CN108818987A - Chip cutting cleaning equipment - Google Patents
Chip cutting cleaning equipment Download PDFInfo
- Publication number
- CN108818987A CN108818987A CN201810969520.1A CN201810969520A CN108818987A CN 108818987 A CN108818987 A CN 108818987A CN 201810969520 A CN201810969520 A CN 201810969520A CN 108818987 A CN108818987 A CN 108818987A
- Authority
- CN
- China
- Prior art keywords
- wafer
- clip
- detection
- cutting
- sprocket wheel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to chip manufacture fields, more particularly to chip cutting cleaning equipment, including cutting mechanism and wiper mechanism, wiper mechanism includes the cleaning disk being vertically arranged, and cleans in the middle part of disk the clip being rotatably connected to for clamping wafer, and cleaning disk is equipped with the sliding slot of annular, clip is located at the center point of sliding slot, spray head is slidably connected on sliding slot, connecting rod is connected between clip and spray head, and the first motor for driving clip to rotate is connected on clip.This programme improves cleaning efficiency of the wafer in cutting process.
Description
Technical field
The present invention relates to chip manufacture field more particularly to chip cutting cleaning equipments.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer.
Wafer needs to cut the surface of wafer in process, so that the surface of wafer is cut into several single cores
Piece, and in cutting process, the surface of wafer forms cutting groove.
In the prior art, wafer is needed to cut the clast generated to wafer and be cleaned in cutting process, still, by
It is smaller in the particle of clast, it easily adheres in the cutting groove on wafer, therefore the cleaning of clast is relatively difficult, the cleaning of clast
Efficiency is lower.Also, current wafer cutting device is numerically-controlled machine tool mostly, for medium-sized and small enterprises, numerically-controlled machine tool
Purchase cost is higher.
Summary of the invention
The purpose of the present invention is to provide chip cutting cleaning equipments, to improve cleaning effect of the wafer in cutting process
Rate.
In order to achieve the above objectives, the technical scheme is that：Chip cutting cleaning equipment, including cutting mechanism and cleaning
Mechanism, wiper mechanism include the cleaning disk being vertically arranged, and clean in the middle part of disk the clip being rotatably connected to for clamping wafer, clearly
Dishwashing is equipped with the sliding slot of annular, and clip is located at the center point of sliding slot, spray head is slidably connected on sliding slot, between clip and spray head
It is connected with connecting rod, the first motor for driving clip to rotate is connected on clip.
The working principle of this programme is：Cutting mechanism is for cutting the surface of wafer.Wiper mechanism is used for cutting
Wafer after cutting is cleaned.When being cleaned to wafer, wafer is fixed on clip.Spray head sprays water to wafer
Cut surface is cleaned.Meanwhile first motor, for driving clip high-speed rotation, clip drives wafer high-speed rotation, to make
Clast on the surface of wafer is thrown away under the action of the centrifugal, improves the cleaning effect of clast.Sliding slot is for cleaning spray head
It is slided on disk.Due to being connected with connecting rod between spray head and clip, therefore when clip rotation, clip drives spray head in sliding slot by connecting rod
Interior rotation guarantees that spray head with the cut surface face of wafer, sprays spray head always to make spray head that wafer be followed to rotate together
Water is all sprayed on the cut surface of wafer, and what the water for preventing spray head from spraying was sprayed onto wafer causes the waste of water elsewhere.
When by adopting the above technical scheme, have the advantages that：1, in the process of cleaning, clip drives wafer high to wafer
Speed rotation, so that the clast on wafer be made to be thrown away at a high speed under the action of the centrifugal, reduces the adhesion strength that clast is sticked on wafer,
It prevents clast to be sticked on the cut surface of wafer, conducive to the cleaning of clast, improves the cleaning efficiency of clast.2, due to spray head and crystalline substance
Circle rotates together, therefore wafer is during rotation, the cut surface of spray head and wafer face always, to guarantee the water that spray head sprays
It is all sprayed on the cut surface of wafer, prevents the water sprayed to be sprayed onto other positions of wafer, improve the utilization rate of water, save
Use water.3, this device structure it is simple, without using Numeric Control Technology, for medium-sized and small enterprises, purchase cost is lower.
