JP2010071800A - Circuit board inspecting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To calculate error from the reference position of a probe, without causing increase in device cost. <P>SOLUTION: A processing part performs an error calculation processing where, while making a needle tip 6a of a first probe of a first inspection head move in a region between line-symmetric conductor patterns 21 and 22 along the X axis and alternately bringing a needle tip 7a of a second probe of a second inspection head into contact with the conductor patterns 21 and 22, specifying the position of the first inspection head, at which a capacitance C1 measured when the needle tip 7a of the second probe comes into contact with the first conductor pattern 21 and a capacitance C2 measured, when the needle tip 7a of the second probe is in contact with the second conductor pattern 22 are equal to each other, by measuring the capacitances between the probes, and calculating an error Δx1 along the X direction of the specified position and a predetermined reference position A on a correction substrate 3; and a correction processing of correcting the positions of the inspection heads, when the needle tips 6a, 7a of the probes are brought into contact with the respective inspection points with the calculated error Δx1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a circuit board inspection apparatus configured to be able to inspect a substrate to be inspected using an inspection head equipped with a probe.

  In this type of circuit board inspection apparatus, the probe is attached to the inspection head. When the probe is attached (including when it is replaced), the probe needle after the attachment is caused due to manufacturing tolerances of the inspection head and the probe. The previous position may be displaced from the design reference position. For this reason, in this type of circuit board inspection apparatus, a correction process for measuring (absorbing) this error in advance and correcting the coordinates of the inspection point defined on the inspection target board with this error is usually performed.

As an error measurement method performed in the correction process, the applicant of the present application has already proposed the measurement method disclosed in Patent Document 1 below. In this measurement method, first, a camera mounting error is measured, and the error is absorbed (adjusted). Specifically, the camera is moved onto the camera mounting error absorption mark to capture the figure, and the center of gravity is obtained by the image processing means. And it adjusts so that the coordinate data of a camera may be matched with the same gravity center position. Next, a command signal is output so that the probe touches a specific point (x, y) on the dent sheet. Thereafter, the center of the camera is moved onto the specific point (x, y), and a dent (protrusion formed by the probe tip) of the probe is imaged. Thereby, the center of gravity is obtained from the shape of the dent by the image processing means. For example, the coordinate data of the center of gravity is input to the CPU, and the difference from the specific point (x, y) is obtained. Here, assuming that the coordinate data of the center of gravity is (xL, yL), the error between the probe tip and the specific point (reference position) is obtained as | x−xL |, | y−yL |. The obtained error is added when setting the coordinates of the probe (used when correcting the coordinates of the probe).
Japanese Patent Laid-Open No. 6-331653 (page 3, FIG. 1)

  However, this error measurement method has the following problems to be solved. That is, in this error measurement method, the use of the dent sheet requires a replacement work of the dent sheet, and the dent tends to become finer as the probe is downsized. Since it is necessary to use a highly accurate camera, there is a problem that the apparatus cost increases.

  The present invention has been made to solve such a problem, and provides a circuit board inspection apparatus capable of calculating an error from a reference position of a probe or an inspection head to which the probe is attached without increasing the apparatus cost. The main purpose is to do.

  In order to achieve the above object, a circuit board inspection apparatus according to claim 1 is provided with a first inspection head to which a first probe is attached, a second inspection head to which a second probe is attached, and a substrate to be inspected. The individual inspection heads are individually moved within an XY orthogonal coordinate plane parallel to the table, and the individual inspection heads are individually moved along the Z-axis direction orthogonal to the XY orthogonal coordinate plane. A mechanism and a moving mechanism that controls the movement of the inspection heads to bring the probe tips of the probes into contact with inspection points on the inspection target substrate disposed on the table. A circuit board inspection apparatus comprising: a processing unit that performs the inspection of: a measurement unit that measures capacitance between the probes; and a first conductor that is disposed on the table and has a line symmetry putter And the second conductor pattern includes a calibration substrate formed so as to be separated along one of the X-axis direction and the Y-axis direction in the XY orthogonal coordinate plane, and the processing unit includes the moving mechanism The needle of the first probe of the first inspection head is controlled while the needle tip of the second probe of the second inspection head is alternately brought into contact with the first conductor pattern and the second conductor pattern. By moving the tip along the one axial direction within the region between the first and second conductor patterns, and causing the measurement unit to measure the capacitance between the probes, the second The capacitance measured when the probe tip of the probe is brought into contact with the first conductor pattern and the measurement measured when the needle tip of the second probe is brought into contact with the second conductor pattern. An error that specifies the position of the first inspection head having the same capacitance and calculates an error along the one axial direction between the specified position and a first reference point that is defined in advance on the calibration board. A calculation process and a correction process for correcting the position of each inspection head when the probe tip of each probe is brought into contact with each inspection point with the calculated error are executed.

  The circuit board inspection apparatus according to claim 2 is the circuit board inspection apparatus according to claim 1, wherein the calibration board includes a third conductor pattern and a fourth conductor pattern having a line symmetry shape in the X-axis direction and the circuit board inspection apparatus. In the error calculation process, the processing unit controls the moving mechanism to separate the needles of the second probe of the second inspection head from each other along the other of the Y-axis directions. While the tip is alternately in contact with the third conductor pattern and the fourth conductor pattern, the needle tip of the first probe of the first inspection head is moved in the region between the third and fourth conductor patterns. The needle tip of the second probe is brought into contact with the third conductor pattern by causing the measuring unit to measure the capacitance between the probes. Identifying the position of the first inspection head at which the capacitance measured when the capacitance measured and the needle tip of the second probe are brought into contact with the fourth conductor pattern are equal, And an error along the other axial direction between the specified position and the second reference point defined in advance on the calibration board is calculated, and in the correction process, the error is calculated at each inspection point with the calculated error. The position of each inspection head when the probe tips of the probes are brought into contact is further corrected.

  The circuit board inspection apparatus according to claim 3 is parallel to a first inspection head to which the first probe is attached, a second inspection head to which the second probe is attached, and a table on which the inspection target substrate is disposed. A moving mechanism for individually moving the inspection heads in an XY orthogonal coordinate plane and moving the inspection heads individually along the Z-axis direction orthogonal to the XY orthogonal coordinate plane; By moving the inspection heads by controlling the moving mechanism, the probe tip of each probe is brought into contact with the inspection point on the inspection target substrate disposed on the table to inspect the inspection target substrate. A circuit board inspection apparatus comprising: a processing unit configured to measure a capacitance between the probes; and a first conductor portion having a line symmetry and a second conductor disposed on the table. Conductor part Comprises a calibration board on which a first conductor pattern is formed that is spaced apart along one of the X-axis direction and the Y-axis direction in the XY orthogonal coordinate plane, and the processing unit includes: In a state where the needle tip of the second probe of the second inspection head is in contact with the first conductor pattern, the moving mechanism is controlled so that the needle tip of the first probe of the first inspection head is By causing the measurement unit to measure the capacitance between the probes while moving along the one axial direction in the region between the first conductor portion and the second conductor portion, An error for specifying the position of the first inspection head having the smallest capacity and calculating an error along the one axial direction between the specified position and the first reference point defined in advance on the calibration substrate Calculation processing and calculation Wherein when said contacting needle tip of each probe to the each test point error executes a correction process for correcting the position of each inspection head.

  The circuit board inspection apparatus according to claim 4 is the circuit board inspection apparatus according to claim 3, wherein the calibration board includes a third conductor portion and a fourth conductor portion having a line symmetry shape in the X-axis direction and the A second conductor pattern is formed so as to be spaced apart along the other axial direction of the Y-axis direction, and the processing unit includes the second probe of the second inspection head in the error calculation process. In a state where the needle tip is in contact with the second conductor pattern, the moving mechanism is controlled so that the needle tip of the first probe of the first inspection head is positioned between the third conductor portion and the fourth conductor portion. The position of the first inspection head at which the capacitance is minimized by causing the measurement unit to measure the capacitance between the probes while moving along the other axial direction within the region. Identify and do An error along the other axial direction between the specified position and the second reference point defined in advance on the calibration board is calculated, and in the correction process, each error is calculated at each inspection point with the calculated error. Further correct the position of each inspection head when contacting the probe tip.

