CN105414084A - Ultrasonic or mega-sonic oscillatory two-phase-flow atomization washing device and ultrasonic or mega-sonic oscillatory two-phase-flow atomization washing method - Google Patents
Ultrasonic or mega-sonic oscillatory two-phase-flow atomization washing device and ultrasonic or mega-sonic oscillatory two-phase-flow atomization washing method Download PDFInfo
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- CN105414084A CN105414084A CN201510917455.4A CN201510917455A CN105414084A CN 105414084 A CN105414084 A CN 105414084A CN 201510917455 A CN201510917455 A CN 201510917455A CN 105414084 A CN105414084 A CN 105414084A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
- B08B3/022—Cleaning travelling work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B17/00—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups
- B05B17/04—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods
- B05B17/06—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations
- B05B17/0607—Apparatus for spraying or atomising liquids or other fluent materials, not covered by the preceding groups operating with special methods using ultrasonic or other kinds of vibrations generated by electrical means, e.g. piezoelectric transducers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0217—Use of a detergent in high pressure cleaners; arrangements for supplying the same
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0288—Ultra or megasonic jets
Abstract
The invention discloses an ultrasonic or mega-sonic oscillatory two-phase-flow atomization washing device and an ultrasonic or mega-sonic oscillatory two-phase-flow atomization washing method. An ultrasonic wave generation unit or a mega-sonic wave generation unit is arranged inside a nozzle main body and along the surface of the inner wall of a liquid pipeline; by generation of ultrasonic or mega-sonic oscillation, the ultrasonic or mega-sonic energy is transmitted into washing liquid which the energy passes through, so that atomized particles formed by intersection of the washing liquid ejected from a liquid guide outlet and air ejected from an air guide outlet below a gas-liquid guide component are enabled to have ultrasonic or mega-sonic energy and are downwards ejected towards a wafer surface under the acceleration or vertical guidance effect of an atomized particle guide outlet so as to realize ultrasonic or mega-sonic atomization washing; damages caused to a graphic structure of the wafer surface are effectively controlled; the removal efficiency of particle pollutants on the wafer surface is improved; the process time is shortened; the amount of washing liquor and high-purity gas is reduced; the production cost is lowered; environmental influences are reduced.
Description
Technical field
The present invention relates to semiconductor cleaning device technical field, more specifically, relate to and a kind ofly there is the two-phase flow atomization cleaner of ultrasonic or million sound oscillation effects and adopt the cleaning method of this device.
Background technology
Along with the high speed development of semiconductor integrated circuit manufacturing technology, the pattern character size of IC chip has entered into the deep-submicron stage, causes the characteristic size of the crucial pollutant (such as particle) of superfine circuit malfunction or damage on chip also greatly to reduce thereupon.
In the process for making of integrated circuit, semiconductor crystal wafer usually all can through multiple tracks processing steps such as such as thin film deposition, etching, polishings.And these processing steps just become the important place that pollutant produces.In order to keep the clean conditions of crystal column surface, eliminating the pollutant being deposited on crystal column surface in each processing step, cleaning treatment must be carried out to the crystal column surface that subjected to after per pass processing step.Therefore, cleaning becomes processing step the most general in integrated circuit fabrication process, its object is to the contamination level effectively controlling each step, to realize the target of each processing step.
In order to remove the pollutant of crystal column surface, when carrying out monolithic wet clean process, wafer will be placed on the rotation platform (such as rotary chuck) of cleaning equipment, and rotates according to certain speed; Simultaneously to the cleaning liquid of the surface spraying certain flow of wafer, crystal column surface is cleaned.
While reached removal pollutant object by cleaning, the most important thing is will ensure wafer, especially the not damaged of figure crystal column surface figure be cleaned.
Along with reducing of integrated circuit pattern characteristic size, the removal difficulty of the pollutant of crystal column surface smaller szie is also continuing to increase.Therefore, a lot of Novel washing technology has also obtained applying more widely on cleaning equipment.Wherein, on monolithic wet clean equipment, utilize atomization cleaning technology can improve the effect of cleaning further.In atomization cleaning process, atomizing particle can produce an impulsive force to the liquid film of crystal column surface, and in liquid film, form the shock wave of fast propagation.When shock wave is on particulate pollutant, the process that pollutant departs from from crystal column surface can be accelerated on the one hand; On the other hand, shock wave can accelerate the flowing velocity of crystal column surface cleaning liquid, impels particulate pollutant to be taken away crystal column surface along with the flowing of liquid quickly.
But, the atomized particle size that atomization cleaner common at present produces is larger, and the energy that atomizing particle has is also higher, when these atomization cleaners are applied in the wafer cleaning technique in 65 nanometers and following technology generation, be easy to cause the problems such as surfacial pattern damage.The utilization rate of liquid phase fluid is lower simultaneously, causes the profligacy of resource.
In addition, along with the continuous progress of integrated circuit fabrication process, the volume of semiconductor devices is just becoming more and more less, and this result also in very small particle and also becomes the manufacture and performance that are enough to affect semiconductor devices.For the particle that these are small, traditional fluid cleaning method effectively can not remove them.This is the boundary layer owing to there is a geo-stationary between semiconductor wafer surface and cleaning liquid.When the particle diameter being attached to crystal column surface is less than boundary layer thickness, the flowing of cleaning liquid just cannot to particle generation effect.
In order to improve this problem, ultrasonic wave or mega sonic wave cleaning have been introduced into semiconductor cleaning process.Ultrasonic wave or megasonic energy can produce small bubble in water, and the vibrations produced when bubble pops form shock wave in the liquid film of crystal column surface.Very fast owing to impacting wave propagation velocity, cause the boundary layer between crystal column surface and cleaning liquid thinning, make contamination particle be exposed in the cleaning liquid of flowing, this is attached to molecule on wafer by contributing to peeling off those, thus cleans wafer.
