JP2005241491A - Substrate inspection device and its positioning method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate inspection device capable of contacting the contact shoes with inspection points surely at the time of inspection while suppressing the increase in cost. <P>SOLUTION: A misalignment detection part detects the center of correction mark using each contact shoe (# 12, #13), derives the necessary driving vector for positioning each contact shoe to the center from the detected center, and detects the misalignment with the driving vector of the contact shoe in the memory part (# 14). The misalignment detection part makes a camera photograph the correction mark, makes detect the center lines (# 15), deduces the driving vector necessary to drive the position of the camera so as to pass the light axis pass through the center (# 16). A driving data correction process part corrects the driving data for each contact shoe in the memory for making each contact shoe contact to the pad based on the detected misalignment (# 17). <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a board inspection apparatus for inspecting conduction / short-circuiting of wiring of a board such as a printed wiring board, and a driving position adjusting method of a probe or a contact of the board inspection apparatus. The present invention is not limited to printed wiring boards, but is used for inspection of electrical wiring on various substrates such as flexible substrates, multilayer wiring substrates, power line device substrates for liquid crystal displays and plasma displays, and film carriers for semiconductor packages. In this specification, these wiring boards are collectively referred to as “substrates” and described.

  Conventionally, wiring formed on a substrate such as a printed circuit board or a package substrate used for an IC package, connection wiring such as a through hole or via, and a land or pad for connecting an IC package or a semiconductor chip to the connection wiring Continuity of conductor patterns (hereinafter referred to as wiring patterns), short circuit between wiring patterns, or whether each wiring pattern is insulated from other wiring patterns (whether sufficient insulation is ensured). A substrate inspection apparatus that performs inspection is known.

  In such a substrate inspection apparatus, for example, Patent Document 1 below includes a pair of contacts, and drives the pair of contacts to an inspection position according to a program designed in advance according to the wiring pattern of the substrate to be inspected. Then, it is disclosed that the various inspections are performed by sequentially contacting the inspection points on the wiring pattern and detecting the current flowing between the pair of contacts.

  In this type of substrate inspection apparatus, when the pads to be contacted with the contacts are extremely small, particularly the positioning accuracy of the contacts is required.

  However, for example, when the contact is exchanged, the position of the tip of the contact may deviate from the position before the exchange. Moreover, the length of the contactor before replacement | exchange and the contactor after replacement | exchange may not be the same by the error on contact manufacture. In such a case, the actual relative positional relationship between the contacts has an error with the logical positional relationship (the positional relationship of the contacts on the program) stored in advance as a reference, and as a result, this reference Even if the contact is moved in the drive direction and drive amount of the contact set in advance based on the logical positional relationship, it is impossible to make contact with the inspection point on the desired pad.

  Therefore, for example, in the following Patent Document 2, a camera and a monitor that displays an image captured by the camera are installed in a substrate inspection apparatus, and a calibration board with pressure-sensitive paper attached is set at a predetermined position. There is disclosed a technique in which a positional relationship between contactors is corrected using a pressure sensitive paper and a camera.

That is, each contactor is brought into contact with the pressure-sensitive paper in a state where it is located at the initial position, a trace formed on the pressure-sensitive paper is picked up by the camera, and the picked-up image is displayed on the monitor. Then, the operator compares the positional relationship between the traces formed by the contact of each contact (the distance between the contacts, etc.) with the positional relationship of the contact set in advance as a reference, and determines the position of the contact. Work to adjust the positional relationship between the contacts so that the relationship matches the reference positional relationship.
JP-A-3-229167 Nidec Lead Corporation Instruction Manual GATS-3220 Ver 1.2.0

  However, in the technique of Non-Patent Document 1, generally, the tip of the contact is extremely thin and the trace formed on the pressure-sensitive paper is extremely small (for example, 20 μm), so that it is difficult to visually recognize the trace image displayed on the monitor. . Therefore, it is difficult for the operator to accurately grasp the position of the trace and an error occurs, so that the positioning accuracy of the contactor is limited.

  Further, since pressure-sensitive paper leaves traces even when subjected to a relatively small pressure, handling thereof is necessary, and improvement in workability cannot be expected and is expensive.

  On the other hand, apart from the problem of the positional relationship between each contactor, the circuit board to be inspected may deviate from the design value due to the influence of heat at the time of forming the wiring, for example. In this case as well, if the contact is driven to the inspection point based on the design value, the contact may be displaced from the inspection point, and the contact driving direction set in advance based on the reference logical positional relationship In addition, there is a problem that even if the contact is moved by the driving amount, it is not possible to contact the inspection point on the desired pad.

  The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate inspection apparatus capable of reliably bringing a contact into contact with a desired inspection point during inspection while suppressing an increase in cost. .

  The invention according to claim 1 includes a pair of probe units each provided with a contact and driving means for independently driving each probe unit, and a wiring pattern formed on the surface of the substrate to be inspected. In a substrate inspection apparatus for inspecting the wiring pattern by bringing each contact into contact with an inspection point, the drive positions of both contacts when driving both the contacts to sequentially contact each inspection point of the wiring pattern Is stored as position data with reference to a design reference position, and an image of a first mark formed in a predetermined shape at a predetermined position of the substrate to be inspected is captured. Therefore, the imaging unit driven integrally with one of the probe units, and the optical axis of the imaging unit and the center of the first mark from the reference position scheduled in the design of the imaging unit are predetermined. A second storage unit that stores data of a planned drive vector of the imaging unit until it is driven to be in a positional relationship, and the imaging unit from a reference position set based on data of a planned reference position, Detection means for detecting an actual drive vector necessary for driving until a captured image having the predetermined positional relationship between the optical axis and the center of the first mark is obtained; and stored in the second storage means And a correction unit that compares the planned drive vector with the actual drive vector detected by the detection unit and corrects the position data stored in the first storage unit based on the comparison result. This is a substrate inspection apparatus.

  According to a second aspect of the present invention, in the substrate inspection apparatus according to the first aspect, the scheduled drive vector and the actual drive vector are stored and detected as coordinates of a vector tip having the respective reference positions as origins. It is a feature.

  According to a third aspect of the present invention, in the substrate inspection apparatus according to the first or second aspect, at least two of the first marks are formed dispersedly at predetermined positions of the substrate to be inspected, and the correction means The center of the substrate to be inspected is detected from the actual drive vector for each first mark, and the position data is corrected according to the deviation between the detected center and the design center.

  According to a fourth aspect of the present invention, in the substrate inspection apparatus according to any one of the first to third aspects, the imaging means is provided so as to be integrally driven with respect to each of the pair of probe units. Each imaging means is characterized in that the planned drive vector is stored, the actual drive vector is detected, and the position data is corrected.

  According to a fifth aspect of the present invention, in the substrate inspection apparatus according to any one of the first to third aspects, the imaging unit is driven integrally with only one of the pair of probe units. The substrate inspection apparatus is further provided with a second mark formed on the surface of the reference substrate set at a predetermined position by a material having a different electrical characteristic from the peripheral region and representing a predetermined figure. An electrical state change generated by moving each contactor in contact or non-contact with respect to the peripheral region and electrically scanning is detected, and from the detected value, a reference position on the design of the contactor is detected. And a second detection means for detecting center position data when the contact is positioned at the center of the second mark, and a relative positional relationship between the contacts is detected based on the center position data for each contact. And third correcting means for further correcting position data of each contact stored in the first storage means based on the relative positional relationship detected by the third detecting means. It is characterized by comprising.

  According to a sixth aspect of the present invention, a wiring pattern formed on a plate surface of a substrate to be inspected is provided with a pair of probe units each having a contact and driving means for independently driving the probe units. In the board inspection apparatus for inspecting the wiring pattern by bringing each contact into contact with an inspection point, presetting is performed based on a predetermined relative positional relationship between the two contacts at a predetermined logical reference position of the two probe units. The drive data on the logical drive amount and the drive direction from the predetermined logical reference position of each probe unit necessary for bringing each contact into contact with the inspection point of the wiring pattern is stored. A predetermined figure is made of a material having different electrical characteristics from the peripheral region at a predetermined position on the plate surface of the reference substrate positioned at the first storage means and the predetermined position. An electrical state change of the contact generated by moving each contactor in contact or non-contact with the first mark and its peripheral region is detected, and the first change is detected using the state change. First detection means for detecting a center position of one mark, and a drive amount and a drive direction of each probe unit to be driven to position each contactor at the center position from an actual reference position; Based on the driving amount and driving direction, the actual relative positional relationship between the two contacts at the reference position is detected in reverse calculation, and the probe unit is detected based on the actual relative positional relationship and the predetermined logical relative positional relationship. A board inspection apparatus comprising: a first correction unit that corrects drive data.

