CN203002704U - Gas-liquid two-phase atomization cleaning device - Google Patents
Gas-liquid two-phase atomization cleaning device Download PDFInfo
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- CN203002704U CN203002704U CN 201220653915 CN201220653915U CN203002704U CN 203002704 U CN203002704 U CN 203002704U CN 201220653915 CN201220653915 CN 201220653915 CN 201220653915 U CN201220653915 U CN 201220653915U CN 203002704 U CN203002704 U CN 203002704U
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Abstract
The utility model discloses a gas-liquid two-phase atomization cleaning device and relates to the technical field of semiconductor wafers. The gas-liquid two-phase atomization cleaning device comprises a gas-liquid two-phase atomizing nozzle. The gas-liquid two-phase atomizing nozzle is of a dual-layer jacket structure and comprises a nozzle, a rotating arm, a gas guide pipe and a liquid guide pipe, wherein the nozzle is connected with the rotating arm, the gas guide pipe and the liquid guide pipe are fixedly arranged on the rotating arm, and pneumatic valves are respectively arranged on the gas guide pipe and the liquid guide pipe. According to the gas-liquid two-phase atomization cleaning device disclosed by the utility model, a physical force perpendicular to the channel of a wafer is added during cleaning, the transfer of impurities and contaminants in the channel of the wafer towards the main body of liquid-phase fluid is promoted, and the cleaning efficiency and the cleaning effect are improved; and since a liquid-phase fluid flow control device is used for reducing liquid-phase flow and atomized fluid is used for washing the surface of the wafer, the damage to the wafer is decreased.
Description
Technical field
The utility model relates to semiconductor wafer technology field, particularly a kind of gas-liquid two-phase atomization cleaner.
Background technology
Along with the integrated circuit characteristic size enters into the deep-submicron stage, in the IC wafer manufacturing process, the cleanliness factor of desired wafer surface is more and more harsher, in order to guarantee the cleanliness factor on wafer material surface, have hundreds of roads matting in the manufacturing process of integrated circuit, matting has accounted for 30% of whole manufacture process.
Statistics shows further, and the loss amount over 50% in whole semiconductor devices manufacturing is not all thoroughly caused by surface contamination, cleaning.In cleaning process, liquid phase fluid is sprayed on wafer by the shower nozzle that is positioned at wafer top, and the liquid phase of injection will produce a physical force during with very high flow attack wafer.Impurity and pollutant in the wafer surface groove are corroded by liquid phase fluid, dissolve or be suspended in liquid phase fluid, the centrifugal force that the rotation of impulsive force at a high speed and below wafer produces makes liquid phase fluid leave wafer surface, simultaneously impurity and pollutant are taken away, thereby reach cleaning performance, but in traditional technique, impurity and pollutant are relatively poor to the transmission of liquid phase fluid main body, affected efficient and the effect of cleaning, improved impurity and pollutant in groove and can improve cleaning efficiency and cleaning performance to the transmission of liquid phase fluid.
But along with the size of wafer figure is more and more less, the high velocity jet fluid can not be ignored the infringement of figure.Traditional cleaning spraying technique exists large scale drop or injection stream, and more aobvious serious to the damage of the figure of the wafer surface of 65 nanometers and following technique thereof, the utilization rate of liquid phase fluid is lower simultaneously, causes the profligacy of resource.
In order to reduce the infringement to figure, all in research nanojet technology, the fluid that namely ejects is vaporific, is comprised of various nano level drops now.The drop of shower nozzle ejection drops on wafer surface, and the impurity on the graphic structure of wafer surface and pollutant are washed.Compare large drop or continuous fluid, the nanojet technology can reduce the infringement to figure really to a certain extent, but the vaporific nano-liquid droplet that ejects is to be ejected on wafer with higher speed equally, if these nano-liquid droplets at a high speed directly contact with figure, because drop size is little, more easily enter the inside of wafer feature size, may cause deeper damage, and the fluid that sprays down is not all also that vertical the injection fallen on wafer, and the fluid of oblique incidence can cause larger damage to sidewall and the corner of figure again like this.
Therefore, promote impurity and pollutant to the transmission of liquid phase fluid main body, to reduce atomizing fluids be present problem demanding prompt solution to the destruction of wafer.
