JP2008177231A - Method and apparatus for automatic probe inspection - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To eliminate the need for manual inspection, after inspection as much as possible, in an automatic set-up type probe apparatus. <P>SOLUTION: The method has a step of executing probe inspection for one among a plurality of modules to be inspected with a probe needle contacting an electrode pad; a step of comparing a measured inspection value, with a previously set determination value and making determination; a step of photographing a needle locus due to the probe needle formed on the electrode pad, when the determination result shows an abnormal value that deviates from the determined value and recording the image; a step of comparing a photographed image with a previously prepared normal image for determination; and a step of repeating the above steps beginning with the probe inspection step after correcting the position, where the probe needle contacts the electrode pad when a determination result shows deviation from the permissible range of a normal image. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an auto probe inspection method and an auto probe inspection apparatus, and more particularly to an auto probe inspection method and an auto probe inspection apparatus using the same for automatically inspecting an object to be inspected comprising a semiconductor wafer or a liquid crystal display substrate. About.

  For example, a plurality of modules to be inspected regularly arranged at predetermined intervals, for example, semiconductor chips are formed on the main surface of the semiconductor wafer, which is an object to be inspected. Electrode pads are arranged. For the probe inspection performed before being divided for each semiconductor chip, a probe device capable of bringing a probe needle into contact with each electrode pad in a wafer state is used. Various kinds of automation have been promoted for this type of probe apparatus in order to improve the efficiency of the inspection process. In particular, as the number of semiconductor chips to be inspected increases as the diameter of the wafer increases, there is an increasing demand for complete unmanned operation.

  One of the challenges to complete unmanned operation is the increase in the density and integration of semiconductor chips, and the gap between the electrode pads becomes smaller, which makes it difficult for the probe needles to contact the electrode pads. Can be mentioned. Furthermore, in the case of probe inspection performed in a low temperature state or a high temperature state, there is a problem that a probe needle contact failure occurs due to contraction or expansion of the probe needle. The following countermeasures have been proposed for such poor probe needle contact (see, for example, Patent Document 1).

  Hereinafter, the auto probe inspection method disclosed in Patent Document 1 will be described with reference to FIG.

  Using the auto setup type probe device, the test object is automatically placed on the wafer mounting table one by one and aligned, and the probe needle is brought into contact with the electrode pad arranged on the test object to perform the probe test. To do. Subsequently, at least the first semiconductor chip is inspected by optically detecting the needle trace generated in the electrode pad at the time of probe inspection, and inspecting whether or not the needle trace is within the allowable range of the electrode pad. If the needle trace inspection result is within the allowable range, the second and subsequent semiconductor chips are inspected as they are. If the needle trace inspection result is not within the allowable range, an alarm is issued and the probe inspection proceeds. To stop.

By such a method, it is possible to avoid contact failure of the probe needle before outputting the probe inspection result.
JP 7-147304 A

  However, in the conventional probe inspection method, even if the alignment between the electrode pad and the probe needle is accurately performed before the probe inspection is performed, the thermal expansion or contraction of the wafer or the probe needle due to the temperature change of the probe apparatus. As a result, fluctuations due to the above, and foreign matter adherence to the needle tip and wear of the needle tip when the inspection is continuously performed occur. Furthermore, there is a problem in that a normal inspection result cannot be obtained due to a contact failure of the probe needle with respect to the electrode pad due to a change in the position of the wafer or the contact position of the probe needle due to erroneous recognition of automatic alignment.

  Further, conventionally, when an abnormality occurs in the inspection value after the probe inspection is completed, it is necessary to inspect the inspection object manually using a microscope, and there is a problem that a great number of man-hours are generated.

  In view of the above, an object of the present invention is to realize automation of probe inspection by eliminating human labor as much as possible.

  In order to achieve the above object, the present invention provides an auto probe inspection method that determines whether or not the inspection result of the probe inspection is a normal value. If the inspection result is not a normal value, the needle trace is applied to the contacted electrode pad. By storing the image as an image, the configuration is such that the operation of checking the needle trace by a hand (microscope) after the probe inspection is completed can be omitted.

  Further, after correcting the contact position of the probe needle, the coordinate position of the object to be inspected, or the coordinate position of the probe card, the probe inspection is performed again, thereby eliminating the need for manpower.

  Specifically, the first auto-probe inspection method according to the present invention uses each auto-setup probe device to measure each module to be inspected in an inspected object having a plurality of modules to be inspected each having an electrode pad formed thereon. A first step of subjecting an auto probe inspection method for measuring electrical characteristics to probe inspection of one of the plurality of modules to be inspected with a probe needle in contact with an electrode pad; The second step of determining by comparing the inspection value measured in the first step and a preset determination value, and the determination result in the second step is an abnormal inspection value deviating from the determination value. A third step of photographing a needle trace by a probe needle formed on the pad and recording the image, an image photographed in the third step, and a normal image prepared in advance When the determination result in the fourth step and the determination result in the fourth step are out of the normal image allowable range, the contact position of the probe needle with respect to the electrode pad is corrected, and then the first step is repeated from the first step. When the determination result in the fourth step is within an allowable range, the fifth step is provided with a sixth step which is repeated from the first step after shifting to another module to be inspected.

