CN104841660A - Gas-liquid two-phase atomization cleaning device and cleaning method - Google Patents
Gas-liquid two-phase atomization cleaning device and cleaning method Download PDFInfo
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- CN104841660A CN104841660A CN201510261375.8A CN201510261375A CN104841660A CN 104841660 A CN104841660 A CN 104841660A CN 201510261375 A CN201510261375 A CN 201510261375A CN 104841660 A CN104841660 A CN 104841660A
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- atomizer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
Abstract
The invention provides a gas-liquid two-phase atomization cleaning device and relates to the technical field of the semiconductor chip technology. The gas-liquid two-phase atomization cleaning device comprises a gas pipeline, a liquid pipeline and a gas-liquid two-phase atomization nozzle, one end of the gas pipeline and one end of the liquid pipeline are arranged on a swing arm while the other end of the gas pipeline and the other end of the liquid pipeline are communicated with the gas-liquid two-phase atomization nozzle to form atomization particles, and the swing arm drives the gas-liquid two-phase nozzle to reciprocate in a circular arc manner between the edge and the center of a wafer. High-speed liquid flow and high-speed gas flow are sufficiently acted through a gas-liquid two-phase atomization nozzle structure, superfine atomized droplets uniform in particle size are formed by adjusting gas flow rate and liquid flow rate of small flow rate, the superfine atomized droplets are sprayed on the surface of the wafer after being accelerated through the high-speed gas flow, and cleaning is completed. By the arrangement, transferring of impurities in troughs to a main flow body is promoted, efficiency in cleaning is improved, cleaning effect is improved, and damage to the surface structure of the wafer is reduced due to small quality of the atomization particles.
Description
Technical field
The invention belongs to technical field of semiconductor wafer technology, be specially a kind of gas-liquid two-phase atomization cleaner and cleaning method.
Background technology
The deep-submicron stage is being entered into along with integrated circuit feature size, the cleanliness factor of wafer surface required in IC wafer manufacturing process is more and more harsher, in order to ensure the cleanliness factor on wafer material surface, there is hundreds of roads matting in the manufacturing process of integrated circuit, matting account for 30% of whole manufacture process.
In semiconductor cleaning process, when cleaning liquid is with very high velocity shock wafer, a physical force can be produced to wafer, this active force can accelerate the mechanism of cleaning liquid and wafer surface impurity and pollutant, impel impurity and pollutant to be corroded by liquid phase fluid, dissolve or be suspended in liquid phase fluid.Under the centrifugal action that wafer rotational produces, the cleaning liquid including impurity and pollutant departs from wafer surface, completes the process of cleaning.
But along with the further reduction of wafer topography feature size, the liquid phase stream cognition of high velocity jet causes serious damage to the graphic structure of wafer surface.Traditional cleaning spraying technique ubiquity large-sized liquid-phase particle or liquid phase injection stream, and the damage for 65 nanometers and following process wafer surfacial pattern is very serious, and the utilization rate of liquid phase fluid is lower simultaneously, causes the profligacy of resource.
In order to reduce the damage to wafer topography, needing the size reducing the liquid particles ejected further, as sprayed liquid nano particle, reducing the damage of liquid particles to pattern side wall and corner.Therefore, those skilled in the art need a kind of gas-liquid two-phase atomization cleaner and cleaning method reducing wafer topography damage of research and development badly.
Summary of the invention
For the deficiencies in the prior art part, the object of the invention is, for reducing wafer topography damage in cleaning process, a kind of gas-liquid two-phase atomization cleaner to be provided, and a kind of cleaning method based on described gas-liquid two-phase atomization cleaner is provided, improve cleaning efficiency, improve cleaning performance.
The object of the invention is realized by following technical proposals:
The invention provides a kind of gas-liquid two-phase atomization cleaner, described device comprises gas pipeline, fluid pipeline and gas-liquid two-phase atomizer, one end of described gas pipeline and fluid pipeline is arranged in swing arm, its other end is communicated with described gas-liquid two-phase atomizer to form atomizing particle, and described swing arm drives described gas-liquid two-phase atomizer between Waffer edge and center wafer, do circular arc and moves back and forth, wherein, gas-liquid two-phase atomizer comprises jet element liquid main line, jet element gas piping, liquid discharge fluid apertures and gas venthole, described jet element liquid main line one end connects described fluid pipeline, the other end has some in divergent shape and the jet element liquid branch pipeline equidistantly distributed, it is the end face that predetermined angle tilts that described jet element liquid branch pipeline has with the axial direction of described gas-liquid two-phase atomizer, described end face has the liquid discharge fluid apertures of some preset diameters, described jet element gas piping sidewall is provided with gas piping interface to be communicated with described gas pipeline, between each jet element liquid branch pipeline, there is horizontally disposed fan-shaped web plate of giving vent to anger, described web plate of giving vent to anger is provided with the gas venthole of some preset diameters.
