CN110211893A - A kind of wafer test system and crystal round test approach - Google Patents
A kind of wafer test system and crystal round test approach Download PDFInfo
- Publication number
- CN110211893A CN110211893A CN201910552906.7A CN201910552906A CN110211893A CN 110211893 A CN110211893 A CN 110211893A CN 201910552906 A CN201910552906 A CN 201910552906A CN 110211893 A CN110211893 A CN 110211893A
- Authority
- CN
- China
- Prior art keywords
- wafer
- probe
- needle trace
- needle
- predeterminable area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
This application involves technical field of semiconductors, more particularly to a kind of wafer test system and crystal round test approach.The crystal round test approach includes: to obtain the image of needle trace after probe all forms needle trace with wafer contacts；Judge the needle trace whether in predeterminable area according to described image；When the needle trace exceeds predeterminable area, the distance that the probe needs to adjust is calculated, the probe location is adjusted according to the calculated result, is located at the needle trace in predeterminable area；When the needle trace is located in predeterminable area, wafer test is carried out.Pass through the execution of input preset value and system program, whether automatic capture needle trace picture simultaneously judges needle trace in predeterminable area, probe adjustment is carried out by program automatically when needle trace exceeds predeterminable area, without manual operation and offline adjustment needle trace, save the testing time, testing efficiency is improved, while can reduce human error.
Description
Technical field
This application involves technical field of semiconductors, more particularly to a kind of wafer test system and crystal round test approach.
Background technique
The process of semiconductor production manufacture generally comprises IC design, and wafer manufactures, wafer test, wafer cutting,
Chip package, finished chip test.Wherein, wafer test is even more important to the cost control of chip.Wafer test can will be brilliant
The chip of functional defect is picked out in advance in circle, avoids the chip of these functional defects from entering rear period cost biggish
In chip package step, cost has been saved.
Wafer refers to the silicon wafer of production used in integrated circuits, after the integrated circuit on wafer all completes, on wafer
Include multiple chips.In On-Wafer Measurement step, need to carry out electrical testing to the multiple chip active to pick out those
The chip of energy defect.In wafer test, it will usually the probe card with more probes is used, by the probe of the probe card and crystalline substance
Chip on circle is electrically connected to carry out electrical testing.Specifically, detection welding pad, the probe and weld pad are provided on the chip
It needs to contact with each other, electrical testing could be completed, it is therefore desirable to guarantee that the probe contacts well with the weld pad.
In On-Wafer Measurement, usually need to carry out determination and the needle trace of needle pressure after having carried out chip and pin mark positioning
Detection, it is ensured that needle is pressed and needle trace is errorless contacts well to guarantee probe with weld pad, wafer test will not be caused to occur because of error
Mistake, so that the reduction of wafer yield.And at present industry for needle pressure and needle trace determination, it is conventionally used to method be grasp
Work person's loading procedure under the guidance of prober picture, be manually operated loading bench lifting determine needle press and check needle trace whether
It is usually offline maintenance or maintenance to the processing mode of abnormal probe when detecting abnormal needle trace in predeterminable area, however this
Time required for kind method is very long, strong influence testing efficiency, and very high to operator's requirement, needs to focus on,
Otherwise large effect is generated to test result it is easy to appear manual operation error.It is therefore desirable to develop a kind of new crystalline substance
Circle test macro and crystal round test approach, it can be ensured that needle pressure and needle trace is errorless guarantees that probe contacts well with weld pad.
Summary of the invention
The application provides a kind of wafer test system and crystal round test approach, realizes automatically determining for needle pressure and needle trace,
And on-line tuning needle trace can save the testing time without manual operation and offline adjustment needle trace, improve testing efficiency, simultaneously
It can reduce human error.
The one aspect of the application provides a kind of wafer test system, comprising: plummer, for carrying and moving target
Wafer；At least one probe is configured as being contacted in the predeterminable area on the target wafer surface, in the contact
When generation, tie point of the probe on the target wafer surface forms needle trace；Probe mobile device is configured as automatic
Adjust the position of the probe；Module is adjusted, is configured as judging automatically the position of the needle trace, when the needle trace at least one
When except the predeterminable area, the adjustment module controls the probe mobile device and moves at least one described probe for part
It moves in the predeterminable area.
In some embodiments of the present application, the wafer test system further include: logging modle, in the wafer
When close to the probe, the mobile distance of the plummer is recorded；First judgment module, for judging that the plummer moves immediately
Whether dynamic distance exceeds preset value；First alarm module is connected with the first judgment module, when the wafer it is mobile away from
It is sounded an alarm from when exceeding preset value, indicates that the wafer test system stops test；First computing module is received from record
The record of module is as a result, for calculating needle pressure typical value according to the mobile distance of the wafer；Second judgment module, and it is described
First computing module is connected, for whether within a preset range to judge the calculated needle pressure typical value；Second alarm module,
Be connected with second judgment module, when the calculated needle pressure typical value not within a preset range when sound an alarm, indicate
The wafer test system stops test.
In some embodiments of the present application, the predeterminable area is located on the weld pad of the crystal column surface.
In some embodiments of the present application, the wafer test system further includes image collection module, for obtaining
The image of needle trace is stated, the needle trace image is for judging the needle trace whether in the predeterminable area.
In some embodiments of the present application, the wafer test system further includes third judgment module, for judging
Needle trace is stated whether in predeterminable area.
In some embodiments of the present application, the wafer test system further includes the second computing module, when the needle trace
It is at least a part of when exceeding predeterminable area, calculate the distance that the probe needs to adjust, the adjustment module is according to described the
The calculated result of two computing modules is adjusted the probe location.