  According to a seventh aspect of the present invention, in the substrate inspection apparatus according to the sixth aspect, the substrate inspection apparatus is formed on the plate surface of the substrate to be inspected so as to correct drive data for the probe unit with respect to distortion of the substrate to be inspected during the inspection. Imaging means provided so as to be integrally driven by only one of the probe units so as to take an image of the second mark, and the probe unit and the imaging means at a predetermined logical reference position The imaging necessary for positioning the second mark from the predetermined logical reference position, which is set in advance based on a predetermined logical relative positional relationship between the contact and the imaging unit, at a position for imaging. A second storage unit that stores drive data about a logical driving amount and a driving direction of the unit; and the first mark is imaged by the imaging unit, and the imaging operation is performed. Second detection means for detecting a center position of the first mark from the obtained image of the first mark, and positioning the contactor at the center position from an actual reference position of the probe unit. Based on the driving amount and driving direction of the probe unit to be driven and the driving amount and driving direction of the imaging unit to drive the optical axis from the reference position with respect to the imaging unit to the central position. , Detecting the actual relative positional relationship between the contact and the imaging unit at each actual reference position in reverse, and based on the actual relative positional relationship and a predetermined logical relative positional relationship between the contact and the imaging unit And a second correction means for correcting drive data for the probe unit.

  According to an eighth aspect of the present invention, in the substrate inspection apparatus according to the sixth or seventh aspect, the first detection unit has a predetermined potential difference between the circular or elliptical first mark and its peripheral region. And detecting a change in the potential of the contact generated at the peripheral portion of the first mark by moving the contact with the first mark and its peripheral region in contact with the first mark. In this case, the peripheral position of the first mark is detected, and the center position of the first mark is mathematically detected from the peripheral position.

  The invention according to claim 9 is provided with a pair of probe units each provided with a contact and driving means for independently driving each probe unit, and a wiring pattern formed on the plate surface of the substrate to be inspected. In a substrate inspection apparatus for inspecting the wiring pattern by bringing each contact into contact with an inspection point, the board of the inspection substrate is subjected to correction of drive data for the probe unit with respect to distortion of the inspection substrate during the inspection. Imaging means provided so as to be integrally driven with respect to each of the pair of probe units so as to capture an image of the second mark formed on the surface, and the inspection point of the wiring pattern Driving data about the logical driving amount and driving direction from the logical reference position of each probe unit necessary for contacting each contact. The first mark is stored in a predetermined positional relationship with the optical axis of the image pickup means from the set logical reference positions of the first storage means for storing the probe unit and the image pickup means that are integrally driven. Second storage means for storing drive data about the logical drive amount and drive direction of the image pickup means necessary for positioning at the image pickup position, and the image pickup means from the actual reference position for each probe unit Is stored in the second storage means and the driving amount and driving direction of each probe unit to be driven to the position where the second mark is imaged with a predetermined positional relationship with the optical axis of the imaging means. Deviations between the respective logical reference positions of the respective contacts and the actual reference positions are detected in reverse calculation from the drive data, and the probe unit is detected based on the deviation amount. Further comprising a correction means for correcting the driving data for a board inspection apparatus according to claim.

  According to a tenth aspect of the present invention, there is provided a wiring pattern formed on a surface of a substrate to be inspected, comprising a pair of probe units each provided with a contact and driving means for independently driving each probe unit. In the position adjustment method of the substrate inspection apparatus for inspecting the wiring pattern by bringing each contact into contact with an inspection point, both contacts when driving the both contacts to sequentially contact each inspection point of the wiring pattern The driving position of the child is stored as position data with reference to the design reference position, and the imaging unit that is driven integrally with one of the probe units has a predetermined shape at a predetermined position on the substrate to be inspected. An image of the first mark formed in step S1 is captured, and the optical axis of the imaging unit and the center of the first mark are set to a predetermined position from a reference position scheduled in the design of the imaging unit. The data of the scheduled drive vector of the imaging unit until it is driven so as to have a relationship is stored, and the imaging unit is moved from the reference position set based on the scheduled reference position data to the optical axis and the first Detecting an actual drive vector necessary for driving until a captured image in which the center of the mark is in the predetermined positional relationship is obtained, comparing the stored scheduled drive vector with the detected actual drive vector; The position adjustment method includes correcting the stored position data based on the comparison result.

  The invention according to claim 11 is the position adjustment method according to claim 10, wherein the imaging means is provided so as to be driven integrally with only one of the pair of probe units, and at a predetermined position. The contact is brought into contact with or not in contact with the second mark formed in a predetermined position on the surface of the reference substrate, which is formed of a material having electrical characteristics different from that of the peripheral area, and the peripheral area. The electrical state change generated by moving and electrically scanning at the position is detected, and the contact is positioned at the center of the second mark with respect to the design reference position of the contact from the detected value. Center position data is detected, based on the center position data for each contact, a relative positional relationship between the two contacts is detected, and based on the detected relative positional relationship, each contact is detected It is characterized in that to correct the positional data further.

  According to a twelfth aspect of the present invention, a wiring pattern formed on a plate surface of a substrate to be inspected is provided with a pair of probe units each having a contact and driving means for independently driving the probe units. In a position adjustment method of a substrate inspection apparatus that inspects the wiring pattern by bringing each contact into contact with an inspection point, a predetermined relative positional relationship between the two contacts at a predetermined logical reference position of the two probe units. Drive data on the logical drive amount and drive direction from the predetermined logical reference position of each probe unit necessary for bringing each contact into contact with the inspection point of the wiring pattern set in advance Each figure is stored, and a predetermined figure is displayed at a predetermined position on the plate surface of the reference board positioned at the predetermined position by a material having electrical characteristics different from those of the peripheral area. An electrical state change of the contact generated by moving the contacts in contact or non-contact with respect to the first mark and its peripheral region is detected, and the first change is detected using the state change. The center position of one mark is detected, the drive amount and drive direction of each probe unit to be driven to position each contactor at the center position from the actual reference position, and the drive amount and drive direction are derived. Based on the direction, the actual relative positional relationship between the two contacts at the reference position is detected in reverse calculation, and the driving data for the probe unit is corrected based on the actual relative positional relationship and the predetermined logical relative positional relationship. This is a position adjustment method characterized by this.

  According to a thirteenth aspect of the present invention, in the position adjustment method according to the twelfth aspect, the imaging unit is configured to correct the driving data for the probe unit with respect to distortion of the inspected substrate during the inspection. The probe unit and the imaging unit are driven integrally with each of the probe units so as to capture an image of the second mark formed on the plate surface, and the contactor and the imaging unit at a predetermined logical reference position of the probe unit and the imaging unit. A logical position of the imaging means necessary for positioning the second mark from the predetermined logical reference position, which is set in advance based on a predetermined logical relative positional relationship with the means, at a position for imaging. Drive data about a drive amount and a drive direction is stored, the first mark is picked up by the image pickup means, and the first mark obtained by the image pickup operation is stored. The driving amount and driving direction of the probe unit to be driven to detect the center position of the first mark from the image of the mark and position the contactor at the center position from the actual reference position of the probe unit And the contactor and the imaging unit at each actual reference position based on the driving amount and driving direction of the imaging unit to drive the optical axis from the reference position with respect to the imaging unit to the central position. The actual relative positional relationship between the probe unit and the probe unit is corrected based on the actual relative positional relationship and a predetermined logical relative positional relationship between the contactor and the imaging unit. To do.

  According to a fourteenth aspect of the present invention, a wiring pattern formed on a plate surface of a substrate to be inspected is provided with a pair of probe units each having a contact and driving means for independently driving the probe units. In the position adjustment method of the substrate inspection apparatus for inspecting the wiring pattern by bringing each contact into contact with an inspection point, the image pickup means corrects drive data for the probe unit with respect to distortion of the substrate to be inspected during the inspection. In order to take an image of a second mark formed on the plate surface of the substrate to be inspected, each of the pair of probe units is provided so as to be driven integrally therewith, and the wiring pattern Logical drive amount and drive method from the logical reference position of each probe unit required to bring each contact into contact with an inspection point The driving data is stored respectively, and the second mark is imaged in a predetermined positional relationship with the optical axis of the imaging means from the set logical reference positions of the probe unit and the imaging means that are integrally driven. Drive data about the logical drive amount and drive direction of the image pickup means necessary for positioning at the position to be moved, and the image pickup means sets the second mark from the actual reference position for each probe unit. Each contact from the drive amount and drive direction of each probe unit to be driven to a position where the image is taken with a predetermined positional relationship with the optical axis of the image pickup means, and the drive data stored in the second storage means Deviations between the respective logical reference positions of the child and the actual reference positions are detected in reverse calculation, and the probe unit is driven based on the deviation amount. A position adjusting method and correcting the data.

