CN110600403A - Wafer etching device - Google Patents
Wafer etching device Download PDFInfo
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- CN110600403A CN110600403A CN201910797351.2A CN201910797351A CN110600403A CN 110600403 A CN110600403 A CN 110600403A CN 201910797351 A CN201910797351 A CN 201910797351A CN 110600403 A CN110600403 A CN 110600403A
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- liquid outlet
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- 238000005530 etching Methods 0.000 title claims abstract description 98
- 239000007788 liquid Substances 0.000 claims abstract description 197
- 239000003595 mist Substances 0.000 claims description 19
- 238000011084 recovery Methods 0.000 claims description 15
- 238000004140 cleaning Methods 0.000 claims description 9
- 238000005507 spraying Methods 0.000 claims description 9
- 238000007599 discharging Methods 0.000 claims description 6
- 235000012431 wafers Nutrition 0.000 description 85
- 238000000034 method Methods 0.000 description 6
- 239000007921 spray Substances 0.000 description 5
- 230000005540 biological transmission Effects 0.000 description 4
- 239000008187 granular material Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Weting (AREA)
Abstract
The embodiment of the application discloses wafer etching device, including first nozzle, first nozzle includes: the first sliding component, the second sliding component and the middle connecting part; the first sliding component and the second sliding component are respectively positioned at the upper side and the lower side of the middle connecting part; the side wall of the first sliding assembly and the side wall of the second sliding assembly can protrude out of the side wall of the middle connecting part, so that an accommodating groove for accommodating the edge of the etched wafer is formed by enclosing the lower surface of the first sliding assembly, the side wall of the middle connecting part and the upper surface of the second sliding assembly; the first sliding assembly is connected with the upper surface of the middle connecting part in a sliding manner, and the second sliding assembly is connected with the lower surface of the middle connecting part in a sliding manner, so that the first sliding assembly and the second sliding assembly respectively move along the diameter direction of the wafer; be provided with first liquid outlet and the second liquid outlet towards the holding tank on first sliding component and the second sliding component respectively, first liquid outlet and second liquid outlet are used for blowout sculpture liquid.
Description
Technical Field
The embodiment of the application relates to the field of semiconductor manufacturing, in particular to a wafer etching device.
Background
In the fabrication of semiconductor devices, wafers are subjected to processes such as photolithography, etching, deposition, and cleaning, thereby forming electronic circuits required for the semiconductor devices. However, the film deposited on the wafer often has a non-uniform thickness problem, which is particularly significant near the wafer edge (wafer level), and often results in a particularly thick wafer near the wafer edge, which has a great influence on the yield of the semiconductor device.
The existing various crystal edge etching methods cannot flexibly regulate and control the position of a nozzle, so that the crystal edge etching distance cannot be well controlled, and in the etching process, if the position of the nozzle is improperly set, the problem of splashing of etching liquid is easily caused, so that the achieved etching effect is not ideal.
Disclosure of Invention
Accordingly, the embodiments of the present application provide a wafer etching apparatus to solve at least one of the problems of the prior art.
In order to achieve the above purpose, the technical solution of the embodiment of the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a wafer etching apparatus, including a first nozzle, where the first nozzle includes: the first sliding component, the second sliding component and the middle connecting part; wherein,
the first sliding assembly and the second sliding assembly are respectively positioned at the upper side and the lower side of the middle connecting part;
the side wall of the first sliding assembly and the side wall of the second sliding assembly can protrude out of the side wall of the middle connecting part, so that a containing groove is defined among the lower surface of the first sliding assembly, the side wall of the middle connecting part and the upper surface of the second sliding assembly, and the containing groove is used for containing the edge of the etched wafer;
the first sliding assembly is connected with the upper surface of the intermediate connecting part in a sliding manner, and the second sliding assembly is connected with the lower surface of the intermediate connecting part in a sliding manner, so that the first sliding assembly and the second sliding assembly can respectively move along the diameter direction of the wafer;
be provided with the orientation on the first sliding component the first liquid outlet of holding tank, be provided with the orientation on the second sliding component the second liquid outlet of holding tank, first liquid outlet with the second liquid outlet is used for the sculpture liquid of blowout.
