JP2004281429A - Wet cleaning device and nozzle used therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wet cleaning device that can be improved further in cleaning effect by satisfactorily removing foreign matters by utilizing a liquid flow discharged by means of a centrifugal force without inhibiting the liquid flow, and to provide a nozzle used for the cleaning device. <P>SOLUTION: This wet cleaning device cleans an object 1 to be cleaned, such as a semiconductor wafer, a disk-shaped glass substrate, etc., by jetting a cleaning fluid upon the surface of the object 1 from the nozzle 10 by pressurizing the fluid by pressurizing gas while the object 1 is rotated. This cleaning device is provided with a rotating means 40 which rotates the object 1 by clamping the object 1, a supporting section 20 which disposes the nozzle 10 on the surface of the object 1 by supporting the nozzle 10, and a supplying section 30 which supplies the cleaning fluid and the pressuring gas to the nozzle 10. The cleaning device is also provided with the nozzle 10 which has a main body 12 extended within the radius of the object 1 from the outer periphery to the center of the object 1 while the main body 12 is supported to face the surface of the object 1 by means of the supporting section 20, is formed with a slit 14 through which the cleaning fluid is nearly vertically jetted upon a radial line when the cleaning fluid and the pressurizing gas are supplied from the supplying section 30, and is disposed in an inclined state so that the slit 14 may gently approach the surface of the object 1 from the outer periphery to the center. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a wet cleaning apparatus and a nozzle used for the same, and more specifically, by rotating an object to be cleaned such as a semiconductor wafer and a disk-shaped glass substrate and injecting a cleaning liquid from a nozzle onto a surface thereof by pressurizing gas with a pressurized gas. The present invention relates to a wet cleaning apparatus for cleaning and a nozzle used for the apparatus.
[0002]
[Prior art]
[Patent Document 1]
JP-A-2002-362945 (pages 4 and 5, FIG. 1)
[0003]
2. Description of the Related Art Conventionally, a wet cleaning apparatus and a nozzle used therein hold and rotate an object to be cleaned such as a semiconductor wafer and a disk-shaped glass substrate, and pressurize and jet a cleaning liquid from a nozzle onto a surface of the object with a pressurized gas. (See, for example, Patent Document 1) is well known. FIG. 12 is a view showing an embodiment of a conventional wet cleaning apparatus for rotating such an object to be cleaned and spraying a cleaning liquid from a nozzle to perform cleaning, and a nozzle used for the apparatus. FIG. 13 is a diagram showing a state viewed from the direction of arrow D shown in FIG. FIG. 14 is a diagram showing a cross section taken along line EE shown in FIG.
[0004]
As shown in FIG. 12, in one embodiment of the conventional wet cleaning apparatus, a cleaning object 1 such as a semiconductor wafer and a disk-shaped glass substrate is rotated, and a cleaning liquid is sprayed from a nozzle 90 onto the surface by a pressurized gas. Rotating means 120 for gripping and rotating the object 1 to be cleaned, a supporting portion 100 for supporting and disposing the nozzle 90 on the surface of the object 1 to be cleaned, and a cleaning liquid and a pressurized gas. The apparatus includes a supply unit 110 for supplying the nozzle 90 and a nozzle 90 having a main body 92 supported by the support unit 100 and opposed to the surface of the article 1 to be cleaned and extending between radii from the outer periphery to the center. .
[0005]
Here, the rotation means 120 includes a support plate 128 provided with a support pin 126 and a suction portion 127, and a rotation shaft 122 for horizontally rotating the support plate 128. The support pin 128 and the suction section 127 are disposed and fixed to the support plate 128 at appropriate positions, and the object to be cleaned 1 is mounted on the support pin 126 by suction while being held on the support pin 126. . The rotating shaft 122 is rotatably supported at its center by a predetermined driving source (not shown).
[0006]
On the other hand, the nozzle 90 used in the conventional wet cleaning apparatus has one end of the main body 92 supported by a driving unit (not shown) in the support portion 100 and is separated from the processing position above the cleaning target 1 and from above the cleaning target 1. It is provided so as to be able to turn between the retracted position. Further, the nozzle 90 has a plurality of ejection ports 94 fixed to the lower surface thereof along the longitudinal direction of the main body 92, and the ejection ports 94 supply a cleaning liquid supply source 112 for supplying a cleaning liquid and a pressurized gas. It is connected to a supply unit 110 having a pressurized gas supply source 114. Here, the cleaning liquid supply source 112 is composed of a pump or the like, and supplies the pressurized cleaning liquid to each of the ejection ports 94 via the supply pipe 111a and the pressure control means 116 provided in the middle of the supply pipe 111a. . Similarly, the pressurized gas supply source 114 also includes a pump and the like, and pressurized gas is injected through a supply pipe 111b and a pressure control unit 118 provided in the middle of the supply pipe 111b. Feed to outlet 94.