  According to the first and tenth aspects of the invention, the relative positional relationship between the tip of the contactor that moves integrally and the imaging means is shifted due to replacement of the contactor or the like, or in the process of manufacturing the substrate to be inspected. Even if the wiring pattern and its inspection point are deviated from the design value, the position data indicating the drive position of the contact set based on the design reference position is corrected according to the deviation. Therefore, for example, even when the wiring pattern and its inspection point deviate from the design value due to the influence of heat when forming the wiring, the relative positional relationship between the tip of the contact and the substrate to be inspected can be easily shifted. It is possible to compensate, and the contact can be reliably brought into contact with a desired inspection point at the time of inspection.

  According to the second aspect of the present invention, the position data indicating the drive position of the contact is stored and detected as indicating the coordinates in the coordinate system with each reference position as the origin, and the contact is Driven to the position, the test points are sequentially brought into contact with high accuracy and high efficiency.

  According to the invention described in claim 3, since the center of the substrate is detected and the correction is performed based on the detected center, the correction becomes more accurate.

  According to the fourth aspect of the present invention, since the imaging means is provided so as to be integrally driven with respect to each probe unit, the first mark is imaged by the imaging means for each probe unit. Based on this, the position data of the contact is corrected. Therefore, the driving amounts of the probe unit and the contact can be corrected without correcting the relative position between the contacts in advance.

  According to the fifth and eleventh aspects of the present invention, even if the relative positional relationship between the tips of the contacts is shifted due to replacement of the contacts, etc., the respective contacts set with reference to the design reference position The position data indicating the driving position is corrected using an imaging means that moves integrally with the contact. Therefore, the contact can be reliably brought into contact with a desired inspection point at the time of inspection. Further, since pressure sensitive paper is not used as in the prior art, an increase in cost is also suppressed. Furthermore, since the imaging means is provided only in one of the probe units, the load is small and high-speed inspection is possible.

  According to the sixth and twelfth aspects of the present invention, even if the relative positional relationship between the contacts is deviated due to the exchange of the contacts, etc., the drive amount and the drive direction of each contact at the time of inspection according to the deviation. Is automatically corrected, the relative positional relationship between the contacts can be easily compensated, and the contacts can be reliably brought into contact with a desired inspection point during the inspection. Further, since pressure sensitive paper is not used as in the prior art, an increase in cost is also suppressed.

  According to the invention described in claims 7 and 13, the second mark is formed on the plate surface of the substrate to be inspected to correct the driving amount and driving direction of the probe unit against the distortion of the substrate to be inspected at the time of inspection, In addition, since the image pickup means for picking up the image of the second mark is driven integrally with one of the probe units, the tip of the contact piece and the image pickup means that move integrally by exchanging the contact pieces, etc. Even if the relative positional relationship is deviated or the wiring pattern and its inspection point are deviated from the design value in the manufacturing process of the substrate to be inspected, the drive data for each probe unit is corrected according to the deviation. Therefore, the contact can be reliably brought into contact with a desired inspection point at the time of inspection. Furthermore, since the imaging means is provided only in one of the probe units, the load is small and high-speed inspection is possible.

  According to the eighth aspect of the present invention, the center position of the first mark can be easily detected.

  According to the invention described in claims 9 and 14, the second mark is formed on the plate surface of the substrate to be inspected to correct the drive data for the probe unit against the distortion of the substrate to be inspected at the time of inspection, and Since the image pickup means for picking up the image of the second mark is provided so as to be integrally driven with respect to each of the pair of probe units, the relative position between the tip of the contact piece that moves integrally with the image pickup means Even if the positional relationship or the relative positional relationship between the tips of the contacts is shifted, or the wiring pattern and its inspection point are shifted from the design value in the manufacturing process of the board to be inspected, The driving amount and driving direction of each contact are automatically corrected. Therefore, it is possible to easily compensate for the deviation in the relative positional relationship between the tip of the contactor that moves integrally with the imaging means and the deviation in the relative positional relationship between the contacts. The inspection point can be contacted. In addition, since the imaging means is provided so as to be driven integrally with each of the probe units, the driving amount and driving direction of the probe unit and the contacts are corrected without correcting the relative positions between the contacts in advance. Can be done.

  Embodiments according to the present invention will be described below with reference to the drawings. In addition, the structure which attached | subjected the same code | symbol in each figure shows that it is the same structure, and avoids duplication of the description.

  FIG. 1 is a cross-sectional view showing a configuration of a substrate inspection apparatus 1 according to the first embodiment of the present invention. The cross-sectional view shown in FIG. 1 shows a cross-section of the main part of the substrate inspection apparatus 1 as viewed from a transverse cross section in which the vicinity of the center of the substrate to be inspected 100 is cut while the substrate to be inspected 100 is held at the inspection position by the work holder 2. Show.

  As shown in FIG. 1, the substrate inspection apparatus 1 includes probe units 5 and 6 that are movable in three axial directions of an X axis, a Y axis, and a Z axis, each having contacts 3 and 4, and a substrate 100 to be inspected. A presser plate 7 for press-contacting the contacts 3 and 4, an elevating mechanism 8 for raising and lowering the presser plate 7 up and down, a camera 9, and a control unit 10 (see FIG. 3) described later are provided.

  The probe units 5 and 6 are supported by driving mechanisms 16 and 17 (see FIG. 3) so as to be independently driven in the X-axis, Y-axis, and Z-axis directions, and control signals from the control unit 10 described later. Thus, drive control is performed in the X-axis, Y-axis, and Z-axis directions.

  That is, the probe units 5 and 6 are first driven on a plane parallel to the plane of the substrate 100 to be inspected positioned at a predetermined inspection position, and set to inspection points on the substrate 100 to be inspected in the X-axis and Y-axis directions. It is moved to the corresponding position. Then, it drives to the to-be-inspected board | substrate 100 in the Z-axis direction, and the contacts 3 and 4 elastically contact the said test | inspection point. The inspected substrate 100 is held horizontally or vertically in the substrate inspection apparatus 1. Further, although the inspection points of the substrate 100 to be inspected are exposed on the substrate surface, not all the wiring patterns are exposed on the substrate surface.

  The resistance value of the wiring pattern to be inspected is measured by measuring the resistance value from the current that flows when a predetermined inspection signal is applied between any two inspection points on the inspected substrate 100 selected in this way. Based on the continuity test for inspecting that the wiring pattern is conductive based on the resistance value between the wiring pattern to be inspected and another wiring pattern, Insulation inspection is performed to inspect whether there is a short circuit between them.

  The camera 9 is configured to include an objective lens and an imaging device (not shown) such as a CCD (charge coupled device), and the optical axis L of the holding surface S formed by the work holder 2 intersects perpendicularly. The probe unit 5 and the probe unit 5 are attached so as to be movable.

  The substrate to be inspected 100 is distorted in the direction along the plate surface due to thermal and mechanical stresses at the time of forming the wiring pattern, and will be described later formed on the substrate 100 as shown by the dotted line in FIG. In some cases, an angle (orientation) shift from the design value occurs in the wiring pattern. When the substrate 100 to be inspected is distorted as described above, even if the contacts 3 and 4 are moved in a design drive direction and drive amount (hereinafter, a combination of these is referred to as a drive vector), the contact 3 and 4 cannot be brought into contact with a desired inspection point.

  Therefore, the camera 9 is provided to detect the distortion of the inspected substrate 100 in order to correct the designed drive vector according to the distortion generated in the inspected substrate 100. The camera 9 images alignment marks M1 and M2 (see FIG. 2), which will be described later, formed on the surface of the inspected substrate 100 in order to detect distortion of the inspected substrate 100, and controls an image obtained by the imaging operation. Send to unit 10. In the case where distortion occurs in the inspected substrate 100, from the captured image with respect to the center coordinates of the inspected substrate 100 that are preset and stored theoretically or theoretically with reference to the reference inspection substrate 100 without distortion. Since the actual center position of the calculated substrate 100 to be inspected is shifted according to the degree of the distortion, the control unit 10 utilizes this based on the captured images of the alignment marks M1 and M2. Detect the distortion rate.

