CN102376532A - Wafer cleaning device - Google Patents
Wafer cleaning device Download PDFInfo
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- CN102376532A CN102376532A CN2010102616467A CN201010261646A CN102376532A CN 102376532 A CN102376532 A CN 102376532A CN 2010102616467 A CN2010102616467 A CN 2010102616467A CN 201010261646 A CN201010261646 A CN 201010261646A CN 102376532 A CN102376532 A CN 102376532A
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Abstract
The invention discloses a wafer cleaning device. The wafer cleaning device comprises a holding device, a frontal cleaning unit and a rear cleaning unit, wherein the holding device is used for holding and rotating a wafer; the wafer comprises a right side and a reverse side relative to the right side; the frontal cleaning unit is used for jetting gas towards the right side of the wafer; the rear cleaning unit is used for spraying deionized water towards the reverse side of the wafer; and the frontal cleaning unit comprises a gas supply pipeline and a gas shower nozzle connected with the gas supply pipeline. By the wafer cleaning device, an oily defect is avoided and yield of a semiconductor device is increased.
Description
Technical field
The present invention relates to integrated circuit and make the field, particularly relate to a kind of wafer cleaner.
Background technology
Semiconductor device is generally through roads up to a hundred even the formation of thousands of procedure such as photoetching, etching, deposition and cmps, and after each procedure was accomplished, the wafer that is used for producing the semiconductor devices was transferred in the process equipment of next process.In the wafer handling process and in the manufacturing process of preceding working procedure, inevitably can produce particle, pollutant such as residual at chip back surface.When photoetching process, these pollutants can cause wafer perk on exposure bench, and influence focuses on, and then influence is aimed at and the critical size of semiconductor device, if this pollutant attached on the exposure bench, also can influence the wafer of other batch; In addition, in the transport process of wafer, rely on the vacuum suction chip back surface to carry out, if this pollutant attached to chip back surface, can cause the absorption affinity difference of wafer maybe can not adsorb, this wafer has to scrap.Therefore, the cleaning to chip back surface is very important.
Cleaning to chip back surface is generally carried out in wafer cleaner.Please refer to Fig. 1, it is the sketch map of existing wafer cleaner.As shown in Figure 1; Wafer cleaner 100 comprises: clamping device 110, front cleaning unit and back side cleaning unit; Said clamping device 110 is used for clamping and rotates wafer 10; Said wafer 10 comprise the front and with said positive opposing backside surface, said front cleaning unit is used for spraying deionized water to the front of wafer 10, said back side cleaning unit is used for spraying deionized water to the back side of wafer 10; Said front cleaning unit comprises feed tube for liquid road 121, fluid jetting head 122 and valve group 123, and said fluid jetting head 122 is connected with feed tube for liquid road 121 through valve group 123.
When carrying out back side cleaning, the wafer 10 of needs being removed the back pollution thing is placed on the said clamping device 110, and said clamping device 110 grasps the side of said wafer 10, the back side of said wafer 10 upwards, the facing down of said wafer 10; Then; Said wafer 10 rotates at a predetermined velocity; The fluid jetting head 122 of said front cleaning unit is arranged at the below of wafer 10, and sprays deionized water to the front of said wafer 10, simultaneously; Said back side cleaning unit moves to the top of wafer 10, sprays deionized water to the back side of wafer 10.When cleaning the back side of said wafer 10, utilize the front of washed with de-ionized water wafer 10, can prevent that the pollutant at wafer 10 back sides from flowing backward to the front of wafer 10 from wafer 10 edges, thereby avoid polluting wafer 10 fronts.
Yet; Find that in actual production after using a period of time, the valve group 123 of existing back side cleaning unit often breaks down; Even oil leakage phenomenon can appear; Make that the deionized water that supplies to wafer 10 fronts is contaminated, cause wafer 10 fronts oily defective (oil defect) to occur, and then cause the yield of semiconductor device to descend.
Summary of the invention
The present invention provides a kind of wafer cleaner, supplies to the deionized water of front wafer surface to solve easy pollution of existing wafer cleaner, and the problem that causes the semiconductor device yield to descend.
For solving the problems of the technologies described above; The present invention provides a kind of wafer cleaner; Comprise: clamping device, front cleaning unit and back side cleaning unit; Said clamping device is used for clamping and rotates wafer, said wafer comprise the front and with positive opposing backside surface, said front cleaning unit is used for to the front of said wafer blowing gas; Said back side cleaning unit is used for spraying deionized water to the back side of said wafer, and said front cleaning unit comprises gas supply pipe road and the gas tip that is connected with said gas supply pipe road.