  The circuit board inspection apparatus according to claim 5 is parallel to the first inspection head to which the first probe is attached, the second inspection head to which the second probe is attached, and the table on which the inspection target substrate is disposed. A moving mechanism for individually moving the inspection heads in an XY orthogonal coordinate plane and moving the inspection heads individually along the Z-axis direction orthogonal to the XY orthogonal coordinate plane; By moving the inspection heads by controlling the moving mechanism, the probe tip of each probe is brought into contact with the inspection point on the inspection target substrate disposed on the table to inspect the inspection target substrate. A circuit board inspection apparatus including a processing unit for measuring a capacitance between the probes, and a calibration board disposed on the table and having an annular conductor pattern formed thereon. The processing unit controls the moving mechanism to control the first of the first inspection head in a state where the needle tip of the second probe of the second inspection head is in contact with the annular conductor pattern. The first capacitance that minimizes the capacitance is caused by causing the measurement unit to measure the capacitance between the probes while moving the probe tip of the probe in the inner region of the annular conductor pattern. An error for specifying the position of the inspection head and calculating each error along the X-axis and Y-axis directions in the XY orthogonal coordinate plane between the specified position and a reference point defined in advance on the calibration board A calculation process and a correction process for correcting the position of each inspection head when the probe tip of each probe is brought into contact with each inspection point with the calculated error are executed.

  The circuit board inspection apparatus according to claim 1, further comprising a calibration board on which first and second conductor patterns having line-symmetric shapes that are separated along one of the X-axis direction and the Y-axis direction are formed, The processing unit controls the moving mechanism to bring the needle tip of the second probe of the second inspection head into contact with the first conductor pattern and the second conductor pattern alternately, while moving the needle tip of the first probe of the first inspection head. The needle tip of the second probe is moved in the region between the first and second conductor patterns along one axial direction, and the capacitance between the probes is measured by the measurement unit. The position of the first inspection head where the capacitance measured when contacting the conductor pattern and the capacitance measured when the needle tip of the second probe is brought into contact with the second conductor pattern is specified. And the specified position Error calculation processing for calculating an error along one axial direction with the first reference point defined in advance on the positive substrate, and each inspection when the probe tip of each probe is brought into contact with each inspection point with the calculated error Correction processing for correcting the position of the head is executed.

  Therefore, according to this circuit board inspection apparatus, an error along one axial direction of each probe mounted on the first inspection head and the second inspection head is calculated without using a dent sheet and a camera. In addition, since the position along one axial direction of the inspection point defined on the inspection target substrate for each inspection head can be corrected, it is possible to eliminate the need to replace the dent sheet and an expensive camera. As a result, an increase in device cost can be avoided.

  According to another aspect of the circuit board inspection apparatus of the present invention, the third conductor pattern and the fourth conductor pattern having a line symmetry are separated from each other along the other axial direction of the X axis direction and the Y axis direction. In the error calculation process, the processing unit further converts the capacitance measured when the needle tip of the second probe is brought into contact with the third conductor pattern and the needle tip of the second probe into the fourth conductor pattern. The position of the first inspection head at which the capacitance measured when contacted is equal is specified, and along the other axial direction between the specified position and the second reference point defined in advance on the calibration substrate An error is calculated, and in the correction process, the position of each inspection head when the probe tip of each probe is brought into contact with each inspection point is further corrected with the calculated error. Therefore, according to this circuit board inspection apparatus, while avoiding an increase in apparatus cost, an error along the other axial direction of each probe mounted on the first inspection head and the second inspection head is calculated, The position along the other axial direction of the inspection point defined on the inspection target substrate for each inspection head can be corrected.

  In the circuit board inspection apparatus according to claim 3, the first conductor part and the second conductor part having a line symmetry shape are arranged apart from each other along one of the X-axis direction and the Y-axis direction. A calibration substrate on which a first conductor pattern is formed, and the processing unit controls the moving mechanism in a state where the probe tip of the second probe of the second inspection head is in contact with the first conductor pattern, and the first inspection head By causing the measuring section to measure the capacitance between the probes while moving the needle tip of the first probe along the one axial direction within the region between the first conductor portion and the second conductor portion An error that specifies the position of the first inspection head that minimizes the capacitance, and calculates an error along one axial direction between the specified position and a first reference point that is defined in advance on the calibration substrate. Each inspection poi is calculated by the calculation process and the calculated error. Performing a correction process for correcting the position of each inspection head when contacting the needle tip of each probe and.

  Therefore, according to this circuit board inspection apparatus, an error along one axial direction of each probe mounted on the first inspection head and the second inspection head is calculated without using a dent sheet and a camera. In addition, since the position along one axial direction of the inspection point defined on the inspection target substrate for each inspection head can be corrected, it is possible to eliminate the need to replace the dent sheet and an expensive camera. As a result, an increase in device cost can be avoided. Furthermore, in this circuit board inspection apparatus, when calculating the error along one axial direction of the probe mounted on one inspection head, the probe mounted on the other inspection head is used for calculating the error. It suffices to contact one conductor pattern, and there is no need to change the contact conductor pattern. For this reason, the error can be calculated in a shorter time, and the position along one axial direction of the inspection point defined on the inspection target substrate for each inspection head can be corrected.

  Further, in the circuit board inspection apparatus according to claim 4, the third conductor portion and the fourth conductor portion having a line symmetry shape are arranged apart from each other along the other of the X-axis direction and the Y-axis direction. A calibration board having a second conductor pattern is provided, and the processing unit controls the moving mechanism in a state where the tip of the second probe of the second inspection head is in contact with the second conductor pattern in the error calculation process. The capacitance between the probes with respect to the measurement unit while moving the needle tip of the first probe of the first inspection head along the other axial direction within the region between the third conductor portion and the fourth conductor portion. By measuring the position of the first inspection head that minimizes the capacitance, and an error along the other axial direction between the specified position and the second reference point defined in advance on the calibration substrate. And calculated in the correction process. Further correcting the position of each inspection head when contacting the needle tip of each probe in each inspection point difference. Therefore, according to this circuit board inspection apparatus, while avoiding an increase in apparatus cost, an error along the other axial direction of each probe mounted on the first inspection head and the second inspection head is calculated, The position along the other axial direction of the inspection point defined on the inspection target substrate for each inspection head can be corrected.

  The circuit board inspection apparatus according to claim 5 includes a calibration substrate on which an annular conductor pattern is formed, and the processing unit brings the needle tip of the second probe of the second inspection head into contact with the annular conductor pattern. In the state, by controlling the moving mechanism to move the probe tip of the first probe of the first inspection head in the inner region of the annular conductor pattern, the measurement unit measures the capacitance between the probes. The position of the first inspection head that minimizes the capacitance is specified, and along the X-axis and Y-axis directions on the XY orthogonal coordinate plane between the specified position and the reference point that is defined in advance on the calibration substrate An error calculation process for calculating each error and a correction process for correcting the position of each inspection head when the probe tip of each probe is brought into contact with each inspection point with the calculated error are executed.

  Therefore, according to this circuit board inspection apparatus, the error for each probe mounted on the first inspection head and the second inspection head can be calculated without using the dent sheet and the camera. As a result of eliminating the need for sheet replacement work and expensive cameras, an increase in apparatus cost can be avoided. Further, in this circuit board inspection apparatus, when calculating the error along the X-axis and Y-axis directions for the probe mounted on one inspection head, the probe mounted on the other inspection head is an annular conductor. The pattern may be kept in contact with the pattern, and there is no need to change the conductor pattern to be contacted. For this reason, the error can be calculated in a shorter time, and the time until the completion of the correction process for the position along each axial direction of the inspection point defined on the inspection target substrate for each inspection head can be shortened. it can.

  Hereinafter, the best mode of a circuit board inspection apparatus according to the present invention will be described with reference to the accompanying drawings.

  First, the configuration of the circuit board inspection apparatus 1 will be described with reference to FIGS.

  As shown in FIG. 1, the circuit board inspection apparatus 1 includes a table 2, a calibration board 3, a first inspection head 4, a second inspection head 5, a first probe 6, a second probe 7, a moving mechanism 8, and a measuring unit 9. The storage unit 10, the operation unit 11, and the processing unit 12 are configured so that an inspection target substrate (hereinafter also referred to as “substrate”) 13 placed on the surface 2 a of the table 2 can be inspected.

