CN205140937U - Belt cleaning device is sprayed in two -phase flow atomizing with gas protection - Google Patents
Belt cleaning device is sprayed in two -phase flow atomizing with gas protection Download PDFInfo
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Abstract
The utility model discloses a belt cleaning device is sprayed in two -phase flow atomizing with gas protection, set up the multichannel liquid reposition of redundant personnel pipeline that has the fluid guiding export of presetting the angle in the nozzle main part, and have an otter board of giving vent to anger of perpendicular gaseous direction export, high -speed liquid flow and high -speed gas flow that the messenger was erupted produce interact fully, form the particle size homogeneous, the super little atomized liquid of adjustable drips, and spout to the wafer surperficially down downwards in the acceleration and the guide effect of the direction export of atomizing granule, it is equipped with protective gas export injection protective gas to export and have a down dip towards the outside around atomizing granule direction simultaneously, can remove the atomizing to the wafer under gas protection washs, the utility model discloses atomizing particle size can be reduced greatly, its energy that has is reduced to can avoid causing the damage to the surperficial graphic structure of wafer, and the oxygen content in the steerable cleaning process in -process washing cavity, reduce the possibility that the washmarking defect produced, thus improvement cleaning quality and efficiency.
Description
Technical field
The utility model relates to semiconductor cleaning device technical field, more specifically, relates to a kind of two-phase flow atomized spray cleaning device with Buchholz protection.
Background technology
Along with the high speed development of semiconductor integrated circuit manufacturing technology, the pattern character size of integrated circuit (IC) chip has entered into the deep-submicron stage, causes the characteristic size of the crucial pollutant (such as particle) of superfine circuit malfunction or damage on chip also greatly to reduce thereupon.
In the process for making of integrated circuit, semiconductor crystal wafer usually all can through multiple tracks processing steps such as such as thin film deposition, etching, polishings.And these processing steps just become the important place that pollutant produces.In order to keep the clean conditions of crystal column surface, eliminating the pollutant being deposited on crystal column surface in each processing step, clean must be carried out to the crystal column surface that subjected to after per pass processing step.Therefore, cleaning becomes processing step the most general in integrated circuit fabrication process, its object is to the contamination level effectively controlling each step, to realize the target of each processing step.
In order to remove the pollutant of crystal column surface, when carrying out monolithic wet clean process, wafer will be placed on the rotation platform of cleaning equipment, and is subject to being arranged on the multiple hold assemblies clampings on rotation platform, and hold assembly holds wafer to carry out High Rotation Speed; Meanwhile, above wafer, cleaning equipment is also provided with spray arm, sprays the cleaning liquid of certain flow, clean crystal column surface by spray arm to crystal column surface.
While reached removal pollutant object by cleaning, the most important thing is will ensure wafer, especially the not damaged of figure crystal column surface figure be cleaned.
Along with reducing of integrated circuit pattern characteristic size, the removal difficulty of the pollutant of crystal column surface smaller szie is also continuing to increase.Therefore, a lot of Novel washing technology has also obtained applying more widely on cleaning equipment.Wherein, on monolithic wet clean equipment, utilize atomization cleaning technology can improve the effect of cleaning further.In atomization cleaning process, atomizing particle can produce an impulsive force to the liquid film of crystal column surface, and in liquid film, form the shock wave of fast propagation.When shock wave is on particulate pollutant, the process that pollutant departs from from crystal column surface can be accelerated on the one hand; On the other hand, shock wave can accelerate the flowing velocity of crystal column surface cleaning liquid, impels particulate pollutant to be taken away crystal column surface along with the flowing of liquid quickly.
But, the atomized particle size that atomization cleaner common at present produces is larger, and the energy that atomizing particle has is also higher, when these atomization cleaners are applied in the wafer cleaning technique in 65 nanometers and following technology generation, be easy to cause the problems such as surfacial pattern damage.The utilance of liquid phase fluid is lower simultaneously, causes the profligacy of resource.
