CN114101156A - Wafer fork cleaning method and device - Google Patents

Wafer fork cleaning method and device Download PDF

Info

Publication number
CN114101156A
CN114101156A CN202010861124.4A CN202010861124A CN114101156A CN 114101156 A CN114101156 A CN 114101156A CN 202010861124 A CN202010861124 A CN 202010861124A CN 114101156 A CN114101156 A CN 114101156A
Authority
CN
China
Prior art keywords
brush
cleaning
wafer fork
spraying
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202010861124.4A
Other languages
Chinese (zh)
Other versions
CN114101156B (en
Inventor
姜喆求
胡艳鹏
李琳
卢一泓
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Institute of Microelectronics of CAS
Zhenxin Beijing Semiconductor Co Ltd
Original Assignee
Institute of Microelectronics of CAS
Zhenxin Beijing Semiconductor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Microelectronics of CAS, Zhenxin Beijing Semiconductor Co Ltd filed Critical Institute of Microelectronics of CAS
Priority to CN202010861124.4A priority Critical patent/CN114101156B/en
Publication of CN114101156A publication Critical patent/CN114101156A/en
Application granted granted Critical
Publication of CN114101156B publication Critical patent/CN114101156B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B08B3/024—Cleaning by means of spray elements moving over the surface to be cleaned
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
    • B08B1/12—Brushes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements for supplying or controlling air or other gases for drying solid materials or objects
    • F26B21/50—Ducting arrangements from the source of air or other gases to the materials or objects being dried
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

本发明涉及设备维护技术领域，尤其涉及一种晶圆叉清洗方法及装置，该晶圆叉清洗装置，包括：清洗室、设置于清洗室内的喷洒装置和刷子、设置于清洗室出入口的气刀；所述喷洒装置，用于喷淋清洗液；所述刷子，用于对伸入所述清洗室内的晶圆叉进行洗刷，气刀，用于对所述待清洗的晶圆叉进行吹扫，以及对清洗后的晶圆叉进行干燥，进而实现对晶圆叉进行有效、自动地清洗，进而避免晶圆的交叉污染，也提高了产能。

Figure 202010861124

The invention relates to the technical field of equipment maintenance, and in particular to a method and device for cleaning a wafer fork. The wafer fork cleaning device includes a cleaning chamber, a spraying device and a brush arranged in the cleaning chamber, and an air knife arranged at the entrance and exit of the cleaning chamber. ; the spraying device is used to spray cleaning liquid; the brush is used to wash the wafer fork that extends into the cleaning chamber, and the air knife is used to purge the wafer fork to be cleaned , and drying the cleaned wafer forks, thereby realizing effective and automatic cleaning of the wafer forks, thereby avoiding cross-contamination of wafers, and improving productivity.

