JPH09325172A - Inspection device and method for burn-in board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the efficiency of inspection and recovery process for a burn-in board by providing both of a test head part and a socket cleaning head part. SOLUTION: As both of a test head part 2 and a cleaning head part 3 are provided in the burn-in board inspection device 1 which are constituted to be selectively driven by a robot 5, cleaning process can be done for the socket 7 (contact pin 8) judged no good based on the test result with the head 2. Therefore, not like the conventional device which could only perform electric tests with the head 2, the inspection device 1 can perform automated cleaning processing so that the inspection and recovery process maintenance process) of the burn-in board 6 can be efficiently performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a burn-in board inspection device and a burn-in board inspection method, and more particularly to a burn-in board inspection device and a burn-in board for performing an electrical test on a burn-in board provided with a plurality of sockets having contact pins. Regarding board inspection method.

In general, a burn-in test is performed as one of reliability tests for semiconductor devices such as LSI. This burn-in test uses a burn-in board in which a plurality of sockets for mounting semiconductor devices are arranged, and after mounting the semiconductor device under test in the sockets, the burn-in board is placed in a test environment to perform a predetermined test. It is said that.

By the way, in recent years, as one of the reliability management of semiconductor devices such as LSIs, the inspection and management of the burn-in board itself have attracted attention. This is because, for example, when foreign matter (solder, solder alloy, dust, etc.) is attached to the contact pins of the socket arranged on the burn-in board, the semiconductor device itself is not defective, but the burn-in board is defective. This may cause the semiconductor device to be determined to be defective.

Therefore, it is important to inspect the burn-in board with high reliability in order to improve the reliability of the semiconductor device. Further, from the viewpoint of improving the inspection efficiency of the semiconductor device, it is important to promptly perform recovery (maintenance) processing when a defect is found in the burn-in board.

[0005]

2. Description of the Related Art Generally, a burn-in board is provided with a plurality of sockets having contact pins on a board and a card edge connector portion on a side edge of the board. The contact pins of each socket are formed on the board. The lead is pulled out to the card edge connector portion. Then, by connecting the card edge connector to the burn-in test device, each socket and the burn-in test device are electrically connected, and the semiconductor device mounted in each socket can be inspected.

Therefore, in the conventional burn-in board inspection, a test head portion configured to be connectable to contact pins arranged in a socket is used, and a test head portion and a card edge connector portion mounted on this connector are The burn-in board defect is detected by measuring the electrical resistance value during the period.

As described above, the defect of the burn-in board is detected by the electric resistance value between the test head part and the card edge connector part. Generally, the defect of the burn-in board is a foreign substance (solder, solder) attached to the contact pin. This is caused by alloys, dust, etc.), and when these foreign substances adhere to the contact pin, the electrical resistance of the contact pin increases.

On the other hand, a socket in which a defect has been detected by the burn-in board inspection needs to be restored (maintenance). However, as described above, a large number of sockets are provided on the burn-in board. This maintenance process is performed by the following procedure.

First, a test head portion is mounted on each socket arranged on the burn-in board as described above, an inspection is performed, and the inspection results obtained by this inspection are stored. At this time, in the manual inspection in which the inspection is performed manually, a drawing or the like corresponding to the burn-in board is prepared, and the inspection result is written in this drawing to perform the storage processing.

Further, in the automatic inspection apparatus in which the test head portion can be driven by a robot or the like, the position of the defective socket is printed by a printer or the like, and therefore the storage processing is performed by the printed paper. After the inspection of all the sockets arranged on the burn-in board is completed, the operator subsequently finds a defective socket among a large number of arranged sockets by looking at the stored drawings or the embossed paper, and detects this defect. Clean the socket.

This cleaning process has been performed by scraping off foreign matter (solder, solder alloy, dust, etc.) adhering to the contact pins by using, for example, a wiping sheet (cloth-like fine file).

[0012]

However, as described above, in the prior art, the burn-in board inspection and the maintenance processing for removing foreign matters were separate steps, so that the operator can detect the defective socket while looking at the inspection result. However, since the cleaning process has to be performed on top of this, the efficiency of the maintenance process is poor, and there is a risk that the cleaning process may be erroneously performed on a socket that does not require cleaning (a normal socket). There was a point.

Further, in the conventional burn-in board inspection, it is difficult to reflect the degree of failure detected by the inspection in the maintenance processing, and it is difficult to determine how much cleaning processing should be performed to obtain a good product. .
Therefore, there is a problem in that the cleaning process may be performed more than necessary, or conversely, the cleaning process may not be sufficiently performed and foreign matter may remain on the contact pin.

