JP2002011419A - Cleaning method and cleaning device used for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a novel method of cleaning using a cleaning nozzle for realizing an efficient method of cleaning, a novel device for cleaning to embody the method of cleaning and further a method of manufacturing an electronic part using the method of cleaning. SOLUTION: The method of cleaning the electronic part is performed by mixing a high pressure gas introduced into a gas-liquid mixing chamber from one of the flow passages with a high pressure liquid introduced into the gas- liquid mixing chamber from another passage to form liquid mist, giving momentum to the mist in an accelerating chamber to form a mist flow and jetting the mist flow from the tip of the nozzle to collide with a material to be cleaned and to relatively move the nozzle and the material to be cleaned to clean.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to a process of manufacturing electronic components having a fine structure such as an electronic display device such as a semiconductor device, a liquid crystal display device and a plasma display device, and a magnetic recording device, or various components related thereto. The present invention relates to a necessary cleaning method, and further relates to a cleaning apparatus for realizing the cleaning method, and further relates to a method for manufacturing a semiconductor device, an electronic display device, a magnetic recording device, and the like, and a semiconductor device manufactured using the method. Alternatively, it relates to a product such as an electronic display device or a magnetic recording device.

[0002]

2. Description of the Related Art As is well known to those skilled in the art, in the process of manufacturing various electronic components, foreign particles generated during the manufacturing process and foreign particles adhered to the product due to contamination from a manufacturing apparatus or a manufacturing environment. There is a case where the manufacturing yield is reduced as a cause of manufacturing failure. One method for avoiding such a problem is to add a washing step for removing foreign particles adhering to a product at a key point in a manufacturing process. Generally, foreign particles adhered to the product are firmly fixed to the product surface due to the potential energy between the product surface and the foreign particles. Then, it is necessary to peel off the foreign particles from the product surface and move them to a position away from the product. Generally, chemical or mechanical energy is used to apply such energy. As a method of applying mechanical energy, water washing by spraying a high-pressure jet, ultrasonic cleaning using ultrasonic vibration, Scrub cleaning using a brush is widely used. In recent years, in addition to these various cleaning methods, cleaning with a fluid in which a cleaning liquid and a gas are mixed has been attempted, and an example of such a technique is disclosed in JP-A-6-104304. .

[0003]

However, although all of these conventional cleaning techniques have the ability to remove foreign particles, it is economically burdensome to carry out cleaning at key points in the manufacturing process. This is a factor, and it is desirable to reduce the number of cleaning steps as much as possible. Even if cleaning is performed, improvement in cleaning efficiency has been consistently demanded. In other words, the cleaning effect is large, the cleaning effect is very short, the investment efficiency is excellent, and the cleaning efficiency is low.
There has been a demand for a cleaning method and a cleaning apparatus, which have low device reliability, a small amount of a cleaning liquid used for cleaning, a low processing cost for a cleaning waste liquid, and a small burden factor such as an environmental burden.

[0004] In addition, there has been a demand for a cleaning method that does not damage an object to be cleaned due to cleaning. Such a problem causes an extremely difficult problem in a manufacturing process of expensive electronic components. In other words, the damage from cleaning is usually small, so the damage cannot be detected unless the product is completed and tested, and in rare cases, the damage can be detected during use by the customer without being detected even by testing. In some cases. Since the cost required for the inspection to reduce such a problem becomes enormous, it has been desired that the cleaning process does not cause any damage. In particular, there has been a demand for a technique that can sufficiently clean the above-described cleaning performance and can perform cleaning without damage at the same time.

The object of the present invention made from such a viewpoint is as follows.
It is an object of the present invention to provide a cleaning method and a cleaning apparatus which have a large cleaning effect and can perform high-speed cleaning in an extremely short time.

A second object of the present invention is to provide a cleaning method and an apparatus capable of cleaning efficiently with an inexpensive cleaning apparatus and having excellent investment efficiency.

A third object of the present invention is to provide a cleaning method and an apparatus which are excellent in workability and apparatus reliability.

It is a fourth object of the present invention to provide a cleaning method and apparatus which reduce the amount of use of the cleaning liquid and the processing cost of the cleaning waste liquid, and reduce the burden factors such as environmental burden.