But adopt ultrasonic wave or mega sonic wave cleaning technique while improve pollutant removal efficiency, also inevitably bring the damage problem for figure wafer.This mainly due to the energy of ultrasonic wave or mega sonic wave in medium with wavy transmission, in some specific position, can due to the superposition of crest energy, produce the region that an energy density is very high, when the bubbles burst that this region produces, its energy is far away higher than the intensity of crystal column surface figure structure, and causes the appearance of damaged graphics.
In order to reduce the damage to crystal column surface figure, need the size reducing the liquid particles ejected further, and control the direction of motion of atomizing particle, movement velocity, movement locus and uniformity etc. better, also need to improve embody rule mode that is ultrasonic or million audio technologies simultaneously, to reduce liquid particles and high density energy ultrasonic wave or mega sonic wave to the damage of figure, improve cleaning quality and efficiency, save cleaning cost.
Summary of the invention
The object of the invention is to the above-mentioned defect overcoming prior art existence, a kind of two-phase flow atomization cleaner and the cleaning method with ultrasonic or million sound oscillations are provided, by design, ultrasonic wave or mega sonic wave are cleaned the new nozzle arrangements combined with two-phase flow atomization cleaning, effectively can solve the problem causing wafer pattern side wall and corner damage, improve cleaning quality and efficiency, save cleaning cost.
For achieving the above object, technical scheme of the present invention is as follows:
Have a two-phase flow atomization cleaner that is ultrasonic or million sound oscillations, for carrying out ultrasonic wave or mega sonic wave atomization cleaning to the wafer be placed in cleaning chambers on rotation platform, described cleaning device comprises:
Nozzle body, its inside is provided with liquid line, along liquid line inner wall surface, ultrasonic wave or mega sonic wave generating unit are housed, gas piping is provided with around liquid line, nozzle body lower end is provided with gas-liquid guiding parts, gas-liquid guiding parts is provided with the multichannel separating liquid pipeline being communicated with liquid line with certain symmetric relation level, there is between each separating liquid pipeline the web plate of giving vent to anger being communicated with gas piping, web plate of giving vent to anger vertically is provided with the gas channeling outlet of densely covered majority, being provided with nozzle body axis along each separating liquid pipeline is that the majority guiding fluid that has a down dip of predetermined angle exports,
Water influent pipeline and air inlet pipeline, be connected on a spray arm, and be communicated with liquid line, gas piping in nozzle body respectively, and the circular arc that described spray arm drives nozzle body to do the wafer center of circle moves back and forth;
Atomizing particle exit, around being located at below gas-liquid guiding parts, it is Laval nozzle structure or has vertical inwall;
Wherein, ultrasonic wave or mega sonic wave vibration is produced by ultrasonic wave or mega sonic wave generating unit, its ultrasonic wave or megasonic energy are conducted in the cleaning liquid flowed through, the cleaning liquid making to export ejection by guiding fluid with exported the gas crossing atomizing particle formed below gas-liquid guiding parts sprayed by gas channeling there is ultrasonic wave or megasonic energy, and under the acceleration or vertically-guided effect of atomizing particle exit, spray to crystal column surface downwards carry out ultrasonic wave or mega sonic wave atomization cleaning.
Preferably, described ultrasonic wave or mega sonic wave generating unit comprise towards the piezoelectric of liquid line internal direction successively connected setting and coupling layer, described piezoelectric is connected with external circuit by binding post, with the oscillation energy that the transform electrical signals that will receive is piezoelectric, form the higher-order of oscillation, and the ultrasonic wave of generation or mega sonic wave oscillation energy are conducted in the cleaning liquid in coupling layer and liquid line successively.
Preferably, described piezoelectric and coupling layer are the annular of phase fit, and it is arranged around liquid line inwall, and mutually concordant with liquid line inner wall surface.
Preferably, described piezoelectric and coupling layer are the sheet shape be connected, and setting mutually concordant with liquid line inner wall surface.
Preferably, the piezoelectric of described shape and coupling layer have the radian matched with liquid line inwall.
Preferably, described coupling layer surface is coated with one deck corrosion-resistant finishes.
Preferably, the thickness of described corrosion-resistant finishes is 1-500 micron.
Preferably, the multichannel separating liquid pipeline of described gas-liquid guiding parts is common connectivity points with liquid line lower end, and by uniform spoke-like setting, the web plate of giving vent to anger of almost fan is formed between adjacent liquid distribution pipeline, the guiding fluid outlet of each separating liquid pipeline is positioned at below web plate of giving vent to anger, and the downward-sloping setting of gas channeling Way out of web plate of giving vent to anger towards its corresponding side.
Preferably, it is the end face that predetermined angle has a down dip that described separating liquid pipeline has with the vertical axis of nozzle body, and described guiding fluid outlet is vertically drawn by this end face.
Preferably, also comprise a liquid rinse pipeline, be located in cleaning chambers, its be positioned at rotation platform oblique upper, export and arrange towards the center of rotation platform; Or liquid rinse pipeline is connected on spray arm, its outlet is positioned at described nozzle body side, and arranges vertically downward.