In an alternative embodiment, the apparatus further comprises:
the pressurizing assembly is connected with the first liquid outlet on the first sliding assembly and/or connected with the second liquid outlet on the second sliding assembly; the pressurizing assembly is used for pressurizing the etching liquid into a mist shape and then spraying the mist from the first liquid outlet and/or the second liquid outlet.
In an alternative embodiment, the apparatus further comprises:
and the first suction component is connected with the accommodating groove and is used for sucking the etching liquid accommodated in the first liquid outlet and/or the second liquid outlet into a mist state and then spraying the etching liquid out of the first liquid outlet and/or the second liquid outlet.
In an alternative embodiment, the apparatus further comprises:
the driving assembly is connected with the first sliding assembly and/or the second sliding assembly and used for controlling the first sliding assembly and/or the second sliding assembly to move.
In an alternative embodiment, a recovery port communicating with the holding tank is provided in the intermediate connection portion, and the recovery port is configured to recover the etching liquid ejected from the first liquid outlet and/or the second liquid outlet.
In an alternative embodiment, the recycling opening is a funnel-shaped through hole.
In an alternative embodiment, the apparatus further comprises:
and the second suction assembly is connected with the recovery port and is used for recovering and discharging the etching liquid through suction.
In an alternative embodiment, the first liquid outlet is arranged at the far end of the first sliding assembly in the wafer rotation direction;
and/or the second liquid outlet is arranged at the far end of the second sliding assembly along the rotation direction of the wafer.
In an alternative embodiment, the apparatus further comprises:
a second nozzle for ejecting a cleaning liquid.
In an alternative embodiment, the second nozzle is identical in construction to the first nozzle.
The embodiment of the application provides a wafer etching device, including first nozzle, first nozzle includes: the first sliding component, the second sliding component and the middle connecting part; the first sliding assembly and the second sliding assembly are respectively positioned at the upper side and the lower side of the middle connecting part; the side wall of the first sliding assembly and the side wall of the second sliding assembly can protrude out of the side wall of the middle connecting part, so that a containing groove is defined among the lower surface of the first sliding assembly, the side wall of the middle connecting part and the upper surface of the second sliding assembly, and the containing groove is used for containing the edge of the etched wafer; the first sliding assembly is connected with the upper surface of the intermediate connecting part in a sliding manner, and the second sliding assembly is connected with the lower surface of the intermediate connecting part in a sliding manner, so that the first sliding assembly and the second sliding assembly can respectively move along the diameter direction of the wafer; be provided with the orientation on the first sliding component the first liquid outlet of holding tank, be provided with the orientation on the second sliding component the second liquid outlet of holding tank, first liquid outlet with the second liquid outlet is used for the sculpture liquid of blowout. The embodiment of the application can control the sliding assembly to move according to actual conditions, so that the adjustment of the etching range of the wafer is more flexible; the problem of splashing of etching liquid is weakened by flexibly controlling the sliding assembly and the position of a liquid outlet on the sliding assembly; in addition, the first sliding assembly and the second sliding assembly can be respectively controlled to move, so that etching of different ranges of the upper surface and the lower surface of the wafer can be realized.
Drawings
FIG. 1 is a perspective view of an embodiment of a wafer etching apparatus according to an embodiment of the present disclosure;
FIG. 2 is a side cross-sectional view of one embodiment of a first nozzle provided in an example of the present application;
FIG. 3 is a side cross-sectional view of another embodiment of a first nozzle provided in an example of the present application;
FIG. 4 is a side cross-sectional view of yet another embodiment of a first nozzle provided in an example of the present application.
Detailed Description
The technical solutions of the embodiments of the present application will be further elaborated with reference to the drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.
Embodiments of the present application are described more fully in the following paragraphs with reference to the accompanying drawings by way of example. Advantages and features of embodiments of the present application will become apparent from the following description and claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present application.
In the embodiment of the present application, the term "a is connected to B" includes A, B where a is connected to B in contact with each other, or A, B where a is connected to B in a non-contact manner with another component interposed therebetween.