  According to the first auto probe inspection method, when the determination result in the fourth step is out of the allowable range of the normal image, the contact position of the probe needle with respect to the electrode pad is corrected, and then the probe inspection in the first step is repeated. Therefore, automation of probe inspection can be realized without human intervention.

  The first auto-probe inspection method preferably further includes a blow cleaning step for cleaning the probe needle by blowing gas onto the probe needle between the fourth step and the fifth step.

  The first auto-probe inspection method preferably further includes a polishing cleaning step for cleaning the probe needle by polishing the probe needle between the fourth step and the fifth step.

  The second auto-probe inspection method according to the present invention uses an auto setup type probe device to determine the electrical characteristics of each inspected module in an inspected object having a plurality of inspected modules each formed with an electrode pad. A first step of performing a probe inspection on one module to be inspected among a plurality of modules to be inspected in a state in which a probe needle is in contact with an electrode pad, with respect to an auto probe inspection method to be measured, and a first step The second step of determining by comparing the inspection value measured in step 2 with a preset determination value, and the coordinates of the object to be inspected when the determination result in the second step is an abnormal inspection value that deviates from the determination value The third step of measuring and recording the position is compared with the coordinate position of the inspection object recorded in the third step and the coordinate position of the normal inspection object prepared in advance. And a fifth step that repeats from the first step after correcting the coordinate position of the object to be inspected when the determination result in the fourth step is out of the allowable range of the coordinate position of the normal object to be inspected. When the determination result in the fourth process is within an allowable range, the process includes a sixth process that is repeated from the first process after shifting to another module to be inspected.

  According to the second auto-probe inspection method, when the determination result in the fourth step is out of the allowable range of the coordinate position of the normal inspection object, the coordinate position of the inspection object is corrected, and the process is repeated from the first step. Therefore, automation of probe inspection can be realized without human intervention.

  The third auto-probe inspection method according to the present invention uses an auto setup type probe device to determine the electrical characteristics of each inspected module in an inspected object having a plurality of inspected modules each formed with an electrode pad. A first step of performing a probe inspection on one module to be inspected among a plurality of modules to be inspected in a state in which a probe needle is in contact with an electrode pad, with respect to an auto probe inspection method to be measured, and a first step The coordinate position of the probe card when the inspection value measured in step 2 and the determination value set in advance are compared, and the determination result in the second step is an abnormal inspection value that deviates from the determination value. The third step of measuring and recording the coordinates of the probe card recorded in the third step and the coordinates of the normal probe card prepared in advance The fourth step of comparing the position of the probe card and the determination result of the fourth step is out of the allowable range of the coordinate position of the normal probe card. After correcting the coordinate position of the probe card, the first step A fifth process that repeats, and a sixth process that repeats from the first process after shifting to another module to be inspected when the determination result in the fourth process is within an allowable range, are provided.

  According to the third auto probe inspection method, when the determination result in the fourth step is out of the allowable range of the coordinate position of the normal probe card, after correcting the coordinate position of the probe card, the process repeats from the first step. Automation of probe inspection can be realized without human intervention.

  In the first to third auto probe inspection methods, probe inspection is performed on at least two of the plurality of modules to be inspected in the first step, and at least two modules to be inspected in advance in the second step. The needle remaining in the electrode pad when compared with the set determination value and in the third step, when the determination result in the second step is an abnormal inspection value that deviates from the determination value in at least two modules to be inspected. It is preferable to take a mark and record the image.

  A fourth auto-probe inspection method according to the present invention uses an auto setup type probe device to determine the electrical characteristics of each inspected module in an inspected object having a plurality of inspected modules each formed with an electrode pad. A first step of performing a probe inspection on one module to be inspected among a plurality of modules to be inspected in a state in which a probe needle is in contact with an electrode pad, with respect to an auto probe inspection method to be measured, and a first step Formed in the electrode pad when the determination value in the second step is an abnormal inspection value that deviates from the determination value by comparing the inspection value measured in step 2 with the predetermined determination value. A third step and a second step which are repeated from the first step by moving to another module to be inspected after photographing the needle trace by the probe needle and recording the image If definitive determination result is normal test value, after shifting to another inspection module, characterized in that it comprises a fourth step of repeating from the first step.

  According to the fourth auto-probe inspection method, when the determination result in the second step is an abnormal inspection value that deviates from the determination value, the needle trace by the probe needle formed on the electrode pad is photographed and the image is recorded. Thereafter, the process proceeds to another module to be inspected. For this reason, after the probe inspection is completed, it is only necessary to confirm an image recorded with a needle trace indicating an abnormal inspection value, and it is not necessary to confirm the needle trace with a microscope. Man-hours can be greatly reduced.