The utility model content
The technical problem that (one) will solve
The technical problems to be solved in the utility model is how to promote impurity and pollutant to the transmission of liquid phase fluid main body, to improve efficient and the effect of cleaning; How to reduce atomizing fluids to the destruction of wafer and save liquid phase fluid.
(2) technical scheme
For solving the problems of the technologies described above, the utility model provides a kind of gas-liquid two-phase atomization cleaner.
The gas-liquid two-phase atomization cleaner that the utility model provides comprises the gas-liquid two-phase atomizer, described gas-liquid two-phase atomizer is double layer jacket structure, comprise nozzle, turning arm, gas conduit, liquid conduits, described nozzle is connected with turning arm, described gas conduit and liquid conduits are fixed on turning arm, and are equipped with pneumatic operated valve on gas conduit and liquid conduits.
Wherein, described nozzle and turning arm be one or be connected with helical structure, ferrule structure mode.
Wherein, described turning arm is hollow structure.
Wherein, described liquid conduits is positioned at turning arm inside.Pneumatic operated valve number on liquid conduits is one.
Wherein, described gas conduit is positioned at turning arm inside.Pneumatic operated valve number on gas conduit is one.
Wherein, described nozzle comprises center culvert and outer layer sleeve, and described center culvert is connected with liquid conduits or the liquid conduits port of export is fixed directly as center culvert; Described outer layer sleeve is connected with gas conduit.
Wherein, described nozzle has good sealing.
Wherein, be liquid phase fluid in described center culvert, can be chemical liquid or ultra-pure water etc.
Wherein, be gas phase in described outer layer sleeve, can be N
2, CO
2Deng.
Described gas-liquid two-phase atomization cleaner also comprises the volume control device of liquid phase fluid, the volume control device of described liquid phase fluid is connected with the feed liquor of liquid conduits one end, the volume control device of described liquid phase fluid is parallel-connection structure, comprise feed flow end pipeline, the first branch line, the second branch line and be connected nozzle end, described feed flow end pipeline arranges a needle-valve, the pneumatic operated valve of connecting, connect afterwards two parallel branch pipelines, at the first branch line, a pneumatic operated valve is set, is used for the feed flow of liquid phase process; The second branch line connect successively a needle-valve and a pneumatic operated valve are used for gas-liquid two-phase technique feed flow, and two branch lines merge into a pipeline, be to connect nozzle end, and suck back valve is set.
Under the condition that guarantees the suck back valve steady operation, close simultaneously the pneumatic operated valve of two parallel branch pipelines of control of feed flow end line upstream, open the pneumatic operated valve on gas conduit, open the N in outer layer sleeve
2Can be as N
2The technique arm.That is, can bring into play N
2The function of technique arm, therefore, the utility model can save the N of traditional handicraft
2The technique arm.
Gas-liquid two-phase atomization cleaner described in the utility model is in cleaning process, the technique that adopts gas-liquid two-phase and single liquid phase to replace, when described gas-liquid two-phase atomization cleaner does not comprise the volume control device of liquid phase fluid, when adopting single liquid phase process, the pneumatic operated valve of the gas conduit of gas-liquid two-phase atomizer cuts out, and the pneumatic operated valve of liquid conduits is opened; When adopting gas-liquid two-phase technique, open simultaneously the pneumatic operated valve of gas conduit and liquid conduits.
When gas-liquid two-phase is opened simultaneously, gas phase in described outer layer sleeve produces the hoop shear action to the liquid phase in described center culvert, can impel the atomization of liquid in described center culvert, kinetic energy increases, increased the physical force perpendicular to the wafer groove, strengthened the impact to the wafer groove, but diffusion and the transmission of the liquid phase fluid of impurity and pollutant in the faster wafer groove.The flow-control of liquid phase fluid at a smaller value, can be reached and reduces fluid to the impact of wafer and the purpose of saving liquid phase fluid.
The vaporific fluid flushing wafer surface of spraying in nozzle, formed a layer wafer top layer liquid level, increased the physical force perpendicular to the wafer groove in this process, in promotion wafer groove, impurity and pollutant to the transmission of vaporific fluid, have improved efficient and the effect of cleaning.