Further aspect of the application provides a kind of crystal round test approach, comprising: when at least one probe all with mesh
After marking wafer contacts formation needle trace, the automatic image for obtaining needle trace；Whether the needle trace is judged automatically in institute according to described image
It states in the predeterminable area on target wafer surface；When the needle trace is at least a part of exceeds predeterminable area, institute is calculated automatically
The distance that probe needs to adjust is stated, the probe location is adjusted according to the calculated result, is located at the needle trace pre-
If in region；When the needle trace is located in predeterminable area, wafer test is carried out.
In some embodiments of the present application, the crystal round test approach further includes, when at least one probe length
When different: by the wafer to close to the movement of the direction of the probe, it is electrically connected whole probes with the wafer；Note
Record the moving distance of the wafer when all the probe is electrically connected with the wafer；Carry out wafer test.
In some embodiments of the present application, the crystal round test approach further include: pre-enter preset value in systems
X1；The direction of the wafer to the close probe is mobile, when a probe longest in the probe touches institute at first
When stating wafer, then whether the mobile distance, delta X of the wafer exceeds preset value X for judgement immediately1；When the wafer is mobile
Distance, delta X exceed the preset value X1When, stop test.
In some embodiments of the present application, the crystal round test approach further include: pre-enter preset value X2And X3；It will
The direction of the wafer to the close at least one probe is mobile, when a probe longest in the probe touches at first
When the wafer, the distance OD1 of the record wafer movement at this time；Continue to move the wafer to the direction close to the probe
It is dynamic, when whole probes all touch the wafer, the distance OD2 of the record wafer movement at this time；It calculates needle and presses typical value,
The needle pressure typical value is equal to OD2 and adds X2；X is added when needle pressure typical value is less than or equal to OD13When, illustrate the probe with
The wafer electrical connection is good；X is added when the probe typical value is greater than OD13When, illustrate that the probe is electrically connected with the wafer
Connect bad, stopping detection.
In some embodiments of the present application, at least one probe contacts to form needle with the weld pad on the wafer
Trace judges whether the method in predeterminable area includes: when starting the wafer test system to the needle trace according to described image
Pre-entering the needle trace should minimum value H apart from weld pad outline border；Judge needle trace distance weldering in the needle trace image actually obtained
Whether the distance of pad outline border is less than the minimum value H, if it is greater than the minimum value H, illustrates needle trace within predeterminable area；Such as
Fruit is less than the minimum value H, illustrates that needle trace is at least a part of except predeterminable area.
A kind of wafer test system and crystal round test approach provided by the present application pass through input preset value and system program
Execution, it is automatic calculate needle and press and capture needle trace picture is compared with standard needle trace picture, judged by algorithm needle press and
Needle trace whether in predeterminable area, calculated automatically when needle trace exceeds predeterminable area by program adjustment required for probe away from
From, operation probe mobile device carries out probe adjustment, and it realizes needle pressure and needle trace automatically determines, and on-line tuning needle trace, nothing
Need to be manually operated with offline adjustment needle trace, save the testing time, improve testing efficiency, while can reduce human error.
Detailed description of the invention
Exemplary embodiment disclosed in this application is described in detail in the following drawings.Wherein identical appended drawing reference is in attached drawing
Several views in indicate similar structure.Those of ordinary skill in the art will be understood that these embodiments be non-limiting,
Exemplary embodiment, the purpose that attached drawing is merely to illustrate and describes, it is no intended to it limits the scope of the present disclosure, other modes
Embodiment may also similarly complete the intention of the invention in the application.It should be appreciated that the drawings are not drawn to scale.Wherein:
Fig. 1 is a kind of structural schematic diagram of tester table in the embodiment of the present application.
Fig. 2 is a kind of structural schematic diagram of wafer test system in the embodiment of the present application.
Fig. 3 is a kind of crystal round test approach flow chart in the embodiment of the present application.
Fig. 4 and Fig. 5 is a kind of structural schematic diagram of each step of wafer detection method in the embodiment of the present application.
Fig. 6 (a) and Fig. 6 (b) is respectively a kind of standard needle trace image and abnormal needle trace image in the embodiment of the present application.
Fig. 7 (a) and Fig. 7 (b) is the structural schematic diagram that the embodiment of the present application middle probe mobile device adjusts abnormal probe.
Specific embodiment
Following description provides the specific application scene of the application and requirements, it is therefore an objective to those skilled in the art be enable to make
It makes and using the content in the application.To those skilled in the art, to the various partial modifications of the disclosed embodiments
Be it will be apparent that and without departing from the spirit and scope of the disclosure, the General Principle that will can be defined here
Applied to other embodiments and application.Therefore, the embodiment the present disclosure is not limited to shown in, but it is consistent most wide with claim
Range.
Technical solution of the present invention is described in detail below with reference to embodiment and attached drawing.
The application provides a kind of wafer test system, comprising: plummer 110, for carrying and moving target wafer
120；At least one probe 131 is configured as being contacted in the predeterminable area on 120 surface of target wafer, in institute
When stating contact generation, tie point of the probe 131 on 120 surface of target wafer forms needle trace；Probe mobile device
140, it is configured as the position of probe 131 described in adjust automatically；Module 270 is adjusted, is configured as judging automatically the needle trace
Position, when the needle trace it is at least a part of except the predeterminable area when, the adjustment module 270 controls the probe and moves
At least one described probe 131 is moved in the predeterminable area by dynamic equipment 140.
Fig. 1 is a kind of structural schematic diagram of tester table in the embodiment of the present application.With reference to Fig. 1, described in the embodiment of the present application
Wafer test system includes tester table 100, and the tester table 100 is the device for carrying out wafer test, the test
Plummer 110 is provided on board 100, for the plummer 110 for carrying wafer 120, the plummer 110 can be vertical
It is moved on direction.When carrying out wafer test, the plummer 110 can carry the wafer 120 to the side close to probe 131
To movement, contact the wafer 120 with the probe 131.It is described after the wafer 120 is contacted with the probe 131
Probe 131 is electrically connected with the wafer 120.