In the embodiments of the present application, the terms "first", "second", and the like are used for distinguishing similar objects, and are not necessarily used for describing a particular order or sequence.
The technical means described in the embodiments of the present application may be arbitrarily combined without conflict.
Fig. 1 is a perspective view of an embodiment of a wafer etching apparatus according to an embodiment of the present application, and fig. 2 is a side cross-sectional view of an embodiment of a first nozzle according to an embodiment of the present application, as shown in fig. 1 and 2, the embodiment of the present application provides a wafer etching apparatus including a first nozzle 100, the first nozzle 100 including: a first slider assembly 110, a second slider assembly 120, and an intermediate connecting portion 130; wherein,
the first sliding member 110 and the second sliding member 120 are respectively located at the upper and lower sides of the middle connecting portion 130;
the side walls of the first sliding element 110 and the second sliding element 120 can protrude from the side walls of the intermediate connecting portion 130, so as to form a receiving groove between the lower surface of the first sliding element 110, the side walls of the intermediate connecting portion 130, and the upper surface of the second sliding element 120, where the receiving groove is used for receiving the edge of the etched wafer;
the first slide module 110 is slidably connected to an upper surface of the intermediate connecting portion 130, and the second slide module 120 is slidably connected to a lower surface of the intermediate connecting portion 130, so that the first slide module 110 and the second slide module 120 can move in a diameter direction of the wafer, respectively;
first sliding component 110 is last to be provided with the orientation first liquid outlet 111 of holding tank, be provided with the orientation on the second sliding component 120 the second liquid outlet 121 of holding tank, first liquid outlet 111 with second liquid outlet 121 is used for the blowout sculpture liquid.
It should be noted that the arrow passing through the first liquid outlet 111 in fig. 1 is used to indicate the conveying direction of the etching liquid.
In this embodiment of the application, when the edge of the etched wafer is accommodated in the accommodating groove, the first liquid outlet 111 disposed on the first sliding assembly 110 faces the upper surface of the etched wafer, and the first liquid outlet 111 is used for spraying an etching liquid onto the upper surface of the etched wafer; the second liquid outlet 121 disposed on the second sliding assembly 120 faces the lower surface of the etched wafer, and the second liquid outlet 121 is used for spraying etching liquid to the lower surface of the etched wafer.
In the embodiment, the first sliding member 110 may have a square, rectangular or any other three-dimensional shape capable of slidably connecting with the upper surface of the middle connection portion 130. The second sliding member 120 may have a cubic shape, a rectangular parallelepiped shape, or any other three-dimensional shape capable of slidably connecting with the lower surface of the middle connecting portion 130.
In practical applications, a first sliding rail (not shown) may be disposed at a connection position of the first sliding assembly 110 and the intermediate connecting portion 130; a second slide rail (not shown) may be disposed at a connection point of the second sliding member 120 and the intermediate connecting portion 130, so that the first sliding member 110 and the second sliding member 120 can move in various directions. For example, after the wafer etching is completed, the first sliding member 110 and the second sliding member 120 may be controlled to move to a position flush with the side wall of the intermediate connecting portion 130, and the receiving groove no longer exists, so that the movement operations of placing, taking out, turning over, etc. of the wafer are not limited by the receiving groove (or the first sliding member 110 and the second sliding member 120).
In some embodiments, the apparatus further comprises: a driving assembly (not shown in the figures) connected to the first sliding assembly 110 and/or the second sliding assembly 120 for controlling the first sliding assembly 110 and/or the second sliding assembly 120 to move.
In practical applications, the driving assembly may control the first sliding assembly 110 and/or the second sliding assembly 120 to move along the diameter direction of the wafer, respectively, so that the first sliding assembly 110 and/or the second sliding assembly 120 may be flexibly controlled to move to different positions along the diameter direction of the wafer according to the requirement of an actual etching range. It should be noted that the first sliding assembly 110 and the second sliding assembly 120 may respectively move to different positions along the diameter direction of the wafer, that is, in the embodiment of the present invention, the first liquid outlet 111 and the second liquid outlet 121 may respectively move to different positions along the diameter direction of the wafer, so as to etch the upper surface and the lower surface of the wafer in different ranges, and the moving distance of the first sliding assembly 110 and the second sliding assembly 120 is not limited by the size of the accommodating groove, and the first sliding assembly 110 and the second sliding assembly 120 may also move to a position flush with the side wall of the intermediate connecting portion 130, so that the moving operations of placing, taking out, turning and the like of the wafer are not limited.