  FIG. 2 is a front view showing an example of the wiring on the surface of the substrate 100 to be inspected.

  As shown in FIG. 2, a plurality of wiring patterns N1 to N3 having a plurality of pads P1 to P7 for connecting connection terminals of, for example, an IC (Integrated Circuit) are formed on the surface 101 of the inspected substrate 100. Yes. The continuity test and the insulation test are performed in a state where the contacts 3 and 4 are in contact with the center positions of the pads P1 to P7.

  In the present embodiment, alignment marks M1 and M2 for detecting distortion of the substrate to be inspected 100 are formed on the inspected substrate 100 at appropriate positions. The alignment marks M1 and M2 are arranged in the X-axis direction and the Y-axis direction when the inspected substrate 100 is placed on the holding surface S so that the center position of the inspected substrate 100 is derived from these positions. It is formed so as to be located at different positions in both directions. Note that three or more alignment marks may be formed in order to derive the center position of the inspected substrate 100 more accurately.

  If the inspected substrate 100 is distorted in the direction along the plate surface, the positions of the alignment marks M1, M2 do not coincide with the positions of the alignment marks M1, M2 of the inspected substrate 100 without the distortion. Therefore, the center position of the inspected substrate 100 is also shifted from the center position of the inspected substrate 100 without distortion. In addition, mechanical manufacturing / assembly errors of the substrate inspection apparatus 1 also affect this deviation. Accordingly, the separation direction and the separation distance between the center position of the inspection target substrate 100 to be inspected and the center position of the inspection target substrate 100 without distortion are detected, and the design drive for the probe units 5 and 6 is based on them. By correcting the vector, the contacts 3 and 4 are brought into contact with the center position of the pad to be inspected.

  For example, the center coordinates of the inspected substrate 100 placed at the inspection position without distortion is set to (X0, Y0) in the two-dimensional coordinate system constituted by the X axis and the Y axis, and the contact 3 is moved from the initial position. Designed in advance so that the contact 3 can be positioned at a position corresponding to the center position of the pad Px of the substrate 100 to be inspected when driven by X1 in the X-axis positive direction and Y1 in the Y-axis positive direction. And

  In this case, for example, if the actual center coordinates of the inspected substrate are detected as (X0 + Δx, Y0 + Δy), the center coordinates of the inspected substrate 100 are Δx in the X-axis direction and Δy in the Y-axis direction. There is a deviation from the reference center position (X0, Y0). Therefore, in order to bring the contact 3 into contact with the position corresponding to the center position of the pad Px of the inspected substrate 100 in which distortion occurs, the design drive vector of the contact 3 is Δx minutes in the X-axis positive direction. Correction and correction by Δy in the Y-axis positive direction are performed, and the contact 3 is driven by (X1 + Δx) in the X-axis positive direction and (Y1 + Δy) in the Y-axis positive direction.

  FIG. 3 is a block diagram showing an electrical configuration of the substrate inspection apparatus 100.

  In FIG. 3, probe units 5 and 6 and camera 9 correspond to probe units 5 and 6 and camera 9 shown in FIG. Is electrically connected to the control unit 10.

  The control unit 10 controls the overall operation of the substrate inspection apparatus 1. For example, a ROM (Read Only Memory) that stores a control program for controlling the operation of the substrate inspection apparatus 1 and temporarily stores data. The storage unit 12 includes a RAM (Random Access Memory) and the like, and a microcomputer that reads a control program from the ROM and executes the program. The control unit 10 has a function as an inspection control unit 11 that executes inspections such as distortion correction and continuity inspection using the alignment marks M1 and M2.

  Here, a substrate inspection method by the substrate inspection apparatus 1 will be described. FIG. 4 is a flowchart showing a substrate inspection method performed by the substrate inspection apparatus 1.

  As shown in FIG. 4, first, when the inspected substrate 100 to be inspected is set at a predetermined inspection position and the start of substrate inspection is instructed (YES in Step # 1), the inspection control unit 11 performs design. Based on the above driving vector, the camera 9 is driven to a predetermined position, the alignment marks M1 and M2 formed on the inspected substrate 100 at that position are imaged by the camera 9, and the distortion of the inspected substrate 100 is determined from the captured image. The rate is calculated, and the drive data indicating the drive vector of the designed contacts 3 and 4 is corrected according to the distortion rate (step # 2).

  When the camera 9 captures the alignment marks M1 and M2, the center of the alignment marks M1 and M2 does not have to coincide with the optical axis of the camera 9, and the alignment marks M1 and M2 are the imaging field of view of the camera 9. If the camera 9 is driven to the position where it enters, and information on the relationship between the position of the camera 9 at that time and the images of the alignment marks M1 and M2 and the imaging field of view or the optical axis L of the camera 9 is obtained. From the information, the camera 9 obtains an actual drive vector from the reference position until the optical axis L coincides with the centers of the alignment marks M1 and M2.

  Then, the inspection control unit 11 drives the probe units 5 and 6 in the X-axis, Y-axis, and Z-axis directions based on the corrected drive data (step # 3), and the contacts 3 and 4 are subjected to two inspections. On the other hand, for example, inspection (continuity inspection, insulation inspection, etc.) is performed in contact with the center positions of the pads P1 and P2 in FIG. 2 (step # 4).

  As a result, when the inspection control unit 11 determines that it is defective (NO in step # 5), a display indicating that the substrate 100 to be inspected is defective is displayed on a monitor (not shown) connected to the substrate inspection apparatus 1. Perform (Step # 8). On the other hand, when the inspection control unit 11 determines that the inspection is good (YES in Step # 5), it determines whether or not the inspection has been completed for all the wiring patterns (Step # 6).

  If the wiring pattern to be inspected remains (NO in step # 6), the process returns to step # 3, and when the inspection for all the wiring patterns is completed (YES in step # 6), the monitor substrate concerned is displayed on the monitor. An indication that 100 is a non-defective product is displayed (step # 7).

  By the way, in the board inspection apparatus 1 that inspects the board to be inspected 100 using such probe units 5 and 6, the contacts 3 and 4 are exchanged due to fatigue or wear of the contacts 3 and 4, for example. As a result, the relative positional relationship between the tips of the contacts 3 and 4 usually deviates before and after replacement. In addition, by exchanging the contacts 3 and 4, the relative positional relationship between the tip of the contacts 3 and 4 and the camera 9 is also shifted before and after the replacement.

  As described above, when the relative positional relationship between the contactors 3 and 4 and the relative positional relationship between the tip of the contactors 3 and 4 and the camera 9 are changed by exchanging the contactors 3 and 4 or the like, it is preset by a program. Even when the probe units 5 and 6 are driven with a design drive vector, at least one of the contacts 3 and 4 does not come into contact with the center position of the desired pad, and this is performed in step # 2 of the flowchart shown in FIG. Distortion correction is not properly reflected and inspection such as continuity inspection cannot be performed accurately.

  Therefore, in the present embodiment, the contactors 3 and 4 are brought into contact with the center positions of the pads P1 to P7 at the time of the above-described continuity test and insulation test. 3 and 4 are exchanged to detect the relative positional relationship between the tips of the contacts 3 and 4 and the relative positional relationship between the camera 9 and the tips of the contacts 3 and 4, and according to the change in the relative positional relationship. The design drive vectors set in advance for the movement control of the contacts 3 and 4 and the camera 9 are corrected.

  As a correction method, in this embodiment, a correction mark M3 (see FIG. 6) representing a specific figure (here, a circle) is formed on a calibration board (a reference substrate for correction), and this correction mark M3 is formed. The correction is performed by using. Hereinafter, this correction method will be described in detail.

  The control unit 10 includes the camera 10 so that the drive vector of the contacts 3 and 4 for bringing the contacts 3 and 4 into contact with the center of the correction mark M3 and the optical axis L of the camera 9 pass through the center of the correction mark M3. The drive vector of the camera 9 for positioning is stored in advance as a design drive vector.

  For example, after exchanging the contacts 3 and 4, the center position of the correction mark M3 is searched by the contacts 3 and 4 by a search method described later, and the contacts 3 and 4 are positioned at the center position of the correction mark M3. The drive vector from the design reference position of the contacts 3 and 4 necessary for the operation is derived, and the deviation between the derived result and the design (logical) drive vector of the contacts 3 and 4 stored in advance is calculated. To detect. Based on this deviation, the design drive vector of the designed contacts 3 and 4 stored in advance is corrected so that the contacts 3 and 4 are brought into contact with the center positions of the pads P1 to P7 at the time of inspection.