  As shown in FIGS. 1 and 2, the table 2 is configured such that the substrate 13 can be placed at a predetermined inspection position on the surface 2 a. As an example, as shown in FIGS. 2 and 3, the calibration board 3 has four independent first conductor patterns 21, second conductor patterns 22, third conductor patterns 23, and fourth conductor patterns 24 on one surface (this In the example, it is the front surface, but it may be formed on the back surface (the surface facing the table 2). Further, as an example, the first conductor pattern 21 and the second conductor pattern 22 have an XY orthogonal coordinate plane (a plane parallel to the surface 2a of the table 2; hereinafter, also referred to as “XY coordinate plane”). Are symmetric with respect to a virtual straight line L1 parallel to the Y axis (a straight line passing through the reference point A defined on the calibration substrate 3). Specifically, the first conductor pattern 21 and the second conductor pattern 22 are rectangles having the same shape parallel to the Y axis (the rectangle whose longitudinal direction is parallel to the Y axis), and the direction of one axis (X axis) Are spaced apart from each other. On the other hand, the third conductor pattern 23 and the fourth conductor pattern 24 are, for example, line-symmetric shapes with respect to a virtual straight line L2 (straight line passing through the reference point A) parallel to the X axis in the XY coordinate plane. Is formed. Specifically, the third conductor pattern 23 and the fourth conductor pattern 24 are the same rectangle parallel to the X axis (the longitudinal direction is a rectangle parallel to the X axis) and the other axis (Y axis) direction. It is formed so as to be spaced apart along. In this example, as shown in FIG. 3, each of the conductor patterns 21 to 24 is formed in an independent state (non-contact state) on four sides of a virtual square B centering on the reference point A. Therefore, the reference point A is also a first reference point for calculating an error of one axis (X axis) in the present invention, as will be described later, and an error of the other axis (Y axis) in the present invention. It is also the second reference point for calculating. Moreover, the calibration board | substrate 3 is attached to the position adjacent to the board | substrate 13 mounted in the surface 2a of the table 2, as shown in FIG. Note that the sizes and intervals of the first conductor pattern 21, the second conductor pattern 22, the third conductor pattern 23, and the fourth conductor pattern 24 are exaggerated from the actual ones in order to facilitate understanding of the invention. Are shown.

  The first inspection head 4 and the second inspection head 5 are configured identically, and are arranged on the surface 2a side of the table 2 as shown in FIG. The inspection heads 4 and 5 are respectively supported by the moving mechanism 8 and can move independently in the XY coordinate plane, and move along the Z-axis direction orthogonal to the XY coordinate plane. It is possible. The first probe 6 and the second probe 7 have the same needle tip 6a, 7a, and are configured in the same way. The first probe 6 is in the first inspection head 4, the second probe 7 is in the second inspection head 5, and The needle tips 6a and 7a are attached so that the extending directions thereof are along the Z-axis direction.

  As an example, the moving mechanism 8 includes two one-dimensional moving mechanisms (not shown) (two moving mechanisms that move the moving object along the Z-axis direction) and each one-dimensional moving mechanism described above with the XY. And two two-dimensional movement mechanisms (not shown) that move two-dimensionally independently in the coordinate plane. In addition, the first inspection head 4 is attached as a moving object to one of the two one-dimensional movement mechanisms, and the second inspection head 5 is attached to the other one-dimensional movement mechanism. It is attached as a moving object. With this configuration, the moving mechanism 8 is controlled by the processing unit 12 to individually move the inspection heads 4 and 5 to designated positions.

  The measuring unit 9 is electrically connected to the probes 6 and 7 attached to the inspection heads 4 and 5 via wiring materials. The measurement unit 9 is controlled by the processing unit 12 to output a test signal such as a voltage signal between the probes 6 and 7 and is generated between the probes 6 and 7 when the test signal is output. Based on the amount of electricity (for example, current), electrical parameters (for example, wiring patterns formed on the substrate 13 and electronic components mounted on the substrate 13) in contact with the probes 6 and 7 (for example, The resistance calculated based on the voltage value of the voltage signal and the current value of the current, and the capacitance and inductance calculated based on each waveform of the voltage signal and current are measured.

  The storage unit 10 is configured by a semiconductor memory such as a ROM and a RAM, for example, and an operation program for the processing unit 12 and a plurality of inspection points CP defined on the substrate 13 are provided with the needle tips 6a, The position data indicating the coordinates in the XY coordinate plane of each inspection head 4, 5 when contacting 7 a, the reference point A of the calibration board 3, and the conductor patterns 21 to 24 formed on the calibration board 3 Position data indicating coordinates in the XY coordinate plane of each inspection head 4, 5 when the probe tips 6 a, 7 a of the probes 6, 7 are brought into contact, and in the XY coordinate plane of each inspection head 4, 5 Position data Dp including position data indicating coordinates of a standby position (not shown) is stored in advance. In this example, in order to facilitate understanding of the invention, the position of each inspection head 4, 5 when moving the needle tips 6 a, 7 a of each probe 6, 7 to the reference point A of the calibration substrate 3 is called a measurement position, Each inspection head when the probe tips 6a, 7a of the probes 6, 7 are brought into contact with the first conductor pattern 21, the second conductor pattern 22, the third conductor pattern 23, and the fourth conductor pattern 24 formed on the calibration substrate 3. The positions 4 and 5 are referred to as a first contact position, a second contact position, a third contact position, and a fourth contact position.

  The operation unit 11 includes a plurality of types of keys (all not shown) including a setting key, an execution key, a stop key, and the like, and outputs operation data Do indicating operation contents for each key to the processing unit 12. The processing unit 12 is configured by a CPU or the like, and an error (reference standard) from the reference point A with respect to the needle tips 6a and 7a of the probes 6 and 7 when the inspection heads 4 and 5 are positioned at the measurement positions. Error calculation processing for calculating the error (separation distance) along the X axis of the needle tips 6a and 7a of the probes 6 and 7 from the point A and the error (separation distance) along the Y axis), A correction process for correcting the position data indicating the coordinates of each inspection point defined on the substrate 13 and an inspection process for the substrate 13 are executed.

  Next, an inspection operation for the substrate 13 by the circuit board inspection apparatus 1 will be described.

  In a state where the substrate 13 is placed on the table 2, when the operation unit 11 is operated and the processing unit 12 is instructed to start an inspection, the processing unit 12 first performs an error calculation process. Execute.

  In this error calculation process, the processing unit 12 sequentially calculates the above-described errors for the probe tips 6a and 7a of the probes 6 and 7 attached to the inspection heads 4 and 5, respectively. First, the processing unit 12 executes a first calculation process for calculating an error (an error along the X-axis direction and an error along the Y-axis direction) about the needle tip 6a of the first probe 6. In the first calculation process, the processing unit 12 first executes an X-axis error calculation process for calculating an error along the X-axis direction, and follows the X-axis direction for the needle tip 6a of the first probe 6. Calculate the error.

  In this process, the processing unit 12 first moves the needle tip 6 a of the first probe 6 attached to the first inspection head 4 to the reference point A of the calibration board 3. Specifically, the processing unit 12 reads the position data Dp for the measurement position from the storage unit 10 and controls the moving mechanism 8 to move the first inspection head 4 to the measurement position in the XY coordinate plane. Let In this case, the needle tip 6a of the first probe 6 attached to the first inspection head 4 is theoretically moved to the reference point A of the calibration board 3, but the first inspection head 4 and the first inspection head 4 described above are moved. Since the relative position of the first probe 6 with respect to the first inspection head 4 varies every time the probe 6 is attached due to manufacturing tolerances of the one probe 6 and the like, actually, the reference point A as shown in FIG. And moved to a position E displaced by Δx1 along the X-axis direction and displaced by Δy1 along the Y-axis direction. Further, the processing unit 12 controls the moving mechanism 8 to move the first inspection head 4 by a predetermined distance in the Z-axis direction, and stops it before contacting the calibration substrate 3. Thereby, as shown in FIG. 4, the needle tip 6 a of the first probe 6 is slightly lifted from the surface of the calibration substrate 3 at the position E.

  Next, the processing unit 12 brings the needle tip 7 a of the second probe 7 attached to the second inspection head 5 into contact with the first conductor pattern 21. Specifically, the processing unit 12 reads the position data Dp for the first contact position from the storage unit 10 and controls the moving mechanism 8 to move the second inspection head 5 to the first in the XY coordinate plane. It is moved to the contact position, and subsequently moved in the Z-axis direction to be brought into contact with the calibration substrate 3. Thereby, the needle tip 7a of the second probe 7 attached to the second inspection head 5 comes into contact with the first conductor pattern 21 formed on the calibration board 3 at the position F shown in FIG. The width of the first conductor pattern 21 and the coordinates of the first contact position are determined by the manufacturing tolerances of the inspection heads 4, 5 and the probes 6, 7. Even if the relative positions of the tips 6 a and 7 a vary, it is defined in advance so that the needle tips 6 a and 7 a can reliably contact the first conductor pattern 21. Similarly, the coordinates of the width of the second conductor pattern 22 and the second contact position (the positions of the inspection heads 4 and 5 where the positions of the probe tips 6a and 7a of the probes 6 and 7 become the position G in FIG. 3), the third The width of the conductor pattern 23 and the coordinates of the third contact position (the positions of the inspection heads 4 and 5 where the positions of the probe tips 6a and 7a of the probes 6 and 7 are the position H in FIG. 3) and the width of the fourth conductor pattern 24 The coordinates of the fourth contact position (the positions of the inspection heads 4 and 5 at which the positions of the probe tips 6a and 7a of the probes 6 and 7 become the position I in FIG. 3) are also defined.

