JP7107589B2 - Equipment with roller electrode contacts for chip electronic component inspection - Google Patents

Description

The present invention relates to an apparatus with roller electrode contacts for testing chip electronic components. More specifically, it is a chip electronic component inspection and sorting equipment used to continuously and quickly inspect and select the electrical characteristics of chip electronic components, such as chip capacitors (also called chip capacitors) mass-produced according to the same standard. More specifically, the present invention relates to a chip electronic component inspection and sorting apparatus of a type that uses roller electrode contacts as contactors for inspecting electrical characteristics of chip electronic components.

Along with the increase in the production of small electronic devices such as mobile phones, smart phones, liquid crystal televisions, and electronic game machines, the production of minute chip electronic components incorporated in such small electronic devices has increased remarkably. Most of the chip electronic components are electronic components having a two-electrode terminal configuration, which is composed of a columnar body portion formed from a ceramic base material and electrode portions provided on opposite end surfaces thereof. A chip capacitor (also referred to as a chip capacitor) can be cited as a representative example of such a chip electronic component.

2. Description of the Related Art In recent years, chip electronic components have become very small in order to cope with the further miniaturization of electronic equipment in which chip electronic components are incorporated and the increase in the number of chip electronic components incorporated in electronic equipment. For example, for chip capacitors, very small sizes (e.g., 1.6 mm x 0.8 mm x 0.8 mm size, called 1608; 1.0 mm x 0.5 mm x 0.5 mm size, called 1005; 0402 chips (0.4 mm x 0.2 mm x 0.2 m in size) are used, and such minute chip electronic components are mass-produced only once. It is produced in units of tens of thousands to hundreds of thousands.

When assembling electronic equipment that incorporates chip electronic components, in order to prevent the electronic equipment from being defective due to defects in the embedded chip electronic components, in general, the total number of embedded chip electronic components is An electrical property test is performed. For example, all chip capacitors to be incorporated into electronic equipment are generally inspected for electrical characteristics such as capacitance and leakage current before being incorporated into the electronic equipment.

It is necessary to inspect the electrical characteristics of a large number of chip electronic components continuously and at high speed. A chip on which a chip electronic component transport disk (sometimes simply called a "transport disk" or "rotor") with multiple concentric rows of through holes formed on the surface of the disk is mounted so as to be able to rotate intermittently. Automated equipment for testing and sorting the electrical properties of electronic components (ie, chip electronic component inspection and sorting equipment) has become commonplace.

Examples of typical configurations of conventionally used chip electronic component inspection and sorting apparatuses are described and illustrated in Patent Documents 1 and 2.

As can be understood from the descriptions and illustrations in each of the above patent documents, a general chip electronic component inspection and sorting apparatus has a large number of through holes for accommodating (meaning temporary accommodation for inspection) and holding chip electronic components. a carrier disc formed with a carrier disc; a carrier disc support (also called a reference platform or base plate) that supports the carrier disc in a vertical or inclined manner for intermittent rotation; a carrier disc surrounding the carrier disc support; chip electronic component feeder for feeding chip electronic components onto the surface of the conveying disc and holding them in the through-holes of the conveying disc; installed behind the conveying disc support base Exhaust device for sucking and exhausting the air inside the device and storing and holding chip electronic components in the conveying disc; An electrical property measuring device comprising an upper electrode terminal (upper contact for inspection) and a lower electrode terminal (lower contact for inspection); a chip electronic component sorting device connected to the electrical property measuring device; It can be said to be an apparatus provided with a chip electronic component recovery device for taking out and recovering the chip electronic component whose characteristics have been measured from the transfer disk.

When using the chip electronic component inspection and sorting device, a carrier disc is mounted on the front side or upper side of the carrier disc support stand arranged vertically or in an inclined state in the device, and the carrier disc is intermittently rotated. At the same time, the exhaust device behind the transfer disk support is operated to suck the chip electronic components into the through holes of the transfer disk and hold them therein. The upper electrode terminal and the lower electrode terminal of the electrical characteristic measuring device are brought into contact with each electrode of the chip electronic component held on the transfer disk in the electrical characteristic inspection section. , applying electrical energy of a predetermined voltage and inspecting (measuring) the electrical characteristics of the chip electronic component. Then, the chip electronic components are inspected (measured) and sorted by the chip electronic component sorting device electrically connected to each of the electrode terminals.