A fifth object of the present invention is to provide a cleaning method and a cleaning apparatus which are free from damage caused by cleaning.

A sixth object of the present invention is to provide a highly economical electronic device manufactured using the cleaning method and the cleaning method of the present invention.

[0011]

As means for solving the above-mentioned problems, the present invention uses the following means. The present invention will be described in detail with reference to FIG.

FIG. 1 schematically shows a cleaning method of the present invention using a system diagram. The present invention moves the cleaning nozzle 2 and the cleaning object 3 relative to each other inside the cleaning chamber 1,
Gas and liquid are introduced from a pipe 4 for supplying a high-pressure gas to the cleaning nozzle 2 and a pipe 5 for supplying a high-pressure liquid. These are mixed inside the cleaning nozzle 2 to divide the liquid into fine mist, and the mist is given a momentum in the direction toward the cleaning object 3 to eject a gas-liquid mixed flow 6 from the tip of the cleaning nozzle 2. . The gas-liquid mixed flow 6 is caused to collide with the cleaning object 3,
The cleaning is performed by removing the foreign substances attached to the cleaning object 3.
In order to properly perform such cleaning, the present invention provides a valve 7 in a part of a path between a pipe 4 for supplying a high-pressure gas and a pipe 5 for supplying a high-pressure liquid, so that the relative movement between the cleaning nozzle 2 and the cleaning object 3 can be improved. The opening and closing of the valve 7 synchronized with the control is performed by using the control system 8. In the present invention, it is desirable to add a drain 9 for collecting gas and liquid ejected into the cleaning chamber 1.

The washing nozzle 2 of the present invention has a structure as shown in FIG. 2 as an example of a sectional view, and FIG. 3 shows a sectional view along AA '.

The nozzle is roughly divided into a gas and liquid introduction section 101, a mixing section 102 for mixing these to form liquid fine particles, and an acceleration section 103 for imparting momentum to the liquid from the gas. Is done. The gas and the liquid introduced into the nozzle from the liquid inlet 104 and the gas inlet 105 collide the gas and the liquid inside the mixing chamber 106 to make the liquid fine, thereby forming a large number of liquid fine particles. The air flow containing the liquid fine particles is supplied to the first jet port 1
07, into the acceleration chamber 108, accelerated in the acceleration chamber 108 having a continuously changing cross-sectional area, and are ejected from the second ejection port 109 toward the cleaning object. FIG. 4 shows the ejection of the nozzle 2 of the present invention using an external view, in which the gas-liquid mixed flow 110 ejected from the acceleration unit 103 tends to spread with a specific solid angle.

The shape of the gas-liquid mixed flow 110 can be controlled by changing the shape of the second ejection port 109. As shown in FIG. 5, the shape of the gas-liquid mixed flow 110 is made circular. In this case, the exit shape 201 of the acceleration chamber as viewed from the direction of FIG. In such a case, a circular spray pattern 202 can be obtained. In addition, in order to make the shape of the gas-liquid mixed flow 110 flat, as shown in FIG. 6, the outlet shape 203 of the acceleration chamber as viewed from the direction of FIG. 2B may be rectangular. In such a case, a flat spray pattern 204 can be obtained. The selection of such a pattern can be arbitrarily controlled according to the purpose of cleaning.

In order to form the liquid fine particles of the present invention, appropriate flow rates of the liquid and gas are required, and it is necessary to achieve such flow rates and pressurize the liquid and gas and introduce them into the nozzle 2.

The pressure of the liquid and the gas suitable for the present invention is such that the pressure of the gas is between 200 kP and 900 kP at atmospheric pressure.
a, and the pressure of the liquid is increased to 200 atm.
It is desirable to add k to 900 kPa. More preferably, the pressure of the liquid is 300 atmospheric pressure.
k to 500 kPa. The lower limit of the pressure is determined because the cleaning power is reduced, and the upper limit is determined because the consumption of gas and liquid required for cleaning increases and the equipment cost required for high pressure increases.

The flow rates of the liquid and gas of the present invention obtained from such pressures are 20 to 20 respectively.
0 L / min, and the flow rate of the liquid is preferably 0.2 to 20 L / min. The lower limit of the flow rate is determined because the cleaning power is reduced, and the upper limit is determined based on the increased consumption of gas and liquid required for cleaning.

