CN102310063A - Cleaning system for honeycomb-shaped plasma free radicals - Google Patents
Cleaning system for honeycomb-shaped plasma free radicals Download PDFInfo
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- CN102310063A CN102310063A CN2010102121695A CN201010212169A CN102310063A CN 102310063 A CN102310063 A CN 102310063A CN 2010102121695 A CN2010102121695 A CN 2010102121695A CN 201010212169 A CN201010212169 A CN 201010212169A CN 102310063 A CN102310063 A CN 102310063A
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Abstract
The invention relates to a cleaning system for honeycomb-shaped plasma free radicals. The cleaning system comprises a mechanical arm, a plasma generator, a rotary base and an air inlet system. The cleaning system is characterized in that: the plasma generator is fixed on the mechanical arm; the plasma generator consists of upper electrodes and a lower electrode which are mutually insulated and is positioned in a shell; the upper electrodes are installed on an insulating board and consist of a plurality of column-shaped electrodes which are wrapped by an insulating medium; the lower electrode is a metal electrode which is provided with honeycomb-shaped holes; an air inlet chamber is arranged between the upper electrodes and the lower electrode; each column electrode in the upper electrodes penetrates through the air inlet chamber and inserts into a honeycomb-shaped hole of the lower electrode to form a certain discharging gap with the honeycomb-shaped hole; the discharging gaps penetrate through the air inlet chamber; the air inlet chamber is connected with a high-pressure air source through an air conduit; and plasmas are generated in the honeycomb-shaped holes and are sprayed on the silicon chip which is placed on the surface of a rotary chassis from the honeycomb nozzles of the lower electrode under the drive of air pressure, so that the photoresist and the organic pollutants on the surface of the silicon chip are eliminated.
Description
Technical field
The present invention relates to honeycomb shape plasma free radical purging system; Especially refer to that the free radical in this system is to be produced by the poroid interior plasma discharge of honeycomb; And carry out spout through certain gas pressure; Form the beam spraying of the poroid high concentration active group of honeycomb to silicon chip, be used for photoresist on the silicon chip and organic pollutant are cleaned.
Background technology
Along with the development of large scale integrated circuit, the improving constantly of integrated level, constantly the reducing of live width, also increasingly high to the requirement that the not damaged of silicon chip cleans.In silicon transistor and integrated circuit production; Almost the per pass operation all has the problem that silicon chip cleans, and the quality that silicon chip cleans seriously influences device performance, deals with improperly; Whole silicon chips are scrapped; Can not make pipe, perhaps produced device performance is inferior, and stability and reliability are very poor.Therefore silicon chip being carried out undamaged cleaning has great significance.
Commonly used at present removes photoresist and cleaning method, by wet method and dry method dual mode.There are many shortcomings in the wet-cleaned wet-cleaned: for example: (1) can not accurately be controlled; (2) cleaning is not thorough, needs to clean repeatedly; (3) introduce new impurity easily; (4) can not handle residue; (5) contaminated environment needs waste liquid is handled; (6) consume a large amount of acid and water.In the dry method cleaning of plasma, do not use any chemical solvent, therefore have basically no pollutant, help environmental protection.In addition, its production cost is lower, cleans to have good homogeneous property and repeatability, controllability, is prone to realize producing in batches.But dry method commonly used is at present removed photoresist and cleaning equipment; Be under vacuum state; Use plasma that silicon chip surface is directly cleaned, the ion in the plasma can cause very big damage to the etching lines of silicon chip surface like this, be not applicable to 32nm and following node technology.The present invention adopts the free radical line that produces free radical under the normal pressure can remove photoresist effectively; Because the energy of free radical is the energy much smaller than the plasma intermediate ion; Therefore it can not cause the damage to silicon chip surface device lines, and cleans the replacement plasma clean with free radical, need not vacuumize; Improved production efficiency, lower production cost.