The wafer test system further includes probe card 130, is set on the tester table 100, position is held with described
Microscope carrier 110 is opposite.The probe card 130 includes at least one probe 131, and the probe card 130 can be by the tester table
It is transferred on the probe 131 after the 100 test signal conversions issued, then is believed the test after conversion by the probe 131
It number is transferred on the wafer 120 and to carry out wafer test.
At least one probe 131 with the wafer 120 for being electrically connected, by what is received from the tester table 100
Test signal is transferred to the wafer 120, carries out wafer test.In some embodiments of the present application, at least one is visited
The mode that needle 131 is electrically connected with the wafer 120 to be tested is to connect the probe 131 and the weld pad 122 on the wafer 120
It connects.Include at least one chip on the wafer 120 in some embodiments of the present application, includes at least two on the chip
A weld pad 122 for being used to carry out wafer test, when carrying out wafer test, the every probe 131 and a weld pad 122
Contact, is electrically connected with the chip.
In some embodiments of the present application, the quantity of the probe 131 and the arrangement mode on the probe 130
With on the wafer 120 to be tested number of chips and chip arrangement it is corresponding, guarantee the probe 131 can with it is every
A corresponding chip electrical connection.
Refering to what is shown in Fig. 1, the wafer test system further includes probe mobile device 140, for visiting described in adjust automatically
The position of needle 131 further includes for clamping the probe clamp 141 of the probe 131 (in Fig. 1 in the probe mobile device 140
It is not shown).In some embodiments of the present application, the probe mobile device 140 is mechanical arm, the mechanical arm setting
In on the tester table 100.Before carrying out wafer detection, need to guarantee the probe 131 and the weldering on the wafer 120
Pad 122 contacts well, when the probe 131 and 122 contact position of weld pad on the wafer 120 are at least a part of not pre-
If when in region, the position of the adjustable probe 131 of probe mobile device 140 makes the probe 131 and the crystalline substance
121 contact position of weld pad on circle 120 is in predeterminable area.
In some embodiments of the present application, the probe mobile device 140 is set on the tester table 100, can
To move in the horizontal direction, after the probe mobile device 140 receives the instruction of adjustment probe, the probe movement is set
Standby 140 are moved to the position for needing the probe adjusted, and the probe clamp 141 clamps the probe for needing to adjust, will be described
Probe 131 is moved to normal place, makes the probe 131 with 121 contact position of weld pad on the wafer 120 in predeterminable area
It is interior.
Fig. 2 is a kind of structural schematic diagram of wafer test system in the embodiment of the present application.The wafer test system includes
Image collection module 250, third judgment module 222, the second computing module 241 adjust module 270 and test module 260.
Refering to what is shown in Fig. 2, after the probe 131 connect with the weld pad 122 on the wafer 120 and to form needle trace, it is described
Image collection module 250 obtains the image of the needle trace, and by image transmitting to third judgment module 222.The one of the application
In a little embodiments, it includes camera that described image, which obtains module 250, and the camera is for shooting weld pad on the wafer 120
121 image.After the probe 131 contacts to form needle trace with the weld pad 121 on the wafer 120, described image obtains mould
Block 250 obtains on the weld pad 121 image of needle trace and by image transmitting to third judgment module 222 by the camera.
Whether the third judgment module 222 judges the needle trace in predeterminable area.The third judgment module 222 connects
Receive described image obtain module 250 transmit image after, described image and standard needle trace image are compared, by algorithm come
Needle trace is judged whether in predeterminable area, when there is needle trace 132 beyond predeterminable area, illustrates this corresponding probe of exception needle trace
Judging result is transferred to the second computing module 241 by malposition；Judging result is passed when needle trace 132 is in predeterminable area
Test module 260 is defeated by start to carry out wafer test.
Second computing module 241 calculates the distance that the corresponding probe of the abnormal needle trace needs to adjust.When described
Two computing modules 241 receive the judging result that the third judgment module 222 transmits, that is, have needle trace 132 beyond predeterminable area
When, the distance that abnormal probe needs to adjust is calculated according to the position of needle trace abnormal in image, and calculated result is transferred to described
Adjust module 270.The adjustment module 270 is according to the calculated result of second computing module 241 to the position of the probe 131
It sets and is adjusted.
In some embodiments of the present application, second computing module 241 includes counting circuit, described different for calculating
The often distance that the corresponding probe of needle trace needs to adjust.
In some embodiments of the present application, adjustment abnormal probe position method be, the adjustment module 270 with it is described
It controls arm 140 to be connected, be controlled after the adjustment module 270 receives the calculated result that second computing module 241 transmits
The mobile probe 141 of the probe mobile device 140 is made to normal place.
The test module 260 receives the judging result that the third judgment module 222 transmits, and issues test signal pair
The wafer 120 is tested.When the test module 260 receives the judging result that the third judgment module 222 transmits,
When i.e. needle trace 132 is in predeterminable area, illustrate that the probe 131 is electrically connected well with the wafer 120, can start into
Row probe of wafer.
In some embodiments of the present application, the method for carrying out probe of wafer is test module 260 and the probe
130 connection of card, when the test module 260 receives the judging result that the third judgment module 222 transmits, i.e. needle trace 132
When in predeterminable area, illustrate that the probe 131 is electrically connected well with the wafer 120, can start to carry out wafer spy
It surveys.The test module 260 issues test signal to the probe card 130.After the probe card 130 receives test signal,
Signal conversion is then transferred to probe 131.The test signal received is transferred to the wafer by the probe 131
Chip on 120, the chip on the wafer 120 can issue feedback signal to probe 131 after receiving test signal.When described
When feedback signal is normal, illustrate that chip corresponding with the feedback signal is good；When the feedback signal exception, illustrate and institute
Stating the corresponding chip of abnormal feedback signal has exception.
