and a lower inspection clamp-13-201009352 having an inspection jig 28 are disposed 28d. When the circular mounting table 22t is driven to rotate by the rotary drive shaft 22s, a circular conveyance path for transporting the inspection target substrate 42 on the plurality of inspection substrate holding portions to the inspection portion 30 is formed. As shown in the inspected substrate holding portion 40 of P8, an opening 40w is formed in the substrate holding portion 40 to be inspected. Therefore, when the inspection substrate 42 is placed on the inspection substrate holding portion 40, the conductor pattern of the back surface of the inspection substrate 42 is exposed from the opening 40w, and the probe of the lower inspection jig 28d (Fig. 1) is attached thereto. 32 can contact the inspection unit 30 of P4. At the time of substrate inspection, pi is an entrance for the substrate to be inspected, and the inspected ® substrate 42 is sequentially placed on the substrate to be inspected 40 to be in this position. The circular mounting table 22t is rotated by 45 degrees each time, and the substrate 42 to be inspected held by the substrate holding portion 40 to be inspected in accordance with the rotation is sequentially moved to positions P2 and P3. The inspected substrate 42 is at the position of P4, and the inspection unit 30 measures the electrical characteristics. When the measurement is completed, the circular stage 22t is rotated, and the substrate 42 to be inspected is transported to the position of the next P5. When the inspected substrate 42 is sequentially transported and reaches P7, the inspected substrate 42 is removed from the inspected substrate holding portion 40. Regarding the continuous flow, the positions P1 to P3 are referred to as an upper portion, and the positions P5 to P7 are referred to as a downstream portion. In the position of the P4, the inspection jig 28u is approached from the upper side of the surface of the paper surface of Fig. 2, and further, the inspection jig 28d is a probe approaching from the lower side of the back surface, and the inspection jigs 28u and 28d are probed. Each of them is in contact with a check point of a wiring formed on each surface of the front and back of the substrate 42 to be inspected. Thereby, the measurement of the electrical characteristics of each wiring of the substrate 42 to be inspected is performed. When it is finished, the upper inspection jig 28u and the upper inspection jig 28u are the substrate to be inspected 42 which are measured away from the surface side and the back side of the inspection substrate 42 by the -14-201009352, and are mounted on the circular mounting table 22t. Rotation, as described above, is carried at the position of the next P5. In this manner, the circular mounting table 22t is rotated back and stopped by 45 degrees at a predetermined time point. In the inspection unit of P4, the inspection target substrate 42 is carried in at the predetermined time point to carry out the inspection, and when it is finished, the inspection target substrate 42 is transported to the next position by the predetermined time point. In addition, as shown in FIG. 2, the position C1 on the circular mounting table 22t between the inspected substrate holding portions 40 at the positions of the inspected substrate holding portions 40 and P3 at the position of P2 is provided with cleaning. Agency 50. Further, another cleaning mechanism 50 is provided at a position C2 on the circular mounting table 22t between the inspected substrate holding portions 40 at the positions of the inspected substrate holding portions 40 and P7 in the position of P6. Those cleaning mechanisms 50 are of the same construction. As described above, the position of C1 is between the inspected substrate holding portion 40 of P2 and the substrate holding portion 40 to be inspected by P3, but it is not necessary to change the interval between the holding portions. In other words, the distance from the position P2 of the C1 to the inspected substrate holding portion 40 of the inspection substrate holding portion 40 or P3 is higher than the inspection substrate holding portion 40 from the inspected substrate holding portion 40 of P2 to P3. The distance is smaller. Similarly, the cleaning mechanism 50 at the position C2 between the inspected substrate holding portion 40 of P6 and the inspected substrate holding portion 40 of P7 does not affect the size of those intervals. Therefore, even if the cleaning mechanism 50 is provided at the positions of C1 and C2, the time at which the inspected substrate 42 is carried into the inspection unit 30 does not change. Those cleaning mechanisms 50 are moved together with the rotation of the circular stage 22t. Further, in the second drawing, the cleaning mechanism -15-201009352 50' is provided at the positions C1 and C2, but the cleaning mechanism 50 can be provided between any adjacent two inspected substrate holding portions 40. . Further, the number of the cleaning mechanisms 50 is at least one, but the degree of necessity for achieving the cleaning effect may be any number. The cleaning mechanism 50 includes a brush portion 52 and a holding portion 54 that holds the brush portion. Fine fibers such as glass fiber fibers are implanted in the brush portion 52. In the brush of the brush portion 52, it is preferable to make the brush elastic by using fibers having a relatively large diameter. Further, by forming the tip end portion of each fiber to be thin, it is also possible to make the tip end portion of the plurality of probes 32 between them at the time of cleaning. Further, when cleaning, each fiber may enter between adjacent probes 32. Further, the brush portion 52 of the cleaning mechanism 50 is held in such a manner as to be inclined (rearwardly inclined) in a direction opposite to the progress direction. Further, the flow direction of the fibers implanted in the brush portion 52 is the direction in which the flow from the moving position of the cleaning mechanism 50 is backward. In other words, the flow direction of the fibers is the direction from the position of P3 toward the position of P2 and the direction from P7 toward P6. Fig. 3A is an enlarged view of a portion of the brush portion 52. Each fiber is, for example, made of nylon or PBT (polybutylene terephthalate) having a diameter of 52 φ of about 0. 