[0007]
The pressure control means 116 and 118 each include, for example, a proportional electromagnetic pilot relief valve and the like, and are formed so that the pressures of the cleaning liquid and the pressurized gas can be continuously changed. The operation of the pressure control means 116 and 118 is controlled by being connected to a control device 119. The pressure of the cleaning liquid supplied from the cleaning liquid supply source 112 to each jet port 94 according to the control of the control device 119, The pressure of the gas supplied from the supply source 114 to each ejection port 94 is appropriately adjusted.
[0008]
When using one embodiment of the conventional wet cleaning apparatus formed as described above and the nozzle used for the same, first, the object to be cleaned 1 is conveyed, placed on the support pins 126, and suction-held by the suction section 127. Next, the rotating shaft 122 is rotationally driven by a predetermined driving source (not shown), and thereby the object to be cleaned 1 is horizontally rotated. In this state, the main body 92 of the nozzle 90 is swiveled by a driving means (not shown) to the processing position above the article 1 to be cleaned, and then the cleaning liquid pressurized from the cleaning liquid supply source 112 and the pressurized gas supply source 114 The pressurized gas is supplied to each of the ejection ports 94, and the cleaning liquid atomized from each of the ejection ports 94 is ejected onto the object to be cleaned 1 to wash the object to be cleaned 1.
[0009]
At this time, in the first stage, the pressure of the supplied cleaning liquid and the pressure of the pressurized gas are set to low pressures. As a result, the cleaning liquid having a relatively large particle diameter is jetted from the ejection port 94, and the particles adhered to the surface of the cleaning target 1 are washed away by the cleaning liquid. Next, in the second stage, the pressure of the cleaning liquid and the pressure of the pressurized gas are set to a high pressure. As a result, the cleaning liquid having a fine particle diameter is jetted from the ejection port 94, and the cleaning liquid particles enter the inside of the fine structure of the article 1 to be cleaned, and wash away the particles inside the fine structure.
[0010]
As described above, in one embodiment of the conventional wet cleaning apparatus and the nozzle used for the same, the pressure control means 116 and 118 are controlled by the control device 119 so that the pressures of the cleaning liquid and the pressurized gas ejected on the radius of the article 1 to be cleaned are controlled. Appropriate adjustment is made to enable two-stage cleaning with different jetting pressures of the cleaning liquid, thereby coping with various processing steps.
[0011]
However, in one embodiment of the conventional wet cleaning apparatus and the nozzle used therefor, as shown in FIG. 13, the cleaning liquid is jetted from a jet port 94 of the nozzle 90 onto a radius of the surface of the object 1 to be cleaned. One side (the right side in FIG. 13) of the object 1 to be cleaned is blocked. Then, as shown in FIG. 14, the cleaning liquid remaining on the surface after one rotation comes into contact with the cleaning liquid jetted from the nozzle 90 to generate a wavy liquid flow on the cleaning target 1. Accordingly, on the surface of the object 1 to be cleaned, the wavy liquid flow becomes a liquid flow that flows in a direction opposite to the rotation direction T as shown by a dashed line in FIG. 13 and generates a flow from the outer peripheral side toward the center. As a result, the cleaning liquid discharged to the outside gathers near the center, which hinders the removal of foreign substances (particles).
[0012]
[Problems to be solved by the invention]
As described above, in the conventional wet cleaning apparatus and the nozzle used in the apparatus, the cleaning liquid is jetted from the nozzle 90 so as to cut off the radius line of the surface on which the object 1 is rotated. A liquid flow (dashed-dotted line shown in FIG. 13) is generated, and the cleaning liquid after the treatment is collected in the vicinity of the center, which hinders the elimination of foreign substances (particles) and the like, and causes a problem that the cleaning effect is reduced.
The present invention solves such a problem, and does not hinder the liquid flow discharged by centrifugal force, can favorably remove foreign substances using the liquid flow, and further improves the cleaning effect by a wet cleaning apparatus and a nozzle used therefor. The purpose is to provide.
[0013]
[Means for Solving the Problems]
The present invention is directed to a wet cleaning apparatus for cleaning an object to be cleaned such as a semiconductor wafer and a disk-shaped glass substrate by rotating the object to be cleaned such as a semiconductor wafer and a disc-shaped glass substrate by pressing a cleaning liquid from a nozzle with a pressurized gas. Rotating means for gripping and rotating the object to be cleaned, a support unit for supporting and disposing the nozzle on the surface of the object to be cleaned, a supply unit for supplying a cleaning liquid and a pressurized gas to the nozzle, and a support unit Having a main body that extends from the outer periphery to the center and is opposed to the surface of the object to be cleaned and that supplies the cleaning liquid and the pressurized gas from the supply unit and injects the gas substantially perpendicularly onto the radius line. A nozzle provided with a slit, which is arranged in an inclined or curved shape so as to gradually approach the surface of the object to be cleaned from the outer periphery toward the center.
