CN102779772A - Wafer back surface cleaning device - Google Patents
Wafer back surface cleaning device Download PDFInfo
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- CN102779772A CN102779772A CN2012102467781A CN201210246778A CN102779772A CN 102779772 A CN102779772 A CN 102779772A CN 2012102467781 A CN2012102467781 A CN 2012102467781A CN 201210246778 A CN201210246778 A CN 201210246778A CN 102779772 A CN102779772 A CN 102779772A
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- back surface
- cleaning device
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Abstract
The invention provides a wafer back surface cleaning device. The wafer back surface cleaning device comprises a wafer clamping component, a rotary shaft, a wafer cleaning component and a fixed shaft, wherein the wafer clamping component is used for clamping a wafer to be cleaned; the rotary shaft is arranged under the wafer clamping component and is fixedly connected with the wafer clamping component; the wafer cleaning component is arranged under the wafer to be cleaned; the fixed shaft is arranged under the wafer cleaning component and is fixedly connected with the wafer cleaning component; the fixed shaft is coaxial to the rotary shaft; the fixed shaft is provided with a first hollow cavity; a liquid pipeline for transmitting a wafer cleaning agent is arranged in the first hollow cavity; a liquid shower nozzle and a liquid passage communicated with the liquid shower nozzle are arranged on the wafer cleaning component; the liquid passage is communicated with the liquid pipeline and is used for jetting the wafer cleaning agent to clean the wafer to be cleaned, so that the wafer back surface is cleaned, and the requirement on a wafer cleaning technique of an integrated circuit is met.
Description
Technical field
The present invention relates to semiconductor integrated circuit wafer cleaner technical field, relate in particular to a kind of chip back surface cleaning device.
Background technology
Along with the semiconductor integrated circuit characteristic size enters into the deep-submicron stage, the requirement of the cleaning in the IC wafer manufacturing process is also increasingly high.When wafer was carried out traditional cleaning, cleaning fluid can flow to chip back surface from the wafer edge and produce secondary pollution, need clean chip back surface.
Summary of the invention
The technical problem that (one) will solve
The present invention provides a kind of chip back surface cleaning device, and cleaning fluid can flow to chip back surface generation secondary pollution problem from the wafer edge in the conventional clean technology in order to solve.
(2) technical scheme
The present invention provides a kind of chip back surface cleaning device, comprising:
The wafer holder parts that are used for clamping wafer to be cleaned;
The rotating shaft that is arranged on said wafer holder parts below and is fixedly connected with said wafer holder parts is used to rotate said wafer holder parts;
Be arranged on the wafer cleaning part of wafer to be cleaned below;
The fixed axis that is arranged on said wafer cleaning part below and is fixedly connected, and said fixed axis and said rotating shaft coaxle with said wafer cleaning part;
Wherein, said fixed axis has first cavity, is provided with the fluid pipeline that is used for the transferring wafer cleaning agent in said first cavity; The fluid path that said wafer cleaning part is provided with fluid jetting head and is communicated with said fluid jetting head, said fluid path is communicated with said fluid pipeline, is used to spray the wafer cleaning agent and cleans wafer to be cleaned.
(3) beneficial effect
Chip back surface cleaning device provided by the present invention is through being provided with the wafer cleaning part at the clean wafers back side; And be fixed in and rotate on the fixed axis of rotating shaft coaxle of wafer holder parts; Realization has been satisfied the requirement of IC wafer cleaning to the cleaning of chip back surface.
Description of drawings
Fig. 1 is the structural representation of chip back surface cleaning device in the embodiment of the invention;
Fig. 2 is the cutaway view of Fig. 1;
Fig. 3 is the vertical view of wafer cleaning part in the embodiment of the invention;
Fig. 4 is flow direction figure in the chip back surface cleaning device cleaning process in the embodiment of the invention;
Fig. 5 is gas flow figure in the chip back surface cleaning device cleaning process in the embodiment of the invention;
Fig. 6 is the front view of wafer cleaning part in the embodiment of the invention;
Among the figure, 1: the wafer holder parts; 2: wafer; 3: rotating shaft; 4: fixed axis; 5: the wafer cleaning part; 6: seal member 7: radial direction through hole; 8: the conversion straight joint; 9: fluid pipeline; 10: gas pipeline; 11: the liquid axially extending bore; 12: the gas axially extending bore; 13: fluid path; 14: the gas passage; 15: the first cavities; 16: the second cavities; 17: quick connector; 18: fluid jetting head; 19: gas tip.