Figure 202010861124

Description

Wafer fork cleaning method and device
Technical Field
The invention relates to the technical field of equipment maintenance, in particular to a method and a device for cleaning a wafer fork.
Background
As shown in fig. 1a, 1b, and 1c, the wafer fork is easy to store dirt and dirty at a position on the wafer fork that contacts with the wafer.
The wafer fork requires periodic maintenance, including cleaning, etc., to prevent cross-contamination of the wafers. At present, the cleaning is usually carried out directly by hand without the equipment operating.
However, this cleaning method is not efficient, and thus, affects productivity.
Disclosure of Invention
In view of the above, the present invention has been made to provide a wafer fork cleaning method and apparatus that overcomes or at least partially solves the above-mentioned problems.
In a first aspect, an embodiment of the present invention provides a wafer fork cleaning apparatus, including:
the cleaning device comprises a cleaning chamber, a spraying device and a brush which are arranged in the cleaning chamber, and an air knife arranged at an inlet and an outlet of the cleaning chamber;
the spraying device is used for spraying cleaning liquid;
the brush is used for brushing the wafer fork to be cleaned so as to spray cleaning liquid and brush simultaneously;
the air knife is used for blowing the wafer fork to be cleaned and drying the cleaned wafer fork.
Further, when the spraying device is integrated on the brush, the spraying device further comprises:
the first rail is arranged at the top end of the cleaning chamber and used for bearing the brush;
the first driving device is connected with the brush and used for driving the brush to move along the first track so as to spray cleaning liquid and wash the brush at the same time.
Further, the brush includes: a brush head and a first support rod;
one end of the first supporting rod is provided with the brush head, and the other end of the first supporting rod is arranged on the first track;
the brush head is provided with brush hair, and a spraying hole for spraying cleaning liquid is arranged in the gap between the brush hair.
Further, when the spraying device is arranged side by side with the brush, still include:
a second support bar;
the second track is arranged at the top end of the cleaning chamber and used for bearing the second supporting rod;
one end of the second supporting rod is arranged on the second track, the other end of the second supporting rod is connected with a transverse plate, one end of the transverse plate is provided with the brush, and the other end of the transverse plate is provided with the spraying device;
and the second driving device is connected with the second supporting rod and used for driving the second supporting rod to move along the second track, so that the spraying device and the brush both move along the second track, and cleaning liquid is sprayed while the brush is washed.
Furthermore, the spraying devices are fixedly arranged on the upper part, the lower part and the side edge of the cleaning chamber;
further comprising:
the third track is arranged at the top end of the cleaning chamber and used for bearing the brush;
and the third driving device is connected with the brush and is used for driving the brush to move along the third track so as to wash the area where the spraying device sprays the cleaning liquid.
Further, still include:
the fourth driving device is connected with the brush and used for driving the brush to rotate so as to realize rotary washing.
Further, still include:
and the fifth driving device is connected with the second supporting rod and is used for driving the second supporting rod to rotate so as to enable the brush on the transverse plate and the spraying device to spray the cleaning liquid and wash the brush at the same time in the rotating process.
In a second aspect, the present invention further provides a wafer fork cleaning method, including:
controlling to insert the wafer fork into the cleaning chamber and controlling the air knife to purge the wafer fork to be cleaned;
controlling to start a spraying device to spray cleaning liquid, and controlling a brush to wash the wafer fork to be cleaned so as to spray the cleaning liquid and wash the wafer fork at the same time;
and controlling the wafer fork to move out of the cleaning chamber, and controlling an air knife to dry the cleaned wafer fork.
Further, after controlling the gas knife to purge the wafer fork, the method further comprises:
controlling to close the air knife;
after the wafer fork is dried by controlling the air knife, the method further comprises the following steps:
controlling to close the air knife.
Further, the controlling of starting the spraying device to spray the cleaning solution and controlling the brush to wash the wafer fork to be cleaned includes:
controlling to start the spraying device;
controlling the spraying device to move or adjusting the spraying direction of the spraying device, so that the cleaning liquid sprayed by the spraying device completely covers the wafer fork to be cleaned;
and controlling the brush to rotationally brush the wafer fork to be cleaned in the cleaning liquid spraying area.
One or more technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:
the invention provides a wafer fork cleaning device which comprises a cleaning chamber, a spraying device and a brush which are arranged in the cleaning chamber, and an air knife which is arranged at an inlet and an outlet of the cleaning chamber, wherein the spraying device is used for spraying cleaning liquid, the brush is used for washing and brushing a wafer fork extending into the cleaning chamber so as to spray the cleaning liquid while washing, and the air knife is used for blowing the wafer fork to be cleaned and drying the cleaned wafer fork so as to effectively and automatically clean the wafer fork, further avoid the cross contamination of the wafer and improve the productivity.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIGS. 1a, 1b, and 1c are schematic structural views of a wafer fork;
FIG. 2 is a schematic structural diagram of a wafer fork cleaning apparatus according to an embodiment of the invention;
FIG. 3 is a schematic structural diagram illustrating an integrated arrangement of a brush and a spraying device according to a first embodiment of the present invention;
FIG. 4 is a schematic view of a brush and a spraying device arranged side by side according to a first embodiment of the present invention;
FIG. 5 is a schematic view showing a structure in which a brush and a spraying device are separately provided according to a first embodiment of the present invention;
fig. 6 is a flowchart illustrating a wafer fork cleaning method according to a second embodiment of the invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Example one
The embodiment of the invention provides a wafer fork cleaning device, which is applied to periodic equipment maintenance to clean a wafer fork.
As shown in fig. 2, the wafer fork cleaning apparatus includes: a cleaning chamber 101, a spraying device 102 and a brush 103 which are arranged in the cleaning chamber 101, and an air knife 106 which is arranged at the entrance and exit of the cleaning chamber 101, wherein the spraying device 102 is used for spraying cleaning liquid; the brush 103 is used for brushing the wafer fork extending into the cleaning chamber 101 so as to spray cleaning liquid and brush simultaneously; and the air knife 106 is used for blowing the wafer fork to be cleaned and drying the cleaned wafer fork.
The spraying device 102 not only can spray the cleaning liquid, but also can wash away impurities on the wafer fork by using impulsive force without using the brush 103 while spraying the cleaning liquid.
When the brush 103 is used for washing, a place where the washing liquid cannot wash can be washed.
Wherein the spraying device 102 and the brush 103 can be integrated together or can be separately arranged.
The following is a detailed description of the structure in which the spraying device 102 and the brush 103 are integrated together and the structure in which they are separately provided.
As shown in fig. 3, when the spraying device 102 is integrated with the brush 103, the wafer fork cleaning apparatus further includes:
a first rail 1041 disposed at a top end of the cleaning chamber 101 for carrying the brush 103; the first driving device 1051 is connected to the brush 103 and is used for driving the brush to move along the first track 1041 so as to spray the cleaning solution and wash the cleaning solution.
In a specific embodiment, the brush 103 includes a brush head 1031 and a first support rod 1032, one end of the first support rod 1032 is provided with the brush head 1031, the other end is provided on the first rail 1041, the brush head 1031 is provided with not only bristles 10311, but also a spraying hole 1021 for spraying the cleaning liquid is provided in the gap between the bristles 10311, so that when the first driving device 1051 drives the brush 103 to move along the first rail 1041, the brush can be washed while spraying the cleaning liquid.
In an alternative embodiment, the wafer fork cleaning apparatus further comprises: and the fourth driving device 1054 is connected with the brush 103, and is used for driving the brush 103 to rotate so as to realize rotary washing, and the washing is cleaner and more efficient by adopting a rotary washing mode.
As shown in fig. 4, the spraying device 102 is disposed side by side with the brush 103, and the wafer fork cleaning device further includes: a second support bar 107; a second rail 1042 provided at the top of the cleaning chamber 101 for supporting the second supporting bar 107; one end of the second support rod 107 is disposed on the second rail 1042, and the other end is connected to a transverse plate, one end of which is disposed with the brush 103, and the other end is disposed with the spraying device 102.
Further comprising: and a second driving device 1052 connected to the second supporting rod 107 for driving the second supporting rod to move along the second rail 1041, so that both the spraying device 102 and the brush 103 move along the second rail 1041, thereby spraying the cleaning solution while brushing.
The wafer fork cleaning device further comprises a fifth driving device 1055, wherein the fifth driving device 1055 is connected with the second supporting rod 107 and is used for driving the second supporting rod 107 to rotate, namely, the second supporting rod 107 rotates around the axis of the second supporting rod 107, so that the transverse plate also rotates along with the second supporting rod 107, the brush 103 and the spraying device 102 on the transverse plate also rotate along with the transverse plate, the aim of washing while spraying the cleaning liquid is achieved in the rotating process, and the washing is cleaner in the rotating process.