1 mm, as shown in the figure, the tip end of each fiber is formed into a tapered shape. Also, the length of the fibers of the brush portion 52 is from about 20 to 30 mm, and the thickness of the brush portion 52 is from about 2 to 4 mm. In Fig. 3B, the cleaning mechanism 50 in C1 or C2 is a simplified front view for passing through the inspection unit 30 in accordance with the rotation of the circular mounting table 22t. Here, the cleaning mechanism 50' is such that the left end of the drawing and the circular mounting table 22t move toward the right side. In the inspection unit 30, only the upper inspection jig 28u is shown in 201009352. The lower inspection jig 28d also has the same function. The upper inspection jig 28u has a plurality of probes 32, and each probe includes a probe shaft portion 32s and a probe distal end portion 32p. The rear end portion of the probe shaft portion 32s is electrically connected to the scanner 20. The upper inspection jig 28u is placed at the standby position in order to inspect the next inspected substrate. As shown in Fig. 3B, the brush portion 52 of the cleaning mechanism 50 is held by the brush holding portion 54 so as to incline the surface of the circular mounting table 22t by an angle of about 45 degrees. Although the brush holding portion 54 is shown in a simplified manner, it is fixed to the circular mounting table 22t so that the inclination angle of the brush portion 52 can be adjusted. The inclination angle is preferably an angle between about 30 degrees and 50 degrees from the surface of the circular mounting table 22t. Further, as shown in FIG. 3B, the fiber 'in the brush portion 52 of the cleaning mechanism 50 is straight in front of the inspection portion 30, but when passing through the inspection portion 30, it is a probe along the upper inspection jig 28u. The guide pallet 3 2g of the front end portion 32p is curved. At this time, the residue of the solder adhered to the probe distal end portion 32p and the fragment of the oxide film by the tip end portion of the fiber portion of the brush portion 52 are swept away. ® passes through the inspection portion 30, and the fibers of the brush portion 52 of the cleaning mechanism 50 are restored by the elasticity. When the inspection substrate 42 is carried into the inspection unit 30 or the rotation of the circular mounting table 2 2t when the inspection substrate 42 is carried out from the inspection unit 30, the cleaning mechanism 50 provided at ci and C2 is completed. The probe tip end portion 32p of the inspection portion 30 can be cleaned. Therefore, there is no need to additionally clean the process', and it is not necessary to interrupt the inspection work for cleaning. In order to collect the residue of the solder swept from the probe tip end portion 32p and the fragment of the oxide film during cleaning, the inlet of the cleaner is set to the Cl and C2 on the circular -17-201009352 mounting table 22t as needed. The vicinity of the inspection unit 30 may be similar to the structure of the cleaning mechanism. FIGS. 4A to 4D are diagrams for explaining a detailed structure of an embodiment of the cleaning mechanism 50. Fig. 4A is a perspective view of the cleaning mechanism 50, and Fig. 4B is a side view of the cleaning mechanism 50. As shown in those figures, in this embodiment, the cleaning mechanism 50 is provided with two brush portions 52 and a brush holding portion 54. In Fig. 4B, the brush portion 52 shown above is the cleaning person for the tip end portion 32p of the probe for the upper inspection jig 28u, and the brush portion 52 shown below is for the inspection of the lower inspection jig 28d. The cleaning user of the front end portion 32p of the needle 32. However, in Fig. 4A, the brush portion 52 shown at the bottom of Fig. 4B is omitted for simplification. Each of the brush portions 52 is a portion 52a of a bundle of fibers such as fiberglass and a portion 52b into which the bundle 52a of the fiber is implanted. The brush holding portion 54 is a two portion 52b that holds the portion 52a of the bundle of fibers. For example, in the manner shown, each portion 52b is fixed by three screws. Different from the embodiment of Fig. 3A, the fibers of the brush portion 52 may be used with a diameter of about 50 to 80/zm. The distance between adjacent probes 32 is, for example, 40 #m. If fibers having a diameter smaller than 40//m are used, the fibers can enter between such probes, but depending on the situation, they are also elastic. Not enough. Further, as shown in Fig. 4B, in the brush holding portion 54, the angle adjusting plate 51a is attached by screws. The screw can be loosened to change the fixed position of the 201009352 board. By changing the fixed position, the length of the projection of the end portion of the pallet is changed, whereby the position at which the portion 52a of the bundle of fibers of fiberglass or the like is pressed is changed, whereby the fiber of the fiberglass or the like can be changed. The angle of inclination of the portion 52a of the bundle. Fig. 4C is a perspective view showing a state in which the cleaning mechanism 50 is attached to the ring-shaped portion 80. By straddle the opening 80a of the ring-shaped portion 80, the two portions of the brush holding portion 54 of the cleaning mechanism 50 are screwed. Thereby, the brush portion 52 shown on the lower side of Fig. 4B can be protruded from the opening portion in the oblique direction downward. In this case, the width of the brush portion 52 on the lower side may be narrower than the width of the brush portion 52 on the upper side shown in Fig. 4C. When the ring-shaped portion 80 is fixed to a surface (upper surface) on the front side of the opening of the circular mounting table 22t, and a brush portion of the same size is used, a wide opening is used. The ring-shaped portion 80 of the portion 80a may be used. The width of the brush is the length of the row of the probes of the upper and lower inspection jigs 28u, 28d. For example, in Fig. 3B, the length of the column juxtaposed from the front side of the paper surface to the back side must be larger. This is because it is possible to sweep the residue of the solder and the fragments of the oxide film for all the probes by passing the tip of the probe once by the brush. However, for example, the cleaning mechanism is plurally arranged, and the brush portion is divided by the path of the probe without repeating according to the number of the cleaning mechanism, so