Embodiment
Below in conjunction with accompanying drawing and embodiment, specific embodiments of the invention describes in further detail.Following examples are used to explain the present invention, but are not used for limiting scope of the present invention.
Shown in Figure 1 is the structural representation of chip back surface cleaning device in the embodiment of the invention, and Fig. 2 is the cutaway view of Fig. 1.In conjunction with illustrated in figures 1 and 2, the chip back surface cleaning device comprises wafer holder parts 1, rotating shaft 3, wafer cleaning part 5 and fixed axis 4 in the embodiment of the invention.Wafer holder parts 1 are used for clamping wafer 2 to be cleaned; Rotating shaft 3 is arranged on wafer holder parts 1 below and is fixedly connected with wafer holder parts 1, is used to rotate wafer holder parts 1; Wafer cleaning part 5 is arranged on wafer to be cleaned 2 belows; Fixed axis 4 is arranged on wafer cleaning part 5 belows and is fixedly connected with wafer cleaning part 5, and fixed axis 4 is coaxial with rotating shaft 3, and fixed axis 4 remains static when realizing rotating shaft 3 rotations.Wherein, fixed axis 4 has in first cavity, 15, the first cavities 15 and is provided with the fluid pipeline 9 that is used for the transferring wafer cleaning agent; The fluid path 13 that wafer cleaning part 1 is provided with fluid jetting head 18 and is communicated with fluid jetting head 18, fluid path 13 is communicated with fluid pipeline 9, is used to spray the wafer cleaning agent and cleans wafer 2 to be cleaned.
What wafer holder parts 1 can be for lower end closed in the present embodiment is cylindric, so that wafer cleaning part 5 is installed in the cylinder and is positioned at the below of wafer 2 to be cleaned, comes the back side of clean wafers 2; Fluid path 13 can be communicated with through conversion straight joint 8 with fluid pipeline 9.
The cleaning process of chip back surface cleaning device is: at first wafer 2 to be cleaned is fixed on the wafer holder parts 1, the back side down; Start rotating shaft 3 rotations, the rotation of rotating shaft 3 drives 1 rotation of wafer holder parts, thereby rotates wafer 2 to be cleaned; Wafer cleaning part 5 is inactive state in cleaning process, realizes the cleaning in full week of agitation wafer 2 back sides through the rotation of wafer 2 to be cleaned.
Shown in Figure 3 is the vertical view of wafer cleaning part in the present embodiment.As shown in Figure 3, the fluid jetting head 18 in the present embodiment on the wafer cleaning part 5 is that a plurality of liquid axially extending bores 11 that central ray distributes are formed by one group with fixed axis 4, certainly, according to the actual process demand many groups can be set also, as three groups or four groups.Because wafer 2 relative wafer cleaning part 5 rotations to be cleaned, one group is that a plurality of liquid axially extending bores 11 that central ray distributes have satisfied the demand of cleaning with fixed axis 4, but also has simplified the structure of wafer cleaning part 5.
Chip back surface cleaning device provided by the present invention is through being provided with the wafer cleaning part 5 at the clean wafers back side; And be fixed in the coaxial fixed axis 4 of the rotating shaft that rotates the wafer holder parts 3 on; Realization has been satisfied the requirement of IC wafer cleaning to the cleaning of chip back surface.
For clean wafers 2, the undressed wafer 2 that has cleaned especially, require that also gas is carried out at the back side of clean wafers 2 and dry up, use nitrogen usually, because nitrogen is very stable at normal temperatures, can not react with other materials.