Optional; In said wafer cleaner; Said gas tip comprises main body and is arranged at a plurality of through holes on the said main body; Said a plurality of through hole is communicated with said gas supply pipe road, and the aperture of through hole that is arranged at said body rim is greater than the aperture of the through hole that is arranged at said main center.
Optional, in said wafer cleaner, said main body is round table-like, and the small end of said main body is connected with said gas supply pipe road, and the big end of said main body is near the front of wafer.
Optional, in said wafer cleaner, said front cleaning unit also comprises gas-filtering device, said gas-filtering device is arranged on the said gas supply pipe road.
Optional, in said wafer cleaner, said front cleaning unit also comprises gas flow controller, said gas flow controller is arranged on the said gas supply pipe road.
Optional, in said wafer cleaner, said front cleaning unit also comprises gas supply device, said gas supply device is connected with said gas supply pipe road.
Optional, in said wafer cleaner, said clamping device comprises supporting seat and a plurality of keeper, said a plurality of keepers equidistantly are fixed on the said supporting seat.
Optional, in said wafer cleaner, said supporting seat is in the form of annular discs.
Optional, in said wafer cleaner, said keeper is cylindric, and the free end of said keeper has the first surface and second curved surface, through said first surface and the common holding chip of second curved surface.
Owing to adopted technique scheme, compared with prior art, the present invention has the following advantages:
The front cleaning unit of said wafer cleaner comprises gas supply pipe road and gas tip; Said gas supply pipe road is connected with gas tip; Said front cleaning unit need not to use the valve group; Be the front of the said wafer of purge of gas capable of using, avoid occurring the oily defective, improve the yield of semiconductor device.
Description of drawings
Fig. 1 is the sketch map of existing wafer cleaner;
The sketch map of the wafer cleaner that Fig. 2 provides for the embodiment of the invention;
Fig. 3 is the sketch map of the gas tip among Fig. 2.
Embodiment
In the following passage, with way of example the present invention is described more specifically with reference to accompanying drawing.According to following explanation and claims, advantage of the present invention and characteristic will be clearer.What need explanation is, accompanying drawing all adopts the form of simplifying very much and all uses non-ratio accurately, only in order to convenient, the purpose of the aid illustration embodiment of the invention lucidly.
Core concept of the present invention is; A kind of wafer cleaner is provided, and the front cleaning unit of said wafer cleaner comprises gas supply pipe road and gas tip, and said gas supply pipe road is connected with gas tip; Said front cleaning unit need not to use the valve group; Be the front of the said wafer of purge of gas capable of using, avoid occurring the oily defective, improve the yield of semiconductor device.
Please refer to Fig. 2; The sketch map of the wafer cleaner that it provides for the embodiment of the invention; As shown in Figure 2, said wafer cleaner 200 comprises: clamping device 210, front cleaning unit and back side cleaning unit, and said clamping device 210 is used for clamping and rotates wafer 20; Said wafer 20 comprise the front and with said positive opposing backside surface; Said front cleaning unit is used for to the front of said wafer 20 blowing gas, and said back side cleaning unit is used for spraying deionized water to the back side of said wafer 20, and said front cleaning unit comprises gas supply pipe road 221 and the gas tip 222 that is connected with said gas supply pipe road 221.The jet front of said wafer 20 of said front cleaning unit gas capable of using; Prevent overleaf in the cleaning process; The pollutant at wafer 20 back sides flows backward to front wafer surface from wafer 20 edges, simultaneously, because said front cleaning unit need not to use the valve group; Can avoid occurring the oily defective, improve the yield of semiconductor device.
Please refer to Fig. 3; And combination Fig. 2, said gas tip 222 comprises main body 222a and is arranged at a plurality of through hole 222b on the main body 222a that said through hole 222b is communicated with gas supply pipe road 210; Preferable; The aperture of through hole that is arranged at said main body 222a edge is greater than the aperture of the through hole that is arranged at main body 222a center, and is even with the air-flow of each position ejection of guaranteeing gas tip 222, to reach preferable cleaning performance.
In the present embodiment, said main body 222a is round table-like, and the small end of said main body 222a is connected with said gas supply pipe road 210, and the big end of said main body 222a is near the front of wafer 20.Yet will be appreciated that the shape of main body 222a of the present invention is not limited to round table-like, said main body 222a can also be other shape, and is for example conical or cylindrical.