As shown in fig. 5, the spraying device 102 is fixedly installed at the upper part, the lower part and the side of the cleaning chamber 101, and the wafer fork cleaning device further includes: a third rail 1043 disposed at the top end of the cleaning chamber for carrying the brush 103; and a third driving device 1053 connected to the brush 103 for driving the brush to move along the third track 1043 for brushing the area where the spraying device 102 sprays the cleaning solution.
Specifically, although the spraying device 102 is fixedly arranged, the spraying devices 102 arranged at the upper part, the lower part and the side edge can realize the spraying task in different areas.
The sprinkler 102 can also realize the rotation of the spray head to realize the spraying task of different areas.
The brush 103 is disposed on the third rail 1043, and can move along the third rail 1043, and in an area where the spraying device 102 sprays the cleaning solution, the brush 103 moves to the area to perform the washing, so as to achieve the purpose of spraying the cleaning solution and washing at the same time.
In an alternative embodiment, the brush 103 is connected to the fourth driving device 1054, and the fourth driving device 1054 is used for driving the brush 103 to rotate, so as to realize the rotary washing and brushing, and the rotary washing and brushing way is adopted, so that the washing and brushing are cleaner and more efficient.
In an alternative embodiment, when the air knife 106 performs purging when the wafer fork enters the cleaning chamber 101, the large impurities on the surface of the wafer fork to be cleaned can be purged; when the wafer fork leaves the cleaning chamber 101, the air knife 106 dries the wafer fork, and dries the water stain on the surface of the cleaned wafer fork.
The cleaning solution may be deionized water, ammonia water, or the like.
The first rail 1041, the second rail 1042, and the third rail 1043 each include a laterally moving rail and a longitudinally moving rail to facilitate the brush 103 to reach various portions of the wafer fork through the rails.
The first driving device 1051, the second driving device 1052, the third driving device 1053, the fourth driving device 1054 and the fifth driving device 1055 are all driven by a motor, wherein the first driving device 1051, the second driving device 1052 and the third driving device 1053 can realize the lifting and moving of the brush 103 and the spraying device 102, and the fourth driving device 1054 and the fifth driving device 1055 are used for driving the rotation of the brush, etc.
One or more technical solutions in the embodiments of the present invention have at least the following technical effects or advantages:
the invention provides a wafer fork cleaning device which comprises a cleaning chamber, a spraying device and a brush which are arranged in the cleaning chamber, and an air knife which is arranged at an inlet and an outlet of the cleaning chamber, wherein the spraying device is used for spraying cleaning liquid, the brush is used for washing and brushing a wafer fork extending into the cleaning chamber so as to spray the cleaning liquid while washing, and the air knife is used for blowing the wafer fork to be cleaned and drying the cleaned wafer fork so as to effectively and automatically clean the wafer fork, further avoid the cross contamination of the wafer and improve the productivity.
Example two
Based on the same inventive concept, the present invention further provides a wafer fork cleaning method, as shown in fig. 6, including:
s601, inserting the wafer fork into a cleaning chamber, and controlling an air knife to purge the wafer fork to be cleaned;
s602, controlling to start a spraying device to spray cleaning liquid, and controlling a brush to wash the wafer fork to be cleaned so as to realize simultaneous spraying and washing;
s603, the wafer fork is controlled to be moved out of the cleaning chamber, and an air knife is controlled to dry the cleaned wafer fork.
Specifically, the wafer fork cleaning method mainly performs washing in a washing mode while spraying cleaning liquid, so that the cleaning efficiency is higher.
In an optional embodiment, after controlling the gas knife to purge the wafer fork, the method further includes:
controlling to close the air knife;
after the wafer fork is brushed by controlling the air knife, the method further comprises the following steps:
controlling to close the air knife.
Specifically, the air knife is opened only when the wafer fork enters or exits the cleaning chamber, and the air knife is controlled to be in a closed state during the process that the wafer fork is cleaned.
The air knife is controlled to open and blow when the wafer fork enters the cleaning chamber, impurities can be blown firstly, then the air knife is controlled to open and dry when the wafer fork leaves the cleaning chamber, the cleaned wafer fork is dried, and water stains left after cleaning are blown.
In an optional embodiment, the controlling to start a spraying device to spray a cleaning solution and control a brush to wash the wafer fork to be cleaned includes:
controlling to start the spraying device;
controlling the spraying device to move or adjusting the spraying direction of the spraying device, so that the cleaning liquid sprayed by the spraying device completely covers the wafer fork to be cleaned;
and controlling the brush to rotationally brush the wafer fork to be cleaned in the cleaning liquid spraying area.
The action of the spraying device and the brush is controlled, so that the spraying device is effectively matched with the brush, and the cleaning efficiency is improved.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.