Further, cutting mechanism includes two opposite detection blocks, and two detection blocks are equipped with detection on opposite side
Bar, detection block are respectively connected with pressure spring far from the side of detection bar, and the top of detection block is rotatably connected to the first sprocket wheel, detection block
Top be rotatably connected to oscillating rod, two ends of the oscillating rod far from detection block are mutually rotatablely connected, and two oscillating rods turn
It is rotatably connected to the second sprocket wheel on the position of dynamic connection, chain is connected on the first sprocket wheel and the second sprocket wheel, chain is equipped with and cuts
Cutting mill is connected with the cutter being vertically arranged on cutting machine；The second motor is connected on first sprocket wheel.Second motor is for driving
The rotation of first sprocket wheel, when the first sprocket wheel rotates, the first sprocket wheel drives chain to be driven on the first sprocket wheel and the second sprocket wheel.Due to cutting
Cutting mill is located on chain, therefore chain is in transmission process, to drive cutting machine mobile, cutting machine to the different parts of wafer into
Row cutting.Detection bar to by the wafer between two detection blocks for clamping, and pressure spring is for having two detection blocks
Trend close to each other, therefore when wafer between two detection blocks from when passing through, two detection blocks clamp wafer according to detection bar
Width and adaptability opens a certain distance.During wafer is by between two detection blocks, when the wider portion of wafer
When the detected bar cramp in position is held, the distance between two detection blocks become larger, and two detection blocks are located remotely from each other, and two detection blocks pull pendulum
Lever, so that making the height of the second sprocket wheel reduces, and distance becomes larger between two the first sprocket wheels at this time, therefore the height of the second sprocket wheel
Degree between two the first sprocket wheels distance become larger and reduce, the length that chain is located at below the second sprocket wheel becomes larger,
And then the moving distance of cutting machine is made to become larger, the wider position of wafer can be cut.Similarly, the relatively narrow position quilt of wafer
When detection bar clamps, the distance between two detection blocks become smaller, and two detection blocks are close to each other, and two detection blocks squeeze pendulum jointly
Lever, so that the height of the second sprocket wheel is increased, and distance becomes smaller between two the first sprocket wheels at this time, therefore the height of the second sprocket wheel
Degree becomes smaller and increases with the distance between two the first sprocket wheels, so that chain be in tensioned state, makes chain positioned at second
Length below sprocket wheel can become smaller, and then the moving distance of cutting machine is made to become smaller, can the position relatively narrow to wafer cut
It cuts.To sum up, by the automatic variation of the height of the second sprocket wheel, so that chain can be fitted in the case where total length is constant
The variation of distance between two the first sprocket wheels is answered, and then the length for enabling chain to be located at below the second sprocket wheel follows two first
The distance change of sprocket wheel and adjust, adapt to wafer different in width position cutting, prevent cutting machine to the lesser portion of wafer width
Cutting machine idle running or cutting machine can not will be brilliant when preventing cutting machine from cutting to the biggish position of wafer width when the cutting of position
It all cuts in place at the biggish position of circle width.Also, this cutting mechanism also accommodates the wafer of different-diameter, to improve
The practicability of this equipment.
Further, the shape of spray head is strip.The range of spray head water spray can be improved in the spray head of strip, sprays conducive to by water
Onto the entire cut surface of wafer.
It further, further include mobile mechanism, mobile mechanism includes lead screw, and threads of lead screw is connected with movable block, on movable block
It is connected with support rod, sucker is connected on support rod, the end of lead screw is connected with spur gear, is intermittently engaged with sector on spur gear
Gear is connected with third motor on sector gear.Sucker is for fixing wafer.Third motor is used to that sector gear to be driven to rotate,
Interval is engaged with spur gear in sector gear rotation process, and spur gear interval drives lead screw rotation, and lead screw interval drives movable block
Mobile, movable block is mobile by support rod and sucker interval drive wafer, so that wafer is certainly after so that cutter is completed primary cutting
Dynamic movement, makes other positions of wafer be moved to the lower section of cutter, cuts cutter at other positions of wafer.
Further, pressing plate is connected between two detection blocks, pressing plate is equipped with lateral cutter groove.Pressing plate is used for below
Wafer consolidated.Cutter groove is for passing through cutter, convenient for cutting to wafer.