  Thereby, at the time of inspection, the distortion correction is performed in consideration of a shift in the relative positional relationship between the tips of the contacts 3 and 4.

  In the same manner, correction is also performed for a shift in the relative positional relationship between the camera 9 and the contact 3. That is, the camera 9 is caused to capture the correction mark M3, and the center position of the correction mark M3 is detected from the captured image. An actual drive vector from the reference position of the camera 9 necessary for positioning the camera 9 so that the optical axis L of the camera 9 passes through the center of the correction mark M3 is derived, and the result of the derivation and the previously stored camera 9 detects a deviation from the design or logical drive vector of 9, and based on this deviation, the drive vector of the contact 3, 4 stored in advance to bring the contact 3, 4 into contact with each pad at the time of inspection is determined. to correct. As a result, the distortion correction is performed in consideration of the relative positional relationship between the tip of the contact 3 or the contact 4 and the camera 9.

  Here, the contacts 3 and 4 are not actually driven from the reference position for each inspection point, but are controlled to move sequentially from the inspection point to the inspection point. Therefore, in the description of the present embodiment, for the sake of explanation, the description will be made from the viewpoint of correcting the drive vectors in the design of the contacts 3 and 4 and the camera 9, but as a more accurate expression, the contact 3 , 4, and the initial position of each camera 9 in each three-dimensional coordinate system, the coordinates of the tip of the drive vector starting from each origin are corrected, and the drive data indicating the designed drive vector is corrected. Rather, it can be said that the position data indicating the coordinates is corrected. FIG. 5 explains the above correction from the viewpoint of correcting the coordinates of the tip positions of the contacts 3 and 4. In FIG. 5, for simplification of description, the description will be given focusing on a two-dimensional coordinate system in which the X axis and the Y axis are two axes among the three-dimensional coordinate systems.

  In each movement control of the contacts 3, 4, the two-dimensional coordinate system (XY coordinate system) having the origin at the position of a predetermined tip of the contacts 3, 4 is set by design. As shown by an arrow A in FIG. 5, the two different two-dimensional coordinate systems are overlapped in the sense that there is no displacement in the relative positional relationship between the tips of the contacts 3 and 4. Further, the center coordinate of the correction mark M3 is assumed to be located at the coordinates (X0, Y0) of the designed two-dimensional coordinate system.

  Now, when the center position of the correction mark M3 is detected by the contacts 3 and 4, if there is no positional shift in the relative positional relationship between the tips of the contacts 3 and 4, the center position is, for example, each of the two-dimensional positions. It is detected that the coordinate system is located at the coordinates (X0, Y0). However, for example, if the contact 3 is replaced, and the contact 3 is replaced, the tip position is shifted by + Δx in the X-axis direction and + Δy in the Y-axis direction. When the child 3 is driven, the contact 3 comes into contact with a point other than the center position of the correction mark M3.

  On the other hand, when the contact 3 detects the center position of the correction mark M3 in a state where this deviation occurs, the coordinates of the center position are not detected as coordinates (X0, Y0), but the coordinates (X0−Δx, Y0−). Δy) is detected.

  That is, the fact that the position of the tip of the contact 3 is displaced by + Δx in the X-axis direction and + Δy in the Y-axis direction due to the replacement of the contact 3 is a two-dimensional operation with the initial position of the tip of the contact 3 after the replacement as the origin When the coordinate system is considered, as shown by an arrow B in FIG. 5, the two-dimensional coordinate system (X′-Y ′ coordinate system) is changed to the designed two-dimensional coordinate system (XY coordinate system). On the other hand, this corresponds to a deviation of + Δx in the X-axis direction and + Δy in the Y-axis direction.

  Therefore, in this case, the coordinates of the drive position for bringing the contactor 3 into contact with the center position of each pad are all set to -Δx for the X coordinate and -Δy for the Y coordinate with respect to the design coordinates of the contactor 3. Only small coordinates will be reset. That is, assuming that the inspection point is generally represented by Pn and the design or logical coordinates of the contactor 3 with respect to the inspection point Pn are generally represented as coordinates (Xn, Yn), the contactor 3 causes the center position of the correction mark M3 to be expressed. , And the amount of deviation (Δx, Δy) of the tip of the contactor 3 is calculated from the coordinates detected at that time, and the design coordinates of the contactor 3 are calculated by the amount of deviation (Δx, Δy). Is reset from coordinates (Xn, Yn) to coordinates (Xn−Δx, Yn−Δy).

  By performing such a process on the contact 4 as well, an appropriate coordinate is reset even for the positional deviation of the tip of the contact 4. As a result, even if the relative positional relationship between the tips of the contacts 3 and 4 is shifted, both the contacts 3 and 4 can be brought into contact with a desired inspection point at the time of inspection.

  6A is a plan view showing the surface of the calibration board 110 as a reference board, and FIG. 6B is a cross-sectional view taken along line AA in FIG. 6A.

  As shown in FIG. 6, a correction mark M3 formed of a conductive material is provided at an appropriate surface of the calibration board 110. The correction mark M3 passes through the calibration board 110 and is exposed on the back surface, and is grounded on the back surface side. The diameter of the correction mark M3 is 1 mm, for example.

  With this configuration, when the contacts 3 and 4 come into contact with the correction mark M3, the potential of the contacts 3 and 4 becomes 0 V, while the periphery of the correction mark M3 is a portion of the substrate made of a non-conductive material. For this reason, when the contacts 3 and 4 come into contact with the substrate portion, the potential of the contacts 3 and 4 becomes higher than 0V.

  Using this, the potential of the contacts 3 and 4 is changed while sliding the contacts 3 and 4 in a predetermined direction (moving at a minute pitch (for example, 1 μm)) with respect to the correction mark M3 and the surrounding area. The position of the contacts 3 and 4 when the potential change is detected is determined as the position of the outer periphery of the correction mark M3.

  Since the center of the circle can be mathematically calculated if the positions of three points on the outer periphery are known, the correction mark M3 is detected by detecting three different positions of the correction mark M3 where the potential has changed. The center position of can be derived.

  In order to perform the operation as described above, the control unit 10 functionally includes a storage unit 12, a deviation detection unit 13, a drive data correction processing unit 14, and a drive control unit 15.

  The storage unit 12 is a contact necessary for bringing the contacts 3 and 4 into contact with the center positions of the pads P1 to P7, which are derived from data relating to the wiring pattern of the substrate 100 to be inspected provided in advance by the substrate manufacturer, for example. Drive data indicating design drive vectors from the reference positions of 3 and 4 is stored. In addition, the storage unit 12 sets the contacts 3 and 4 of the correction mark M3, which are set in advance based on a predetermined positional relationship between the contacts 3 and 4 at a predetermined reference position of the both contacts 3 and 4. Driving data indicating a design driving vector from the reference position of the contacts 3 and 4 for contacting the center, and for positioning the camera 10 so that the optical axis L of the camera 9 passes through the center of the correction mark M3. Drive data indicating a design drive vector from the reference position of the camera 9 is also stored.

  The deviation detection unit 13 searches the center position of the correction mark M3 with the contacts 3 and 4, and the reference position of the contacts 3 and 4 required to position the contact 3 and 4 at the center position of the correction mark M3. The actual drive vector is derived, and a deviation between the actual drive vector and the designed drive vector from the reference position of the contacts 3 and 4 stored in advance in the storage unit 12 is detected. In addition, the deviation detection unit 13 causes the camera 9 to capture the correction mark M3, detects the center of the correction mark M3 from the captured image, and allows the optical axis L of the camera 9 to pass through the center of the correction mark M3. An actual drive vector from a reference position of the camera 9 necessary to position the camera 9 is derived, and a deviation between the actual drive vector and a design drive vector of the camera 9 stored in the storage unit 12 in advance is detected.

  Based on the deviation detected by the deviation detector 13, the drive data correction processing unit 14 stores the contacts 3 stored in advance in order to bring the contacts 3 and 4 into contact with the center positions of the pads P1 to P7 at the time of inspection. 4 is corrected.

  Further, the drive data correction processing unit 14 performs an image of the alignment marks M1 and M2 sent from the camera 9 and the actual result of the camera 9 driven to obtain the image during the distortion correction process in step # 2 of the flowchart shown in FIG. Based on the drive vector, a deviation between the center position (center coordinates) stored in advance and the actual center position of the inspected substrate 100 is detected, and the corrected drive data is further corrected based on this deviation.