  Next, the processing unit 12 controls the measurement unit 9 to measure the capacitance between the probes 6 and 7. Thereby, the measurement part 9 is the electrostatic capacitance between the 1st conductor pattern 21 and the 1st probe 6 (specifically the needle tip 6a of the 1st probe 6) which the needle tip 7a of the probe 7 is contacting. C1 (see FIG. 4) is measured and output to the processing unit 12. The processing unit 12 inputs this capacitance C1 and stores it in the storage unit 10.

  Subsequently, the processing unit 12 brings the needle tip 7 a of the second probe 7 attached to the second inspection head 5 into contact with the second conductor pattern 22. Specifically, the processing unit 12 reads the position data Dp for the second contact position from the storage unit 10 and controls the moving mechanism 8 to move the second inspection head 5 to the second position in the XY coordinate plane. Move to the contact position, and then move in the Z-axis direction. Thereby, the needle tip 7a of the second probe 7 is located at the position G shown in FIG. 4 and is in contact with the second conductor pattern 22. Next, the processing unit 12 controls the measurement unit 9 to measure the capacitance between the probes 6 and 7. As a result, the measurement unit 9 measures the capacitance C2 (see FIG. 4) between the second conductor pattern 22 and the first probe 6 with which the probe tip 7a of the probe 7 is in contact, and the processing unit 12 Output to. The processing unit 12 inputs this electrostatic capacitance C2 and stores it in the storage unit 10.

  Subsequently, the processing unit 12 compares the capacitances C1 and C2 stored in the storage unit 10, and when the capacitances C1 and C2 are different, the processing unit 12 controls the moving mechanism 8 to A unit distance (a minute distance) determined in advance along the X-axis from the first inspection head 4 to the smaller one of the capacitance values between the second conductor patterns 21 and 22 and the needle tip 6a of the first probe 6. ) Only to stop.

  Next, the processing unit 12 controls the measurement unit 9 to measure the capacitance between the probes 6 and 7. As a result, the measurement unit 9 measures the electrostatic capacitance C2 (see FIG. 4) between the second conductor pattern 22 and the probe 6 with which the needle tip 7a of the second probe 7 is in contact with the processing unit 12. The processing unit 12 stores the capacitance C2 in the storage unit 10. Subsequently, the processing unit 12 controls the moving mechanism 8 to move the second inspection head 5 to the first contact position in the XY coordinate plane and move it in the Z-axis direction, thereby moving the second probe. 7 is again moved to the position F shown in FIG. 3 and brought into contact with the first conductor pattern 21, and the capacitance C1 (see FIG. 4) between the first conductor pattern 21 and the probe 6 is changed. Measure and store in the storage unit 10. Next, the processing unit 12 compares the new capacitances C1 and C2 stored in the storage unit 10, and when the capacitances C1 and C2 are different, the processing unit 12 controls the moving mechanism 8 to In addition, the first inspection head 4 is moved by a unit distance along the X axis to the smaller one of the capacitance values between the second conductor patterns 21 and 22 and the needle tip 6a of the first probe 6 and stopped. .

  Thereafter, the processing unit 12 controls the moving mechanism 8 so that the needle tips 7a of the second probe 7 attached to the second inspection head 5 are alternately brought into contact with the conductor patterns 21 and 22 of the calibration board 3, while While moving the needle tip 6a of the first probe 6 mounted on one inspection head 4 by a unit distance along the X-axis (one axis) direction within the region between the conductor patterns 21 and 22, The capacitance C1 and the second probe when the probe tip 7a of the second probe 7 is brought into contact with the first conductor pattern 21 by causing the measurement unit 9 to measure the capacitance between the probes 6 and 7. The measurement processing of the capacitance C2 measured when the 7 needle tips 7a are brought into contact with the second conductor pattern 22 and the comparison processing of the measured capacitances C1 and C2 are both performed. Repeat until C1 and C2 match. As a result, when both the capacitances C1 and C2 match, the processing unit 12 specifies the position of the first inspection head 4 at this time, and the specified position and the first time at the start of the X-axis error calculation process. The distance (movement amount) from the position (measurement position) of one inspection head 4 is calculated, and this calculated distance is along the X-axis direction from the reference point A to the position E with respect to the needle tip 6a of the first probe 6. The error Δx1 is stored in the storage unit 10. Thereby, the X-axis error calculation process in the first calculation process is completed. In the present example, the first conductor pattern 21 and the second conductor pattern 22 are formed in the same planar shape (rectangular shape) and are arranged in parallel with each other, so that the needle tip 6a of the first probe 6 is the first one. When positioned at an intermediate position (on the virtual straight line L1) between the conductor pattern 21 and the second conductor pattern 22, both the capacitances C1 and C2 are equal. Therefore, the first inspection head 4 from the position (measurement position) of the first inspection head 4 at the start of the X-axis error calculation process to the above specified position (position where both electrostatic capacitances C1 and C2 match). Is equal to the error Δx1.

  Next, the processing unit 12 executes a Y-axis error calculation process in the first calculation process. In this process, the processing unit 12 again reads the position data Dp for the measurement position from the storage unit 10 and controls the movement mechanism 8 to move the first inspection head 4 to the measurement position, and then the movement mechanism 8. And the first inspection head 4 is moved by a predetermined distance in the Z-axis direction and stopped. As a result, the needle tip 6a of the first probe 6 attached to the first inspection head 4 is again slightly lifted from the surface of the calibration substrate 3 at the position E shown in FIG. Become.

  Next, the processing unit 12 brings the needle tip 7 a of the second probe 7 attached to the second inspection head 5 into contact with the third conductor pattern 23. Specifically, the processing unit 12 reads the position data Dp for the third contact position from the storage unit 10 and controls the moving mechanism 8 to move the second inspection head 5 to the third position in the XY coordinate plane. Move to the contact position, and then move in the Z-axis direction. Thereby, the needle tip 7a of the second probe 7 attached to the second inspection head 5 is located at the position H shown in FIG. 3 and is in contact with the third conductor pattern 23.

  Next, the processing unit 12 controls the measurement unit 9 to measure the capacitance between the probes 6 and 7. Thereby, the measurement part 9 is the electrostatic capacitance between the 3rd conductor pattern 23 and the 1st probe 6 (specifically the needle tip 6a of the 1st probe 6) which the needle tip 7a of the probe 7 is contacting. C1 (see FIG. 4) is measured and output to the processing unit 12. The processing unit 12 inputs this capacitance C1 and stores it in the storage unit 10.

  Subsequently, the processing unit 12 brings the needle tip 7 a of the second probe 7 attached to the second inspection head 5 into contact with the fourth conductor pattern 24. Specifically, the processing unit 12 reads the position data Dp for the fourth contact position from the storage unit 10 and controls the moving mechanism 8 to move the second inspection head 5 to the fourth position in the XY coordinate plane. Move to the contact position, and then move in the Z-axis direction. Thereby, the needle tip 7a of the second probe 7 is located at the position I shown in FIG. 3 and is in contact with the fourth conductor pattern 24. Next, the processing unit 12 controls the measurement unit 9 to measure the capacitance between the probes 6 and 7. Accordingly, the measurement unit 9 measures the capacitance C2 (see FIG. 4) between the fourth conductor pattern 24 and the first probe 6 with which the probe tip 7a of the probe 7 is in contact, and the processing unit 12 Output to. The processing unit 12 inputs this electrostatic capacitance C2 and stores it in the storage unit 10.

  Subsequently, the processing unit 12 compares the capacitances C1 and C2 stored in the storage unit 10, and when the capacitances C1 and C2 are different, the processing unit 12 controls the moving mechanism 8 to A unit distance (a minute distance) determined in advance along the Y axis by moving the first inspection head 4 to the smaller one of the capacitance values between the second conductor patterns 21 and 22 and the needle tip 6a of the first probe 6. ) Only to stop.