  A fifth auto-probe inspection method according to the present invention uses an auto setup type probe device to determine the electrical characteristics of each module to be inspected in a test object having a plurality of modules to be inspected each having an electrode pad formed thereon. A first step of performing a probe inspection on one module to be inspected among a plurality of modules to be inspected in a state in which a probe needle is in contact with an electrode pad, with respect to an auto probe inspection method to be measured, and a first step Formed in the electrode pad when the determination value in the second step is an abnormal inspection value that deviates from the determination value by comparing the inspection value measured in step 2 with the predetermined determination value. The third process, which captures the needle trace from the probe needle and records the image, compares the image captured in the third process with a normal image prepared in advance. The fourth step to be determined, the fifth step for issuing an alarm and stopping the progress of the probe inspection when the determination result in the fourth step is outside the allowable range of the normal image, and the determination result in the fourth step When it is within the permissible range, after moving to another module to be inspected, the sixth step is repeated from the first step.

  According to the fifth auto-probe inspection method, when the determination result in the second step is an abnormal inspection value that deviates from the determination value, the needle trace by the probe needle formed on the electrode pad is photographed and the image is recorded. . Thereafter, the recorded image is compared with a normal image prepared in advance to make a determination. When the determination result is out of the allowable range of the normal image, an alarm is issued and the progress of the probe inspection is stopped. For this reason, it is not necessary to confirm the needle trace by the microscope only by confirming the image in which the needle trace indicating the abnormal inspection value is recorded, so that the man-hour required for confirming the needle trace can be greatly reduced.

  A first auto-probe inspection apparatus according to the present invention is directed to an auto-probe inspection apparatus that measures the electrical characteristics of each module to be inspected in a test object having a plurality of modules to be inspected each having an electrode pad formed thereon. The inspection means for performing the probe inspection on the module to be inspected in a state where the probe needle is in contact with the electrode pad, and the inspection determined by comparing the inspection value measured by the inspection means with a preset determination value A value comparison unit, and an image recording unit that captures an image of a needle trace formed by the probe needle formed on the electrode pad and records the image when the determination result in the inspection value comparison unit is an abnormal inspection value that deviates from the determination value. The image comparison determination means for comparing the image photographed by the image recording means with a normal image prepared in advance, and the image comparison determination means If the kick determination result is out of the allowable range of the normal image, characterized in that it comprises a contact position correcting means for correcting a contact position of the probe needle with respect to the electrode pads.

  According to the first auto-probe inspection apparatus, the determination result in the image comparison / determination means for comparing and determining an image obtained by comparing a normal image with an image obtained by capturing a probe trace formed on the probe needle on the electrode pad is acceptable for the normal image. Since the contact position correction means for correcting the contact position of the probe needle with respect to the electrode pad when it is out of the range, the contact position of the probe needle on the electrode pad is corrected by the contact position correction means, and then again by the inspection means. When probe inspection is performed, automation of probe inspection can be realized without human intervention.

  The first auto-probe inspection apparatus preferably further includes blow means for cleaning the probe needle by blowing gas onto the probe needle.

  Moreover, it is preferable that the first auto-probe inspection apparatus further includes needle tip polishing means for cleaning the probe needle by polishing the probe needle.

  A second auto-probe inspection apparatus according to the present invention is directed to an auto-probe inspection apparatus that measures the electrical characteristics of each module to be inspected in an object to be inspected having a plurality of modules to be inspected each having an electrode pad formed thereon. The inspection means for performing the probe inspection on the module to be inspected in a state where the probe needle is in contact with the electrode pad, and the inspection determined by comparing the inspection value measured by the inspection means with a preset determination value When the determination result in the value comparison means and the inspection value comparison means is an abnormal inspection value deviating from the determination value, the coordinate position recording means for measuring and recording the coordinate position of the object to be inspected, and the coordinate position recording means Coordinate position comparison and determination means for comparing the coordinate position of the inspected object and the coordinate position of a normal inspection object prepared in advance, and the coordinate position comparison If the judgment result in the constant means is out of the allowable range of the coordinate position of a normal object to be inspected, characterized by comprising a coordinate position correcting means for correcting the coordinate position of the device under test.

  According to the second auto-probe inspection apparatus, the determination result in the coordinate position comparison / determination means for determining by comparing the coordinate position of the inspection object and the coordinate position of the normal inspection object is the coordinate position of the normal inspection object. Since the coordinate position correcting means for correcting the coordinate position of the object to be inspected is provided when it is outside the allowable range, the probe position is corrected again by the inspection means after correcting the coordinate position of the object to be inspected by the coordinate position correcting means. If this is done, automation of probe inspection can be realized without human intervention.