  The drive control unit 15 operates the drive mechanisms 16 and 17 based on the drive amount data corrected by the drive data correction processing unit 14 at the time of inspection.

  The program that causes the control unit 10 to function as the deviation detection unit 13, the drive data correction processing unit 14, and the drive control unit 15 can be supplied through a recording medium such as a ROM or a CD-ROM, It is also possible to supply through a transmission medium.

  FIG. 7 is a flowchart showing the drive data correction process described above. Here, it is assumed that the drive data correction process is performed when at least one of the contact 3 and the contact 4 is exchanged.

  As shown in FIG. 7, when at least one of the contacts 3 and 4 is exchanged (YES in step # 11), the deviation detector 13 detects the center position of the correction mark M3 using the contact 3 (Step # 12), the center position of the correction mark M3 is detected using the contact 4 (step # 13). Then, the deviation detection unit 13 uses the reference positions of the contacts 3 and 4 necessary for positioning the contacts 3 and 4 at the center position of the correction mark M3 from the center positions detected in steps # 12 and # 13, respectively. The actual drive vector is derived, and a deviation between the actual drive vector and the drive vector from the design reference position of the contacts 3 and 4 stored in advance in the storage unit 12 is detected (step # 14). .

  Further, the deviation detecting unit 13 causes the camera 9 to capture the correction mark M3 and detects the center of the correction mark M3 from the captured image (step # 15). Then, the deviation detection unit 13 derives an actual drive vector of the camera 9 necessary for positioning the camera 9 so that the optical axis L of the camera 9 passes through the center of the correction mark M3. 12 is detected (step # 16).

  Then, based on the deviation detected by the deviation detecting unit 13, the drive data of the contacts 3, 4 stored in advance to correct the contacts 3, 4 to the pads P1 to P7 at the time of inspection is corrected (step). # 17).

  As described above, the deviation of the relative positional relationship between the contacts 3 and 4 is automatically detected using the correction mark M3, and the design drive vector of the contacts 3 and 4 at the time of inspection is automatically detected. Therefore, it is possible to realize the substrate inspection apparatus 1 that can reliably contact the contacts 3 and 4 with the center position of the desired pad at the time of inspection, and at the time of contact at the time of inspection. Processing for bringing the child 3 or 4 into contact with the center position of the desired pad is facilitated.

  In addition, since pressure sensitive paper is not used as in the prior art, cost reduction and workability improvement can be achieved as compared with the prior art.

  Further, the relative positional relationship between the tip of the contact 3 and the camera 9 is shifted due to replacement of at least one of the contacts 3 and 4, or the wiring pattern and the inspection point are designed in the manufacturing process of the substrate 100 to be inspected. Even if it deviates from the value, the design drive vector of the contact set based on the design reference position is corrected according to the deviation. For example, when the wiring is formed, Even when the wiring pattern and its inspection point deviate from the design values due to the influence of heat, the relative positional relationship between the tips of the contacts 3 and 4 and the substrate 100 to be inspected can be easily compensated, and inspection can be performed. At times, the contacts 3 and 4 can be reliably brought into contact with a desired inspection point.

  The present invention can employ the following embodiments (1) to (4) instead of the first embodiment.

  (1) In the first embodiment, when detecting the outer peripheral position of the correction mark M3, the contact 3 is brought into sliding contact with the correction mark M3 of the calibration board 110 and the peripheral area thereof. , 4 are detected, but the present invention is not limited to this, and the outer peripheral position of the correction mark M3 may be detected as follows.

  FIG. 8 is a flowchart showing this correction mark outer periphery position detection process, and FIG. 9 is an explanatory diagram of a correction mark M3 outer periphery position detection method according to another modification.

  In the present embodiment, unlike the first embodiment, when detecting the outer peripheral position of the correction mark M3, the contact 3 (or contact 4) is not moved while sliding on the substrate 100 to be inspected. The contact 3 is discretely brought into contact with the substrate 100 to be inspected from the initial position when the contact 3 starts to contact the correction mark M3 after the detection of the outer peripheral position. In addition, the potential of the contact 3 (or the contact 4) is detected at the time of contact, and a state where the potential of the contact 3 is 0 V and a state of other potential (hereinafter collectively referred to as a contact state) are detected. Each time the switch is made, the moving direction of the contact 3 is set in the opposite direction, and the moving distance of the contact 3 is reduced to half of the previous moving distance. The moving distance is larger than the limit pitch of driving by the driving mechanisms 16 and 17. The position of the contact 3 when it becomes smaller is determined as the outer peripheral position of the correction mark M3.

  That is, as shown in FIG. 8, first, the control unit 10 sets the movement distance L of the contact 3 as the diameter of the correction mark M3 as an initial setting (step # 21), and then drives the contact 3 to make contact. The child 3 is brought into contact with an arbitrary position on the inspected substrate 100 (step # 22). Then, the control unit 10 detects the contact state of the contact 3 by detecting the potential of the contact 3 in this state (step # 23).

  As a result, when the contact 3 is not in contact with the correction mark M3 (NO in step # 23), the control unit 10 moves the probe unit 5 until the contact 3 comes into contact with the correction mark M3. When the contact 3 comes into contact with the correction mark M3 (YES in step # 23), the moving direction of the probe unit 5 immediately before the contact is stored (step # 24).

  Next, it is determined whether or not the moving distance L of the probe unit 5 is smaller than the limit pitch Lth (step # 25). As a result, when the moving distance L of the probe unit 5 is equal to or greater than the limit pitch Lth (NO in step # 25), the probe unit 5 is moved in the direction stored in step # 4 by the moving distance L / 2. (Step # 26). When the process of step # 16 is the first round, the moving distance L of the probe unit 5 is equal to the radius of the correction mark M3, and the probe unit 5 is moved in the moving direction by the length corresponding to the radius.

  Then, it is determined whether or not the contact state between the probe unit 5 and the correction mark M3 has been switched by the current movement (step # 27). That is, as shown in FIG. 9 (a), when the point that has moved by the radius of the correction mark M3 from the state of contact with the point A and touched is the point B, the contact point B after the movement is the correction mark. Since the position is outside M3, the contact state is switched between the previous contact state and the current contact state. As described above, when the contact state is switched (YES in step # 27), the moving direction of the probe unit 5 is set in the reverse direction (step # 28), and the next moving distance L is set to the current moving distance. Set to half of L (step # 29) and return to step # 15.

  On the other hand, as shown in FIG. 9B, assuming that the point moved by the radius of the correction mark M3 from the state in contact with the point P is the point Q, the contact point Q after the movement is the correction mark. Since the position is within M3, the contact state is not switched between the previous contact state and the current contact state. As described above, when the contact state is not switched (NO in step # 27), the process returns to step # 25 while maintaining the moving direction and moving distance L of the probe unit 5 at the previous time.

  In this way, steps # 25 to # 29 are repeated. FIGS. 9A and 9B show a state in which the probe unit 5 is moved by setting the moving direction and moving distance of the probe unit 5 depending on whether or not the contact state is switched. In FIGS. 9 (a) and 9 (b), in order to display each movement amount in an easy-to-understand manner, the lines representing the respective movements are shifted. However, in actuality, the probe unit is shown on the same line by the indicated amount. Moving.

  That is, in FIG. 9A, the contact point of the contact 3 moves in the order of A → B → C → D → E, the contact state is switched every time the contact point changes, and the movement distance is set to half of the previous time. It shows the state being done. In FIG. 9B, the contact point of the contact 3 moves in the order of P → Q → R → S → T → U, and the movement from the point P to the point Q and the movement from the point T to the point U are performed. Since the contact state is not switched, the movement direction and the movement distance are maintained at the previous movement distance, and the contact state is switched in other movements, so the movement direction is set to the reverse direction and the movement distance is reduced to half of the previous movement distance. Indicates the set state. In FIGS. 9A and 9B, “ON” and “OFF” in parentheses added to the alphabet indicate a state where the potential of the contactor 3 is 0 V and a state of other potentials. ing.

  When the moving distance L of the probe unit 5 becomes smaller than the limit pitch Lth (YES in step # 25), the contact point of the contact 3 at that time is set as the outer peripheral position of the correction mark M3 (step # 30).

  According to this method, as compared with the configuration in which the outer peripheral position of the correction mark M3 is detected while the contact 3 is in sliding contact with the substrate 100 to be inspected as in the first embodiment, the detection time of the center position of the correction mark M3. Can be shortened.