For drying up the gas tip that clean wafers 2 need be provided with air-transmitting gas pipeline and jet gas.
Wherein, The mode that gas pipeline is set has a variety of; In conjunction with illustrated in figures 1 and 2, be chosen in the present embodiment in first cavity 15 of fixed axis 4 and be provided for air-transmitting gas pipeline 10 (not shown)s, and the gas passage 14 that gas tip 19 is set on wafer cleaning part 5 and is communicated with gas tip 19; Gas passage 14 is communicated with gas pipeline 10, is used for jet gas and dries up clean wafers 2.The same with fluid jetting head 18, gas tip 19 is that a plurality of gas axially extending bores 12 that central ray distributes are formed by one group with fixed axis 4 in the present embodiment.
As shown in Figure 3, to be distributed in fixed axis 4 with a plurality of gas axially extending bores 12 be on the same diameter at center to preferred a plurality of liquid axially extending bores 11 in the present embodiment, and the cross section of the wafer cleaning part 5 that can reduce is saved material.Wherein, the cross section of wafer cleaning part can be Long Circle.
In first cavity 15, be provided for air-transmitting gas pipeline 10; Can be through independent tubes be set; This needs first cavity 15 enough big; Also can be with first cavity 15 as gas pipeline 10, the preferred latter then only need be provided with independently fluid pipeline 9 in this enforcement in first cavity 15.In addition, those skilled in the art are easy to expect, also can be with first cavity 15 as fluid pipeline 9 and independently gas pipeline 10 is set, and this also belongs to protection scope of the present invention.
In order to realize first cavity 15 as gas pipeline 10; Seal member 6 need be installed below fixed axis 4 makes the cavity 15 of winning form confined space; Wherein seal member 6 can be selected swivel joint; Simultaneously first cavity 15 is communicated with gas passage 14, and on the sidewall of fixed axis 4, radial direction through hole 7 is set, can in first cavity 15, feed gas through quick connector 17.Simplified the structure of chip back surface cleaning device on the one hand, can also prevent that on the other hand other objects from getting into first cavity 15.
In wafer 2 cleaning processes; The static requirement of fixed axis 4 when satisfying rotating shaft 3 rotation; Be that rotating shaft 3 is coaxial with fixed axis 4; Preferred rotating shaft 3 has second cavity 16 in the present embodiment, and fixed axis 4 is arranged in second cavity 16, is convenient in first cavity 15 of fixed axis 4, have enough spaces that fluid pipeline 9 and gas pipeline 10 are set.Wherein, As shown in Figure 4; Can fluid pipeline 9 be arranged on the center of fixed axis 4, make and to clean the center of wafer 2 to be cleaned, and all tilt to the outer of wafer cleaning part 5 in upper end away from several (being generally 2 or 3) liquid axially extending bores 11 of fixed axis 4 one ends at several (being generally 2 or 3) liquid axially extending bores 11 near fixed axis 4 one ends; The angle of inclination is according to the cleaning requirements set, to clean the position, edge of wafer 2 to be cleaned.Correspondingly, all tilt in upper end to wafer cleaning part 5 outers away from several (being generally 2 or 3) gas axially extending bores 12 of fixed axis 4 one ends; Because gas pipeline 10 is or not the center of fixed axis 4, therefore centroclinal to wafer cleaning part 5 in upper end near several gas axially extending bores 12 of fixed axis 4 one ends, to clean the center of wafer 2 to be cleaned.At this moment, flowing to of liquid is as shown in Figure 4, and flowing to of gas is as shown in Figure 5.
Shown in Figure 6 is the front view of wafer cleaning part in the embodiment of the invention.As shown in Figure 6, the center of preferred wafer cleaning part 5 is higher than the outer in the embodiment of the invention, so that cleaning agent under the surface current of wafer cleaning part 5, can not make the cleaning agent that cleans after accomplishing be injected into wafer 2 back sides once more, causes secondary pollution.