that each clean brush portion separately shares the probes in the divided paths. Needle cleaning is also possible. Fig. 4D is a perspective view showing a state in which the ring-shaped portion 80 shown in Fig. 4C is fixed to the back surface of a certain portion of the opening portion 56 of the circular mounting table 22t. As shown in the figure, the brush portion -19-201009352 53 having a narrower width than the brush portion 52 is attached to the ring-shaped portion 80. The brush portion 53 is a portion 53a of a bundle of fibers such as fiberglass and a portion 53b for implanting a bundle 53a of fibers. Thus, the brush portion 53 does not protrude from the surface of the circular mounting table 22t, and may protrude from the back surface via the opening portion 56. In this case, for the lower inspection jig 28d, a wide brush portion having a width may be protruded. Fig. 5 is a perspective view of a cleaning mechanism 60 of another embodiment of the present invention. The cleaning mechanism 60 is provided with a holding portion 64 that holds the brush portion 62 and the brush portion 62. The brush portion 62 is a portion 62a having a bundle of fine fibers such as glass fiber fibers, and a portion 62 into which the bundle of fibers is implanted. It is also possible to use the fiber shown in Fig. 3A. The brush holding portion 64 is a portion 62b that holds the portion 62a of the bundle of fibers. Further, the brush holding portion 64 is attached to the fixing portion 65 by the adjusting screw 64a. The inclination of the brush portion 62 can be adjusted by loosening the adjustment screw to change the angle at which the brush holding portion 64 is held. The fixing portion 65 is a surface fixed to the circular mounting table 22t. [Summary of the shuttle type substrate inspection device] Fig. 6 is a simplified plan view of the shuttle type substrate inspection device 70. The shuttle type substrate inspection device 70 is provided with a cleaning mechanism 90. The turntable device 22 shown in FIG. 2 is a transport path that moves a plurality of inspected substrate holding portions 40 along a circular path. However, the shuttle type substrate inspecting device shown in FIG. 6 has 2 The two transport lanes of the transport lanes 70L and 70R, and the transport lanes of these are the common transport lanes 70C. The substrate holding portion (tray) 74L to be inspected moves along the slightly rectangular conveying path 70L and the common -20-201009352 conveying path 70C, and the inspected substrate holding portion (tray) 74R is slightly rectangular. The conveyance path 70R and the common conveyance path 70C move. The inspection unit 30 is provided in the common conveyance path 70C. The inspection unit 30 may include one inspection jig, and may include an inspection jig in the vertical direction as in the embodiment of Fig. 2, thereby simultaneously measuring the conductor pattern formed on both sides of the substrate to be inspected. It can also be done. For convenience of explanation, in Fig. 6, the position of some of the conveyance path 70L is displayed along the path indicated by the arrow from the lower left position to the left periphery. [1,? 2,? 3,? 4 and? 1^5. Further, some of the positions of the conveyance path 7011 are shown as PR1, P2, P3, P4, and PR5 along the path indicated by the arrow from the lower right position to the right periphery. In this case, the tray 74L is at the position of PL1, the tray 74R is at the position of PR1, the cleaning mechanism 70 is at the position of P3, and the inspection portion 30 is at the position of P4. The driving of each tray is performed, for example, by a pneumatic cylinder provided in each passage. Further, in the case where the opening 40 w is formed in the substrate holding portion 40 to be inspected in the turntable device 22 shown in Fig. 2, the opening is formed in each tray, and the lower side inspection jig can be inspected from the lower side. Substrate 72. The PL1 is a loading unit and a carrying-out unit of the substrate to be inspected in the transport path 70L, and PR1 is a loading unit and a carrying-out unit of the board to be inspected in the transport path 70R. For example, in the conveyance path 70L, when the tray 74L is located at PL1, the inspection substrate 72L is placed on the tray. Thereafter, the tray moves along the conveyance path 70L, and moves toward the inspection portion 30 located in P4 through P2 and P3 of the common conveyance path 70C. In the inspection unit, electrical characteristics of the substrate 72 to be inspected are measured by an inspection jig having a plurality of probes. When the measurement is completed, the tray 74L moves from P4 and passes through PL5, and reaches the carry-out unit and the PL 1 of the -21 - 201009352 part. Here, the inspected substrate 72 to be inspected is taken out from the tray 74L and the next inspected substrate 72 is placed. The tray 74L is the PL1 in the carry-out portion and the carry-in portion, and is stopped by the inspection of the inspected substrate to be placed, and the next new inspected substrate is placed, and is stopped at PL1. On the other hand, the tray 74R in which the new inspected substrate 72 is placed is moved from the PR1 along the conveyance path 70R and moved to the inspection unit 30 through the P2 and P3 of the common conveyance path 70C, and the substrate to be inspected is received there. Check. In this way, since the substrate to be inspected in each of the transport paths is subjected to the cross-check, it is possible to remove the excess time for taking out and mounting the substrate to be inspected. As a result, the total time of inspection of the plurality of substrates to be inspected can be shortened. The cleaning mechanism 90 is provided with a brush portion 92 and a holding portion 94 for holding the brush portion 92. The brush portion 92 is a portion 92a having a bundle of fine fibers such as glass fiber fibers, and a portion 92b for implanting a bundle of the fibers. Each fiber is the same as the embodiment of Fig. 3A, and is made of, for example, nylon, and its diameter 52φ is about 0. 