A kind ofly use the above-mentioned cleaning method with the two-phase flow atomization cleaner of ultrasonic or million sound oscillations, comprise: the operating frequency of setting ultrasonic wave or mega sonic wave generating unit and power, the movement locus of setting spray arm and cleaning menu, start cleaning, first start wafer to rotate, and open liquid rinse pipeline, to crystal column surface large discharge jet cleaning liquid, to form the equally distributed cleaning liquid film of one deck at crystal column surface, then water influent pipeline and air inlet pipeline is opened, the cleaning liquid of certain flow is passed into the liquid line in nozzle body, the gas of certain flow is passed into gas piping, open ultrasonic wave or mega sonic wave generating unit simultaneously, be oscillation energy by piezoelectric by the transform electrical signals of reception, form the higher-order of oscillation, and the ultrasonic wave of generation or mega sonic wave oscillation energy are conducted in the cleaning liquid in coupling layer and liquid line successively, the cleaning liquid making to export ejection by guiding fluid with exported the gas crossing atomizing particle formed below gas-liquid guiding parts sprayed by gas channeling there is ultrasonic wave or megasonic energy, and under the vertically-guided of atomizing particle exit or the acceleration of Laval nozzle structure, inject in the cleaning liquid thin layer of crystal column surface, form the vibration of local, to carry out ultrasonic wave or mega sonic wave atomization cleaning to wafer.
Preferably, described liquid rinse pipeline and the cleaning liquid passed in water influent pipeline can identical, also can be different.
Preferably, described cleaning liquid comprises chemical liquid or ultra-pure water.
Preferably, described gas comprises nitrogen, carbon dioxide or compressed air.
The present invention has the following advantages:
1, by the atomizing nozzle structure exported by guiding fluid and gas exit is formed, the high-speed liquid stream making it spray and high velocity gas stream produce and interact fully, and by adjustment piping flow, form the ultra micro atomized drop that particle size is homogeneous, adjustable, greatly can reduce atomized particle size, reduce the energy that it has, avoid becoming damage to crystal column surface figure structure; When atomizing particle exit has Laval nozzle structure, when air inlet pipeline and water influent pipeline keep flow constant, can make to there is higher speed, to improve cleaning efficiency from the atomizing particle of device end outlet injection.
2, when atomizing particle exit has vertical inner wall structure, the vertically-guided effect produced by atomizing particle exit, can make in technical process airflow direction and crystal column surface perpendicular, promote that the impurity in surface grooves figure is to the transmission of bodies of fluid, improve the efficiency of cleaning, improve cleaning performance, and the cross shear of atomizing particle to crystal column surface figure structure can be reduced, prevent the damage of crystal column surface figure structure; Meanwhile, be conducive to saving cleaning liquid.
3, size uniformity can be formed, adjustable atomizing particle rinses crystal column surface, because the quality of atomizing particle is little, but also crystal column surface can be made to be pre-existing in one deck sprayed the cleaning liquid film formed with large discharge by liquid rinse pipeline, thus the impulsive force that can reduce crystal column surface structure, and the damage to crystal column surface figure structure can be reduced; Simultaneously, the shock wave produced when atomizing particle can be utilized to clash into cleaning liquid film is on particulate pollutant, the process that pollutant departs from from crystal column surface can be accelerated on the one hand, on the other hand, shock wave can accelerate the flowing velocity of crystal column surface cleaning liquid, impels particulate pollutant to be taken away crystal column surface along with the flowing of liquid quickly.
4, with the cleaning liquid of ultrasonic wave or megasonic energy after the atomization of two-phase flow atomising device, form atomizing particle; Due to atomizing particle enter crystal column surface cleaning liquid film time be all random distribution over time and space, therefore, ultrasonic wave entrained by atomizing particle or megasonic energy would not form stable energy interference field, also namely improve ultrasonic wave or the megasonic energy covering uniformity at crystal column surface, effectively can control the appearance producing crystal column surface figure damage problem.
5, compared to existing cleaning device, there is atomizing particle that two-phase flow atomization cleaner that is ultrasonic or million sound oscillations produces when entering in the cleaning liquid film of crystal column surface, except the kinetic energy of atomizing particle own is except the shock wave formed in liquid film, the ultrasonic wave that atomizing particle has or megasonic energy are also passed in cleaning liquid film, direct flow can be formed, or breaking due to cavitation formation microbubble, more effectively can form shock wave in liquid film, thus improve the removal efficiency of crystal column surface particulate pollutant, shorten the process time, save the use amount of cleaning liquid and high-purity gas, save production cost, reduce ambient influnence.
Accompanying drawing explanation
Fig. 1 has two-phase flow atomization cleaner structural representation that is ultrasonic or million sound oscillations in present pre-ferred embodiments one;
Fig. 2 is the schematic enlarged-scale view of gas-liquid guiding parts in Fig. 1;
Fig. 3 has two-phase flow atomization cleaner structural representation that is ultrasonic or million sound oscillations in present pre-ferred embodiments two;
Fig. 4 is the partial structurtes enlarged drawing of ultrasonic wave or mega sonic wave generating unit in Fig. 1;
Fig. 5 has two-phase flow atomization cleaner structural representation that is ultrasonic or million sound oscillations in present pre-ferred embodiments three;
Fig. 6 is the partial structurtes enlarged drawing of ultrasonic wave or mega sonic wave generating unit in Fig. 5;
Fig. 7-Fig. 8 is the structural representation had when two-phase flow atomization cleaner that is ultrasonic or million sound oscillations is positioned at cleaning chambers in present pre-ferred embodiments four;
Fig. 9 is the movement locus schematic diagram of spray arm in cleaning process.
Detailed description of the invention
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
It should be noted that, in following detailed description of the invention, when describing embodiments of the present invention in detail, in order to clearly represent structure of the present invention so that explanation, special to the structure in accompanying drawing not according to general scale, and carried out partial enlargement, distortion and simplify processes, therefore, should avoid being understood in this, as limitation of the invention.
