JPH11351840A - Noncontact type three-dimensional measuring method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable a high-accuracy three-dimensional measurement even for inclined measuring points of a work or fine irregularities. SOLUTION: Two types of measuring means, i.e., a CCD camera 34 used in a picture measuring unit and laser probe 35 for noncontactly measuring the displacement, utilizing a laser beam, are provided to constitute a photographing unit 17 which is driven in directions X, Y, Z, based on each measured value to measure the displacement of a work 12 along a set measuring path, using the laser probe 34. For the obtd. dot array data, the trend correction is executed to convert three-dimensional data to two-dimensional data which are then processed into fixed-pitch data and filtered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a non-contact image measurement function for measuring a contour shape or the like of an object to be measured from an image obtained by imaging a work by an imaging means such as a CCD camera. Non-contact three-dimensional measurement method effective when measuring precision parts such as IC packages using a non-contact three-dimensional measurement device equipped with a non-contact displacement detection function that detects the distance of the object as a displacement amount in a non-contact manner About.

[0002]

2. Description of the Related Art Conventionally, an image measuring device has been used for measuring a contour shape of a precision part. The image measuring device captures an image of a workpiece to be measured at an arbitrary magnification using a CCD camera, detects an edge from the obtained two-dimensional image, and obtains coordinate values of a necessary portion using various measurement tools. Things. When three-dimensional measurement including the height direction of the work is performed by the image measurement device, focus determination is performed based on the contrast of the image on the measurement surface, and the focus position is set as a position in the height direction.

[0003]

In the case of a mounted component having a fine structure such as an LSI package, the manufacturing quality of the package is a major factor that determines the yield. For this reason, a device that can measure each part of the package with high accuracy is desired.
In the conventional image measuring device, the position in the height direction (Z-axis direction) is measured by auto focus. Therefore, there is a restriction that the position to be measured must be parallel to the XY plane. What is measured by focus is only the average value of the set area.
Therefore, it was not possible to measure the contour shape or the surface roughness such as to measure fine irregularities in the Z-axis direction.

The present invention has been made in view of the above points, and provides a non-contact three-dimensional measuring method in which a measuring part of a workpiece is inclined or has fine irregularities, and can perform three-dimensional measurement with high accuracy. The purpose is to do.

[0005]

According to the present invention, there is provided a non-contact three-dimensional measuring method, comprising: an image pickup means for picking up an image of a work and outputting two-dimensional image information for image measurement; A non-contact three-dimensional measurement method for obtaining three-dimensional point sequence data by moving an imaging unit having a non-contact displacement meter capable of detecting a distance as a displacement amount in a measurement three-dimensional space, Confirming the position of the work by image-measuring the work using the method, and moving the non-contact displacement meter to a predetermined measurement start point based on the position, and then performing scanning measurement along a specified measurement trajectory. Obtaining three-dimensional point sequence data by executing;
Performing a trend correction on the point sequence data obtained in this step, converting the three-dimensional data trend corrected in this step into two-dimensional data, and converting the two-dimensional data obtained in this step into two-dimensional data. The method is characterized by comprising a step of performing a constant pitch process and a step of performing a filter process on the two-dimensional data that has been converted to a constant pitch in this step.

According to the present invention, the non-contact displacement meter follows and measures the displacement of the work along the specified measurement trajectory using the two-dimensional image information obtained by the imaging means, so that the work is inclined. However, it has little effect on measurement accuracy,
Accurate three-dimensional point sequence data can be obtained. By performing trend correction on this 3D point sequence data,
Subsequent processing is simplified. According to the invention,
Since the obtained data is three-dimensional point sequence data, it may be difficult to perform filtering, etc., but in order to enable filtering, etc., the trend-corrected three-dimensional data is converted to two-dimensional data. Then, a constant pitch processing is performed.
Therefore, according to the present invention, fine irregularities and contour shapes in the Z-axis direction can be analyzed using filtered two-dimensional data.
It becomes easy to execute a predetermined analysis process such as a surface roughness analysis.