[0014]
Here, the main body of the nozzle has a hollow hollow portion extending in the radial direction of the object to be cleaned inside, a slit cut through the hollow portion to the side of the object to be cleaned, and extends along the hollow portion. A supply path for individually supplying the cleaning liquid and the pressurized gas and discharging the cleaning liquid and the pressurized gas having a plurality of holes arranged and opened on the outer peripheral surface, and discharging the cleaning liquid and the pressurized gas from the supply path into the hollow portion. It is preferable that the mixture is sprayed from the slit by mixing. Preferably, the slit extends linearly or wavyly in the radial direction of the object to be cleaned. In another embodiment of the slit, the center side of the object to be cleaned is formed in a wavy line, the height of the wave is gradually narrowed toward the outer peripheral side, and the slit is provided so as to be substantially linear at the outer peripheral end side. Is preferred. In addition, it is preferable that the supporting portion movably supports the nozzle outside the outer periphery so that the cleaning liquid does not drop from the slit on the surface of the object to be cleaned after cleaning by the nozzle.
[0015]
On the other hand, another embodiment of a wet cleaning apparatus for rotating an object to be cleaned such as a semiconductor wafer and a disk-shaped glass substrate and cleaning the surface by pressurizing and spraying a cleaning liquid from a nozzle with a pressurized gas is used for cleaning an object to be cleaned. Rotating means for gripping and rotating, a support unit for supporting and disposing a nozzle on the surface of the object to be cleaned, a supply unit for supplying a cleaning liquid and a pressurized gas to the nozzle, and an object to be cleaned supported by the support unit Having a main body extending between the radii from the outer periphery to the center in parallel opposite to the surface, and having a slit for supplying a cleaning liquid and a pressurized gas from a supply unit and injecting the liquid substantially perpendicularly between the radii, A nozzle arranged such that the slit has a gentle curve parallel to the rotation direction of the object to be cleaned from the center between the radii to the outer periphery.
[0016]
Here, the main body of the nozzle has a hollow hollow portion extending in the radial direction of the object to be cleaned inside, a slit cut through the hollow portion to the side of the object to be cleaned, and extends along the hollow portion. A supply path for individually supplying the cleaning liquid and the pressurized gas and discharging the cleaning liquid and the pressurized gas having a plurality of holes arranged and opened on the outer peripheral surface, and discharging the cleaning liquid and the pressurized gas from the supply path into the hollow portion. It is preferable that the mixture is sprayed from the slit by mixing. In addition, the supply path is provided with a taper that becomes narrower toward the center in the hollow portion of the nozzle extending from the outer periphery of the article to be cleaned to the center. It is preferable to provide the taper gradually narrower. In addition, it is preferable that the supporting portion movably supports the nozzle outside the outer periphery so that the cleaning liquid does not drop from the slit above the object to be cleaned after cleaning by the nozzle.
[0017]
Further, an embodiment of a nozzle used in a wet cleaning apparatus for cleaning an object to be cleaned, such as a semiconductor wafer and a disk-shaped glass substrate, by rotating the object to be cleaned by pressurizing and spraying a cleaning liquid onto the surface with a pressurized gas is described as follows. A main body extending between the radii from the outer periphery to the center, and having a slit for supplying a cleaning liquid and a pressurized gas and ejecting the main body substantially perpendicularly on the radius line, and forming the slit on the surface of the object to be cleaned. Are arranged in an inclined or curved shape so as to gradually approach from the outer periphery toward the center.
[0018]
Here, the main body has a hollow hollow portion extending in the radial direction of the object to be cleaned inside, a slit cut out from the hollow portion to the side of the object to be cleaned, and a cleaning liquid and A supply path for individually supplying the pressurized gas and discharging it with a plurality of holes arranged and opened on the outer peripheral surface, and releasing and mixing the cleaning liquid and the pressurized gas from the supply path into the hollow portion. Therefore, it is preferable to eject from the slit. Preferably, the slit extends linearly or wavyly in the radial direction of the object to be cleaned. In another embodiment of the slit, the center side of the object to be cleaned is formed in a wavy line, the height of the wave is gradually narrowed toward the outer peripheral side, and the slit is provided so as to be substantially linear at the outer peripheral end side. Is preferred.
[0019]
Further, another embodiment of a nozzle used in a wet cleaning apparatus for cleaning an object to be cleaned such as a semiconductor wafer and a disk-shaped glass substrate by rotating the object to be cleaned by pressurizing and jetting a cleaning liquid onto the surface with a pressurized gas includes a cleaning object. A main body extending in parallel to the surface from the outer periphery to the center and extending between the radii from the outer periphery to the center, and provided with a slit for supplying a cleaning liquid and a pressurized gas and jetting substantially perpendicularly between the radii; It is arranged so as to have a gentle curve parallel to the rotation direction of the object to be cleaned from the center to the outer periphery.