Technical process begins, and nozzle enters from wafer one end margin, adopts single liquid phase process to rinse, until through center wafer, be changed to the jet douche of gas-liquid two-phase technique, the impurity in the wafer groove and pollutant are arrived in Waffer edge, treat that nozzle arrives wafer other end edge, again being changed to single liquid phase process rinses, after nozzle returns to center wafer, be changed to the jet douche of gas-liquid two-phase technique, again arrive Waffer edge, be changed to single liquid phase process and rinse, clean and so forth.
But; gas-liquid two-phase fluid rinses wafer surface; kinetic energy increases; graphic structure is formed impact; when described gas-liquid two-phase atomization cleaner comprised the volume control device of liquid phase fluid, the utility model reduced the liquid phase flow by the volume control device of liquid phase fluid, because the quality of atomizing fluids is little; impulsive force to the wafer surface structure is little, and the protection graphic structure is not damaged.
Gas-liquid two-phase atomization cleaner described in the utility model is in cleaning process, the technique that adopts gas-liquid two-phase and single liquid phase to replace, wherein, in center culvert, fluid flow is controlled by the volume control device of aforementioned liquid phase fluid: when adopting single liquid phase process, the second branch line pneumatic operated valve of described volume control device cuts out, the first branch line pneumatic operated valve is opened, flow is by the noticeable degree of feed flow end pipeline, the pneumatic operated valve of the gas conduit of described gas-liquid two-phase atomizer cuts out, and the pneumatic operated valve of liquid conduits is opened; When adopting gas-liquid two-phase technique, the flow of liquid phase fluid is reduced to appropriate value, adjust vaporific fluid by controlling the liquid phase flow, the pneumatic operated valve of the first branch line of described volume control device cuts out, the second branch line pneumatic operated valve and needle-valve are opened, and flow is by the noticeable degree of the second branch line, simultaneously, open the pneumatic operated valve of described gas-liquid two-phase atomizer gas conduit and liquid conduits, namely open the N in outer layer sleeve
2
Technical process begins, and nozzle enters from wafer one end margin, adopts single liquid phase process to rinse, until through center wafer, be changed to the jet douche of gas-liquid two-phase technique, wafer surface impurity and pollutant are arrived in Waffer edge, treat that nozzle arrives wafer other end edge, again being changed to single liquid phase process rinses, after nozzle returns to center wafer, be changed to the jet douche of gas-liquid two-phase technique, again arrive Waffer edge, be changed to single liquid phase process and rinse, clean and so forth.
(3) beneficial effect
(1) gas-liquid two-phase atomization cleaner of the present utility model comprises the gas-liquid two-phase atomizer, the technique that adopts gas-liquid two-phase and single liquid phase to replace in cleaning process, increased the physical force perpendicular to the wafer groove in this process, in promotion wafer groove, impurity and pollutant are to the transmission of liquid phase fluid main body, efficient and the effect of cleaning have been improved, simultaneously, be conducive to save liquid phase fluid.
(2) the utility model reduces the liquid phase flow by the volume control device of liquid phase fluid, adopts atomizing fluids to rinse wafer surface, and is little to the impulsive force of wafer surface structure because the quality of atomizing fluids is little, reduced the destruction to wafer.
(3) in the utility model, the gas-liquid two-phase fluid of kinetic energy is pushed the edge to by center wafer, is conducive to take impurity and pollutant out of wafer surface, can reduce the pollution that brings because of the drop sputter simultaneously.
(4) gas-liquid two-phase atomization cleaner of the present utility model adopts liquid phase and gas-liquid two-phase technique to hocket in cleaning process, has both helped to keep the thickness of liquid film of wafer surface, can promote again the disturbance of surperficial liquid film, is conducive to the carrying out of transmitting.
(5) the utility model is by traditional chemical liquid arm, ultra-pure water arm and N
2Three technique arms of arm are reduced to two, chemical liquid arm and ultra-pure water arm.
Description of drawings
Fig. 1 is the structural representation of the gas-liquid two-phase atomization cleaner of the utility model embodiment;
Fig. 2 is the structural representation of volume control device of the liquid phase fluid of the utility model embodiment;
Fig. 3 is that gas phase in nozzle ectomesoderm sleeve pipe is to the hoop shear action schematic diagram of liquid phase in center culvert;
Fig. 4 is the wafer surface schematic diagram of the device of the utility model embodiment when cleaning;
Fig. 5 is the gas-liquid two-phase of the utility model embodiment and the schematic diagram of single liquid phase Alternating System.
