CN108288594A - A kind of cleaning device of flip-chip - Google Patents
A kind of cleaning device of flip-chip Download PDFInfo
- Publication number
- CN108288594A CN108288594A CN201711498818.0A CN201711498818A CN108288594A CN 108288594 A CN108288594 A CN 108288594A CN 201711498818 A CN201711498818 A CN 201711498818A CN 108288594 A CN108288594 A CN 108288594A
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- Prior art keywords
- chip
- flip
- cleaning device
- turntable
- cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a kind of cleaning device of flip-chip, which includes:Turntable for placing flip-chip to be cleaned, and drives the flip-chip rotation;Part is sprayed, for the flip-chip spraying cleaning liquid being placed on the turntable, to rinse and remove the scaling powder of the flip-chip.By the above-mentioned means, the present invention can fast and effectively remove remaining scaling powder between chip and substrate.
Description
Technical field
The present invention relates to chip technology fields, more particularly to a kind of cleaning device of flip-chip.
Background technology
In flip chip mounting process, in chip attachment to substrate before, need to dip scaling powder, in chip re-flow process
In, most scaling powder can volatilize at high temperature, but also have part scaling powder and can remain between chip and substrate.If
Will not remain between chip and substrate flux cleaning removal, will have a direct impact on product quality and product it is reliable
Property.Therefore, the flux cleaning step after chip re-flow welding is most important.
In traditional handicraft, scaling powder is cleaned by the way of mesh belt transmission.Please refer to Fig. 1, conventional clean
Mode includes the following steps:First, the flip-chip 1 being placed on transporting reticulation belt 5 is sent to spray region 2, to pass through water
Stream takes away remaining scaling powder;Later, flip-chip 1 is transmitted to air-dried region 3, with by high-pressure blast by flip-chip 1
The water on surface dispels;Finally, flip-chip 1 is transmitted to drying area 4, upside-down mounting core will be remained in a manner of by heat radiation
Droplet drying on piece 1 evaporates.
Present inventor has found that traditional handicraft removes the remaining scaling powder of flip-chip in long-term R&D process
In mode, required equipment volume is huge, and it is big to occupy big quantity space, the water of equipment, consumption of electric energy, so that production cost is high;
In addition, air-dry, drying effect it is poor so that product in have water quality residual.
Invention content
The present invention provides a kind of cleaning device of flip-chip, and it is huge can to solve equipment volume needed in the art
Greatly, it is big that big quantity space, the water of equipment, consumption of electric energy can be occupied, so that production cost is high;In addition, air-dry, drying effect it is poor, with
To there is the technical issues of water quality residual in product.
In order to solve the above technical problems, one aspect of the present invention is:A kind of cleaning of flip-chip is provided
Device, including:
Turntable for placing flip-chip to be cleaned, and drives the flip-chip rotation;
Part is sprayed, for the flip-chip spraying cleaning liquid being placed on the turntable, to rinse and remove
The scaling powder of the flip-chip.
Wherein, the cleaning device further comprises:
Part is dried, for air-drying the flip-chip after cleaning.
Wherein, the drying part is air knife, to form the flip-chip after air curtain air-dries cleaning.
Wherein, the gas that the air knife sprays is nitrogen.
Wherein, the direction for the air curtain that the air knife is formed forms an inclination angle with the direction of rotation of the turntable.
Wherein, the drying part is arranged with the spray part parallel interval, is fixedly installed on the top of the turntable.
Wherein, the cleaning device further comprises solenoid valve, for controlling the spray part or/and the drying part
It opens and closes.
Wherein, multiple nozzles are offered on the spray part so that the cleaning solution by the nozzle to the upside-down mounting
Chip is washed away.
Wherein, rotation side of the water of the ejection of the spray part in the flow direction of the turntable and the flip-chip
To identical or opposite.
Wherein, the rotational velocity range of the turntable is 30-120r/min.