Further, in the conventional burn-in board inspection, the electrical resistance change of the contact pin can be detected, but the cause of the electrical resistance change cannot be detected. That is, the cause of the increase in the electrical resistance of the contact pin occurs not only when the foreign matter is attached but also when the contact pin is deformed and cannot be connected to the test head portion.

However, the deformation of the contact pin cannot be detected by the inspection using the test head portion,
Further, when the test head portion is attached to the socket having the deformed contact pin, the test head portion may be damaged. For this reason, conventionally, before the burn-in board is inspected by the test head unit, the operator visually performs the process of detecting the occurrence of deformation of the contact pin. Therefore, this also causes a problem that the inspection efficiency of the burn-in board is reduced.

The present invention has been made in view of the above points, and an object of the present invention is to provide a burn-in board inspection apparatus and a burn-in board inspection method that can accurately and efficiently perform a burn-in board inspection.

[0017]

The above-mentioned problems can be solved by taking the following means. In the burn-in board inspection device for performing an electrical test on a burn-in board having a plurality of sockets each having a contact pin, a test head unit connected to the contact pin to perform an electrical test. A socket cleaning head part having a cleaning head for performing a cleaning process on the contact pin; a moving means for relatively moving the test head part and the socket cleaning head part to the socket mounting position; A control means for driving and controlling the means, and driving the socket cleaning head portion to perform a cleaning process on the contact pin when a defect is detected in the contact pin based on a test result by the test head portion. Which is characterized by That.

According to a second aspect of the present invention, in the burn-in board inspection apparatus according to the first aspect, the control means corresponds to the degree of defect of the contact pin, and the drive amount of the socket cleaning head portion. It is characterized by controlling.

According to a third aspect of the present invention, in the burn-in board inspection apparatus according to the first aspect or the second aspect, the control unit again performs the test after the cleaning process by the socket cleaning head unit. An electrical test is performed by the head unit, and the cleaning process and the electrical test are repeatedly performed until a normal determination is made by the electrical test.

According to a fourth aspect of the present invention, in the burn-in board inspection device according to any one of the first to third aspects, an optical detecting means for detecting a defective shape of the contact pin is further provided. It is characterized by.

According to the invention of claim 5, in the burn-in board inspection apparatus according to any one of claims 1 to 4, the socket cleaning head portion has a plurality of cleaning heads having different cleaning functions. However, the control means selects the cleaning head corresponding to the defective state of the contact pin and performs the cleaning process based on the test result by the test head part.

According to a sixth aspect of the present invention, in the burn-in board inspection apparatus according to any of the first to fourth aspects, the socket cleaning head portion uses a wiping sheet as the cleaning head, and the wiping sheet is used. It is characterized in that an automatic exchange means for automatically exchanging the sheet when it deteriorates is provided.

Further, in the invention according to claim 7, in the burn-in board inspection device according to any one of claims 1 to 6, the socket cleaning head portion includes a head deterioration sensor for detecting dirt of the cleaning head. It is characterized by having.

Further, in the invention according to claim 8, when a defect is detected in the contact pin based on a test step of connecting a test head portion to the contact pin and performing an electrical test, and a test result in the test step. And a cleaning step of cleaning the contact pin by driving the socket cleaning head portion.

Each of the above means operates as follows.
According to the first and eighth aspects of the invention, the test head portion is connected to the contact pin to perform an electrical test.
Further, the socket cleaning head unit performs a cleaning process on the contact pin arranged in the socket. The test head portion and the socket cleaning head portion are moved to the position where the socket is to be subjected to the test and cleaning processing by the moving means.

Further, the control means drives and controls the test head portion and the socket cleaning head portion so as to move to the position of the socket where the test and cleaning processing is to be performed, as described above. Further, the control means drives the socket cleaning head portion to clean the contact pin when a defect is detected in the contact pin based on the test result of the test head portion.

As described above, by providing both the test head portion and the socket cleaning head portion, it is possible to perform the cleaning process on the defective socket (contact pin) based on the test result by the test head portion. Become. Therefore, with the burn-in board inspection device, it is possible to perform cleaning processing as well.
Burn-in board inspection and recovery processing can be performed efficiently.

According to the second aspect of the present invention, the control means controls the drive amount of the socket cleaning head portion in accordance with the degree of the defective contact pin. It is possible to prevent the cleaning process from ending even though foreign matter remains. Therefore, it is possible to perform the cleaning process according to the amount of foreign matter attached to the contact pin, and it is possible to improve the efficiency and accuracy of the cleaning process.