Preferably, the angle between the axial direction of described end face and described gas-liquid two-phase atomizer is 10 ° ~ 80 °.
Preferably, the lower end of described gas-liquid two-phase atomizer is provided with atomizing particle pilot conduits, to remove and the uneven atomizing particle of described gas-liquid two-phase atomizer axial direction.
Preferably, the top of described gas-liquid two-phase atomizer is provided with nozzle rotary part, to adjust the spray angle of described gas-liquid two-phase atomizer.
Preferably, described gas pipeline is provided with the gas flow regulating valve for adjusting gas flow, and/or described fluid pipeline is provided with the first liquid flow control valve for regulates liquid flow.
Preferably, the preset diameters of described liquid discharge fluid apertures and gas venthole is 1 ~ 300 μm.
Preferably, described swing arm is also provided with for the liquid phase pipe blow-through to wafer jetting fluid phase fluid.
Preferably, described liquid phase pipe blow-through is provided with the second liquid flow control valve for regulates liquid flow.
Preferably, described gas pipeline, fluid pipeline and liquid phase pipe blow-through are equipped with the pneumatic operated valve for gauge tap.
Present invention also offers a kind of cleaning method based on gas-liquid two-phase atomization cleaner, first open the pneumatic operated valve of liquid phase pipe blow-through, make crystal column surface uniform fold one deck liquid film; Open the pneumatic operated valve of described gas pipeline and fluid pipeline subsequently simultaneously, form atomizing particle, be injected in the liquid film of crystal column surface.
Beneficial effect of the present invention:
1, the present invention is by gas-liquid two-phase atomizing nozzle structure, high-speed liquid stream and high velocity gas stream are interacted fully, and by adjustment gas flow rate and low flow rate liquid flow velocity, form the ultra micro atomized drop that particle size is homogeneous, after high velocity gas stream is accelerated, be injected in wafer surface, complete cleaning.
2, the present invention in technical process airflow direction and wafer surface perpendicular, promote that the impurity in surface grooves figure is to the transmission of bodies of fluid, improves the efficiency of cleaning, improves cleaning performance.Meanwhile, be conducive to saving liquid phase fluid.
3, the present invention adopts the atomizing particle of size uniformity to rinse wafer surface, because the quality of atomizing particle is little, and there is one deck and sprayed the liquid lamella formed by liquid phase pipe blow-through in wafer surface, decrease the impulsive force to wafer surface structure, decrease the damage to wafer topography structure simultaneously.
4, the atomizing particle guide pipe in the present invention can play certain filtration, only retain the direction of motion atomizing particle parallel with gas-liquid two-phase atomizer axial direction, reduce atomizing particle to the horizontal force of wafer topography structure, prevent the damage of graphic structure.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the preferred embodiment of gas-liquid two-phase atomization cleaner in the present invention;
Fig. 2 is the movement locus schematic diagram of swing arm in the present invention;
Fig. 3 is the structure for amplifying schematic diagram of gas-liquid two-phase atomization cleaner in the present invention;
Fig. 4 is the perspective view of gas-liquid two-phase atomizer preferred embodiment in the present invention;
Fig. 5 is the cross-sectional view of gas-liquid two-phase atomizer preferred embodiment in the present invention;
Fig. 6 is the cross-sectional structure schematic diagram of gas-liquid two-phase atomizer preferred embodiment in the present invention;
Fig. 7 is the partial structurtes schematic diagram of gas-liquid two-phase atomizer preferred embodiment in the present invention;
Fig. 8 is the partial structurtes schematic diagram of gas-liquid two-phase atomizer preferred embodiment in the present invention;
Fig. 9 is the structural representation that in the present invention, gas-liquid two-phase atomizer forms atomizing particle.
Number in the figure is described as follows:
10, gas pipeline; 20, fluid pipeline; 30, gas-liquid two-phase atomizer; 31, jet element liquid main line; 32, jet element gas piping; 33, liquid discharge fluid apertures; 34, gas venthole; 35, jet element liquid branch pipeline; 36, gas piping interface; 37, to give vent to anger web plate; 38, atomizing particle pilot conduits; 40, swing arm; 50, wafer; 60, nozzle rotary part; 70, gas flow regulating valve; 80, first liquid flow control valve; 90, liquid phase pipe blow-through; 100, second liquid flow control valve; 110, holder; 120, rotary body; 130, motor.