In this embodiment of the application, as shown in fig. 2, the first liquid outlet 111 disposed on the first sliding assembly 110 may be a cylindrical through hole, one end of the first liquid outlet 111 faces the accommodating groove, and the other end of the first liquid outlet 111 is connected to an external etching liquid pipeline (a solid line pipeline connected to the first liquid outlet 111, an arrow in the solid line pipeline indicates a transmission direction of the etching liquid), so that the etching liquid in the etching liquid pipeline is sprayed out from the first liquid outlet 111.
Fig. 3 is a side cross-sectional view of another embodiment of the first nozzle provided in this embodiment, as shown in fig. 3, in another embodiment of this application, a built-in etching liquid pipeline (a dotted line pipeline in the first sliding assembly 110, an arrow in the dotted line pipeline indicates a transmission direction of the etching liquid) may also be disposed in the first sliding assembly 110, the first liquid outlet 111 is disposed on the first sliding assembly 110 as an outlet end of the etching liquid pipeline, and the first liquid outlet 111 faces the accommodating groove.
In this embodiment of the application, as shown in fig. 2, the second liquid outlet 121 disposed on the second sliding assembly 120 may be a cylindrical through hole, one end of the second liquid outlet 121 faces the accommodating groove, and the other end of the second liquid outlet 121 is connected to an external etching liquid pipeline (a solid line pipeline connected to the second liquid outlet 121, an arrow in the solid line pipeline indicates a transmission direction of the etching liquid), so that the etching liquid in the etching liquid pipeline is sprayed out from the second liquid outlet 121.
In another embodiment of the present application, as shown in fig. 3, a built-in etching liquid pipeline may also be disposed in the second sliding assembly 120 (a dotted line pipeline in the second sliding assembly 120, an arrow in the dotted line pipeline indicates a transmission direction of the etching liquid), the second liquid outlet 121 is disposed on the second sliding assembly 120 as an outlet end of the etching liquid pipeline, and the second liquid outlet 121 faces the accommodating groove.
In some embodiments, the apparatus further comprises: a pressurizing assembly (not shown) connected to the first liquid outlet 111 of the first sliding assembly 110 and/or connected to the second liquid outlet 121 of the second sliding assembly 120; the pressurizing assembly is configured to pressurize the etching liquid into a mist and then spray the mist out of the first liquid outlet 111 and/or the second liquid outlet 121.
In this application embodiment, when carrying out the sculpture, first liquid outlet 111 with second liquid outlet 121 blowout vaporific sculpture liquid extremely the wafer surface, the sculpture liquid of spun is vaporific in the follow liquid outlet, and its atomizing sculpture liquid granule is even, and the quality is little, can reduce the impact force of sculpture liquid to the wafer to the reduction is to the structural damage of wafer, and because atomizing sculpture liquid granule quality is little, and flow stability, therefore can also reduce splashing of sculpture liquid at to a great extent, thereby, improves the yield of wafer.
In practical application, the pressurizing assembly at least comprises: the gas inlet end is connected with a gas pipeline, and the gas outlet end is connected with the first liquid outlet 111 on the first sliding assembly 110 and/or connected with the second liquid outlet 121 on the second sliding assembly 120. And pressure valves for conducting or isolating the air inlet end and the air outlet end are respectively arranged in the air inlet end and the air outlet end.