  Thereafter, the processing unit 12 controls the moving mechanism 8 so that the needle tip 7a of the second probe 7 attached to the second inspection head 5 is transferred to each conductor pattern 23, similarly to the X-axis error calculation process described above. 24, the needle tip 6a of the first probe 6 mounted on the first inspection head 4 is unit distance along the Y-axis (the other axis) direction within the area between the conductor patterns 23 and 24 When the probe tip 7a of the second probe 7 is brought into contact with the third conductor pattern 23 by causing the measuring unit 9 to measure the capacitance between the probes 6 and 7 each time the electrode is moved. Measurement of the capacitance C2 measured when the capacitance C1 of the second probe 7 and the probe tip 7a of the second probe 7 are brought into contact with the fourth conductor pattern 24, and comparison between the measured capacitances C1 and C2. Repeat until both capacitances C1 and C2 match. To be executed. As a result, when both the electrostatic capacitances C1 and C2 match, the processing unit 12 specifies the position of the first inspection head 4 at this time, and the specified position and the first time at the start of the Y-axis error calculation process. The distance (movement amount) from the position (measurement position) of one inspection head 4 is calculated, and this calculated distance is along the Y-axis direction from the reference point A to the position E for the needle tip 6a of the first probe 6. The error Δy1 is stored in the storage unit 10. Thereby, the Y-axis error calculation process in the first calculation process is completed. In this example, the third conductor pattern 23 and the fourth conductor pattern 24 are formed in the same planar shape (rectangular shape) and are arranged in parallel with each other, so that the needle tip 6a of the first probe 6 is the third one. When positioned at an intermediate position (on the virtual straight line L2) between the conductor pattern 23 and the fourth conductor pattern 24, both the capacitances C1 and C2 are equal. Therefore, the first inspection head 4 from the position (measurement position) of the first inspection head 4 at the start of the Y-axis error calculation process to the above specified position (position where both electrostatic capacitances C1 and C2 match). Is equal to the error Δy1. Thereby, the first calculation process is completed, and the storage unit 10 stores the error (the error Δx1 along the X-axis direction and the Y-axis) about the needle tip 6a of the first probe 6 attached to the first inspection head 4. The error Δy1) along the direction is stored.

  Next, the processing unit 12 performs a second calculation process for calculating an error (the error Δx2 along the X-axis direction and the error Δy2 along the Y-axis direction) regarding the needle tip 7a of the second probe 7. In the second calculation process, similarly to the first calculation process described above, the processing unit 12 first executes an X-axis error calculation process in the X-axis direction with respect to the needle tip 7a of the second probe 7. The error Δx2 along the Y-axis direction of the needle tip 7a of the second probe 7 is calculated by executing the Y-axis error calculation process. The X-axis error calculation process and the Y-axis error calculation process in the second calculation process are the same as the first inspection head 4 and the first axis in the X-axis error calculation process and the Y-axis error calculation process in the first calculation process described above. 2 The reading process for replacing the inspection head 5 is performed, and the processing content is the same as the process for performing the replacement process for replacing the first probe 6 and the second probe 7, and thus the description thereof is omitted. When the processing unit 12 executes the second calculation process, an error (an error along the X-axis direction) about the needle tip 7a of the second probe 7 attached to the second inspection head 5 is stored in the storage unit 10. Δx2 and error Δy2) along the Y-axis direction are stored. Thereby, the error calculation process is completed.

  Subsequently, the processing unit 12 executes correction processing for correcting position data indicating the coordinates of the inspection point CP defined on the substrate 13 based on the calculated errors (Δx1, Δy1), (Δx2, Δy2). Specifically, the processing unit 12 corrects the position data indicating the coordinates of the inspection point CP read from the storage unit 10 with an error (Δx1, Δy1), so that the first inspection head on which the first probe 6 is mounted. 4 is calculated and stored in the storage unit 10 as corrected position data. Similarly, the processing unit 12 corrects the position data indicating the coordinates of the inspection point CP read from the storage unit 10 with an error (Δx2, Δy2), thereby performing the second inspection with the second probe 7 attached thereto. The position data for each inspection point CP for the head 5 is calculated and stored in the storage unit 10 as corrected position data. Thereby, the correction process is completed.

  Next, the processing unit 12 performs an inspection process on the substrate 13. In this inspection process, the processing unit 12 first performs control on the moving mechanism 8 while reading out the corrected position data for the inspection points CP for the inspection heads 4 and 5 from the storage unit 10, and performs the first probe. 6 and the second probe 7 are brought into contact with a target inspection point CP on the substrate 13. Next, the processing unit 12 performs control on the measurement unit 9 and outputs an inspection signal between the probes 6 and 7, thereby setting the electrical parameters of the electrical components in contact with the probes 6 and 7. The measured electrical parameter is stored in the storage unit 10 in correspondence with the inspection point CP. The processing unit 12 ends the inspection process when all the electrical parameters of the electrical components to be inspected are completed. Thereby, the inspection for the substrate 13 is completed.

  Thus, in this circuit board inspection apparatus 1, the pair of conductor patterns 21 and 22 that are separated along the direction of one of the X-axis and the Y-axis (X-axis), and the direction of the other axis (Y-axis) Each of the conductor patterns 21 for the probes 6 and 7 attached to the first inspection head 4 and the second inspection head 5 using the calibration substrate 3 on which a pair of conductor patterns 23 and 24 spaced apart along the same line is formed. , 22 (or the conductor patterns 23, 24) based on the capacitances C1, C2, one axis for each probe 6, 7 attached to the first inspection head 4 and the second inspection head 5 The errors Δx1, Δx2 along the (X axis) direction and the errors Δy1, Δy2 along the other axis (Y axis) direction are calculated, and based on the calculated errors (Δx1, Δy1), (Δx2, Δy2). Each inspection head The position data indicating the coordinates of the inspection point CP defined on the substrate 13 for 4 and 5 is corrected. Therefore, according to the circuit board inspection apparatus 1, errors (Δx1, Δy1) about the probes 6 and 7 attached to the first inspection head 4 and the second inspection head 5 without using a dent sheet and a camera. ), (Δx2, Δy2) can be calculated and the position data indicating the coordinates of the inspection point CP defined on the substrate 13 for each of the inspection heads 4 and 5 can be corrected. As a result of eliminating the need for an expensive camera for imaging the dent, an increase in apparatus cost can be avoided.

  In addition, this invention is not limited to said structure. For example, in the circuit board inspection apparatus 1 described above, an error in each axial direction (error in the X-axis direction (Δx1, Δx2), error in the Y-axis direction (Δy1, Δy2)) is calculated. A calibration substrate 3 on which a pair of conductor patterns (first and second conductor patterns 21, 22 and third and fourth conductor patterns 23, 24) is formed is used, but the planar shape as shown in FIG. A configuration (see FIG. 1) using the calibration substrate 3A on which the first and second conductor patterns 31 and 32 (U-shape or U-shape. In this example, U-shape as an example) is formed. it can.

  The calibration substrate 3A will be specifically described. The first conductor pattern 31 has errors Δx1 and Δx2 along the X-axis direction for the probes 6 and 7 attached to the first inspection head 4 and the second inspection head 5. This is for calculation, and is symmetrical with respect to a virtual straight line L1 passing through the reference point A1 defined on the calibration board 3 and parallel to the Y axis (in this example, along one axis (X axis) direction) The first conductor portion 31a and the second conductor portion 31b, and the first conductor portion 31a and the second conductor portion 31b, which are formed in a rectangular shape having a longitudinal direction parallel to the Y axis. And a connecting conductor portion 31c to be connected. On the other hand, the second conductor pattern 32 is for calculating errors Δy1 and Δy2 along the Y-axis direction for the probes 6 and 7 attached to the first inspection head 4 and the second inspection head 5, Axisymmetric shape with reference to an imaginary straight line L2 passing through the reference point A2 defined on the calibration substrate 3 and parallel to the X axis (in this example, arranged apart from each other in the direction of the other axis (Y axis), and A third conductor portion 32a and a fourth conductor portion 32b formed in a rectangular shape having a longitudinal direction parallel to the X axis), and a connecting conductor portion 32c that connects the third conductor portion 32a and the fourth conductor portion 32b. It is formed in preparation.

  A circuit board inspection apparatus 1A provided with the calibration board 3A will be described. Compared with the circuit board inspection apparatus 1, the probe points 6a and 7a of the probes 6 and 7 are provided on the two reference points A1 and A2 of the calibration board 3A and the conductor patterns 31 and 32 formed on the calibration board 3A. The position data Dp includes position data indicating coordinates in the XY coordinate plane of the inspection heads 4 and 5 when they are brought into contact with each inspection head 4 and 5 executed by the processing unit 12. Since the error calculation process for calculating the errors for the needle tips 6a and 7a of the attached probes 6 and 7 is mainly different, these differences will be described. In the following description, in order to facilitate understanding of the invention, the positions of the inspection heads 4 and 5 when the probe tips 6a and 7a of the probes 6 and 7 are moved to the reference point A1 of the calibration board 3A are first measured. It is called a position, and the position of each inspection head 4, 5 when the probe tips 6a, 7a of the probes 6, 7 are moved to the reference point A2 of the calibration board 3A is called a second measurement position. The positions of the inspection heads 4 and 5 when the probe tips 6a and 7a of the probes 6 and 7 are brought into contact with the first conductor pattern 31 and the second conductor pattern 32 formed on the calibration substrate 3 are defined as the first contact position. And the second contact position.

  Next, an error calculation process by the circuit board inspection apparatus 1A will be described.