In some embodiments of the present application, when the 131 length difference of at least one probe, the wafer test system
System further includes monitoring Regulation mechanism.The monitoring Regulation mechanism includes logging modle 210, the first computing module 240, the second judgement
Module 221, first judgment module 220, the first alarm module 230, the second alarm module 231.
The logging modle 210 recorded when the wafer 120 is close to the probe 131 wafer 120 it is mobile away from
The first computing module 240 is transferred to from and by record result.The logging modle 210 is connected with the plummer 110, Ke Yiji
Record the mobile distance of plummer 110.It should be noted that the plummer 110 carries the wafer 120, therefore, in this implementation
In example, the mobile distance of the plummer 110 is equal to the mobile distance of the wafer 120.
In some embodiments of the present application, the logging modle 210 includes range sensor, for incuding the carrying
The mobile distance of platform 110.
The first judgment module 220 is connected with the plummer 110, can recorde the mobile distance of plummer 110.The
One judgment module 220 judges whether the mobile distance of the wafer 120 exceeds preset value immediately.The plummer 110 carries institute
State wafer 120.Therefore, the mobile distance of the plummer 110 is equal to the mobile distance of the wafer 120.When the wafer 120
When mobile distance exceeds preset value, judging result is transferred to the first alarm module by the first judgment module；When the crystalline substance
When the mobile distance of circle 120 is without departing from preset value, the first judgment module 220 does not do any action.
In some embodiments of the present application, the first judgment module 220 includes range sensor, described for incuding
The mobile distance of plummer 110.
First alarm module 230 is connected with the first judgment module 220.First alarm module 230 receives
The judging result transmitted to the first judgment module 220, i.e., when the mobile distance of the described wafer 120 exceeds preset value, to institute
It states tester table 100 to sound an alarm, indicates that the wafer test system stops test.
The logging modle 210 records the mobile distance of the wafer 120.First computing module 240 receives record
The record result that module 210 transmits.After receiving the record result that the logging modle 210 is transmitted, the first computing module 240
Needle pressure typical value OD3 is calculated according to the mobile distance of the wafer 120 and calculated result is transferred to the second judgment module
221, the needle pressure typical value OD3 can represent needle pressure, and needle presses typical value OD3 bigger, illustrates that needle pressure is bigger；Needle presses typical value
OD3 is smaller, illustrates that needle pressure is smaller.
Second judgment module 221 is connected with first computing module 240.Second judgment module 221 receives
After the calculated result transmitted to first computing module 240, according to formula judge calculated needle press typical value OD3 whether
In preset range.When the needle pressure typical value OD3 within a preset range when, second judgment module 221 passes judging result
It is defeated by described image and obtains module 250, described image is obtained after module 250 receives judging result and brought into operation；When the needle
When pressing typical value OD3 beyond in preset range, judging result is transferred to the second alarm mould by second judgment module 221
Block 231.
Second alarm module 231 is connected with second judgment module 221.When second alarm module 231 connects
After the judging result for receiving second judgment module 221, i.e., the described calculated needle pressure typical value OD3 is beyond in preset range
When, Xiang Suoshu tester table 100 sounds an alarm, and indicates that the wafer test system stops test.
The application also provides a kind of crystal round test approach, comprising: when at least one probe 131 all connects with wafer 120
After touching forms needle trace, the image of needle trace is obtained；Whether within a preset range the needle trace is judged according to described image；When the needle
When trace exceeds preset range, the distance that the probe 131 needs to adjust is calculated, according to the calculated result to the probe 131
Position is adjusted, and is located at the needle trace in preset range；When the needle trace is located in preset range, wafer survey is carried out
Examination.
Fig. 3 is a kind of crystal round test approach flow chart in the embodiment of the present application.With reference to Fig. 3, start the wafer test system
System, inputs preset value, the preset value includes X in systems1, X2, X3And H.The preset value is arranged according to product wafer
's.Meaning and purposes about the preset value can be described in corresponding place below.
Fig. 4 and Fig. 5 is a kind of structural schematic diagram of each step of wafer detection method in the embodiment of the present application.With reference to Fig. 3 and
Fig. 4, activation system and after inputting preset value run the plummer 110, and the plummer 110 carries wafer 120 to close to visiting
The direction of needle 131 is mobile.With reference to Fig. 4, when the longest probe in the probe card 130 contacts the wafer 120, the wafer
120 relative to the distance of wafer initial position 121 be OD1, the logging modle 210 record when in the probe card 130 most
When long probe contacts the wafer 120, result is simultaneously transferred to the first computing module by the mobile distance OD1 of the wafer 120
240。
With reference to Fig. 3, the plummer 110 is continued to run, the plummer 110, which carries wafer 120, to be continued to close to probe
131 direction is mobile, and the first judgment module 220 judges to continue to lean on after the wafer 120 contacts the longest probe immediately
Whether moving distance Δ X when the nearly probe 131 exceeds preset value X1, and judging result is transferred to the first alarm module
230.When the mobile distance, delta X of the wafer exceeds the preset value X1When Y (Yes) (judging result be), described in explanation
The depth that longest probe enters the wafer 120 is too deep, may cause to damage to the wafer 120.At this point, first alarm
Module 230 sounds an alarm, and indicates that the wafer test system stops test, the probe 131 is avoided to cause the wafer 120
Damage；When the mobile distance, delta X of the wafer is without departing from the preset value X1When N (No) (judging result be), it is described
Plummer 110 continues to close to described in the mobile most short probe contact until in the probe card 130 in the direction of the probe 131
Wafer 120.In 110 moving process of plummer, the first judgment module 220 persistently keeps working condition, sentences immediately
Whether the mobile distance, delta X of the wafer 120 that breaks exceeds preset value X1, guarantee to connect when the most short probe in the probe card 130
When touching the wafer 120, the mobile distance, delta X of the wafer is without departing from the preset value X1.