According to the third aspect of the present invention, the cleaning process by the socket cleaning head unit and the electrical test by the test head unit are repeatedly performed until the normal judgment is made. Therefore, it is possible to prevent the cleaning process from being performed more than necessary, and to prevent the cleaning process from ending due to the remaining foreign matter, and it is possible to improve the efficiency and accuracy of the cleaning process.

According to the invention described in claim 4, by providing the optical detecting means, it becomes possible to detect the defective shape of the contact pin. As a result, damage to the test head portion can be prevented, and the contact pin shape defect can be automatically detected without manual labor, so that the burn-in board inspection efficiency can be improved.

According to a fifth aspect of the invention, the socket cleaning head portion has a plurality of cleaning heads having different cleaning functions, and the contact pin has a defective state based on the test result by the test head portion. With the configuration in which the corresponding cleaning head is selected and used, it is possible to perform the cleaning process corresponding to the defective state of the contact pin, and it is possible to improve the efficiency of the cleaning process.

According to the invention of claim 6, a wiping sheet is used as the cleaning head provided in the socket cleaning head portion, and when the wiping sheet is deteriorated by the automatic exchanging means, the wiping sheet is automatically exchanged. As a result, it is possible to prevent the cleaning process from being performed by the cleaning head whose cleaning function has deteriorated, which also makes it possible to improve the efficiency of the cleaning process. Further, since it is not necessary to frequently replace the cleaning head, maintenance of the burn-in board inspection device can be facilitated.

Further, according to the invention of claim 7, by providing a head deterioration sensor in the socket cleaning head portion, it is possible to detect the contamination of the cleaning head. Therefore, the cleaning process is performed by the cleaning head whose cleaning function has deteriorated. Can be prevented, and the efficiency of the cleaning process can be improved.

[0034]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described with reference to the drawings. 1 to 3 are views for explaining a burn-in board inspection apparatus 1 which is a first embodiment of the present invention. FIG. 1 is an overall configuration diagram of a burn-in board inspection apparatus 1, and FIG. 2 is an enlarged view showing a test head unit 2 and a socket cleaning head unit 3 (hereinafter referred to as a cleaning head unit), and FIG. 3 will be described later. The inspection processing which inspection control device 4 performs is shown.

First, the overall structure of the burn-in board inspection apparatus 1 will be described with reference to FIG. The burn-in board inspection device 1 is roughly composed of a test head unit 2, a cleaning head unit 3, an inspection control device 4, a robot 5, and the like. This burn-in board inspection device 1
The contact pins 8 provided in a plurality of sockets 7 (only one is shown in FIG. 1 for convenience) arranged on the burn-in board 6 are electrically tested and cleaned as described later. It is configured to perform processing. Hereinafter, each constituent element of the burn-in board inspection apparatus 1 will be described.

The test head portion 2 has a structure in which a plurality of test pins 10 are arranged on a head base member 9 as shown in an enlarged view in FIG. 2 in addition to FIG. The head base member 9 is shaped so that it can be mounted in the socket 7 arranged on the burn-in board 6. Also, with the head base member 9 mounted in the socket 7, the test pin 10
Is connected to the contact pin 8.

The head base member 9 is connected to a robot 5, and the robot 5 allows the head base member 9 to move horizontally and vertically.
Therefore, the head base member 9 is configured to be attachable to each socket 7 arranged on the burn-in board 6 by the robot 5.

As shown in FIG. 2 in addition to FIG. 1, the cleaning head unit 3 has a structure in which a pair of rollers 12 and 13 are arranged on a support member 11, and the pair of rollers 12 and 13 is provided. The wiping sheet 14 is stretched over the sheet. The pair of rollers 12 and 13 and the wiping sheet 14 function as a cleaning head that performs a cleaning process on the contact pin 8.

At least one of the pair of rollers 12 and 13 is connected to a motor (not shown) and can be rotated by this motor. Therefore, when the rollers 12 and 13 are rotated by the motor, the wiping sheet 1 stretched between the pair of rollers 12 and 13 is stretched.
4 also rotates.

The wiping sheet 14 is a fine cloth-like file. The wiping sheet 14 is configured to come into contact with the contact pins 8 when the cleaning head unit 3 is mounted in the socket 7. Therefore, by mounting the cleaning head unit 3 on the socket 7, the wiping sheet 14 is brought into contact with the contact pin 8 on which foreign matter such as solder, solder alloy, dust, etc. is adhered, and is rotated as described above to contact the contact pin 8. The adhered foreign matter can be removed (rubbed off).