Detailed description of the invention
For making content of the present invention clearly understandable, below in conjunction with Figure of description, content of the present invention is described further.Certain the present invention is not limited to this specific embodiment, and the general replacement known by those skilled in the art is also encompassed in protection scope of the present invention.Secondly, the present invention's detailed statement that utilized schematic diagram to carry out, when describing example of the present invention in detail, for convenience of explanation, schematic diagram, should in this, as limitation of the invention not according to general ratio partial enlargement.
It should be noted that, in following embodiment, utilize the structural representation of Fig. 1 ~ 9 to carry out detailed statement to by the gas-liquid two-phase atomization cleaner in the present invention.Describe in detail embodiments of the present invention time, for convenience of explanation, each schematic diagram not according to general scale and carried out partial enlargement and omit process, therefore, should avoid in this, as limitation of the invention.
As shown in Figure 1 to Figure 3, the invention provides a kind of gas-liquid two-phase atomization cleaner, for cleaning the wafer 50 be carried on rotary body 120, the holder 110 on rotary body 120 is for holding chip 50, and rotary body 120 is driven by motor 130 and drives wafer 50 to rotate.Gas-liquid two-phase atomization cleaner comprises gas pipeline 10, fluid pipeline 20 and gas-liquid two-phase atomizer 30.One end of gas pipeline 10 and fluid pipeline 20 is arranged in swing arm 40, its other end is communicated with gas-liquid two-phase atomizer 30 to form atomizing particle, and swing arm 40 drives gas-liquid two-phase atomizer 30 to do circular arc between wafer 50 edge and wafer 50 center and moves back and forth (as shown in Figure 2).
In the present embodiment, for the ease of regulation and control gas flow and fluid flow, gas pipeline 10 is provided with the gas flow regulating valve 70 for adjusting gas flow, and/or fluid pipeline 20 is provided with the first liquid flow control valve 80 for regulates liquid flow.
In addition, swing arm 40 is also provided with for the liquid phase pipe blow-through 90 to wafer jetting fluid phase fluid, liquid phase pipe blow-through 90 is provided with the second liquid flow control valve 100 for regulates liquid flow, and swing arm 40 also can drive liquid phase pipe blow-through 90 to do circular arc between wafer 50 edge and wafer 50 center and move back and forth.
In order to control the keying of gas pipeline 10, fluid pipeline 20 and liquid phase pipe blow-through 90, gas pipeline 10, fluid pipeline 20 and liquid phase pipe blow-through 90 are equipped with the pneumatic operated valve (not shown) for gauge tap.
Gas in gas pipeline 10 in the present embodiment is preferably N
2, CO
2, compressed air etc., the liquid in fluid pipeline 20 and liquid phase pipe blow-through 90 is preferably chemical liquid or ultra-pure water etc., and gas and liquid can be decided according to the actual requirements.
It is as follows that gas-liquid two-phase atomization swings the corresponding operation principle of cleaning system: wafer 50 is fixed on rotary body 120 by holder 110, rotates under the drive of motor 130 with certain speed; The flow of fluid pipeline 20 and gas pipeline 10 is set, to adjust the size of gas-liquid two-phase atomizing particle by first liquid flow control valve 80 and gas flow regulating valve 70.After presetting the relevant informations such as the movement locus of swing arm 40, cleaning time, gas-liquid two-phase atomizer 30 spray angle, liquid proportion, fluid temperature, start to carry out cleaning.First cleaning liquid is flowed out by liquid phase pipe blow-through 90, covers completely on the surface rotating wafer 50, forms skim liquid.After Preset Time, fluid pipeline 20 and gas pipeline 10 are opened, aerosolized liquid particles is formed in gas-liquid two-phase atomizer 30, and then ejected by atomizing particle pilot conduits 38 under the drive of high-speed gas, inject in the cleaning liquid thin layer on wafer 50 surface, the physical force of increasing action on pollutant, drive the vibration of cleaning fluid thin layer simultaneously, accelerate the transmittance process of pollutant to cleaning liquid fluid, improve cleaning efficiency, better complete cleaning.