For example, when measuring the capacitance of a chip capacitor, in the electrical characteristic inspection section, through a pair of electrode terminals (contactors for inspection) from the electrical characteristic measuring device provided in the chip electronic component inspection and sorting device A test voltage having a predetermined frequency is applied to the chip capacitor. Then, the current value of the current generated in the chip capacitor by the application of this inspection voltage is detected, and the capacitance of the chip capacitor to be inspected is inspected based on this current value and the voltage value of the applied inspection voltage. be

After the inspection (measurement of electrical characteristics) of the chip electronic components housed and held on the transport disk is completed, based on the inspection results, the chip electronic components are discharged from the through holes of the transport disk so that they are sorted and stored in a specified container. is done. For this reason, an ordinary chip electronic component inspection and sorting apparatus is further provided with a chip electronic component sorting section for sorting (or sorting) the chip electronic components after inspection.

Patent Literature 3 describes a method for continuously inspecting the electrical properties of chip electronic components using an improved version of the chip electronic component inspection and sorting apparatus described in Patent Literature 1. US Pat. FIG. 1 of Patent Document 3 shows an example of the basic configuration of a two-electrode terminal type chip electronic component, and FIGS. A cross-section of the front surface of and the carrier platter support is shown. FIG. 4 of Patent Document 3 shows a chip electronic component conveying disc having three concentric rows of through holes formed on its surface. It is a chip electronic component carrier disc having six or eight concentric rows of through holes formed on its surface.
7, 8 and 9 of Patent Document 3 respectively show a series of operations in which the chip electronic component is accommodated and held in the through-hole of the conveying disk, the electrical characteristics are measured, and finally discharged and recovered. is shown.

By the way, as the upper contact of the pair of electrode terminals (contact for inspection) provided in the electrical characteristic measuring device of the chip electronic component inspection and sorting device, the upper contact in FIG. 7 and FIG. A long and narrow plate-shaped contactor (lever contactor) was used as shown, but in recent years, a roller electrode type contactor (roller electrode terminal) is generally used. This roller electrode terminal is described and illustrated in detail in Patent Document 4 and Patent Document 5. In any roller electrode terminal, the roller electrode and the roller electrode are brought into contact with the electrode surface of the chip electronic component. and a roller support that rotatably supports the roller electrode.

Patent Document 4 describes and illustrates a system for inspecting chip electronic components with a combination of an upper roller electrode terminal housed in a housing and a rod-shaped lower electrode terminal having a flat top surface. In [0049] to [0054] of Patent Document 4, non-conductive contaminants such as metal oxides peeled off from the electrode surface of the chip electronic component are deposited on the roller electrode surface of the upper roller electrode terminal. , and that the non-conductive contaminants can be removed by moving the upper roller electrode terminals along the upper surface of the intermittently rotating conveying disk and bringing them into contact with each other.

Patent Document 5 discloses, as a roller electrode terminal, a combination of a roller electrode terminal provided at the tip of a plate spring-like support and a rod-like lower electrode terminal. Contaminants are deposited on the top surface of the lower electrode terminal, and the lower electrode terminal is repeatedly raised and lowered in accordance with the rotation of the conveying disc containing the chip electrode component, causing the top surface of the lower electrode terminal to It is disclosed that contaminants deposited on the top surface of the lower electrode can be removed by rubbing the surface against the lower surface of the carrier platter.

JP-A-2001-26318 Japanese Patent No. 3426246 (Patent publication filed in Japan corresponding to WO97/018046) JP 2015-213121 A JP 2018-56483 A U.S. Patent Publication 2006/0028224 A1

Patent Document 4 discloses removing non-conductive contaminants deposited on the roller electrode surface of the upper roller electrode terminal using physical contact between the upper surface of a rotating transfer disc and the roller electrode, as described above. and US Pat. No. 5,300,002 describes a system for contaminating the top surface of the lower rod-shaped electrode using physical contact between the lower surface of a rotating transfer disk and the top surface of the lower rod-shaped electrode. A system for removing material is described. However, the system for removing contaminants on the electrode surface by physical contact between the electrode surface and the surface of the transfer disc may damage the surface of the transfer disc made of resin material, so it is not necessarily a satisfactory method. I can't say

In particular, in recent years, as described above, chip electronic components have been miniaturized to have extremely small sizes, and extremely small sizes have become mainstream. According to the study of the inventor of the present invention, in a chip electronic component inspection and sorting apparatus for inspecting and sorting such extremely small chip electronic components, the chip electronic components are inevitably placed in the vertical direction (longitudinal direction) of the through holes. It is necessary to make the thickness of the conveying disk for holding and conveying the chip vertically slightly smaller (thinner) than the length of the chip electronic component in the vertical direction. Therefore, it is desirable to avoid, as much as possible, the occurrence of scratches on the surface of such extremely thin transfer discs, which tend to reduce the physical strength of the discs.