In addition, in the process of carrying out chemical liquid and ultra-pure water cleaning, crystal column surface material more easily sustains damage or some chemical reactions occurs.Such as, in DHF cleaning, first spray DHF by spray arm to crystal column surface, the natural oxidizing layer of crystal column surface is eroded completely; Then spray ultra-pure water to rinse crystal column surface, the residual liquor of crystal column surface and product are washed out; Finally, then by spraying nitrogen drying is carried out to crystal column surface complete whole technical process.In this process, the oxygen in the naked silicon materials of crystal column surface and processing chamber is very easy to react, and generates silicon dioxide, causes crystal column surface material to change, impact follow-up technique.Therefore, need in technical process, the oxygen content in whole chamber is controlled.
On the other hand, wafer is carried out in the process of nitrogen drying above-mentioned, if technology controlling and process is bad, Watermark (washmarking) defect can be occurred at crystal column surface.The dominant mechanism that Watermark is formed is in nitrogen drying process, reacts and the SiO that generates because drying not exclusively remains in the water of crystal column surface to have incorporated with oxygen
2, and form H further
2siO
3or HSiO
3 -precipitation.After the water volatilization of crystal column surface, namely these precipitations form the washmarking of flat condition.In addition, in above-mentioned cleaning process, also often occur crystal round fringes rib there is the non-drying of drop phenomenon thoroughly, this also result in certain impact for wafer cleaning quality.
In order to reduce the damage to crystal column surface figure, need the size reducing the liquid particles ejected further, and control the direction of motion of atomizing particle, movement velocity, movement locus and uniformity etc. better, to reduce the damage of liquid particles to pattern side wall and corner; Meanwhile, also need to be optimized improvement to cleaning environment, make wafer in technical process with oxygen-barrier, prevent crystal column surface silicon materials oxidized, and realize the drying of whole wafer scope better, prevent the generation of washmarking defect, improve cleaning quality and efficiency.
Utility model content
The purpose of this utility model is the above-mentioned defect overcoming prior art existence; a kind of two-phase flow atomized spray cleaning device with Buchholz protection is provided; by design, Buchholz protection and two-phase flow atomized spray are cleaned the new nozzle arrangements combined; not only effectively can solve the problem causing wafer pattern side wall and corner damage; and can make wafer in technical process with oxygen-barrier; prevent crystal column surface silicon materials oxidized; and realize the drying of whole wafer scope better; prevent the generation of washmarking defect, improve cleaning quality and efficiency.
For achieving the above object, the technical solution of the utility model is as follows:
Have a two-phase flow atomized spray cleaning device for Buchholz protection, for cleaning the wafer be placed in cleaning chambers on rotation platform and drying, described cleaning device comprises:
Nozzle body, its inside is provided with liquid line, gas piping is provided with around liquid line, nozzle body lower end is provided with gas-liquid guiding parts, gas-liquid guiding parts is provided with the multichannel separating liquid pipeline being communicated with liquid line with certain symmetric relation level, there is between each separating liquid pipeline the web plate of giving vent to anger being communicated with gas piping, web plate of giving vent to anger vertically is provided with the outlet of densely covered majority gas channeling, and being provided with nozzle body axis along each separating liquid pipeline is that the majority guiding fluid that has a down dip of predetermined angle exports;
Water influent pipeline and air inlet pipeline, be connected on a spray arm, and be communicated with liquid line, gas piping in nozzle body respectively, and described spray arm drives nozzle body to do the circular arc reciprocating motion in the wafer center of circle;
Atomizing particle exit, around being located at below gas-liquid guiding parts, it is Laval nozzle structure or has vertical inwall;
Buchholz protection unit, around being located at lower body part, it is provided with around atomizing particle exit and the protective gas outlet arranged that has a down dip toward the outer side, the gas atmosphere inlet that described protective gas outlet Buchholz protection unit is provided with;
When wherein cleaning, the cleaning liquid being exported ejection by guiding fluid with exported by gas channeling that the gas sprayed is crossing below gas-liquid guiding parts forms atomizing particle, and under the acceleration or vertically-guided effect of atomizing particle exit, spray to crystal column surface downwards carry out atomization cleaning, simultaneously, the protective gas sprayed by protective gas outlet-inclined impeller vane forms gas blanket above wafer, prevents wafer from contacting with the oxygen in chamber; Time dry, close water influent pipeline, the dry gas sprayed by atomizing particle exit and the protective gas by protective gas outlet ejection carry out rapid draing to wafer integral surface jointly.