Claims (10)

1.一种晶圆叉清洗装置，其特征在于，包括：1. a wafer fork cleaning device, is characterized in that, comprises: 清洗室、设置于清洗室内的喷洒装置和刷子、设置于所述清洗室出入口的气刀；a cleaning room, a spray device and a brush arranged in the cleaning room, and an air knife arranged at the entrance and exit of the cleaning room; 所述喷洒装置，用于喷淋清洗液；The spraying device is used for spraying cleaning liquid; 所述刷子，用于对待清洗的晶圆叉进行洗刷，以实现边喷淋清洗液边洗刷；The brush is used for washing the wafer fork to be cleaned, so as to realize the washing while spraying the cleaning liquid; 所述气刀，用于对所述待清洗的晶圆叉进行吹扫，以及对清洗后的晶圆叉进行干燥。The air knife is used for purging the wafer fork to be cleaned and drying the cleaned wafer fork. 2.如权利要求1所述的晶圆叉清洗装置，其特征在于，所述喷洒装置集成于所述刷子上时，还包括：2. The wafer fork cleaning device according to claim 1, wherein when the spraying device is integrated on the brush, it further comprises: 第一轨道，设置在所述清洗室顶端，用于承载所述刷子；a first track, arranged at the top of the cleaning chamber, for carrying the brush; 第一驱动装置，连接所述刷子，用于驱动所述刷子沿着所述第一轨道移动，以实现边喷淋清洗液边洗刷。The first driving device is connected to the brush, and is used for driving the brush to move along the first track, so as to realize washing while spraying the cleaning liquid. 3.如权利要求2所述的晶圆叉清洗装置，其特征在于，所述刷子包括：刷头和第一支撑杆；3. The wafer fork cleaning device according to claim 2, wherein the brush comprises: a brush head and a first support rod; 所述第一支撑杆一端设置所述刷头，另一端设置于所述第一轨道上；One end of the first support rod is provided with the brush head, and the other end is provided on the first track; 所述刷头上设置有刷毛，且在刷毛的间隙设置有喷淋清洗液的喷淋孔。The brush head is provided with bristles, and the gaps between the bristles are provided with spray holes for spraying cleaning liquid. 4.如权利要求1所述的晶圆叉清洗装置，其特征在于，在所述喷洒装置与所述刷子并排设置时，还包括：4. The wafer fork cleaning device according to claim 1, wherein when the spraying device and the brush are arranged side by side, further comprising: 第二支撑杆；the second support rod; 第二轨道，设置在所述清洗室顶端，用于承载所述第二支撑杆；a second track, disposed at the top of the cleaning chamber, for carrying the second support rod; 所述第二支撑杆的一端设置于所述第二轨道，另一端连接横板，所述横板一端设置所述刷子，另一端设置所述喷洒装置；One end of the second support rod is arranged on the second track, and the other end is connected with a horizontal plate, the brush is arranged at one end of the horizontal plate, and the spray device is arranged at the other end; 第二驱动装置，连接所述第二支撑杆，用于驱动所述第二支撑杆沿着所述第二轨道移动，以使所述喷洒装置和所述刷子均沿着所述第二轨道移动，以实现边喷淋清洗液边洗刷。A second driving device, connected to the second support rod, for driving the second support rod to move along the second track, so that both the spraying device and the brush move along the second track , in order to achieve washing while spraying cleaning liquid. 5.如权利要求1所述的晶圆叉清洗装置，其特征在于，在所述清洗室的上部、下部以及侧边均固定设置有所述喷洒装置；5. The wafer fork cleaning device according to claim 1, wherein the spraying device is fixedly arranged on the upper part, the lower part and the side of the cleaning chamber; 还包括：Also includes: 第三轨道，设置在所述清洗室顶端，用于承载所述刷子；a third track, arranged at the top of the cleaning chamber, for carrying the brushes; 第三驱动装置，连接所述刷子，用于驱动所述刷子沿着所述第三轨道移动，以在所述喷洒装置喷淋清洗液的区域进行洗刷。