In practical application, the pressurizing assembly can further be provided with two gas outlet ends, which are respectively connected with the first liquid outlet 111 and the second liquid outlet 121, and according to different etching requirements of the upper surface and the lower surface of the wafer, the etching liquid is pressurized into a mist shape by using different pressure values and then is respectively sprayed out from the first liquid outlet 111 and the second liquid outlet 121. It should be noted that, pressure valves are respectively arranged in the two air outlet ends, and the pressure valves can adjust the spraying amount and the spraying pressure of the mist etching liquid by opening and closing the air flow passage and/or adjusting the flow cross-sectional area of the air flow passage, so as to control the etching degree and effect.
Wherein, the pressure valve can be a manual valve and can also be an automatic valve. The automatic valve may comprise an electrically controlled valve or a solenoid valve.
In practical application, the pressurizing assembly may be connected to the etching liquid pipeline, and the pressurizing assembly is configured to pressurize the etching liquid into a mist shape and then eject the etching liquid from the first liquid outlet 111 and/or the second liquid outlet 121 through the etching liquid pipeline.
In some embodiments, the apparatus further comprises: and a first suction component (not shown in the figure), which is connected to the accommodating groove and is configured to suck the etching liquid accommodated in the first liquid outlet 111 and/or the second liquid outlet 121 into a mist shape and then spray the mist out of the first liquid outlet 111 and/or the second liquid outlet 121.
In practical applications, the first suction component may be a vacuum pump, a flow rate pump, a mechanical pump, a molecular pump, or a suction fan, which is capable of generating suction.
In the embodiment of the present application, as shown in fig. 2, a recovery port 131 communicating with the holding tank is provided in the intermediate connecting portion 130, and the recovery port 131 is used for recovering the etching liquid sprayed from the first liquid outlet 111 and/or the second liquid outlet 121. Wherein, retrieve mouthful 131 for the through-hole that leaks hopper-shaped, the cone body part setting of through-hole is in the one side that is close to the liquid outlet, and such being provided with does benefit to the recovery of etching liquid, prevents that the remaining condition of etching liquid from appearing.
In some embodiments, the apparatus further comprises: and a second suction assembly (not shown in the figure) connected to the recovery port 131 for recovering and discharging the etching liquid by suction.
In practical application, the second suction assembly can be a vacuum pump, a flow rate pump, a mechanical pump, a molecular pump or an exhaust fan and the like, which can generate suction force, and the second suction assembly is connected with the recovery port 131 and is used for recovering and discharging the etching liquid through the suction force.
It should be noted that, in some embodiments, the first suction assembly and the second suction assembly may be two independent suction assemblies, and are respectively used for realizing a function of sucking the etching liquid into mist and a function of recovering and discharging the etching liquid; in other embodiments, the first suction assembly and the second suction assembly may also be the same suction assembly, and in practical application, the first suction assembly and the second suction assembly are used for sucking the etching liquid into mist, and recovering and discharging the etching liquid. And a suction valve is arranged in the suction component to control different suction strengths. Wherein, the sucking valve can be a manual valve and can also be an automatic valve. The automatic valve may comprise an electrically controlled valve or a solenoid valve.
In the embodiment of the present application, the first liquid outlet 111 is disposed at a far end of the first sliding assembly 110 along a wafer rotation direction; and/or the second liquid outlet 121 is disposed at the far end of the second slide assembly 120 in the wafer rotation direction.
As shown in fig. 1, during etching, the wafer rotates clockwise, and the first liquid outlet 111 is disposed at the edge of the left side (left side corresponding to the center of the wafer) of the first sliding assembly 110, so that when spraying mist etching liquid, the mist etching liquid is not driven to the right side (right side corresponding to the center of the wafer) of the first sliding assembly 110 by the rotation force of the wafer; second liquid outlet 121 sets up the left side (the left side that corresponds when looking at the wafer centre of a circle) edge of second sliding assembly 120 to when the vaporific sculpture liquid of blowout, vaporific sculpture liquid can not be because of the commentaries on classics power of wafer is driven extremely the right side (the right side that corresponds when looking at the wafer centre of a circle) of second sliding assembly 120, so, compare in the center department with the liquid outlet setting at sliding assembly, such setting up of this application embodiment has reduced the pollution of sculpture liquid to first nozzle 100.
