CN209496837U - Crystal round fringes cleaning device - Google Patents
Crystal round fringes cleaning device Download PDFInfo
- Publication number
- CN209496837U CN209496837U CN201920563993.1U CN201920563993U CN209496837U CN 209496837 U CN209496837 U CN 209496837U CN 201920563993 U CN201920563993 U CN 201920563993U CN 209496837 U CN209496837 U CN 209496837U
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- China
- Prior art keywords
- brush
- bristle
- wafer
- brush finish
- cleaning device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000004140 cleaning Methods 0.000 title claims abstract description 68
- 239000013078 crystal Substances 0.000 title claims abstract description 46
- 239000007921 spray Substances 0.000 claims abstract description 43
- 238000005201 scrubbing Methods 0.000 claims abstract description 10
- 238000005507 spraying Methods 0.000 claims abstract description 5
- 238000005192 partition Methods 0.000 claims description 12
- 238000005406 washing Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 10
- 230000002045 lasting effect Effects 0.000 abstract description 2
- 241000196324 Embryophyta Species 0.000 description 8
- 230000007547 defect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000009434 installation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model is related to a kind of crystal round fringes cleaning device, comprising: rotating unit can be rotated around a vertical axes；Brush head is installed to the rotating unit, the rotating unit can be followed to rotate around the vertical axes, comprising: the first brush finish, for scrubbing crystal column surface；Second brush finish, for scrubbing crystal column surface, and second brush finish and the first brush finish are symmetrical arranged about the vertical axes；Spray head is arranged, for spraying cleaning solution with cleanninfg brushes towards the brush head.The crystal round fringes cleaning device of the utility model has rotating unit and two-sided brush head, the brush head is set to rotate, so that always having on one side is to continue to scrub wafer when brush head is cleaned, it ensure that the lasting cleaning to wafer, the time required to reducing cleaning wafer.Further, two brush finish all have top bristle, lower part bristle and middle part bristle, and washing effect is more preferable, are easier to wafer cleaning is clean.
Description
Technical field
The utility model relates to wafer cleaning technical fields, and in particular to a kind of crystal round fringes cleaning device.
Background technique
With the development of integrated circuit technology, wafer specifications gradually develop to large scale, and 12 cun have been increasingly becoming integrated electricity
The mainstream of road manufacture, it is following even to develop to 18 cun and 18 cun or more.The expansion of wafer size causes crystal round fringes accordingly
The expansion of area seems more important to the control of defects of wafer edge.
So-called defects of wafer edge refers to that film (the poor film of especially some adhesions) is accumulated in crystal round fringes
(generally require by film several times deposit) to a certain extent after, peeled off under the action of internal stress or external force,
If dropping to the device region of crystal column surface, just become the defect for influencing product yield, serious defect results even in product report
It is useless.After thin film deposition processes after a period of time, since edge response contact angle is bigger, meeting deposition thickness is thicker
Film, it is then relatively thin at marginal position and the film thickness in other regions compares.Wafer edge control method is by clear
The mode for washing crystal round fringes removes possible peeling source, needs to increase special tilt angle cleaning (Bevel clean)
Technique.
In the prior art, it generallys use tilt angle brush (Bevel brush) and carries out tilt angle cleaning process.It is described to incline
The larger particles that rake angle brush is capable of edge and proximal edge region to wafer are cleared up.However, using single inclination angle
Degree brush be easy to cause edge clean unclean, causes edge ring defect, and generating unnecessary yield to wafer influences.
Utility model content
The purpose of this utility model is to provide a kind of crystal round fringes cleaning devices, can do the edge clean of wafer
Only, the defect of crystal round fringes is reduced, wafer yield is improved.
In order to solve the above technical problems, the following provide a kind of crystal round fringes cleaning devices, comprising: rotating unit, it can
It is rotated around a vertical axes；Brush head, installation to the rotating unit, can follow the rotating unit to rotate around the vertical axes,
It include: the first brush finish, for scrubbing crystal column surface；Second brush finish, for scrubbing crystal column surface, and second brush finish and first
Brush finish is symmetrical arranged about the vertical axes；Spray head is arranged, for spraying cleaning solution with cleanninfg brushes towards the brush head.