Preferably, described Buchholz protection cell rings is provided with protective gas cushion chamber around atomizing particle exit, and it is connective protection gas vent and gas atmosphere inlet respectively.
Preferably, described protective gas outlet is the pore that a circle continuous print air gap or a circle are evenly arranged.
Preferably, described gas atmosphere inlet arranges one to several at Buchholz protection unit.
Preferably, described protective gas outlet is obliquely installed towards the drop point direction of crystal round fringes.
Preferably, described protective gas outlet is obliquely installed towards the drop point direction apart from crystal round fringes 1 ~ 5cm.
Preferably, the Laval nozzle structure of described atomizing particle exit comprises collapsible tube, narrow larynx and convergent divergent channel from top to bottom successively.
Preferably, the multichannel separating liquid pipeline of described gas-liquid guiding parts is common connectivity points with liquid line lower end, and by uniform spoke-like setting, the web plate of giving vent to anger of almost fan is formed between adjacent liquid distribution pipeline, the guiding fluid outlet of each separating liquid pipeline is positioned at below web plate of giving vent to anger, and the downward-sloping setting of gas channeling Way out of web plate of giving vent to anger towards its corresponding side.
Preferably, it is the end face that predetermined angle has a down dip that described separating liquid pipeline has with the vertical axis of nozzle body, and described guiding fluid outlet is vertically drawn by this end face.
Preferably, also comprise a liquid rinse pipeline, be located in cleaning chambers, its be positioned at rotation platform oblique upper, export and arrange towards the center of rotation platform; Or liquid rinse pipeline is connected on spray arm, its outlet is positioned at described nozzle body side, and arranges vertically downward.
The utility model has the following advantages:
1, by the atomizing nozzle structure exported by guiding fluid and gas exit is formed, the high-speed liquid stream making it spray and high velocity gas stream produce and interact fully, and by adjustment piping flow, form the ultra micro atomized drop that particle size is homogeneous, adjustable, greatly can reduce atomized particle size, reduce the energy that it has, avoid becoming damage to crystal column surface figure structure; When atomizing particle exit has Laval nozzle structure, when air inlet pipeline and water influent pipeline keep flow constant, can make to there is higher speed, to improve cleaning efficiency from the atomizing particle of device end outlet injection.
2, when atomizing particle exit has vertical inner wall structure, the vertically-guided effect produced by atomizing particle exit, can make in technical process airflow direction and crystal column surface perpendicular, promote that the impurity in surface grooves figure is to the transmission of bodies of fluid, improve the efficiency of cleaning, improve cleaning performance, and the cross shear of atomizing particle to crystal column surface figure structure can be reduced, prevent the damage of crystal column surface figure structure; Meanwhile, be conducive to saving cleaning liquid.
3, size uniformity can be formed, adjustable atomizing particle rinses crystal column surface, because the quality of atomizing particle is little, but also crystal column surface can be made to be pre-existing in one deck sprayed the cleaning liquid film formed with large discharge by liquid rinse pipeline, thus the impulsive force that can reduce crystal column surface structure, and the damage to crystal column surface figure structure can be reduced; Simultaneously, the shock wave produced when atomizing particle can be utilized to clash into cleaning liquid film is on particulate pollutant, the process that pollutant departs from from crystal column surface can be accelerated on the one hand, on the other hand, shock wave can accelerate the flowing velocity of crystal column surface cleaning liquid, impels particulate pollutant to be taken away crystal column surface along with the flowing of liquid quickly.
4, carrying out in two-phase flow atomized spray cleaning process, protective gas, from the ejection of protective gas outlet-inclined impeller vane, forms Buchholz protection, can prevent the oxygen reaction in wafer and chamber atmosphere above wafer; In dry run; the water influent pipeline of two-phase flow atomizer is closed; air inlet pipeline and protective gas outlet are held open; serve and dry object is carried out fast to crystal circle center and edge integral surface; independent jet drying gas can be replaced to carry out dry existing spray arm form, cleaning equipment chamber structure is simplified.