Preferably; Said front cleaning unit also comprises gas-filtering device 223; Said gas-filtering device 223 is arranged on the said gas supply pipe road 221; Said gas-filtering device 223 is used to filter the gas in the said feeding pipe 221, guarantees to supply to the purity of the positive gas of said wafer 20.
Preferably, said front cleaning unit also comprises gas flow controller (MFC) 224, and said gas flow controller 224 is arranged on the said gas supply pipe road 221.When the flow that supplies to the positive gas of said wafer 20 is too big, very likely damage the rete on the wafer 20; And when gas pressure too hour, the pollutant at wafer 20 back sides will flow backward to front wafer surface from wafer 20 edges; Said gas flow controller 224 is the flow of control gaseous accurately, prevents that gas pressure is too big or too little.
In the present embodiment; Said front cleaning unit also comprises gas supply device 225; Said gas supply device 225 is connected with said gas supply pipe road 221, and said gas supply device 225 is used for to said gas supply pipe road 221 supply gas, and said gas is preferably highly purified nitrogen.
In the present embodiment, said clamping device 210 comprises supporting seat 211 and a plurality of keeper 212, and said a plurality of keepers 212 equidistantly are fixed on the said supporting seat on 211.Said supporting seat 211 is in the form of annular discs; Said gas tip 222 is arranged in the said supporting base 211 and is positioned at the below of said wafer 20; Said keeper 212 is cylindric; The free end of said keeper 212 has first surface (not shown) and second curved surface (not shown), through said first surface and the said wafer 20 of the common clamping of second curved surface.
Further, said cleaning device 200 also comprises motor 240, and said motor 240 is fixedly connected with said supporting seat 211, and said motor 240 is used to drive supporting seat 211 rotations, and then drives wafer 20 rotations.
When carrying out back side cleaning, can the wafer 20 that need to remove the back pollution thing be placed on the keeper 212 of said clamping device 210, said clamping device 210 grasps the side of wafer 20, and the back side of said wafer 20 upwards faces down; Then; Said wafer 20 is (for example 50～500 revolutions per seconds) rotation at a predetermined velocity, and the gas tip 222 of said front cleaning unit is arranged at the below of wafer 20, and to the front of wafer 20 blowing gas; Simultaneously; Back side cleaning unit moves to the top of wafer 20, sprays deionized water to the back side of wafer 20, to clean the pollutant at said wafer 20 back sides.When cleaning the back side of said wafer 20, utilize the front of gas winding-up wafer 20, can prevent that the pollutant at wafer 20 back sides from flowing backward to wafer 20 fronts from wafer 20 edges, thereby avoid polluting wafer 20 fronts.The front cleaning unit 221 of said wafer cleaner 200 need not to use the valve group, and the oily defective is avoided occurring in the front of the said wafer 20 of purge of gas promptly capable of using, has improved the yield of semiconductor device.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from spirit of the present invention and scope.Like this, if these modifications of the present invention and modification belong within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.
Claims (10)
1. wafer cleaner; Comprise: clamping device, front cleaning unit and back side cleaning unit; Said clamping device is used for clamping and rotates wafer, said wafer comprise the front and with positive opposing backside surface, said front cleaning unit is used for to the front of said wafer blowing gas; Said back side cleaning unit is used for spraying deionized water to the back side of said wafer, and said front cleaning unit comprises gas supply pipe road and the gas tip that is connected with said gas supply pipe road.
2. wafer cleaner as claimed in claim 1; It is characterized in that; Said gas tip comprises main body and is arranged at a plurality of through holes on the said main body; Said a plurality of through hole is communicated with said gas supply pipe road, and the aperture of through hole that is arranged at said body rim is greater than the aperture of the through hole that is arranged at said main center.
3. wafer cleaner as claimed in claim 2 is characterized in that said main body is round table-like, and the small end of said main body is connected with said gas supply pipe road, and the big end of said main body is near the front of wafer.
4. wafer cleaner as claimed in claim 1 is characterized in that, said front cleaning unit also comprises gas-filtering device, and said gas-filtering device is arranged on the said gas supply pipe road.
5. wafer cleaner as claimed in claim 1 is characterized in that, said front cleaning unit also comprises gas flow controller, and said gas flow controller is arranged on the said gas supply pipe road.
6. wafer cleaner as claimed in claim 1 is characterized in that, said front cleaning unit also comprises gas supply device, and said gas supply device is connected with said gas supply pipe road.