For example, when only the filter processing is performed on the obtained point sequence data, the step of returning the filtered two-dimensional data to the original pitch, and the step of returning to the original pitch in this step. By further providing a step of returning the two-dimensional data to three-dimensional data and a step of performing an inverse trend correction on the three-dimensional data obtained in this step, only the filter processing was performed on the original data. Point sequence data can be obtained.

The method may further include a step of performing an arbitrary analysis process on the two-dimensional data on which the filter process has been performed. For example, when measuring the flatness of a land grid array or a ball grid array of a workpiece formed of an IC package, a step of extracting data of a plurality of vertexes or valleys of the filtered two-dimensional data, Converting the data extracted in the step from two-dimensional data to three-dimensional data, and calculating the flatness of the land grid array or ball grid array from the three-dimensional data obtained in this step. do it.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing an entire configuration of a non-contact three-dimensional measuring apparatus according to one embodiment of the present invention. This apparatus includes a coordinate measuring machine 1 having a non-contact image measuring function and a non-contact displacement measuring function, and a computer system 2 which drives and controls the coordinate measuring machine 1 and executes necessary data processing. It is configured.

The coordinate measuring machine 1 is configured as follows. That is, a measurement table 13 on which the work 12 to be measured is placed is mounted on the gantry 11, and the measurement table 13 is driven in the Y-axis direction by a Y-axis driving mechanism (not shown). Support arms 14 and 15 extending upward are fixed to the center of both sides of the gantry 11.
An X-axis guide 16 is fixed so as to connect both upper ends of the support arms 14 and 15. This X-axis guide 16
Supports an imaging unit 17. The imaging unit 17 is driven along the X-axis guide 16 by an X-axis driving mechanism (not shown). Computer system 2
A computer 21 for measuring information processing and various controls;
A keyboard 22, a joystick box 23, and a mouse 24 for inputting various instruction information; a CRT display 25 for displaying a measurement screen, an instruction screen, and a measurement result;
And a printer 26 for printing out the measurement results.

The inside of the image pickup unit 17 is configured as shown in FIG. That is, the slider 31 is provided so as to be movable along the X-axis guide 16, and the Z-axis guide 32 is fixed to the slider 31 integrally. This Z-axis guide 3
2, a support plate 33 is provided slidably in the Z-axis direction,
The support plate 33 is provided with a CCD as an image pickup device for image measurement.
A camera 34 and a laser probe 35 which is a non-contact displacement meter
And are attached. Accordingly, the CCD camera 34 and the laser probe 35 maintain a fixed positional relationship between X and X.
It can be moved simultaneously in three directions of Y and Z axes. An illumination device 36 for illuminating the imaging range is added to the CCD camera 34. In the vicinity of the laser probe 35, a CCD camera 38 for imaging the periphery of the measurement position to confirm the measurement position of the laser probe 35 by the laser beam, and an illumination device 39 for illuminating the measurement position of the laser probe 35 Are provided. A vertical movement mechanism 40 for retracting the laser probe 35 when the imaging unit 17 moves;
It is supported by a rotation mechanism 41 for adjusting the directionality of the laser beam to an optimal direction.

FIG. 3 is a diagram showing details of the laser probe 35. The light emitted from the semiconductor laser 51 passes through a beam splitter 52 and a quarter-wave plate 53,
The light is collimated by the collimator lens 54 and forms a light spot on the measurement section of the work 12 via the mirrors 55 and 56 and the objective lens 57. The light reflected from the measurement section of the work 12 is reflected by the beam splitter 52 along the reverse path of the mirrors 56 and 55, the collimator lens 54 and the quarter-wave plate 53, and is vertically split by the edge mirror 58. . The light divided vertically is divided into two vertically arranged lights.
The light is detected by the divided light receiving elements 59 and 60. Detection circuit 61
Is based on the output signals from the two-divided light receiving elements 59 and 60, and from the focal position of the objective lens 57 to the measurement surface 62
And outputs a signal corresponding to the amount of deviation up to. Servo circuit 63
Outputs a drive signal for driving the objective lens 57 to the drive mechanism 64 based on the detection output of the detection circuit 61. When the objective lens 57 moves up and down, the movable member 67 of the displacement detector 66 moves with respect to the fixed member 68. This movement amount is output as a displacement amount.