Accompanying drawing explanation
Fig. 1 is a kind of two-phase flow atomized spray cleaning device structural representation with Buchholz protection in the utility model preferred embodiment one;
Fig. 2 is the schematic enlarged-scale view of gas-liquid guiding parts in Fig. 1;
Fig. 3 is a kind of two-phase flow atomized spray cleaning device structural representation with Buchholz protection in the utility model preferred embodiment two;
Fig. 4 is a kind of two-phase flow atomized spray cleaning device contour structures schematic diagram with Buchholz protection in the utility model preferred embodiment three;
Fig. 5-Fig. 6 is a kind of two-phase flow atomized spray cleaning device with Buchholz protection in the utility model preferred embodiment four structural representation when being positioned at cleaning chambers;
Fig. 7 is the movement locus schematic diagram of spray arm in cleaning process.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described in further detail.
It should be noted that, in following embodiment, when describing execution mode of the present utility model in detail, in order to clearly represent structure of the present utility model so that explanation, special to the structure in accompanying drawing not according to general scale, and carried out partial enlargement, distortion and simplify processes, therefore, should avoid being understood in this, as to restriction of the present utility model.
In following embodiment of the present utility model, refer to Fig. 1, Fig. 1 is a kind of two-phase flow atomized spray cleaning device structural representation with Buchholz protection in the utility model preferred embodiment one.As shown in Figure 1; the two-phase flow atomized spray cleaning device with Buchholz protection of the present utility model; can be used for carrying out atomization cleaning and drying to the wafer be placed in cleaning chambers on rotation platform; described cleaning device comprises: nozzle body 3, water influent pipeline 2 and air inlet pipeline 1, be positioned at the atomizing particle exit 7 of nozzle body lower end, and around being located at the several major part of Buchholz protection unit 8 of lower body part.Wherein the shape of cross section of nozzle body 3 can comprise circle, triangle or polygon, and fan-shaped, strip etc., the utility model is not construed as limiting.
Please continue to refer to Fig. 1.Be provided with liquid line 4 in nozzle body 3 inside, be provided with gas piping 5 around liquid line.Described water influent pipeline 2 can be communicated with liquid line 4 by entering in nozzle body in the middle part of the upper surface of nozzle body 3, and described air inlet pipeline 1 correspondence can be entered in nozzle body by the upper end sidepiece of nozzle body 3 and be communicated with gas piping 5.Water influent pipeline 2 and air inlet pipeline 1 are respectively used to pass into cleaning liquid, gas.Be positioned at below liquid line 4 and gas piping 5 be provided with gas-liquid guiding parts 6 in nozzle body lower end, namely, for being derived and form atomizing particle by the purge gas in the cleaning liquid in liquid line 4 and gas piping 5, then spray to crystal column surface downwards through atomizing particle exit 7.Atomizing particle exit 7 is around being located at below gas-liquid guiding parts 6, and it has illustrated Lavalle (Laval) nozzle structure 7-1 to 7-3, or also can have vertical interior wall construction (see Fig. 3).