A third driving device, connected to the brush, is used for driving the brush to move along the third track, so as to wash the area where the spray device sprays cleaning liquid. 6.如权利要求1所述的晶圆叉清洗装置，其特征在于，还包括：6. The wafer fork cleaning device of claim 1, further comprising: 第四驱动装置，所述第四驱动装置连接所述刷子，用于驱动所述刷子旋转，以实现旋转洗刷。a fourth driving device, which is connected to the brush and used for driving the brush to rotate, so as to realize rotary brushing. 7.如权利要求4所述的晶圆叉清洗装置，其特征在于，还包括：7. The wafer fork cleaning device of claim 4, further comprising: 第五驱动装置，所述第五驱动装置连接所述第二支撑杆，用于驱动所述第二支撑杆旋转，以使所述横板上的刷子和喷洒装置在旋转过程中实现边喷洒清洗液边洗刷。A fifth driving device, the fifth driving device is connected to the second support rod, and is used to drive the second support rod to rotate, so that the brushes and the spraying device on the horizontal plate can realize edge spray cleaning during the rotation process Liquid side scrub. 8.一种晶圆叉清洗方法，其特征在于，包括：8. a wafer fork cleaning method, is characterized in that, comprises: 控制将晶圆叉插入清洗室，并控制气刀对待清洗的晶圆叉进行吹扫；Control the insertion of the wafer fork into the cleaning chamber, and control the air knife to purge the wafer fork to be cleaned; 控制开启喷洒装置进行喷淋清洗液，并控制刷子对所述待清洗的晶圆叉进行洗刷，以实现边喷淋清洗液边洗刷；Controlling the opening of the spraying device to spray the cleaning liquid, and controlling the brush to wash the wafer fork to be cleaned, so as to realize the washing while spraying the cleaning liquid; 控制将所述晶圆叉移出所述清洗室，并控制气刀对清洗后的晶圆叉进行干燥。The wafer fork is controlled to be moved out of the cleaning chamber, and the cleaned wafer fork is controlled by the air knife to dry. 9.如权利要求8所述的方法，其特征在于，所述在控制气刀对所述晶圆叉进行吹扫之后，还包括：9. The method of claim 8, wherein after controlling the air knife to purge the wafer fork, the method further comprises: 控制关闭所述气刀；controlling the closing of the air knife; 所述在控制气刀对所述晶圆叉进行干燥之后，还包括：After controlling the air knife to dry the wafer fork, the method further includes: 控制关闭所述气刀。Control turns off the air knife. 10.如权利要求8所述的方法，其特征在于，所述控制开启喷洒装置进行喷淋清洗液，并控制刷子对待清洗的晶圆叉进行洗刷，包括：10. The method according to claim 8, wherein the control to open the spray device to spray the cleaning liquid, and to control the brush to wash the wafer fork to be cleaned, comprising: 控制开启喷洒装置；Control the opening of the spray device; 控制所述喷洒装置移动或者调整所述喷洒装置的喷洒朝向，使得所述喷洒装置喷淋的清洗液将所述待清洗的晶圆叉全部覆盖；Controlling the movement of the spraying device or adjusting the spraying direction of the spraying device, so that the cleaning liquid sprayed by the spraying device completely covers the wafer fork to be cleaned; 控制刷子在喷淋清洗液的区域对所述待清洗的晶圆叉进行旋转洗刷。The control brush rotates and scrubs the wafer fork to be cleaned in the area where the cleaning liquid is sprayed.
CN202010861124.4A 2020-08-25 2020-08-25 Wafer fork cleaning method and device Active CN114101156B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010861124.4A CN114101156B (en) 2020-08-25 2020-08-25 Wafer fork cleaning method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010861124.4A CN114101156B (en) 2020-08-25 2020-08-25 Wafer fork cleaning method and device