Chip back surface cleaning device in the embodiment of the invention is 1 rotation of wafer holder parts when clean wafers 2; Wafer cleaning part 5 is static; This is identical with existing front wafer surface cleaning; Make chip back surface cleaning device provided by the present invention can with the assembling of existing front wafer surface cleaning device, realize simultaneously cleaning to wafer 2 front and backs.
The above only is a preferred implementation of the present invention; Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from know-why of the present invention; Can also make some improvement and replacement, these improvement and replacement also should be regarded as protection scope of the present invention.
Claims (10)
1. a chip back surface cleaning device is characterized in that, comprising:
The wafer holder parts that are used for clamping wafer to be cleaned;
The rotating shaft that is arranged on said wafer holder parts below and is fixedly connected with said wafer holder parts is used to rotate said wafer holder parts;
Be arranged on the wafer cleaning part of wafer to be cleaned below;
The fixed axis that is arranged on said wafer cleaning part below and is fixedly connected, and said fixed axis and said rotating shaft coaxle with said wafer cleaning part;
Wherein, said fixed axis has first cavity, is provided with the fluid pipeline that is used for the transferring wafer cleaning agent in said first cavity; The fluid path that said wafer cleaning part is provided with fluid jetting head and is communicated with said fluid jetting head, said fluid path is communicated with said fluid pipeline, is used to spray the wafer cleaning agent and cleans wafer to be cleaned.
2. chip back surface cleaning device according to claim 1 is characterized in that, also is provided with in first cavity of said fixed axis to be used for air-transmitting gas pipeline;
The gas passage that also is provided with gas tip and is communicated with said gas tip on the said wafer cleaning part, said gas passage is communicated with said gas pipeline, is used for jet gas and dries up clean wafers.
3. chip back surface cleaning device according to claim 2 is characterized in that, said fluid jetting head and gas tip are that the gentle axon of a plurality of liquid axially extending bores that central ray distributes is formed to through hole by some groups with said fixed axis respectively.
4. chip back surface cleaning device according to claim 3 is characterized in that, it is on the same diameter at center that said a plurality of liquids and gases axially extending bores are distributed in said fixed axis.
5. chip back surface cleaning device according to claim 4 is characterized in that, the cross section of said wafer cleaning part is a Long Circle.
6. chip back surface cleaning device according to claim 2 is characterized in that, also comprises seal member, is arranged on the below of said fixed axis, is used to seal first cavity of said fixed axis;
The sidewall of said fixed axis is provided with radial direction through hole, in said first cavity, feeds gas through said radial direction through hole, and said first cavity is communicated with said gas passage.
7. chip back surface cleaning device according to claim 1 is characterized in that said rotating shaft has second cavity, and said fixed axis is arranged in said second cavity.
8. chip back surface cleaning device according to claim 7 is characterized in that said fluid pipeline is arranged on the center of said fixed axis;
All tilting away from several gases of said fixed axis one end and the upper end of liquid axially extending bore to said wafer cleaning part outer;
Upper end near several gas axially extending bores of said fixed axis one end is centroclinal to said wafer cleaning part.
9. according to the arbitrary described chip back surface cleaning device of claim 1-8, it is characterized in that said fluid path is communicated with through the conversion straight joint with said fluid pipeline.