FIG. 4 is a block diagram of the entire apparatus showing the configuration of the coordinate measuring machine 1 and the computer system 2 in more detail. In the coordinate measuring machine 1, image signals obtained by imaging the work 12 with the CCD camera 34 for image measurement and the CCD camera 35 for confirming the measurement position of the laser probe 35 are converted into A / D converters 71 and 7, respectively.
After being converted into multi-valued image data in 2, one of them is selected by the selection circuit 73 and supplied to the computer 21. Illumination light necessary for imaging by the CCD cameras 34 and 38 is supplied to the illumination controller 7 based on the control of the computer 21.
4,75 are provided by controlling the lighting devices 36,39, respectively. The signal of the displacement amount obtained from the laser probe 35 is supplied to the computer 21 via the A / D converter 76. Then, the imaging unit 17 including these operates under the control of the computer 21.
It is driven in the XYZ-axis directions by the YZ-axis driving unit 77.
The position of the imaging unit 17 in the XYZ-axis direction is detected by the XYZ-axis encoder 78 and supplied to the computer 21.

On the other hand, the computer 21 comprises a CPU 81 which is the center of control, a multi-valued image memory 82, a program storage unit 83, and a work memory 8 connected to the CPU 81.
4 and interfaces 85 and 86, and multi-valued image memory 8
The multi-valued image data stored in the CRT display 1
And a display control section 87 for displaying the image on the display 5. The CPU 81 switches the selection circuit 73 between the image measurement mode and the laser measurement mode. The multivalued image data for image measurement or the multivalued image data for laser measurement selected by the selection circuit 73 is stored in the multivalued image memory 82.
The multivalued image data stored in the multivalued image memory 82 is displayed on the CRT display 25 by the display control operation of the display control unit 87. On the other hand, operator's instruction information input from the keyboard 22, the joystick 23 and the mouse 24 is transmitted to the CPU 81 via the interface 85.
Is input to Further, the CPU 81 captures the displacement amount detected by the laser probe 35, XYZ coordinate information from the XYZ axis encoder 78, and the like. The CPU 81 stores the input information, the operator's instructions, and the program storage unit 8.
Based on the program stored in 3, various processes such as stage movement by the XYZ axis driving unit 77 and calculation processing of measured values are executed. The work memory 84 provides a work area for various processes of the CPU 81. The measured value is output to the printer 26 via the interface 86.

Next, measurement processing and data processing of the non-contact three-dimensional measuring apparatus according to the present embodiment configured as described above will be described. This device has an image measurement mode and a laser measurement mode. In the image measurement mode, the same operation as that of the conventional image measurement device is performed, and therefore, the laser measurement mode will be described here.

FIG. 5 is a flowchart showing the procedure of scanning measurement in the laser measurement mode. First, the image for image measurement and the laser probe 35 are calibrated (S1). That is, a jig 9 including two non-parallel linear components L1 and L2 that can be measured by a CCD camera 34 and a laser probe 35 as shown in FIG.
1 is placed. The jig 91 may be, for example, such that a trapezoidal pattern 93 having a predetermined width h is arranged on a substrate 92. CCD camera 34 and laser probe 35
The straight lines L1 and L2 are measured in the projection plane in the axial direction, the equations of these straight lines are obtained, and the obtained equations are processed to calculate the offset value between the coordinate axes of the CCD camera 34 and the laser probe 35. This offset value is used as position calibration data for the CCD camera 34 and the laser probe 35.