Further, the supporting member 11 to which the rollers 12 and 13 and the wiping sheet 14 are attached is connected to the robot 5, and the cleaning head portion 3 can be moved horizontally and vertically by the robot 5. ing. Therefore, the cleaning head unit 3 is mounted on the burn-in board 6 by the robot 5 by using the sockets 7.
On the other hand, the cleaning processing is possible.

The robot 5 serves as the moving means described in the claims, and is configured to be driven and controlled by the inspection control device 4. As described above, this robot 5 moves the test head unit 2 and the cleaning head unit 3 in the horizontal direction and the vertical direction, and attaches them to a predetermined socket 7 on the burn-in board 6 designated by the inspection control device 4. Function as.

The inspection control device 4 serves as the control means described in the claims, and is composed of a microcomputer. The inspection control device 4 is functionally composed of a test result determination unit 15 and a drive control unit 16. The test result determination unit 15 is connected to the test head unit 2 and a card edge connector unit (not shown) formed on the burn-in board 6, and determines the electric resistance value between the test head unit 2 and the card edge connector unit. To detect.

If foreign matter is attached to the contact pin 8, the electrical resistance value between the test head portion 2 and the card edge connector portion increases. Therefore, by detecting the electric resistance value between the test head portion 2 and the card edge connector portion, it is possible to determine whether or not foreign matter is attached to the contact pin 8. This test result determination unit 15
The determination result determined by is sent to the drive control unit 16.

The drive control unit 16 controls the drive of the motor provided in the cleaning head 3 and the drive control of the robot 5 based on the determination result sent from the test result determination unit 15. Specifically, the rotation speed of the motor is controlled to vary according to the magnitude of the electrical resistance value between the test head unit 2 and the card edge connector unit, and the test head unit 2 and the cleaning head 3 are selectively connected to a predetermined connector 7. To be attached to.

Next, in the burn-in board inspecting apparatus 1 having the above-mentioned configuration, the inspection processing for the burn-in board 6 executed by the inspection control apparatus 4 will be described. FIG. 3 is a flowchart showing the inspection process executed by the inspection control device 4. When the inspection process shown in the drawing is activated, first, at step 20, the drive control unit 16 of the inspection control device 4 drives the robot 5 to drive the test head unit 2 and the cleaning head 3 of the socket 7 to be tested. Move to the top.

In the following step 28, the drive control section 16 drives the robot 5 and first mounts the test head section 2 in the socket 7. As described above, by mounting the test head unit 2 in the socket 7, the test pins 10 arranged in the test head unit 2 are connected to the contact pins 8 of the socket 7. In addition, the card edge connector portion formed on the burn-in board 6 is previously tested by the test result determination unit 15
It is connected to the.

In the following step 30, the test result judging unit 1
5, an electrical test for detecting the electrical resistance value R between the test head portion 2 and the card edge connector portion is performed. The electrical resistance value R obtained in step 30 has a correlation with the amount of foreign matter attached to the contact pin 8. That is, the larger the amount of foreign matter attached, the larger the electric resistance value R, and conversely, the smaller the amount of foreign matter attached, the smaller the electric resistance value R. Therefore, depending on the electric resistance value R, the contact pin 8
It is possible to detect the amount of foreign matter attached to the.

In this embodiment, the first reference resistance value R ₀ for determining whether or not the contact pin 8 needs to be cleaned, and whether or not the contact pin 8 needs a strong cleaning process (strong cleaning process), Alternatively, the second reference resistance value R ₁ for determining whether or not the normal cleaning process (normal cleaning process) is sufficient is set, and step 30 is performed.
The processing is changed based on the magnitude of the electric resistance value R obtained in step.

That is, at step 32, whether the electric resistance value R obtained at step 30 is the second reference resistance value R ₁ or more (R ≧ R ₁ ), or the first reference resistance value R ₀ or more. Is the second reference resistance value less than R ₁ (R ₀ ≦ R <
R ₁ ), is less than the first reference resistance value R ₀ (R <R
₀ ) is determined.

When it is determined in step 32 that the electric resistance value R obtained in step 30 is equal to or larger than the second reference resistance value R ₁ (R ≧ R ₁ ), a large amount of foreign matter is attached to the contact pin 8. It is the case where is attached. In this case, it is necessary to perform strong cleaning processing on the contact pin 8.