It should be noted that the etching liquid in the embodiment of the present application is a liquid capable of etching a wafer, and the technical solution in the embodiment of the present application does not limit the etching liquid.
In some embodiments, the apparatus further comprises: a second nozzle 200, the second nozzle 200 for ejecting the cleaning liquid. Wherein, the cleaning liquid can be deionized water.
As shown in fig. 1, the second nozzle 200 includes: a third slider assembly 210, a fourth slider assembly 220, and an intermediate connecting portion 230; wherein,
the third sliding member 210 and the fourth sliding member 220 are respectively located at the upper and lower sides of the middle connection portion 230;
the side walls of the third sliding element 210 and the fourth sliding element 220 can protrude from the side walls of the intermediate connecting portion 230, so as to form a receiving groove between the lower surface of the third sliding element 210, the side walls of the intermediate connecting portion 230, and the upper surface of the fourth sliding element 220, wherein the receiving groove is used for receiving the edge of the etched wafer;
a third liquid outlet 211 facing the accommodating groove is formed in the third sliding assembly 210, a fourth liquid outlet 221 (not shown) facing the accommodating groove is formed in the fourth sliding assembly 220, and the third liquid outlet 211 and the fourth liquid outlet 221 are used for ejecting the cleaning liquid;
a recovery port 231 communicating with the accommodation groove is provided in the intermediate connection portion 230, and the recovery port 231 is used for recovering the cleaning liquid ejected from the third liquid outlet 211 and/or the fourth liquid outlet 221.
It should be noted that the arrow passing through the third liquid outlet 211 in fig. 1 is used to indicate the conveying direction of the cleaning liquid.
It should be noted that, in the embodiment of the present application, the second nozzle 200 has the same structure as the first nozzle 100, and has similar beneficial effects, and therefore, the detailed description is omitted. For technical details that are not disclosed in the second nozzle 200 of the embodiment of the present application, please refer to the description of the first nozzle 100 of the embodiment of the present application for understanding.
This application embodiment etches the wafer through first nozzle 100, and wash the wafer through second nozzle 200, two nozzles can carry out its function that corresponds simultaneously, compare in respectively carrying out sculpture and abluent mode to the wafer through switching over the nozzle, this application embodiment need not to switch over the nozzle, and two nozzles can be according to actual conditions control its time of spouting liquid, thereby realize cleaning process and etching process's seamless connection, etching and abluent time have been practiced thrift to a very big extent, thereby the productivity ratio of wafer has been improved.
The embodiment of the application sprays the atomized etching liquid to the wafer through the liquid outlet, the wafer is etched, and a recovery port which can suck, pump and discharge the atomized liquid is further arranged in the nozzle, so that the problems of splashing of the liquid medicine and recovery of the liquid medicine in the wafer etching process are solved, the sliding assembly can be controlled to move along the diameter direction of the wafer according to actual conditions, and the etching range can be adjusted more flexibly.
The wafer etching apparatus according to the embodiment of the present application will be described in detail below with reference to fig. 3 and 4.
As shown in fig. 3, an embodiment of the present application provides a wafer etching apparatus, including a first nozzle 100, where the first nozzle 100 includes: a first slider assembly 110, a second slider assembly 120, and an intermediate connecting portion 130; wherein,
a receiving groove is defined between the lower surface of the first sliding member 110, the side wall of the intermediate connecting portion 130, and the upper surface of the second sliding member 120, and is used for receiving the edge of the etched wafer;
the first sliding assembly 110 and the second sliding assembly 120 are respectively positioned at the upper side and the lower side of the etched wafer; the first liquid outlet 111 arranged on the first sliding assembly 110 faces the upper surface of the etched wafer, so that the first liquid outlet 111 can spray mist etching liquid to the upper surface of the etched wafer; the second liquid outlet 121 disposed on the second sliding assembly 120 faces the lower surface of the etched wafer, so that the second liquid outlet 121 can spray mist etching liquid to the lower surface of the etched wafer;
the first sliding member 110 is slidably connected to an upper surface of the intermediate connecting portion 130, and the second sliding member 120 is slidably connected to a lower surface of the intermediate connecting portion 130.