The beneficial effects of the invention are as follows:It is different from the prior art, the cleaning device of flip-chip provided by the invention includes:
Turntable for placing flip-chip to be cleaned, and drives flip-chip rotation;Part is sprayed, for being placed on turntable
On flip-chip spraying cleaning liquid, to rinse and remove the scaling powder of flip-chip.By the way that flip-chip is positioned over rotation
On platform, and as turntable rotates, in cleaning process, it is sprayed onto cleaning solution on flip-chip under the influence of centrifugal force,
Remaining scaling powder between chip and substrate is fast and effectively taken away, in addition, used turntable, spray part and drying
Part it is small, shared area is also small, and low energy consumption, and noise is small so that the cleaning device can be widely used in various lifes
In producing line.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.Wherein:
Fig. 1 is the cleaning way flowage structure schematic diagram of prior art flip-chip;
Fig. 2 is the schematic top plan view of one embodiment of cleaning device of the present invention;
Fig. 3 is the structural schematic diagram after flip-chip cleaning;
Fig. 4 is the structural schematic diagram before flip-chip cleaning;
Fig. 5 is the structural schematic diagram in cleaning device cleaning process of the present invention;
Fig. 6 is the structural schematic diagram in cleaning device drying course of the present invention.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, rather than whole embodiments.Based on this
Embodiment in invention, those of ordinary skill in the art are obtained every other under the premise of not making performing creative labour
Embodiment shall fall within the protection scope of the present invention.
Please refer to Fig. 2 and Fig. 3, the present invention provides a kind of cleaning device 100 of flip-chip 200, flip-chip 200
Including substrate 210 and chip 220, certainly, before cleaning the flip-chip 200 further include be folded in substrate 210 and chip 220 it
Between scaling powder 230 (as shown in Figure 4).Cleaning device 100 is wrapped for removing remaining scaling powder 230 in flip-chip 200
Include turntable 10, spray part 30 and drying part 50.
Fig. 5 and Fig. 6 is please referred to, turntable 10 drives flip-chip for placing flip-chip 200 to be cleaned
200 rotations.In present embodiment, turntable 10 includes column spinner 11 and the accommodating platform 13 being arranged on column spinner 11, this reality
It applies in mode, column spinner 11 and accommodating platform 13 are cylinder, and column spinner 11 and accommodating platform 13 are coaxial, and the radius of accommodating platform 13
More than the radius of column spinner 11.For placing flip-chip 200, placing the surface of flip-chip 200 can open accommodating platform 13
Equipped with groove 131, the substrate 210 of flip-chip 200 is plugged in groove 131, so that flip-chip 200 can steadily be consolidated
It is scheduled on turntable 10, will not be taken off by the effect of centrifugal force and cleaning solution or air curtain during subsequently cleaning or air-drying
From turntable 10.In present embodiment, groove 131 there are four being opened up on platform 13 is housed, for housing flip-chip 200.It can be with
Understand, the extending direction of four grooves 131 is at least partly overlapped with the radius of accommodating platform 13, to do circumference fortune with turntable 10
It is dynamic.Certainly, in other embodiments, the quantity of groove 131 can be adaptively adjusted according to demand, not limited herein
It is fixed.Certainly, flip-chip 200 can also be otherwise fixed on turntable 10, such as 10 surface of turntable setting one
Fixing piece (not shown) for fixing flip-chip 200, does not limit herein.
In one embodiment, turntable 10 is connect by shaft (not shown) with motor (not shown), to pass through motor
The drive force turntable 10 of offer is rotated.Certainly, in other embodiments, turntable 10 can pass through other knots
Structure is rotated, and is not limited herein.
Wherein, the direction that turntable 10 rotates can be counterclockwise, can also be clockwise, do not limit herein.At this
In embodiment, the direction of rotation of turntable 10 is counterclockwise.
To obtain preferable centrifugal force, effectively to clean or air-dry flip-chip 200, the rotational velocity range of turntable 10
For 30-120r/min, such as 30r/min, 75r/min or 120r/min etc..
Part 30 is sprayed to be used for 200 spraying cleaning liquid of flip-chip being placed on turntable 10, to rinse and remove down
The scaling powder 230 of cartridge chip 200.Multiple nozzles 31 are offered on spray part 30 so that cleaning liquid energy preferably flows into chip 220
With the gap between substrate 210, remaining scaling powder 230 can be fully removed.In the present embodiment, multiple nozzles 31 are at least in
A line arrangement is opened on spray part 30.It is appreciated that the spray part 30 is (not shown) even with the first pipeline equipped with cleaning solution
It connects, flip-chip 200 is washed away with providing enough cleaning solutions, wherein cleaning solution can be deionized water, detergent
Deng.