Therefore, when it is determined that R ≧ R ₁ ,
The process proceeds to step 34, where the drive control unit 16 drives the robot 5 to disengage the test head unit 2 from the socket 7 and attach the cleaning head 3 to the socket 7. Then, in the following step 36, the drive controller 16 controls the drive of the motor provided in the cleaning head 3 so that the motor rotates at high speed. As a result, the rotation speed of the wiping sheet 14 arranged on the cleaning head 3 is increased, and a strong cleaning process that removes foreign matter strongly is performed.

On the other hand, in step 32, step 3
The electric resistance value R obtained at 0 is the first reference resistance value R ₀
As described above, it is less than the second reference resistance value R ₁ (R ₀ ≦ R <R
_{If the result is 1} ), it is not so much as described above, but there is foreign matter attached to the contact pin 8 to the extent that it affects the burn-in test. In this case, it is necessary to perform a weak cleaning process on the contact pin 8.

Therefore, when it is determined that R ₀ ≤R <R ₁ , the process proceeds to step 38, where the drive control unit 16 drives the robot 5 to disengage the test head unit 2 from the socket 7. Together with the cleaning head 3
To the socket 7. Then, in the following step 40, the drive control unit 16 controls the drive of the motor provided in the cleaning head 3 so that the motor is rotated in the middle direction. As a result, the rotation speed of the wiping sheet 14 disposed on the cleaning head 3 becomes lower than that at the time of performing step 36, and the normal cleaning process having a normal removal force for foreign matters is performed.

The strong cleaning process carried out in step 36 and the normal cleaning process carried out in step 40 are carried out for a preset time. Then, when the cleaning process in step 36 or step 40 is completed, the process is performed again in step 28.
Returning to step 30, the electrical test using the test head unit 2 in steps 30 and 32 is performed, and when it is determined that the electrical resistance value R is R ≧ R ₀ in step 32, step 34 is performed depending on the magnitude of the electrical resistance value R. , 36 or steps 38, 4
The processing of 0 is executed.

In this repeated processing, the electric resistance value R is
The process is repeated until it is determined in step 32 that the resistance value is less than the first reference resistance value R ₀ (R <R ₀ ). That is, steps 28 to 40 are repeatedly executed until it is determined that the contact pin 8 does not need to be cleaned. Then, in step 32, R <R
_If it is determined to be ₀ , the inspection process of this time is once ended, and then the above-described inspection process is performed on the other sockets 7 arranged on the burn-in board 6.

As described above, in the burn-in board inspection apparatus 1 according to the present embodiment, the test head unit 2 and the cleaning head unit 3 are both provided, and the robot 5 can selectively drive the test head unit 2 and the cleaning head unit 3 to perform the test. Based on the test result by the head unit 2, the cleaning process can be performed on the socket 7 (contact pin 8) that is determined to be defective in step 32.

Therefore, unlike the conventional apparatus that can only perform the electrical test by the test head unit 2, the burn-in board inspection apparatus 1 according to the present embodiment can also perform the cleaning process automatically. Therefore, the inspection and restoration process (maintenance process) of the burn-in board 6 can be efficiently performed.

Further, in this embodiment, steps 32 to 40 are performed.
By the processing described above, the wiping sheet 1 provided on the cleaning head unit 3 in accordance with the degree of failure of the contact pin 8 (that is, the amount of foreign matter attached to the contact pin 8).
Since the rotation speed of No. 4 is controlled, it is possible to prevent the cleaning process from being performed more than necessary, and to prevent the cleaning process from ending even if foreign matter remains.

Therefore, it becomes possible to carry out the cleaning process depending on the amount of foreign matter adhered to the contact pin 8, so that the efficiency of the cleaning process and the cleaning accuracy can be improved. Further, in the present embodiment, after the cleaning process of steps 34 to 40 is completed, the process is returned to step 28. Therefore, the cleaning process by the cleaning head unit 3 and the electrical test by the test head unit 2 are performed by the step It is repeatedly performed until the normality determination (R <R ₀ ) is performed in 32.

Therefore, it is possible to prevent the cleaning process from being performed more than necessary, and to prevent the cleaning process from ending even if foreign matter remains, so that the efficiency and accuracy of the cleaning process can be improved. Next, a second embodiment of the present invention will be described.

FIGS. 4 and 5 are views for explaining a burn-in board inspection apparatus 1A according to the second embodiment of the present invention. FIG. 4 is an overall configuration diagram of the burn-in board inspection device 1A, and FIG. 5 shows an inspection process executed by the inspection control device 4A. In addition, in FIGS. 4 and 5, FIG.
Burn-in board inspection apparatus 1 according to the first embodiment shown in FIG.
The same configurations as those of the above are denoted by the same reference numerals, and the same processes are denoted by the same number of steps and the description thereof is omitted.