Optionally, further include a vertical partition wall, the excessively described vertical axes, be set to first brush finish and the second brush finish it
Between, for separating first brush finish and the second brush finish, when preventing one of brush finish to be cleaned, cleaning solution is sprayed to another
Brush finish.
Optionally, further includes: horizontal slide rail, the rotating unit are installed to the horizontal slide rail, and can be along the level
Sliding rail does the movement of horizontal direction, so that the brush head is detached from the contact between wafer.
Optionally, first brush finish and the second brush finish include bristle top bristle in the vertical direction and lower brushes
Hair, and the top bristle and lower part bristle are oppositely arranged, to scrub the upper and lower surfaces of the wafer simultaneously.
Optionally, first brush finish and the second brush finish further include the middle part bristle of setting in the horizontal direction, for brushing
Wash the side of the wafer.
Optionally, the middle part bristle is installed on the vertical partition wall, and perpendicular to the vertical partition wall.
Optionally, the spray head includes: the sub- spray head in top being arranged towards top bristle, is cleaned with spraying to top bristle
Liquid；The sub- spray head in lower part being arranged towards lower part bristle sprays cleaning solution with bristle to the lower part.
Optionally, the number of the brush head is two.
Optionally, the number of the spray head is two, the opposite sides that the wafer places position is respectively arranged at, towards institute
State brush head setting.
Optionally, the rotating unit includes rotating electric machine, and the output of the rotating electric machine is pivotally connected to the brush head, and
With the vertical overlapping of axles.
The crystal round fringes cleaning device of the utility model has rotating unit and two-sided brush head, and the brush head is enable to revolve
Turn, so that always having on one side is that ensure that the lasting cleaning to wafer continuing to scrub wafer, reduce when brush head is cleaned
The time required to cleaning wafer.Further, two brush finish all have top bristle, lower part bristle and middle part bristle, washing effect
More preferably, it is easier to wafer cleaning is clean.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of crystal round fringes cleaning device in a kind of specific embodiment of the utility model.
Fig. 2 is the structural schematic diagram of the brush head of crystal round fringes cleaning device in a kind of specific embodiment of the utility model.
Fig. 3 is the structural schematic diagram of crystal round fringes cleaning device in a kind of specific embodiment of the utility model.
Specific embodiment
Below in conjunction with the drawings and specific embodiments to the utility model proposes a kind of crystal round fringes cleaning device make into
One step is described in detail.
Fig. 1,2 are please referred to, wherein Fig. 1 is the knot of crystal round fringes cleaning device in a kind of specific embodiment of the utility model
Structure schematic diagram, Fig. 2 are the structural schematic diagram of the brush head of crystal round fringes cleaning device in a kind of specific embodiment of the utility model.
In this specific embodiment, the crystal round fringes cleaning device includes: rotating unit 106, can be vertical around one
Axis rotation；Brush head 101, installation to the rotating unit 106 can follow the rotating unit 106 to rotate around the vertical axes,
Include: the first brush finish 1011, be set to the vertical axes side, for scrubbing 103 surface of wafer；Second brush finish 1012, is used for
103 surface of wafer is scrubbed, and second brush finish 1012 and the first brush finish 1011 are symmetrical arranged about the vertical axes；Spray head
104, it is arranged towards the brush head 101, for spraying cleaning solution with cleanninfg brushes 101.
In a specific embodiment, the number of the brush head 101 is two, so that using two simultaneously
Brush head 101 cleans wafer 103.Indeed, it is possible to which the number of brush head 101 is set as needed, it is with two to four
Preferably, the number of brush head 101 is more, and the efficiency of scrub is higher, but the cost of 103 cleaning device of the wafer also gradually rises.?
When setting three or more brush head 101, each brush head 101 is surrounded by a circle, and rounded off inside is for placing wafer to be scrubbed
103.So that each brush head 101 is surrounded circle is for the shape for the wafer 103 for adapting to be scrubbed.When only there are two brush head 101, two
A brush head 101 is oppositely arranged, to be separately positioned on the opposite sides that the wafer places position 102, so as to scrub crystalline substance simultaneously
The opposite sides of circle 103.In fact, the position that brush head 101 is arranged can also be changed as needed.