The average particle diameter of the liquid fine particles of the present invention obtained from the pressure and the flow rate is in the range of 20 to 200 μm, and the average flow velocity of the liquid fine particles ejected from the second ejection port 109 is 30 to 300 m / m. It can be seconds. Since the kinetic energy of the high-speed liquid particles colliding with the object to be cleaned is sufficient to remove foreign matter adhering to the object to be cleaned, the extremely effective cleaning power of the present invention can be obtained.

In order to obtain such an effective cleaning power, the acceleration chamber 1
It is desirable to set the ratio of the cross-sectional area of the entrance of the acceleration chamber shown in FIG. 2C to the cross-sectional area of the throttle shown in FIG. 2D to be approximately 5: 1 to 500: 1.
Preferably, the ratio is 10: 1 to 100: 1. The upper and lower limits of this range are determined in order to set the average flow velocity of the liquid fine particles in a required range.

In order to make the high-speed flow of the liquid fine particles effectively reach the cleaning object, the cross-sectional shape of the flow of the liquid fine particles ejected from the second jet port 109 is circular or elliptical and the nozzle of the mist flow is It is desirable that the opening angle from the tip be 0.005 to 0.05 steradian as a solid angle.

The cross-sectional shape is selected so that the entire surface of the cleaning object having a large area is swept by the liquid fine particle stream impinging on the cleaning object to complete the cleaning in a short time, so that the sweeping is simplified. The lower limit of the range of the solid angle is selected from the viewpoint of economics so that the area of the liquid fine particle flow colliding with the object to be washed is not too small and the washing does not take too much time. This is selected from the economics of reducing the proportion of fine particles whose cleaning power is reduced as a result of the distance from the nozzle tip to collision with the cleaning object being too long and the fine particles being decelerated in the atmosphere.

A similar problem occurs with the distance between the nozzle tip and the cleaning object. From the viewpoint of economy, in the present invention, it is desirable that the distance between the tip of the nozzle and the object to be cleaned is 10 to 100 mm.

The type of gas used in the present invention is pressurized air, nitrogen gas, carbon dioxide gas, argon gas, etc.
It is not that other gases are not used. Air is mainly advantageous from the economical point of view, and nitrogen gas is easily used as a high-purity gas that does not contain impurities. Carbon dioxide gas is advantageous from the viewpoint of preventing static electricity since it dissolves in water to increase electric conductivity.

The types of liquids used in the present invention include pressurized pure water, cleaning solutions in which chemicals are dissolved, and organic solvents.
Pure water is advantageous mainly from the economical point of view and from the viewpoint of preventing pollution since high-purity pure water containing no impurities can be easily obtained.Washing solutions in which various chemicals are dissolved can be used for cleaning with pure water. Used when a combination of reactions is desired. The organic solvent is used when it is desired to use the solvent's dissolving power in addition to the cleaning action for the purpose of removing the resist.

The recommended material for the liquid-contact portion of the flow path including the nozzle and the pipe of the present invention is Ti or an iron-based alloy such as stainless steel, ceramics, quartz, or a polymer material. Such a material should be selected economically from the viewpoint of mechanical strength to withstand high pressure and contamination of the object to be cleaned due to melting of the material itself, and stainless steel is suitable for providing inexpensive piping and nozzles, Polymer materials represented by resins, polyimides, PEEK, etc. are suitable for providing low-contamination nozzles that do not elute metal ions.
This does not mean that polymer materials and ceramics cannot be used.

In order to drive the nozzle of the present invention for efficient cleaning, a valve is provided in a part of a path of a pipe for supplying a high-pressure gas and a pipe for supplying a high-pressure liquid, and a valve is provided within a required time. It is necessary only to supply the gas and liquid to the nozzle, and having such a function is one of the features of the present invention.

Further, the opening and closing of such a valve requires the nozzle to be driven for cleaning only when the position to be cleaned is arranged in front of the nozzle in synchronization with the relative movement between the object to be cleaned and the nozzle. Without such a control system, the efficiency of cleaning is significantly reduced with respect to gas and liquid consumption.