  In this error calculation process, the processing unit 12 first calculates the error (the error Δx1 along the X-axis direction and the error Δy1 along the Y-axis direction) for the needle tip 6a of the first probe 6. Execute. In the first calculation process, the processing unit 12 first executes an X-axis error calculation process to calculate an error Δx1 along the X-axis direction for the needle tip 6a of the first probe 6.

  Specifically, the processing unit 12 first moves the needle tip 6a of the first probe 6 attached to the first inspection head 4 to the reference point A1 of the calibration substrate 3A. Specifically, the processing unit 12 reads the position data Dp for the first measurement position from the storage unit 10 and controls the moving mechanism 8 to move the first inspection head 4 to the first in the XY coordinate plane. Move to the measurement position. In this case as well, the relative position of the first probe 6 with respect to the first inspection head 4 varies with respect to the first inspection head 4 due to manufacturing tolerances of the first inspection head 4 and the first probe 6. As shown in FIG. 5, it is moved from the reference point A1 to the position E1 displaced by Δx1 along the X-axis direction. Further, the processing unit 12 controls the moving mechanism 8 to move the first inspection head 4 by a predetermined distance in the Z-axis direction and stop it. Thereby, although not shown, the needle tip 6a of the first probe 6 is slightly lifted from the surface of the calibration substrate 3A at the position E1.

  Next, the processing unit 12 brings the needle tip 7 a of the second probe 7 attached to the second inspection head 5 into contact with the first conductor pattern 31. Specifically, the processing unit 12 reads the position data Dp for the first contact position from the storage unit 10 and controls the moving mechanism 8 to move the second inspection head 5 to the first in the XY coordinate plane. Move to the contact position, and then move in the Z-axis direction. Thereby, the needle tip 7a of the second probe 7 attached to the second inspection head 5 is located at the position J shown in FIG. 5 and is in contact with the first conductor pattern 31 formed on the calibration substrate 3A. Become.

  Next, the processing unit 12 controls the measurement unit 9 to start measuring the capacitance between the probes 6 and 7. As a result, the measurement unit 9 can reduce the static between the first conductor pattern 31 and the first probe 6 (specifically, the needle tip 6a of the first probe 6) with which the needle tip 7a of the second probe 7 is in contact. The capacitance C3 (see FIG. 7) is repeatedly measured and output to the processing unit 12.

  In this state, the processing unit 12 controls the moving mechanism 8 to move the second inspection head 5 along the X-axis direction within the XY coordinate plane, thereby moving the needle tip 7a of the second probe 7. While moving between the first conductor part 31a and the second conductor part 31b in the first conductor pattern 31, the position where the capacitance C3 is minimized is specified. In this example, the first conductor part 31a and the second conductor part 31b are formed in a line-symmetric shape (in this example, the same plane shape and a rectangle arranged in parallel with each other), so the first probe When the six needle tips 6a are closest to either the first conductor part 31a or the second conductor part 31b, the capacitance C3 becomes maximum, and from this state, the intermediate between the first conductor part 31a and the second conductor part The capacitance C3 gradually decreases as it moves toward the position (on the virtual straight line L1 that passes through the reference point A1 and is parallel to the Y axis), and the capacitance C3 becomes minimum when it reaches the intermediate position. . Therefore, the first inspection head 4 from the position (first measurement position) of the first inspection head 4 at the start of the X-axis error calculation process to the specified position (position where the capacitance C3 is minimized). Is equal to the error Δx1. The processing unit 12 stores this movement amount in the storage unit 10 as an error Δx1 along the X-axis direction. Thereby, the X-axis error calculation process in the first calculation process is completed.

  Next, the processing unit 12 executes a Y-axis error calculation process in the first calculation process, and calculates an error Δy1 along the Y-axis direction for the needle tip 6a of the first probe 6.

  Specifically, the processing unit 12 first moves the needle tip 6a of the first probe 6 attached to the first inspection head 4 to the reference point A2 of the calibration substrate 3A. Specifically, the processing unit 12 reads the position data Dp for the second measurement position from the storage unit 10 and controls the moving mechanism 8 to move the first inspection head 4 to the second position in the XY coordinate plane. Move to the measurement position. In this case as well, the relative position of the first probe 6 with respect to the first inspection head 4 varies with respect to the first inspection head 4 due to manufacturing tolerances of the first inspection head 4 and the first probe 6. As shown in FIG. 6, it is moved from the reference point A2 to a position E2 displaced by Δy1 along the Y-axis direction. Further, the processing unit 12 controls the moving mechanism 8 to move the first inspection head 4 by a predetermined distance in the Z-axis direction and stop it. Thereby, the needle tip 6a of the first probe 6 is slightly lifted from the surface of the calibration substrate 3A at the position E2.

  Next, the processing unit 12 brings the needle tip 7 a of the second probe 7 attached to the second inspection head 5 into contact with the second conductor pattern 32. Specifically, the processing unit 12 reads the position data Dp for the first contact position from the storage unit 10 and controls the moving mechanism 8 to move the second inspection head 5 to the second position in the XY coordinate plane. Move to the contact position, and then move in the Z-axis direction. Accordingly, the needle tip 7a of the second probe 7 attached to the second inspection head 5 is located at the position K shown in FIG. 6 and is in contact with the second conductor pattern 32 formed on the calibration substrate 3A. Become.

  Next, the processing unit 12 controls the measurement unit 9 to start measuring the capacitance between the probes 6 and 7. As a result, the measurement unit 9 can reduce the static between the second conductor pattern 32 in contact with the needle tip 7a of the second probe 7 and the first probe 6 (specifically, the needle tip 6a of the first probe 6). The capacitance C4 (see FIG. 7) is repeatedly measured and output to the processing unit 12.

  In this state, the processing unit 12 controls the moving mechanism 8 to move the second inspection head 5 along the Y-axis direction in the XY coordinate plane, thereby moving the needle tip 6 a of the first probe 6. While moving between the third conductor portion 32a and the fourth conductor portion 32b in the second conductor pattern 32, the position where the capacitance C4 is minimized is specified. In this case as well, as in the case of the first conductor pattern 31, the capacitance C4 when the needle tip 6a of the first probe 6 reaches the intermediate position between the third conductor portion 32a and the fourth conductor portion 32b. Is minimal. Therefore, the first inspection head 4 from the position (second measurement position) of the first inspection head 4 at the start of the Y-axis error calculation process to the specified position (position where the capacitance C4 is minimized). Is equal to the error Δy1. The processing unit 12 stores this movement amount in the storage unit 10 as an error Δy1 along the Y-axis direction. As a result, the X-axis error calculation process is completed and the first calculation process is completed, and an error (X in the needle tip 6a of the first probe 6 attached to the first inspection head 4 is stored in the storage unit 10. An error Δx1 along the axial direction and an error Δy1) along the Y-axis direction are stored.

  Next, the processing unit 12 performs a second calculation process for calculating an error (the error Δx2 along the X-axis direction and the error Δy2 along the Y-axis direction) regarding the needle tip 7a of the second probe 7. In the second calculation process, similarly to the first calculation process described above, the processing unit 12 first executes an X-axis error calculation process in the X-axis direction with respect to the needle tip 7a of the second probe 7. The error Δx2 along the Y-axis direction of the needle tip 7a of the second probe 7 is calculated by executing the Y-axis error calculation process. The X-axis error calculation process and the Y-axis error calculation process in the second calculation process are the same as the first inspection head 4 and the first axis in the X-axis error calculation process and the Y-axis error calculation process in the first calculation process described above. 2 The reading process for replacing the inspection head 5 is performed, and the processing content is the same as the process for performing the replacement process for replacing the first probe 6 and the second probe 7, and thus the description thereof is omitted. When the processing unit 12 executes the second calculation process, an error (an error along the X-axis direction) about the needle tip 7a of the second probe 7 attached to the second inspection head 5 is stored in the storage unit 10. Δx2 and error Δy2) along the Y-axis direction are stored. Thereby, the error calculation process is completed. Next, the processing unit 12 executes a correction process for correcting position data indicating the coordinates of the inspection point CP defined on the substrate 13 based on the calculated errors (Δx1, Δy1), (Δx2, Δy2).