1 mm, as shown in the figure, the tip end of each fiber may be formed into a tapered shape. Further, the length of the fibers of the brush portion 52 is about 20 to 30 mm, and the thickness of the brush portion 52 is about 2 to 4 mm. The brush holding portion 94 is a portion 92b that holds the portion 92a of the bundle of fibers. Further, the brush holding portion 94 is attached to the tray 95 by, for example, an adjusting screw (not shown), and the mounting angle of the brush portion 92 can be adjusted. In Fig. 6, the brush portion 92 is inclined in a direction opposite to the progress direction of the tray 95. The angle of inclination is about 45 degrees from the face of the tray 95. However, it is also possible to set an arbitrary angle between 30 degrees and 50 degrees. The tray 95 of the cleaning mechanism 90 may be provided to move the conveyance path 70R and the common conveyance path 70C, for example. In this case, the tray 95 is 201009352, and the conveyance path 70R moves in synchronization with the movement of the tray 74R while being kept at a constant interval from the tray 74R. Further, in the common conveyance path 70C, when the trays 74L and 74L are not passed, the tray 95 is passed through the common conveyance path 70C, and the movement of those trays is not impaired. Therefore, the movement of the tray 95 does not affect the inspection time point of the substrate to be inspected placed on the trays 74L, 74L. When the inspection probe is cleaned, the tray 95 is the inspection unit 30 that enters P4 through the common conveyance path 70C. In the position of P4, the brush portion 92 of the cleaning mechanism 90® is passed through the probe while sweeping the tip end portion of the probe of the inspection jig as shown in Fig. 3. From it, move toward PR5. In this embodiment, the brush portion 92 is provided with the inlet of the cleaner at the position of P4 passing through the row of the probe while sweeping the tip end portion of the probe of the inspection jig, and the fallen solder dust, other dust, and the like are provided. Capture is also possible. Further, in order to increase the frequency of cleaning the probe of the inspection unit 30, another cleaning mechanism is disposed in the conveyance path 70L, and the other cleaning mechanism is moved during the next period in which the trays 74L and 74L do not pass. It is also possible to clean the probe by moving the cleaning mechanism 90 interactively through the inspection portion 30. Next, the cleaning mechanism 50 or 90 is used to explain the point of attention when the probe 32 of the inspection jig is cleaned. In general, since the probe 32 is vertically extended as shown in Fig. 3B, the brush portion is in a state of being inclined to be inclined opposite to the progress direction. In this state, if the brush portion is in contact with the tip end of the probe, the fiber of the brush portion can be made to impact the probe because it can gradually contact the probe. -23- 201009352 And 'as a cleaning brush, the brush part is a brush made of softer material (for example, PBT: polybutylene terephthalate brush)' It is also possible to replace the cleaning, and the brush portion is a brush made of a relatively hard material (for example, a glass fiber brush), and the front end portion of the probe is preferably cleaned. As described above, in the embodiment in which the tip end portion of the probe is cleaned by using the inclined brush, foreign matter adhering to the tip end of the adjacent probes and causing the probes to be in poor conduction (short-circuit) state can be removed (for example, solder). The conductive substance) can be correctly inspected. In particular, this embodiment is a four-terminal ® measuring method in which the separation distances of the measuring probes are shortened, and it can be effectively utilized for removing foreign matter between the measuring probes of the inspection jig. [Summary of the rotary table device of another embodiment] Fig. 7 is a plan view showing the rotary table device 220 of another embodiment different from Fig. 2 from above. The same elements as those of the rotary table device 22 of Fig. 2 are symbols in which the same phase is added, and the description thereof is omitted. In the position C1 on the circular mounting table 22t between the inspected substrate holding portions 40 at the positions of the @ inspection substrate holding portions 40 and P3, which are different from the rotary table device 22 of Fig. 2 Instead of the cleaning mechanism 50, the upper probe tip end cleaning portion 44Ru may be disposed along the radial direction. Therefore, the probe tip end cleaning and cleaning part 44Ru is integrated with the turntable 22 device and moves on the same path as the conveyance path on which the inspected substrate 42 is conveyed. Further, this setting position is arbitrary 'not limited to between positions p2 and P3. Usually, the inspection jig 28 in the inspection unit 30 is lifted at a position that is not in contact with the front end cleaning unit 44Ru of the upper probe-24-201009352, and is held at the position "in the radial direction" (that is, The circumferential direction is longer than the radial direction, and the probe area of the inspection jig 28u can be covered.) When the upper probe front end cleaning portion 44Ru comes to the position P4, the upper inspection jig 28u is lowered until the probe front end portion 32p. (Refer to the reference numeral 9p of the figure) The position of the fiber tip of the distal end portion of the probe cleaning portion 44Ru is slightly contacted (refer to Fig. 9). At this stage, the cleaning operation of the probe tip end portion of the upper inspection jig 28u is performed. The probe tip end cleaning and cleaning part 44Ru is a brush which is generally embedded in the fiber as shown in Fig. 9 V. Although not shown in the drawing, the lower probe tip end cleaning portion 44Rd is also provided on the back surface of the mounting table 22t. Similarly, the lower inspection jig 2 8d' is raised until the tip end portion of the probe slightly contacts the position of the fiber tip of the lower probe tip end cleaning member 44Rd, and the cleaning operation is performed. The cleaning operation is performed by a reciprocating rotational movement in a clockwise direction and a counterclockwise direction within a predetermined angle generated by the rotary table device 22. Thereby, the fibers of the brush are wiped off by the probe tip end portions of the upper inspection jig 28u and the lower inspection jig 28d, respectively. For the probe of the inspection jig 28, in order to define the direction in which the brush is wiped clean, the direction is defined as the X direction. In