CN108288594A - A kind of cleaning device of flip-chip - Google Patents

A kind of cleaning device of flip-chip Download PDF

Info

Publication number
CN108288594A
CN108288594A CN201711498818.0A CN201711498818A CN108288594A CN 108288594 A CN108288594 A CN 108288594A CN 201711498818 A CN201711498818 A CN 201711498818A CN 108288594 A CN108288594 A CN 108288594A
Authority
CN
China
Prior art keywords
chip
flip
cleaning device
turntable
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711498818.0A
Other languages
Chinese (zh)
Inventor
卢海伦
周锋
施陈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tongfu Microelectronics Co Ltd
Original Assignee
Tongfu Microelectronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tongfu Microelectronics Co Ltd filed Critical Tongfu Microelectronics Co Ltd
Priority to CN201711498818.0A priority Critical patent/CN108288594A/en
Publication of CN108288594A publication Critical patent/CN108288594A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67028Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

The invention discloses a kind of cleaning device of flip-chip, which includes:Turntable for placing flip-chip to be cleaned, and drives the flip-chip rotation;Part is sprayed, for the flip-chip spraying cleaning liquid being placed on the turntable, to rinse and remove the scaling powder of the flip-chip.By the above-mentioned means, the present invention can fast and effectively remove remaining scaling powder between chip and substrate.