In a specific embodiment, the crystal round fringes cleaning device further includes a vertical partition wall 107, excessively described perpendicular
D-axis is set between first brush finish 1011 and the second brush finish 1012, for separating first brush finish 1011 and second
Brush finish 1012, when preventing one of brush finish to be cleaned, cleaning solution spray to another brush finish.
In a specific embodiment, the vertical partition wall 107 is made of corrosion-resistant material, to prevent by spray head
The 104 cleaning corrosions sprayed, cause to damage.Specifically, the vertical partition wall 107 can be by glass reinforced plastic, natural rubber, poly- second fourth
The resistant materials such as alkene rubber are made.
In a specific embodiment, first brush finish 1011 and the second brush finish 1012 include bristle in vertical side
Upward top bristle 201 and lower part bristle 202, and the top bristle 201 and lower part bristle 202 are oppositely arranged, with simultaneously
Scrub the upper and lower surfaces of the wafer 103.In this specific embodiment, the height of the vertical partition wall 107 is less than
Equal to the maximum distance between first brush finish 1011 and the second brush finish 1012.
In a specific embodiment, the brush head 101 includes two blocks of plant hair plates 108, also uses corrosion-resistant material
It is made, is respectively arranged at the top and bottom of the vertical clapboard, divided equally by the vertical clapboard, and two blocks of plant hair plates 108
It is horizontal positioned, for planting top bristle 201 and lower part bristle 202.Specifically, 201 kinds of top bristle are planted and plant hair in upper end
Plate 108 plants for 202 kinds of lower part bristle and plants hair plates 108 in lower end.
In a kind of more preferably specific embodiment, first brush finish 1011 and the second brush finish 1012 further include that setting exists
Middle part bristle 203 in horizontal direction, for scrubbing the side of the wafer 103.Specifically, the middle part bristle 203 is installed
In the vertical partition wall 107, and perpendicular to the vertical partition wall 107, it is horizontally arranged.Setting middle part bristle 203 is to brush
While washing the upper and lower surface of wafer 103, the side of wafer 103 is scrubbed, to get better washing effect.
In a specific embodiment, bristles, nylon yarn or Du Pont's hair can be used to prepare upper and lower, middle part bristle
203.It is upper and lower, the material of middle part bristle 203 is completely the same, 201 He of top bristle in a kind of more preferably specific embodiment
Length, the hardness of lower part bristle 202 are also identical, to guarantee the crystal round fringes cleaning device to the scrub dynamics phase of wafer 103
Together.
In a specific embodiment, the pieces height of the bristle within 0.5cm to 1.0cm to be advisable, and bristle
Gross density it is uniform, with it is per cubic centimeter no less than 150 bristles be advisable.The gross density of bristle is bigger, and brush head 101 is to wafer
103 washing effect is better.In a specific embodiment, in order to scrubbing the marginal position of wafer 103, institute comprehensively
Stating area shared by top bristle 201 and lower part bristle 202 should be sufficiently large, can at least scrub from 103 edge of wafer to
The depth of ten halfs of 103 diameter of wafer.
In this specific embodiment, area and the plant hair plates shared by the top bristle 201 and lower part bristle 202
108 rear two sides are separated by the vertical clapboard area it is related.In order to guarantee the area of top bristle 201 and lower part bristle 202
It is sufficiently large, it is described plant hair plates 108 size should also be as it is sufficiently large so that it is described plant hair plates 108 on planted bristle depth foot
It is enough, the depth of ten halfs of 103 diameter of wafer can be reached.
In a specific embodiment, the top bristle 201 is equal with the staple length of lower part bristle 202, and described double
The distance between tip and the tip of lower part bristle 202 of portion's bristle are less than the thickness of wafer 103, so that wafer 103 is put into
Between portion's bristle 201 and lower part bristle 202.The length of middle part bristle 203 and the length of the sliding rail are adapted, with the brush head
101 along the sliding rail when moving near the position of wafer 103, and the side that middle part bristle 203 can touch wafer 103 is
Preferably, to guarantee that the side of wafer 103 can be arrived by scrub.