In following the specific embodiment of the present invention, refer to Fig. 1, Fig. 1 has two-phase flow atomization cleaner structural representation that is ultrasonic or million sound oscillations in present pre-ferred embodiments one.As shown in Figure 1, of the present invention have two-phase flow atomization cleaner that is ultrasonic or million sound oscillations, can be used for carrying out ultrasonic wave or mega sonic wave atomization cleaning to the wafer be placed in cleaning chambers on rotation platform, described cleaning device comprises: nozzle body 4, water influent pipeline 5 and air inlet pipeline 2, and is positioned at the several major part of atomizing particle exit 8 of nozzle body lower end.Wherein the shape of cross section of nozzle body 4 can comprise circle, triangle or polygon, and fan-shaped, strip etc., the present invention is not construed as limiting.
Please continue to refer to Fig. 1.Be provided with liquid line 3 in nozzle body 4 inside, be provided with gas piping 7 around liquid line.Described water influent pipeline 5 can be communicated with liquid line 3 by entering in nozzle body in the middle part of the upper surface of nozzle body 4, and described air inlet pipeline 2 correspondence can be entered in nozzle body by the upper end sidepiece of nozzle body and be communicated with gas piping 7.Water influent pipeline 5 and air inlet pipeline 2 are respectively used to pass into cleaning liquid, gas.Be positioned at below liquid line 3 and gas piping 7 be provided with gas-liquid guiding parts 1 in nozzle body 4 lower end, namely, for being derived and form atomizing particle by the purge gas in the cleaning liquid in liquid line 3 and gas piping 7, then spray to crystal column surface downwards through atomizing particle exit 8.Atomizing particle exit 8 is around being located at below gas-liquid guiding parts 1, and it has illustrated Lavalle (Laval) nozzle structure 8-1 to 8-3, or also can have vertical interior wall construction (see Fig. 4).
Refer to Fig. 2, Fig. 2 is the schematic enlarged-scale view of gas-liquid guiding parts in Fig. 1.To have the nozzle body of circular cross section, as shown in Figure 2, gas-liquid guiding parts 1 is provided with the multichannel separating liquid pipeline 1-1 being communicated with liquid line with certain symmetric relation level, such as in the present embodiment, the multichannel separating liquid pipeline 1-1 of described gas-liquid guiding parts 1 is common connectivity points with liquid line lower end 3-1, and by uniform spoke-like setting; There is between each separating liquid pipeline 1-1 the web plate 1-2 that gives vent to anger being communicated with gas piping, such as in the present embodiment, between adjacent liquid distribution pipeline, form the fan-shaped web plate 1-2 that gives vent to anger; The web plate 1-2 that gives vent to anger vertically is provided with a densely covered majority gas channeling outlet 1-4, being provided with nozzle body vertical axis along each separating liquid pipeline 1-1 is that the majority guiding fluid that has a down dip of predetermined angle exports 1-3, such as in the present embodiment, the guiding fluid outlet 1-3 of each separating liquid pipeline is positioned at below the web plate 1-2 that gives vent to anger, and exports the downward-sloping setting in 1-4 direction towards the gas channeling of its corresponding side (being illustrated as left side) web plate of giving vent to anger.When actual fabrication, can process one in described separating liquid pipeline 1-1 lower end with the vertical axis of nozzle body is the end face that has a down dip of predetermined angle, is then vertically drawn by this end face by described guiding fluid outlet 1-3.As optional embodiment, when above-mentioned predetermined angle is between 10 ~ 80 °, good atomizing particle can be had and form effect; And when described predetermined angle is between 30 ~ 60 °, better atomizing particle can be had and form effect.The symmetric mode that multichannel separating liquid pipeline also can be suitable for according to other is arranged, such as fishbone, circular concentric etc., arranges with the gas channeling outlet of certain predetermined angle towards side as long as meet the outlet of each guiding fluid.
As optional embodiment, the cross sectional shape of guiding fluid outlet 1-3 and/or gas channeling outlet 1-4 can comprise circle, triangle, polygon etc.Preferably, highly at the bottom of the round diameter of described guiding fluid outlet 11 and/or gas channeling outlet 12 or triangle, polygon top can be 1 ~ 1000 μm; Further preferably, the diameter of the outlet of described guiding fluid and/or gas channeling outlet or the end, top, highly can be 200 ~ 400 μm.
For improving the speed that atomizing particle penetrates from cleaning device end, can be optimized the structure of atomizing particle exit 8, the design of atomizing particle exit is become the structure with Laval nozzle, thus when the flow of air inlet pipeline and water influent pipeline remains unchanged, can make to there is higher speed, to improve cleaning efficiency from the atomizing particle of device end outlet injection.As shown in Figure 1, this Laval nozzle structure comprises collapsible tube 8-1, narrow larynx 8-2 and convergent divergent channel 8-3 from top to bottom successively.
In the collapsible tube part of Laval nozzle, the rule that gas motion is followed " little place, cross section flow velocity is large, and cross section general goal flow velocity is little ", therefore air-flow is constantly accelerated.When reaching narrow larynx, the flow velocity of gas exceedes velocity of sound, and ultrasonic fluid no longer follows above-mentioned rule when convergent divergent channel componental movement, but just the opposite, cross section is larger, and flow velocity is faster.Therefore, this principle can be utilized, atomizing particle exit 8 is designed to the structure with Laval nozzle, make, from the atomizing particle of cleaning device injection, there is higher speed, to improve cleaning efficiency, save the cleaning liquid and gases at high pressure that clean and consume.
Refer to Fig. 3, Fig. 3 has two-phase flow atomization cleaner structural representation that is ultrasonic or million sound oscillations in present pre-ferred embodiments two.As shown in Figure 3, as different embodiments, atomizing particle exit 8 also can have vertical interior wall construction 8-4, its effect makes the direction of motion and the uneven atomizing particle of nozzle body vertical axial impinge upon on the sidewall 8-4 of atomizing particle exit 8, to ensure that the direction of motion of the atomizing particle of all arrival crystal column surface liquid films is perpendicular to wafer, prevents cross shear from causing the structural damage of crystal column surface figure.