After the calibration process is completed, the work 12
Is image-measured to confirm the position of the work 12, and the measurement point by the laser probe 35 is moved to the measurement start point (S
2). At the time of image measurement, the laser probe 35 may interfere with the work 12. Therefore, during image measurement, the laser probe 35 is retracted upward by the vertical movement mechanism 40. The control is performed by, for example, an air cylinder. Next, when the laser measurement mode is selected (S3), the selection circuit 73
Is switched, and the screen of the CRT display 25 is CCD
The screen changes from the camera 34 to the CCD camera 38 for laser measurement. On this screen, the position (measurement position) of the laser beam spot from the laser probe 36 is confirmed (S
4). Here, the position of the beam spot can be finely adjusted using the joystick 23, the mouse 24, or the like. Since the CCD camera 38 is for confirming whether or not the laser beam spot is correctly hitting the target position on the work 12, the image data is not used for the measurement. For this reason, it is not necessary to have a high-definition camera like the CCD camera 34 for image measurement. In addition, only the position of the laser spot looks bright only with the laser light, and the surrounding area becomes dark and a clear image cannot be obtained. Of course,
The CCD camera 38 and the lighting device 39 are connected to the CCD camera 34
The lighting device 36 can also be used.

Next, in order to provide a path for scanning measurement, a measurement tool is selected and necessary parameters are set (S
5). As the measurement tool, for example, the one shown in FIG. 7 can be considered. (A) Point tool The X, Y, and Z coordinate values of the current measurement point (black circle) are measured. (B) Straight line tool Given the end point position Pe, follow and measure on a straight line from the current measurement point to the end point Pe. (C) Area tool Given the width W, height H, and pitches PT1 and PT2 of the area search, perform scanning measurement while reciprocating within the specified area at the specified pitch from the current measurement point. (D) Circle tool The radius R, the pitch PT, and the start angle θ are given, and the concentric circle is measured from the current measurement point. (E) Rectangular tool Given a width W and a height H, perform scanning measurement along a rectangle. (F) Cross tool Given the lengths L1 and L2 of two line segments orthogonal to each other,
Follow the cross and measure. (G) Spiral tool Maximum radius R and pitch RT (radius value increased in one rotation)
To measure the helical shape. (H) Focus tool Simply focuses at the current position.

When a measurement tool is selected and necessary parameters are set, scanning measurement is executed (S6). The displacement detection accuracy of the laser probe 35 has some directionality. Therefore, when measuring the contour and surface roughness along the track, the laser probe 3
The laser probe 35 is rotated by the rotation mechanism 41 so that 5 is oriented in the optimal direction. In the case of measuring along a circular orbit or a spiral orbit, it is more effective to measure while rotating the laser probe 35.

At the time of scanning measurement, the laser probe 35
In order to obtain a coordinate value in the Z-axis direction within a measurement range of, for example, ± 0.5 mm, for example, as shown in FIG.
By driving the axis driving unit 77, the position of the imaging unit 17 in the Z-axis direction is moved up and down. Thus, control is performed such that the focus position of the laser probe 35 is always at the center of the measurement range.
In this case, the Z-axis coordinate value obtained by the XYZ-axis encoder 78 is the displacement amount in the Z-axis direction. In order to perform a high-speed measurement in which the position control in the Z-axis direction cannot be performed in time, it is only necessary to correct the Z-axis coordinate value with the displacement amount of the laser probe 35 and calculate a correct displacement amount. When measuring the minute surface roughness in the measurement range of the laser probe 35, as shown in FIG. 9, the position of the laser probe 35 in the Z-axis direction is fixed,
This can be dealt with only by controlling the driving of the objective lens 57 in the laser probe 35. In this case, further high-speed processing is possible, and the resolution (for example, 0.1
μm) can be measured with a higher resolution (eg, 0.01 μm). By such scanning measurement, the coordinate values in the Z-axis direction are X and Y at predetermined intervals along the designated measurement trajectory.
The data is obtained as point sequence data together with the axis coordinate values, and is stored in the work memory 84. When the point sequence data is obtained, an analysis process of the point sequence data is executed (S7).