[0020]
Here, the main body has a hollow hollow portion extending in the radial direction of the object to be cleaned, a slit cut from the hollow portion to the side of the object to be cleaned, and a cleaning liquid extending along the hollow portion. And a supply path for individually supplying the pressurized gas and discharging it with a plurality of holes arranged and opened on the outer peripheral surface, from which the cleaning liquid and the pressurized gas are discharged into the hollow portion and mixed. It is preferable to eject from the slit by doing. In addition, the supply path is provided with a taper that becomes narrower toward the center in a hollow portion extending from the outer periphery of the article to be washed to the center, and the interval between a plurality of holes arranged on the tapered outer peripheral surface is increased toward the center. It is preferable to provide it gradually narrow.
[0021]
BEST MODE FOR CARRYING OUT THE INVENTION
Next, an embodiment of a wet cleaning apparatus and a nozzle used in the apparatus according to the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a view showing one embodiment of a wet cleaning apparatus according to the present invention and a nozzle used for the apparatus. FIG. 2 is a view showing the appearance of the nozzle 10 shown in FIG. FIG. 3 is a diagram showing the internal structure of the nozzle 10 shown in FIG. FIG. 4 is a diagram showing a cross section taken along line BB shown in FIG. FIG. 5 is a diagram showing the state of the nozzle 10 as viewed from the direction of arrow A shown in FIG. FIG. 6 is a view showing another embodiment of the slit shown in FIG. FIG. 7 is a view showing still another embodiment of the slit shown in FIG. FIG. 8 is a view showing another embodiment of the nozzle shown in FIG. FIG. 9 is a diagram showing the appearance of the nozzle 70 shown in FIG. FIG. 10 is a view showing still another embodiment of the nozzle shown in FIG. FIG. 11 is a diagram showing a cross section taken along line CC shown in FIG.
[0022]
As shown in FIG. 1, an embodiment of a wet cleaning apparatus and a nozzle used in the apparatus according to the present invention rotates an object 1 to be cleaned such as a semiconductor wafer and a disk-shaped glass substrate in the same manner as in the prior art shown in FIG. The cleaning means presses and jets a cleaning liquid from the nozzle 10 onto the surface with a pressurized gas to clean the cleaning object. The rotating means 40 grips the cleaning target 1 and rotates in a predetermined rotation direction T; A support section 20 for supporting and disposing the nozzle 10 thereon, a supply section 30 for supplying a cleaning liquid and a pressurized gas to the nozzle 10, and a support section 20 supported from the outer periphery facing the surface of the article 1 to be cleaned. A nozzle 10 having a body 12 extending between the radii to the center. In the present embodiment, unlike the related art shown in FIG. 12, the cleaning liquid and the pressurized gas are supplied from the supply unit 30 to the inside of the main body 12 of the nozzle 10 supported by the support unit 20 and extend on the radius line. The slit 14 is provided so as to be jetted substantially vertically, and the slit 14 is arranged in an inclined manner so as to gradually approach the surface of the object 1 from the outer periphery toward the center. Therefore, in the present embodiment, the cleaning liquid ejected from the slit 14 is provided by providing the nozzle 10 having one end close to the center and the other end inclined toward the upper part of the outer periphery facing the surface of the article 1 to be cleaned. The liquid flow is strong on the center side and weak on the outer peripheral side, and a liquid flow for eliminating foreign matter (particles) on the outer peripheral side on the radius line of the article 1 to be cleaned.
[0023]
Here, the rotating means 40 is provided with a support pin and a suction part (not shown) for mounting the article 1 to be cleaned, and is rotatably fixed to the rotating shaft 42 in the same manner as in the prior art shown in FIG. Further, a drive source 44 for rotatably supporting the rotation shaft 42 is further provided. Further, the support portion 20 is formed so that the nozzle 10 is supported by driving means (not shown) so as to be able to pivot between a processing position above the cleaning target 1 and a retracted position deviating from above the cleaning target 1. ing. Thereby, the support part 20 can move the nozzle 10 to the outside of the outer periphery after the cleaning by the nozzle 10 so that the cleaning liquid does not drop from the slit 14 on the surface of the article 1 to be cleaned. Further, the supply unit 30 includes a cleaning liquid supply source (not shown) configured to include a pump and the like to supply a cleaning liquid and a pressurized gas supply source (not illustrated) configured to supply a pressurized gas, similarly to the related art illustrated in FIG. (Not shown), which are connected to the nozzle 10 via the supply pipe 31 respectively. The supply unit 30 supplies a gas for preventing oxidation such as N2 or argon as a pressurized gas, and supplies a liquid such as alcohol, pure water, ammonia, or hydrofluoric acid as a cleaning liquid. Further, the supply unit 30 includes a proportional electromagnetic pilot relief valve and the like in the cleaning liquid supply source and the pressurized gas supply source, and the pressure of the cleaning liquid and the pressurized gas between the cleaning liquid supply source and the pressurized gas supply source. The pressure control means (not shown) for continuously changing each of them is provided, and each of them is connected to a control device (not shown) to control the operation.