  A third auto-probe inspection apparatus according to the present invention is directed to an auto-probe inspection apparatus that measures electrical characteristics of each module to be inspected in an object to be inspected having a plurality of modules to be inspected each having an electrode pad formed thereon. The inspection means for performing the probe inspection on the module to be inspected in a state where the probe needle is in contact with the electrode pad, and the inspection determined by comparing the inspection value measured by the inspection means with a preset determination value When the determination result in the value comparison means and the inspection value comparison means is an abnormal inspection value deviating from the determination value, the coordinate position recording means for measuring and recording the coordinate position of the probe card and the coordinate position recording means A coordinate position comparison and determination method for comparing the coordinate position of the probe card with the coordinate position of a normal probe card prepared in advance. If, when the judgment result at the coordinate position comparing determining means is out of the allowable range of the coordinate position of the normal probe card, and a coordinate position correcting means for correcting the coordinate position of the probe card.

  According to the third auto-probe inspection apparatus, the determination result in the coordinate position comparison / determination means for determining by comparing the coordinate position of the probe card with the coordinate position of the normal probe card is an allowable range of the coordinate position of the normal probe card. Since the coordinate position correcting means for correcting the coordinate position of the probe card when it is out of the range, the coordinate position of the probe card is corrected by the coordinate position correcting means and then the probe inspection is performed again by the inspection means. It is possible to realize automation of probe inspection without going through.

  A fourth auto-probe inspection apparatus according to the present invention is directed to an auto-probe inspection apparatus that measures electrical characteristics of each module to be inspected in an object to be inspected having a plurality of modules to be inspected each having an electrode pad formed thereon. The inspection means for performing the probe inspection on the module to be inspected in a state where the probe needle is in contact with the electrode pad, and the inspection determined by comparing the inspection value measured by the inspection means with a preset determination value A value comparison unit, and an image recording unit that captures an image of a needle trace formed by the probe needle formed on the electrode pad and records the image when the determination result in the inspection value comparison unit is an abnormal inspection value that deviates from the determination value. An image comparison / determination unit and an image comparison / determination unit for comparing the image captured by the image recording unit with a normal image prepared in advance If the definitive determination result is out of the allowable range of the normal image, characterized by comprising an inspection stop means for stopping the progress of the probe test by an alarm.

  According to the fourth auto-probe inspection apparatus, when the determination result in the inspection value comparison means is an abnormal inspection value that deviates from the determination value, the needle trace by the probe needle formed on the electrode pad is photographed and the image is recorded. Image recording means is provided. For this reason, it is not necessary to confirm the needle trace by the microscope only by confirming the image in which the needle trace indicating the abnormal inspection value is recorded, so that the man-hour required for confirming the needle trace can be greatly reduced.

  According to the auto-probe inspection method and the auto-probe inspection apparatus according to the present invention, it is not necessary to check the needle traces with a microscope or the like, so that manual intervention can be reduced.

  Further, when the position of the probe needle or the like is automatically corrected, automation of the probe inspection can be realized.

(First embodiment)
A first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front configuration of an auto setup type wafer probe inspection apparatus according to a first embodiment of the present invention. As shown in FIG. 1, the inspection apparatus main body 10 has a wafer mounting table 1 on which a wafer 20 to be inspected is mounted and is movably provided, and a wafer mounted on the wafer mounting table 1. A probe needle (probe card) 2 held at a position opposed to the main surface 20, a camera 3 held above the probe needle 2, and an image processing unit 4 that processes an image taken by the camera 3. And a monitor 5 for displaying data such as images. Although not shown, in addition to the image processing unit 4, the inspection apparatus main body 10 has an arithmetic processing unit that executes at least software (inspection program) necessary for probe inspection.

  Hereinafter, an inspection method using the wafer probe apparatus configured as described above will be described with reference to a flowchart shown in FIG.

  As shown in FIG. 2, first, in step A, the wafer 20 is automatically mounted on the wafer mounting table. Here, a plurality of semiconductor integrated circuits, which are modules to be inspected, are formed in a matrix (array) for each chip formation region on the main surface of the wafer 20, and pad electrodes for inspection are provided in each semiconductor integrated circuit. Is formed.

  Next, in step B, alignment (alignment) between the mounted wafer 20 and the probe needle 2 is performed.

  Next, in step C, the probe needle 20 is automatically brought into contact with the electrode pad with a preset overdrive amount, and the electrical characteristics of one module (one chip) under the measurement conditions specified by the inspection program. Perform the inspection.

  Next, in step D, the inspection result for one chip is recorded on a recording medium.

  Next, in step E, the recorded inspection result for one chip is compared with a predetermined determination value (design value) of electrical characteristics by arithmetic processing to determine. At this time, if the determination result is an abnormal inspection value that deviates from the determination value, in the next step G, the camera 3 shoots the needle trace of the electrode pad in a range including the entire electrode pad, and captures the image. Record on a recording medium. It should be noted that the imaging range of the electrode pad may be only the electrode pad used for the inspection, or may include an electrode pad included in another chip adjacent to the electrode pad used for the inspection. Moreover, all the electrode pads which the probe needle 2 contacted may be sufficient, and the electrode pad corresponding to the inspection mode (disconnection or short circuit) is registered, and only the registered electrode pad may be photographed. Good.

  If the determination result is a normal inspection value that satisfies the determination value, the process moves to the next inspection module (chip formation region) in step F. That is, it repeats from the process B.