The burn-in board inspection apparatus 1A according to the present embodiment is characterized in that the burn-in board inspection apparatus 1 of the first embodiment described above is further provided with a television head 17. This TV head 17 has, for example, a CC
A TV camera 18 using D is provided. Also,
The TV head 17 is connected to the robot 5 and configured to be movable in the horizontal direction and the vertical direction. Therefore, the TV camera 18 is configured to allow the robot 5 to image each socket 7 arranged on the burn-in board 6. Has been done.

Further, the inspection control device 4A is provided with an image determination section 19 connected to the television camera 18.
The image determination unit 19 stores in advance the normal shape of the contact pin 8 as data (referred to as normal shape data). Therefore, the image determination unit 19 determines the normal shape data and the contact pin 8 imaged by the television camera 18.
The shape data (referred to as imaging data) is compared and the determination result is sent to the drive control unit 16. The television camera 18 and the image determination unit 1 described above
Reference numeral 9 serves as the optical detection means described in the claims.

Next, in the burn-in board inspecting apparatus 1A having the above-mentioned configuration, the inspection process for the burn-in board 6 executed by the inspection control apparatus 4A will be described. FIG. 5 is a flowchart showing the inspection process executed by the inspection control device 4A. The inspection process shown in FIG.
In contrast to the inspection process according to the first embodiment described by using the above, steps 22 to 26 are newly provided. Therefore, in the following description, only steps 22 to 26 newly added in this embodiment will be described.

In step 20, the drive control section 16 of the inspection control apparatus 4 drives the robot 5 to move the test head section 2, the cleaning head 3, and the television head 17 to the upper portion of the socket 7 to be tested. Then, the TV head 17 is first moved to a predetermined image pickup position of the socket 7.

Subsequently, in step 22, the contact pin 8 arranged in the socket 7 is imaged by the TV camera 18 provided in the TV head 17. The imaged data of the contact pin 8 taken by the television camera 18 is transmitted to the image determination unit 19, and the image determination unit 19 performs comparison processing with the normal shape data which is the normal shape data of the contact pin 8 stored in advance. Be told (Step 2
4).

If it is determined in step 24 that the imaging data and the normal shape data match, that is, if the shape of the contact pin 8 is normal, the inspection control device 4A. Performs the processing described in the first embodiment after step 28.

On the other hand, if it is determined in step 24 that the image data and the normal shape data do not match, that is, if the shape of the contact pin 8 is abnormal, the process proceeds to step 26. Then, the alarm for notifying the operator that the shape of the contact pin 8 is abnormal is activated and the inspection process this time is ended.

Therefore, when an abnormality is detected in step 24, the test head unit 2 after step 28
Electrical test process using the cleaning head unit 3
The cleaning process using is not performed.
As described above, the contact pin 8 is set by using the television camera 18 prior to the electrical test process using the test head unit 2.
The shape of the contact pin 8 is inspected, and the electrical test process is not performed when the shape of the contact pin 8 is abnormal. Therefore, the deformed contact pin 8 may damage the test head portion 2 in advance. Can be prevented.

Since the defective shape of the contact pin 8 can be automatically detected without manual labor, the burn-in board 6
The inspection efficiency can be improved, and the inspection does not vary due to the experience of the operator.
The accuracy of inspection can be improved.

Next, various structures of the cleaning head portion will be described with reference to FIGS. 6 to 9. The cleaning head unit 3A shown in FIG. 6 is characterized in that the head deterioration sensor 20 is provided in the cleaning head unit 3 shown in the first and second embodiments. The head deterioration sensor 20 is a photointerrupter including a light emitting unit 20a and a light receiving unit 20b arranged with the wiping sheet 14 interposed therebetween.

As described above, the wiping sheet 14 is a fine-mesh cloth member, and is in a state in which light can pass therethrough at the start of use. However, if the foreign matter adhering to the contact pin 8 is removed, the foreign matter adheres to the wiping sheet 14 over time, resulting in clogging.

When the eyes of the wiping sheet 14 are clogged in this way, the light emitted from the light emitting section 20a is blocked by the wiping sheet 14 and cannot be received by the light receiving section 20b. Therefore, the dirt of the wiping sheet 14 can be detected by the signal output from the head deterioration sensor 20.