Further, pressure spring is respectively connected with briquetting far from one end of detection block.Briquetting is used to provide tie point to pressure spring.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of chip cutting cleaning equipment；
Fig. 2 is detection block in Fig. 1, the top view for cleaning disk；
Fig. 3 is the forward structure schematic diagram for cleaning disk.
Specific embodiment
It is further described below by specific embodiment：
Appended drawing reference in Figure of description includes：Briquetting 1, pressure spring 2, detection block 3, the first sprocket wheel 4, oscillating rod 5, second
Sprocket wheel 6, chain 7, cutting machine 8, cutter 9, spray head 10, connecting rod 11, pressing plate 12, detection bar 13, sucker 14, movable block 15, silk
Thick stick 16, sliding slot 17, clip 18, cleaning disk 19.
Embodiment is basic as shown in attached drawing 1- Fig. 3：Chip cutting cleaning equipment, including rack, rack are equipped with cutting machine
Structure, wiper mechanism and mobile mechanism, referring to figs. 1 and 2, the rear that the A in the present embodiment refers to, the front that B refers to.Clearly
Washing machine structure is located at the rear of cutting mechanism, and mobile mechanism is located at the lower section of cutting mechanism.
In conjunction with shown in Fig. 1-Fig. 3, wiper mechanism includes the cleaning disk 19 being vertically arranged, and cleaning disk 19 welds on the rack,
The middle part for cleaning disk 19 is rotatably connected to the clip 18 for clamping wafer by bearing, and cleaning disk 19 is equipped with the sliding slot of annular
17, clip 18 is located at the center point of sliding slot 17, and spray head 10 is slidably connected on sliding slot 17, and the shape of spray head 10 is strip, folder
It is connected with connecting rod 11 between son 18 and spray head 10, the first motor for driving clip 18 to rotate is connected on clip 18 (in figure
It is not shown), first motor is mounted on the rear of cleaning disk 19.
In conjunction with shown in Fig. 1-Fig. 2, cutting mechanism includes two opposite detection blocks 3, and the bottom end of two detection blocks 3 is lateral
It is slidably connected on the rack, is welded with the briquetting 1 for being located at two 3 two sides of detection block in rack, two briquettings 1 are respectively with two
Pressure spring 2 is connected between a detection block 3.Pressing plate 12 is welded between two detection blocks 3, pressing plate 12 is equipped with lateral cutter groove.
Two detection blocks 3 are welded with detection bar 13 on opposite side.The top of two detection blocks 3 is rotatably connected to by bearing
First sprocket wheel 4, the top of detection block 3 pass through pin shaft and are rotatably connected to oscillating rod 5, and the top of two oscillating rods 5 is also by pin
Axis is rotatablely connected, and is rotatably connected to the second sprocket wheel 6, the first sprocket wheel 4 and the second sprocket wheel 6 on the position on the top of two oscillating rods 5
On be connected with chain 7.Cutting machine 8 is equipped with by screw on a chain link on chain 7, the bottom of cutting machine 8 is connected with perpendicular
The cutter 9 being directly arranged, cutter 9 may pass through cutter groove and contact with the upper surface of wafer, so that the upper surface to wafer is cut
It cuts.The the second motor (not shown) for driving the first sprocket wheel 4 to rotate is installed at the top of detection block 3.
Mobile mechanism includes the lead screw 16 positioned at 12 lower section of pressing plate, and lead screw 16 is threaded with movable block 15, movable block 15
It can move along rack is forward and backward.It is welded with support rod on movable block 15, sucker 14 is connected on support rod.
Specific implementation process is as follows：Wafer to be cut is placed on sucker 14, sucker 14 will be brilliant under the action of suction
Circle is sucked.Interval drives lead screw 16 to rotate, and the concrete mode of 16 intermittent rotary of lead screw is in the present embodiment：The front end of lead screw 16
It is welded with spur gear (not shown), sector gear (not shown) is intermittently engaged on spur gear, is equipped in rack
The third motor (not shown) for driving sector gear to rotate starts third motor, and third motor drives sector gear rotation,
The rotation of sector gear turn spur intermittence, spur gear drive the intermittent rotation of lead screw 16.When 16 intermittent rotary of lead screw, lead screw
16 drive movable block 15 intermittent mobile from front direction rear, and movable block 15 drives wafer intermittent by support rod and sucker 14
It is mobile from front direction rear, the wafer lower section that gradually intermittence passes through pressing plate 12.Start the second motor simultaneously, the second motor drives
The rotation of first sprocket wheel 4, the first sprocket wheel 4 drive chain 7 to transmit on the first sprocket wheel 4 and the second sprocket wheel 6.Chain 7 drives cutting machine 8
It moves together, when the cutter 9 of cutting machine 8 are moved in the cutter groove on pressing plate 12, cutter 9 carry out the upper surface of wafer
Cutting.