the cleaning operation of the probe tip end portion, the inlet of the cleaner is placed at an appropriate position in the vicinity of the position P4 in order to collect the fallen solder chips and other dust during the cleaning operation of the probe tip end portion. Further, at the position C2 between the positions P6 and P7 at which the table tray 22t is placed, the other upper probe tip end portion cleaning and cleaning member 44Cu is provided along the circumferential direction. Therefore, the probe distal end portion cleaning and cleaning unit 44Cu is moved to the same position as the conveyance path -25-201009352. Further, the installation position is not limited to the position between the positions P6 and P7, and may be arbitrary. The upper probe tip end cleaning portion 44Cu is a cleaning operation of the probe front end portion when the rotary table device 22 is rotated to the position P4. When the upper probe tip end cleaning portion 44Cu comes to the position P4, the upper inspection jig 28u is lowered until the tip end portion of the probe slightly contacts the fiber tip end of the upper probe tip cleaning portion 44Cu. Although not shown in the drawing, the lower probe tip end cleaning portion 44Cd is also provided on the back surface of the mounting table 22t. Similarly, the lower inspection jig 28d is lifted until the tip end portion of the probe slightly contacts the position of the fiber tip of the lower probe tip end cleaning portion 44Cd, and the tip end portion is cleaned. The cleaning operation is performed, for example, by the pneumatic cylinder 38u. The upper probe tip end cleaning portion 44Cu which is extended in the circumferential direction (that is, formed longer in the circumferential direction than the radial direction) is reciprocated by the pneumatic cylinder 38u in a predetermined length in the radial direction of the mounting table 22t. The way is driven. The pneumatic cylinder 3 8u is an actuator (actuating device) that drives the load (probe tip cleaning unit 44C) by air pressure, and various types are commercially available. For example, a rail (not shown) may be attached along the moving direction of the upper probe tip end cleaning portion 44Cu, and the upper probe tip cleaning portion 44Cu may be driven radially outward by the pneumatic cylinder. The stage in which the air is stopped is performed by a spring drive driving inward in the radial direction. Further, when the length of the upper probe tip end cleaning portion 44Cu in the circumferential direction is shorter than the length of the probe field that can cover the inspection jig 28u, the rotary table is rotated after the cleaning operation of the first probe tip end is completed. 22 The micro-rotation causes the upper probe tip end cleaning part 44Cu to move slightly toward the circumferential direction 201009352, and then performs the cleaning operation. The length "in the circumferential direction of the probe tip end cleaning portion 44C" is such that the cleaning operation can be performed in a fractional order by the rotation of the turntable 22 even if the probe area of the inspection jig 28u cannot be covered. By this cleaning operation, the fibers of the brush are wiped clean toward the γ direction by the distal end portions of the probes of the upper inspection jig 28u and the lower inspection jig 28d, respectively. This cleaning operation is not performed every one rotation of the rotary table device 22. For example, from a conventional experience, a predetermined number of (e.g., 100) substrates are inspected after the cleaning operation is performed. The data of the substrate inspection obtained by the substrate inspection apparatus 10 is a "test result" as will be described later. When the inspection threshold 値 is exceeded by a predetermined frequency, the cleaning operation is performed. [Other Probe Front End Cleaning Parts] Fig. 8 is a partially enlarged view showing the rotary table device 22 having other probe tip cleaning and cleaning parts. In Fig. 7, the probe tip end cleaning portion 44R is provided along the radius ® direction, and the probe tip end cleaning portion 44C is provided along the circumferential direction. In the probe tip end portion cleaning portion 44RC of Fig. 8, the probe tip end portion cleaning and purifying member has a shape that extends in the radial direction and the circumferential direction. The shape of the probe tip end cleaning and cleaning member 44RC is not limited to the cross shape shown in the drawing. The shape may be such that the brush extends in the radial direction and the circumferential direction, and for example, a T shape or an L shape may be used. The probe tip end portion cleaning unit 44RC is also integrated with the turntable 22, and the inspected substrate 42 is moved on the same path as the conveyed path. Also, this -27- 201009352 setting position can be any. When the probe tip end portion cleaning portion 44RC is moved to the position P4 of the turntable 22 described with reference to Fig. 7, the cleaning operation of the probe tip end portion 32p is performed. Similarly to the description of Fig. 7, the probe tip end portion cleaning and cleaning device 44RC is driven by the reciprocating rotation of the rotary table device 22 at a predetermined angle, and the Y-direction reciprocating movement is performed by, for example, air pressure. The cylinder 3 8u is driven by a reciprocating movement of a predetermined length. After the reciprocating movement of the Y direction, the rotary table is slightly rotated, and the cleaning in the Y direction may be performed by reciprocating movement in the Y direction. ® Of course, similarly to the probe tip cleaning and cleaning parts of Fig. 7, the upper and lower probe tip end cleaning parts 44RCu and 44RCd are provided on both the upper surface and the back surface of the turntable unit 22. By cleaning the part 44RC at the tip end portion of the probe, the probe tip end portion of the inspection jig can be cleaned in the X direction and the Y direction by the cleaning of the tip end portion of the probe. [Inspection jig and probe tip end cleaning and purifying parts] Figs. 9(A) and 9(B) are views showing details of the inspection jig 28 and the probe tip end cleaning and cleaning part 44. A plurality of probes 32 are mounted in the inspection jig 28. Each probe 32 is composed of a probe shaft portion 32s and a probe distal end portion 3 