Refer to Fig. 1.Inner wall surface along liquid line is equipped with ultrasonic wave or mega sonic wave generating unit 6.Described ultrasonic wave or mega sonic wave generating unit 6 comprise piezoelectric and coupling layer, and described piezoelectric and coupling layer are connected successively towards the direction of liquid line 3 inside setting.Described piezoelectric 6-1 is connected with external circuit by binding post 6-3, with the oscillation energy that the transform electrical signals that will receive is piezoelectric 6-1, form the higher-order of oscillation, and the ultrasonic wave of generation or mega sonic wave oscillation energy are conducted in the cleaning liquid in coupling layer 6-2 and liquid line 3 successively.
Refer to Fig. 4, Fig. 4 is the partial structurtes enlarged drawing of ultrasonic wave or mega sonic wave generating unit in Fig. 1.As shown in Figure 4, as one preferred embodiment, described piezoelectric 6-1 and coupling layer 6-2 adopts the ring form of phase fit in outer to fit together, and arrange around the inwall of liquid line 3, make the section from its side, piezoelectric 6-1 and coupling layer 6-2 to be connected setting successively towards liquid line 3 internal direction.Coupling layer 6-2 exposes to liquid line internal direction, and mutually concordant with the inwall of liquid line, in order to avoid have an impact to the flowing of cleaning liquid.
Please continue to refer to Fig. 4.As further preferred embodiment, one deck corrosion-resistant finishes 6-4 can be applied again on the surface of described coupling layer 6-2, such as fluoro-containing plastic or polyester material etc., its effect prevents liquid rinse medium from causing corrosion to coupling layer 6-2 and piezoelectric 6-1, produces and pollute.The thickness of described corrosion-resistant finishes 6-4 is advisable with 1-500 micron, and mutually concordant with the inwall of liquid line after preferably making corrosion-resistant finishes apply.
Refer to Fig. 5, Fig. 5 has two-phase flow atomization cleaner structural representation that is ultrasonic or million sound oscillations in present pre-ferred embodiments three.As shown in Figure 5, as different optional manner, described water influent pipeline 5 also can be entered in nozzle body by the upper end sidepiece of nozzle body 4 and be communicated with liquid line 3, and in this case, water influent pipeline 5 needs to enter the upper end sidepiece being also communicated to liquid line 3 in body through gas piping 7.Enter in nozzle body in the middle part of the upper surface of described air inlet pipeline 2 correspondence by nozzle body 4 and be communicated with gas piping 7.Water influent pipeline 5 and the access port of air inlet pipeline 2 on nozzle body also can be positioned at other positions, and can adopt other access way, and the present invention is not construed as limiting.
Please continue to refer to Fig. 5.As an optional embodiment, ultrasonic wave or mega sonic wave generating unit 6 also can be arranged on the upper end inner wall position of liquid line 3.
Refer to Fig. 6, Fig. 6 is the partial structurtes enlarged drawing of ultrasonic wave or mega sonic wave generating unit in Fig. 5.As shown in Figure 6, ultrasonic wave or mega sonic wave generating unit comprise piezoelectric 6-1 and coupling layer 6-2 equally.Piezoelectric 6-1 herein and coupling layer 6-2 can adopt the sheet shape form be connected, and down to the inside connected setting successively of liquid line 3.Water influent pipeline 5 is positioned at the below sidepiece of ultrasonic wave or mega sonic wave generating unit with the connection entrance 5-3 of liquid line 3.The piezoelectric 6-1 of described shape and coupling layer 6-2 can have the radian matched with liquid line 3 inwall.Described piezoelectric 6-1 is connected with external circuit by binding post 6-3, with the oscillation energy that the transform electrical signals that will receive is piezoelectric 6-1, form the higher-order of oscillation, and the ultrasonic wave of generation or mega sonic wave oscillation energy are conducted in the cleaning liquid in coupling layer 6-2 and liquid line 3 successively.The surface of described coupling layer 6-2 can apply one deck corrosion-resistant finishes 6-4 equally.
Refer to Fig. 7-Fig. 8, Fig. 7-Fig. 8 is the structural representation had when two-phase flow atomization cleaner that is ultrasonic or million sound oscillations is positioned at cleaning chambers in present pre-ferred embodiments four.As shown in Figure 7, at cleaning chambers 15 built with rotation platform 14, rotation platform is provided with grip unit 11, for fixing wafer 16; Rotation platform is driven by motor 13 and can realize rotating.Below cleaning chambers 15, be provided with devil liquor recovery unit, the waste liquid in cleaning process is discharged in the devil liquor recovery outlet 12 by cavity bottom.The nozzle body 4 of cleaning device of the present invention is hung in cleaning chambers, and can fully movement above rotation platform 14.Nozzle body 4 is connected on spray arm 9 also fixing by water influent pipeline 5 and air inlet pipeline 2.
Refer to Fig. 7.Of the present invention have two-phase flow atomization cleaner that is ultrasonic or million sound oscillations and also comprise a liquid rinse pipeline 10, be located in cleaning chambers 15, and the oblique upper of rotation platform 14 can be positioned at, such as, above the inwall side that can be arranged on cleaning chambers 15, its outlet is arranged towards the center of rotation platform 14.
