CN202224393U - Device for cleaning back surface of wafer - Google Patents
Device for cleaning back surface of wafer Download PDFInfo
- Publication number
- CN202224393U CN202224393U CN2011203754892U CN201120375489U CN202224393U CN 202224393 U CN202224393 U CN 202224393U CN 2011203754892 U CN2011203754892 U CN 2011203754892U CN 201120375489 U CN201120375489 U CN 201120375489U CN 202224393 U CN202224393 U CN 202224393U
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- CN
- China
- Prior art keywords
- cleaning device
- wafer rear
- wafer
- remover liquid
- rear cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a device for cleaning the back surface of a wafer. The device comprises a platform and a cleaning cap arranged in the center of the platform, wherein the cleaning cap is provided with at least two cleaning solution nozzles which are uniformly distributed along the same circumference and have the same flow. The device for cleaning the back surface of the wafer can uniformly eject a cleaning solution and prevents the thickness of the back surface of the wafer from being non-uniformly increased.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, relates in particular to a kind of wafer rear cleaning device.
Background technology
Shown in Figure 1 is the wafer rear cleaning device of prior art; Said wafer rear cleaning device comprises a platform 11, a plurality of holder 12 and a washing cap (rinse cap) 13; Said a plurality of holder 12 is arranged on the edge of said platform 11 along same circumference; Said washing cap 13 is arranged on the central authorities of said platform 11, and said washing cap 13 is in the form of annular discs, is provided with remover liquid nozzle 14 at the circle centre position of said washing cap 13.When using said wafer rear cleaning device that wafer rear is cleaned; Wafer to be cleaned (not showing among Fig. 1) is positioned at the top of said platform 11 through said a plurality of holders 12; The back side of said wafer to be cleaned is towards said platform 11, and the central authorities of said wafer to be cleaned be positioned at said washing cap 13 directly over, the rotation at a high speed of said washing cap 13; And eject cleaning fluid (like deionized water) from said remover liquid nozzle 14; After cleaning fluid is ejected into the centre of said wafer rear to be cleaned, wash away, reach the purpose of cleaning whole wafer rear from the mediad edge.
Yet; Because said wafer rear cleaning device has only a remover liquid nozzle 14; And said remover liquid nozzle 14 is arranged on the circle centre position of said washing cap 13, and therefore, said wafer rear cleaning device can not evenly eject cleaning fluid; When using the wafer rear cleaning device cleaning wafer back side of prior art, the central authorities of wafer rear touch more cleaning fluid.Cleaning fluid has certain oxidation to wafer; Wafer rear thickness is increased, because the central authorities of wafer rear touch more cleaning fluids, therefore; After using the wafer rear cleaning device cleaning wafer back side of prior art; The thickness of wafer rear centre is much larger than the thickness of other location points of wafer rear, and experimental data shows, behind the wafer rear cleaning device cleaning wafer back side of use prior art; The thickness of wafer rear centre on average increases by 1.59 dusts, and the thickness of other location points of wafer rear on average increases by 0.27 dust.The inhomogeneities that wafer rear thickness increases makes the wafer location be difficult to balance, thereby influences the wafer processing technology, and this is that semiconductor fabrication process is not hoped the phenomenon that takes place.
The utility model content
The purpose of the utility model is to provide a kind of wafer rear cleaning device, can evenly eject cleaning fluid, prevents wafer rear growth in uneven thickness.
In order to reach above-mentioned purpose; The utility model provides a kind of wafer rear cleaning device; Comprise platform and be arranged at the central washing cap of said platform, it is characterized in that said washing cap is provided with at least two remover liquid nozzles; Said at least two remover liquid nozzles evenly distribute along same circumference, and the flow of said at least two remover liquid nozzles is identical.
Above-mentioned wafer rear cleaning device, wherein, said washing cap is provided with two remover liquid nozzles.
Above-mentioned wafer rear cleaning device, wherein, said washing cap is provided with at least three remover liquid nozzles.
Above-mentioned wafer rear cleaning device wherein, is characterized in that, said cleaning cap is in the form of annular discs.
Above-mentioned wafer rear cleaning device, wherein, said wafer rear cleaning device also comprises a plurality of holders that are used for the clamping wafer.