[0024]
On the other hand, one embodiment of the nozzle 10 used in the wet cleaning apparatus according to the present invention includes a main body 12 extending on the radius of the object 1 to be cleaned, as shown in FIG. A linear slit 14 for supplying a cleaning liquid and jetting the cleaning liquid onto a radius of the object 1 is formed. As shown in FIG. 3, the main body 12 of the nozzle 10 has a hollow hollow portion 16 extending in the radial direction of the object 1 to be cleaned inside, and cuts through the hollow portion 16 toward the object 1 to penetrate. A slit 14 and a supply path 18 extending along the inside of the hollow portion 16 for individually supplying a cleaning liquid and a pressurized gas, and discharging the cleaning liquid and the pressurized gas through a plurality of holes 18a arranged and opened on the outer peripheral surface. ing. Therefore, the nozzle 10 is formed in such a structure that the cleaning liquid and the pressurized gas are discharged from the supply path 18 into the hollow portion 16 to be mixed and ejected from the slit 14. Here, as shown in FIG. 4, the supply path 18 extends horizontally in parallel in the hollow portion 16 of the nozzle 10, and has holes 18 a that are opened at regular intervals on this outer peripheral surface. A plurality of cleaning liquids and a pressurized gas are formed in the hollow portion 16 so as to be uniformly discharged. Then, as shown in FIG. 5, the nozzle 10 is supported by the support portion 20 (see FIG. 1) on the surface of the article 1 to be cleaned, and is inclined so as to gradually approach from the outer periphery toward the center. This makes it possible to obtain a liquid flow in which the ejected cleaning liquid is strong on the center side and weak on the outer peripheral side, and removes foreign matter toward the outer peripheral side.
[0025]
In the case of using the wet cleaning apparatus according to the embodiment of the present invention and the nozzle used in the embodiment, first, as shown in FIG. And hold it by suction. Next, the rotating shaft 42 is rotationally driven by the driving source 44 of the rotating means 40, and thereby the object 1 to be cleaned is horizontally rotated. In this state, the driving means (not shown) of the support unit 20 pivots the main body 14 of the nozzle 10 to the processing position above the article 1 to be cleaned, and then pressurizes the cleaning liquid supplied from the supply unit 30 with the cleaning liquid. The gas is supplied to the nozzle 10. The nozzle 10 discharges and mixes the cleaning liquid and the pressurized gas from the supply path 18 through the hole 18 a in the hollow portion 16 shown in FIG. The object to be cleaned 1 is washed by spraying it on the object 1. At this time, as shown in FIG. 1, the nozzle 10 is arranged to be inclined on the radius of the object 1 to be cleaned, so that the jet of the cleaning liquid is strong on the center side and weak on the outer side, and is directed toward the outer side on the radius line. To generate a flowing liquid stream. Therefore, on the surface of the object 1 to be cleaned, even if the cleaning liquid ejected from the nozzle 10 blocks on the radial line, the cleaning liquid is discharged together with the foreign matter without remaining by the liquid flow flowing toward the outer periphery described above. When the cleaning by the nozzle 10 is completed, the main body 14 of the nozzle 10 is pivoted to the outer periphery of the object 1 to be cleaned, thereby preventing re-contamination with the cleaning liquid dropped from the slit 14. Therefore, the nozzle 10 does not operate during the processing, and comes off from the surface of the article to be cleaned 1 with a minimum movement after the processing, so that dust generation can be reduced.
[0026]
According to the embodiment of the wet cleaning apparatus and the nozzle used for the same according to the present invention, the cleaning liquid to be sprayed by inclining the nozzle 10 moves from the center to the outer peripheral side without blocking on the radius line of the rotating object 1 to be rotated. Since the flowing liquid flow is generated, the liquid flow of the cleaning liquid discharged to the outer peripheral side due to the centrifugal force is not hindered, and the foreign matter can be satisfactorily removed using the liquid flow, so that the cleaning effect can be further improved.
[0027]
By the way, in the embodiment of the wet cleaning apparatus and the nozzle used for the same according to the present invention, an example in which the slit 14 (see FIG. 2) extending linearly is provided in the main body 12 of the nozzle 10 has been described in detail. However, for example, as shown in FIG. 6, a slit 54 extending in a wavy line may be provided in the main body 52 of the nozzle 50. According to another embodiment of the slit 54 provided in a wavy line as described above, the nozzle can be arranged to be inclined on the radial line of the article 1 to be cleaned, and the liquid flow flowing from the center to the outer peripheral side can be generated. The same effect as that of the slit shown can be obtained, and by forming the slit 54 in a wavy line to increase the injection area, more powerful injection can be performed as compared with the slit shown in FIG. 2, and the cleaning effect is further improved. it can.