Since wafer is circular, therefore wafer interval is when gradually passing through between two detection blocks 3, two detection bars 13 by
Wafer circumference side offsets and is first located remotely from each other, when the distance of two detection bars 13 increases to the diameter of wafer, two
The distance of a detection bar 13 gradually becomes smaller again.
When circumference side when offseting and being gradually distance from of two detection bars 13 by wafer, two detection blocks 3 are mutually remote
From two detection blocks 3 can squeeze pressure spring 2, and the distance between two first sprocket wheels 4 become larger.Meanwhile the top of two detection blocks 3
Oscillating rod 5 can be pulled to two sides, reduce the height of the second sprocket wheel 6 on 5 top of oscillating rod.Due to the height of the second sprocket wheel 6
Reduction, so that chain 7 be enable to fluff, the distance for adapting to two the first sprocket wheels 4 is elongated.Due between two the first sprocket wheels 4
Distance it is elongated, therefore chain 7 is located at the length between two the first sprocket wheels 4, and the distance of 8 transverse shifting of cutting machine is elongated,
To enable cutter 9 to follow the movement of wafer, and the track cut on wafer is elongated, guarantees that wafer is located under pressing plate 12
When the position of side broadens, cutter 9 remain to for wafer being located at the position whole transverse cuts below pressing plate 12 in place.
When circumference side when offseting and moving closer to of two detection bars 13 by wafer, two detection blocks 3 are in pressure spring 2
Elastic force under it is close to each other, the distance between two first sprocket wheels 4 become smaller.Meanwhile the top of two detection blocks 3 can be jointly in
Between squeeze oscillating rod 5, so that the height of the second sprocket wheel 6 on 5 top of oscillating rod is become larger.Since the height of second sprocket wheel 6 becomes larger,
To enable chain 7 to become tightly, the distance for adapting to two the first sprocket wheels 4 shortens.Since the distance between two first sprocket wheels 4 become
It is short, therefore the length that chain 7 is located between two the first sprocket wheels 4 becomes smaller, the distance of 8 transverse shifting of cutting machine becomes smaller, to make to cut
Cutter 9 can follow the movement of wafer, and when the position for guaranteeing that wafer is located at below pressing plate 12 narrows, 9 transverse shifting of cutter is cut
It cuts track also to shorten, prevents 9 transverse shifting track of cutter excessive and make the unloaded cutting of cutter 9.
After the upper surface of wafer is cut, wafer is moved to the position of the clip 18 of cleaning disk 19.Manually make crystalline substance
Circle is separated with sucker 14, and clamps clip 18 by wafer.Spray head 10 is opened, spray head 10 sprays water, on wafer cut surface
Clast is cleaned.Meanwhile starting first motor, first motor drives clip 18 to rotate, and clip 18 drives wafer high-speed rotation,
So that the clast on wafer is thrown away under the influence of centrifugal force.In 18 rotation process of clip, clip 18 is driven by connecting rod 11
Spray head 10 does ring-shaped slide in sliding slot 17, to make spray head 10 that wafer be followed to rotate together, spray head 10 is cut with wafer always
Face is opposite, and the water that ensure that spray head 10 sprays all is sprayed on the cut surface of wafer.
What has been described above is only a preferred embodiment of the present invention, it is noted that for those skilled in the art,
Without departing from the inventive concept of the premise, several modifications and improvements can also be made, these also should be considered as guarantor of the invention
Range is protected, these all will not influence the effect and patent practicability that the present invention is implemented.The present invention omits the technology of description, shape
Shape, construction portion are well-known technique.