Publications (2)

Publication Number Publication Date
CN114101156A true CN114101156A (en) 2022-03-01
CN114101156B CN114101156B (en) 2023-04-11

Family

ID=80373674

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010861124.4A Active CN114101156B (en) 2020-08-25 2020-08-25 Wafer fork cleaning method and device

Country Status (1)

Country Link
CN (1) CN114101156B (en)

Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129267A (en) * 1991-10-30 1993-05-25 Tokyo Electron Ltd Cleaning equipment
JPH05129270A (en) * 1991-10-30 1993-05-25 Tokyo Electron Ltd Cleaning equipment
JPH10308371A (en) * 1997-05-07 1998-11-17 Fujitsu Ltd Substrate processing equipment
JP2000077500A (en) * 1998-09-03 2000-03-14 Toho Kasei Kk Substrate processing equipment
KR20050065749A (en) * 2003-12-23 2005-06-30 동부아남반도체 주식회사 Vertical wafer gripping apparatus
JP2007052300A (en) * 2005-08-19 2007-03-01 Pre-Tech Co Ltd Cleaning device for mask substrate, and cleaning method for mask substrate using the same
CN101590474A (en) * 2008-05-30 2009-12-02 中芯国际集成电路制造(上海)有限公司 Injection apparatus on the purging system
CN103325721A (en) * 2013-05-20 2013-09-25 扬州晶新微电子有限公司 Rolling type chip moving method
CN203526108U (en) * 2013-10-30 2014-04-09 重庆润泽医药有限公司 Support for cleaning medical electric coagulation forceps
CN105921444A (en) * 2016-06-06 2016-09-07 佛山市富易食品有限公司 Pachyrhizua angulatus cleaning device
CN206810826U (en) * 2017-06-17 2017-12-29 黄清平 A kind of rotary type glass washer-drier
CN206838611U (en) * 2017-05-22 2018-01-05 江苏建康职业学院 A kind of surgery instrument cleaning case
CN107597628A (en) * 2017-08-29 2018-01-19 大唐新疆清洁能源有限公司 Photovoltaic cell deduster and self-cleaning photovoltaic board component
CN107694974A (en) * 2017-11-14 2018-02-16 虞温乐 A kind of rural domestic sewage treatment engineering construction tool cleaning device
KR101857636B1 (en) * 2018-03-19 2018-05-14 (주)다미정밀 Heatsink scrubber for LED light of vehicle
CN207914193U (en) * 2017-11-27 2018-09-28 韶关市宏德热轧带钢有限公司 A kind of cleaning device for overhead steel rolling equipment
CN108746009A (en) * 2018-05-19 2018-11-06 芜湖新利德玻璃制品有限公司 A kind of glass washing device
CN108786956A (en) * 2018-05-03 2018-11-13 芜湖市诺康生物科技有限公司 A kind of biologic test platform convenient for cleaning
CN208583679U (en) * 2018-04-03 2019-03-08 惠安华晨贸易有限公司 A kind of paediatrics medical instrument spray scrubs drying unit
CN209496837U (en) * 2019-04-23 2019-10-15 德淮半导体有限公司 Crystal round fringes cleaning device
CN110369371A (en) * 2019-07-23 2019-10-25 天津中环领先材料技术有限公司 A large-size silicon wafer cleaning device and its cleaning process
CN210010247U (en) * 2019-05-16 2020-02-04 德淮半导体有限公司 Cleaning device for wafer chuck
CN110756483A (en) * 2019-09-19 2020-02-07 上海提牛机电设备有限公司 A wafer grabbing mechanism cleaning device
CN210358249U (en) * 2019-08-01 2020-04-21 周鸿理 Part belt cleaning device for auto repair
CN210876456U (en) * 2019-09-06 2020-06-30 张展 Efficient cleaning equipment for medical instruments
CN211070955U (en) * 2019-11-27 2020-07-24 李金霞 Gastroscope belt cleaning device
CN211247682U (en) * 2019-09-16 2020-08-14 常州金世纪玻璃科技有限公司 Low-radiation coated glass cleaning device