[0028]
Further, the slit of the nozzle can be more effectively cleaned by combining a straight shape and a wavy shape. As shown in FIG. 7, still another embodiment of the slit 64 combining the linear shape and the wavy shape has a wavy line on the center side of the main body 62 of the nozzle 60 extending on the radial line of the article 1 to be cleaned. And the height of the wave is gradually narrowed toward the outer peripheral side so as to be substantially linear at the outer peripheral end side. In still another embodiment of such a slit 64, a structure is formed in which the jet is strongly jetted at the center side of the wavy line and gradually becomes weaker by going toward the outer peripheral side. Therefore, according to still another embodiment of the slit 64, the same effect as the nozzle shown in FIGS. 2 and 3 can be obtained by arranging the main body 62 of the nozzle 60 at an angle on the surface of the article 1 to be cleaned. In addition, the strength of the jet from the center of the portion to be cleaned 1 toward the outer periphery can be adjusted not only by the inclination of the main body 62 but also by the shape of the slit 64.
[0029]
On the other hand, in one embodiment of the wet cleaning apparatus and the nozzle used for the same according to the present invention, the example of the linear nozzle inclined at a predetermined angle on the surface of the object to be cleaned has been described in detail. However, for example, the main body and the slit of the nozzle may be formed in a curved shape gradually approaching from the outer periphery toward the center on the surface of the object to be cleaned. As shown in FIG. 8, another embodiment of the nozzle formed in a curved shape has a main body 72 extending on the radius line of the object 1 to be cleaned. The surface of the object 1 is formed in a curved shape so as to gradually approach from the outer periphery toward the center. As shown in FIG. 9, the main body 72 has a slit 74 formed by cutting a straight line in a curved bottom surface facing the object 1 to be cleaned, and is disposed on a radial line of the object 1 shown in FIG. ing. At this time, the slit 74 can be formed by a wavy line or a combination of a straight line and a wavy line as shown in FIGS. Therefore, according to another embodiment of the nozzle, the jetting of the cleaning liquid can be made strong at the center side of the object 1 to be cleaned and weakened at the outer peripheral side, so that the same effect as the nozzle shown in FIG. 2 can be obtained. In addition to this, it is possible to gradually and weakly adjust the injection of the cleaning liquid from the center to the outer periphery according to the curve rate, and it is possible to obtain a suitable liquid flow for smoothly discharging foreign substances.
[0030]
In addition, in one embodiment of the wet cleaning apparatus and the nozzle used therein according to the present invention, an example in which the nozzle is disposed to be inclined or curved on the radius line of the object to be cleaned is described in detail, but is not limited thereto. Instead, there is still another embodiment of a nozzle that can be disposed in parallel on the radius line of the object to be cleaned and discharge foreign matter. Still another embodiment of the nozzle has a main body 82 extending in parallel to the surface of the article 1 to be cleaned and extending between the radii from the outer periphery to the center as shown in FIG. A slit (not shown) for supplying a pressurized gas and injecting substantially perpendicularly between the radii is provided, and this slit is formed in a gentle curve parallel to the rotation direction of the object 1 from the center between the radii to the outer periphery. It is arranged so that it may have. Note that all components other than the nozzle 80 shown in FIG. 10 are the same components as those of the wet cleaning apparatus shown in FIG. 1, and redundant description will be omitted.
[0031]
Here, the main body 82 of the nozzle 80 is formed so as to extend in parallel on the radius of the article 1 to be cleaned and have a gentle curve in the rotation direction T from the center toward the outer circumference as shown in FIG. In addition, a slit (not shown) cut into the center of the curved bottom surface is provided. Therefore, in still another embodiment of the nozzle, the slit for spraying the cleaning liquid is provided in a curved shape in the rotation direction T from the center toward the outer periphery to the main body 82 parallel to the radius of the object 1 to be cleaned, so that the object to be cleaned is provided. The object 1 is formed so that foreign matter can be discharged to the outer peripheral side along a curve without interrupting the radial line of the object 1. As shown in FIG. 11, the main body 82 of the nozzle 80 includes a hollow portion 86 that opens inside, and a supply path 88 that extends into the hollow portion 86. At this time, unlike the supply path shown in FIG. 4, the supply path 88 has a taper that gradually narrows from the outer peripheral side of the article to be cleaned 1 to the center side. The holes 88a to be arranged are provided, and the gaps between the holes 88a are formed so as to gradually narrow toward the center. As a result, the nozzle 80 can uniformly supply the cleaning liquid and the pressurized gas from the supply unit 88 into the hollow portion 86 of the main body 82, and can jet the nozzle 80 at a constant jet output from the center to the outer periphery of the slit.
[0032]
According to still another embodiment of such a nozzle, a simple slit having a gentle curve extending in the rotation direction T from the center to the outer periphery and extending in parallel on the surface of the article 1 to be cleaned is provided. Due to the structure, this curve generates a liquid flow for discharging foreign substances to the outer peripheral side without blocking the radius line of the object 1 to be cleaned, so that the same effect as the nozzle shown in FIG. The setting and adjustment of the arrangement position becomes easier as compared with a nozzle arranged in an inclined or curved shape on the surface of the cleaning object 1.