With reference to Fig. 3 and Fig. 5, the carrying of plummer 110 wafer 120 continues the direction movement to the close probe 131,
When the most short probe in the probe card 130 contacts the wafer 120, (all probes 131 all contact institute in probe card 130
State wafer 120), the wafer 120 is OD2 relative to the distance of wafer initial position 121, and the record of logging modle 210 is worked as
When most short probe in the probe card 130 contacts the wafer 120, the mobile distance OD2 of the wafer 120 simultaneously passes result
It is defeated by the first computing module 240.
With reference to Fig. 3, first computing module 240 calculates the needle pressure according to the data that the logging modle 210 records
Calculated result is simultaneously transferred to the second judgment module 221 by typical value OD3.The needle pressure typical value OD3 is equal to OD2 and adds X2.Institute
Needle pressure can be represented by stating needle pressure typical value OD3.Needle presses typical value OD3 bigger, illustrates that needle pressure is bigger；Needle presses typical value OD3 smaller,
Illustrate that needle pressure is smaller.
With reference to Fig. 3, it is default that second judgment module 221 judges whether the calculated needle pressure typical value OD3 exceeds
Range.In some embodiments of the present application, judge whether the needle pressure typical value OD3 exceeds the foundation of preset range are as follows: when
The needle pressure typical value OD3 is less than or equal to OD1 and adds X3When, the needle pressure typical value OD3 (judges without departing from preset range
When being as a result N (No)), illustrate that the probe 131 is electrically connected well with the wafer 120, can start to obtain needle trace image；When
The probe typical value OD3 is greater than OD1 and adds X3When, beyond preset range, (i.e. judging result is Y to the needle pressure typical value OD3
(Yes) when), it is bad to illustrate that the probe 131 is electrically connected with the wafer 120, second alarm module 231 sounds an alarm,
Indicate that the wafer test system stops test.
With reference to Fig. 3, after the probe 131 is electrically connected good with the wafer 120, starting described image obtains module
250 obtain needle trace image.In some embodiments of the present application, the probe 131 connects with the weld pad 122 on the wafer 120
Touching forms needle trace, and described image obtains module 250 and is connected with camera, and the camera can shoot and weld on the wafer 120
The image of pad 122.After the probe 131 contacts to form needle trace with the weld pad 122 on the wafer 120, described image is obtained
Module 250 obtains the image of needle trace on the weld pad 122 by the camera and gives image transmitting to third judgment module
222。
With reference to Fig. 3, after the third judgment module 222 receives the needle trace image that described image obtains the transmission of module 250,
By the needle trace image compared with standard needle trace image, judge the needle trace whether in predeterminable area.Fig. 6 (a) and Fig. 6 (b)
A kind of standard needle trace image and abnormal needle trace image respectively in the embodiment of the present application.With reference to Fig. 6 (a), in normal needle trace figure
As in, the needle trace 132 is located in the dotted line frame on weld pad 122, and the dotted line frame represents the predeterminable area of the needle trace 132.
The needle trace 132 is pre-entered when starting the wafer test system to be apart from the minimum value of 122 outline border of weld pad
H。
In some embodiments of the present application, judge whether the method in predeterminable area is to judge reality to the needle trace 132
Whether distance of the needle trace 132 apart from 122 outline border of weld pad is less than the minimum value H in the needle trace image that border obtains.If it is greater than institute
Minimum value H is stated, illustrates needle trace 132 within predeterminable area, the contact position of the probe 131 and the wafer 120 is correct；Such as
Fruit is less than the minimum value H, illustrates needle trace 132 except predeterminable area.Because of the contact position of probe 131 and the wafer 120
Set it is incorrect, so forming malposition of the probe of the abnormal needle trace in probe card 130.It is described with reference to Fig. 6 (b)
Distance of the needle trace 132 apart from 122 outline border of weld pad is respectively h1, h2, h3 and h4.When the distance h1, h2, h3 and h4 are big
When the minimum value H, illustrate the needle trace 132 within predeterminable area (i.e. in dotted line frame)；As the distance h1, h2, h3
And have in h4 any one distance be less than the minimum value H when, illustrate the needle trace 132 it is at least a part of predeterminable area it
Outside (i.e. outside dotted line frame).For example, as shown in fig. 6, wherein h1 and h2 is respectively less than the minimum value H, a part of the needle trace 132
Outside dotted line frame, exceed predeterminable area.
With reference to Fig. 3, when the judging result of the third judgment module 222 is Y (Yes), i.e., the needle trace 132 is in preset areas
When within domain, starting test module 260 carries out wafer test；When the third judgment module 222 judging result be N (No),
The i.e. described needle trace 132 it is at least a part of except predeterminable area when, illustrate to be formed the probe of the abnormal needle trace in probe card
Malposition on 130.Correspondingly, second computing module 221 calculates distance that the abnormal probe needs to adjust simultaneously
Send calculated result to adjustment module.