The present invention provides a system for efficiently removing non-conductive contaminants deposited on the roller surface of an upper roller electrode terminal provided in an inspection and sorting device for chip electronic components without damaging the surface of a conveying disc. is the subject.

The inventors of the present invention conducted research for the purpose of finding a method for removing non-conductive contaminants deposited on the roller surface of the upper roller electrode terminal of a chip electronic component inspection and sorting device without damaging the surface of the conveying disk. As a result, a flexible tape (or sheet) having an abrasive powder layer formed on one surface, that is, a polishing tape (or polishing sheet) was prepared, and this polishing tape was placed in a non-conductive contaminant in a rotating state. The upper roller electrode is provided so that the abrasive powder layer surface is in continuous contact with the roller electrode at a location different from the roller surface where the material is deposited and the location where the roller electrode is in contact with the electrode of the chip electronic component. By incorporating it into the terminal, the contact between the roller electrode and the electrode surface of the chip electronic component, which is necessary for measuring electrical characteristics, is not hindered, and the surface of the conveying disk is not damaged. The present inventors have arrived at the present invention based on the finding that organic contaminants can be effectively removed.

Accordingly, the present invention provides a chip electronic component transporting disk; a transporting disk support base for axially supporting the transporting disk accommodating and holding chip electronic components in a vertical or inclined state so as to allow intermittent rotation; and a transporting disk support base. an exhaust device provided behind; and a chip electronic component is supplied to the surface of the transfer disc and accommodated in the through hole thereof, respectively, provided at positions along the rotation path of the transfer disc around the transfer disc support. A chip electronic component feeder for holding, and an electrical characteristic provided with an electrode terminal set in which the upper electrode terminal is a roller electrode terminal for measuring the electrical characteristics of the chip electronic component accommodated and held in the through hole of the conveying disc. A chip electronic component inspection and sorting apparatus comprising a measuring device and a chip electronic component recovery device for taking out and recovering chip electronic components whose electrical properties have been measured, wherein an abrasive powder layer is applied to the roller electrode terminal on one side. so that the surface of the abrasive powder layer can continuously contact the roller electrode at a location different from the location where the roller electrode is in contact with the electrode of the chip electronic component. An inspection and sorting device for chip electronic components characterized by being built in.

The upper roller electrode terminal of the chip electronic component inspection and sorting apparatus of the present invention includes a roller electrode, and a roller electrode supporting member that brings the roller electrode into contact with the electrode surface of the chip electronic component and rotatably supports the roller electrode in that state. It is preferable that the configuration includes. Specific configurations of the roller electrode support include the following configurations.
(1) The configuration described and illustrated in Patent Document 4, that is, roller rotating shaft holding means for rotatably holding the roller electrode, and the roller rotating shaft holding means that accommodates and is held by the roller rotating shaft holding means and (2) the structure described and illustrated in Patent Document 5, i.e., Roller rotating shaft holding means for rotatably supporting the roller electrode, and pressing the roller electrode held by the roller rotating shaft holding means connected to the roller rotating shaft holding means against the electrode surface of the chip electronic component. A configuration having elastic means (for example, a plate-like spring) can be mentioned.

The abrasive powder used in the present invention for the soft (that is, flexible) tape or sheet having an abrasive powder layer formed on one surface includes finely divided diamond powder, aluminum oxide powder, and silicon powder. Stiff material powders such as carbide powders may be mentioned. The flexible tape or sheet is preferably a synthetic resin tape or sheet typified by polyester tape (or sheet). The abrasive powder layer is desirably formed by smooth coating on the surface of the tape or sheet that serves as the substrate. Flexible tapes or sheets with such an abrasive powder layer formed on one surface are commercially available, for example, under the tradenames 3M Lapping Film or 3M Diamond Lapping Film.

In the chip electronic component inspection and sorting apparatus of the present invention, contaminants deposited on the roller electrode surface of the upper roller electrode terminal during its operation, particularly tin oxide adhered to the roller electrode surface due to contact with the electrode surface of the chip electronic component can be continuously removed without damaging the surface of the chip electronic component carrier platter.