Next, the analysis of the point sequence data will be described. Conventional contour shape measuring instruments and surface roughness measuring instruments are two-dimensional data, whereas contour shape measuring data obtained by this non-contact three-dimensional measuring device is three-dimensional data.
Moreover, since the scanning measurement is performed along the designated two-dimensional trajectory,
Data processing becomes more complex. Therefore, in order to simplify the data processing, the following point string data analysis processing is executed. The analysis process of this point sequence data will be described based on the flowchart of FIG. 10 and the waveform diagram of FIG.

First, since the work 12 itself may be inclined, an average plane (average line in the case of a straight line) is obtained from the point sequence data, and data trend correction is performed on this plane (S11). . Thus, the trend-corrected point sequence data shown in FIG. 11B is obtained from the inclined point sequence data as shown in FIG. Next, the traveling direction along the measurement trajectory is the first axis direction, and the normal direction of the average surface is the second axis direction.
As the axial direction, the three-dimensional point sequence data is converted into two-dimensional point sequence data (S12). As a result, data as shown in FIG. 11C is obtained. Since this point sequence data is obtained by scanning with acceleration / deceleration along the measurement trajectory,
Not a constant pitch. If the pitch is not constant, Gaussian filter processing generally used in an FFT (Fast Fourier Transform) or a shape measuring instrument cannot be executed. Therefore, constant pitch processing is executed here (S1).
3: FIG. 11 (d)). Next, Gaussian filter processing is executed (S14: FIG. 11E). Then, the fixed-pitch data is returned to the original position (position of an unfixed pitch) (S15: FIG. 11 (f)). Next, two-dimensional to three-dimensional conversion for returning the two-dimensional data converted in step S12 to the original measurement trajectory position (XY position) is executed (S12).
16: FIG. 11 (g). Lastly, the inclination correction performed by the data trend correction in step S11 is restored, and the data is converted in the direction in which the work 12 is originally inclined (S17: FIG. 11 (h)).

With the above processing, filtering of the three-dimensional point sequence data can be easily performed. Further, since the data after the processing in step S14 is two-dimensional data filtered at a constant pitch, various analysis processes such as those performed by a normal contour shape measuring device or a surface roughness measuring device can be performed. become.

Next, as examples of the work 12, LGA (Land Grid Array) and BGL (Ball Gr
The procedure for evaluating the coplanarity (flatness) of (id Array) will be described. FIG. 12 shows LS as the work 12
FIG. 2 is a plan view and a vertical cross-sectional view of each of the I packages 101 and 102. An LSI package 1 having the LGA shown in FIG.
In the case of 01, the height of the land 103 is obtained, and in the case of the LSI package 102 having the BGA shown in FIG. . Then, based on the obtained point sequence data, as shown in FIG. 13, the coplanarity of the vertex or the valley bottom is evaluated.

FIG. 14 shows a procedure for evaluating the coplanarity of the LGA. Here, the processing from the trend correction of the data in step S21 to the execution of the Gaussian filter in step S24 is the same as the processing described with reference to FIG. 10, and a description thereof will be omitted. The setting of the filter constants and the like necessary for this processing is performed using, for example, a parameter setting viewer as shown in FIG. Whether or not there is trend correction, the high and low cutoff frequencies of the filter,
Calculation conditions and the like can be set.

FIG. 16 shows two-dimensional point sequence data (b) obtained by executing a filtering process from the two-dimensional point sequence data (a) which is scanned at a constant pitch and scanned by the LGA.
From this point sequence data, the center position of each valley (Land) is extracted by using a valley detection algorithm, and point group data (FIG. 16)
(C)) is obtained (S25). The Yamatani algorithm is shown in Fig. 1.
As shown in FIG. 7, the minimum depth h and the minimum pitch p from the reference position are given in advance, and it is determined whether or not the point sequence data existing in the range from the lowest valley to the minimum depth h continues by the minimum pitch p. The valley is detected by the condition judgment. This method has an advantage that a valley can be detected without having a design value file.

As shown in FIG. 18, the number Nx of the lands in the horizontal direction, the number Ny of the lands in the vertical direction, and the scanning start position St
x, Sty, horizontal pitch Px, vertical pitch Py
May be prepared as design data in advance, the point data of the valley may be extracted using the design data.