7. wafer cleaner as claimed in claim 1 is characterized in that, said clamping device comprises supporting seat and a plurality of keeper, and said a plurality of keepers equidistantly are fixed on the said supporting seat.
8. wafer cleaner as claimed in claim 7 is characterized in that said supporting seat is in the form of annular discs.
9. wafer cleaner as claimed in claim 7 is characterized in that said keeper is cylindric, and the free end of said keeper has the first surface and second curved surface, through said first surface and the said wafer of the common clamping of second curved surface.
10. wafer cleaner as claimed in claim 7 is characterized in that said cleaning device also comprises motor, and said motor is connected with said supporting seat, is used to drive said supporting seat rotation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102616467A CN102376532A (en) | 2010-08-24 | 2010-08-24 | Wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102616467A CN102376532A (en) | 2010-08-24 | 2010-08-24 | Wafer cleaning device |
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| Publication Number | Publication Date |
|---|---|
| CN102376532A true CN102376532A (en) | 2012-03-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN2010102616467A Pending CN102376532A (en) | 2010-08-24 | 2010-08-24 | Wafer cleaning device |
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| CN (1) | CN102376532A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102941201A (en) * | 2012-10-12 | 2013-02-27 | 上海华力微电子有限公司 | Automatic machine transmission part washing method and machine transmission part |
| CN103406307A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | Automatically-controlled PCB (printed circuit board) blow jig |
| CN103681247A (en) * | 2013-12-30 | 2014-03-26 | 上海集成电路研发中心有限公司 | Wafer reaction chamber cleaning device |
| CN104813460A (en) * | 2012-11-27 | 2015-07-29 | 盛美半导体设备（上海）有限公司 | Substrate supporting apparatus |
| CN109637951A (en) * | 2018-12-07 | 2019-04-16 | 苏州市兆恒众力精密机械有限公司 | A kind of product and its destressing processing method for cleaning wafer |
| WO2022205495A1 (en) * | 2021-04-01 | 2022-10-06 | 台湾积体电路制造股份有限公司 | Wafer electrode cleaning apparatus |
| WO2023109455A1 (en) * | 2021-12-14 | 2023-06-22 | 盛美半导体设备(上海)股份有限公司 | Wafer backside cleaning method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1393911A (en) * | 2001-06-22 | 2003-01-29 | S.E.S.株式会社 | Method for washing blade type substrate and its apparatus |
| CN1510721A (en) * | 2002-12-25 | 2004-07-07 | 株式会社瑞萨科技 | Manufacturing method for semiconductor device |
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2010
- 2010-08-24 CN CN2010102616467A patent/CN102376532A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1393911A (en) * | 2001-06-22 | 2003-01-29 | S.E.S.株式会社 | Method for washing blade type substrate and its apparatus |
| CN1510721A (en) * | 2002-12-25 | 2004-07-07 | 株式会社瑞萨科技 | Manufacturing method for semiconductor device |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102941201A (en) * | 2012-10-12 | 2013-02-27 | 上海华力微电子有限公司 | Automatic machine transmission part washing method and machine transmission part |
| CN102941201B (en) * | 2012-10-12 | 2016-01-20 | 上海华力微电子有限公司 | Board transfer member method for self-cleaning and board transfer member |
| CN104813460A (en) * | 2012-11-27 | 2015-07-29 | 盛美半导体设备（上海）有限公司 | Substrate supporting apparatus |
| US10410906B2 (en) | 2012-11-27 | 2019-09-10 | Acm Research (Shanghai) Inc. | Substrate supporting apparatus |
| CN103406307A (en) * | 2013-07-24 | 2013-11-27 | 昆山迈致治具科技有限公司 | Automatically-controlled PCB (printed circuit board) blow jig |
| CN103681247A (en) * | 2013-12-30 | 2014-03-26 | 上海集成电路研发中心有限公司 | Wafer reaction chamber cleaning device |
| CN109637951A (en) * | 2018-12-07 | 2019-04-16 | 苏州市兆恒众力精密机械有限公司 | A kind of product and its destressing processing method for cleaning wafer |
| WO2022205495A1 (en) * | 2021-04-01 | 2022-10-06 | 台湾积体电路制造股份有限公司 | Wafer electrode cleaning apparatus |
| WO2023109455A1 (en) * | 2021-12-14 | 2023-06-22 | 盛美半导体设备(上海)股份有限公司 | Wafer backside cleaning method |
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Application publication date: 20120314 |