Please refer to Fig. 5, to make flushing effect more preferably, will spray part 30 be arranged the top of turntable 10 and with appearance
The radius for setting platform 13 overlaps, by adjusting the position of spray 30 top nozzle 31 of part so that the sprinkling side of the cleaning solution sprayed out
To the flow direction A horizontal by an angle, and after cleaning solution to turntable 10 it is identical as the direction of rotation B of turntable 10 or
It is opposite, to which remaining scaling powder 230 on flip-chip 200 be cleaned up, further, cleaning solution to turntable 10
Flow direction A afterwards is identical as the direction of rotation B of turntable 10.
It is appreciated that flip-chip 200 is placed on turntable 10, and during cleaning, with turntable 10
It moves in a circle, the souring of one side cleaning solution, on the other hand, the effect of generated centrifugal force in rotary course,
So that cleaning solution rapidly flow to the gap between substrate 210 and chip 220, reinforce cleaning performance, so that being folded in base
Scaling powder 230 between plate 210 and chip 220 can be rapidly separated, i.e., do not have scaling powder 230 between substrate 210 and chip 220
Residual, to reach quickly and effectively cleaning performance.
Fig. 6 is please referred to, drying part 50 is for the flip-chip 200 after air-drying cleaning.In present embodiment, part is dried
50 be air knife, and to form the flip-chip 200 after air curtain air-dries cleaning, the gas that air knife sprays is nitrogen.The direction of air curtain with
It is in an inclination angle between the direction of rotation of turntable 10.It is appreciated that the air knife is connect with the second pipeline (not shown), to provide foot
Enough nitrogen air-dries flip-chip 200.
Of course, it is possible to be heated on the second pipeline so that the nitrogen of air knife blowout has certain temperature, so that
Flip-chip 200 can Quick-air-drying, avoid cleaning solution from remaining in flip-chip 200 and cause undesirable influence, temperature can be with
As demand is adaptively adjusted.
It is appreciated that being air-dried to the flip-chip 200 after cleaning by nitrogen, air-dried with using compressed air
Compare, can effectively ensure the cleanliness factor of wind, to avoid or reduce impurity pollution.
In the present embodiment, drying part 50 and spray 30 parallel interval of part setting, are fixedly installed on the upper of turntable 10
Side.Certainly, in other embodiments, drying can not use parallel interval to be arranged between part 50 and spray part 30, need to only consolidate
The top of turntable 10 is set surely.
Certainly, part 50 is dried in order to control and spray being turned on and off for part 30, be arranged in the first pipeline or/and the second pipeline
Solenoid valve (not shown), in order to control spray part 30 or/and dry the open and close of part 50.
It is appreciated that the control of solenoid valve can be controlled manually, can also be to be controlled by controller, herein
It does not limit.
When being cleaned using the cleaning device 100, flip-chip 200 to be cleaned is plugged to accommodating platform 13 first
In groove 131, turntable 10 is rotated in the counterclockwise direction at a predetermined velocity;The first pipeline is opened, so that spray part 30 sprays
Cleaning solution cleans flip-chip 200, and after the completion of to be cleaned, the first pipeline is closed, and turntable 10 still keeps rotating,
Most of cleaning solution on flip-chip 200 to be thrown away by centrifugal force;Then, the solenoid valve on the second pipeline is opened, with
Drying part 50 is opened to air-dry flip-chip 200.
It is different from the prior art, the cleaning device 100 for the flip-chip 200 that embodiment of the present invention provides includes:Rotation
Platform 10 for placing flip-chip 200 to be cleaned, and drives flip-chip 200 to rotate;Part 30 is sprayed, for being placed on
200 spraying cleaning liquid of flip-chip on turntable 10, to rinse and remove the scaling powder 230 of flip-chip 200.By that will fall
Cartridge chip 200 is positioned on turntable 10, and as turntable 10 rotates, in cleaning process, is sprayed onto on flip-chip 200
Cleaning solution under the influence of centrifugal force, fast and effectively take away remaining scaling powder 230 between chip 220 and substrate 210.