Description

A kind of cleaning device of flip-chip
Technical field
The present invention relates to chip technology fields, more particularly to a kind of cleaning device of flip-chip.
Background technology
In flip chip mounting process, in chip attachment to substrate before, need to dip scaling powder, in chip re-flow process In, most scaling powder can volatilize at high temperature, but also have part scaling powder and can remain between chip and substrate.If Will not remain between chip and substrate flux cleaning removal, will have a direct impact on product quality and product it is reliable Property.Therefore, the flux cleaning step after chip re-flow welding is most important.
In traditional handicraft, scaling powder is cleaned by the way of mesh belt transmission.Please refer to Fig. 1, conventional clean Mode includes the following steps:First, the flip-chip 1 being placed on transporting reticulation belt 5 is sent to spray region 2, to pass through water Stream takes away remaining scaling powder;Later, flip-chip 1 is transmitted to air-dried region 3, with by high-pressure blast by flip-chip 1 The water on surface dispels;Finally, flip-chip 1 is transmitted to drying area 4, upside-down mounting core will be remained in a manner of by heat radiation Droplet drying on piece 1 evaporates.
Present inventor has found that traditional handicraft removes the remaining scaling powder of flip-chip in long-term R&D process In mode, required equipment volume is huge, and it is big to occupy big quantity space, the water of equipment, consumption of electric energy, so that production cost is high; In addition, air-dry, drying effect it is poor so that product in have water quality residual.
Invention content
The present invention provides a kind of cleaning device of flip-chip, and it is huge can to solve equipment volume needed in the art Greatly, it is big that big quantity space, the water of equipment, consumption of electric energy can be occupied, so that production cost is high;In addition, air-dry, drying effect it is poor, with To there is the technical issues of water quality residual in product.
In order to solve the above technical problems, one aspect of the present invention is:A kind of cleaning of flip-chip is provided Device, including:
Turntable for placing flip-chip to be cleaned, and drives the flip-chip rotation;
Part is sprayed, for the flip-chip spraying cleaning liquid being placed on the turntable, to rinse and remove The scaling powder of the flip-chip.
Wherein, the cleaning device further comprises:
Part is dried, for air-drying the flip-chip after cleaning.
Wherein, the drying part is air knife, to form the flip-chip after air curtain air-dries cleaning.
Wherein, the gas that the air knife sprays is nitrogen.
Wherein, the direction for the air curtain that the air knife is formed forms an inclination angle with the direction of rotation of the turntable.
Wherein, the drying part is arranged with the spray part parallel interval, is fixedly installed on the top of the turntable.
Wherein, the cleaning device further comprises solenoid valve, for controlling the spray part or/and the drying part It opens and closes.
Wherein, multiple nozzles are offered on the spray part so that the cleaning solution by the nozzle to the upside-down mounting Chip is washed away.
Wherein, rotation side of the water of the ejection of the spray part in the flow direction of the turntable and the flip-chip To identical or opposite.
Wherein, the rotational velocity range of the turntable is 30-120r/min.
The beneficial effects of the invention are as follows:It is different from the prior art, the cleaning device of flip-chip provided by the invention includes: Turntable for placing flip-chip to be cleaned, and drives flip-chip rotation;Part is sprayed, for being placed on turntable On flip-chip spraying cleaning liquid, to rinse and remove the scaling powder of flip-chip.By the way that flip-chip is positioned over rotation On platform, and as turntable rotates, in cleaning process, it is sprayed onto cleaning solution on flip-chip under the influence of centrifugal force, Remaining scaling powder between chip and substrate is fast and effectively taken away, in addition, used turntable, spray part and drying Part it is small, shared area is also small, and low energy consumption, and noise is small so that the cleaning device can be widely used in various lifes In producing line.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings Attached drawing.Wherein:
Fig. 1 is the cleaning way flowage structure schematic diagram of prior art flip-chip;
Fig. 2 is the schematic top plan view of one embodiment of cleaning device of the present invention;
Fig. 3 is the structural schematic diagram after flip-chip cleaning;
Fig. 4 is the structural schematic diagram before flip-chip cleaning;
Fig. 5 is the structural schematic diagram in cleaning device cleaning process of the present invention;
Fig. 6 is the structural schematic diagram in cleaning device drying course of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, rather than whole embodiments.Based on this Embodiment in invention, those of ordinary skill in the art are obtained every other under the premise of not making performing creative labour Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 2 and Fig. 3, the present invention provides a kind of cleaning device 100 of flip-chip 200, flip-chip 200 Including substrate 210 and chip 220, certainly, before cleaning the flip-chip 200 further include be folded in substrate 210 and chip 220 it Between scaling powder 230 (as shown in Figure 4).Cleaning device 100 is wrapped for removing remaining scaling powder 230 in flip-chip 200 Include turntable 10, spray part 30 and drying part 50.
Fig. 5 and Fig. 6 is please referred to, turntable 10 drives flip-chip for placing flip-chip 200 to be cleaned 200 rotations.In present embodiment, turntable 10 includes column spinner 11 and the accommodating platform 13 being arranged on column spinner 11, this reality It applies in mode, column spinner 11 and accommodating platform 13 are cylinder, and column spinner 11 and accommodating platform 13 are coaxial, and the radius of accommodating platform 13 More than the radius of column spinner 11.For placing flip-chip 200, placing the surface of flip-chip 200 can open accommodating platform 13 Equipped with groove 131, the substrate 210 of flip-chip 200 is plugged in groove 131, so that flip-chip 200 can steadily be consolidated It is scheduled on turntable 10, will not be taken off by the effect of centrifugal force and cleaning solution or air curtain during subsequently cleaning or air-drying From turntable 10.In present embodiment, groove 131 there are four being opened up on platform 13 is housed, for housing flip-chip 200.It can be with Understand, the extending direction of four grooves 131 is at least partly overlapped with the radius of accommodating platform 13, to do circumference fortune with turntable 10 It is dynamic.Certainly, in other embodiments, the quantity of groove 131 can be adaptively adjusted according to demand, not limited herein It is fixed.Certainly, flip-chip 200 can also be otherwise fixed on turntable 10, such as 10 surface of turntable setting one Fixing piece (not shown) for fixing flip-chip 200, does not limit herein.