  As described above, in the circuit board inspection apparatus 1A, the first inspection head 4 and the second inspection head 5 are used by using the calibration substrate 3A on which the two conductor patterns 31 and 32 having the planar shape as described above are formed. The probes 6 and 7 attached to the first inspection head 4 and the second inspection head 5 based on the capacitances C3 and C4 between the conductor patterns 31 and 32 of the attached probes 6 and 7. Error Δx1, Δx2 along one axis (X axis) direction and error Δy1, Δy2 along the other axis (Y axis) direction are calculated. Therefore, even with this circuit board inspection apparatus 1A, errors (Δx1, Δy1) about the probes 6, 7 mounted on the first inspection head 4 and the second inspection head 5 without using a dent sheet and a camera. , (Δx2, Δy2) can be calculated, so that an increase in device cost can be avoided. Furthermore, in this circuit board inspection apparatus 1A, when calculating the error along one axial direction for the probe mounted on one inspection head, the probe mounted on the other inspection head is used for calculating the error. It suffices to contact one conductor pattern (the first conductor pattern 31 or the second conductor pattern 32) in use, and there is no need to change the contacted conductor pattern. Therefore, the errors (Δx1, Δy1) and (Δx2, Δy2) are calculated in a shorter time than the circuit board inspection apparatus 1 described above, and the inspection points CP defined on the substrate 13 for each inspection head 4, 5 are calculated. The position data indicating the coordinates can be corrected.

  Further, the circuit board inspection apparatuses 1 and 1A described above use the calibration boards 3 and 3A on which a plurality of conductor patterns are formed, so that errors in the respective axial directions (errors in the X-axis direction and errors in the Y-axis direction) are obtained. Although the configuration of calculating individually is adopted, the calibration in which a conductor pattern 41 having an annular (perfect circle) planar shape (hereinafter also referred to as “annular conductor pattern 41”) as shown in FIG. 8 is formed. A configuration using the substrate 3B (see FIG. 1) can also be adopted.

  A circuit board inspection apparatus 1B provided with the calibration board 3B will be described. Compared to the circuit board inspection apparatuses 1 and 1A described above, the needle points 6a and 7a of the probes 6 and 7 are placed on the reference point A (center of the annular conductor pattern 41) and the annular conductor pattern 41 of the calibration board 3B. The position data Dp includes position data indicating the coordinates of the inspection heads 4 and 5 in the XY coordinate plane and the inspection heads 4 and 5 executed by the processing unit 12. Since the difference between the error calculation processing for calculating the respective errors of the needle tips 6a and 7a of the probes 6 and 7 attached to the probe is mainly different, these differences will be described. Hereinafter, in order to facilitate understanding of the invention, the position of each inspection head 4, 5 when moving the needle tips 6 a, 7 a of each probe 6, 7 to the reference point A of the calibration substrate 3 B is referred to as a measurement position. The positions of the inspection heads 4 and 5 when the probe tips 6a and 7a of the probes 6 and 7 are brought into contact with the annular conductor pattern 41 are referred to as contact positions.

  Next, an error calculation process performed by the circuit board inspection apparatus 1B will be described.

  In this error calculation process, the processing unit 12 first calculates the error (the error Δx1 along the X-axis direction and the error Δy1 along the Y-axis direction) for the needle tip 6a of the first probe 6. Execute. In the first calculation process, the processing unit 12 calculates an error Δx1 along the X-axis direction and an error Δy1 along the Y-axis direction for the needle tip 6a of the first probe 6.

  Specifically, the processing unit 12 first moves the needle tip 6a of the first probe 6 attached to the first inspection head 4 to the reference point A of the calibration substrate 3B. Specifically, the processing unit 12 reads the position data Dp for the measurement position from the storage unit 10 and controls the moving mechanism 8 to move the first inspection head 4 to the measurement position in the XY coordinate plane. Let In this case as well, the relative position of the first probe 6 with respect to the first inspection head 4 varies with respect to the first inspection head 4 due to manufacturing tolerances of the first inspection head 4 and the first probe 6. 8, deviates from the reference point A, passes through the reference point A and is displaced by Δx1 along the X-axis direction from the virtual straight line L1 parallel to the Y-axis, and passes through the reference point A and parallel to the X-axis. It is moved from the virtual straight line L2 to a position E displaced by Δy1 along the Y-axis direction. Further, the processing unit 12 controls the moving mechanism 8 to move the first inspection head 4 by a predetermined distance in the Z-axis direction and stop it. Thereby, although not shown, the needle tip 6a of the first probe 6 is slightly lifted from the surface of the calibration substrate 3B at the position E.

  Next, the processing unit 12 brings the needle tip 7 a of the second probe 7 attached to the second inspection head 5 into contact with the annular conductor pattern 41. Specifically, the processing unit 12 reads the position data Dp for the contact position from the storage unit 10 and controls the moving mechanism 8 to bring the second inspection head 5 to the contact position in the XY coordinate plane. Next, move in the Z-axis direction. Accordingly, the needle tip 7a of the second probe 7 attached to the second inspection head 5 is located at the position M shown in FIG. 8 and is in contact with the annular conductor pattern 41.

  Next, the processing unit 12 controls the measurement unit 9 to start measuring the capacitance between the probes 6 and 7. As a result, the measurement unit 9 can prevent static electricity between the annular conductor pattern 41 in contact with the needle tip 7a of the second probe 7 and the first probe 6 (specifically, the needle tip 6a of the first probe 6). The capacitance C5 (see FIG. 8) is repeatedly measured and output to the processing unit 12.

  In this state, the processing unit 12 controls the moving mechanism 8 to alternately move the second inspection head 5 along the X-axis direction and the Y-axis direction in the XY coordinate plane, thereby the second probe. 7 is moved in the inner region of the annular conductor pattern 41 so that the capacitance C5 becomes small, and the position where the capacitance C5 is minimized is specified. In this example, since the annular conductor pattern 41 is formed in an annular shape, the capacitance C5 becomes maximum when the needle tip 6a of the first probe 6 comes closest to the annular conductor pattern 41. From this state, As it moves toward the center of the annular conductor pattern 41 (reference point A), the capacitance C5 gradually decreases, and when it reaches the reference point A, the capacitance C5 is minimized. Therefore, the first inspection head 4 from the initial position (measurement position) of the first inspection head 4 at the start of the first calculation process to the above specified position (position where the capacitance C5 is minimized). The amount of movement along the X-axis direction coincides with the error Δx1, and the amount of movement along the Y-axis direction coincides with the error Δy1. The processing unit 12 stores the movement amounts in the storage unit 10 as errors Δx1 and Δy1. Thereby, the first calculation process is completed.

  Next, the processing unit 12 performs a second calculation process for calculating an error (the error Δx2 along the X-axis direction and the error Δy2 along the Y-axis direction) regarding the needle tip 7a of the second probe 7. In the second calculation process, similarly to the first calculation process described above, the processing unit 12 controls the moving mechanism 8 so that the needle tip 6a of the first probe 6 attached to the first inspection head 4 is moved. In contact with the annular conductor pattern 41, the moving mechanism 8 is further controlled in this state, and the needle tip 7a of the second probe 7 is moved in the inner region of the annular conductor pattern 41 so that the capacitance C5 becomes small. Thus, by specifying the position where the capacitance C5 is minimized, the error Δx2 along the X-axis direction and the error Δy2 along the Y-axis direction for the needle tip 7a of the second probe 7 are calculated. Store in the storage unit 10. Thereby, the second calculation process is completed, and the error calculation process is completed.

  As described above, in the circuit board inspection apparatus 1B, the probes 6 and 7 attached to the first inspection head 4 and the second inspection head 5 are used by using the calibration substrate 3B on which the annular conductor pattern 41 is formed. In the direction of one axis (X axis) of the probes 6 and 7 mounted on the first inspection head 4 and the second inspection head 5 on the basis of the electrostatic capacitance C5 between the conductor patterns 31 and 32. The errors Δx1 and Δx2 along the other axis (Y axis) are calculated. Therefore, even with this circuit board inspection apparatus 1B, errors (Δx1, Δy1) about the probes 6 and 7 attached to the first inspection head 4 and the second inspection head 5 without using a dent sheet and a camera. , (Δx2, Δy2) can be calculated, so that the replacement work of the dent sheet and an expensive camera can be made unnecessary, and an increase in the apparatus cost can be avoided. Further, in this circuit board inspection apparatus 1B, when calculating the error along the X-axis and Y-axis directions for the probe mounted on one inspection head, the probe mounted on the other inspection head is annular. The conductor pattern 41 may be kept in contact with the conductor pattern 41, and there is no need to change the conductor pattern to be brought into contact with the circuit board inspection apparatuses 1 and 1A. For this reason, errors (Δx1, Δy1), (Δx2, Δy2) can be calculated in a shorter time than the circuit board inspection apparatuses 1 and 1A described above, and are defined on the substrate 13 for each of the inspection heads 4 and 5. It is possible to shorten the time until the correction processing of the position data indicating the coordinates of the inspection point CP is completed.