For the exception needle trace shown in Fig. 6 (b), in some embodiments of the present application, the abnormal probe needs
The distance of adjustment is the range for the distance, delta H1 for moving down the probe are as follows:
| H-h2 | < Δ H1 < | H-h3 |
The range for the distance, delta H2 that the probe is moved to the left are as follows:
| H-h1 | < Δ H2 < | H-h4 |
For the exception needle trace shown in Fig. 6 (b), in other embodiments of the application, with the weld pad 122
Center is that origin establishes coordinate system, wherein in the horizontal direction, is negative direction on the left of the origin, is positive on the right side of the origin
Direction；In vertical direction, it is positive direction on the upside of the origin, is negative direction on the downside of the origin.The abnormal probe needs
The distance of adjustment is the range for the distance, delta H1 for moving the probe in vertical direction are as follows:
H-h2 < Δ H1 < H-h3
The range for the distance, delta H2 that the probe is moved in the horizontal direction are as follows:
H-h1 < Δ H2 < H-h4
When calculated result is negative value, it is mobile to negative direction to represent the probe；When calculated result is positive value, institute is represented
It is mobile to positive direction to state probe.
It should be noted that term position " upper " mentioned here " under " and " left side " " right side " be only applicable to the application reality
Abnormal needle trace image described in example diagram 6 (b) is applied, restriction, the abnormal probe are not made to the direction of probe adjustment
The direction for needing to adjust is determined according to the offset direction of the actually described abnormal needle trace.
With reference to Fig. 3, the calculated result is transferred to adjustment module 270, the adjustment mould by second computing module 241
Block 270 controls the position that the probe mobile device 140 is moved to abnormal probe, according to the calculated result to abnormal probe into
Row adjustment.Fig. 7 (a) and Fig. 7 (b) is the structural schematic diagram that the embodiment of the present application middle probe mobile device adjusts abnormal probe.Ginseng
Fig. 7 (a), malposition of the abnormal probe in probe card 130 are examined, the probe mobile device 140 is moved to described
The position of abnormal probe, the probe clamp 141 in the probe mobile device 140 clamp the abnormal probe.With reference to Fig. 7 (b),
The abnormal probe is moved to correct position by the probe mobile device 140, completes probe adjustment.
With reference to Fig. 3, after adjusting the abnormal probe, the step of obtaining needle trace image is come back to, repeats the acquisition
Needle trace image judges the needle trace in needle trace image whether in predeterminable area, calculates distance and adjustment that probe needs to adjust
Probe and etc. be located within predeterminable area until the probe needle trace, start wafer test module 260, carry out wafer test.
A kind of wafer test system and crystal round test approach provided by the present application, by inputting preset value X1, X2, X3With H with
And the execution of system program, automatic calculating needle presses typical value and captures needle trace picture to be compared with standard needle trace picture, is passed through
Algorithm judges that needle pressure typical value and needle trace whether in predeterminable area, pass through journey when the needle trace exceeds predeterminable area
Sequence calculates the distance adjusted required for probe automatically, and operation probe mobile device carries out probe adjustment, realizes needle pressure and needle trace
Automatically determine, and on-line tuning needle trace saves the testing time, improves survey without manual operation and offline adjustment needle trace
Efficiency is tried, while can reduce human error.
In conclusion after reading this detailed disclosures, it will be understood by those skilled in the art that aforementioned detailed disclosure
Content can be only presented in an illustrative manner, and can not be restrictive.Although not explicitly described or shown herein, this field skill
Art personnel are understood that improve and modify it is intended to include the various reasonable changes to embodiment.These change, improve and
It modifies and is intended to be proposed by the disclosure, and in the spirit and scope of the exemplary embodiment of the disclosure.
It should be appreciated that term that the present embodiment uses " and/or " it include associated listing one or more of project
It is any or all combination.It, can be with it should be appreciated that when an element is referred to as " connection " or " coupling " to another element
It is directly connected or is coupled to another element, or there may also be intermediary elements.
It is also understood that term " including ", " including ", " including " and/or " including ", is deposited herein in use, indicating
In documented feature, entirety, step, operation, element and/or component, but be not precluded presence or it is additional one or more its
His feature, entirety, step, operation, element, component and/or their group.
It is also understood that although term first, second, third, etc. can be used herein to describe various elements, these
Element should not be limited by these terms.These terms are only used to distinguish an element with another element.Therefore, exist
In the case where not being detached from the teachings of the present invention, first element in some embodiments can be referred to as in other embodiments
Second element.Identical reference label or identical reference designator indicate identical element throughout the specification.
In addition, by reference to as Utopian graphical representation of exemplary cross sectional view and/or plane diagram example is described
Property embodiment.Therefore, because with the shape illustrated not being both foreseeable caused by such as manufacturing technology and/or tolerance.Cause
Exemplary embodiment, should not be interpreted as being limited to the shape in region out shown here, but should include by for example making by this
The deviation in shape caused by making.For example, the etching area for being shown as rectangle would generally have circular or curved spy
Sign.Therefore, region shown in figure is substantially schematical, and shape is not configured to show the practical shape in the region of device
Shape is also not to limit the range of exemplary embodiment.
Claims (11)
1. a kind of wafer test system characterized by comprising
Plummer, for carrying and moving target wafer；
At least one probe is configured as being contacted in the predeterminable area on the target wafer surface, in the contact
When generation, tie point of the probe on the target wafer surface forms needle trace；
Probe mobile device is configured as the position of probe described in adjust automatically；
Module is adjusted, is configured as judging automatically the position of the needle trace, when the needle trace is at least a part of described default
When except region, the adjustment module controls the probe mobile device and at least one described probe is moved to the preset areas
In domain.