The relative movement used in the present invention can be achieved by the nozzle tip being fixed and the object to be cleaned being translated, or by the nozzle tip being fixed and the object being rotated to rotate. Alternatively, it can be achieved by the nozzle tip being translated and the object to be cleaned being rotated. The selection of the relative motion is in a range appropriately selected depending on the shape of the object to be cleaned.

Further, in the present invention, it is possible to use a plurality of nozzles in combination, and it is desirable to reduce the cleaning time by simultaneously driving a plurality of nozzles for an object to be cleaned having a relatively large shape. There are even cases.

In the present invention, it is desirable to add a drain for collecting gas and liquid ejected into the cleaning chamber. Such a drain is necessary to prevent a positive pressure inside the cleaning chamber from leaking gaseous liquid to undesired parts.

In the cleaning nozzle of the present invention, the gas-liquid mixing chamber may also serve as the acceleration chamber. Such a nozzle realizes mixing and acceleration in the same chamber 111 as shown in FIG. 7 and discharges a gas-liquid mixed fluid from a jet port 112.

Also, as shown in FIG. 8, another example of the nozzle structure is realized when mixing and acceleration are realized in the same chamber 111.
The cross-sectional shape of the flow channel up to the jet port 112 can be continuously changed, and the liquid can be mixed with the high-speed gas from the horizontal direction.

Further, the present invention can be realized by using a nozzle having a shape as shown in FIG. 9 in which the cross-sectional shape of the flow path is linearly changed.

Although the present invention can be realized using the above-described consistent method and apparatus, there is a close relationship between the cleaning method and the cleaning apparatus of the present invention, and the features of the present invention are these consistent methods. It should only be required for a combination of and equipment.

[0036]

FIG. 10 shows an example of the embodiment of the present invention.
This will be described below.

FIG. 3 shows a part of a cleaning apparatus suitable for using the cleaning nozzle 301 of the present invention shown in FIG. 2 for cleaning a disk-shaped substrate 302. The cleaning nozzle 301 is disposed above the substrate 302 and can be swung back and forth by using a driving mechanism 303. The substrate 302 is fixed to a rotary stage 305 with a chuck pin 304 and rotates during cleaning. With such an apparatus configuration, relative movement between the substrate 302 and the cleaning nozzle 301 can be realized.

A high-pressure nitrogen gas and high-pressure pure water are supplied to the cleaning nozzle 301, and the gas-liquid mixed flow formed in the cleaning nozzle 301 is discharged onto the substrate 302 like a spray pattern 306, and adheres to the substrate 302. Foreign particles can be removed.

The cleaning nozzle 30 of the cleaning apparatus shown in FIG.
FIG. 11 shows the results of an attempt to evaluate the detergency by systematically changing the pressure of nitrogen gas and pure water supplied to 1.

The results shown in this figure show that 1 μm-diameter alumina particles uniformly adhered on a 6-inch diameter silicon wafer at a density of about 100,000 / square millimeter were rotated 50 times.
This was obtained from the results of cleaning for 10 seconds at 0 rpm, nozzle swing 20 mm / s, and distance between nozzle substrates of 30 mm. It has been found that the most excellent detergency can be obtained in an appropriate range depending on the water pressure (value added to the atmospheric pressure). The solid angle of the gas-liquid mixed flow in such washing is about 0.0
One steradian.

In order to achieve the foreign matter removal rate of 90 to 100% required for the cleaning operation, the gas pressure should be 200 to 10%.
00 kPa and liquid pressure of 200 to 1000 kPa
Was found to be necessary, and preferably 300 to 500 kPa. Gas flow rate in this range is about 80L
/ Min, and the liquid flow rate was about 2 L / min. further,
The diameter of the pure water particles is about 50 μm, and the speed of the particles is 100 μm.
m / s.

From the results of such cleaning, it has been found that in the present invention, by controlling the pressure of gas and liquid, excellent cleaning power can be secured in a very short time, and the cleaning performance can be maintained by controlling the pressure of liquid and gas. . Such easiness of management is extremely excellent for managing and maintaining a cleaning process for the purpose of reliably processing expensive products, and also has excellent properties for configuring a cleaning apparatus at low cost.

As a result of using the cleaning of the present invention for cleaning the wiring step and the element forming step of the thin-film magnetic head in the process of manufacturing the semiconductor memory, the cleaning method is simple.
It was also found that a significantly higher production yield was obtained.

