CN109637951A - A kind of product and its destressing processing method for cleaning wafer - Google Patents
A kind of product and its destressing processing method for cleaning wafer Download PDFInfo
- Publication number
- CN109637951A CN109637951A CN201811493871.6A CN201811493871A CN109637951A CN 109637951 A CN109637951 A CN 109637951A CN 201811493871 A CN201811493871 A CN 201811493871A CN 109637951 A CN109637951 A CN 109637951A
- Authority
- CN
- China
- Prior art keywords
- product
- product body
- cleaning wafer
- mounting surface
- inside casing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 24
- 238000003672 processing method Methods 0.000 title claims abstract description 9
- 229920000297 Rayon Polymers 0.000 claims abstract description 5
- 239000003292 glue Substances 0.000 claims abstract description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 7
- 235000012431 wafers Nutrition 0.000 abstract 4
- 229940095676 wafer product Drugs 0.000 description 2
- 241000222712 Kinetoplastida Species 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
It is provided by the invention a kind of for cleaning the product of 12 cun of wafers, including product body, machined surface and mounting surface are provided on the product body；The machined surface is located at the side of the tool assembly, is recessed on a side surface of the tool assembly；The mounting surface is located at the other side of the product body, is recessed on a side surface of the product body.A kind of product destressing processing method for cleaning wafer provided by the invention, clean gas is discharged using multiple rows of bearing holes, carry wafer, driving device drives rotation, to carry out the cleaning of wafer, repeatedly goes de-stress in process, and it is laid flat in finishing utilization of hour viscose glue, it is processed in its natural state, prevents its deformation, effectively improve the precision of tooling.
Description
Technical field
The present invention relates to a kind of product for cleaning wafer and its destressing processing methods.
Background technique
Currently, the wafer that CPU is used needs to carry out Precision Machining in process, it may require that progress is more in the process
Secondary cleaning needs to provide tooling in wafer cleaning thus to reach its surface smoothness, meets the needs of high-precision is cleaned.
Plastic material is usually used in product required for wafer, to protect crystal column surface not to be damaged, but plastics
The characteristic of product result in processing it is easily-deformable, precision is not easy to guarantee, be difficult in process eliminate stress, influence the precision of tooling
And quality.
Summary of the invention
Technical problem to be solved by the present invention lies in: a kind of product for cleaning wafer and its destressing processing are provided
Method improves on product structure, wafer support precision when cleaning, then the processing method for improving product is improved, in life
De-stress is gone during producing, reduces the deformation of product, improves precision.
In order to solve the above technical problems, the technical scheme is that a kind of product for cleaning wafer, including product
Body is provided with machined surface and mounting surface on the product body；The machined surface is located at the side of the product body, recess
On a side surface of the product body；The mounting surface is located at the other side of the product body, is recessed described
On one side surface of product body.
Further, the product body is made of the special plastic of acid-fast alkali-proof.
Further, processing inside casing is provided on the machined surface, the processing inside casing is located at the product body
It is interior, extend to the outside of the product body.
Further, the stepped distribution of processing inside casing.
Further, bearing holes are provided in the processing inside casing, connection gas source discharges clean gas.
Further, the bearing holes are provided with multiple, are annularly distributed in the processing inside casing.
Further, the bearing holes are provided with multiple rows of, are distributed in the processing inside casing in concentric circles.
Further, a kind of processing method of the product for cleaning wafer:
A. mounting surface described in roughing, using the mounting surface as machined surface described in benchmark roughing；
B. the product body is heat-treated, goes de-stress for the first time；
C. mounting surface described in semifinishing, using the mounting surface as machined surface described in benchmark semifinishing；
D. the product body is placed naturally, carries out failure destressing, goes de-stress for the second time；
E. the machined surface is finished, is laid flat on processing platform using viscose glue, in its natural state described in finishing
Mounting surface, complete the processing of tooling.
Compared with prior art, a kind of product and its destressing processing method for cleaning wafer provided by the invention,
Clean gas is discharged using multiple rows of bearing holes, carries wafer, driving device drives rotation, to carry out the cleaning of wafer, processing
De-stress is repeatedly gone in the process, and is laid flat in finishing utilization of hour viscose glue, is processed in its natural state, prevents its deformation,
Effectively improve the precision of tooling.
Detailed description of the invention
Fig. 1 shows main sectional view of the invention.
Wherein: 1. tool assemblies, 2. machined surfaces, 3. mounting surfaces, 4. processing inside casings, 5. bearing holes.
Specific embodiment
As shown, a kind of tooling for cleaning wafer product, including tool assembly 1, it is provided in the tool assembly 1
Machined surface 2 and mounting surface 3；The machined surface 2 is located at the side of the tool assembly 1, is recessed the one of the product body 1
On side surface；The mounting surface 3 is located at the other side of the product body 1, is recessed in a side surface of the product body 1
On.
Further, described to be made with kinetoplast 1 of the special plastic of acid-fast alkali-proof.
Further, processing inside casing 4 is provided on the machined surface 2, the processing inside casing 4 is located at the tooling
In body 1, the outside of the tool assembly 1 is extended to.
Further, the stepped distribution of processing inside casing 4.
Further, bearing holes 5 are provided in the processing inside casing 4, connection gas source discharges clean gas.
Further, the bearing holes 5 are provided with multiple, are annularly distributed in the processing inside casing 4.
Further, the bearing holes 5 are provided with multiple rows of, are distributed in the processing inside casing 4 in concentric circles.