Refer to Fig. 2, Fig. 2 is the schematic enlarged-scale view of gas-liquid guiding parts in Fig. 1.To have the nozzle body of circular cross section, as shown in Figure 2, gas-liquid guiding parts 6 is provided with the multichannel separating liquid pipeline 6-1 being communicated with liquid line with certain symmetric relation level, such as in the present embodiment, the multichannel separating liquid pipeline 6-1 of described gas-liquid guiding parts is common connectivity points with liquid line lower end 4-1, and by uniform spoke-like setting; There is between each separating liquid pipeline 6-1 the web plate 6-2 that gives vent to anger being communicated with gas piping, such as in the present embodiment, between adjacent liquid distribution pipeline, form the fan-shaped web plate 6-2 that gives vent to anger; Web plate of giving vent to anger vertically is provided with a densely covered majority gas channeling outlet 6-4, being provided with nozzle body vertical axis along each separating liquid pipeline is that the majority guiding fluid that has a down dip of predetermined angle exports 6-3, such as in the present embodiment, the guiding fluid outlet 6-3 of each separating liquid pipeline is positioned at below the web plate 6-2 that gives vent to anger, and exports the downward-sloping setting in 6-4 direction towards the gas channeling of its corresponding side (being illustrated as left side) web plate of giving vent to anger.When actual fabrication, can process one in described separating liquid pipeline 6-1 lower end with the vertical axis of nozzle body is the end face that has a down dip of predetermined angle, is then vertically drawn by this end face by described guiding fluid outlet 6-3.As optional execution mode, when above-mentioned predetermined angle is between 10 ~ 80 °, good atomizing particle can be had and form effect; And when described predetermined angle is between 30 ~ 60 °, better atomizing particle can be had and form effect.The symmetric mode that multichannel separating liquid pipeline also can be suitable for according to other is arranged, such as fishbone, circular concentric etc., arranges with the gas channeling outlet of certain predetermined angle towards side as long as meet the outlet of each guiding fluid.
As optional execution mode, the cross sectional shape of guiding fluid outlet 6-3 and/or gas channeling outlet 6-4 can comprise circle, triangle, polygon etc.Preferably, highly at the bottom of the round diameter of the outlet of described guiding fluid and/or gas channeling outlet or triangle, polygon top can be 1 ~ 1000 μm; Further preferably, the diameter of the outlet of described guiding fluid and/or gas channeling outlet or the end, top, highly can be 200 ~ 400 μm.
For improving the speed that atomizing particle penetrates from cleaning device end, can be optimized the structure of atomizing particle exit 7, the design of atomizing particle exit is become the structure with Laval nozzle, thus when the flow of air inlet pipeline and water influent pipeline remains unchanged, can make to there is higher speed, to improve cleaning efficiency from the atomizing particle of device end outlet injection.As shown in Figure 1, this Laval nozzle structure comprises collapsible tube 7-1, narrow larynx 7-2 and convergent divergent channel 7-3 from top to bottom successively.
In the collapsible tube part of Laval nozzle, the rule that gas motion is followed " little place, cross section flow velocity is large, and cross section general goal flow velocity is little ", therefore air-flow is constantly accelerated.When reaching narrow larynx, the flow velocity of gas exceedes velocity of sound, and ultrasonic fluid no longer follows above-mentioned rule when convergent divergent channel componental movement, but just the opposite, cross section is larger, and flow velocity is faster.Therefore, this principle can be utilized, atomizing particle exit 7 is designed to the structure with Laval nozzle, make, from the atomizing particle of cleaning device injection, there is higher speed, to improve cleaning efficiency, save the cleaning liquid and gases at high pressure that clean and consume.
Refer to Fig. 3, Fig. 3 is a kind of two-phase flow atomized spray cleaning device structural representation with Buchholz protection in the utility model preferred embodiment two.As shown in Figure 3, as different execution modes, atomizing particle exit 7 also can have vertical interior wall construction 7-4, its effect makes the direction of motion and the uneven atomizing particle of nozzle body vertical axial impinge upon on the sidewall 7-4 of atomizing particle exit 7, to ensure that the direction of motion of the atomizing particle of all arrival crystal column surface liquid films is perpendicular to wafer, prevents cross shear from causing the structural damage of crystal column surface figure.
Refer to Fig. 1 or Fig. 3.Buchholz protection unit 8 is around being located at main body 3 bottom; its be provided with around atomizing particle exit 7 and towards the downward-sloping setting of its lateral direction protective gas outlet 8-2; for forming gas blanket above wafer; by the air exclusion in wafer and chamber, prevent the silicon in wafer from contacting with the oxygen in chamber atmosphere and react.In order to form the uniform gas blanket of a circle around atomizing particle exit 7, described protective gas outlet 8-2 can be the pore that diagram one encloses horizontal homogeneous setting; Or refer to Fig. 4, Fig. 4 is a kind of two-phase flow atomized spray cleaning device contour structures schematic diagram with Buchholz protection in the utility model preferred embodiment three.As shown in Figure 4, to have the nozzle body 3 of circular cross section, enter in nozzle body in the middle part of the upper surface of described water influent pipeline 2 by nozzle body 3 and be communicated with liquid line, described air inlet pipeline 1 correspondence is entered in nozzle body by the upper end sidepiece of nozzle body 3 and is communicated with gas piping; Buchholz protection unit 8 is for approximate barrel-shaped, and also have circular cross section, and around being located at main body 3 bottom, its upper end is connected with main body is closely sealed, lower end is opening.As different execution modes, the described protective gas outlet 8-2 in diagram the present embodiment also can be a circle continuous print air gap.