An example of another embodiment of the present invention will be described below with reference to FIG.

FIG. 4 shows a part of a cleaning apparatus suitable for using the cleaning nozzle 401 of the present invention shown in FIG. 2 for cleaning a rectangular substrate 402. The cleaning nozzle 401 is disposed above the substrate 402, and a large number of nozzles fixed to the nozzle holder 403 are arranged in a straight line so that a wide substrate can be efficiently cleaned. Further, the substrate 402 can be moved in one direction by using the roller transport mechanism 404.

High pressure air and high pressure pure water are supplied to the cleaning nozzle 401, and a gas-liquid mixed flow formed in the cleaning nozzle 401 is discharged toward the substrate 402 as a spray pattern 405, and Adhered foreign particles can be removed.

Using the cleaning apparatus of the present invention, 650
The result of cleaning in 15 seconds while transporting the x830 mm liquid crystal glass substrate shows that the same detergency as in FIG. 11 can be obtained. Further, as a result of applying the cleaning of the present invention to the thin film transistor forming step of the liquid crystal display, It was also found that a remarkably high production yield was obtained despite the simple cleaning method.

[0048]

The present invention simultaneously provides a method of manufacturing a high-performance magnetic head in a very simple process and a novel magnetic head structure. The use of the magnetic head of the present invention provides a very high-performance magnetic head. Since the disk device can be provided at a low cost, there is an immeasurable economic effect.

[Brief description of the drawings]

FIG. 1 is a diagram schematically showing a cleaning method of the present invention using a system diagram.

FIG. 2 is a diagram showing an example of a cleaning nozzle of the present invention using a cross-sectional view.

FIG. 3 is a sectional view taken along the line AA ′ of FIG. 2;

FIG. 4 is a diagram showing a nozzle of the present invention using an external view.

FIG. 5 is a diagram showing an example of an outlet shape and a spray pattern of an acceleration chamber of the present invention.

FIG. 6 is a view showing an example of an outlet shape and a spray pattern of the acceleration chamber of the present invention.

FIG. 7 is a diagram showing an example of another cleaning nozzle of the present invention using a cross-sectional view.

FIG. 8 is a diagram showing an example of another cleaning nozzle of the present invention using a sectional view.

FIG. 9 is a diagram showing an example of another cleaning nozzle of the present invention using a sectional view.

FIG. 10 is a diagram showing an example of an embodiment of the present invention.

FIG. 11 is a diagram showing the cleaning effect of the present invention based on the evaluation results of cleaning power.

FIG. 12 is a diagram showing an example of an embodiment of the present invention.

[Explanation of symbols]

1. Cleaning chamber, 2. Cleaning nozzle, 3. Cleaning object, 4.
Pipe for supplying gas, 5 for pipe for supplying liquid, 6 for mixed flow of gas and liquid, 7 for valve, 8 for control system, 9 for drain,
Reference numeral 101: a liquid introduction section, 102: a mixing section, 103: an acceleration section, 104: a liquid introduction port, 105: a gas introduction port, 1
06: mixing chamber, 107: first ejection port, 108: acceleration chamber, 109: second ejection port, 110: gas-liquid mixed flow, 1
11: Same chamber for mixing and acceleration, 112: Spout, 201 ...
Outlet shape of acceleration chamber, 202 ... spray pattern, 203 ...
Outlet shape of acceleration chamber, 204 ... spray pattern, 301 ...
Cleaning nozzle, 302: disk-shaped substrate, 303: drive mechanism, 304: chuck pin, 305: rotary stage, 3
06 ... spray pattern, 401 ... cleaning nozzle, 402 ...
Square substrate, 403: nozzle holder, 404: transport roller, 405: spray pattern.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) H01L 21/304 643 H01L 21/304 643A 643C (72) Inventor Yasushi Sano 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture. Address F-term in Hitachi, Ltd. Production Technology Research Laboratories (Reference)

Claims (20)