Fig. 3-4 may be provided as a series of side cross-sectional views illustrating sequential steps of etching an edge of a wafer by a first nozzle in accordance with an embodiment of the present application. As shown in fig. 3 and 4, the etching range of the upper surface of the wafer can be controlled by adjusting the distance that the first sliding assembly 110 (the first liquid outlet 111) moves in the diameter direction of the wafer; the etching range of the lower surface of the wafer can be controlled by adjusting the distance that the second sliding assembly 120 (the second liquid outlet 121) moves along the diameter direction of the wafer, as shown in fig. 4, the first sliding assembly 110 (the first liquid outlet 111) moves along the diameter direction of the wafer to a position closer to the center of the wafer in fig. 3, so that the etching range of the upper surface of the wafer in fig. 4 is wider than that in fig. 3; the second sliding assembly 120 (the second liquid outlet 121) moves to a position closer to the center of the wafer in fig. 3 along the diameter direction of the wafer, so that the etching range of the lower surface of the wafer in fig. 4 is wider than that in fig. 3. It should be noted that the moving distances of the first sliding component 110 and the second sliding component 120 can be adjusted and controlled respectively, that is, the moving distances of the first sliding component 110 and the second sliding component 120 can be the same or different. Since the first slide assembly 110 and the second slide assembly 120 can be controlled by the driving assembly, respectively, etching of different ranges on the upper surface and the lower surface of the wafer can be achieved.
In this application embodiment, when carrying out the sculpture, first liquid outlet 111 with second liquid outlet 121 blowout vaporific sculpture liquid extremely the wafer surface, the sculpture liquid of spun is vaporific in the follow liquid outlet, and its atomizing sculpture liquid granule is even, and the quality is little, can reduce the impact force of sculpture liquid to the wafer to the reduction is to the structural damage of wafer, and because atomizing sculpture liquid granule quality is little, and flow stability, therefore can also reduce splashing of sculpture liquid at to a great extent, thereby, improves the yield of wafer.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus may be implemented in other manners. The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (10)
1. A wafer etching apparatus comprising a first nozzle, the first nozzle comprising: the first sliding component, the second sliding component and the middle connecting part; wherein,
the first sliding assembly and the second sliding assembly are respectively positioned at the upper side and the lower side of the middle connecting part;
the side wall of the first sliding assembly and the side wall of the second sliding assembly can protrude out of the side wall of the middle connecting part, so that a containing groove is defined among the lower surface of the first sliding assembly, the side wall of the middle connecting part and the upper surface of the second sliding assembly, and the containing groove is used for containing the edge of the etched wafer;
the first sliding assembly is connected with the upper surface of the intermediate connecting part in a sliding manner, and the second sliding assembly is connected with the lower surface of the intermediate connecting part in a sliding manner, so that the first sliding assembly and the second sliding assembly can respectively move along the diameter direction of the wafer;
be provided with the orientation on the first sliding component the first liquid outlet of holding tank, be provided with the orientation on the second sliding component the second liquid outlet of holding tank, first liquid outlet with the second liquid outlet is used for the sculpture liquid of blowout.
2. The wafer etching apparatus of claim 1, further comprising:
the pressurizing assembly is connected with the first liquid outlet on the first sliding assembly and/or connected with the second liquid outlet on the second sliding assembly; the pressurizing assembly is used for pressurizing the etching liquid into a mist shape and then spraying the mist from the first liquid outlet and/or the second liquid outlet.
3. The wafer etching apparatus of claim 1, further comprising:
and the first suction component is connected with the accommodating groove and is used for sucking the etching liquid accommodated in the first liquid outlet and/or the second liquid outlet into a mist state and then spraying the etching liquid out of the first liquid outlet and/or the second liquid outlet.
4. The wafer etching apparatus of claim 1, further comprising:
the driving assembly is connected with the first sliding assembly and/or the second sliding assembly and used for controlling the first sliding assembly and/or the second sliding assembly to move.
5. The wafer etching apparatus according to claim 1,
and a recovery port communicated with the accommodating groove is arranged in the intermediate connecting part and used for recovering the etching liquid sprayed out from the first liquid outlet and/or the second liquid outlet.