[0033]
As described above, the embodiments of the wet cleaning apparatus and the nozzle used for the same according to the present invention have been described in detail. However, the present invention is not limited to the above-described embodiments, and can be changed without departing from the gist thereof. .
For example, the embodiment of the nozzle fixed at a predetermined angle on the surface of the object to be cleaned has been described in detail, but the present invention is not limited to this, and the angle can be arbitrarily changed according to the number of revolutions of the object to be cleaned. May be provided.
[0034]
【The invention's effect】
As described above, according to the wet cleaning apparatus and the nozzle used for the same according to the present invention, the cleaning liquid that is sprayed on the rotating surface of the object to be cleaned on the radial line and cut off generates a liquid flow that flows from the center to the outer peripheral side, The foreign matter can be satisfactorily removed using the liquid flow without obstructing the liquid flow of the cleaning liquid discharged to the outer peripheral side due to the centrifugal force, and the cleaning effect can be further improved.
[Brief description of the drawings]
FIG. 1 is a diagram showing an embodiment of a wet cleaning apparatus and a nozzle used in the apparatus according to the present invention.
FIG. 2 is a diagram showing an appearance of a nozzle shown in FIG.
FIG. 3 is a diagram showing the internal structure of the nozzle shown in FIG.
FIG. 4 is a view showing a cross section taken along line BB shown in FIG. 2;
FIG. 5 is a diagram showing the state of the nozzle as viewed from the direction of arrow A shown in FIG. 1;
FIG. 6 is a view showing another embodiment of the slit shown in FIG. 2;
FIG. 7 is a view showing still another embodiment of the slit shown in FIG. 2;
FIG. 8 is a view showing another embodiment of the nozzle shown in FIG. 2;
FIG. 9 is a view showing the appearance of the nozzle shown in FIG. 8;
FIG. 10 is a view showing still another embodiment of the nozzle shown in FIG. 2;
FIG. 11 is a diagram showing a cross section taken along line CC shown in FIG. 10;
FIG. 12 is a diagram showing an embodiment of a conventional wet cleaning apparatus and a nozzle used for the apparatus.
FIG. 13 is a view showing a state viewed from the direction of arrow D shown in FIG. 12;
FIG. 14 is a view showing a cross section taken along line EE shown in FIG. 13;
[Explanation of symbols]
1 Items to be cleaned
10 nozzles
12 body
14 slit
16 hollow part
18 Supply path
18a hole
20 Support
30 Supply unit
31 Supply pipe
40 rotating means
42 rotation axis
44 Drive source

Claims (16)

In a wet cleaning apparatus for cleaning an object to be cleaned such as a semiconductor wafer and a disk-shaped glass substrate by rotating the object to be cleaned by pressurizing and jetting a cleaning liquid from a nozzle onto a surface with a pressurized gas,
Rotating means for gripping and rotating the object to be cleaned,
A support unit that supports and arranges the nozzle on the surface of the object to be cleaned,
A supply unit that supplies the cleaning liquid and the pressurized gas to the nozzle,
A main body that is supported by the support section and extends between the radii from the outer periphery to the center in opposition to the surface of the object to be cleaned, and supplies the cleaning liquid and the pressurized gas from the supply section, and And a nozzle which is arranged in a slanted or curved shape so that the slit is gently approached from the outer periphery toward the center on the surface of the object to be cleaned. Wet cleaning equipment. The wet cleaning device according to claim 1,
The main body of the nozzle has a hollow hollow portion extending in the radial direction of the object to be cleaned therein, the slit cut through the hollow portion toward the object to be cleaned, and extends along the hollow portion. A supply path for individually supplying the cleaning liquid and the pressurized gas and discharging the cleaning liquid and the pressurized gas through a plurality of holes arranged and opened on the outer peripheral surface. A wet cleaning apparatus, wherein a pressurized gas is released and mixed to eject the gas from the slit. The wet cleaning device according to claim 1 or 2,
The wet cleaning apparatus, wherein the slit extends linearly or wavyly in a radial direction of the object to be cleaned. The wet cleaning device according to claim 1 or 2,
The slit is formed such that the center side of the object to be cleaned is formed in a wavy line, the height of the wave is gradually narrowed toward the outer peripheral side, and substantially linear at the outer peripheral end side. Wet cleaning equipment. The wet cleaning device according to claim 1,
The wet cleaning device, wherein the support unit movably supports the nozzle outside the outer periphery so that the cleaning liquid does not drop from the slit on the surface of the object to be cleaned after cleaning by the nozzle. . In a wet cleaning apparatus for cleaning an object to be cleaned such as a semiconductor wafer and a disk-shaped glass substrate by rotating the object to be cleaned by pressurizing and jetting a cleaning liquid from a nozzle onto a surface with a pressurized gas,
Rotating means for gripping and rotating the object to be cleaned,
A support unit that supports and arranges the nozzle on the surface of the object to be cleaned,
A supply unit that supplies the cleaning liquid and the pressurized gas to the nozzle,