In order to guarantee that wafer 103 can protrude between top bristle 201 and lower part bristle 202, top bristle 201 and lower brushes
Hair the distance between 202 should be more than or equal to a quarter of 103 thickness of wafer, less than or equal to 103 thickness of wafer two/
One, it can prevent between upper and lower part bristle 202 that distance is too short in this way, wafer 103 can not be put into top bristle 201 and lower brushes
Between hair 202, and upper and lower part bristle 202 can be prevented bristle can not touch wafer 103, influence wafer 103 apart from too long
Washing effect.
In fact, the first brush finish 1011 and the second brush finish 1012 can also only include top bristle 201, middle part bristle 203
With the combination of any one or two kinds in lower part bristle 202.In a kind of preferred embodiment, first brush finish
1011 is identical with the bristle arrangement mode of the second brush finish 1012.It is rotated in the brush head 101 around the vertical axes, the first brush of switching
Behind face 1011 and the position of the second brush finish 1012, the first brush finish 1011 is right to the washing effect of wafer 103 and the second brush finish 1012
The washing effect of wafer 103 is identical, and user can select the brush finish of scrub wafer 103 according to actual needs, without scruple two
A brush finish has different washing effects to wafer 103.
In first brush finish 1011 and the second brush finish 1012, top bristle 201, middle part bristle 203 and lower part are set simultaneously
When bristle 202, there is optimal 103 washing effect of wafer, top surface edge, the lower surface side of wafer 103 can be scrubbed simultaneously
The side of edge and wafer 103.
In a specific embodiment, the number of rotating unit 106 and the number of brush head 101 match, so that often
One brush head 101 can be rotated around vertical axes, to switch the brush finish of oriented wafer 103, consequently facilitating to another side brush finish into
During row cleaning, continue to scrub wafer 103.
In a specific embodiment, the rotating unit 106 includes rotating electric machine, the output shaft of the rotating electric machine
Be connected to the brush head 101, and with the vertical overlapping of axles.In a specific embodiment, brush head 101 setting it is described to
When between the wafer 103 and spray head 104 of cleaning, when the rotating electric machine drives the brush head 101 rotation, the rotation can be set
The rotation that rotating motor drives the brush head 101 to do 180 ° every time, to switch the first brush finish 1011 and the second brush finish of brush head 101
1012 position sprays one of first brush finish 1011 or the second brush finish 1012 towards spray head 104, by spray head 104 clear
Washing lotion rinse when, another brush finish can oriented wafer 103, continue to scrub wafer 103.It should be noted that this
Setting in the specific embodiment of rotation angle, needs to guarantee the initial direction of two brush finish of the brush head 101 every time, i.e., one
A brush finish is towards wafer 103, another brush finish is towards spray head 104.
In a specific embodiment, the spray head 104 includes: the sub- spray head in top being arranged towards top bristle 201
1041, to spray cleaning solution to top bristle 201；The sub- spray head 1042 in lower part being arranged towards lower part bristle 202, to brush to the lower part
Hair 202 sprays cleaning solution.
In a specific embodiment, the number of the spray head 104 is two, is set to the outside of the brush head 101,
And be arranged towards the brush head 101, ecto-entad sprays cleaning solution to the brush head 101.In this specific embodiment, described
Spray head 104 can only clean one of brush finish of brush head 101, and in the one of brush finish for needing cleanninfg brushes 101
When, the rotating unit 106 drives the brush head 101 to rotate around the vertical axes, makes to be cleaned one facing towards outside, with institute
It is opposite to state spray head 104, cleaning solution is sprayed by the spray head 104, which is cleaned.
In another embodiment specific implementation mode, four spray heads 104 can also be set, be set to the brush head in addition to two
Except the spray head 104 in 101 outsides, there are two the spray heads 104 that 101 inside of brush head is arranged in, to realize to the first brush finish
1011 and the second brush finish 1012 whiles wash away and (refer to Fig. 3, be crystal round fringes in a kind of specific embodiment of the utility model
The structural schematic diagram of cleaning device).In fact, the number of spray head 104 can be set as needed and position that each spray head 104 is arranged
It sets.