6. The wafer etching apparatus as claimed in claim 5, wherein the recovery port is a funnel-shaped through hole.
7. The wafer etching apparatus as recited in claim 5, further comprising:
and the second suction assembly is connected with the recovery port and is used for recovering and discharging the etching liquid through suction.
8. The wafer etching apparatus according to claim 1,
the first liquid outlet is arranged at the far end of the first sliding assembly along the rotation direction of the wafer;
and/or the second liquid outlet is arranged at the far end of the second sliding assembly along the rotation direction of the wafer.
9. The wafer etching apparatus of claim 1, further comprising:
a second nozzle for ejecting a cleaning liquid.
10. The wafer etching apparatus as recited in claim 9, wherein the second nozzle is identical in structure to the first nozzle.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111627793.6A CN114400192A (en) | 2019-08-27 | 2019-08-27 | Wafer etching device |
| CN201910797351.2A CN110600403B (en) | 2019-08-27 | 2019-08-27 | Wafer etching device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910797351.2A CN110600403B (en) | 2019-08-27 | 2019-08-27 | Wafer etching device |
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| CN202111627793.6A Division CN114400192A (en) | 2019-08-27 | 2019-08-27 | Wafer etching device |
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| CN110600403A true CN110600403A (en) | 2019-12-20 |
| CN110600403B CN110600403B (en) | 2022-02-08 |
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| CN201910797351.2A Active CN110600403B (en) | 2019-08-27 | 2019-08-27 | Wafer etching device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112670207A (en) * | 2020-12-21 | 2021-04-16 | 长江存储科技有限责任公司 | Wafer edge processing equipment and processing method of wafer structure to be processed |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203707094U (en) * | 2014-02-19 | 2014-07-09 | 中芯国际集成电路制造(北京)有限公司 | Wafer edge cleaning device |
| CN104183524A (en) * | 2014-08-27 | 2014-12-03 | 上海华力微电子有限公司 | Wafer edge etching device |
| CN109300808A (en) * | 2018-09-26 | 2019-02-01 | 华进半导体封装先导技术研发中心有限公司 | A kind of semiconductor device for wet-treating crystal round fringes |
| US20190067041A1 (en) * | 2017-08-23 | 2019-02-28 | Tokyo Electron Limited | Substrate processing apparatus, substrate processing method, and storage medium |
| US20190080934A1 (en) * | 2017-09-14 | 2019-03-14 | Tokyo Electron Limited | Substrate processing apparatus, substrate processing method, and storage medium |
-
2019
- 2019-08-27 CN CN202111627793.6A patent/CN114400192A/en active Pending
- 2019-08-27 CN CN201910797351.2A patent/CN110600403B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203707094U (en) * | 2014-02-19 | 2014-07-09 | 中芯国际集成电路制造(北京)有限公司 | Wafer edge cleaning device |
| CN104183524A (en) * | 2014-08-27 | 2014-12-03 | 上海华力微电子有限公司 | Wafer edge etching device |
| US20190067041A1 (en) * | 2017-08-23 | 2019-02-28 | Tokyo Electron Limited | Substrate processing apparatus, substrate processing method, and storage medium |
| US20190080934A1 (en) * | 2017-09-14 | 2019-03-14 | Tokyo Electron Limited | Substrate processing apparatus, substrate processing method, and storage medium |
| CN109300808A (en) * | 2018-09-26 | 2019-02-01 | 华进半导体封装先导技术研发中心有限公司 | A kind of semiconductor device for wet-treating crystal round fringes |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112670207A (en) * | 2020-12-21 | 2021-04-16 | 长江存储科技有限责任公司 | Wafer edge processing equipment and processing method of wafer structure to be processed |
| CN112670207B (en) * | 2020-12-21 | 2023-10-31 | 长江存储科技有限责任公司 | Edge wafer processing equipment and processing method of wafer structure to be processed |
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| CN114400192A (en) | 2022-04-26 |
| CN110600403B (en) | 2022-02-08 |
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