Therefore, when the head deterioration sensor 20 detects the dirt of the wiping sheet 14, the cleaning process is continued by the wiping sheet 14 whose cleaning function has deteriorated by, for example, activating an alarm. Can be prevented, and the efficiency of the cleaning process can be improved.

Further, the cleaning head portion 3 shown in FIG.
B is characterized in that a plurality of (three in the figure) cleaning heads 21 to 23 having different cleaning functions are provided. Each of the cleaning heads 21 to 23 is a file having a cylindrical shape, and its roughness is such that the cleaning head 21 is rough, the cleaning head 23 is fine, and the cleaning head 22 is intermediate between the cleaning heads 21 and 23. It is set. In addition, each cleaning head 21-2
The support member 11 </ b> A for supporting 3 is configured to be rotatable by the robot 5 as indicated by an arrow in the figure, and thus the cleaning heads 21 to 23 can be selectively used.

As described above, by providing the cleaning head portion 3B with a plurality of cleaning heads 21 to 23 having different cleaning functions, the test head portion 2
It is possible to select and use the cleaning head that is most suitable for the defective state of the contact pin 8 from the plurality of cleaning heads 21 to 23 based on the test result of 1. Therefore, it is possible to perform the cleaning process corresponding to the defective state of the contact pin 8, and the efficiency of the cleaning process can be improved.

Further, the cleaning head portion 3 shown in FIG.
C is characterized by using a disk-shaped file as the cleaning head 24. In each of the embodiments described above, the socket 7 is a DIP (Dual In-lin).
Although the description has been made by taking the ePckage) type semiconductor device as an example, the socket 7A for mounting the QFP (Quad Flat Pckage) type semiconductor device has a contact pin 8A as shown in FIG. Is configured to project upward. Then, the foreign matter adheres to the upper tip of the contact pin 8A.

Therefore, the cleaning process cannot be performed on the socket 7A having the contact pin 8A protruding upward as described above by the cleaning head portions 3, 3A to 3C having the above-described configuration. However, Figure 8
As shown in FIG. 6, by using a disk-shaped file, it is possible to clean the tip of the contact pin 8A protruding upward, and therefore, the socket 7A for mounting the QFP type semiconductor device can also be cleaned. It is possible to apply the burn-in board inspection device 1, 1A according to the invention. The cleaning process by the cleaning head unit 3C is performed by rotating the cleaning head 24.

Further, the cleaning head unit 3 shown in FIG.
D is a wiping sheet 14 as a cleaning head.
A is used and an automatic exchange device 25 (automatic exchange means) is provided.
4A is configured to be automatically replaceable.

In the present embodiment, the wiping sheet 14A is wound around the supply reel 26 and the guide rollers 27-2.
It is configured to be wound around the take-up reel 30 while being guided by 9. A take-up motor 31 is connected to the take-up reel 30, and by driving the take-up motor 31, the wiping sheet 14A is supplied to the supply reel 2.
It is configured to be wound around the take-up reel 30 from 6.

On the other hand, a head deterioration sensor 20 as described with reference to FIG. 6 is provided at a predetermined position facing the wiping sheet 14A. The head deterioration sensor 20 and the winding motor 31 are the inspection control devices 4 and 4A.
When the inspection control devices 4 and 4A judge that the wiping sheet 14A is deteriorated (the eyes are clogged) by the output signal of the head deterioration sensor 20, the winding motor 31 is driven to move the wiping sheet 14A to a desired position. Move a fixed amount.

With the above structure, it is possible to prevent the cleaning process from being continued by the wiping sheet 14A whose cleaning function has deteriorated, and to improve the efficiency of the cleaning process. Further, since it is not necessary to frequently replace the wiping sheet 14A (cleaning head), the burn-in board inspection apparatus 1
Maintenance of 1A can be facilitated.

In the above embodiment, the robot 5 is used as the moving means and the heads 2, 3, 17 are moved, but the moving means may move the burn-in board 6.

[0085]

As described above, according to the present invention, various effects described below can be realized. According to the inventions of claims 1 and 8, the cleaning process can be performed by the burn-in board inspection device, and the burn-in board inspection and restoration process can be efficiently performed.

According to the second aspect of the invention, it is possible to carry out the cleaning process according to the amount of foreign matter attached to the contact pin, so that the efficiency and accuracy of the cleaning process can be improved. . Claim 3
According to the invention described above, it is possible to prevent the cleaning process from being performed more than necessary, and to prevent the cleaning process from ending even if foreign matter remains, thus making it possible to improve the efficiency and accuracy of the cleaning process.