2p. A signal line connected to the scanner 20 of the substrate inspection device 10 is connected to the rear end of the probe 32, but is shown in the figure. Omitted. The probe tip cleaning and cleaning member 44 is composed of a brush fixing member 44h and a plurality of brushes 44 fixed thereto, and the brush 44b is composed of a brush shaft portion 44S and a fiber portion 44f. The probe tip cleaning and cleaning part 44, -28-201009352 is, for example, a method in which a plurality of refurbishing brushes are attached to the brush fixing member 44h by using a commercially available refurbishing brush as a cleaning and honing of the printed circuit board. Fixed formation is also possible. The fiber portion 44f is made of, for example, glass fiber. The number of the refurbishing brushes fixed to the brush fixing member 44h is arbitrary, but is 6 to 20 degrees in the trial work. When the probe tip cleaning and cleaning part 44 reciprocates in the X direction or the Y direction, in order to make the fiber portion 44f and the probe tip end portion 32p contact the average, the brush fixing member 44h is not in the form of a lattice. It is preferred that the adjacent brush columns are staggered in a half-grid. Next, the point of attention when cleaning the probe 32 of the inspection jig 28 using the probe tip end cleaning and cleaning unit 44 will be described. As shown in Fig. 9(A), when the inspection jig 28 is lowered toward the probe tip cleaning unit 44 provided on the turntable 22, the probe tip cleaning component 44 is not directly below it, and is not detected. The tip end portion 3 2p collision is preferred. The inspection jig 28 is lowered until the probe tip end portion 32p slightly contacts the height of the fiber portion 44b and is stationary, and the probe tip cleaning portion 44 is moved laterally from the left side toward the right side of the surface, and the fiber portion 44b The probe tip end portion 3 2p is erased (i.e., erased) toward the other side. The fiber portion 44 is also stationary when it reaches the position away from the probe distal end portion 32p, and then moves laterally toward the original position, and the fiber portion 44b wipes the probe distal end portion 32p in the opposite direction. The number of times this cleaning action is required to return. After the cleaning operation is completed, the inspection jig 28 is raised to the original position. As shown in Fig. 9(B), when the probe jig 28 is lowered toward the probe tip cleaning unit 44 provided on the turntable 22, and the probe tip cleaning unit 44 is located directly below, the fiber portion 44f is provided. The tip of the probe will collide with the end 3 2p of the probe -29-201009352, causing the probe 32 to be in a compressed state. In this state, when the reciprocating movement of the probe tip cleaning and cleaning member 44 in the lateral direction is started, an excessive load is applied to the probe 32 from the fiber portion 44f, and some of the probes 32 are deformed. Therefore, it is preferable to perform the cleaning operation in the state as described in Fig. 9(A). [Shuttle type substrate inspection device] The cleaning mechanism of the present embodiment is not limited to the substrate inspection device 1A by the rotary table device 22 0 . For example, Fig. 10 is a view for explaining a substrate holding portion used in the shuttle type substrate inspection device 150. The substrate holding portion of the shuttle type substrate inspection device 150 is the same as the substrate test device described in Fig. 7. Further, the basic configuration is the same as that of the shuttle type substrate inspection device 70 of Fig. 6. Symbol 29 is a correction camera. In the shuttle type substrate inspection device 150 of Fig. 10, the tray 74L or 74R on which the substrate 72 to be inspected is placed is moved along the predetermined lane on the rectangular rectangular mounting table 22-1. In other words, when the inspected substrate 72 is the left tray 74L placed in the position P1, the left tray 74L is moved by the left lane 70L via the center line 70C to the position P5 via the left lane 70L, and is stationary at the position P5. And perform substrate inspection. After the substrate inspection is completed, the position is returned to the position P1 via the left line 70L via the position P6. The inspected substrate 72 of the right tray 74R provided in the position P2 passes through the position P3 via the right lane 70R, and moves the center lane 70C to the position P5 at the end of the inspection of the substrate on the left side of the preceding line. P5 performs substrate inspection. After the substrate inspection, the position on the right side lane 70L is returned to the position P2 from the position P7 via 201009352. In the forward path of the left tray 74L, the positions PI, P3, and P4 are the upstream portions, the position P5 is the inspection portion, and the positions P6 and P1 are the downstream portions. On the other hand, in the forward path of the right tray 74R, the positions P2, P3, and P4 are the upstream portions, the position P5 is the inspection portion, and the positions P7 and P2 are the downstream portions. The substrate inspection time of the substrate to be inspected on the sheet side is performed, and the total operation time of the plurality of substrate inspections is shortened by performing an operation of positioning the substrate 72 to be inspected on the opposite side in the tray 74L or 74R. The shuttle type substrate inspection device 150 may be provided with a cleaning mechanism. For example, in the right tray 74R, the probe front end portion cleaning and cleaning member 44 described in Fig. 9 may be provided instead of the substrate to be inspected. The probe tip end cleaning and cleaning part 44 is a radially extending probe tip end cleaning part 44R, a circumferentially extending probe tip end cleaning part 44C, and a radial direction and a circumferential direction extending probe tip end cleaning part 44RC. One type is also available. The probe tip end portion of the right tray 74R is cleaned and cleaned, and the tool is retracted by a pneumatic cylinder (not shown) at a predetermined position in the X direction at the position P5, and the probe tip end portion 32p of the inspection jig 28 is performed. Cleaning action. Further, it is reciprocated in a predetermined length in the Y direction as needed, and the