In a specific embodiment, when the crystal round fringes cleaning device includes more than two brush heads 101, even
The rotating electric machine for being connected to each brush head 101 is individually controlled, in order to which user is according to each brush finish of different brush heads 101
Concrete condition determines whether to rotary-cleaning.
In a specific embodiment, the crystal round fringes cleaning device further includes control unit, is connected to described turn
Moving cell 106 drives the brush head 101 to rotate to control the rotating unit 106.In a specific embodiment, institute
It states control unit and controls the rotating electric machine every time around 180 ° of vertical axes rotation, to complete the switching of the direction of brush finish, make
Brush finish switches towards wafer 103 to be cleaned and towards between spray head 104.
In a specific embodiment, described control unit is additionally coupled to the spray head 104, controls the spray head 104
Cleaning solution is sprayed towards the brush head 101.In a specific embodiment, the rotating electric machine is completed to rotate, and makes to be cleaned
Brush finish towards after the spray head 104, described control unit just sprays cleaning solution towards the brush finish.
In a specific embodiment, the crystal round fringes cleaning device further include: horizontal slide rail 105, the rotation
Unit 106 is installed to the horizontal slide rail 105, and the movement of horizontal direction can be done along the horizontal slide rail 105, so that the brush
It is contactless between first 101 and wafer 103, consequently facilitating the operation after being scrubbed to wafer 103.
In a specific embodiment, the crystal round fringes cleaning device is being installed to by wafer 103 to be cleaned
When, one end of the horizontal slide rail 105 will extend to 103 lower section of the wafer, so as to rotating unit 106 can move to it is to be cleaned
Wafer 103 by, installing to the brush head 101 of the rotating unit 106 can also move to by wafer 103 to be cleaned, thus
Complete the cleaning to wafer 103.
In this specific embodiment, the other end of the horizontal slide rail 105 will be far from the wafer 103, to rotate
Unit 106 can move to the position far from wafer 103, so that the brush head 101 of installation to the rotating unit 106 can also be transported
It moves to the position far from wafer 103, so that it is contactless between brush head 101 and wafer 103, wafer 103 is carried out with facilitating
Subsequent operation.
In a specific embodiment, the crystal round fringes cleaning device further includes a motor, is set to the rotation
106 bottom of unit, for driving the rotating unit 106 to move along the horizontal slide rail 105, so that the brush head 101
It is contacted with the wafer 103 scrubbed or contactless.In this specific embodiment, it is single to be additionally coupled to the control for the motor
Member, the working condition of the motor is controlled by the motor, to control the rotating unit 106 in the horizontal slide rail
The position on 105 surfaces.
When the crystal round fringes cleaning device includes multiple brush heads 101, the crystal round fringes cleaning device also include with
The consistent rotating unit 106 of 101 number of brush head, and all Matching installations of each rotating unit 106 are to a horizontal slide rail 105, therefore
The number of the horizontal slide rail 105 is consistent with the rotating unit 106, the number of brush head 101.105 institute of horizontal slide rail
The position of setting should also be as corresponding with the position of the brush head 101, is mounted to the rotating unit 106 described horizontal sliding
After rail 105, the preset cleaning of wafer 103 point can be moved to the sliding rail of the rotating unit 106 by, which installing, is advisable.It is described
The cleaning point of wafer 103 is the position that preset brush head 101 is stopped during scrub, positioned at the brush head 101 of the point
Optimal washing effect can be got.For the horizontal slide rail 105 after installing, the extended line of the horizontal slide rail 105 should
The wafer 103 for the brush head 101 installed on the horizontal slide rail 105 cleans point.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (10)
1. a kind of crystal round fringes cleaning device characterized by comprising
Rotating unit can be rotated around a vertical axes；
Brush head is installed to the rotating unit, the rotating unit can be followed to rotate around the vertical axes, comprising:
First brush finish, for scrubbing crystal column surface；
Second brush finish, for scrubbing crystal column surface, and second brush finish and the first brush finish are symmetrical arranged about the vertical axes；
Spray head is arranged, for spraying cleaning solution with cleanninfg brushes towards the brush head.