According to the fourth aspect of the invention, since the defective shape of the contact pin can be detected by providing the optical detecting means, damage to the test head portion can be prevented. In addition, since the contact pin shape defect can be automatically detected without manual labor, the burn-in board inspection efficiency can be improved.

According to the fifth aspect of the invention, it is possible to perform the cleaning process corresponding to the defective state of the contact pin, and it is possible to improve the efficiency of the cleaning process. According to the invention of claim 6, it is possible to prevent the cleaning process from being performed by the cleaning head whose cleaning function has deteriorated, to improve the efficiency of the cleaning process, and to frequently perform the replacement process of the cleaning head. The burn-in board inspection device can be easily maintained because the burn-in board inspection device is eliminated.

Further, according to the invention of claim 7, it is possible to detect the contamination of the cleaning head, so that it is possible to prevent the cleaning head from having the cleaning function deteriorated, and to improve the efficiency of the cleaning processing. Can be planned.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a burn-in board inspection device that is a first embodiment of the present invention.

FIG. 2 is an enlarged perspective view showing a test head unit and a cleaning head unit.

FIG. 3 is a flowchart showing an inspection process executed by an inspection control device in the first embodiment.

FIG. 4 is a configuration diagram of a burn-in board inspection device that is a second embodiment of the present invention.

FIG. 5 is a flowchart showing an inspection process executed by the inspection control device in the second embodiment.

FIG. 6 is an enlarged perspective view showing a cleaning head portion provided with a head deterioration sensor.

FIG. 7 is an enlarged perspective view showing a cleaning head unit having a plurality of cleaning heads having different cleaning functions.

FIG. 8 is an enlarged perspective view showing a cleaning head portion having a cleaning head corresponding to a QFP socket.

FIG. 9 is an enlarged perspective view of a cleaning head unit provided with an automatic wiping sheet exchange device.

[Explanation of symbols]

 1,1A Burn-in board inspection device 2 Test head part 3,3A, 3B, 3C, 3D Cleaning head part 4,4A Inspection control device 5 Robot 6 Burn-in board 7,7A socket 8,8A Contact pin 10 Test pin 14,14A Wiping Seat 15 Test result determination unit 16 Drive control unit 17 Television head 18 Television camera 19 Image determination unit 20 Head deterioration sensor 21-24 Cleaning head 25 Automatic exchange device 31 Winding motor

Claims (8)

[Claims] 1. A burn-in board inspection device for performing an electrical test on a burn-in board having a plurality of sockets each having a contact pin, the test head unit being connected to the contact pin to perform an electrical test, and the contact. A socket cleaning head unit having a cleaning head for performing a cleaning process on a pin, a moving unit that relatively moves the test head unit and the socket cleaning head unit to a mounting position of the socket, and a driving unit for driving the moving unit. And a control unit that controls the socket cleaning head unit to clean the contact pin when a defect is detected in the contact pin based on the test result of the test head unit. Characteristic burn-in bow Inspection equipment. 2. The burn-in board inspection apparatus according to claim 1, wherein the control means controls the drive amount of the socket cleaning head portion in accordance with the degree of defect of the contact pin. Board inspection device. 3. The burn-in board inspection device according to claim 1, wherein the control unit performs an electrical test again by the test head unit after the cleaning process by the socket cleaning head unit. A burn-in board inspection apparatus, wherein the cleaning process and the electrical test are repeatedly performed until a normal determination is made by the electrical test. 4. The burn-in board inspection device according to claim 1, further comprising optical detection means for detecting a defective shape of the contact pin. 5. The burn-in board inspection apparatus according to claim 1, wherein the socket cleaning head unit has a plurality of cleaning heads having different cleaning functions, and the control unit has the test head. A burn-in board inspection apparatus, wherein the cleaning head is selected to perform a cleaning process corresponding to a defective state of the contact pin based on a test result by the section. 6. The burn-in board inspection device according to claim 1, wherein the socket cleaning head portion uses a wiping sheet as the cleaning head, and automatically replaces the wiping sheet when it deteriorates. A burn-in board inspection device, characterized in that it is provided with an automatic replacement means. 7. The burn-in board inspection device according to claim 1, wherein the socket cleaning head portion has a head deterioration sensor for detecting dirt on the cleaning head. apparatus. 8. A test process in which a test head unit is connected to a contact pin to perform an electrical test, and when a defect is detected in the contact pin based on a test result in the test process, the socket cleaning head unit is A burn-in board inspection apparatus, comprising: a cleaning step of driving and cleaning the contact pin.