  Next, in the process H following the process G, image processing is performed on the photographed electrode pad needle traces and a needle trace sample a which is registered in advance and shows a normal state in which all the needle traces are accommodated in each electrode pad. Compared with the part 4, it is determined whether or not the needle trace of the electrode pad used for the inspection is normal. Here, the method for determining the needle trace may be the amount of protrusion of the needle trace to the periphery of the electrode pad, or the ratio of the area of the needle trace to the area of the electrode pad.

  Next, in Step H, when it is determined that the photographed needle trace of the electrode pad is abnormal, the position of the probe needle 2 is corrected so as to be equivalent to the normal needle trace sample a. Thereafter, the process moves to the re-inspection of the process U, that is, returns to the process C.

  In Step H, if the photographed needle trace is normal, the needle tip of the probe needle 2 is photographed and recorded by the camera 3 in the next Step K.

Next, in step L, the image processing unit 4 compares the photographed needle tip shape with a normal needle tip sample b that is registered in advance and has no stain or bending of the needle tip, and the needle tip shape is normal. It is determined whether or not. If it is determined that the shape of the probe tip of the probe needle 2 does not match the tip sample b and is abnormal, in a next step M, a nitrogen blowing device (not shown) provided in the wafer probe inspection device. , The dust attached to the probe tip of the probe needle 2 is removed by injecting nitrogen (N ₂ ) gas to the probe tip of the probe needle 2 for a predetermined time.

  Next, in step N, after nitrogen blowing, the tip of the probe needle 2 is imaged again with the camera 3. Thereafter, in Step O, when it is determined that the shape of the needle tip is normal as compared with the normal needle tip sample b, the process U is re-inspected. Conversely, if it is determined in step O that the shape of the needle tip is abnormal, in the next step P, a probe needle is used using a needle tip polisher (not shown) provided in the wafer probe inspection apparatus. Polish the tip of No.2.

  Next, in step Q, the polished needle tip and the normal needle tip sample b are compared by image processing to determine whether the shape is correct. When it is determined that the polished needle tip is normal, the process U re-inspects. On the contrary, when it is determined that the polished needle tip is abnormal, the probe needle 2 may be bent or the like, so that the process proceeds to step V and the inspection is stopped.

  On the other hand, if it is determined in step L that the photographed needle tip is normal, in the next step R, the wafer position (X coordinate, Y coordinate and rotation (θ)) on the wafer mounting table 1, the wafer The height of the mounting table 1 and the position of the probe needle (probe card) 2 (X coordinate, Y coordinate and rotation (θ)) are measured, and the measured data is stored.

  Next, in step S, the measured data and a preset standard value are compared by arithmetic processing to determine whether or not they are correct. At this time, if it is determined that the position of the wafer or the like satisfies the standard value, since the cause of the inspection abnormality is unknown at this stage, the process proceeds to the next process V and stops the inspection. As described above, when the result of the probe inspection is abnormal and the needle trace, the needle tip, the position of the wafer 20 and the position of the probe card 2 are all determined to be normal, the semiconductor integrated circuit to be inspected Since there is a possibility of abnormality, a probe inspection of the next chip formation region may be performed, and the inspection may be stopped when the inspection result is continuously determined to be abnormal. Further, in the case of chip formation areas adjacent to each other, an abnormality may have occurred due to a specific location on the wafer. For example, at least one chip formation area, for example, five is skipped. It is also preferable in terms of efficiency to perform the probe inspection using the inspection program set as described above. In addition, the determination of the inspection result may not be determined in one chip formation region, but the inspection results in two or more consecutive inspection targets may be recorded to determine whether or not the continuous inspection results are normal. .

  If it is determined in step S that the position of the wafer or the like does not satisfy the standard value, the position of the wafer 20 or the probe card 2 that does not satisfy the standard value is corrected in the next step T to Move on to re-examination.

  As described above, according to the first embodiment, since the contact position of the probe needle 2 with respect to the pad electrode can be automatically corrected during the inspection, the inspection result is confirmed after the inspection is completed, and further, the needle trace abnormality is observed with the microscope. Therefore, it is not necessary to perform the probe inspection again after the confirmation, etc. Therefore, the probe inspection can be completely automated and unmanned, and the efficiency of the probe inspection can be greatly improved.

  In addition, after the needle tip of the probe needle 2 is determined to be abnormal, in step M, the needle tip is cleaned using a nitrogen blowing device, so that the deposit on the needle tip can be removed during the inspection. It can prevent falling on the wafer 20.

  Further, after the needle tip is determined to be abnormal, in step P, the needle tip is polished using a needle tip polishing machine, so that the needle tip can be corrected to a normal shape when an abnormality occurs. It is possible to minimize an abnormal needle trace of the electrode pad.

  In Step R, after it is determined that the coordinate position of the object to be inspected (wafer 20) or the coordinate position of the probe card 2 does not satisfy the allowable range, these are corrected to a normal position that falls within the allowable range, and probe inspection is performed. Continue. This eliminates the extra man-hours for performing a probe inspection separately after the inspection is completed, so that the probe inspection can be performed efficiently.