When carrying out two-phase flow atomization cleaning technique, except the road cleaning liquid introduced by water influent pipeline, liquid line in atomizer inside, also additionally need the liquid rinse pipeline 10 of a large discharge, its effect be wafer 16 surface formed one deck cover completely, equally distributed cleaning liquid film.The atomization of liquid particle that independent dependence two-phase flow atomizer produces may be not enough to the area covering whole wafer, also cannot form best cleaning performance simultaneously.When in the cleaning liquid film of the high speed atomisation particles hit sprayed from two-phase flow atomizing particle exit at crystal column surface, an impulsive force can be produced, and in liquid film, form the shock wave of fast propagation.When this shock wave is on particulate pollutant, the process that pollutant departs from from crystal column surface can be accelerated on the one hand; On the other hand, shock wave can accelerate the flowing velocity of crystal column surface cleaning liquid, impels particulate pollutant to be taken away crystal column surface along with the flowing of liquid quickly.
When cleaning, described spray arm 9 can movement locus as shown in Figure 9, and the circular arc driving nozzle body 4 to do wafer 16 center of circle moves back and forth, and carries out mobile atomization cleaning to the wafer 16 on rotation platform 14.
Please continue to refer to Fig. 7.Large discharge liquid enters from the large discharge liquid inlet 10-2 of liquid rinse pipeline 10, spray from large discharge liquid outlet, its spray angle adjusts accordingly by large discharge Liquid inject angle adjusting 10-1, enables large discharge liquid be ejected into the center of wafer 16.In technical process, large discharge liquid rinse pipeline is first opened, jet cleaning liquid, until cleaning liquid covers crystal column surface completely, now opens two-phase flow atomizer and starts cleaning.In two-phase flow atomizer cleaning process, large discharge liquid line can be held open or close or intermittent unlatching, depends on the technological parameters such as water influent pipeline flow, large discharge fluid flow, wafer rotating speed.
Refer to Fig. 8.The mode be mounted on by liquid rinse pipeline 10 on spray arm 9 can also be adopted, make the large discharge liquid outlet of liquid rinse pipeline 10 be positioned at the side of described nozzle body 4, and arrange vertically downward.Be with the difference of structure shown in Fig. 7, large discharge liquid rinse pipeline 10 is fixed on after on spray arm 9, synchronously can carry out arc swing along with the swing of nozzle body 4.
In addition, as further optimal design, the gas flow regulating valve being used for adjusting gas flow can also be set on described air inlet pipeline 2; Also can the liquid flow regulating valve being used for regulates liquid flow be set in described water influent pipeline 5 further; The large discharge liquid flow regulating valve being used for regulates liquid flow can also be set on the liquid rinse pipeline 10 of large discharge; And the pneumatic operated valve being used for gauge tap can also be set on the liquid rinse pipeline 10 of described air inlet pipeline 2, water influent pipeline 5 and large discharge.
The principle that the atomizer with the two-phase flow atomization cleaner of ultrasonic or million sound oscillations of the invention described above forms atomizing particle is as follows: the cleaning liquid in water influent pipeline enters the separating liquid pipeline in divergent shape along the liquid line in nozzle body, and from guiding fluid outlet ejection; The gross area due to guiding fluid outlet is less than the sectional area of water influent pipeline and liquid line, cleaning liquid is produced and accelerates, be divided into the liquid stream of several diameters in micron dimension simultaneously, and with the oblique injection of angle preset.Same, the gas of air inlet pipeline, by the gas channeling outlet injection bottom the gas piping in nozzle body, forms the gas flow of several diameters in micron dimension, and penetrates along the vertical axial direction of nozzle body.Have an effect in the below that gas flow and liquid stream export at gas channeling, liquid stream is broken up forms ultra micro atomizing particle.After ultra micro atomizing particle is formed, under the effect of gas flow, do accelerated motion downwards.For the atomizing particle exit with VERTICAL TUBE wall construction; the uneven ultra micro atomizing particle in vertical axial direction of the direction of motion and nozzle body can impinge upon on the sidewall of atomizing particle exit; again converge and become large drop; flowed down by tube wall, ensure the direction of motion uniformity of the atomizing particle ejected from atomizing particle exit with this.
Meanwhile, in wafer cleaning process, cleaning liquid enters nozzle liquid pipeline by water influent pipeline, and is full of.Conduct in piezoelectric from the signal of telecommunication of external circuit input through piezoelectric binding post, form the higher-order of oscillation, and the ultrasonic wave of generation and mega sonic wave oscillation energy are conducted through coupling layer and corrosion-resistant finishes successively, final arrival is cleaned in liquid.Cleaning liquid, after the guiding fluid outlet ejection of nozzle gas-liquid guiding parts, exports the high-speed gas effect sprayed, form atomizing particle, and acquisition is accelerated with gas channeling.Atomizing particle has now had ultrasonic wave or megasonic energy, and enters in the cleaning liquid film of crystal column surface after the injection of atomizing particle exit, forms the vibration of local, completes the cleaning to particulate pollutant.
Below by detailed description of the invention, a kind ofly the above-mentioned cleaning method with the two-phase flow atomization cleaner of ultrasonic or million sound oscillations is used to be described in detail to of the present invention.
The cleaning method of the two-phase flow atomization cleaner of ultrasonic or million sound oscillations that what use of the present invention was above-mentioned have, can comprise:
First, the operating frequency of setting ultrasonic wave or mega sonic wave generating unit 6 and power, the movement locus of setting spray arm 9 and cleaning menu, start cleaning.
Wafer 16 is fixed on rotation platform 14 by wafer mounting apparatus (grip unit 11 in such as Fig. 7,8), and rotates with certain speed under the drive of motor 13.
Then, open liquid rinse pipeline 10 and regulate flow, to wafer 16 surperficial large discharge jet cleaning liquid, to form the equally distributed cleaning liquid film of one deck on wafer 16 surface.