1 to 10 are diagrams for explaining the prior art related to the present invention. 11 to 14 are diagrams showing configuration examples of means for removing non-conductive contaminants (deposits) on the surfaces of roller electrodes provided in the chip electronic component inspection and sorting apparatus of the present invention.
1 is a perspective view showing the configuration of a standard two-terminal (two-electrode terminal) type chip electronic component; FIG. 1 is a front view showing an overview of the overall configuration of a general chip electronic component inspection and sorting apparatus in which a conveying disk support stand for supporting rotation of a conveying disk is arranged vertically; FIG. FIG. 4 is a plan view showing a standard configuration of the front surface of the transfer disk; FIG. 4 is a schematic diagram showing the positional relationship among a chip electronic component supply section, an electrical characteristic measurement section, and a chip electronic component recovery section, which are arranged along the rotation path of the transfer disk; 5A is a front view of the chip electronic component supply unit shown in FIGS. 1 and 4, and also shows a chip electronic component supply shelf provided on the back surface; FIG. (b) is a side cross-sectional view of (a), showing the positional relationship with the conveying disk. FIG. 4 is a cross-sectional view showing the positional relationship between a conveying disk support and a conveying disk mounted on the front surface thereof; FIG. 4 is a diagram schematically showing how chip electronic components supplied to the chip electronic component supply device are accommodated in the through holes of the transfer disk by the action of the exhaust device behind the transfer disk support. It is a figure which shows the process which test|inspects the electrical characteristic of the chip electronic component accommodated in the through-hole of a conveyance disk in an inspection part. This figure shows a structure in which both the upper contact (electrode terminal) and the lower contact (electrode terminal) are rod-shaped contacts that have been used for a long time. FIG. 4 is a cross-sectional view showing a process of ejecting and recovering chip electronic components for which electrical characteristics have been measured from through-holes of a conveying disk; 9A is a view corresponding to FIG. 8 above, showing aligned upper roller electrode terminals of the chip electronic component inspection and sorting apparatus; FIG. (b) is a side cross-sectional view of the upper roller electrode terminal, and (c) is an enlarged view (cross-sectional view) of the roller electrode portion of the upper roller electrode terminal of (b). FIG. 4 is a cross-sectional view of the upper roller electrode terminal to which means (abrasive tape) for removing non-conductive contaminants (deposits) is attached, showing a configuration example of the upper roller electrode terminal of the chip electronic component inspection and sorting apparatus of the present invention. (a) is a rear view of the upper roller electrode terminal to which the polishing tape is attached, shown as a cross-sectional view in FIG. 11; It is a block diagram explaining those assembly methods. 13A is a diagram showing an example (plan view) of the shape of a polishing tape used for removing the non-conductive contaminants shown in FIGS. 11 and 12; FIG. (b) is a diagram showing a mode in which a plurality of polishing tapes are integrated and formed, which is effective for polishing a plurality of parallel upper roller electrode terminals. (a) shows another mounting position of the polishing tape, and (b) shows the assembly of the parts constituting the upper roller electrode terminal and the polishing tape.

First, the configurations of a general chip electronic component inspection and sorting apparatus and a chip electronic component transfer disc that have been used conventionally will be briefly described with reference to FIGS. 1 to 10 of the accompanying drawings.

FIG. 1 is a diagram showing a standard configuration of a chip capacitor, which is a representative example of a chip electronic component to be inspected. and a pair of electrodes 1b, 1b.

FIG. 2 is a front view showing a configuration example of a chip electronic component inspection and sorting apparatus in which a conveying disk support stand for supporting the rotation of the conveying disk is arranged vertically. In the chip electronic component inspection and sorting apparatus 10 shown in FIG. 2, a conveying disk 11 is attached to a conveying disk support base on the rear surface thereof.

FIG. 3 shows a front view of the transfer disk 11. In this transfer disk 11, a plurality of through holes (chip electronic component housing and holding holes) for temporarily housing chip electronic components are formed in a concentric arrangement. It is

As shown in FIGS. 2 and 4, around the transfer disk 11, a chip electronic component supply container 101 (having a chip electronic component supply box 44) and a chip electronic component electrical property measuring device are arranged. An electrical property measuring unit 102 and a chip electronic component sorting/collecting unit 103 are provided along the rotation path of the conveying disk 11 .