2. wafer test system as described in claim 1, which is characterized in that further include:
Logging modle, for when the wafer is close to the probe, recording the mobile distance of the plummer；
First judgment module, for judging whether the mobile distance of the plummer exceeds preset value immediately；
First alarm module is connected with the first judgment module, issues when the mobile distance of the wafer exceeds preset value
Alarm indicates that the wafer test system stops test；
First computing module receives the record from logging modle as a result, for calculating according to the mobile distance of the wafer
Needle presses typical value；
Second judgment module is connected with first computing module, for judge the calculated needle pressure typical value whether
In preset range；
Second alarm module is connected with second judgment module, when the calculated needle pressure typical value is not in preset range
It is sounded an alarm when interior, indicates that the wafer test system stops test.
3. wafer test system as described in claim 1, which is characterized in that the predeterminable area is located at the weldering of the crystal column surface
On pad.
4. wafer test system as described in claim 1, which is characterized in that it further include image collection module, it is described for obtaining
The image of needle trace, whether the needle trace image is for judging the needle trace in the predeterminable area.
5. wafer test system as described in claim 1, which is characterized in that it further include third judgment module, it is described for judging
Whether needle trace is in predeterminable area.
6. wafer test system as described in claim 1, which is characterized in that further include the second computing module, when the needle trace extremely
When rare a part exceeds predeterminable area, the distance that the probe needs to adjust is calculated, the adjustment module is according to described second
The calculated result of computing module is adjusted the probe location.
7. a kind of crystal round test approach characterized by comprising
After at least one probe all contacts to form needle trace with target wafer, the automatic image for obtaining needle trace；
The needle trace is judged automatically whether in the predeterminable area on the target wafer surface according to described image；
When the needle trace is at least a part of exceeds predeterminable area, the distance that the probe needs to adjust is calculated automatically, according to
The calculated result is adjusted the probe location, is located at the needle trace in predeterminable area；
When the needle trace is located in predeterminable area, wafer test is carried out.
8. crystal round test approach as claimed in claim 7, which is characterized in that further include, when at least one probe length not
Meanwhile:
By the wafer to close to the movement of the direction of the probe, it is electrically connected whole probes with the wafer；
Record the moving distance of the wafer when all the probe is electrically connected with the wafer；
Carry out wafer test.
9. crystal round test approach as claimed in claim 8, which is characterized in that further include:
Preset value X is pre-entered in systems1；
The direction of the wafer to the close probe is mobile, when a probe longest in the probe touches institute at first
When stating wafer, then whether the mobile distance, delta X of the wafer exceeds preset value X for judgement immediately1；
When the mobile distance, delta X of the wafer exceeds the preset value X1When, stop test.
10. crystal round test approach as claimed in claim 8, which is characterized in that further include:
Pre-enter preset value X2And X3；
The wafer is mobile to the direction close at least one probe, when a probe longest in the probe at first
When touching the wafer, the distance OD1 of the record wafer movement at this time；
Continue the wafer to close to the movement of the direction of the probe, when whole probes all touch the wafer, record
The mobile distance OD2 of the wafer at this time；
It calculates needle and presses typical value, the needle pressure typical value is equal to OD2 and adds X2；
X is added when needle pressure typical value is less than or equal to OD13When, illustrate that the probe is electrically connected well with the wafer；Work as institute
Probe typical value is stated greater than OD1 plus X3When, it is bad to illustrate that the probe is electrically connected with the wafer, stops detection.
11. crystal round test approach as claimed in claim 7, which is characterized in that on at least one probe and the wafer
Weld pad contacts to form needle trace, judges whether the method in predeterminable area includes: the needle trace according to described image
The needle trace is pre-entered when starting the wafer test system should minimum value H apart from weld pad outline border；
Judge whether distance of the needle trace apart from weld pad outline border is less than the minimum value H in the needle trace image actually obtained, if greatly
In the minimum value H, illustrate needle trace within predeterminable area；If it is less than the minimum value H, illustrate that needle trace is at least a part of
Except predeterminable area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910552906.7A CN110211893A (en) | 2019-06-24 | 2019-06-24 | A kind of wafer test system and crystal round test approach |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910552906.7A CN110211893A (en) | 2019-06-24 | 2019-06-24 | A kind of wafer test system and crystal round test approach |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110211893A true CN110211893A (en) | 2019-09-06 |
Family
ID=67794516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910552906.7A Pending CN110211893A (en) | 2019-06-24 | 2019-06-24 | A kind of wafer test system and crystal round test approach |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110211893A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128782A (en) * | 2019-12-27 | 2020-05-08 | 上海华虹宏力半导体制造有限公司 | Wafer testing method |