Please refer to Fig. 4 to Fig. 8, Fig. 4 to Fig. 8 is the structural representation of gas-liquid two-phase atomizer 30, and gas-liquid two-phase atomizer 30 comprises jet element liquid main line 31, jet element gas piping 32, liquid discharge fluid apertures 33 and gas venthole 34, jet element liquid main line 31 one end connects fluid pipeline 20, the other end has some in divergent shape and the jet element liquid branch pipeline 35 equidistantly distributed, it is the end face that predetermined angle tilts that jet element liquid branch pipeline 35 has with the axial direction of gas-liquid two-phase atomizer, end face has the liquid discharge fluid apertures 33 of some preset diameters, jet element gas piping 32 sidewall is provided with gas piping interface 36 to be communicated with gas pipeline 10, there is between each jet element liquid branch pipeline 35 horizontally disposed fan-shaped web plate 37 of giving vent to anger, web plate 37 of giving vent to anger is provided with the gas venthole 34 of some preset diameters.
Concrete, in the present embodiment, the angle between the axial direction of end face and gas-liquid two-phase atomizer 30 is preferably 10 ° ~ 80 °, and the preset diameters of liquid discharge fluid apertures 33 and gas venthole 34 is 1 ~ 300 μm.
In preferred version, the lower end of gas-liquid two-phase atomizer 30 is provided with atomizing particle pilot conduits 38, to remove and the uneven atomizing particle of gas-liquid two-phase atomizer 30 axial direction.Atomizing particle guide pipe 38 can play certain filtration, only retains the direction of motion atomizing particle parallel with gas-liquid two-phase atomizer 30 axial direction, reduces atomizing particle to the horizontal force of wafer topography structure, prevents the damage of graphic structure.
For the angle regulating atomizing particle to spray, the top of gas-liquid two-phase atomizer 30 is provided with nozzle rotary part 60, to adjust the spray angle of gas-liquid two-phase atomizer 30.By arranging nozzle rotary part 60, the spray angle of gas-liquid two-phase atomizer 30 can be adjusted, better coordinate with the liquid that liquid phase pipe blow-through 90 sprays, be conducive to taking the impurity departing from wafer surface out of wafer surface scope, prevent the generation of impurity secondary pollution.
The principle that gas-liquid two-phase atomizer 30 in the present embodiment forms atomizing particle is as follows: the cleaning liquid in fluid pipeline 20 enters the jet element liquid branch pipeline 35 in divergent shape along jet element liquid main line 31, spray from liquid discharge fluid apertures 33, the gross area due to liquid discharge fluid apertures 33 is less than the sectional area of fluid pipeline 20, cleaning liquid produces and accelerates, be divided into the liquid stream of several diameters in micron dimension, with the oblique injection of angle preset simultaneously.Same, the gas of gas pipeline 10 is penetrated by the gas venthole 34 in jet element gas piping 32, forms the gas flow of several diameters in micron dimension, and the axial direction along gas-liquid two-phase atomizer 30 penetrates.Gas flow and liquid stream are had an effect in the below of gas venthole, and liquid stream is broken up forms ultra micro atomizing particle.After ultra micro atomizing particle is formed, under the effect of gas flow, do accelerated motion downwards.The uneven ultra micro atomizing particle of axial direction of the direction of motion and gas-liquid two-phase atomizer 30 can impinge upon in atomizing particle pilot conduits 38; again converge and become large drop; flowed down by tube wall, ensure with this direction of motion uniformity exporting the atomizing particle ejected from atomizing particle pilot conduits 38.
Present invention also offers a kind of cleaning method based on gas-liquid two-phase atomization cleaner, first open the pneumatic operated valve of liquid phase pipe blow-through 90, make crystal column surface uniform fold one deck liquid film; Open the pneumatic operated valve of described gas pipeline 10 and fluid pipeline 20 subsequently simultaneously, form atomizing particle, be injected in the liquid film of crystal column surface.
In sum, the present invention is by gas-liquid two-phase atomizing nozzle structure, high-speed liquid stream and high velocity gas stream are interacted fully, and by adjustment gas flow rate and low flow rate liquid flow velocity, form the ultra micro atomized drop that particle size is homogeneous, after high velocity gas stream is accelerated, be injected in wafer surface, complete cleaning.Because the quality of atomizing particle is little, and there is one deck and sprayed the liquid lamella formed by liquid phase pipe blow-through in wafer surface, decreases the impulsive force to wafer surface structure, decrease the damage to wafer topography structure simultaneously.In addition, in technical process airflow direction and wafer surface perpendicular, promote that in surfacial pattern groove, impurity is to the transmission of bodies of fluid, improve the efficiency of cleaning, improve cleaning performance.Meanwhile, be conducive to saving liquid phase cleansing medium.