Then, after a certain time, preferably between 3s ~ 10s, open water influent pipeline 5 and regulate flow, passing into cleaning liquid to the liquid line 3 in nozzle body 4; Open air inlet pipeline 2, pass into the gas of certain flow to the gas piping 7 in nozzle body 4, make to form ultra micro atomizing particle with the angular slope directive preset from the concurrent raw atomizing of gas of gas channeling outlet 1-4 ejection from the cleaning liquid of guiding fluid outlet 1-3 ejection.By regulating the flow of water influent pipeline 5 and air inlet pipeline 2, adjust the size of aerosolized liquid particles.
Simultaneously, open ultrasonic wave or mega sonic wave generating unit 6, be oscillation energy by piezoelectric 6-1 by the transform electrical signals of reception, form the higher-order of oscillation, and the ultrasonic wave of generation or mega sonic wave oscillation energy are conducted in the cleaning liquid in coupling layer 6-2 and liquid line 3 successively, make to be exported cleaning liquid that 1-3 sprays by guiding fluid and exported high-speed gas crossing atomizing particle formed below gas-liquid guiding parts 1 that 1-4 sprays by gas channeling there is ultrasonic wave or megasonic energy, and under the vertically-guided of atomizing particle exit 8 vertical inner wall or the acceleration of Laval nozzle structure, inject in the cleaning liquid thin layer on wafer 16 surface, form the vibration of local, the physical force of increasing action on pollutant, drive the vibration of cleaning fluid thin layer simultaneously, accelerate the transmittance process of pollutant to cleaning liquid fluid, improve cleaning efficiency, to realize the ultrasonic wave that carries out wafer or mega sonic wave atomization cleaning.
As one preferred embodiment, by the flow control valve regulating pipeline to arrange, be 100 ~ 2000ml/min by the cleaning liquid flow-control of described liquid rinse pipeline 10, be 10 ~ 500ml/min by the cleaning liquid flow-control of described water influent pipeline 5, and the gas flow of described air inlet pipeline 2 is controlled to be 10 ~ 150L/min, to form the ultra micro atomizing particle of size uniformity.
As optional embodiment, the cleaning liquid passed in liquid rinse pipeline 10 of the present invention and water influent pipeline 5 can comprise chemical liquid or ultra-pure water, and the gas passed in air inlet pipeline 2 can comprise nitrogen, carbon dioxide or compressed air.Especially, described liquid rinse pipeline 10 and the cleaning liquid passed in water influent pipeline 5 can identical, also can be different.Which kind of gas of concrete employing and liquid, can be decided according to the actual requirements.
In sum, the present invention has following distinguishing feature:
1, by the atomizing nozzle structure exported by guiding fluid and gas exit is formed, the high-speed liquid stream making it spray and high velocity gas stream produce and interact fully, and by adjustment piping flow, form the ultra micro atomized drop that particle size is homogeneous, adjustable, greatly can reduce atomized particle size, reduce the energy that it has, avoid becoming damage to crystal column surface figure structure; When atomizing particle exit has Laval nozzle structure, when air inlet pipeline and water influent pipeline keep flow constant, can make to there is higher speed, to improve cleaning efficiency from the atomizing particle of device end outlet injection.
2, when atomizing particle exit has vertical inner wall structure, the vertically-guided effect produced by atomizing particle exit, can make in technical process airflow direction and crystal column surface perpendicular, promote that the impurity in surface grooves figure is to the transmission of bodies of fluid, improve the efficiency of cleaning, improve cleaning performance, and the cross shear of atomizing particle to crystal column surface figure structure can be reduced, prevent the damage of crystal column surface figure structure; Meanwhile, be conducive to saving cleaning liquid.
3, size uniformity can be formed, adjustable atomizing particle rinses crystal column surface, because the quality of atomizing particle is little, but also crystal column surface can be made to be pre-existing in one deck sprayed the cleaning liquid film formed with large discharge by liquid rinse pipeline, thus the impulsive force that can reduce crystal column surface structure, and the damage to crystal column surface figure structure can be reduced; Simultaneously, the shock wave produced when atomizing particle can be utilized to clash into cleaning liquid film is on particulate pollutant, the process that pollutant departs from from crystal column surface can be accelerated on the one hand, on the other hand, shock wave can accelerate the flowing velocity of crystal column surface cleaning liquid, impels particulate pollutant to be taken away crystal column surface along with the flowing of liquid quickly.
4, with the cleaning liquid of ultrasonic wave or megasonic energy after the atomization of two-phase flow atomization jetting device, form atomizing particle; Due to atomizing particle enter crystal column surface cleaning liquid film time be all random distribution over time and space, therefore, ultrasonic wave entrained by atomizing particle or megasonic energy would not form stable energy interference field, also namely improve ultrasonic wave or the megasonic energy covering uniformity at crystal column surface, effectively can control the appearance producing crystal column surface figure damage problem.
5, compared to existing cleaning device, there is atomizing particle that two-phase flow atomization cleaner that is ultrasonic or million sound oscillations produces when entering in the cleaning liquid film of crystal column surface, except the kinetic energy of atomizing particle own is except the shock wave formed in liquid film, the ultrasonic wave that atomizing particle has or megasonic energy are also passed in cleaning liquid film, direct flow can be formed, or breaking due to cavitation formation microbubble, more effectively can form shock wave in liquid film, thus improve the removal efficiency of crystal column surface particulate pollutant, shorten the process time, save the use amount of cleaning liquid and high-purity gas, save production cost, reduce ambient influnence.
Above-describedly be only the preferred embodiments of the present invention; described embodiment is also not used to limit scope of patent protection of the present invention; therefore the equivalent structure that every utilization description of the present invention and accompanying drawing content are done changes, and in like manner all should be included in protection scope of the present invention.