[Claims] 1. A high-pressure gas introduced into a gas-liquid mixing chamber from one flow path and a high-pressure liquid introduced into the gas-liquid mixing chamber from the other flow path are mixed in a gas-liquid mixing chamber to form a liquid mist. Forming
Momentum is imparted to the mist in an acceleration chamber to form a mist flow, and the mist flow is ejected from a nozzle tip to collide with the object to be cleaned, and the nozzle and the object to be cleaned are moved relative to each other for cleaning. A method for cleaning electronic components, comprising: 2. A method for cleaning an electronic component according to claim 1, wherein said acceleration chamber is a nozzle whose sectional area changes continuously. 3. The method for cleaning an electronic component according to claim 1, wherein the nozzle has a ratio of a cross-sectional area of an entrance of the acceleration chamber to a cross-sectional area of a throttle portion of 5: 1 to 500: 1. 4. A liquid-contacting part between the flow path, the gas-liquid mixing chamber, the acceleration chamber, and the tip of the nozzle according to claim 1 is made of Ti, an iron-based alloy, ceramics, quartz, or a polymer material. A method for cleaning electronic components, comprising: 5. A method for cleaning an electronic component, wherein the gas-liquid mixing chamber according to claim 1 doubles as the acceleration chamber. 6. A method for cleaning an electronic component according to claim 1, wherein said mist has an average particle diameter of 20 to 200 μm. 7. The method for cleaning an electronic component according to claim 1, wherein the mist flow has an average flow velocity of 30 to 300 m / sec. 8. The gas according to claim 1, wherein the pressure of the gas is 200 k to 1000 kPa added to the atmospheric pressure, and the pressure of the liquid is 200 k to 1000 kPa to the atmospheric pressure.
a. A method for cleaning an electronic component, wherein a is added. 9. The method for cleaning an electronic component according to claim 1, wherein the flow rate of the gas is 20 to 200 L / min, and the flow rate of the liquid is 0.2 to 20 L / min. . 10. The mist flow according to claim 1, wherein the cross-sectional shape of the mist flow is circular or elliptical, and the opening angle of the mist flow from the nozzle tip is 0.005 as a solid angle.
A method for cleaning electronic components, characterized in that the thickness is from 0.05 to 0.05 steradian. 11. A method for cleaning an electronic component according to claim 1, wherein a distance between the tip of the nozzle and the object to be cleaned is 10 to 100 mm. 12. The relative movement according to claim 1, wherein the nozzle tip is fixed and the object to be cleaned is translated, or the nozzle tip is fixed and the object to be rotated is rotationally moved. Alternatively, the method is a method of cleaning an electronic component, wherein the nozzle tip is selected from translational movement and rotation of the object to be cleaned. 13. A method for cleaning an electronic component, wherein a plurality of the nozzles according to claim 1 are used in combination. 14. A liquid-contacting portion between the flow path, the gas-liquid mixing chamber, the acceleration chamber, and the tip of the nozzle according to claim 1 to 11, wherein
Alternatively, a method for cleaning an electronic component, comprising an iron-based alloy, ceramics, quartz, or a polymer material. 15. A cleaning nozzle according to claim 1, wherein: 16. A cleaning apparatus using the cleaning method according to claim 1. Description: 17. A cleaning chamber, comprising: a cleaning nozzle according to any one of claims 1 to 14; and a mechanism for transferring the cleaning nozzle and an object to be cleaned. Control for opening and closing a valve provided in a part of a path of the pipe in synchronization with a relative movement between the cleaning nozzle and the object to be cleaned. A cleaning apparatus for an electronic component, comprising: a system; and a drain for collecting gas and liquid ejected into a cleaning chamber. 18. A pipe for introducing a high-pressure gas to the gas-liquid mixing chamber, a pipe for introducing a high-pressure liquid to the gas-liquid mixing chamber, and a gas-liquid mixing chamber for mixing the gas and the liquid to form a liquid mist. And a mist flow forming apparatus having an acceleration chamber for forming a mist flow imparting momentum to the mist, and a nozzle tip for ejecting the mist, and the mist flow ejected from the nozzle tip is prevented from colliding with the object to be cleaned. Is provided with a mechanism for relatively moving the nozzle tip and the object to be cleaned. 19. A method for manufacturing a semiconductor device, an electronic display device, or a magnetic recording device, comprising using a cleaning step using the cleaning method according to claim 16. Description: 20. A semiconductor device, an electronic display device, or a magnetic recording device manufactured by using the manufacturing method according to claim 19.