Above-mentioned explanation illustrate and describes some preferred embodiments of the present invention, but as previously mentioned, be to be understood that the present invention is not limited to the form disclosed by this paper, should not regard the eliminating to other embodiments as, and can be used for other combinations various, amendment and environment, and can in invention contemplated scope described herein, changed by the technology of above-mentioned instruction or association area or knowledge.And the change that those skilled in the art carry out and change do not depart from the spirit and scope of the present invention, then all should in the protection domain of claims of the present invention.
Claims (10)
1. a gas-liquid two-phase atomization cleaner, it is characterized in that, described device comprises gas pipeline, fluid pipeline and gas-liquid two-phase atomizer, one end of described gas pipeline and fluid pipeline is arranged in swing arm, its other end is communicated with described gas-liquid two-phase atomizer to form atomizing particle, and described swing arm drives described gas-liquid two-phase atomizer between Waffer edge and center wafer, do circular arc and moves back and forth; Wherein,
Described gas-liquid two-phase atomizer comprises jet element liquid main line, jet element gas piping, liquid discharge fluid apertures and gas venthole, described jet element liquid main line one end connects described fluid pipeline, the other end has some in divergent shape and the jet element liquid branch pipeline equidistantly distributed, it is the end face that predetermined angle tilts that described jet element liquid branch pipeline has with the axial direction of described gas-liquid two-phase atomizer, described end face has the liquid discharge fluid apertures of some preset diameters, described jet element gas piping sidewall is provided with gas piping interface to be communicated with described gas pipeline, between each jet element liquid branch pipeline, there is horizontally disposed fan-shaped web plate of giving vent to anger, described web plate of giving vent to anger is provided with the gas venthole of some preset diameters.
2. gas-liquid two-phase atomization cleaner according to claim 1, is characterized in that, the angle between the axial direction of described end face and described gas-liquid two-phase atomizer is 10 ° ~ 80 °.
3. gas-liquid two-phase atomization cleaner according to claim 1, is characterized in that, the lower end of described gas-liquid two-phase atomizer is provided with atomizing particle pilot conduits, to remove and the uneven atomizing particle of described gas-liquid two-phase atomizer axial direction.
4. gas-liquid two-phase atomization cleaner according to claim 1, is characterized in that, the top of described gas-liquid two-phase atomizer is provided with nozzle rotary part, to adjust the spray angle of described gas-liquid two-phase atomizer.
5. gas-liquid two-phase atomization cleaner according to claim 1, it is characterized in that, described gas pipeline is provided with the gas flow regulating valve for adjusting gas flow, and/or described fluid pipeline is provided with the first liquid flow control valve for regulates liquid flow.
6. gas-liquid two-phase atomization cleaner according to claim 1, is characterized in that, the preset diameters of described liquid discharge fluid apertures and gas venthole is 1 ~ 300 μm.
7. gas-liquid two-phase atomization cleaner according to claim 1, is characterized in that, described swing arm is also provided with for the liquid phase pipe blow-through to wafer jetting fluid phase fluid.
8. gas-liquid two-phase atomization cleaner according to claim 7, is characterized in that, described liquid phase pipe blow-through is provided with the second liquid flow control valve for regulates liquid flow.
9. gas-liquid two-phase atomization cleaner according to claim 7, is characterized in that, described gas pipeline, fluid pipeline and liquid phase pipe blow-through is equipped with the pneumatic operated valve for gauge tap.
10. based on a cleaning method for the gas-liquid two-phase atomization cleaner described in any one of claim 1-9, it is characterized in that, first open the pneumatic operated valve of liquid phase pipe blow-through, make crystal column surface uniform fold one deck liquid film; Open the pneumatic operated valve of described gas pipeline and fluid pipeline subsequently simultaneously, form atomizing particle, be injected in the liquid film of crystal column surface.
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| CN105344511A (en) * | 2015-12-10 | 2016-02-24 | 北京七星华创电子股份有限公司 | Self-cleaning two-phase flow atomized spray cleaning device and cleaning method |
| CN105414084A (en) * | 2015-12-10 | 2016-03-23 | 北京七星华创电子股份有限公司 | Ultrasonic or mega-sonic oscillatory two-phase-flow atomization washing device and ultrasonic or mega-sonic oscillatory two-phase-flow atomization washing method |
| CN105413905A (en) * | 2015-12-10 | 2016-03-23 | 北京七星华创电子股份有限公司 | Two-phase-flow atomized-spray washing device and two-phase-flow atomized-spray washing method |
| CN105513999A (en) * | 2015-12-10 | 2016-04-20 | 北京七星华创电子股份有限公司 | Two-phase flow atomization injection cleaning apparatus with gas protection, and cleaning method |
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