Claims (14)
1. have a two-phase flow atomization cleaner that is ultrasonic or million sound oscillations, for carrying out ultrasonic wave or mega sonic wave atomization cleaning to the wafer be placed in cleaning chambers on rotation platform, it is characterized in that, described cleaning device comprises:
Nozzle body, its inside is provided with liquid line, along liquid line inner wall surface, ultrasonic wave or mega sonic wave generating unit are housed, gas piping is provided with around liquid line, nozzle body lower end is provided with gas-liquid guiding parts, gas-liquid guiding parts is provided with the multichannel separating liquid pipeline being communicated with liquid line with certain symmetric relation level, there is between each separating liquid pipeline the web plate of giving vent to anger being communicated with gas piping, web plate of giving vent to anger vertically is provided with the gas channeling outlet of densely covered majority, being provided with nozzle body axis along each separating liquid pipeline is that the majority guiding fluid that has a down dip of predetermined angle exports,
Water influent pipeline and air inlet pipeline, be connected on a spray arm, and be communicated with liquid line, gas piping in nozzle body respectively, and the circular arc that described spray arm drives nozzle body to do the wafer center of circle moves back and forth;
Atomizing particle exit, around being located at below gas-liquid guiding parts, it is Laval nozzle structure or has vertical inwall;
Wherein, ultrasonic wave or mega sonic wave vibration is produced by ultrasonic wave or mega sonic wave generating unit, its ultrasonic wave or megasonic energy are conducted in the cleaning liquid flowed through, the cleaning liquid making to export ejection by guiding fluid with exported the gas crossing atomizing particle formed below gas-liquid guiding parts sprayed by gas channeling there is ultrasonic wave or megasonic energy, and under the acceleration or vertically-guided effect of atomizing particle exit, spray to crystal column surface downwards carry out ultrasonic wave or mega sonic wave atomization cleaning.
2. cleaning device according to claim 1, it is characterized in that, described ultrasonic wave or mega sonic wave generating unit comprise towards the piezoelectric of liquid line internal direction successively connected setting and coupling layer, described piezoelectric is connected with external circuit by binding post, with the oscillation energy that the transform electrical signals that will receive is piezoelectric, form the higher-order of oscillation, and the ultrasonic wave of generation or mega sonic wave oscillation energy are conducted in the cleaning liquid in coupling layer and liquid line successively.
3. cleaning device according to claim 2, is characterized in that, described piezoelectric and coupling layer are the annular of phase fit, and it is arranged around liquid line inwall, and mutually concordant with liquid line inner wall surface.
4. cleaning device according to claim 2, is characterized in that, described piezoelectric and coupling layer are the sheet shape be connected, and setting mutually concordant with liquid line inner wall surface.
5. cleaning device according to claim 4, is characterized in that, the piezoelectric of described shape and coupling layer have the radian matched with liquid line inwall.
6. the cleaning device according to claim 2-5 any one, is characterized in that, described coupling layer surface is coated with one deck corrosion-resistant finishes.
7. cleaning device according to claim 6, is characterized in that, the thickness of described corrosion-resistant finishes is 1-500 micron.
8. cleaning device according to claim 1, it is characterized in that, the multichannel separating liquid pipeline of described gas-liquid guiding parts is common connectivity points with liquid line lower end, and by uniform spoke-like setting, the web plate of giving vent to anger of almost fan is formed between adjacent liquid distribution pipeline, the guiding fluid outlet of each separating liquid pipeline is positioned at below web plate of giving vent to anger, and the downward-sloping setting of gas channeling Way out of web plate of giving vent to anger towards its corresponding side.
9. cleaning device according to claim 8, is characterized in that, it is the end face that predetermined angle has a down dip that described separating liquid pipeline has with the vertical axis of nozzle body, and described guiding fluid outlet is vertically drawn by this end face.
10. cleaning device according to claim 1, is characterized in that, also comprises a liquid rinse pipeline, is located in cleaning chambers, its be positioned at rotation platform oblique upper, export and arrange towards the center of rotation platform; Or liquid rinse pipeline is connected on spray arm, its outlet is positioned at described nozzle body side, and arranges vertically downward.
11. 1 kinds use the cleaning method with the two-phase flow atomization cleaner of ultrasonic or million sound oscillations described in claim 1 ~ 10 any one, it is characterized in that, comprise: the operating frequency of setting ultrasonic wave or mega sonic wave generating unit and power, the movement locus of setting spray arm and cleaning menu, start cleaning, first start wafer to rotate, and open liquid rinse pipeline, to crystal column surface large discharge jet cleaning liquid, to form the equally distributed cleaning liquid film of one deck at crystal column surface, then water influent pipeline and air inlet pipeline is opened, the cleaning liquid of certain flow is passed into the liquid line in nozzle body, the gas of certain flow is passed into gas piping, open ultrasonic wave or mega sonic wave generating unit simultaneously, be oscillation energy by piezoelectric by the transform electrical signals of reception, form the higher-order of oscillation, and the ultrasonic wave of generation or mega sonic wave oscillation energy are conducted in the cleaning liquid in coupling layer and liquid line successively, the cleaning liquid making to export ejection by guiding fluid with exported the gas crossing atomizing particle formed below gas-liquid guiding parts sprayed by gas channeling there is ultrasonic wave or megasonic energy, and under the vertically-guided of atomizing particle exit or the acceleration of Laval nozzle structure, inject in the cleaning liquid thin layer of crystal column surface, form the vibration of local, to carry out ultrasonic wave or mega sonic wave atomization cleaning to wafer.
12. cleaning methods according to claim 11, is characterized in that, described liquid rinse pipeline and the cleaning liquid passed in water influent pipeline can identical, also can be different.
13. cleaning methods according to claim 11 or 12, it is characterized in that, described cleaning liquid comprises chemical liquid or ultra-pure water.
14. cleaning methods according to claim 11, is characterized in that, described gas comprises nitrogen, carbon dioxide or compressed air.
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