Claims (6)
1. chip cutting cleaning equipment, including cutting mechanism and wiper mechanism, it is characterised in that：The wiper mechanism includes vertical
The cleaning disk of setting, described to clean the clip being rotatably connected in the middle part of disk for clamping wafer, cleaning disk is equipped with annular
Sliding slot, clip are located at the center point of sliding slot, spray head are slidably connected on the sliding slot, is connected between the clip and spray head
Bar is connected with the first motor for driving clip to rotate on clip.
2. chip cutting cleaning equipment according to claim 1, it is characterised in that：The cutting mechanism includes two opposite
Detection block, two detection blocks are equipped with detection bar on opposite side, and the detection block is all connected with far from the side of detection bar
There is pressure spring, the top of detection block is rotatably connected to the first sprocket wheel, and the top of detection block is rotatably connected to oscillating rod, two pendulum
End of the lever far from detection block is mutually rotatablely connected, and is rotatably connected to the second chain on the position of two oscillating rods rotation connection
It takes turns, chain is connected on first sprocket wheel and the second sprocket wheel, the chain is equipped with cutting machine, and it is vertical to be connected on cutting machine
The cutter of setting；The second motor is connected on first sprocket wheel.
3. chip cutting cleaning equipment according to claim 2, it is characterised in that：The shape of the spray head is strip.
4. chip cutting cleaning equipment according to claim 2, it is characterised in that：It further include mobile mechanism, the movement
Mechanism includes lead screw, and the threads of lead screw is connected with movable block, and support rod is connected on movable block, is connected on the support rod
Sucker, the end of the lead screw are connected with spur gear, and sector gear is intermittently engaged on spur gear, and is connected on sector gear
Three motors.
5. chip cutting cleaning equipment according to claim 4, it is characterised in that：Pressure is connected between two detection blocks
Plate, the pressing plate are equipped with lateral cutter groove.
6. chip cutting cleaning equipment according to claim 5, it is characterised in that：The one end of the pressure spring far from detection block
It is respectively connected with briquetting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810969520.1A CN108818987A (en) | 2018-08-23 | 2018-08-23 | Chip cutting cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810969520.1A CN108818987A (en) | 2018-08-23 | 2018-08-23 | Chip cutting cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108818987A true CN108818987A (en) | 2018-11-16 |
Family
ID=64151390
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810969520.1A Pending CN108818987A (en) | 2018-08-23 | 2018-08-23 | Chip cutting cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108818987A (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004281429A (en) * | 2003-03-12 | 2004-10-07 | Shimada Phys & Chem Ind Co Ltd | Wet cleaning device and nozzle used therefor |
| CN102463227A (en) * | 2010-11-03 | 2012-05-23 | 北京中电科电子装备有限公司 | Cleaning device and cleaning method |
| CN202224393U (en) * | 2011-09-28 | 2012-05-23 | 中芯国际集成电路制造(上海)有限公司 | Device for cleaning back surface of wafer |
| KR20140038772A (en) * | 2012-09-21 | 2014-03-31 | 청진테크 주식회사 | Cleaning apparatus |
| KR20150121473A (en) * | 2014-04-21 | 2015-10-29 | 주식회사 케이씨텍 | Distribution part and cleaning apparatus for substrate having the same |
| CN105762094A (en) * | 2014-12-19 | 2016-07-13 | 沈阳芯源微电子设备有限公司 | Device for clamping edge of wafer during automatic wafer cleaning process and clamping method of device |
| CN205488060U (en) * | 2016-03-04 | 2016-08-17 | 和舰科技(苏州)有限公司 | Wafer cleaning device |
| CN106256016A (en) * | 2014-04-18 | 2016-12-21 | 株式会社荏原制作所 | Substrate board treatment, base plate processing system and substrate processing method using same |
| CN107305854A (en) * | 2016-04-22 | 2017-10-31 | 盛美半导体设备（上海）有限公司 | A kind of ic substrate cleaning equipment |