Further, a kind of processing method of the tooling for cleaning wafer product:
A. mounting surface 3 described in roughing is machined surface 2 described in benchmark roughing with the mounting surface 3；
B. the tool assembly 1 is heat-treated, goes de-stress for the first time；
C. mounting surface 3 described in semifinishing is machined surface 2 described in benchmark semifinishing with the mounting surface 3；
D. the tool assembly 1 is placed naturally, carries out failure destressing, goes de-stress for the second time；
E. the machined surface 2 is finished, is laid flat on processing platform using viscose glue, in its natural state described in finishing
Mounting surface 3, complete the processing of tooling.
Finally, it should be noted that property technical side the above examples are only used to illustrate the technical scheme of the present invention and are not limiting
Case, those skilled in the art should understand that, modification or equivalent replacement of the technical solution of the present invention are made for those, and
The objective and range for not departing from the technical program, are intended to be within the scope of the claims of the invention.
Claims (8)
1. a kind of product for cleaning wafer, which is characterized in that including product body, be provided with machined surface on the product body
And mounting surface；The machined surface is located at the side of the product body, is recessed on a side surface of the product body；Institute
The mounting surface stated is located at the other side of the product body, is recessed on a side surface of the product body.
2. a kind of product for cleaning wafer as described in claim 1, which is characterized in that the product body is using acidproof
Alkaline-resisting special plastic is made.
3. a kind of product for cleaning wafer as described in claim 1, which is characterized in that be provided on the machined surface
Inside casing is processed, the processing inside casing is located in the product body, extends to the outside of the product body.
4. a kind of product for cleaning wafer as claimed in claim 3, which is characterized in that the processing inside casing is in ladder
Shape distribution.
5. a kind of product for cleaning wafer as claimed in claim 4, which is characterized in that be arranged in the processing inside casing
There are bearing holes, connection gas source discharges clean gas.
6. a kind of product for cleaning wafer as claimed in claim 5, which is characterized in that the bearing holes are provided with more
It is a, it is annularly distributed in the processing inside casing.
7. a kind of product for cleaning wafer as claimed in claim 6, which is characterized in that the bearing holes are provided with more
Row is distributed in the processing inside casing in concentric circles.
8. a kind of product for cleaning wafer as described in any one of claim 1-7, destressing processing method is such as
Under:
A. mounting surface described in roughing, using the mounting surface as machined surface described in benchmark roughing；
B. the tool assembly is heat-treated, goes de-stress for the first time；
C. mounting surface described in semifinishing, using the mounting surface as machined surface described in benchmark semifinishing；
D. the tool assembly is placed naturally, carries out failure destressing, goes de-stress for the second time；
E. the machined surface is finished, is laid flat on processing platform using viscose glue, finishes the peace in its natural state
The processing of tooling is completed in dress face.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811493871.6A CN109637951B (en) | 2018-12-07 | 2018-12-07 | Product for cleaning wafer and stress-relief processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811493871.6A CN109637951B (en) | 2018-12-07 | 2018-12-07 | Product for cleaning wafer and stress-relief processing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109637951A true CN109637951A (en) | 2019-04-16 |
| CN109637951B CN109637951B (en) | 2021-02-23 |
Family
ID=66071632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811493871.6A Active CN109637951B (en) | 2018-12-07 | 2018-12-07 | Product for cleaning wafer and stress-relief processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109637951B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005042995A (en) * | 2003-07-24 | 2005-02-17 | Toray Eng Co Ltd | Cleaning device for forming local clean area |
| CN101850505A (en) * | 2010-04-10 | 2010-10-06 | 宁波市锦泰橡塑有限公司 | Precision cutting machining method of polycarbonate material |
| CN101886263A (en) * | 2010-07-15 | 2010-11-17 | 菲特晶(南京)电子有限公司 | Blowing corrosion machine and method for corrosion and cleaning |
| CN102310063A (en) * | 2010-06-29 | 2012-01-11 | 中国科学院微电子研究所 | Honeycomb-shaped plasma free radical cleaning system |
| CN102339729A (en) * | 2010-07-22 | 2012-02-01 | 中芯国际集成电路制造(上海)有限公司 | Wafer cleaning and drying machine |
| CN102376532A (en) * | 2010-08-24 | 2012-03-14 | 武汉新芯集成电路制造有限公司 | Wafer cleaning device |
-
2018
- 2018-12-07 CN CN201811493871.6A patent/CN109637951B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005042995A (en) * | 2003-07-24 | 2005-02-17 | Toray Eng Co Ltd | Cleaning device for forming local clean area |
| CN101850505A (en) * | 2010-04-10 | 2010-10-06 | 宁波市锦泰橡塑有限公司 | Precision cutting machining method of polycarbonate material |
| CN102310063A (en) * | 2010-06-29 | 2012-01-11 | 中国科学院微电子研究所 | Honeycomb-shaped plasma free radical cleaning system |
| CN101886263A (en) * | 2010-07-15 | 2010-11-17 | 菲特晶(南京)电子有限公司 | Blowing corrosion machine and method for corrosion and cleaning |
| CN102339729A (en) * | 2010-07-22 | 2012-02-01 | 中芯国际集成电路制造(上海)有限公司 | Wafer cleaning and drying machine |
| CN102376532A (en) * | 2010-08-24 | 2012-03-14 | 武汉新芯集成电路制造有限公司 | Wafer cleaning device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109637951B (en) | 2021-02-23 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20240226 Address after: No. 50, Jinxiu Avenue, Zhitang Town, Changshu City, Suzhou City, Jiangsu Province, 215500 Patentee after: Changshu zhaoheng Zhongli Precision Machinery Co.,Ltd. Country or region after: China Address before: 215000 Shunle Road, Taiping Street, Xiangcheng District, Suzhou City, Jiangsu Province Patentee before: SUZHOU ZHAOHENG ZHONGLI PRECISION MACHINERY CO.,LTD. Country or region before: China |
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| TR01 | Transfer of patent right |