Please continue to refer to Fig. 4.Described Buchholz protection unit 8 is also provided with gas atmosphere inlet 8-1, and gas atmosphere inlet 8-1 is passed into by the side of Buchholz protection unit 8, for being communicated with described protective gas outlet 8-2.Protective gas is passed into protective gas outlet 8-2 by gas atmosphere inlet 8-1.
Please continue to refer to Fig. 1 or Fig. 3.Described Buchholz protection unit 8 is also provided with the protective gas cushion chamber 8-3 around atomizing particle exit 7, one end connective protection gas vent 8-2 of protective gas cushion chamber 8-3, other end connective protection gas access 8-1.Protective gas cushion chamber 8-3 is used for cushioning the protective gas passed into from gas atmosphere inlet 8-1, can be uniformly distributed after making protective gas enter cushion chamber in whole circumference range, and pressure that can be identical is from protective gas outlet 8-2 ejection.Gas atmosphere inlet 8-1 can arrange one in the side of Buchholz protection unit 8, also can arrange multiple equably, to realize protective gas being uniformly distributed along the circumferential direction.
As one preferred embodiment, described protective gas outlet 8-2 can be obliquely installed towards the drop point direction of crystal round fringes.As preferred further, protective gas outlet 8-2 also can be obliquely installed towards the drop point direction apart from crystal round fringes 1 ~ 5cm.Can according to the diameter wafer of required cleaning, the angle of inclination adjusting described protective gas outlet 8-2 is arranged.
Refer to Fig. 5-Fig. 6, Fig. 5-Fig. 6 is a kind of two-phase flow atomized spray cleaning device with Buchholz protection in the utility model preferred embodiment four structural representation when being positioned at cleaning chambers.As shown in Figure 5, at cleaning chambers 15 built with rotation platform 14, rotation platform is provided with grip unit 11, for fixing wafer 16; Rotation platform is driven by motor 13 and can realize rotating.Below cleaning chambers, be provided with devil liquor recovery unit, the waste liquid in cleaning process is discharged in the devil liquor recovery outlet 12 by cavity bottom.The nozzle body 3 of the utility model cleaning device is hung in cleaning chambers, and can fully movement above rotation platform.Nozzle body is connected on spray arm 9 also fixing by water influent pipeline 2 and air inlet pipeline 1.The pipeline of the gas atmosphere inlet 8-1 of Buchholz protection unit 8 also can extend to be connected on spray arm 9 also to be fixed.
Refer to Fig. 5.A kind of two-phase flow atomized spray cleaning device with Buchholz protection of the present utility model also comprises a liquid rinse pipeline 10; be located in cleaning chambers; and the oblique upper of rotation platform 14 can be positioned at; such as; above the inwall side that can be arranged on cleaning chambers 15, its outlet is arranged towards the center of rotation platform 14.
When carrying out two-phase flow atomization cleaning technique, except the road cleaning liquid introduced by water influent pipeline, liquid line in atomizer inside, also additionally need the liquid rinse pipeline 10 of a large discharge, its effect be wafer 16 surface formed one deck cover completely, equally distributed cleaning liquid film.The atomization of liquid particle that independent dependence two-phase flow atomizer produces may be not enough to the area covering whole wafer, also cannot form best cleaning performance simultaneously.When in the cleaning liquid film of the high speed atomisation particles hit sprayed from two-phase flow atomizing particle exit at crystal column surface, an impulsive force can be produced, and in liquid film, form the shock wave of fast propagation.When this shock wave is on particulate pollutant, the process that pollutant departs from from crystal column surface can be accelerated on the one hand; On the other hand, shock wave can accelerate the flowing velocity of crystal column surface cleaning liquid, impels particulate pollutant to be taken away crystal column surface along with the flowing of liquid quickly.