In figure, 1: turning arm; 2: gas conduit; 3: liquid conduits; 4: nozzle; 5: center culvert; 6: outer layer sleeve; 7: the pneumatic operated valve on liquid conduits; 8: the pneumatic operated valve on gas conduit; 9: feed flow end pipeline; 10: feed flow end pipeline needle-valve; 11: feed flow end pipeline pneumatic operated valve; 12: the first branch lines; 13: the first branch line pneumatic operated valves; 14: the second branch lines; 15: the second branch line needle-valves; 16: the second branch line pneumatic operated valves; 17: connect nozzle end; 18: suck back valve; 19: vaporific fluid; 20: wafer top layer liquid level; 21: the wafer graphic structure; 22: the impurity in the wafer groove and pollutant; 51: the liquid phase in center culvert; 61: the gas phase in outer layer sleeve; 23: the nozzle movement locus; 24: wafer; 25: through arriving the gas-liquid two-phase technique of Waffer edge after center wafer; 26: the single liquid phase process from the Waffer edge to the center wafer.
The specific embodiment
Following examples are used for explanation the utility model, but are not used for limiting scope of the present utility model.
As shown in Figure 1, the gas-liquid two-phase atomization cleaner that the utility model provides comprises the gas-liquid two-phase atomizer, described gas-liquid two-phase atomizer is double layer jacket structure, comprise nozzle 4, turning arm 1, gas conduit 2, liquid conduits 3, described nozzle 4 is connected with turning arm 1, and described gas conduit 2 and liquid conduits 3 are fixed on turning arm 1.
Wherein, described nozzle 4 and turning arm 1 be one or be connected with helical structure, ferrule structure mode.
Wherein, described turning arm 1 is hollow structure.
Wherein, described liquid conduits 3 is positioned at turning arm 1 inside; Liquid conduits 3 is provided with a pneumatic operated valve 7.
Wherein, described gas conduit 2 is positioned at turning arm 1 inside; Gas conduit 2 is provided with a pneumatic operated valve 8.
Wherein, described nozzle 4 comprises center culvert 5 and outer layer sleeve 6, and described center culvert 5 is connected with liquid conduits 3 or liquid conduits 3 ports of export are fixed directly as center culvert 5; Described outer layer sleeve 6 is connected with gas conduit 2.
Wherein, described nozzle 4 has good sealing.
Wherein, be liquid phase fluid in described center culvert 5, can be chemical liquid or ultra-pure water etc.
Wherein, be gas phase in described outer layer sleeve 6, can be N
2, CO
2Deng.
Embodiment 2
gas-liquid two-phase atomization cleaner of the present utility model also comprises the volume control device of liquid phase fluid, the volume control device of described liquid phase fluid is connected with an end of liquid conduits 3 feed liquors, as shown in Figure 2, the volume control device of described liquid phase fluid is parallel-connection structure, comprise feed flow end pipeline 9, the first branch line 12, the second branch line 14 be connected nozzle end 17, described feed flow end pipeline 9 arranges a feed flow end pipeline needle-valve 10, the feed flow end pipeline pneumatic operated valve 11 of connecting, connect afterwards two parallel branch pipelines, at the first branch line 12, first a branch line pneumatic operated valve 13 is set, the feed flow that is used for liquid phase process, the second branch line 14 connect successively second a branch line needle-valve 15 and second a branch line pneumatic operated valve 16 are used for gas-liquid two-phase technique feed flow, and two branch lines merge into a pipeline, be to connect nozzle end 17, and suck back valve 18 is set.
Under the condition that guarantees suck back valve 18 steady operations, close simultaneously the pneumatic operated valve 11 of two parallel branch pipelines of control of feed flow end pipeline 9 upstreams, open the pneumatic operated valve 8 on gas conduit 2, open the N in outer layer sleeve 6
2Can be as N
2The technique arm.That is, can bring into play N
2The function of technique arm, therefore, the utility model can save the N of traditional handicraft
2The technique arm.