Summary of the invention
Honeycomb shape plasma free radical purging system; Comprise a manipulator, plasma generator, rotation substrate and gas handling system, it is characterized by: a plasma generator is fixed on the manipulator, and this plasma generator is in a housing, to be made up of top electrode insulated from each other and bottom electrode; This top electrode is mounted on the insulation board and by a plurality of columnar electrodes that are insulated the medium coating and constitutes; This bottom electrode is a metal electrode that is provided with honeycomb structure, is provided with an inlet air compartment between this upper/lower electrode, and each the post electrode in the top electrode is to pass inlet air compartment and be inserted in the honeycomb hole of bottom electrode; And form certain discharging gap with honeycomb hole; This discharging gap connects inlet air compartment, and this inlet air compartment is connected with high-pressure air source through gas conduit, and the plasma free radical is in the honeycomb hole gap, to produce; And under gas pressure drives, be ejected on the silicon chip that is placed on the swivel base surface by bottom electrode honeycomb spout.
Described honeycomb shape plasma free radical purging system; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: a plasma generator is fixed on the manipulator, and this manipulator drives plasma generator can realize three-dimensional moving.
Described honeycomb shape plasma free radical purging system; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: this plasma generator is in a housing, to be made up of top electrode insulated from each other and bottom electrode; This top electrode is mounted on the insulation board and by a plurality of columnar electrodes that are insulated the medium coating and constitutes, and this bottom electrode is a metal electrode that is provided with honeycomb structure.
Described honeycomb shape plasma free radical purging system; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: be provided with an inlet air compartment between this upper/lower electrode; Each post electrode in the top electrode is to pass inlet air compartment and be inserted in the honeycomb hole of bottom electrode, and forms certain discharging gap with honeycomb hole.
Described honeycomb shape plasma free radical purging system; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: each post electrode in the top electrode and the formed discharging gap of bottom electrode honeycomb hole are to connect inlet air compartment; This inlet air compartment is connected with high-pressure air source through gas conduit, and this source of the gas can be selected pure air, nitrogen, oxygen and other reacting gas for use.
Described honeycomb shape plasma free radical purging system comprises a manipulator, plasma generator, rotation substrate and gas handling system, it is characterized by: silicon chip is to be placed on the rotatable chassis, and this swivel base can be heated.
Described honeycomb shape plasma free radical purging system; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: the plasma free radical is in the honeycomb hole gap, to produce; And under gas pressure drives, be ejected on the silicon chip that is placed on the swivel base surface by bottom electrode honeycomb spout.
Described honeycomb shape plasma free radical purging system comprises a manipulator, plasma generator, rotation substrate and gas handling system, it is characterized by: what between two upper/lower electrodes, connect is a high-frequency and high-voltage power supply.
Described honeycomb shape plasma free radical purging system; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: between upper/lower electrode, be provided with the insulated enclosure material; On top electrode, be provided with a cover plate, fix with plasma generator and fix with manipulator.
Honeycomb shape plasma free radical purging system of the present invention, its advantage is: 1, adopt cellular single dielectric impedance formula discharge type, can under normal pressure, form uniform and stable discharge, and produce large tracts of land high concentration free radical.2, do not contain ion component in the free radical line that ejects, can carry out not damaged to silicon chip surface and remove photoresist and clean.3, this system need not vacuumize, and has improved production efficiency, lower production cost.
Main application of the present invention is to be used in the integrated circuit fabrication process, photoresist on the cleaning silicon chip and organic pollution.In addition, it also can be used for the organic matter cleaning of other substrate surfaces.
Figure of description
Fig. 1 Facad structure cross-sectional schematic of the present invention.
Fig. 2 stereochemical structure of the present invention is analysed and observe schematic views.
Fig. 3 electrode structure cutaway view of the present invention.
The specific embodiment
See also Fig. 1, Fig. 2 and Fig. 3, the cellular atmospheric plasma free radical of the present invention cleaning equipment comprises a manipulator 101, and this manipulator 101 drives plasma generator through connector 306 and realizes three-dimensional moving; This plasma generator is to be connected on the housing 305; Be provided with in this plasma generator by top electrode 303 and bottom electrode 103; This top electrode 303 is mounted on the insulation board 302 and by lead 109 and connects as one; This bottom electrode 103 is metal electrodes that are provided with a plurality of honeycomb structures, is provided with an inlet air compartment 110 between this upper/lower electrode.