When point cloud data as shown in FIG. 16 (c) is obtained by such processing, it is converted from two-dimensional point cloud data to three-dimensional point cloud data (S26), and finally the coplanarity is converted. It is calculated (S27).

Similarly, when evaluating the BGA coplanarity, the processing shown in FIG. 19 may be executed. From the data trend correction (S31) to the Gaussian filter execution processing (S34), step S21 in FIG.
To S24, and after the filtering process,
What is necessary is just to detect the vertex part of each ball using the valley detection algorithm. In this case, a minimum height h and a minimum pitch p are given to detect a mountain that satisfies the condition.
Subsequent processing on the extracted point cloud data (S36,
S37) is the same as steps S26 and S27 in FIG.

However, in this BGA detection, FIG.
As shown in FIG. 0 (a), the vertex (highest part) of the ball 104 may not be located at the center of the circle. In addition, as shown in FIG. 3B, the laser probe 35 has an allowable inclination angle of, for example, ± 13 °, and if the scanning position shifts, the reflected light of the laser beam is not detected and correct measurement cannot be performed. There is. In consideration of such a point, for example, as shown in FIG. 21A, the upper surface of the ball 104 is zigzag-scanned, or as shown in FIG.
Spiral scanning is desirable. Specifically, the XY coordinates of each ball 104 are prepared by, for example, design values or image measurement, and as shown in FIG. 22, the stage is stopped at a point a within the range of the allowable inclination angle (the laser probe 35).
, The distance between the patterns ab is measured by the vertex scanning pattern as shown in FIG. Between bc, it moves at high speed without performing measurement. FIG. 23 is a diagram showing a setting screen for setting each parameter and scanning pattern of such a grid array scanning.

[0031]

As described above, according to the present invention, the non-contact displacement meter measures the displacement of the work along the designated measurement trajectory, so that even if the work is inclined, it can be measured. There is little influence on accuracy, and highly accurate three-dimensional point sequence data can be obtained. By performing trend correction on the three-dimensional point sequence data, subsequent processing is simplified. Further, according to the present invention, since the obtained data is three-dimensional point sequence data, it is conceivable that filtering and the like may be difficult. Since the original data is converted to two-dimensional data and subjected to constant pitch processing, predetermined analysis processing such as fine unevenness in the Z-axis direction, contour shape analysis, and surface roughness analysis is performed using the filtered two-dimensional data. This has the effect of making it easier to perform.

[Brief description of the drawings]

FIG. 1 is a perspective view of a non-contact three-dimensional image measuring apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of the inside of an imaging unit in the apparatus.

FIG. 3 is a diagram showing a configuration of a laser probe in the apparatus.

FIG. 4 is an overall block diagram of the same device.

FIG. 5 is a flowchart showing a procedure of laser measurement by the apparatus.

FIG. 6 is a view for explaining a method of calibrating an image and a laser probe in the apparatus.

FIG. 7 is a diagram showing an example of a measurement tool used in the apparatus.

FIG. 8 is a diagram for explaining an example of scanning measurement of the same apparatus.

FIG. 9 is a diagram for explaining another example of the scanning measurement of the same apparatus.

FIG. 10 is a flowchart of a point sequence data analysis process of the apparatus.

FIG. 11 is a diagram for explaining the analysis processing.

FIG. 12 is a diagram showing an LSI package as an example of a work.

FIG. 13 is a diagram illustrating coplanarity measurement of a BGA of the same package.

FIG. 14 is a flowchart showing a procedure of LGA coplanarity evaluation.

FIG. 15 is a diagram showing a parameter setting screen for performing the evaluation.

FIG. 16 is a diagram showing data obtained at each point in the evaluation processing.

FIG. 17 is a diagram for explaining a valley algorithm used in the evaluation processing.

FIG. 18 is a diagram for explaining the same evaluation process using design data.

FIG. 19 is a flowchart showing a procedure of BGA coplanarity evaluation.

FIG. 20 is a diagram for explaining a problem of BGA coplanarity evaluation.

FIG. 21 is a diagram showing an example of a vertex scanning pattern used in a scanning method for solving the problem.

FIG. 22 is a diagram for explaining details of the scanning method.

FIG. 23 is a diagram showing a parameter setting screen for realizing the same scanning method.

[Explanation of symbols]

1 ... three-dimensional measuring machine, 2 ... computer system, 11 ...
Stand, 12: Workpiece, 13: Measurement table, 14, 15
... Support arm, 16 ... X-axis guide, 17 ... Imaging unit, 21 ... Computer, 22 ... Keyboard, 23 ... Joystick box, 24 ... Mouse, 25 ... CRT
Display, 26 printer, 34, 38 CCD camera, 35 laser probe, 36, 39 lighting device.

Continued on the front page (72) Inventor Naoji Horiuchi 1-20-1 Sakado, Takatsu-ku, Kawasaki-shi, Kanagawa Prefecture Mitutoyo Corporation (72) Inventor Koichi Komatsu 1-1-20-1, Sakado, Takatsu-ku, Kawasaki-shi, Kanagawa Corporation Mitutoyouchi (72) Inventor Hidemitsu Asano 1-20-1 Sakado, Takatsu-ku, Kawasaki-shi, Kanagawa Prefecture Mitutoyo-uchi Inc.

Claims (4)

[Claims] 1. An image pickup means for picking up an image of a work and outputting two-dimensional image information for image measurement, and a non-contact displacement meter capable of detecting a distance from a predetermined measurement point on the work as a displacement amount. A non-contact three-dimensional measurement method for obtaining three-dimensional point sequence data by moving an imaging unit in a measurement three-dimensional space, comprising: a step of measuring an image of a work using the imaging unit to confirm a position of the work; Acquiring the three-dimensional point sequence data by moving the non-contact displacement meter to a predetermined measurement start point based on this position, and then performing scanning measurement along a specified measurement trajectory; Performing a trend correction on the point sequence data obtained in this step; converting the three-dimensional data trend-corrected in this step into two-dimensional data; Non-contact three-dimensional measuring method comprising the steps of applying a constant pitch processing in a two-dimensional data obtained, further comprising the step of applying a filtering process on the two-dimensional data constant pitch in the steps. A step of returning the filtered two-dimensional data to the original pitch; a step of returning the two-dimensional data returned to the original pitch in this step to three-dimensional data; Performing a reverse trend correction on the obtained three-dimensional data. The non-contact three-dimensional measurement method according to claim 1, further comprising: 3. The non-contact three-dimensional measurement method according to claim 1, further comprising a step of performing an arbitrary analysis process on the two-dimensional data subjected to the filter process. 4. An image pickup means for picking up an image of a work made of an IC package and outputting two-dimensional image information for image measurement, and a non-contact displacement meter capable of detecting a distance from a predetermined measurement point on the work as a displacement amount. The three-dimensional point sequence data is obtained by moving the imaging unit provided with the three-dimensional point sequence data in the measurement three-dimensional space, and the flatness of the land grid array or ball grid array of the IC package is measured based on the three-dimensional point sequence data. A non-contact three-dimensional measuring method, wherein the step of measuring the image of the work using the imaging means to confirm the position of the work; and moving the non-contact displacement meter to a predetermined measurement start point based on the position. After that, a step of acquiring three-dimensional point sequence data by performing scanning measurement along a specified measurement trajectory, and the point sequence data obtained in this step Performing a trend correction on the three-dimensional data, converting the three-dimensional data trend-corrected in this step into two-dimensional data, performing a constant pitch process on the two-dimensional data obtained in this step, Performing a filtering process on the two-dimensional data having the constant pitch in this step; extracting a plurality of apexes or valley bottom data of the two-dimensional data subjected to the filtering process in this step; Converting the extracted data from two-dimensional data to three-dimensional data; and calculating the flatness of the land grid array or ball grid array from the three-dimensional data obtained in this step. Non-contact three-dimensional measurement method.