In one embodiment, turntable 10 is connect by shaft (not shown) with motor (not shown), to pass through motor The drive force turntable 10 of offer is rotated.Certainly, in other embodiments, turntable 10 can pass through other knots Structure is rotated, and is not limited herein.
Wherein, the direction that turntable 10 rotates can be counterclockwise, can also be clockwise, do not limit herein.At this In embodiment, the direction of rotation of turntable 10 is counterclockwise.
To obtain preferable centrifugal force, effectively to clean or air-dry flip-chip 200, the rotational velocity range of turntable 10 For 30-120r/min, such as 30r/min, 75r/min or 120r/min etc..
Part 30 is sprayed to be used for 200 spraying cleaning liquid of flip-chip being placed on turntable 10, to rinse and remove down The scaling powder 230 of cartridge chip 200.Multiple nozzles 31 are offered on spray part 30 so that cleaning liquid energy preferably flows into chip 220 With the gap between substrate 210, remaining scaling powder 230 can be fully removed.In the present embodiment, multiple nozzles 31 are at least in A line arrangement is opened on spray part 30.It is appreciated that the spray part 30 is (not shown) even with the first pipeline equipped with cleaning solution It connects, flip-chip 200 is washed away with providing enough cleaning solutions, wherein cleaning solution can be deionized water, detergent Deng.
Please refer to Fig. 5, to make flushing effect more preferably, will spray part 30 be arranged the top of turntable 10 and with appearance The radius for setting platform 13 overlaps, by adjusting the position of spray 30 top nozzle 31 of part so that the sprinkling side of the cleaning solution sprayed out To the flow direction A horizontal by an angle, and after cleaning solution to turntable 10 it is identical as the direction of rotation B of turntable 10 or It is opposite, to which remaining scaling powder 230 on flip-chip 200 be cleaned up, further, cleaning solution to turntable 10 Flow direction A afterwards is identical as the direction of rotation B of turntable 10.
It is appreciated that flip-chip 200 is placed on turntable 10, and during cleaning, with turntable 10 It moves in a circle, the souring of one side cleaning solution, on the other hand, the effect of generated centrifugal force in rotary course, So that cleaning solution rapidly flow to the gap between substrate 210 and chip 220, reinforce cleaning performance, so that being folded in base Scaling powder 230 between plate 210 and chip 220 can be rapidly separated, i.e., do not have scaling powder 230 between substrate 210 and chip 220 Residual, to reach quickly and effectively cleaning performance.
Fig. 6 is please referred to, drying part 50 is for the flip-chip 200 after air-drying cleaning.In present embodiment, part is dried 50 be air knife, and to form the flip-chip 200 after air curtain air-dries cleaning, the gas that air knife sprays is nitrogen.The direction of air curtain with It is in an inclination angle between the direction of rotation of turntable 10.It is appreciated that the air knife is connect with the second pipeline (not shown), to provide foot Enough nitrogen air-dries flip-chip 200.
Of course, it is possible to be heated on the second pipeline so that the nitrogen of air knife blowout has certain temperature, so that Flip-chip 200 can Quick-air-drying, avoid cleaning solution from remaining in flip-chip 200 and cause undesirable influence, temperature can be with As demand is adaptively adjusted.
It is appreciated that being air-dried to the flip-chip 200 after cleaning by nitrogen, air-dried with using compressed air Compare, can effectively ensure the cleanliness factor of wind, to avoid or reduce impurity pollution.
In the present embodiment, drying part 50 and spray 30 parallel interval of part setting, are fixedly installed on the upper of turntable 10 Side.Certainly, in other embodiments, drying can not use parallel interval to be arranged between part 50 and spray part 30, need to only consolidate The top of turntable 10 is set surely.
Certainly, part 50 is dried in order to control and spray being turned on and off for part 30, be arranged in the first pipeline or/and the second pipeline Solenoid valve (not shown), in order to control spray part 30 or/and dry the open and close of part 50.
It is appreciated that the control of solenoid valve can be controlled manually, can also be to be controlled by controller, herein It does not limit.
When being cleaned using the cleaning device 100, flip-chip 200 to be cleaned is plugged to accommodating platform 13 first In groove 131, turntable 10 is rotated in the counterclockwise direction at a predetermined velocity;The first pipeline is opened, so that spray part 30 sprays Cleaning solution cleans flip-chip 200, and after the completion of to be cleaned, the first pipeline is closed, and turntable 10 still keeps rotating, Most of cleaning solution on flip-chip 200 to be thrown away by centrifugal force;Then, the solenoid valve on the second pipeline is opened, with Drying part 50 is opened to air-dry flip-chip 200.
It is different from the prior art, the cleaning device 100 for the flip-chip 200 that embodiment of the present invention provides includes:Rotation Platform 10 for placing flip-chip 200 to be cleaned, and drives flip-chip 200 to rotate;Part 30 is sprayed, for being placed on 200 spraying cleaning liquid of flip-chip on turntable 10, to rinse and remove the scaling powder 230 of flip-chip 200.By that will fall Cartridge chip 200 is positioned on turntable 10, and as turntable 10 rotates, in cleaning process, is sprayed onto on flip-chip 200 Cleaning solution under the influence of centrifugal force, fast and effectively take away remaining scaling powder 230 between chip 220 and substrate 210. In addition, used turntable 10, spray part 30 and dry part 50 it is small, shared area is also small, and low energy consumption, noise It is small so that the cleaning device 100 can be widely used on various production lines.
Mode the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it is relevant to be applied directly or indirectly in other Technical field is included within the scope of the present invention.