FIG. 5 is a front view of the chip electronic component supply section 11, and also shows the chip electronic component supply box 44 and the chip electronic component supply shelf 33 provided on the back surface. (b) is a side cross-sectional view of (a) and also shows the positional relationship with the conveying disk 11. FIG.

Chip electronic components to be inspected (measured) are temporarily stored in a chip electronic component supply box 44, sequentially sent to a chip electronic component supply shelf 33 formed in an arc shape, and then stored behind a transfer disk support table. It is accommodated in the through hole of the conveying disk 11 which is intermittently rotating due to the exhaust action (suction action) of the exhaust device provided.

FIG. 6 shows the positional relationship between the conveying disk support table 45 and the conveying disk 11. As shown in FIG. The conveying disk 11 is mounted on a rotating tool 41 provided in the center of the conveying disk support base 45 and rotates intermittently.

As shown in FIG. 7, when the chip electronic components supplied to the chip electronic component supply device move along the surface of the chip electronic component supply shelf 33 and reach a position close to the through hole of the transfer disc 11, the transfer disc support table 45 is a schematic diagram showing how it is accommodated in the through-hole of the transfer disk 11 by the action of the exhaust device behind 45. FIG.

The transfer disk 11 containing the chip electronic components continues to rotate, and then temporarily stops at the inspection section (electrical characteristic measurement position) 102 . In the inspection unit 102, as shown in FIG. 8, electrodes (22a, 22b) at both ends of the individual chip electronic components 19 (19a, 19b, . A pair of electrode terminals 13a and 12a are arranged at positions close to both openings of the through hole 11a. Among these electrode terminals, the lower electrode terminal 12a is usually a fixed electrode terminal, and is fixed to the conveying disk support base 45 by an electrically insulating cylindrical body 51 arranged around it. there is On the other hand, the electrode terminal 13a on the upper side is a movable electrode terminal, and FIG. 8 shows a rod-shaped electrode terminal as the movable electrode terminal.

In the inspection unit 102, the electrical characteristics of each of the six chip electronic components 19a, 19b, . Parts are sorted.

The chip electronic components whose electrical characteristics have been inspected are then sent to the chip electronic component sorting section 103 shown in FIGS. Classification (selection) is performed.

FIG. 9 is a schematic diagram showing the process of sorting chip electronic components in the chip electronic component sorting unit. In the sorting section, a pressurized gas ejection hole 45 b is formed in the transfer disk support 45 , and the pressurized gas ejection hole 45 b is connected to the pressurized gas generator 63 . Pressurized gas is generally created by pressurizing air.

The chip electronic components 19a, 19b, whose electrical characteristics have been inspected, which have been sent to the sorting section by the rotational movement of the conveying disk, stop at positions corresponding to the pressurized gas ejection holes 45b of the conveying disk support table 45. FIG. Then, based on the control signal sent from the controller 15, as shown in FIG. 9, the pressurized gas is supplied to the through hole 11a of the transfer disk 11 through the pressurized gas ejection hole 45b. The supply of pressurized gas causes the chip electronic component 19a in the through hole 11a to be blown up and discharged, and then passed through the chip electronic component discharge pipe 62 to be housed in the chip electronic component recovery case.

Next, the configuration of the upper roller electrode terminals of the chip electronic component inspection and sorting apparatus of the present invention will be described.

FIG. 10(a) is a diagram corresponding to FIG. 8 described above as the prior art, and shows the aligned upper roller electrode terminals 71 of the chip electronic component inspection and sorting apparatus. (b) is a side sectional view of one upper roller electrode terminal 71, and (c) is an enlarged view (sectional view) of the roller electrode portion 71 of the upper roller electrode terminal of (b).

As can be seen in the side sectional view (b) and enlarged view (c) of FIG. , a roller electrode support 73 that rotatably supports the roller electrode 72 is included. The upper roller electrode terminal 71 accommodates the roller rotating shaft holding means 74 that rotatably holds the roller electrode 72, and the roller rotating shaft holding means 74, and the roller electrode 72 held by the roller rotating shaft holding means 74. It consists of a housing 76 with elastic means (eg coil springs) 75 which can be pressed against the electrode surfaces of the chip electronic component.

FIG. 11 is a cross-sectional view corresponding to the enlarged view of FIG. 10(c), and in FIG. 11 shows a state in which a polishing tape 77, which is a characteristic configuration of the present invention, is incorporated in a roller electrode support 73. show. Details regarding the polishing tape 77 have been previously described herein.