(Second Embodiment)
Hereinafter, an inspection method using an auto setup type wafer probe inspection apparatus according to a second embodiment of the present invention will be described with reference to the flowchart shown in FIG. The wafer probe inspection apparatus according to the second embodiment is equivalent to the apparatus shown in FIG.

  As shown in FIG. 3, first, in step A, the wafer 20 is automatically mounted on the wafer mounting table. Here, on the main surface of the wafer 20, a plurality of semiconductor integrated circuits, which are modules to be inspected, are formed in an array for each chip formation region, and a pad electrode for inspection is formed on each semiconductor integrated circuit. Yes.

  Next, in step B, alignment (alignment) between the mounted wafer 20 and the probe needle 2 is performed.

  Next, in step C, the probe needle 20 is automatically brought into contact with the electrode pad with a preset overdrive amount, and the electrical characteristics of one module (one chip) under the measurement conditions specified by the inspection program. Perform the inspection.

  Next, in step D, the inspection result for one chip is recorded on a recording medium.

  Next, in step E, the recorded inspection result for one chip is compared with a predetermined determination value (design value) of electrical characteristics by arithmetic processing to determine. At this time, if the determination result is a normal inspection value that satisfies the determination value, the process proceeds to step F, moves to the next inspection module (chip formation region), and repeats from step B.

  If the determination result is an abnormal inspection value that deviates from the determination value, in the next step G, the camera 3 shoots the needle trace of the electrode pad in a range including the entire electrode pad and records the image. Record on media. Subsequently, after the image is recorded, the process moves to the next inspection module (chip formation region) by the process F and is repeated from the process B.

  According to the second embodiment, after the probe inspection for one chip is performed, if the inspection result is determined to be abnormal, the needle marks attached to the electrode pads are recorded as an image. Thus, when an abnormal value is found during the inspection result confirmation process performed after the probe inspection is completed, a manual operation of checking the needle trace shape using a microscope or the like is performed using an image of the needle trace taken during the inspection. Can be done. As a result, it is possible to complete the inspection abnormality confirmation work in a short time.

(Third embodiment)
Hereinafter, an inspection method using an auto setup type wafer probe inspection apparatus according to a third embodiment of the present invention will be described with reference to a flowchart shown in FIG. The wafer probe inspection apparatus according to the third embodiment is equivalent to the apparatus shown in FIG.

  As shown in FIG. 4, first, in step A, the wafer 20 is automatically mounted on the wafer mounting table. Here, on the main surface of the wafer 20, a plurality of semiconductor integrated circuits, which are modules to be inspected, are formed in an array for each chip formation region, and a pad electrode for inspection is formed on each semiconductor integrated circuit. Yes.

  Next, in step B, alignment (alignment) between the mounted wafer 20 and the probe needle 2 is performed.

  Next, in step C, the probe needle 20 is automatically brought into contact with the electrode pad with a preset overdrive amount, and the electrical characteristics of one module (one chip) under the measurement conditions specified by the inspection program. Perform the inspection.

  Next, in step D, the inspection result for one chip is recorded on a recording medium.

  Next, in step E, the recorded inspection result for one chip is compared with a predetermined determination value (design value) of electrical characteristics by arithmetic processing to determine. At this time, if the determination result is a normal inspection value that satisfies the determination value, the process proceeds to step F, moves to the next inspection module (chip formation region), and repeats from step B.

  If the determination result is an abnormal inspection value that deviates from the determination value, in the next step G, the camera 3 shoots the needle trace of the electrode pad in a range including the entire electrode pad and records the image. Record on media. Subsequently, after the image is recorded, in Step H, image processing is performed on the needle traces of the photographed electrode pads and the needle trace sample a indicating a normal state in which all the needle traces are stored in advance in each electrode pad. Compared with the part 4, it is determined whether or not the needle trace of the electrode pad used for the inspection is normal. If the needle trace on the electrode pad is abnormal, an alarm is issued in step I, and then the inspection is stopped in step J.

  According to the third embodiment, when it is determined that the needle trace is abnormal, an alarm is issued and the inspection is stopped, so that the needle trace abnormality to the electrode pad can be minimized. In addition, since the needle traces of the electrode pads are recorded as an image, the needle trace image taken during the inspection is performed manually by using a microscope or the like when an abnormal value occurs in the inspection. It can be performed by using. For this reason, it is possible to complete the inspection abnormality confirmation work in a short time.

  In the second embodiment and the third embodiment, the imaging range of the electrode pad in the process G may be only the electrode pad used for the inspection, and is adjacent to the electrode pad used for the inspection. An electrode pad included in another chip may be included. Moreover, all the electrode pads which the probe needle 2 contacted may be sufficient, and the electrode pad corresponding to the inspection mode (disconnection or short circuit) is registered, and only the registered electrode pad may be photographed. Good.