Above-mentioned wafer rear cleaning device, wherein, said wafer rear cleaning device also comprises a flow controller, said at least two remover liquid nozzles all are connected with said flow controller.
Above-mentioned wafer rear cleaning device, wherein, said wafer rear cleaning device also comprises at least two flow controllers, said remover liquid nozzle and said flow controller connect one to one.
Washing cap is provided with along the equally distributed a plurality of remover liquid nozzles of same circumference in the wafer rear cleaning device of the utility model; And a plurality of remover liquid nozzles are not positioned at the circle centre position of washing cap, are at washing cap under the state of rotation at a high speed, and the cleaning fluid that remover liquid nozzle ejects is and then superhigh speed rotation under action of centrifugal force; Again because a plurality of remover liquid nozzles are arranged; And a plurality of washing lotion nozzles equate that to the distance in the washing cap center of circle therefore, the cleaning fluid that ejects can evenly distribute; Make wafer rear each point to be cleaned touch the cleaning fluid of same amount, it is inhomogeneous to prevent effectively that wafer rear thickness to be cleaned from increasing.
Description of drawings
The wafer rear cleaning device of the utility model is provided by following embodiment and accompanying drawing.
Fig. 1 is the structural representation of the wafer rear cleaning device of prior art.
Fig. 2 is the structural representation of wafer rear cleaning device among the utility model embodiment one.
Fig. 3 is a distribute sketch map among the utility model embodiment one.
Fig. 4 is the structural representation of washing cap among the utility model embodiment two.
The specific embodiment
Below will combine Fig. 2～Fig. 4 that the wafer rear cleaning device of the utility model is done further to describe in detail.
Embodiment one
Referring to Fig. 2, the wafer rear cleaning device of present embodiment comprises a platform 21, a plurality of holder 22 and a washing cap 23;
Said a plurality of holder 22 evenly is arranged on the edge of said platform 21 along same circumference, and said a plurality of holders 22 are used for clamping wafer to be cleaned (Fig. 2 does not show);
Said washing cap 23 is in the form of annular discs, and is arranged on said platform 21 central authorities;
Said washing cap 23 is provided with two remover liquid nozzles: first remover liquid nozzle 24 and second remover liquid nozzle 25; Said first remover liquid nozzle 24 and second remover liquid nozzle 25 are arranged on the same diameter; And said first remover liquid nozzle 24 to said washing cap 23 center of circle O apart from d1 equal said second remover liquid nozzle 25 to said washing cap 23 center of circle O apart from d2, as shown in Figure 3.
In the present embodiment; Said wafer rear cleaning device also comprises a flow controller; Said first remover liquid nozzle 24 all is connected with this flow controller with second remover liquid nozzle 25; Be that said first remover liquid nozzle 24 and second remover liquid nozzle 25 are by same flow controller (not shown) control, so that first remover liquid nozzle 24 is identical with the flow of second remover liquid nozzle 25.Certainly; In other specific embodiment of the utility model; Said wafer rear cleaning device can also comprise two or more flow controllers, and said remover liquid nozzle and said flow controller connect one to one, promptly; A remover liquid nozzle connects a flow controller, as long as make the flow of remover liquid nozzle identical.
When the wafer rear cleaning device of use present embodiment cleans wafer rear; Wafer to be cleaned is positioned at the top of said platform 21 through said a plurality of holders 22; The back side of said wafer to be cleaned is towards said platform 21; And the central authorities of said wafer to be cleaned be positioned at said washing cap 23 directly over, said washing cap 23 rotation at a high speed, and eject cleaning fluid (like deionized water) from said first remover liquid nozzle 24 and second remover liquid nozzle 25.Because said first remover liquid nozzle 24 and second remover liquid nozzle 25 are not positioned at the O place, the center of circle of said washing cap 23; Be at said washing cap 23 under the state of rotation at a high speed; The cleaning fluid that said first remover liquid nozzle 24 and second remover liquid nozzle 25 eject is and then superhigh speed rotation under action of centrifugal force; Again owing to have two remover liquid nozzles, and two remover liquid nozzles are equal to the distance in the washing cap center of circle, therefore; The cleaning fluid that ejects from said first remover liquid nozzle 24 and second remover liquid nozzle 25 can evenly distribute; As shown in Figure 3, make wafer rear each point to be cleaned touch the cleaning fluid of same amount, it is inhomogeneous to prevent effectively that wafer rear thickness to be cleaned from increasing.