  In each of the above circuit board inspection apparatuses 1, 1A, 1B, a pair of conductor patterns (conductor patterns 21, conductors 21, 1B) used when calculating an error along one axial direction (X-axis direction or Y-axis direction). 22), and a pair of conductor parts (conductor parts 31a, 31b, etc.) in one conductor pattern are rectangular symmetrical with respect to a line, but a virtual straight line passing through the reference point A (or reference points A1, A2) Any graphic that is line-symmetric with respect to (virtual straight line L1 or L2) may be used, and a graphic other than a rectangle may be used. In the circuit board inspection apparatuses 1, 1A, 1B, the inspection heads 4, 5 are two-dimensionally moved in the XY orthogonal coordinate plane, so that errors in the X-axis and Y-axis directions are detected. However, the present invention can also be applied to a circuit board inspection apparatus in which the inspection head moves one-dimensionally. In this case, the circuit board inspection apparatus only has to calculate an error along one axis in the moving direction, and thus each error in the X-axis and Y-axis directions is equivalent to one of the calculation processes. Processing is performed to calculate the error along this one axis.

It is a block diagram of the circuit board inspection apparatus 1, 1A, 1B. FIG. 3 is a plan view showing an arrangement state of the calibration substrate 3 and the substrate 13 on the surface 2a of the table 2. 4 is a plan view of the calibration board 3 showing the positional relationship between the probe tips 6a and 7a of the probes 6 and 7 and the conductor patterns 21 to 24 for explaining the error calculation processing by the circuit board inspection apparatus 1. FIG. It is a front view of the calibration board | substrate 3 which shows the positional relationship of each probe tip 6a, 7a of the probes 6, 7 and each conductor pattern 21-24. 7 is a plan view of a calibration board 3A showing a positional relationship between a conductor pattern 31 and probe tips 6a and 7a of probes 6 and 7 for explaining a calculation process of an error Δx1 in the X-axis direction by the circuit board inspection apparatus 1A. FIG. FIG. 6 is a plan view of a calibration board 3A showing a positional relationship between a conductor pattern 32 and probe tips 6a, 7a of probes 6, 7 for explaining a calculation process of an error Δy1 in the Y-axis direction by the circuit board inspection apparatus 1A. 3 is a front view of a calibration board 3A showing the positional relationship between the probe tips 6a and 7a of the probes 6 and 7 and the conductor patterns 31 and 32. FIG. 4 is a plan view of a calibration substrate 3B showing the positional relationship between the probe tips 6a, 7a of the probes 6, 7 and the annular conductor pattern 41. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1,1A, 1B Circuit board inspection apparatus 2 Table 2a Surface 3,3A, 3B Calibration board 4,5 Inspection head 6,7 Probe 6a, 7a Needle tip 8 Moving mechanism 9 Measuring part 12 Processing part 13 Substrate 21-24, 31 , 32 Conductor pattern 41 Circular conductor pattern A, A1, A2 Reference point

Claims (5)

A first inspection head to which a first probe is attached;
A second inspection head on which a second probe is mounted;
Each inspection head is individually moved within an XY orthogonal coordinate plane parallel to the table on which the inspection target substrate is arranged, and each inspection is performed along the Z-axis direction orthogonal to the XY orthogonal coordinate plane. A moving mechanism for individually moving the head;
By controlling the moving mechanism and moving the inspection heads, the probe tips of the probes are brought into contact with inspection points on the inspection target substrate disposed on the table to inspect the inspection target substrate. A circuit board inspection apparatus including a processing unit to be executed,
A measurement unit for measuring the capacitance between the probes;
The first conductor pattern and the second conductor pattern, which are arranged on the table and have a line symmetry, are separated along one of the X-axis direction and the Y-axis direction in the XY orthogonal coordinate plane. Calibration board formed
The processing unit controls the moving mechanism to cause the first probe head of the second probe of the second inspection head to alternately contact the first conductor pattern and the second conductor pattern, while the first inspection head The needle tip of the first probe is moved along the one axial direction within the region between the first and second conductor patterns, and the capacitance between the probes with respect to the measurement unit is increased. By measuring, the capacitance measured when the needle tip of the second probe is brought into contact with the first conductor pattern and the needle tip of the second probe are brought into contact with the second conductor pattern. The position of the first inspection head at which the measured capacitance becomes equal, and the one axial direction between the specified position and a first reference point defined in advance on the calibration substrate Along And the error calculation process for calculating the error was,
A circuit board inspection apparatus that performs correction processing for correcting the position of each inspection head when the probe tip of each probe is brought into contact with each inspection point with the calculated error. On the calibration substrate, a third conductor pattern and a fourth conductor pattern having a line symmetry are formed apart along the other axial direction of the X-axis direction and the Y-axis direction,
In the error calculation process, the processing unit controls the moving mechanism to alternately contact the tip of the second probe of the second inspection head with the third conductor pattern and the fourth conductor pattern. The probe tip of the first probe of the first inspection head is moved along the other axial direction within a region between the third and fourth conductor patterns, and each probe is moved with respect to the measurement unit. The capacitance measured when the needle tip of the second probe is brought into contact with the third conductor pattern and the needle tip of the second probe are measured by measuring the capacitance between the second probe and the second probe. The position of the first inspection head at which the capacitance measured when contacting with the four conductor patterns is equal is specified, and the specified reference and the second reference defined in advance on the calibration substrate In the correction process, the position of each inspection head when the probe tip of each probe is brought into contact with each inspection point is further corrected in the correction process. The circuit board inspection apparatus according to claim 1. A first inspection head to which a first probe is attached;
A second inspection head on which a second probe is mounted;
Each inspection head is individually moved within an XY orthogonal coordinate plane parallel to the table on which the inspection target substrate is arranged, and each inspection is performed along the Z-axis direction orthogonal to the XY orthogonal coordinate plane. A moving mechanism for individually moving the head;
By controlling the moving mechanism and moving the inspection heads, the probe tips of the probes are brought into contact with inspection points on the inspection target substrate disposed on the table to inspect the inspection target substrate. A circuit board inspection apparatus including a processing unit to be executed,
A measurement unit for measuring the capacitance between the probes;
The first conductor part and the second conductor part, which are arranged on the table and have a line symmetry, are separated along one of the X-axis direction and the Y-axis direction in the XY orthogonal coordinate plane. A calibration board on which the first conductor pattern arranged is formed,
The processing unit controls the moving mechanism to control the movement of the first probe of the first inspection head in a state where the needle tip of the second probe of the second inspection head is in contact with the first conductor pattern. Causing the measuring unit to measure the capacitance between the probes while moving the needle tip along the one axial direction within a region between the first conductor portion and the second conductor portion. Thus, the position of the first inspection head that minimizes the capacitance is specified, and along the one axial direction between the specified position and the first reference point defined in advance on the calibration substrate. An error calculation process for calculating an error;
A circuit board inspection apparatus that executes correction processing for correcting the position of each inspection head when the probe tip of each probe is brought into contact with each inspection point with the calculated error. The calibration board has a second conductor pattern in which a third conductor portion and a fourth conductor portion having a line symmetry are arranged apart from each other in the other of the X-axis direction and the Y-axis direction. Formed,
In the error calculation process, the processing unit controls the moving mechanism to control the first inspection head in a state where the tip of the second probe of the second inspection head is in contact with the second conductor pattern. While moving the needle tip of the first probe along the other axial direction within the region between the third conductor portion and the fourth conductor portion, By measuring the capacitance, the position of the first inspection head that minimizes the capacitance is specified, and the other of the specified position and the second reference point defined in advance on the calibration board An error along the axial direction is calculated, and in the correction process, the position of each inspection head when the probe tip of each probe is brought into contact with each inspection point with the calculated error is further corrected. Record Circuit board inspection apparatus. A first inspection head to which a first probe is attached;
A second inspection head on which a second probe is mounted;
Each inspection head is individually moved within an XY orthogonal coordinate plane parallel to the table on which the inspection target substrate is arranged, and each inspection is performed along the Z-axis direction orthogonal to the XY orthogonal coordinate plane. A moving mechanism for individually moving the head;
By controlling the moving mechanism and moving the inspection heads, the probe tips of the probes are brought into contact with inspection points on the inspection target substrate disposed on the table to inspect the inspection target substrate. A circuit board inspection apparatus including a processing unit to be executed,
A measurement unit for measuring the capacitance between the probes;
A calibration board disposed on the table and having an annular conductor pattern formed thereon,
The processing unit controls the moving mechanism to control the movement of the first probe of the first inspection head in a state where the needle tip of the second probe of the second inspection head is in contact with the annular conductor pattern. The first inspection head that minimizes the capacitance by causing the measurement unit to measure the capacitance between the probes while moving the needle tip in the inner region of the annular conductor pattern. Error calculation processing for specifying the position of the X axis and the Y axis in the XY orthogonal coordinate plane between the specified position and a reference point defined in advance on the calibration board When,
A circuit board inspection apparatus that performs correction processing for correcting the position of each inspection head when the probe tip of each probe is brought into contact with each inspection point with the calculated error.

Images