Embodiment 3
The technique that gas-liquid two-phase atomization cleaner described in the utility model adopts gas-liquid two-phase and single liquid phase to replace, when described gas-liquid two-phase atomization cleaner does not comprise the volume control device of liquid phase fluid, when adopting single liquid phase process, the pneumatic operated valve 8 of the gas conduit 2 of gas-liquid two-phase atomizer cuts out, and the pneumatic operated valve 7 of liquid conduits 3 is opened; When adopting gas-liquid two-phase technique, open simultaneously the pneumatic operated valve 8 of gas conduit 2 and the pneumatic operated valve 7 of liquid conduits 3.
When gas-liquid two-phase is opened simultaneously, open simultaneously the pneumatic operated valve 8 of gas conduit 2 and the pneumatic operated valve 7 of liquid conduits 3, as shown in Figure 3, liquid phase 51 in 61 pairs of described center culvert 5 of gas phase in described outer layer sleeve 6 produces the hoop shear action, can impel liquid phase 51 atomizings in described center culvert 5, kinetic energy increases, and has increased the physical force perpendicular to the wafer groove, strengthened the impact to the wafer groove, but diffusion and the transmission of the liquid phase fluid of impurity and pollutant in the faster wafer groove.
As shown in Figure 4, the vaporific fluid 19 that sprays in nozzle 4 rinses wafer surface, has formed a layer wafer top layer liquid level 20, has increased the physical force perpendicular to the wafer groove in this process, in promotion wafer groove, impurity and pollutant 22 to the transmission of vaporific fluid 19, have improved efficient and the effect of cleaning.The flow-control of liquid phase fluid at a smaller value, can be reached and reduces fluid to the impact of wafer graphic structure 21 and the purpose of saving liquid phase fluid.
as shown in Figure 5, cleaning method of the present utility model adopts the method that replaces to gas-liquid two-phase technique 25 and the single liquid phase process 26 from the Waffer edge to the center wafer of Waffer edge through after center wafer, the movement locus 23 of nozzle 4, avoided the droplet of atomizing easily to form the problem of washmarking in wafer 24 dry tack frees, wherein, technical process begins, nozzle 4 enters from wafer 24 1 end margins, adopt single liquid phase process 26 to rinse, until through wafer 24 centers, be changed to 25 jet douches of gas-liquid two-phase technique, impurity in wafer 24 grooves and pollutant are arrived in wafer 24 edges, treat that nozzle 4 arrives wafer 24 other end edges, again being changed to single liquid phase process 26 rinses, after nozzle 4 returns to wafer 24 centers, be changed to 25 jet douches of gas-liquid two-phase technique, again arrive wafer 24 edges, being changed to single liquid phase process 26 rinses, clean and so forth.
When described gas-liquid two-phase atomization cleaner comprises the volume control device of liquid phase fluid, the utility model reduces the liquid phase flow by the volume control device of liquid phase fluid, because the quality of atomizing fluids is little, little to the impulsive force of wafer graphic structure, reduced the destruction to wafer.
Gas-liquid two-phase atomization cleaner described in the utility model is in cleaning process, the technique that adopts gas-liquid two-phase and single liquid phase to replace, wherein, in center culvert 5, fluid flow is controlled by the volume control device of aforementioned liquid phase fluid: when adopting single liquid phase process, the pneumatic operated valve 16 of the second branch line 14 of described volume control device cuts out, the pneumatic operated valve 13 of the first branch line 12 is opened, flow is controlled by the needle-valve 10 of feed flow end pipeline 9, the pneumatic operated valve 8 of the gas conduit 2 of described gas-liquid two-phase atomizer cuts out, and the pneumatic operated valve 7 of liquid conduits 3 is opened; When adopting gas-liquid two-phase technique, the flow of liquid phase fluid is reduced to appropriate value, adjust vaporific fluid by controlling the liquid phase flow, the pneumatic operated valve 13 of the first branch line 12 of described volume control device cuts out, the pneumatic operated valve 16 of the second branch line 14 and needle-valve 15 are opened, and flow is controlled by the needle-valve 15 of the second branch line 14, simultaneously, open the pneumatic operated valve 8 of described gas-liquid two-phase atomizer gas conduit 2 and the pneumatic operated valve 7 of liquid conduits 3, open the N in outer layer sleeve 6
2
as shown in Figure 5, cleaning method of the present utility model adopts the method that replaces to gas-liquid two-phase technique 25 and the single liquid phase process 26 from the Waffer edge to the center wafer of Waffer edge through after center wafer, the movement locus 23 of nozzle 4, avoided the droplet of atomizing easily to form the problem of washmarking in wafer 24 dry tack frees, wherein, technical process begins, nozzle 4 enters from wafer 24 1 end margins, adopt single liquid phase process 26 to rinse, until through wafer 24 centers, be changed to 25 jet douches of gas-liquid two-phase technique, impurity in wafer 24 grooves and pollutant are arrived in wafer 24 edges, treat that nozzle 4 arrives wafer 24 other end edges, again being changed to single liquid phase process 26 rinses, after nozzle 4 returns to wafer 24 centers, be changed to 25 jet douches of gas-liquid two-phase technique, again arrive wafer 24 edges, being changed to single liquid phase process 26 rinses, clean and so forth.