Claims (10)

1. a kind of cleaning device of flip-chip, which is characterized in that including:
Turntable for placing flip-chip to be cleaned, and drives the flip-chip rotation;
Part is sprayed, it is described to rinse and remove for the flip-chip spraying cleaning liquid being placed on the turntable The scaling powder of flip-chip.
2. cleaning device according to claim 1, which is characterized in that the cleaning device further comprises:
Part is dried, for air-drying the flip-chip after cleaning.
3. cleaning device according to claim 2, which is characterized in that the drying part is air knife, is air-dried with forming air curtain The flip-chip after cleaning.
4. cleaning device according to claim 3, which is characterized in that the gas that the air knife sprays is nitrogen.
5. cleaning device according to claim 3, which is characterized in that the direction for the air curtain that the air knife is formed and the rotation The direction of rotation of turntable forms an inclination angle.
6. cleaning device according to claim 3, which is characterized in that the drying part is set with the spray part parallel interval It sets, is fixedly installed on the top of the turntable.
7. cleaning device according to claim 3, which is characterized in that the cleaning device further comprises solenoid valve, uses In the open and close for controlling the spray part or/and the drying part.
8. cleaning device according to claim 1, which is characterized in that multiple nozzles are offered on the spray part, so that The cleaning solution washes away the flip-chip by the nozzle.
9. cleaning device according to claim 1, which is characterized in that the water of the ejection of the spray part is in the turntable Flow direction it is identical or opposite as the direction of rotation of the flip-chip.
10. cleaning device according to claim 1, which is characterized in that the rotational velocity range of the turntable is 30- 120r/min。
CN201711498818.0A 2017-12-29 2017-12-29 A kind of cleaning device of flip-chip Pending CN108288594A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711498818.0A CN108288594A (en) 2017-12-29 2017-12-29 A kind of cleaning device of flip-chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711498818.0A CN108288594A (en) 2017-12-29 2017-12-29 A kind of cleaning device of flip-chip

Publications (1)

Publication Number Publication Date
CN108288594A true CN108288594A (en) 2018-07-17

Family

ID=62819680

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711498818.0A Pending CN108288594A (en) 2017-12-29 2017-12-29 A kind of cleaning device of flip-chip

Country Status (1)

Country Link
CN (1) CN108288594A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108818987A (en) * 2018-08-23 2018-11-16 重庆市嘉凌新科技有限公司 Chip cutting cleaning equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1400632A (en) * 2001-07-26 2003-03-05 株式会社东芝 Liquid film forming method and solid film forming method
CN103094241A (en) * 2012-12-15 2013-05-08 华天科技(西安)有限公司 Re-wiring lead frame FCAAQFN package part and manufacture process thereof
CN103464401A (en) * 2012-06-08 2013-12-25 盛美半导体设备(上海)有限公司 Method and device for cleaning flip chips

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1400632A (en) * 2001-07-26 2003-03-05 株式会社东芝 Liquid film forming method and solid film forming method
CN103464401A (en) * 2012-06-08 2013-12-25 盛美半导体设备(上海)有限公司 Method and device for cleaning flip chips
CN103094241A (en) * 2012-12-15 2013-05-08 华天科技(西安)有限公司 Re-wiring lead frame FCAAQFN package part and manufacture process thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108818987A (en) * 2018-08-23 2018-11-16 重庆市嘉凌新科技有限公司 Chip cutting cleaning equipment

Similar Documents

Publication Publication Date Title
JP7241844B2 (en) Cleaning equipment and cleaning method
JP2001053051A (en) Device and method for drying and washing substrate
JP6677459B2 (en) Semiconductor element manufacturing method and substrate processing method
CN207637755U (en) A kind of rotating etching device and wet etching machine bench
JP6431208B2 (en) Substrate liquid processing apparatus and method
CN108288594A (en) A kind of cleaning device of flip-chip
CN105006424A (en) Monolithic wet cleaning method
TW201120949A (en) Washing method of semiconductor wafer
CN206882270U (en) Synthetic sapphire substrate cleaning apparatus
CN102376543A (en) Development method in semiconductor component manufacture process
CN105470177A (en) Wafer cleaning and drying apparatus
CN209551448U (en) The processing unit of wafer, chemical-mechanical polishing system
CN103464401B (en) Method and apparatus for flip-chip cleaning
JP3441304B2 (en) Substrate processing apparatus and method
CN205699511U (en) A kind of spray dryer nozzle
CN111299213B (en) Cleaning device for grain dryer
CN209036280U (en) The post-processing unit of chemical-mechanical polishing system and wafer
CN107952639B (en) Paint spraying and post-auxiliary drying equipment for environment-friendly spraying
CN207154257U (en) Blooming piece cleaning device
CN207343115U (en) Novel toy paint spraying machine
KR100191848B1 (en) Substrate backside washing method
JP2005167089A (en) Apparatus and method for washing substrate
CN102527582B (en) A kind of shower nozzle for cleaning disk and method thereof
KR20140058839A (en) Wafer drying equipment
CN108933092A (en) Substrate board treatment, spray head cleaning device and spray head cleaning method

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20180717