A main body that is supported by the support portion and extends between the radii from the outer periphery to the center in parallel to the surface of the object to be cleaned, and supplies the cleaning liquid and the pressurized gas from the supply portion; A nozzle is provided that has a slit that is sprayed almost perpendicularly between the radii and that the slit has a gentle curve parallel to the rotation direction of the object to be cleaned from the center between the radii to the outer periphery. Wet cleaning device characterized by the above-mentioned. The wet cleaning device according to claim 6,
The main body of the nozzle has a hollow hollow portion extending in the radial direction of the object to be cleaned therein, the slit cut through the hollow portion toward the object to be cleaned, and extends along the hollow portion. A supply path for individually supplying the cleaning liquid and the pressurized gas and discharging the cleaning liquid and the pressurized gas through a plurality of holes arranged and opened on the outer peripheral surface. A wet cleaning apparatus, wherein a pressurized gas is released and mixed to eject the gas from the slit. The wet cleaning device according to claim 7,
The supply path is provided with a taper that becomes narrower toward the center in a hollow portion of the nozzle that extends from the outer periphery of the article to be cleaned to the center. A wet cleaning apparatus characterized in that the cleaning apparatus is gradually narrowed toward the center. The wet cleaning device according to claim 6,
The wet cleaning apparatus according to claim 1, wherein the support unit movably supports the nozzle outside the outer periphery so that the cleaning liquid does not drip from the slit above the object to be cleaned after cleaning by the nozzle. In a nozzle used in a wet cleaning apparatus that rotates an object to be cleaned such as a semiconductor wafer and a disk-shaped glass substrate and cleans the surface by pressurizing and spraying a cleaning liquid onto the surface with a pressurized gas,
Having a main body extending between the radii from the outer periphery to the center facing the surface of the object to be cleaned, and having a slit for supplying the cleaning liquid and the pressurized gas and ejecting the cleaning liquid substantially perpendicularly on the radius line, A nozzle for use in a wet cleaning apparatus, wherein the slit is arranged in an inclined or curved shape so as to gradually approach the surface of the object to be cleaned from the outer periphery toward the center. A nozzle used in the wet cleaning device according to claim 10,
The main body has a hollow hollow portion extending in the radial direction of the object to be cleaned therein, the slit cut through the hollow portion toward the object to be cleaned, and extends along the hollow portion. A supply path for individually supplying the cleaning liquid and the pressurized gas and discharging the cleaning liquid and the pressurized gas with a plurality of holes arranged and opened on the outer peripheral surface, and the cleaning liquid and the pressurized gas are supplied from the supply path into the hollow portion. A nozzle used in a wet cleaning apparatus, wherein the nozzle is ejected from the slit by discharging and mixing. A nozzle used in the wet cleaning device according to claim 10 or 11,
A nozzle used in a wet cleaning apparatus, wherein the slit extends linearly or wavyly in a radial direction of the object to be cleaned. A nozzle used in the wet cleaning device according to claim 10 or 11,
The slit is formed such that the center side of the object to be cleaned is formed in a wavy line, the height of the wave is gradually narrowed toward the outer peripheral side, and substantially linear at the outer peripheral end side. Nozzle used in wet cleaning equipment. In a nozzle used in a wet cleaning apparatus that rotates an object to be cleaned such as a semiconductor wafer and a disk-shaped glass substrate and cleans the surface by pressurizing and spraying a cleaning liquid onto the surface with a pressurized gas,
A main body extending parallel to a surface of the object to be cleaned and extending between radii from an outer periphery to a center, and provided with a slit for supplying the cleaning liquid and a pressurized gas and injecting the cleaning liquid substantially perpendicularly to the radius; A nozzle used in the wet cleaning apparatus, wherein the slit is arranged so as to have a gentle curve from the center between the radii to the outer periphery in parallel with the rotation direction of the object to be cleaned. A nozzle used in the wet cleaning device according to claim 14,
The main body has a hollow hollow portion extending in the radial direction of the object to be cleaned therein, the slit cut through the hollow portion toward the object to be cleaned, and extends along the hollow portion. A supply path for individually supplying the cleaning liquid and the pressurized gas and discharging the cleaning liquid and the pressurized gas with a plurality of holes arranged and opened on the outer peripheral surface, and the cleaning liquid and the pressurized gas are supplied from the supply path into the hollow portion. A nozzle used in a wet cleaning apparatus, wherein the nozzle is ejected from the slit by discharging and mixing. A nozzle used in the wet cleaning device according to claim 15,
The supply path is provided with a taper that becomes narrower toward the center in the hollow portion extending from the outer periphery of the article to be cleaned to the center. A nozzle for use in a wet cleaning device, which is provided gradually narrower toward the side.

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