cleaning operation of the probe distal end portion 32p of the inspection jig 28 is performed. Therefore, the probe tip end cleaning and cleaning component 44 is formed integrally with the tray 74R, and the inspected substrate 72 is moved on the same path as the conveyed conveyance path. Although not shown in the drawing, in order to collect fallen solder chips and other dust during cleaning of the distal end portion of the probe, the inlet of the cleaner is placed at an appropriate position in the vicinity of the position P5. -31 - 201009352 For this cleaning operation, for example, a predetermined number (for example, 100 pieces) of the substrate is carried out after the inspection. The data of the substrate inspection obtained by the substrate inspection device 150 is a "test result" as will be described later, and when the predetermined threshold is exceeded, the cleaning operation is performed. [Test Results] For example, in the substrate inspection apparatuses 10 and 150, the resistance 値 of the conductor pattern diagram was measured to determine whether it was good or not. For example, if the measurement resistance 値 of the conductor pattern is less than the inspection threshold 次 of the next type, it is judged to be good, and if it exceeds the inspection threshold 判别, it is judged to be defective. Inspection threshold 値=L + k ( Ω ) L : Conductor pattern resistance of the good substrate 値k: Contact resistance of the probe and conductor pattern, solder adhesion at the tip end of the probe, etc., as an example, 1〇〇 When the substrate inspection of the degree is performed, the measurement resistance 基板 of the substrate conductor may exceed the inspection threshold 。. In this case, the tip end portion of the probe is cleaned by manual operation in a manner described in the prior art, and the measurement resistance of the substrate conductor is returned to the inspection threshold 値 or less. Using the cleaning mechanism described in the above embodiment, the cleaning operation is performed on the substrate beyond the inspection threshold 。. Cleaning brush, the brush part is a brush made of softer material (for example, using PBT: polybutylene terephthalate brush), and the front end of the probe is maximally 200 in the X direction. Cleaning. However, the measurement resistance 値 is beyond the inspection threshold. -32- 201009352 It can replace the PBT brush. The brush part uses a brush made of relatively hard material (for example, a glass fiber brush), and the tip end of the probe is cleaned dozens of times in the X direction. . As a result, the measured resistance 値 is almost equal to the inspection threshold 値. Next, the tip end portion of the probe was cleaned to the X direction for several tens of times, and then the cleaning was performed dozens of times in the Υ direction. As a result, it can be confirmed that all of the measured resistances 値 are equal to or less than the inspection threshold. Conductor of the substrate The variation of the measured resistance 値 of the pattern diagram is 1 Ω or less. Based on the results of these trials, it is understood that the material of the brush used is better than the soft material (glass fiber). The tip end portion of the probe is almost cleaned by performing tens of times of cleaning on the tip end portion of the probe in one direction (e.g., the X direction). Further, the tip end portion of the probe is completely cleaned by performing tens of times of cleaning on the tip end portion of the probe in two directions (e.g., the X direction and the Υ direction). The cleaning operation is determined in one direction or two directions, and can be determined by the measurement resistance of the conductor pattern of the substrate to be inspected obtained in the substrate inspection, the frequency exceeding the inspection threshold w 等 , and the like. The embodiment shown in Figs. 7 to 10 can further clean the peripheral surface of the distal end portion of the probe as compared with the embodiment of Fig. 2. Therefore, this embodiment is particularly suitable for use in a two-terminal measurement method in which a soldering chip or the like between the tip end portion of the probe and the inspection point is left to change the contact resistance 値 of the probe to affect the measurement result. Clean the probe. [Advantages and Effects of the Embodiments] As described above, by providing the cleaning mechanism in the substrate inspection device, the following advantages and effects can be obtained from -33 to 201009352. (o) realization of the substrate inspection device having the cleaning mechanism of the probe tip end portion According to the present embodiment, the substrate inspection device having the cleaning mechanism of the probe tip end portion can be realized. (2) Mechanization of the cleaning operation, as described in the prior art, Conventionally, the inspection jig is removed from the substrate inspection device. The probe of the inspection jig is cleaned by brushing by hand. © With this embodiment, the mechanization of the cleaning operation can be achieved. It is difficult to manage the quality level. However, by mechanizing the cleaning action, the quality of the cleaning of the probe tip can be managed to a certain extent. (3) The cleaning operation can be automated by the substrate inspection device. Automating the cleaning operation. © In the manual work, the substrate inspection work and the cleaning of the probe tip are individual operations. Further, in the substrate inspection device disclosed in Patent Documents 1 and 2, when cleaning, it is A plurality of cleaning means provided by the flow of the substrate to be inspected are moved until the contact portion, the contact probe, etc. However, in the substrate inspection apparatus, by providing a cleaning mechanism that moves the substrate to be inspected on the same path as the conveyance path to be inspected, the substrate inspection operation is not substantially interrupted, and the cleaning operation of the probe tip is performed. It can be carried out by a continuous process together with the substrate inspection-34-201009352. That is, when a plurality of (for example, 100) substrates are sequentially and sequentially subjected to substrate inspection, 'as seen from the inspection jig, by being placed on the substrate to be inspected The cleaning mechanism that moves in the same manner as the substrate to be inspected and seeks to