A plurality of top electrodes 303 are to be fixed on the insulating materials 302, are to coat a quartz glass tube 301, a plurality of electrode 303 apart certain distances around each electrode; A plurality of top electrodes 303 are to pass inlet air compartment 110 and be inserted in a plurality of honeycomb holes of bottom electrode 103; And form certain discharging gap 108 with honeycomb hole; This discharging gap 108 connects inlet air compartment 110, and this inlet air compartment is connected with high-pressure air source 102 through air inlet 201, gas conduit 202, gas pressure reducer 203, and the free radical 304 in the plasma is in honeycomb hole gap 108, to produce; And under gas pressure drives, by the honeycombed spout ejection of bottom electrode 103.
Silicon chip is 105 to be to be placed in the rotatable substrate 106, and this substrate 106 is can be heated.The free radical 304 of ejection ground electrode 103 honeycomb spouts arrives on the photoresist 104 of silicon chip 105, and it is cleaned.
A high frequency electric source 107 is connected with bottom electrode 103 respectively at top electrode 303, and source of the gas 102 can adopt air, nitrogen, argon gas or oxygen.This top electrode 303 is to be processed by Metallic rod, and bottom electrode 301, substrate 106, housing 305 are to be processed by metal material, and insulating materials 302 is to be processed by polytetrafluoroethylmaterial material.
Invention has been described to combine concrete embodiment with reference to accompanying drawing above; Yet; Need to prove, for a person skilled in the art, under the situation that does not break away from the spirit and scope of the present invention; Can make many changes and modification to the foregoing description, these changes and modification all drop in the scope thereof of the present invention.
Claims (9)
1. honeycomb shape plasma free radical purging system; Comprise a manipulator, plasma generator, rotation substrate and gas handling system, it is characterized by: a plasma generator is fixed on the manipulator, and this plasma generator is in a housing, to be made up of top electrode insulated from each other and bottom electrode; This top electrode is mounted on the insulation board and by a plurality of columnar electrodes that are insulated the medium coating and constitutes; This bottom electrode is a metal electrode that is provided with honeycomb structure, is provided with an inlet air compartment between this upper/lower electrode, and each the post electrode in the top electrode is to pass inlet air compartment and be inserted in the honeycomb hole of bottom electrode; And form certain discharging gap with honeycomb hole; This discharging gap connects inlet air compartment, and this inlet air compartment is connected with high-pressure air source through gas conduit, and the plasma free radical is in the honeycomb hole gap, to produce; And under gas pressure drives, be ejected on the silicon chip that is placed on the swivel base surface by bottom electrode honeycomb spout.
2. honeycomb shape plasma free radical purging system as claimed in claim 1; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: a plasma generator is fixed on the manipulator, and this manipulator drives plasma generator can realize three-dimensional moving.
3. honeycomb shape plasma free radical purging system as claimed in claim 1; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: this plasma generator is in a housing, to be made up of top electrode insulated from each other and bottom electrode; This top electrode is mounted on the insulation board and by a plurality of columnar electrodes that are insulated the medium coating and constitutes, and this bottom electrode is a metal electrode that is provided with honeycomb structure.
4. honeycomb shape plasma free radical purging system as claimed in claim 1; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: be provided with an inlet air compartment between this upper/lower electrode; Each post electrode in the top electrode is to pass inlet air compartment and be inserted in the honeycomb hole of bottom electrode, and forms certain discharging gap with honeycomb hole.
5. like claim 1 and 4 described honeycomb shape plasma free radical purging systems; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: each post electrode in the top electrode and the formed discharging gap of bottom electrode honeycomb hole are to connect inlet air compartment; This inlet air compartment is connected with high-pressure air source through gas conduit, and this source of the gas can be selected pure air, nitrogen, oxygen and other reacting gas for use.
6. honeycomb shape plasma free radical purging system as claimed in claim 1; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: silicon chip is to be placed on the rotatable chassis, and this swivel base can be heated.
7. honeycomb shape plasma free radical purging system as claimed in claim 1; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: the plasma free radical is in the honeycomb hole gap, to produce; And under gas pressure drives, be ejected on the silicon chip that is placed on the swivel base surface by bottom electrode honeycomb spout.