| CN111755341A (en) * | 2020-06-03 | 2020-10-09 | 武汉光谷信息光电子创新中心有限公司 | Dotting marking method and device for silicon photonic wafer |
| CN111929566A (en) * | 2020-08-20 | 2020-11-13 | 厦门市三安集成电路有限公司 | Wafer testing method, device and control equipment thereof |
| CN112362580A (en) * | 2020-10-26 | 2021-02-12 | 琉明光电(常州)有限公司 | Photographing detection system and method for probe mark |
| CN113640557A (en) * | 2021-08-11 | 2021-11-12 | 山东大学 | System and method for automatically adjusting height of needle insertion |
| CN113947871A (en) * | 2020-07-17 | 2022-01-18 | 南亚科技股份有限公司 | Alarm device and alarm method thereof |
| CN114113968A (en) * | 2022-01-26 | 2022-03-01 | 广州粤芯半导体技术有限公司 | Adjusting method of wafer testing device |
| CN114264657A (en) * | 2020-09-16 | 2022-04-01 | 南亚科技股份有限公司 | Wafer inspection method and system |
| CN114880219A (en) * | 2022-04-29 | 2022-08-09 | 北京达佳互联信息技术有限公司 | Test node configuration method and device, electronic equipment and storage medium |
| CN116168996A (en) * | 2023-04-24 | 2023-05-26 | 合肥晶合集成电路股份有限公司 | Electron microscope and working method thereof |
| CN116469778A (en) * | 2023-03-10 | 2023-07-21 | 上海威固信息技术股份有限公司 | Chip packaging method and system for increasing chip quality |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07288270A (en) * | 1994-04-18 | 1995-10-31 | Tokyo Electron Ltd | Method and apparatus for probing |
| JP2004063877A (en) * | 2002-07-30 | 2004-02-26 | Tokyo Seimitsu Co Ltd | Wafer-positioning correction method |
| CN104793118A (en) * | 2014-01-17 | 2015-07-22 | 中芯国际集成电路制造(上海)有限公司 | Method of setting test probe pressure |
| CN104897687A (en) * | 2015-05-27 | 2015-09-09 | 上海华力微电子有限公司 | Detection system and method for needle mark position of probe |
-
2019
- 2019-06-24 CN CN201910552906.7A patent/CN110211893A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07288270A (en) * | 1994-04-18 | 1995-10-31 | Tokyo Electron Ltd | Method and apparatus for probing |
| JP2004063877A (en) * | 2002-07-30 | 2004-02-26 | Tokyo Seimitsu Co Ltd | Wafer-positioning correction method |
| CN104793118A (en) * | 2014-01-17 | 2015-07-22 | 中芯国际集成电路制造(上海)有限公司 | Method of setting test probe pressure |
| CN104897687A (en) * | 2015-05-27 | 2015-09-09 | 上海华力微电子有限公司 | Detection system and method for needle mark position of probe |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111128782A (en) * | 2019-12-27 | 2020-05-08 | 上海华虹宏力半导体制造有限公司 | Wafer testing method |
| CN111755341A (en) * | 2020-06-03 | 2020-10-09 | 武汉光谷信息光电子创新中心有限公司 | Dotting marking method and device for silicon photonic wafer |
| CN111755341B (en) * | 2020-06-03 | 2021-12-14 | 武汉光谷信息光电子创新中心有限公司 | Dotting marking method and device for silicon photonic wafer |
| CN113947871B (en) * | 2020-07-17 | 2023-07-11 | 南亚科技股份有限公司 | Alarm device and alarm method thereof |
| CN113947871A (en) * | 2020-07-17 | 2022-01-18 | 南亚科技股份有限公司 | Alarm device and alarm method thereof |
| CN111929566A (en) * | 2020-08-20 | 2020-11-13 | 厦门市三安集成电路有限公司 | Wafer testing method, device and control equipment thereof |
| CN114264657A (en) * | 2020-09-16 | 2022-04-01 | 南亚科技股份有限公司 | Wafer inspection method and system |
| CN112362580A (en) * | 2020-10-26 | 2021-02-12 | 琉明光电(常州)有限公司 | Photographing detection system and method for probe mark |
| CN113640557A (en) * | 2021-08-11 | 2021-11-12 | 山东大学 | System and method for automatically adjusting height of needle insertion |
| CN114113968A (en) * | 2022-01-26 | 2022-03-01 | 广州粤芯半导体技术有限公司 | Adjusting method of wafer testing device |
| CN114880219A (en) * | 2022-04-29 | 2022-08-09 | 北京达佳互联信息技术有限公司 | Test node configuration method and device, electronic equipment and storage medium |
| CN116469778A (en) * | 2023-03-10 | 2023-07-21 | 上海威固信息技术股份有限公司 | Chip packaging method and system for increasing chip quality |
| CN116168996A (en) * | 2023-04-24 | 2023-05-26 | 合肥晶合集成电路股份有限公司 | Electron microscope and working method thereof |
| CN116168996B (en) * | 2023-04-24 | 2023-06-27 | 合肥晶合集成电路股份有限公司 | Electron microscope and working method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110211893A (en) | A kind of wafer test system and crystal round test approach | |
| KR101102718B1 (en) | Needle trace transfer member and probe apparatus | |
| US7772862B2 (en) | Alignment method, tip position detecting device and probe apparatus | |
| KR100832165B1 (en) | Probing method and device | |
| KR20080086816A (en) | Method for detecting tip position of probe, alignment method, apparatus for detecting tip position of probe and probe apparatus | |
| TWI718773B (en) | Method of operating a probing apparatus | |
| US7265536B2 (en) | Procedure for reproduction of a calibration position of an aligned and afterwards displaced calibration substrate in a probe station | |
| JPH11163047A (en) | Manufacture of semiconductor device and apparatus therefor | |
| JP2018117095A (en) | Prober and contact method of probe needle | |
| JP4950779B2 (en) | Probe card registration method and program recording medium recording this program | |
| CN111146103B (en) | Wafer detection method and detection equipment | |
| CN106558513B (en) | Detection device and detection method thereof | |
| JP2984541B2 (en) | Probing method and probe device | |
| JP2007095938A (en) | Tester, prober, wafer test system and electrical contact position detection method | |
| JP2005150224A (en) | Semiconductor testing apparatus using probe information and testing method | |
| JPH08327658A (en) | Inspection equipment for substrate | |
| KR100982343B1 (en) | Apparatus for measuring and calibrating error of stage in wafer prober | |
| JPH0441495B2 (en) | ||
| JP3202577B2 (en) | Probe method | |
| JP2006128452A (en) | Probe card and prober, process for fabricating semiconductor device | |
| JP5370828B2 (en) | TFT array inspection apparatus and TFT substrate alignment method | |
| CN216792380U (en) | Probe disc, wafer detection card and wafer test system | |
| JP2003152037A (en) | Method and apparatus for inspecting wafer as well as inspecting infrared imaging unit | |
| KR20080013522A (en) | Method for adjusting levelness of chuck and probe tester using the same | |
| CN219715254U (en) | Detecting and alarming device for chip position in automatic test |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190906 |