| CN107393846A (en) * | 2016-05-09 | 2017-11-24 | 株式会社荏原制作所 | Base plate cleaning device |
| CN207357652U (en) * | 2017-06-27 | 2018-05-15 | 盐城市宁润玻璃制品有限公司 | A kind of glassware cleaning device |
| CN108193216A (en) * | 2017-12-28 | 2018-06-22 | 黄健 | A kind of air-conditioning production appearance steel plate degreasing plant |
| CN108288594A (en) * | 2017-12-29 | 2018-07-17 | 通富微电子股份有限公司 | A kind of cleaning device of flip-chip |
-
2018
- 2018-08-23 CN CN201810969520.1A patent/CN108818987A/en active Pending
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004281429A (en) * | 2003-03-12 | 2004-10-07 | Shimada Phys & Chem Ind Co Ltd | Wet cleaning device and nozzle used therefor |
| CN102463227A (en) * | 2010-11-03 | 2012-05-23 | 北京中电科电子装备有限公司 | Cleaning device and cleaning method |
| CN202224393U (en) * | 2011-09-28 | 2012-05-23 | 中芯国际集成电路制造(上海)有限公司 | Device for cleaning back surface of wafer |
| KR20140038772A (en) * | 2012-09-21 | 2014-03-31 | 청진테크 주식회사 | Cleaning apparatus |
| CN106256016A (en) * | 2014-04-18 | 2016-12-21 | 株式会社荏原制作所 | Substrate board treatment, base plate processing system and substrate processing method using same |
| KR20150121473A (en) * | 2014-04-21 | 2015-10-29 | 주식회사 케이씨텍 | Distribution part and cleaning apparatus for substrate having the same |
| CN105762094A (en) * | 2014-12-19 | 2016-07-13 | 沈阳芯源微电子设备有限公司 | Device for clamping edge of wafer during automatic wafer cleaning process and clamping method of device |
| CN205488060U (en) * | 2016-03-04 | 2016-08-17 | 和舰科技(苏州)有限公司 | Wafer cleaning device |
| CN107305854A (en) * | 2016-04-22 | 2017-10-31 | 盛美半导体设备（上海）有限公司 | A kind of ic substrate cleaning equipment |
| CN107393846A (en) * | 2016-05-09 | 2017-11-24 | 株式会社荏原制作所 | Base plate cleaning device |
| CN207357652U (en) * | 2017-06-27 | 2018-05-15 | 盐城市宁润玻璃制品有限公司 | A kind of glassware cleaning device |
| CN108193216A (en) * | 2017-12-28 | 2018-06-22 | 黄健 | A kind of air-conditioning production appearance steel plate degreasing plant |
| CN108288594A (en) * | 2017-12-29 | 2018-07-17 | 通富微电子股份有限公司 | A kind of cleaning device of flip-chip |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105436037A (en) | Needle glue removing mechanism and dispenser | |
| CN100542744C (en) | Large scale liquid crystal glass edge grinding machine | |
| CN210995411U (en) | Clean working head mechanism | |
| CN111634620A (en) | Blanking conveying device | |
| CN111085601A (en) | Copper basin auxiliary antique-finish equipment | |
| CN205380027U (en) | Syringe needle gel resin mechanism and point gum machine | |
| CN209935098U (en) | Cleaning mechanism for dispensing needle head | |
| CN108818987A (en) | Chip cutting cleaning equipment | |
| CN209936474U (en) | Machine tool with cleaning function | |
| CN210701313U (en) | Residual glue removing device | |
| CN109168272B (en) | Counterpoint paster auxiliary device of PCB board | |
| CN115255559B (en) | Automatic welding platform for preventing slag inclusion of mechanical parts | |
| CN107150149B (en) | A kind of band saw bed system | |
| CN110625484B (en) | Xiuyan jade polishing equipment capable of automatically replacing abrasive paper | |
| CN209793381U (en) | Cleaning device for preparing environment-friendly crystal glass | |
| CN108160547A (en) | The full-automatic assembling line of micromotor rotor | |
| CN209772821U (en) | Guide wheel cleaning device | |
| CN220236796U (en) | Cleaning device for cleaning building wall | |
| CN113305724A (en) | Polishing treatment device for hardware processing | |
| CN112144065A (en) | Industrial cleaning equipment and cleaning method | |
| CN218191183U (en) | Outlet welding slag cleaner for assembly welding and straightening all-in-one machine | |
| CN112122996A (en) | Automatic chip removal metal cutting machine tool | |
| CN111002952A (en) | Railway locomotive cleaning equipment | |
| CN215800246U (en) | Belt tensioning mechanism of large circular knitting machine | |
| CN208262531U (en) | A kind of grinding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181116 |
|
| RJ01 | Rejection of invention patent application after publication |