10. according to the arbitrary described chip back surface cleaning device of claim 1-8, it is characterized in that the center of said wafer cleaning part is higher than the outer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102467781A CN102779772A (en) | 2012-07-16 | 2012-07-16 | Wafer back surface cleaning device |
| TW102103612A TWI534881B (en) | 2012-07-16 | 2013-01-31 | Device for celaning the back surface of a wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102467781A CN102779772A (en) | 2012-07-16 | 2012-07-16 | Wafer back surface cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102779772A true CN102779772A (en) | 2012-11-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012102467781A Pending CN102779772A (en) | 2012-07-16 | 2012-07-16 | Wafer back surface cleaning device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN102779772A (en) |
| TW (1) | TWI534881B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103065996A (en) * | 2012-12-31 | 2013-04-24 | 上海新阳半导体材料股份有限公司 | Wafer surface treatment device |
| CN104867849A (en) * | 2015-05-28 | 2015-08-26 | 北京七星华创电子股份有限公司 | Wafer back surface pollution prevention device |
| CN105470177A (en) * | 2016-01-05 | 2016-04-06 | 天津华海清科机电科技有限公司 | Wafer cleaning and drying apparatus |
| CN109065484A (en) * | 2018-08-24 | 2018-12-21 | 宁波润华全芯微电子设备有限公司 | A kind of hollow main shaft structure for decontamination |
| CN107346755B (en) * | 2017-06-29 | 2019-10-01 | 华进半导体封装先导技术研发中心有限公司 | Thin wafer cleaning device and cleaning method of the wafer scale with TSV through hole |
| WO2023093799A1 (en) * | 2021-11-29 | 2023-06-01 | 盛美半导体设备(上海)股份有限公司 | Wafer cleaning device |
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| CN1393911A (en) * | 2001-06-22 | 2003-01-29 | S.E.S.株式会社 | Method for washing blade type substrate and its apparatus |
| CN101079373A (en) * | 2006-05-25 | 2007-11-28 | 细美事有限公司 | Apparatus and method for treating substrate, and injection head used in the apparatus |
| CN101207007A (en) * | 2006-12-20 | 2008-06-25 | 东京毅力科创株式会社 | Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium |
| CN202779014U (en) * | 2012-07-16 | 2013-03-13 | 北京七星华创电子股份有限公司 | Wafer back cleaner |
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2012
- 2012-07-16 CN CN2012102467781A patent/CN102779772A/en active Pending
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2013
- 2013-01-31 TW TW102103612A patent/TWI534881B/en active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1393911A (en) * | 2001-06-22 | 2003-01-29 | S.E.S.株式会社 | Method for washing blade type substrate and its apparatus |
| CN101079373A (en) * | 2006-05-25 | 2007-11-28 | 细美事有限公司 | Apparatus and method for treating substrate, and injection head used in the apparatus |
| CN101207007A (en) * | 2006-12-20 | 2008-06-25 | 东京毅力科创株式会社 | Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium |
| CN202779014U (en) * | 2012-07-16 | 2013-03-13 | 北京七星华创电子股份有限公司 | Wafer back cleaner |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103065996A (en) * | 2012-12-31 | 2013-04-24 | 上海新阳半导体材料股份有限公司 | Wafer surface treatment device |
| CN103065996B (en) * | 2012-12-31 | 2016-02-17 | 上海新阳半导体材料股份有限公司 | Wafer surface treatment device |
| CN104867849A (en) * | 2015-05-28 | 2015-08-26 | 北京七星华创电子股份有限公司 | Wafer back surface pollution prevention device |
| CN104867849B (en) * | 2015-05-28 | 2018-01-26 | 北京七星华创电子股份有限公司 | A kind of device for preventing chip back surface from polluting |
| CN105470177A (en) * | 2016-01-05 | 2016-04-06 | 天津华海清科机电科技有限公司 | Wafer cleaning and drying apparatus |
| CN105470177B (en) * | 2016-01-05 | 2018-09-07 | 清华大学 | Wafer cleaning drying device |
| CN107346755B (en) * | 2017-06-29 | 2019-10-01 | 华进半导体封装先导技术研发中心有限公司 | Thin wafer cleaning device and cleaning method of the wafer scale with TSV through hole |
| CN109065484A (en) * | 2018-08-24 | 2018-12-21 | 宁波润华全芯微电子设备有限公司 | A kind of hollow main shaft structure for decontamination |
| CN109065484B (en) * | 2018-08-24 | 2024-05-28 | 宁波润华全芯微电子设备有限公司 | Hollow main shaft structure for removing impurities |
| WO2023093799A1 (en) * | 2021-11-29 | 2023-06-01 | 盛美半导体设备(上海)股份有限公司 | Wafer cleaning device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI534881B (en) | 2016-05-21 |
| TW201405652A (en) | 2014-02-01 |
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Application publication date: 20121114 |