  Further, the comparison means, determination means, and inspection stop means in the auto setup type wafer probe inspection apparatus according to the first to third embodiments are incorporated as functions of the inspection program.

  The auto-probe inspection method and the auto-probe inspection apparatus according to the present invention eliminates the need for confirmation of needle traces with a microscope or the like, can greatly reduce labor, and are inspected of a semiconductor wafer or a liquid crystal display substrate. The present invention is useful for an auto probe inspection method that automatically performs body probe inspection, an auto probe inspection apparatus using the same, and the like.

It is a typical front view showing an auto setup type wafer probe inspection device concerning each 1st-3rd embodiment of the present invention. It is a flowchart figure which shows the auto probe inspection method which concerns on the 1st Embodiment of this invention. It is a flowchart figure which shows the auto probe inspection method which concerns on the 2nd Embodiment of this invention. It is a flowchart figure which shows the auto probe inspection method which concerns on the 3rd Embodiment of this invention. It is a flowchart figure which shows the conventional auto probe test | inspection method.

Explanation of symbols

1 Wafer mounting table 2 Probe needle (probe card)
3 Camera 4 Image Processing Unit 5 Monitor 10 Inspection Device Main Body 20 Wafer

Claims (14)

An auto-probe inspection method for measuring electrical characteristics of each module to be inspected in an object to be inspected having a plurality of modules to be inspected each having an electrode pad formed thereon using an auto setup type probe device,
A first step of performing a probe test on one module to be tested among the plurality of modules to be tested, with a probe needle in contact with the electrode pad;
A second step of determining by comparing the inspection value measured in the first step with a preset determination value;
When the determination result in the second step is an abnormal inspection value that deviates from the determination value, a third step of photographing a needle trace by the probe needle formed on the electrode pad and recording the image;
A fourth step of determining by comparing the image captured in the third step with a normal image prepared in advance;
A fifth step that repeats from the first step after correcting the contact position of the probe needle with respect to the electrode pad when the determination result in the fourth step is out of the allowable range of the normal image;
An auto-probe inspection method comprising: a sixth step that repeats from the first step after shifting to another module to be inspected when the determination result in the fourth step is within the allowable range. Between the fourth step and the fifth step,
The auto probe inspection method according to claim 1, further comprising a blow cleaning step of cleaning the probe needle by blowing gas onto the probe needle. Between the fourth step and the fifth step,
The auto probe inspection method according to claim 1, further comprising a polishing cleaning step of cleaning the probe needle by polishing the probe needle. An auto-probe inspection method for measuring electrical characteristics of each module to be inspected in an object to be inspected having a plurality of modules to be inspected each having an electrode pad formed thereon using an auto setup type probe device,
A first step of performing a probe test on one module to be tested among the plurality of modules to be tested, with a probe needle in contact with the electrode pad;
A second step of determining by comparing the inspection value measured in the first step with a preset determination value;
A third step of measuring and recording the coordinate position of the object to be inspected when the determination result in the second step is an abnormal inspection value deviating from the determination value;
A fourth step of comparing and determining the coordinate position of the inspection object recorded in the third step and the coordinate position of a normal inspection object prepared in advance;
A fifth step that repeats from the first step after correcting the coordinate position of the inspection object when the determination result in the fourth step is outside the allowable range of the coordinate position of the normal inspection object;
An auto-probe inspection method comprising: a sixth step that repeats from the first step after shifting to another module to be inspected when the determination result in the fourth step is within the allowable range. An auto-probe inspection method for measuring electrical characteristics of each module to be inspected in an object to be inspected having a plurality of modules to be inspected each having an electrode pad formed thereon using an auto setup type probe device,
A first step of performing a probe test on one module to be tested among the plurality of modules to be tested, with a probe needle in contact with the electrode pad;
A second step of determining by comparing the inspection value measured in the first step with a preset determination value;
A third step of measuring and recording the coordinate position of the probe card when the determination result in the second step is an abnormal inspection value deviating from the determination value;
A fourth step of comparing and determining the coordinate position of the probe card recorded in the third step and the coordinate position of a normal probe card prepared in advance;
A fifth step that repeats from the first step after correcting the coordinate position of the probe card when the determination result in the fourth step is out of the allowable range of the coordinate position of the normal probe card;
An auto-probe inspection method comprising: a sixth step that repeats from the first step after shifting to another module to be inspected when the determination result in the fourth step is within the allowable range. In the first step, probe inspection is performed on at least two of the plurality of modules to be inspected,
In the second step, at least two of the modules to be inspected are determined by comparing with the determination value set in advance,
In the third step, when the determination result in the second step is an abnormal inspection value deviating from the determination value in at least two of the modules to be inspected, the needle traces left on the electrode pad are photographed and 6. The auto probe inspection method according to claim 1, wherein an image is recorded. An auto-probe inspection method for measuring electrical characteristics of each module to be inspected in an object to be inspected having a plurality of modules to be inspected each having an electrode pad formed thereon using an auto setup type probe device,
A first step of performing a probe test on one module to be tested among the plurality of modules to be tested, with a probe needle in contact with the electrode pad;