FIG. 12(a) is a rear view (viewed from the back side) of the roller electrode support 73 on which the polishing tape 77 shown in cross section in FIG. 11 is attached. Each part (including the polishing tape 77) constituting the roller electrode support 73 and the method of assembling them are shown in FIG. 12(b).

FIG. 13(a) shows a plan view of the polishing tape 77 before being incorporated into the roller electrode support 73. As shown in FIG. The abrasive tape 77 is usually manufactured by cutting out an abrasive sheet coated with an abrasive layer. The polishing tape 77 cut into the shape shown in FIG. 13 is folded in advance into the shape shown in FIG. incorporated into 73. The materials and construction of polishing tape 77 have been previously described herein.
(b) shows an embodiment in which a plurality of polishing tapes effective for polishing a plurality of parallel upper roller electrode terminals are integrated.

11 and 12 show a configuration in which the polishing tape 77 is incorporated in the roller electrode support 73 so as to come into contact with the roller electrode 72 on the upper side. 72 may be incorporated so as to contact the lower front side. An example of this configuration is shown in FIGS. 14(a) and 14(b).
Also, although not shown, the polishing tape 77 is mounted vertically (or inclined) on the front side of the roller electrode support 73 so that the roller electrode 72 comes into contact with the electrode of the chip electronic component just before it comes into contact with the electrode. may have been

In this specification, the configuration of the chip electronic component inspection and sorting apparatus has been described, and the effects of the present invention have been described by taking as an example a chip electronic component inspection and sorting apparatus in which the chip electronic component transfer disk is arranged in the vertical direction and operates. Of course, the chip electronic component inspecting and sorting apparatus of the present invention may be a device in which the chip electronic component conveying disc is pivotally supported in a tilted state on a base.

1, 19a chip electronic component (chip capacitor)
1b electrode unit 10 chip electronic component inspection and sorting device 11 chip electronic component transport disk (transport disk)
71 Roller electrode terminal 72 Roller electrode 73 Roller electrode support 74 Roller rotating shaft holding means 75 Coil spring 76 Housing 77 Polishing tape

Claims (5)

Chip electronic component transfer disc; Transfer disc support base for axially supporting the transfer disc accommodating and holding the chip electronic components in a vertical or inclined state so that the transfer disc can be intermittently rotated; Exhaust provided behind the transfer disc support base device; and chip electronics for supplying chip electronic components to the surface of the conveying disc and accommodating and holding them in the through-holes, respectively, provided at positions along the rotation path of the conveying disc around the conveying disc support base. A component supply device, an electrical property measuring device equipped with an electrode terminal set in which the upper electrode terminal is a roller electrode terminal for measuring the electrical property of a chip electronic component accommodated and held in a through-hole of a conveying disc, and an electrical property measurement device A chip electronic component inspection and sorting device equipped with a chip electronic component recovery device for taking out and recovering chip electronic components for which the measured A tape or sheet is incorporated so that the surface of the abrasive powder layer can be in continuous contact with the roller electrode at a location different from the location where the roller electrode is in contact with the electrode of the chip electronic component. Chip electronic component inspection and sorting equipment 2. The chip according to claim 1, wherein the upper roller electrode terminal includes a roller electrode, and a roller electrode support that brings the roller electrode into contact with the electrode surface of the chip electronic component and rotatably supports the roller electrode in that state. Electronic parts inspection and sorting equipment. The upper roller electrode terminal accommodates roller rotating shaft holding means for rotatably holding the roller electrode, and the roller rotating shaft holding means, and the roller electrode held by the roller rotating shaft holding means is connected to the electrode surface of the chip electronic component. 2. A chip electronic component inspection and sorting apparatus according to claim 1, comprising a housing having resilient means that can be pressed against the chip electronic component inspection and sorting device. The upper roller electrode terminal is connected to roller rotating shaft holding means for rotatably supporting the roller electrode, and the roller electrode held by the roller rotating shaft holding means is connected to the roller rotating shaft holding means of the chip electronic component. 2. A chip electronic component inspection and sorting apparatus according to claim 1, having a structure provided with elastic means capable of being pressed against the electrode surface. 2. The chip electronic component inspection and sorting apparatus according to claim 1, wherein the abrasive powder of the abrasive powder layer is a fine particle powder of a rigid material selected from fine-particle diamond powder, aluminum oxide powder, and silicon carbide powder.

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