move the path substantially does not interrupt the flow of the substrate inspection that is sequentially performed. If necessary, the tip end portion of the probe can be cleaned in a short time and immediately returned to the substrate. (4) Shortening of the substrate inspection time By providing a cleaning mechanism in the substrate inspection device, it is not necessary to remove and reinstall the inspection jig. The wiring of the substrate to be inspected is extremely high-density, and the inspection jig corresponding to this is investigated. The needle arrangement is also extremely high density. Therefore, when the inspection jig is mounted on the substrate inspection device, the position is It takes a lot of time to correct and determine the position. "There is no need to attach and detach the inspection jig by the cleaning mechanism of the substrate inspection device. The time required for cleaning the tip end portion of the probe can be greatly shortened. As a result, it will be fixed. The total substrate inspection time required for the number of substrate inspections can be greatly shortened. (5) The knowledge of the positional deviation of the inspection jig is known, and the inspection jig is reattached to the substrate inspection device after the cleaning operation, and each time it is returned. The position of one point is corrected and the final position determines the way of installation. However, in this type of installation position setting, the positional deviation problem may occur before and after the inspection jig is loaded or unloaded. The cleaning mechanism of the distal end portion of the probe is incorporated in the substrate inspection device, and the attachment and detachment of the inspection jig at the time of cleaning the distal end portion of the probe is unnecessary, and the problem of positional deviation occurring before and after attachment and detachment can be eliminated. -35-201009352 [Alternatives and the like] Although the preferred embodiment of the substrate inspection apparatus including the cleaning mechanism of the present invention has been described above, the present invention is not limited to the embodiment, and it is easy for the person skilled in the art to add. The invention is also included in the present invention, and the scope of the technology of the present invention is determined by the description of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing a schematic configuration of a substrate inspecting apparatus including a rotary table device according to an embodiment of the present invention. [Fig. 2] An enlarged plan view of the rotary table device shown in Fig. 1 as seen from above. [Fig. 3] A sketch of a part of the brush portion of the cleaning mechanism of the turntable shown in Fig. 2 is enlarged. [Fig. 3] Fig. 4 is a simplified view of the cleaning mechanism of the turntable shown in Fig. 2, which is a state of passing through the inspection unit in accordance with the rotation of the circular mounting table [Fig. 4A] A perspective view of the cleaning mechanism shown in FIG. [Fig. 4B] A side view of the cleaning mechanism shown in Fig. 3B. [Fig. 4C] is a perspective view showing a configuration in which the cleaning mechanism shown in Fig. 3B is attached to the annular portion. [Fig. 4] Fig. 4 is a perspective view showing a state in which the ring-shaped portion of the cleaning mechanism of the other embodiment is attached to the back side of a certain portion of the opening of the circular mounting table. -36- 201009352 [Fig. 5] A perspective view of a cleaning mechanism of another embodiment. Fig. 6 is a schematic plan view showing the structure of a shuttle type substrate inspecting apparatus according to another embodiment of the present invention. [Fig. 7] An enlarged plan view of the rotary table device of another embodiment of the rotary table device of Fig. 1 as seen from above. [Fig. 8] An enlarged plan view showing a part of the rotary table device of Fig. 7 having the probe tip end cleaning portion of the other embodiment. [Fig. 9] Figs. 9(A) and 9(B) are simplified front views for explaining the functions of the inspection tool and the probe tip end cleaning and cleaning parts. [Fig. 10] A plan view showing a substrate holding portion used in a shuttle type substrate inspection device according to another embodiment of the present invention. [Description of main component symbols] 10 : Substrate inspection device 11 : Control device 1 2 : Operation panel 1 4 : Control unit 1 6 : Image processing unit 1 8 : Tester controller 20 : Scanner 22 : Rotary table device 22 - 1 : rectangular mounting table 22 s : rotating drive shaft 22 t : circular mounting table 26 d : lower jig driving unit - 37 - 201009352 26u : upper jig driving portion 28 : inspection jig 28 d : lower inspection jig 2 8u : upper inspection jig 29 : Correction camera 29u, 29d: lower camera 30: inspection unit 32: probe 32g: guide pallet 32p: probe distal end portion 32s: probe shaft portion 38u: pneumatic cylinder 40: inspected substrate holding portion 40w: opening 42 : Inspected substrate 44 : Probe tip cleaning and cleaning part 44b : Brush 44C : Probe tip end cleaning part 44Cd : Lower probe tip end cleaning part 44Cu : Upper probe tip end cleaning part 44 f : Fiber part 44h: brush fixing member 44R: probe tip end cleaning part 44RC: probe tip cleaning part 44RCu, 44RCd: lower probe tip cleaning part 201009352 44Rd: lower probe tip cleaning part 44Ru : The front side of the upper probe is clean Part 4 4 S: Brush shaft portion 50: Cleaning mechanism 52: Brush portion 52a: Portion 52b of the bundle of fibers: Implanted portion 53: Brush portion 53a: Portion 53b of the bundle of fibers: Implanted portion 54 : brush holding portion 54a: angle adjustment plate 56: opening portion 60: cleaning mechanism 62: brush portion 62a: bundle portion 62b of fiber: implanted portion 64: brush holding portion 64a: adjustment screw 65: fixed Part 70: shuttle type substrate inspection device 70C: common conveyance path 70L: conveyance path 70R: conveyance path 72: inspection substrate - 39 - 201009352 72L : inspection substrate 74L: left side tray 74R: right side tray 80: ring shape portion 80a: Opening portion 90: cleaning mechanism 92: brush portion 92a: portion 92b of the bundle of fibers: implanted portion 94: brush holding portion 95: tray 150: shuttle type substrate inspection device 220: rotary table device