A second step of determining by comparing the inspection value measured in the first step with a preset determination value;
When the determination result in the second step is an abnormal inspection value that deviates from the determination value, after imaging the needle trace by the probe needle formed on the electrode pad and recording the image, another inspection target A third step of transferring to the module and repeating from the first step;
When the determination result in the second step is a normal inspection value, an auto probe inspection method comprising: a fourth step repeated from the first step after shifting to another module to be inspected. An auto-probe inspection method for measuring electrical characteristics of each module to be inspected in an object to be inspected having a plurality of modules to be inspected each having an electrode pad formed thereon using an auto setup type probe device,
A first step of performing a probe test on one module to be tested among the plurality of modules to be tested, with a probe needle in contact with the electrode pad;
A second step of determining by comparing the inspection value measured in the first step with a preset determination value;
When the determination result in the second step is an abnormal inspection value that deviates from the determination value, a third step of photographing a needle trace by the probe needle formed on the electrode pad and recording the image;
A fourth step of determining by comparing the image captured in the third step with a normal image prepared in advance;
A fifth step of issuing an alarm and stopping the progress of the probe inspection when the determination result in the fourth step is out of the allowable range of the normal image;
An auto-probe inspection method comprising: a sixth step that repeats from the first step after shifting to another module to be inspected when the determination result in the fourth step is within the allowable range. An auto-probe inspection device for measuring electrical characteristics of each of the modules to be inspected in an object to be inspected having a plurality of modules to be inspected each having an electrode pad formed thereon,
Inspecting means for inspecting the module to be inspected with a probe needle in contact with the electrode pad,
A test value comparing means for judging by comparing a test value measured by the test means with a preset judgment value;
When the determination result in the inspection value comparison means is an abnormal inspection value that deviates from the determination value, an image recording means for photographing a needle trace by the probe needle formed on the electrode pad and recording the image;
Image comparison determination means for comparing an image photographed by the image recording means with a normal image prepared in advance;
And an automatic contact position correcting means for correcting a contact position of the probe needle with respect to the electrode pad when a determination result in the image comparison determining means is out of an allowable range of the normal image. Probe inspection device.   The auto probe inspection apparatus according to claim 9, further comprising blow means for cleaning the probe needle by blowing gas onto the probe needle.   The auto probe inspection apparatus according to claim 9, further comprising needle tip polishing means for cleaning the probe needle by polishing the probe needle. An auto-probe inspection device for measuring electrical characteristics of each of the modules to be inspected in an object to be inspected having a plurality of modules to be inspected each having an electrode pad formed thereon,
Inspecting means for inspecting the module to be inspected with a probe needle in contact with the electrode pad,
A test value comparing means for judging by comparing a test value measured by the test means with a preset judgment value;
A coordinate position recording means for measuring and recording the coordinate position of the object to be inspected when the determination result in the inspection value comparison means is an abnormal inspection value deviating from the determination value;
A coordinate position comparison / determination unit that compares the coordinate position of the inspection object recorded by the coordinate position recording unit with a coordinate position of a normal inspection object prepared in advance;
Coordinate position correction means for correcting the coordinate position of the inspection object when the determination result in the coordinate position comparison determination means deviates from the allowable range of the coordinate position of the normal inspection object. Auto probe inspection device. An auto-probe inspection device for measuring electrical characteristics of each of the modules to be inspected in an object to be inspected having a plurality of modules to be inspected each having an electrode pad formed thereon,
Inspecting means for inspecting the module to be inspected with a probe needle in contact with the electrode pad,
A test value comparing means for judging by comparing a test value measured by the test means with a preset judgment value;
Coordinate position recording means for measuring and recording the coordinate position of the probe card when the determination result in the inspection value comparison means is an abnormal inspection value deviating from the determination value;
Coordinate position comparison and determination means for determining by comparing the coordinate position of the probe card recorded by the coordinate position recording means and the coordinate position of a normal probe card prepared in advance;
Coordinate position correction means for correcting the coordinate position of the probe card when the determination result in the coordinate position comparison determination means deviates from the allowable range of the coordinate position of the normal probe card. Auto probe inspection device. An auto-probe inspection device for measuring electrical characteristics of each of the modules to be inspected in an object to be inspected having a plurality of modules to be inspected each having an electrode pad formed thereon,
Inspecting means for inspecting the module to be inspected with a probe needle in contact with the electrode pad,
A test value comparing means for judging by comparing a test value measured by the test means with a preset judgment value;
When the determination result in the inspection value comparison means is an abnormal inspection value that deviates from the determination value, an image recording means that records the image by photographing a needle trace formed by the probe needle formed on the electrode pad;
An image comparison / determination means for comparing the image taken by the image recording means with a normal image prepared in advance;
An auto-probe inspection, comprising: an inspection stop means for issuing an alarm and stopping the progress of the probe inspection when a determination result in the image comparison determination means is out of an allowable range of the normal image apparatus.

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