Experimental data shows; After using the wafer rear cleaning device cleaning wafer back side of present embodiment; The thickness of wafer rear centre on average increases by 0.28 dust; And the thickness of other location points of wafer rear on average increases by 0.25 dust, this shows, it is inhomogeneous that the wafer rear cleaning device of present embodiment can prevent effectively that wafer rear thickness to be cleaned from increasing.
Embodiment two
Referring to Fig. 4, embodiment two is that with the difference of embodiment one said washing cap 30 is provided with at least three remover liquid nozzles 31, and said a plurality of remover liquid nozzles 31 evenly distribute along same circumference.
Preferable, the quantity of said remover liquid nozzle is 6～10.
Need to prove that each embodiment adopts the mode of going forward one by one to describe in this specification, what each embodiment stressed all is and the difference of other embodiment that identical similar part is mutually referring to getting final product between each embodiment.
Obviously, those skilled in the art can carry out various changes and modification to utility model and not break away from the spirit and the scope of the utility model.Like this, if these of the utility model are revised and modification belongs within the scope of the utility model claim and equivalent technologies thereof, then the utility model also is intended to comprise these change and modification.
Claims (7)
1. wafer rear cleaning device; Comprise platform and be arranged at the central washing cap of said platform; It is characterized in that; Said washing cap is provided with at least two remover liquid nozzles, and said at least two remover liquid nozzles evenly distribute along same circumference, and the flow of said at least two remover liquid nozzles is identical.
2. wafer rear cleaning device as claimed in claim 1 is characterized in that, said washing cap is provided with two remover liquid nozzles.
3. wafer rear cleaning device as claimed in claim 1 is characterized in that said washing cap is provided with at least three remover liquid nozzles.
4. like any described wafer rear cleaning device in the claim 1 to 3, it is characterized in that said cleaning cap is in the form of annular discs.
5. like any described wafer rear cleaning device in the claim 1 to 3, it is characterized in that said wafer rear cleaning device also comprises a plurality of holders that are used for the clamping wafer.
6. wafer rear cleaning device as claimed in claim 1 is characterized in that, said wafer rear cleaning device also comprises a flow controller, and said at least two remover liquid nozzles all are connected with said flow controller.
7. wafer rear cleaning device as claimed in claim 1 is characterized in that, said wafer rear cleaning device also comprises at least two flow controllers, and said remover liquid nozzle and said flow controller connect one to one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203754892U CN202224393U (en) | 2011-09-28 | 2011-09-28 | Device for cleaning back surface of wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011203754892U CN202224393U (en) | 2011-09-28 | 2011-09-28 | Device for cleaning back surface of wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202224393U true CN202224393U (en) | 2012-05-23 |
Family
ID=46075001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011203754892U Expired - Fee Related CN202224393U (en) | 2011-09-28 | 2011-09-28 | Device for cleaning back surface of wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202224393U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470177A (en) * | 2016-01-05 | 2016-04-06 | 天津华海清科机电科技有限公司 | Wafer cleaning and drying apparatus |
| CN105891552A (en) * | 2016-01-06 | 2016-08-24 | 苏州捷芯威半导体有限公司 | Wafer fixation clamp |
| CN108818987A (en) * | 2018-08-23 | 2018-11-16 | 重庆市嘉凌新科技有限公司 | Chip cutting cleaning equipment |
-
2011
- 2011-09-28 CN CN2011203754892U patent/CN202224393U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105470177A (en) * | 2016-01-05 | 2016-04-06 | 天津华海清科机电科技有限公司 | Wafer cleaning and drying apparatus |
| CN105470177B (en) * | 2016-01-05 | 2018-09-07 | 清华大学 | Wafer cleaning drying device |
| CN105891552A (en) * | 2016-01-06 | 2016-08-24 | 苏州捷芯威半导体有限公司 | Wafer fixation clamp |
| CN108818987A (en) * | 2018-08-23 | 2018-11-16 | 重庆市嘉凌新科技有限公司 | Chip cutting cleaning equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130423 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20130423 Address after: 100176 No. 18, Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120523 Termination date: 20180928 |