2. crystal round fringes cleaning device according to claim 1, which is characterized in that it further include a vertical partition wall, it is excessively described
Vertical axes are set between first brush finish and the second brush finish, for separating first brush finish and the second brush finish, to prevent
When one of brush finish is cleaned, cleaning solution spray to another brush finish.
3. crystal round fringes cleaning device according to claim 1, which is characterized in that further include:
Horizontal slide rail, the rotating unit are installed to the horizontal slide rail, and the fortune of horizontal direction can be done along the horizontal slide rail
It is dynamic, so that the brush head is detached from the contact between wafer.
4. crystal round fringes cleaning device according to claim 2, which is characterized in that first brush finish and the second brush finish are equal
Top bristle and lower part bristle including bristle in the vertical direction, and the top bristle and lower part bristle are oppositely arranged, with
The upper and lower surfaces of the wafer are scrubbed simultaneously.
5. crystal round fringes cleaning device according to claim 4, which is characterized in that first brush finish and the second brush finish are also
Including middle part bristle in the horizontal direction is arranged, for scrubbing the side of the wafer.
6. crystal round fringes cleaning device according to claim 5, which is characterized in that the middle part bristle is installed on described perpendicular
Straight partition wall, and perpendicular to the vertical partition wall.
7. crystal round fringes cleaning device according to claim 1, which is characterized in that the spray head includes:
The sub- spray head in top being arranged towards top bristle, to spray cleaning solution to top bristle；
The sub- spray head in lower part being arranged towards lower part bristle sprays cleaning solution with bristle to the lower part.
8. crystal round fringes cleaning device according to claim 1, which is characterized in that the number of the brush head is two.
9. crystal round fringes cleaning device according to claim 8, which is characterized in that the number of the spray head is two, point
It is not set to the opposite sides that the wafer places position, is arranged towards the brush head.
10. crystal round fringes cleaning device according to claim 1, which is characterized in that the rotating unit includes electric rotating
Machine, the output of the rotating electric machine are pivotally connected to the brush head, and with the vertical overlapping of axles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920563993.1U CN209496837U (en) | 2019-04-23 | 2019-04-23 | Crystal round fringes cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920563993.1U CN209496837U (en) | 2019-04-23 | 2019-04-23 | Crystal round fringes cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209496837U true CN209496837U (en) | 2019-10-15 |
Family
ID=68158035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920563993.1U Expired - Fee Related CN209496837U (en) | 2019-04-23 | 2019-04-23 | Crystal round fringes cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209496837U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112024500A (en) * | 2020-08-24 | 2020-12-04 | 北京北方华创微电子装备有限公司 | Cleaning device |
| CN114101156A (en) * | 2020-08-25 | 2022-03-01 | 中国科学院微电子研究所 | Wafer fork cleaning method and device |
| CN115256234A (en) * | 2022-09-28 | 2022-11-01 | 华海清科股份有限公司 | Wafer thinning equipment with dresser belt cleaning device |
| CN115672801A (en) * | 2022-06-10 | 2023-02-03 | 智程半导体设备科技(昆山)有限公司 | Single wafer brushing device capable of automatically replacing brush head |
-
2019
- 2019-04-23 CN CN201920563993.1U patent/CN209496837U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112024500A (en) * | 2020-08-24 | 2020-12-04 | 北京北方华创微电子装备有限公司 | Cleaning device |
| CN114101156A (en) * | 2020-08-25 | 2022-03-01 | 中国科学院微电子研究所 | Wafer fork cleaning method and device |
| CN115672801A (en) * | 2022-06-10 | 2023-02-03 | 智程半导体设备科技(昆山)有限公司 | Single wafer brushing device capable of automatically replacing brush head |
| CN115256234A (en) * | 2022-09-28 | 2022-11-01 | 华海清科股份有限公司 | Wafer thinning equipment with dresser belt cleaning device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
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Granted publication date: 20191015 |