Above-mentioned cleaning method can be realized with above-mentioned gas-liquid two-phase atomization cleaner or the similar device of structure.
Above embodiment only is used for explanation the utility model; and be not limitation of the utility model; the those of ordinary skill in relevant technologies field; in the situation that do not break away from spirit and scope of the present utility model; can also make a variety of changes and modification; therefore all technical schemes that are equal to also belong to category of the present utility model, and scope of patent protection of the present utility model should be defined by the claims.
Claims (10)
1. gas-liquid two-phase atomization cleaner, it is characterized in that, described device comprises the gas-liquid two-phase atomizer, described gas-liquid two-phase atomizer is double layer jacket structure, comprise nozzle, turning arm, gas conduit, liquid conduits, described nozzle is connected with turning arm, and described gas conduit and liquid conduits are fixed on turning arm, and is equipped with pneumatic operated valve on gas conduit and liquid conduits.
2. device according to claim 1, is characterized in that, described nozzle and turning arm be one or be connected with helical structure, ferrule structure mode.
3. device according to claim 1, is characterized in that, described turning arm is hollow structure.
4. device according to claim 1, is characterized in that, described liquid conduits is positioned at turning arm inside.
5. device according to claim 1, is characterized in that, the pneumatic operated valve number on described liquid conduits is 1.
6. device according to claim 1, is characterized in that, described gas conduit is positioned at turning arm inside.
7. device according to claim 6, is characterized in that, the pneumatic operated valve number on described gas conduit is 1.
8. device according to claim 1, is characterized in that, described nozzle comprises center culvert and outer layer sleeve, and described center culvert is connected with liquid conduits or the liquid conduits port of export is fixed directly as center culvert; Described outer layer sleeve is connected with gas conduit.
9. device according to claim 8, is characterized in that, is liquid phase fluid in described center culvert, is gas phase in described outer layer sleeve.
10. the described device of according to claim 1 to 9 any one, it is characterized in that, described device also comprises the volume control device of liquid phase fluid, the volume control device of described liquid phase fluid is connected with the feed liquor of liquid conduits one end, the volume control device of described liquid phase fluid is parallel-connection structure, comprise feed flow end pipeline, the first branch line, the second branch line and be connected nozzle end, described feed flow end pipeline arranges a needle-valve, the pneumatic operated valve of connecting, connect afterwards two parallel branch pipelines, at the first branch line, a pneumatic operated valve is set; The second branch line connect successively a needle-valve and a pneumatic operated valve, two branch lines merge into a pipeline, be to connect nozzle end, and suck back valve is set.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220653915 CN203002704U (en) | 2012-11-30 | 2012-11-30 | Gas-liquid two-phase atomization cleaning device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220653915 CN203002704U (en) | 2012-11-30 | 2012-11-30 | Gas-liquid two-phase atomization cleaning device |
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| CN203002704U true CN203002704U (en) | 2013-06-19 |
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| CN 201220653915 Expired - Lifetime CN203002704U (en) | 2012-11-30 | 2012-11-30 | Gas-liquid two-phase atomization cleaning device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103008299A (en) * | 2012-11-30 | 2013-04-03 | 北京七星华创电子股份有限公司 | Gas-liquid two-phase spray cleaning device and cleaning method |
-
2012
- 2012-11-30 CN CN 201220653915 patent/CN203002704U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103008299A (en) * | 2012-11-30 | 2013-04-03 | 北京七星华创电子股份有限公司 | Gas-liquid two-phase spray cleaning device and cleaning method |
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| GR01 | Patent grant | ||
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Granted publication date: 20130619 |