Patent Citations (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05129267A (en) * 1991-10-30 1993-05-25 Tokyo Electron Ltd Cleaning equipment
JPH05129270A (en) * 1991-10-30 1993-05-25 Tokyo Electron Ltd Cleaning equipment
JPH10308371A (en) * 1997-05-07 1998-11-17 Fujitsu Ltd Substrate processing equipment
JP2000077500A (en) * 1998-09-03 2000-03-14 Toho Kasei Kk Substrate processing equipment
KR20050065749A (en) * 2003-12-23 2005-06-30 동부아남반도체 주식회사 Vertical wafer gripping apparatus
JP2007052300A (en) * 2005-08-19 2007-03-01 Pre-Tech Co Ltd Cleaning device for mask substrate, and cleaning method for mask substrate using the same
CN101590474A (en) * 2008-05-30 2009-12-02 中芯国际集成电路制造(上海)有限公司 Injection apparatus on the purging system
CN103325721A (en) * 2013-05-20 2013-09-25 扬州晶新微电子有限公司 Rolling type chip moving method
CN203526108U (en) * 2013-10-30 2014-04-09 重庆润泽医药有限公司 Support for cleaning medical electric coagulation forceps
CN105921444A (en) * 2016-06-06 2016-09-07 佛山市富易食品有限公司 Pachyrhizua angulatus cleaning device
CN206838611U (en) * 2017-05-22 2018-01-05 江苏建康职业学院 A kind of surgery instrument cleaning case
CN206810826U (en) * 2017-06-17 2017-12-29 黄清平 A kind of rotary type glass washer-drier
CN107597628A (en) * 2017-08-29 2018-01-19 大唐新疆清洁能源有限公司 Photovoltaic cell deduster and self-cleaning photovoltaic board component
CN107694974A (en) * 2017-11-14 2018-02-16 虞温乐 A kind of rural domestic sewage treatment engineering construction tool cleaning device
CN207914193U (en) * 2017-11-27 2018-09-28 韶关市宏德热轧带钢有限公司 A kind of cleaning device for overhead steel rolling equipment
KR101857636B1 (en) * 2018-03-19 2018-05-14 (주)다미정밀 Heatsink scrubber for LED light of vehicle
CN208583679U (en) * 2018-04-03 2019-03-08 惠安华晨贸易有限公司 A kind of paediatrics medical instrument spray scrubs drying unit
CN108786956A (en) * 2018-05-03 2018-11-13 芜湖市诺康生物科技有限公司 A kind of biologic test platform convenient for cleaning
CN108746009A (en) * 2018-05-19 2018-11-06 芜湖新利德玻璃制品有限公司 A kind of glass washing device
CN209496837U (en) * 2019-04-23 2019-10-15 德淮半导体有限公司 Crystal round fringes cleaning device
CN210010247U (en) * 2019-05-16 2020-02-04 德淮半导体有限公司 Cleaning device for wafer chuck
CN110369371A (en) * 2019-07-23 2019-10-25 天津中环领先材料技术有限公司 A large-size silicon wafer cleaning device and its cleaning process
CN210358249U (en) * 2019-08-01 2020-04-21 周鸿理 Part belt cleaning device for auto repair
CN210876456U (en) * 2019-09-06 2020-06-30 张展 Efficient cleaning equipment for medical instruments
CN211247682U (en) * 2019-09-16 2020-08-14 常州金世纪玻璃科技有限公司 Low-radiation coated glass cleaning device
CN110756483A (en) * 2019-09-19 2020-02-07 上海提牛机电设备有限公司 A wafer grabbing mechanism cleaning device
CN211070955U (en) * 2019-11-27 2020-07-24 李金霞 Gastroscope belt cleaning device

Also Published As

Publication number Publication date
CN114101156B (en) 2023-04-11

Similar Documents

Publication Publication Date Title
US20100078044A1 (en) Apparatus and method for cleaning semiconductor substrate using pressurized fluid
JP6107750B2 (en) Car wash machine
CN116936410A (en) Semi-automatic wafer cleaning machine and wafer cleaning method
CN110335839B (en) Wafer box cleaning device and method
CN117842743A (en) A coating pretreatment device capable of improving color fastness
CN114101156B (en) Wafer fork cleaning method and device
CN209036280U (en) The post-processing unit of chemical-mechanical polishing system and wafer
JP2002159921A (en) Substrate cleaning device
JPH0328212B2 (en)
CN218360937U (en) Full-automatic mesh plate cleaning machine
KR20050047147A (en) Apparatus for cleaning a wafer
CN216965604U (en) Quartz tube self-cleaning equipment
CN113649424B (en) Cleaning and blowing device for copper continuous casting and rolling production
JP6107736B2 (en) Car wash machine
CN113263035A (en) Industrial barrel cleaning equipment
KR100753129B1 (en) Light guide plate dry cleaning device
CN214317915U (en) A window frame cleaning device for architectural decoration
CN105908413B (en) A kind of flushing machine of open soaper
CN221017632U (en) Door and window processing cleaning machine
JPH021699B2 (en)
CN107096746B (en) Automatic disc feeding/pre-cleaning equipment and method
CN222941700U (en) A tumbling steam bubble cleaning machine for the production of quick-frozen edible mushrooms
CN220836868U (en) Spinning roller cleaning device
CN221969523U (en) Semi-contact self-service car washer
CN219817164U (en) Stainless steel foundry goods dust collector

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant