JP2006128452A - Probe card and prober, process for fabricating semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a probe card capable of optimizing the maintenance timing of individual probe cards, and to provide a prober and a process for fabricating a semiconductor device. <P>SOLUTION: The probe card 10 has a plurality of probes 13 extending from the periphery of an opening 12 toward the central direction. The probes 13 are connected with terminals (not shown) arranged on the periphery of a circuit board 11 through wiring. A data storage section 14 is provided on a predetermined region of the circuit board 11. The data storage section 14 is storing information at least about the use record of the probe card 10 and the state of each probe 13. The data storage section 14 is holding information at least about the distal end diameter and the length of each probe 13 under initial state, the accumulated number of contact times, the timing and the number of times of card maintenance, and the distal end diameter and the length of each probe dependent on the timing and the number of times of card maintenance. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a probe card, a prober device, and a semiconductor device manufacturing method for measuring electrical characteristics by mechanically contacting a probe needle with an electrode portion of an LSI chip in a wafer state.

  The probe card is used for testing each chip area in a wafer state before the assembly process of LSI manufacturing. The probe card has a probe needle that is brought into contact with an electrode portion (an upper surface of an Al pad, Au bump, solder bump, etc.) of a chip area that is a measurement area. In the prober apparatus, a test signal or a test pattern is input from the probe needle to the chip to be measured.

  For example, the chip to be measured has a bump electrode as an external terminal. At the time of probing, the probe needle of the probe card applies an appropriate pressure to the electrode part in the chip region, and is brought into contact with deflection and sliding. When the probe needle of the probe card continues to be used, foreign matters such as shavings on the electrode terminal surface adhere to the tip of the probe needle. Alternatively, the lengths of the probe needle tips are not aligned due to wear, deformation, or the like. Therefore, maintenance such as cleaning and polishing of the probe needle is required in order to prevent a problem in the electrical contact state.

Conventionally, the probe needle is cleaned by inspecting the probe card (probe needle state) based on the frequency of use of the probe card and the frequency of occurrence of defects in the electrical characteristic inspection result to determine whether maintenance is necessary. When a continuous failure occurs with respect to the semiconductor device to be sequentially inspected, the tip of the stylus is observed by using an existing CCD camera for needle alignment. There is also disclosed a technique for performing an optimum cleaning by comparing the adhesion state of foreign matter with reference pattern data (see, for example, Patent Document 1).
JP 2001-326258 A (FIG. 1)

  Implementation of the probe card inspection reduces the substantial operation rate of the prober device. Excessive cleaning of the probe needles of the probe card may shorten the life of the probe card. Therefore, conventionally, necessary card maintenance is performed only when a continuous failure occurs in the semiconductor device to be measured.

  While using the probe card, it is not always possible to grasp the necessity of card maintenance to recover the probe needle state. This is because it is not possible to grasp how long the probe card is being used, how much (number of times, intervals, etc.) it has undergone maintenance, and the maintenance volume.

  The present invention has been made in view of the above circumstances, and is intended to provide a probe card, a prober device, and a method for manufacturing a semiconductor device that can optimize the timing of card maintenance in each probe card. is there.

  A probe card according to the present invention is a probe card that transmits and receives signals by each probe needle corresponding to each contact area of a measurement target, and is provided on a circuit board on which the probe needle extends, and on the circuit board A data storage unit that stores at least identification information, usage history, and information related to the state of the probe needle.

According to the probe card according to the present invention, by reading the contents of the data storage unit, it is possible to grasp the state transition (probe needle state transition) with the progress of use of the probe card. This can be used to make a prediction of when maintenance will occur.
Preferably, the data storage unit includes at least the tip diameter and length of each probe needle in the initial state, the accumulated number of contacts, the timing and number of card maintenance, and the tip of each probe needle that changes accordingly. Diameter and length information is retained.

  A prober apparatus according to the present invention includes a stage mechanism that supports and detects a position of a semiconductor wafer and can be moved and a circuit board in which a plurality of probe needles extend from a predetermined portion, and each of the probe needles in the semiconductor wafer. A probe card that exchanges signals by contacting each electrode terminal in the IC chip area, and a position recognition of the probe card with respect to the semiconductor wafer, and measurement of a predetermined tip diameter and length of the probe needle or the An image recognition mechanism capable of inspecting the state of the probe needle to determine whether there is an abnormality in the state of each probe needle, a maintenance mechanism for bringing the probe needles of the probe card closer to a normal state, and the circuit board At least identification information about the probe card deployed, usage history and Cormorant including a data storage unit in which the information about the state of the probe needle is stored, and a control unit to determine the maintenance timing of the probe card to obtain information from at least the data storage unit.

  According to the prober device according to the present invention, the diameter and length of each probe needle at the tip predetermined region can be measured by the image recognition mechanism. The measurement value information obtained by the image recognition mechanism is useful as information stored in the data storage unit. The optimal maintenance timing of the probe card is determined by the control unit, and the contact system failure caused by probing is not continued.

In the prober apparatus according to the present invention, data collection for optimizing the maintenance time of the probe card having one of the following features is efficiently performed.
During the inspection of a predetermined lot on the semiconductor wafer, the probe needle state inspection using the image recognition mechanism is performed after the semiconductor wafer is supported and detected by the stage mechanism.
During the inspection of the predetermined lot on the semiconductor wafer, the probe needle state inspection using the image recognition mechanism is performed at the time of replacement of the semiconductor wafer.
During the inspection of a predetermined lot on the semiconductor wafer, the state inspection of the probe needle using the image recognition mechanism or the maintenance mechanism is made to function during the replacement time of the semiconductor wafer.
The data storage unit stores at least information on the tip diameter and length of the probe needle in the initial state, the accumulated number of contacts, the timing and number of card maintenance, and the tip diameter and length of the probe needle that change accordingly. The control unit checks the latest data regarding the probe needle state obtained using the image recognition mechanism with the information obtained from the data storage unit, and the probe card can be used continuously or needs maintenance. It is characterized by making a judgment.
It has a display part which displays at least a part of information acquired by the control part.

  The semiconductor device manufacturing method according to the present invention includes a positioning step in which a semiconductor wafer is supported and aligned by a movable stage of a prober device, and each IC chip region of the semiconductor wafer using a probe card of the prober device. In order to exchange at least signals related to electrical characteristic inspection, a probe inspection step for bringing a probe needle into contact with each terminal electrode of the selected IC chip region, the probe card includes its identification information, usage history, and the accompanying information A data accumulation process for storing information relating to the state of the probe needle, and the probe inspection process are completed for each IC chip region, and until the next semiconductor wafer is supported on the stage by replacement, the prober apparatus Inspection / maintenance to achieve the probe needle condition inspection or maintenance work with The inspection / maintenance step is performed according to a maintenance plan created by collecting and analyzing information in the data storage step and model information of the semiconductor wafer on the prober device side, and the inspection step In the above, the contact system failure caused by the probe needle is eliminated.

  According to the semiconductor device manufacturing method of the present invention, at least information in the data storage process is referred to in order to make an optimum maintenance plan. In the inspection / maintenance process, if a maintenance operation is performed as a maintenance process, the history is updated in the data accumulation process. Moreover, the information regarding the state of each probe needle is updated as an inspection process. That is, the maintenance timing is always optimized based on the latest information, and the contact system failure caused by the probe needle is eliminated in each IC chip region in the semiconductor wafer.

  In the method for manufacturing a semiconductor device according to the present invention, the data accumulation process changes at least the tip diameter and length of each probe needle in the initial state, the accumulated number of contacts, the timing and number of card maintenance, and changes accordingly Information on the tip diameter and length of the probe needle is retained. As a result, data collection for optimizing the maintenance time of the probe card is efficiently performed.

  In the method of manufacturing a semiconductor device according to the present invention, an alignment process of the probe card is performed after the positioning process, and at least the same inspection process as the inspection / maintenance process is performed together with the alignment process. As a result, data collection for optimizing the maintenance time of the probe card is efficiently performed.

BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 1 is a schematic diagram showing the configuration of the probe card according to the first embodiment of the present invention.
FIG. 2 is an image diagram showing the maintenance and the change in the state of the probe needle as the probe card is used. The probe card 10 transmits and receives signals with each probe needle corresponding to each contact area to be measured. In the probe card 10, an opening 12 is formed at a substantially central portion of the circuit board 11. A plurality of probe needles 13 extend from the periphery of the opening 12 toward the center. The probe needle 13 is also well known in the form of a multistage arrangement. In the same type, for example, the length from the needle tip 131 to the shaft bending portion 132 is within a predetermined range. The probe needle 13 is connected to a terminal (not shown) arranged around the circuit board 11 via wiring. A terminal (not shown) has a connection relationship with a prober device described later.

  In this embodiment, the data storage unit 14 is provided on a predetermined area of the circuit board 11. The data storage unit 14 stores at least identification information of the probe card 10, usage history, and information regarding the state of the probe needle 13 associated therewith. The data storage unit 14 includes at least the diameter (φ0) of the needle tip 131 of the probe needle 13 in the initial state, the length (L0) to the shaft bending unit 132, the accumulated number of contacts (N), and the timing (interval) of card maintenance. ) And the number of times (M), and the tip diameter of each probe needle and the length to the shaft bending portion (φM and LM) that change in accordance therewith are held (see FIG. 2). The data storage unit 14 includes, for example, a memory device, and data is input from the prober device side described later. The tip diameter and length of each probe needle 13 in the initial state may be held in advance by the data storage unit 14 as an initial standard.

  According to the structure of the said embodiment, the state transition (probe needle state transition) accompanying use progress of the probe card 10 can be grasped | ascertained by reading the content of the data storage part 14. FIG. The maintenance occurrence time can be predicted with reference to this. For example, it is convenient when the probe card 10 is recovered after completion of maintenance such as probe needle polishing and length adjustment outside the prober device, and is attached to the prober device again. If the contents of the data storage unit 14 are read, the latest information regarding the usage history and the state of each probe needle 13 associated therewith can be obtained. Thereby, the optimal maintenance time or replacement time of the probe card 10 can be predicted.

  FIG. 3 is a block diagram showing the main part of the prober device according to the second embodiment of the present invention. The prober device is provided with the probe card 10 shown in the first embodiment, and the same parts as those in FIG.

  The prober device 20 includes a wafer transfer mechanism 21, a stage mechanism 22, an alignment mechanism 23, a probe card 10, an image recognition mechanism 24, a maintenance mechanism 25, and a control unit 26. The prober device 20 and the tester 29 are transmitted with signals via a test head 27 and a measurement signal cable 28. The display unit 30 displays various operation statuses of the prober device 20.

  The stage mechanism 22 includes a wafer stage 221, a temperature control unit 222, and a position detection unit 223. The stage mechanism 22 chucks the semiconductor wafer WF on the wafer stage 221 and can control movement in at least the X, Y, Z, and θ directions. These are commanded by the control unit 26. Further, the alignment mechanism 23 can slide on the wafer stage 221. The alignment mechanism 23 has an alignment bridge including various lenses (not shown), a CCD camera, etc., performs optical system alignment on the semiconductor wafer WF supported on the wafer stage 221, and sends coordinate data to the control unit 26.

  The probe card 10 is supported by the measurement board 17. The measurement board 17 is connected to the test head 27 via a connection ring 18 including pogo pins and the like. As shown in the first embodiment, the probe card 10 has each probe needle 13 extending from the opening 12 of the circuit board 11. The probe card 11 exchanges signals related to probing when each probe needle 13 contacts each terminal electrode (pad, bump, etc.) of a predetermined IC chip region CHIP in the semiconductor wafer WF. In addition, on a predetermined area of the circuit board 11, there is a data storage unit 14 in which identification information of the probe card 10, usage history and information related to the state of each probe needle 13 are stored.

  Further, the image recognition mechanism 24 works in conjunction with the wafer stage 221. The image recognition mechanism 24 includes various lenses and a CCD camera (not shown), recognizes the position of the probe card 10 with respect to the semiconductor wafer WF on the wafer stage 221, and has a diameter and length in a predetermined region of the tip of each probe needle 13. This is possible. For example, the tip of the probe needle 13 is focused on, and compared with a set standard or reference data in the control unit 26 described later. Thereby, measurement of the tip diameter φ of the probe needle 13 shown in FIG. 2 and measurement of the length L to the shaft bending portion are possible. In addition, it is possible to inspect whether or not the tip of the needle is aligned on the same plane and the adhesion of foreign matter.

  For example, the maintenance mechanism 25 uses the movement control of the stage mechanism 22 to bring the probe needles 13 of the probe card 10 closer to a normal state. The maintenance mechanism 25 is provided with a predetermined maintenance member 251 selected from sandpaper, a fibrous polishing member such as carbon or ceramic, or other cleaning tools.

  The control unit 26 holds device information (system data, product type parameters, etc.) and product information (models, etc.) of the prober device 20 and reflects them in the control of each unit. Further, the control unit 26 exchanges data with the data storage unit 14 of the probe card 10 via the measurement board 17. Based on the accumulated data and the latest needle state measurement result for the probe needle 13 using the image recognition mechanism 24, the control unit 26 changes the state of the probe needle 13 under future use conditions and generates maintenance. Make time predictions. Thereby, the optimal maintenance timing of the probe card 10 is determined.

  The display unit 30 displays image processing results and coordinates of a predetermined part in the semiconductor wafer WF when the alignment mechanism 23 is functioned. In addition, the display unit 30 displays the image processing result of the probe needle 13 in the probe card 10 when the image recognition mechanism 24 is functioned. It is also conceivable to display the image processing result of the probe needle 13 after maintenance. Further, the display unit 30 may display the analysis result display of the data collected by the control unit 26 and the current status as probe card information, and may display a call for error avoidance, maintenance time prediction information, and the like.

  According to the configuration of the above embodiment, the image recognition mechanism 24 can measure the tip diameter φ of each probe needle 13 in the probe card 10 and the length L to the shaft bending portion. The measurement value information obtained by the image recognition mechanism 24 is stored in the data storage unit 14 together with the usage history. Such a probe card 10 is convenient because the current state of the probe card can be grasped when maintenance is performed at another location for replacement, or when the probe card 10 is attached to the prober device again by replacement of the probe card. Thereby, the more suitable maintenance time of a probe card can be obtained. As a result, the contact system defect caused by probing is not continuously generated for the semiconductor wafer WF to be inspected.

  FIG. 4 is a flowchart showing the main part of the method for manufacturing a semiconductor device according to the third embodiment of the present invention. The prober device shown in the second embodiment is used in order to inspect the electrical characteristics in the wafer state during the semiconductor device manufacturing. This will be described with reference to FIG.

(S1: Semiconductor wafer positioning)
The semiconductor wafer WF is set in the prober device 20. That is, the semiconductor wafer WF is supported by the movable wafer stage 221 via the wafer transfer mechanism 21. Thereafter, alignment is performed by the alignment mechanism 23 slidably moved on the wafer stage 221 to determine coordinate data.

(S2: Probe card alignment and inspection)
Next, the alignment mechanism 23 moves avoiding, and the stage mechanism 22 rises and approaches the probe card 10. The wafer stage 221 is controlled so that the array of probe needles 13 exists above the image recognition mechanism 24. The image recognition mechanism 24 focuses the tip of a predetermined probe needle 13 and recognizes the position with respect to the semiconductor wafer WF. Along with this, a state inspection of the probe needle is performed. The tip diameter φ of the focused probe needle 13 is measured, and the focus L is further moved to measure the length L to the shaft bending portion. Further, by moving the entire probe needle 13 array in focus, it may be inspected whether the tips of the needles are aligned on the same plane or the adhesion state of foreign matter. The result data of the probe needle state inspection is compared with the reference data in the control unit 26, and is used for determining the maintenance time. Among the probe needle state inspections, the measurement of the tip diameter φ and the length L of the probe needle 13 is not always performed and may be omitted.

  The probe card 10 has its identification information, the diameter (φ0) of the tip 131 of the probe needle 13 in the initial state and the length to the shaft bending portion 132 (L0), the usage history if there is a usage history, and accompanying it. Information on the state of the probe needle is stored. The controller 26 also reads these accumulated data. Each measurement value (φ0, L0) of the probe needle 13 in the initial state may be handled as a part of the reference data.

(S3: Probe inspection of semiconductor wafer)
For example, a signal related to electrical characteristic inspection is transmitted / received to each IC chip region of the semiconductor wafer WF using the probe card 10. That is, each probe needle 13 comes into contact with each terminal electrode in the IC chip region selected by the movement control of the wafer stage 221. Thereby, the semiconductor wafer WF is inspected for each IC chip region. In the data storage unit 14 of the probe card 10, the number of contacts of the probe needle 13 is counted and stored.

(S4: Replacement of semiconductor wafer and inspection / maintenance of probe card)
The inspected semiconductor wafer WF is moved closer to the wafer transfer mechanism 21 at the wafer stage 221, unloaded by the wafer transfer mechanism 21, and replaced with the next semiconductor wafer WF. During this time, the probe needle state inspection (probe card inspection) using the image recognition mechanism 24 or the maintenance mechanism 25 is operated (probe card maintenance). Whether to inspect or maintain the probe card is determined and determined by the control unit 26 as a result of step S2. Necessary information is written in the data storage unit 14 in any of the inspection / maintenance of the probe card.

  As a result of the processing S2, if the control unit 26 determines that the probe card 10 can be continuously used for the probe inspection of the next semiconductor wafer WF, the probe needle state inspection (inspection of the probe card) is performed (inspection of the probe card) ( S41). The wafer stage 221 is controlled so that the array of probe needles 13 exists above the image recognition mechanism 24. Here, a state inspection of the probe needle using the image recognition mechanism 24 is performed. That is, the tip of a predetermined probe needle 13 is focused, the tip diameter φ of the probe needle 13 is measured, and the focus L is further moved to measure the length L to the shaft bending portion. Further, by moving the entire probe needle 13 array in focus, it may be inspected whether the tips of the needles are aligned on the same plane or the adhesion of foreign matter. The result data of the probe needle state inspection is compared with the reference data in the control unit 26, and is used for determining the maintenance time. In the probe needle state inspection, the measurement of the tip diameter φ and the length L of the probe needle 13 is not always performed and may be omitted.

  As a result of checking the probe card, it cannot be said that the control unit 26 may determine that the probe card 10 requires maintenance. In this case, a maintenance mechanism 25 described later is caused to function (probe card maintenance (S42)).

  As a result of the process S2, when the control unit 26 determines that the next semiconductor wafer WF has a contact system failure due to probing and the probe card 10 is determined to require maintenance, the maintenance mechanism 25 functions. (Probe card maintenance (S42)). The wafer stage 221 is controlled so that the arrangement of the probe needles 13 exists above the maintenance mechanism 25. Here, maintenance of the probe needle 13 using the maintenance mechanism 25 is performed. That is, a predetermined region including the tip of each probe needle 13 is brought into contact with a predetermined maintenance member 251 by fine movement control of the wafer stage 221 to achieve cleaning or polishing. The maintenance member 251 is selected from sandpaper, fibrous abrasive members such as carbon or ceramic, or other cleaning tools. Thereby, each probe needle 13 of the probe card 10 is brought closer to a normal state. The history as data in the data storage unit 14 is updated.

  After the maintenance of the probe card, the above-described probe needle state inspection (probe card inspection) is performed (S41). The wafer stage 221 is controlled so that the array of probe needles 13 exists above the image recognition mechanism 24. The tip of a predetermined probe needle 13 is focused, the tip diameter φ of the probe needle 13 is measured, and the focus L is moved to measure the length L to the shaft bending portion. Further, by moving the entire probe needle 13 array in focus, it may be inspected whether the tips of the needles are aligned on the same plane or the adhesion of foreign matter. The result data of the probe needle state inspection is compared with the reference data in the control unit 26, and is used to determine whether or not the probe card 10 can be used continuously or the maintenance time (or replacement).

  Thus, after it is determined that the probe card 10 can be used through the process S4, the process S1 (positioning of the semiconductor wafer) is performed on the new semiconductor wafer WF. Thereafter, the process is repeated through S2 to S4. As a result, the probe inspection that eliminates the contact system failure caused by the probe needle can be performed, which contributes to the manufacture of a highly reliable semiconductor device with a good yield.

  Further, there may be a case where it is determined that the probe card 10 is unusable and needs to be replaced after the probe card is checked in the process S4. In that case, the setting of a new semiconductor wafer WF to the stage mechanism 22 is canceled, and the uninspected semiconductor wafer WF is unloaded from the wafer stage 221 by the wafer transfer mechanism 21. Thereafter, the process proceeds to probe card replacement work (S43).

  FIG. 5 is a flowchart showing the main parts of the method of manufacturing a semiconductor device according to the fourth embodiment of the present invention. It is a modification of the third embodiment, and as the process S2a, only the probe card alignment is performed, and the probe needle state inspection is not performed. Therefore, in the process S4, it is determined which one of the processes S41 and S42 is started by using data collection in the control unit 26. The other processes are the same as the processes in the third embodiment, and a description thereof will be omitted.

  According to the method of each of the above embodiments, data collection in the control unit 26 is greatly utilized, including information acquisition from the data storage unit 14 of the probe card 10 in order to make an optimal maintenance plan. In the inspection / maintenance of the probe card, if a maintenance operation is performed as a maintenance process, the history is updated in the data storage unit 14. Moreover, the information regarding the state of each probe needle is updated as an inspection process. In other words, the control unit 26 always collects the latest data and optimizes the maintenance timing so as to eliminate the contact system failure caused by the probe needle in each IC chip region in the semiconductor wafer. Thereby, mass productivity improves.

  As mentioned above, according to each embodiment and method of this invention, a data storage part is provided in a probe card. By reading the contents of the data storage unit, it is possible to grasp the state transition (probe state transition) of the probe card as it is used. This can be used to make a prediction of maintenance occurrence time (or replacement time). This contributes to realistic planning of probe card maintenance plans and new probe card arrangement plans. In addition, the maintenance timing is optimized so as to eliminate the contact system failure caused by the probe needle in each IC chip region in the semiconductor wafer. This also has a positive effect on yield. As a result, it is possible to provide a method of manufacturing a probe card, a prober device, and a semiconductor device that can optimize the timing of card maintenance in each probe card.

Schematic which shows the structure of the probe card which concerns on 1st Embodiment. The image figure which shows the state change accompanying the use progress of a probe card. The block block diagram which shows the principal part of the prober apparatus which concerns on 2nd Embodiment. 9 is a flowchart showing a main part of a method for manufacturing a semiconductor device according to a third embodiment. 9 is a flowchart showing a main part of a method for manufacturing a semiconductor device according to a fourth embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Probe card, 12 ... Opening part, 13 ... Probe needle, 131 ... Needle tip, 132 ... Shaft bending part, 14 ... Data storage part, 17 ... Measurement board, 18 ... Connection ring, 20 ... Prober device, 21 ... Wafer transport mechanism, 22 ... stage mechanism, 221 ... wafer stage, 222 ... temperature control unit, 223 ... position detection unit, 23 ... alignment mechanism, 24 ... image recognition mechanism, 25 ... maintenance mechanism, 251 ... maintenance member, 26 ... Control unit 27 ... Test head 28 ... Measurement signal cable 29 ... Tester 30 ... Display unit WF ... Semiconductor wafer CHIP ... IC chip region S1-S4, S2a, S41-S43 ... Processing steps.

Claims (11)

A probe card that transmits and receives signals by each probe needle corresponding to each contact area of a measurement target,
A circuit board on which the probe needle extends;
A data storage unit for storing at least identification information provided on the circuit board, usage history and information related to the state of the probe needle, and
Including probe card. The data storage unit stores at least information on the tip diameter and length of the probe needle in the initial state, the accumulated number of contacts, the timing and number of card maintenance, and the tip diameter and length of the probe needle that change accordingly. The probe card according to claim 1, which is held. A stage mechanism capable of supporting and detecting the position of a semiconductor wafer and controlling movement;
A probe card that has a circuit board in which a plurality of probe needles extend from a predetermined portion, and each of the probe needles makes contact with each electrode terminal of an IC chip region in the semiconductor wafer, and sends and receives signals,
Recognizing the position of the probe card with respect to the semiconductor wafer, measuring the predetermined tip diameter and length of the probe needle, or checking the state of the probe needle to determine whether there is an abnormality in the state of the probe needle. A possible image recognition mechanism;
A maintenance mechanism that brings each probe needle of the probe card closer to a normal state;
A data storage unit that stores at least identification information about the probe card disposed on the circuit board, usage history, and information on the state of the probe needle associated therewith;
A control unit that obtains at least information from the data storage unit and determines a maintenance timing of the probe card; and
Prober device including 4. The prober apparatus according to claim 3, wherein during the inspection of a predetermined lot on the semiconductor wafer, the probe needle is inspected using the image recognition mechanism after the semiconductor wafer is supported and detected by the stage mechanism. 4. The prober device according to claim 3, wherein during the inspection of the predetermined lot of the semiconductor wafer, the probe needle is inspected using the image recognition mechanism at the time of replacement of the semiconductor wafer. 4. The prober device according to claim 3, wherein during the inspection of the predetermined lot of the semiconductor wafer, the probe needle state inspection using the image recognition mechanism or the maintenance mechanism is caused to function during the replacement time of the semiconductor wafer. The data storage unit stores at least information on the tip diameter and length of the probe needle in the initial state, the accumulated number of contacts, the timing and number of card maintenance, and the tip diameter and length of the probe needle that change accordingly. The control unit checks the latest data regarding the probe needle state obtained using the image recognition mechanism with the information obtained from the data storage unit, and the probe card can be used continuously or needs maintenance. The prober device according to any one of claims 3 to 6, wherein the determination is performed. The prober apparatus as described in any one of Claims 3-7 which has a display part which displays at least one part of the information acquired by the said control part. A positioning step in which a semiconductor wafer is supported and aligned by a movable stage of a prober device;
A probe in which a probe needle is brought into contact with each terminal electrode of the selected IC chip area in order to exchange at least signals relating to electrical characteristic inspection to each IC chip area of the semiconductor wafer using the probe card of the prober device Inspection process;
A data storage step in which the probe card stores information relating to its identification information, usage history and accompanying probe needle state;
Inspection to achieve the probe needle state inspection or maintenance work in the prober apparatus until the probe inspection process is completed for each IC chip region and the next semiconductor wafer is supported on the stage by replacement. / Maintenance process,
Including
The inspection / maintenance process is performed according to a maintenance plan created by collecting and analyzing information in the data accumulation process and model information of the semiconductor wafer on the prober side, and is caused by the probe needle in the inspection process. A method of manufacturing a semiconductor device that eliminates contact system defects. The data accumulating step includes at least the tip diameter and length of each probe needle in the initial state, the accumulated number of contacts, the timing and number of card maintenance, and information on the tip diameter and length of the probe needle that changes accordingly. The method for manufacturing a semiconductor device according to claim 9, wherein: 11. The method of manufacturing a semiconductor device according to claim 9, wherein an alignment step of the probe card is performed after the positioning step, and at least the same step as the inspection step of the inspection / maintenance step is performed together with the alignment step.

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