In addition, used turntable 10, spray part 30 and dry part 50 it is small, shared area is also small, and low energy consumption, noise
It is small so that the cleaning device 100 can be widely used on various production lines.
Mode the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content, it is relevant to be applied directly or indirectly in other
Technical field is included within the scope of the present invention.
Claims (10)
1. a kind of cleaning device of flip-chip, which is characterized in that including:
Turntable for placing flip-chip to be cleaned, and drives the flip-chip rotation;
Part is sprayed, it is described to rinse and remove for the flip-chip spraying cleaning liquid being placed on the turntable
The scaling powder of flip-chip.
2. cleaning device according to claim 1, which is characterized in that the cleaning device further comprises:
Part is dried, for air-drying the flip-chip after cleaning.
3. cleaning device according to claim 2, which is characterized in that the drying part is air knife, is air-dried with forming air curtain
The flip-chip after cleaning.
4. cleaning device according to claim 3, which is characterized in that the gas that the air knife sprays is nitrogen.
5. cleaning device according to claim 3, which is characterized in that the direction for the air curtain that the air knife is formed and the rotation
The direction of rotation of turntable forms an inclination angle.
6. cleaning device according to claim 3, which is characterized in that the drying part is set with the spray part parallel interval
It sets, is fixedly installed on the top of the turntable.
7. cleaning device according to claim 3, which is characterized in that the cleaning device further comprises solenoid valve, uses
In the open and close for controlling the spray part or/and the drying part.
8. cleaning device according to claim 1, which is characterized in that multiple nozzles are offered on the spray part, so that
The cleaning solution washes away the flip-chip by the nozzle.
9. cleaning device according to claim 1, which is characterized in that the water of the ejection of the spray part is in the turntable
Flow direction it is identical or opposite as the direction of rotation of the flip-chip.
10. cleaning device according to claim 1, which is characterized in that the rotational velocity range of the turntable is 30-
120r/min。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201711498818.0A CN108288594A (en) | 2017-12-29 | 2017-12-29 | A kind of cleaning device of flip-chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201711498818.0A CN108288594A (en) | 2017-12-29 | 2017-12-29 | A kind of cleaning device of flip-chip |
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Publication Number | Publication Date |
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CN108288594A true CN108288594A (en) | 2018-07-17 |
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ID=62819680
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Application Number | Title | Priority Date | Filing Date |
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CN201711498818.0A Pending CN108288594A (en) | 2017-12-29 | 2017-12-29 | A kind of cleaning device of flip-chip |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108818987A (en) * | 2018-08-23 | 2018-11-16 | 重庆市嘉凌新科技有限公司 | Chip cutting cleaning equipment |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1400632A (en) * | 2001-07-26 | 2003-03-05 | 株式会社东芝 | Liquid film forming method and solid film forming method |
CN103094241A (en) * | 2012-12-15 | 2013-05-08 | 华天科技(西安)有限公司 | Re-wiring lead frame FCAAQFN package part and manufacture process thereof |
CN103464401A (en) * | 2012-06-08 | 2013-12-25 | 盛美半导体设备(上海)有限公司 | Method and device for cleaning flip chips |
-
2017
- 2017-12-29 CN CN201711498818.0A patent/CN108288594A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1400632A (en) * | 2001-07-26 | 2003-03-05 | 株式会社东芝 | Liquid film forming method and solid film forming method |
CN103464401A (en) * | 2012-06-08 | 2013-12-25 | 盛美半导体设备(上海)有限公司 | Method and device for cleaning flip chips |
CN103094241A (en) * | 2012-12-15 | 2013-05-08 | 华天科技(西安)有限公司 | Re-wiring lead frame FCAAQFN package part and manufacture process thereof |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108818987A (en) * | 2018-08-23 | 2018-11-16 | 重庆市嘉凌新科技有限公司 | Chip cutting cleaning equipment |
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Application publication date: 20180717 |