  (2) In the first embodiment, the shape of the correction mark M3 is a circular shape, but is not limited to this, and may be an elliptical shape or a triangular shape. Any shape can be used as long as can be calculated. In addition, the conductive portion of the correction mark M3 is grounded to the ground on the back surface of the calibration board 110. However, the present invention is not limited to this. For example, power or ground is supplied to the entire inner layer of the calibration board. In the case where a solid conductor portion is provided, the correction mark M3 and the solid conductor portion may be connected and the ground may be supplied by the solid conductor portion.

  (3) As a method for detecting the center position of the correction mark M3, the following method may be adopted in addition to the method described above.

  In the present embodiment, as shown in FIG. 10A, when the contact 3 is moved in the radial direction in the correction mark M3 and its peripheral region in a state where the contact 3 is separated from the correction mark M3 by a predetermined distance, This is based on the fact that the electric capacity formed by the child 3 and the correction mark M3 changes.

  FIG. 10B is a graph showing a measurement result of the capacitance when the contact 3 is moved in the radial direction in the correction mark M3 and its peripheral region. As shown in FIG. 10 (b), this change in capacitance becomes maximum when the contact 3 is positioned on the normal passing through the center position of the correction mark M3 under the same separation distance condition. It becomes smaller as it moves radially outward from that position.

  Using this characteristic, the center position of the correction mark M3 can be detected. That is, the correction mark M3 is moved in the radial direction in the correction mark M3 and its peripheral region with the contact 3 spaced apart from the correction mark M3 by a predetermined distance, and the correction mark passes through the position of the contact 3 where the electric capacity becomes maximum. An intersection point between the normal line of M3 and the correction mark M3 may be set as the center position of the correction mark M3.

  (4) In the first embodiment, the camera 9 is attached to the probe unit 5 so as to be integrally movable, and the contact 3 is used by using the images of the alignment marks M1 and M2 captured by the camera 9. , 4 is corrected, the drive data of the contacts 3, 4 is changed to a predetermined positional relationship between the contacts 3, 4 at a predetermined reference position of the contacts 3, 4. However, when the cameras are integrally provided in the probe units 5 and 6, the positional relationship between the cameras integrally provided in the probe units 5 and 6 is required. Since the relative positional relationship between them is fixed and the relative positional relationship between the contacts 3 and 4 is set in advance, it is necessary to determine the relative positional relationship between the contacts 3 and 4 at the initial position in advance. There.

  That is, in the substrate inspection apparatus according to the present embodiment, the storage unit 12 is a contact for bringing the contacts 3 and 4 into contact with the center of the correction mark M3 from a preset initial position of the contacts 3 and 4, for example. Drive data indicating design drive vectors of the sub-elements 3 and 4 and design drive vectors of the camera 9 for moving the optical axis L from the initial position of the camera 9 to a position passing through the center of the correction mark M3 are shown. Drive data is stored.

  When at least one of the contacts 3 and 4 is replaced, the center position of the correction mark M3 is detected using the contacts 3 and 4, and the contacts 3 and 4 are detected from the center positions of the correction mark M3. Deriving actual drive vectors of the contacts 3 and 4 necessary for positioning at the center position, and calculating the actual drive vector and the design drive vectors of the contacts 3 and 4 stored in the storage unit 12 in advance. Detect deviation.

  Also, it is necessary to cause each camera to image the correction mark M3, detect the center of the correction mark M3 from each captured image, and position each camera so that the optical axis L of each camera passes through the center of the correction mark M3. An actual drive vector of a simple camera is derived, and a deviation between the actual drive vector and a design drive vector of each camera stored in advance in the storage unit 12 is detected. Based on the detected displacement between the probe unit and the camera that are driven integrally, the contacts 3 and 4 stored in advance to bring the contacts 3 and 4 into contact with the pads P1 to P7 during the inspection. The drive data in the design is corrected.

  Also with this method, the correction of the drive data in accordance with the positional relationship between the tips of the contacts 3 and 4 is appropriately compensated, and the distortion correction performed in step # 2 of the flowchart shown in FIG. 4 is appropriately reflected. Is done.

It is sectional drawing which shows the structure of the board | substrate inspection apparatus which concerns on the 1st Embodiment of this invention. It is a front view which shows an example of the wiring surface of a to-be-inspected board | substrate. It is a block diagram which shows the electrical structure of a board | substrate inspection apparatus. It is a flowchart which shows the board | substrate inspection method by a board | substrate inspection apparatus. It is a figure for demonstrating correction | amendment of the drive data on the design of a contactor. (A) is the top view which showed the surface of the calibration board, (b) is arrow sectional drawing seen from the AA line of (a). It is a flowchart which shows a drive data correction process. It is a flowchart which shows the outer periphery position detection process of a correction mark. It is explanatory drawing of the outer periphery position detection method of the correction mark which concerns on another modification. It is a figure which shows the other method of detecting the center position of a correction mark.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate inspection apparatus 3, 4 Contact 5, 5 Probe unit 9 Camera 10 Control part 12 Memory | storage part 13 Deviation detection part 14 Drive data correction process part 15 Drive control part

Claims (14)