8. honeycomb shape plasma free radical purging system as claimed in claim 1 comprises a manipulator, plasma generator, rotation substrate and gas handling system, it is characterized by: what between two upper/lower electrodes, connect is a high-frequency and high-voltage power supply.
9. honeycomb shape plasma free radical purging system as claimed in claim 1; Comprise a manipulator, plasma generator, rotation substrate and gas handling system; It is characterized by: between upper/lower electrode, be provided with the insulated enclosure material; On top electrode, be provided with a cover plate, fix with plasma generator and fix with manipulator.
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2013149482A1 (en) * | 2012-04-05 | 2013-10-10 | 中国科学院微电子研究所 | New normal-pressure dual radio frequency electrode plasma free radical cleaning spray gun |
WO2013149481A1 (en) * | 2012-04-05 | 2013-10-10 | 中国科学院微电子研究所 | Atmospheric-pressure plasma free radical cleaning system |
CN103695839A (en) * | 2013-12-07 | 2014-04-02 | 深圳市金凯新瑞光电有限公司 | Ion source cleaning device applied to coating equipment |
CN104244558A (en) * | 2014-09-02 | 2014-12-24 | 大连民族学院 | Atmospheric pressure low-temperature plasma generation device and application thereof |
CN104525525A (en) * | 2014-12-23 | 2015-04-22 | 中国电子科技集团公司第二研究所 | Diamond powder purifying bin at vacuum environment |
CN105517311A (en) * | 2016-02-24 | 2016-04-20 | 常州大恒环保科技有限公司 | Dielectric barrier discharge plasma generation device and dielectric barrier discharge plasma generation method |
CN109637951A (en) * | 2018-12-07 | 2019-04-16 | 苏州市兆恒众力精密机械有限公司 | A kind of product and its destressing processing method for cleaning wafer |
CN110461080A (en) * | 2019-08-08 | 2019-11-15 | 北京工商大学 | A kind of low temperature plasma generating device and its method for preparing activated water |
CN110876223A (en) * | 2018-08-29 | 2020-03-10 | 中国石油化工股份有限公司 | Plasma generator |
CN111617716A (en) * | 2020-06-09 | 2020-09-04 | 常州大学 | Metal honeycomb type plasma discharge reactor |
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Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2013149482A1 (en) * | 2012-04-05 | 2013-10-10 | 中国科学院微电子研究所 | New normal-pressure dual radio frequency electrode plasma free radical cleaning spray gun |
WO2013149481A1 (en) * | 2012-04-05 | 2013-10-10 | 中国科学院微电子研究所 | Atmospheric-pressure plasma free radical cleaning system |
CN103695839A (en) * | 2013-12-07 | 2014-04-02 | 深圳市金凯新瑞光电有限公司 | Ion source cleaning device applied to coating equipment |
CN104244558A (en) * | 2014-09-02 | 2014-12-24 | 大连民族学院 | Atmospheric pressure low-temperature plasma generation device and application thereof |
CN104525525A (en) * | 2014-12-23 | 2015-04-22 | 中国电子科技集团公司第二研究所 | Diamond powder purifying bin at vacuum environment |
CN105517311A (en) * | 2016-02-24 | 2016-04-20 | 常州大恒环保科技有限公司 | Dielectric barrier discharge plasma generation device and dielectric barrier discharge plasma generation method |
CN105517311B (en) * | 2016-02-24 | 2018-04-20 | 常州大恒环保科技有限公司 | A kind of dielectric barrier discharge plasma generation device and method |
CN110876223A (en) * | 2018-08-29 | 2020-03-10 | 中国石油化工股份有限公司 | Plasma generator |
CN109637951A (en) * | 2018-12-07 | 2019-04-16 | 苏州市兆恒众力精密机械有限公司 | A kind of product and its destressing processing method for cleaning wafer |
CN110461080A (en) * | 2019-08-08 | 2019-11-15 | 北京工商大学 | A kind of low temperature plasma generating device and its method for preparing activated water |
CN111617716A (en) * | 2020-06-09 | 2020-09-04 | 常州大学 | Metal honeycomb type plasma discharge reactor |
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Application publication date: 20120111 |