A pair of probe units each provided with a contact and driving means for independently driving each probe unit are provided, and each contact is brought into contact with an inspection point of a wiring pattern formed on the surface of the substrate to be inspected. In the substrate inspection apparatus for inspecting the wiring pattern,
First storage means for storing the drive positions of both contacts when driving both the contacts to sequentially contact each inspection point of the wiring pattern as position data based on a design reference position;
Imaging means that is driven integrally with one of the probe units to capture an image of the first mark formed in a predetermined shape at a predetermined position on the substrate to be inspected;
The planned drive vector of the image pickup means from the reference position scheduled in the design of the image pickup means until the optical axis of the image pickup means and the center of the first mark are driven to have a predetermined positional relationship. Second storage means for storing data;
Necessary for driving the imaging means from a reference position set based on data of a planned reference position until a captured image is obtained in which the optical axis and the center of the first mark have the predetermined positional relationship. Detecting means for detecting a real driving vector;
The planned drive vector stored in the second storage means is compared with the actual drive vector detected by the detection means, and the position data stored in the first storage means is corrected based on the comparison result. A board inspection apparatus comprising: a correction unit.   The substrate inspection apparatus according to claim 1, wherein the planned drive vector and the actual drive vector are stored and detected as coordinates of a vector tip having each reference position as an origin.   At least two of the first marks are formed at predetermined locations on the substrate to be inspected, and the correction means detects the center of the substrate to be inspected from the actual drive vector for each first mark. 3. The substrate inspection apparatus according to claim 1, wherein the position data is corrected in accordance with a deviation between the center and the design center.   The imaging unit is provided so as to be driven integrally with each of the pair of probe units. For each imaging unit, storage of a planned drive vector, detection of an actual drive vector, and correction of position data are performed. The substrate inspection apparatus according to claim 1, wherein: is performed. The imaging means is provided to be driven integrally with only one of the pair of probe units,
The substrate inspection apparatus further includes a second mark formed on the surface of the reference substrate, which is set at a predetermined position, with a material having a different electrical characteristic from the peripheral region, and the peripheral region, and the second mark and the peripheral region thereof. An electrical state change generated by moving each of the contacts in contact or non-contact and electrically scanning is detected, and the contact with respect to a reference position on the design of the contact is detected from the detected value. Second detection means for detecting center position data when positioned at the center of the second mark;
Third detection means for detecting a relative positional relationship between the two contacts based on the center position data for each contact;
And a third correction unit for further correcting the position data of each contact stored in the first storage unit based on the relative positional relationship detected by the third detection unit. The substrate inspection apparatus according to claim 1. A pair of probe units each provided with a contact and driving means for independently driving each probe unit are provided, and each contact is brought into contact with an inspection point of a wiring pattern formed on a plate surface of a substrate to be inspected. In the substrate inspection apparatus for inspecting the wiring pattern,
Probes necessary for bringing the contacts into contact with the inspection points of the wiring pattern, which are set in advance based on a predetermined relative positional relationship between the contacts at a predetermined logical reference position of the probe units. First storage means for storing drive data about a logical drive amount and drive direction from the predetermined logical reference position of the unit, respectively;
Contact each contactor at a predetermined position on the plate surface of the reference substrate positioned at a predetermined position with respect to the first mark representing a predetermined figure by a material having electrical characteristics different from that of the peripheral area and the peripheral area. First detection means for detecting an electrical state change of the contact generated by moving in a non-contact manner and detecting a center position of the first mark using the state change;
A driving amount and a driving direction of each probe unit to be driven to position each contactor from the actual reference position to the center position are derived, and the both contacts at the reference position are derived based on the driving amount and the driving direction. A first correction unit that detects the actual relative positional relationship of the child in a reverse calculation and corrects the driving data for the probe unit based on the actual relative positional relationship and the predetermined logical relative positional relationship; A board inspection apparatus that is characterized. Integrated with only one of the probe units so as to capture an image of the second mark formed on the plate surface of the substrate to be inspected so as to correct the drive data for the probe unit with respect to distortion of the substrate to be inspected during the inspection. Imaging means provided to be driven in an automated manner;
The first from the predetermined logical reference position set in advance based on a predetermined logical relative positional relationship between the contactor and the imaging means at a predetermined logical reference position of the probe unit and the imaging means. Second storage means for storing drive data regarding the logical drive amount and drive direction of the image pickup means necessary to position the second mark at the position for image pickup;
Second detection means for causing the imaging means to image the first mark and detecting a center position of the first mark from an image of the first mark obtained by the imaging operation;
The drive amount and drive direction of the probe unit to be driven to position the contactor at the center position from the actual reference position for the probe unit, and the optical axis from the reference position for the imaging means to the center position Based on the drive amount and drive direction of the imaging means to be driven to position the imaging means, the actual relative positional relationship between the contactor and the imaging means at each actual reference position is detected in reverse calculation, and the actual relative position The substrate according to claim 6, further comprising: a second correction unit that corrects driving data for the probe unit based on a relationship and a predetermined logical relative positional relationship between the contact and the imaging unit. Inspection device.   The first detection means is configured to bring each contactor into contact with the first mark and the peripheral area in a state where the circular or elliptical first mark and the peripheral area have a predetermined potential difference. A change in the potential of the contact generated at the peripheral portion of the first mark is detected by the movement, the peripheral position of the first mark is detected from the change in state, and the first position is mathematically determined from the peripheral position. The substrate inspection apparatus according to claim 6, wherein the center position of the mark is detected. A pair of probe units each provided with a contact and driving means for independently driving each probe unit are provided, and each contact is brought into contact with an inspection point of a wiring pattern formed on a plate surface of a substrate to be inspected. In the substrate inspection apparatus for inspecting the wiring pattern,
Each of the pair of probe units is configured to capture an image of a second mark formed on the plate surface of the substrate to be inspected so as to correct drive data for the probe unit with respect to distortion of the substrate to be inspected during the inspection. Imaging means provided so as to be driven integrally therewith,
First storage means for storing logical driving amounts and driving data from the logical reference positions of the probe units necessary for bringing the contacts into contact with the inspection points of the wiring pattern, respectively. When,
Necessary for positioning the second mark from the set logical reference position of the probe unit and the imaging means, which are integrally driven, at a position for imaging in a predetermined positional relationship with the optical axis of the imaging means. Second storage means for storing drive data about the logical drive amount and drive direction of the imaging means;
The driving amount of each probe unit to be driven from the actual reference position for each probe unit to the position where the imaging unit images the second mark with a predetermined positional relationship with the optical axis of the imaging unit; A deviation between each logical reference position and each actual reference position of each contact is detected in reverse from the drive direction and the drive data stored in the second storage means, and based on the deviation amount. A substrate inspection apparatus comprising: a correction unit that corrects drive data for the probe unit. A pair of probe units each provided with a contact and driving means for independently driving each probe unit are provided, and each contact is brought into contact with an inspection point of a wiring pattern formed on the surface of the substrate to be inspected. In the position adjustment method of the substrate inspection apparatus for inspecting the wiring pattern,
The drive position of both contacts when driving both the contacts to sequentially contact each inspection point of the wiring pattern is stored as position data based on a design reference position,
By imaging means driven integrally with one of the probe units, an image of the first mark formed in a predetermined shape at a predetermined position of the substrate to be inspected is taken,
Data of the planned drive vector of the imaging unit from the reference position scheduled in the design of the imaging unit until the optical axis of the imaging unit and the center of the first mark are driven to have a predetermined positional relationship Remember
Necessary for driving the imaging means from a reference position set based on data of a planned reference position until a captured image is obtained in which the optical axis and the center of the first mark have the predetermined positional relationship. Real driving vector is detected,
A position adjustment method comprising: comparing the stored scheduled drive vector with the detected actual drive vector, and correcting the stored position data based on the comparison result. The imaging means is provided so as to be driven integrally with only one of the pair of probe units, and
The surface of the reference substrate set at a predetermined position is brought into contact with each contact with the second mark and its peripheral area formed by representing a predetermined figure with a material having different electrical characteristics from the peripheral area at a predetermined position. A change in the electrical state generated by scanning and electrically scanning without contact is detected, and from the detected value, the contact with respect to a reference position on the design of the contact is the center of the second mark. Detect the center position data when located at
Based on the center position data for each contact, detect the relative positional relationship between both contacts,
The position adjustment method according to claim 10, further comprising correcting the position data of each contact based on the detected relative positional relationship. A pair of probe units each provided with a contact and driving means for independently driving each probe unit are provided, and each contact is brought into contact with an inspection point of a wiring pattern formed on a plate surface of a substrate to be inspected. In the position adjustment method of the substrate inspection apparatus for inspecting the wiring pattern,
Probes necessary for bringing the contacts into contact with the inspection points of the wiring pattern, which are set in advance based on a predetermined relative positional relationship between the contacts at a predetermined logical reference position of the probe units. Storing driving data about the logical driving amount and driving direction from the predetermined logical reference position of the unit,
Contact each contactor at a predetermined position on the plate surface of the reference substrate positioned at a predetermined position with respect to the first mark representing a predetermined figure by a material having electrical characteristics different from that of the peripheral area and the peripheral area. Detecting an electrical state change of the contact generated by moving in a non-contact manner, and detecting a center position of the first mark using the state change;
A driving amount and a driving direction of each probe unit to be driven to position each contactor from the actual reference position to the center position are derived, and the both contacts at the reference position are derived based on the driving amount and the driving direction. A position adjustment method comprising: detecting an actual relative positional relationship of a child in a reverse calculation and correcting driving data for the probe unit based on the actual relative positional relationship and the predetermined logical relative positional relationship. The imaging unit is configured to capture an image of a second mark formed on the plate surface of the substrate to be inspected so as to correct drive data for the probe unit with respect to distortion of the substrate to be inspected during the inspection. While driving together with each,
The first from the predetermined logical reference position set in advance based on a predetermined logical relative positional relationship between the contactor and the imaging means at a predetermined logical reference position of the probe unit and the imaging means. Storing the drive data about the logical drive amount and drive direction of the imaging means necessary for positioning the mark of 2 at the position for imaging,
The first mark is imaged by the imaging means, and the center position of the first mark is detected from the image of the first mark obtained by the imaging operation,
The drive amount and drive direction of the probe unit to be driven to position the contactor at the center position from the actual reference position for the probe unit, and the optical axis from the reference position for the imaging means to the center position Based on the drive amount and drive direction of the imaging means to be driven to position the imaging means, the actual relative positional relationship between the contactor and the imaging means at each actual reference position is detected in reverse calculation, and the actual relative position The position adjustment method according to claim 12, wherein drive data for the probe unit is corrected based on a relationship and a predetermined logical relative positional relationship between the contact and the imaging unit. A pair of probe units each provided with a contact and driving means for independently driving each probe unit are provided, and each contact is brought into contact with an inspection point of a wiring pattern formed on a plate surface of a substrate to be inspected. In the position adjustment method of the substrate inspection apparatus for inspecting the wiring pattern,
The pair of the imaging means captures an image of the second mark formed on the plate surface of the substrate to be inspected so as to correct the drive data for the probe unit with respect to distortion of the substrate to be inspected during the inspection. Provided to be driven integrally with each of the probe units,
Storing driving data about a logical driving amount and a driving direction from a logical reference position of each probe unit necessary for bringing each contact into contact with an inspection point of the wiring pattern;
Necessary for positioning the second mark from the set logical reference position of the probe unit and the imaging means, which are integrally driven, at a position for imaging in a predetermined positional relationship with the optical axis of the imaging means. Storing drive data about the logical drive amount and drive direction of the imaging means;
The driving amount of each probe unit to be driven from the actual reference position for each probe unit to the position where the imaging unit images the second mark with a predetermined positional relationship with the optical axis of the imaging unit; A deviation between each logical reference position and each actual reference position of each contact is detected in reverse from the drive direction and the drive data stored in the second storage means, and based on the deviation amount. A position adjustment method comprising correcting drive data for the probe unit.

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