When cleaning, described spray arm 9 can movement locus as shown in Figure 7, drives nozzle body 3 to do the circular arc reciprocating motion in wafer 16 center of circle, carries out mobile atomization cleaning to the wafer 16 on rotation platform 14.
Please continue to refer to Fig. 5.Large discharge liquid enters from the large discharge liquid inlet 10-2 of liquid rinse pipeline, spray from large discharge liquid outlet, its spray angle adjusts accordingly by large discharge Liquid inject angle adjusting 10-1, enables large discharge liquid be ejected into the center of wafer.In technical process, large discharge liquid rinse pipeline is first opened, jet cleaning liquid, until cleaning liquid covers crystal column surface completely, now opens two-phase flow atomizer and starts cleaning.In two-phase flow atomizer cleaning process, large discharge liquid line can be held open or close or intermittent unlatching, depends on the technological parameters such as water influent pipeline flow, large discharge fluid flow, wafer rotating speed.
Refer to Fig. 6.The mode be mounted on by liquid rinse pipeline 10 on spray arm 9 can also be adopted, make the large discharge liquid outlet of liquid rinse pipeline 10 be positioned at the side of described nozzle body 3, and arrange vertically downward.Be with the difference of structure shown in Fig. 5, large discharge liquid rinse pipeline 10 is fixed on after on spray arm 9, synchronously can carry out arc swing along with the swing of nozzle body 3.
In addition, as further optimal design, the gas flow regulating valve being used for adjusting gas flow can also be set on the pipeline of described air inlet pipeline 1, gas atmosphere inlet 8-1; Also can the liquid flow regulating valve being used for regulates liquid flow be set in described water influent pipeline 2 further; The large discharge liquid flow regulating valve being used for regulates liquid flow can also be set on the liquid rinse pipeline 10 of large discharge; Can also the pneumatic operated valve being used for control switch be set on the liquid rinse pipeline 10 of the pipeline of described air inlet pipeline 1, water influent pipeline 2, gas atmosphere inlet 8-1 and large discharge.
The principle that the above-mentioned atomizer with the two-phase flow atomized spray cleaning device of Buchholz protection of the present utility model forms atomizing particle is as follows: the cleaning liquid in water influent pipeline enters the separating liquid pipeline in divergent shape along the liquid line in nozzle body, and from guiding fluid outlet ejection; The gross area due to guiding fluid outlet is less than the sectional area of water influent pipeline and liquid line, cleaning liquid is produced and accelerates, be divided into the liquid stream of several diameters in micron dimension simultaneously, and with the oblique injection of angle preset.Same, the gas of air inlet pipeline, by the gas channeling outlet injection bottom the gas piping in nozzle body, forms the gas flow of several diameters in micron dimension, and penetrates along the vertical axial direction of nozzle body.Have an effect in the below that gas flow and liquid stream export at gas channeling, liquid stream is broken up forms ultra micro atomizing particle.After ultra micro atomizing particle is formed, under the effect of gas flow, do accelerated motion downwards.For the atomizing particle exit with VERTICAL TUBE wall construction; the uneven ultra micro atomizing particle in vertical axial direction of the direction of motion and nozzle body can impinge upon on the sidewall of atomizing particle exit; again converge and become large drop; flowed down by tube wall, ensure the direction of motion uniformity of the atomizing particle ejected from atomizing particle exit with this.
In sum, the utility model has following distinguishing feature:
1, by the atomizing nozzle structure exported by guiding fluid and gas exit is formed, the high-speed liquid stream making it spray and high velocity gas stream produce and interact fully, and by adjustment piping flow, form the ultra micro atomized drop that particle size is homogeneous, adjustable, greatly can reduce atomized particle size, reduce the energy that it has, avoid becoming damage to crystal column surface figure structure; When atomizing particle exit has Laval nozzle structure, when air inlet pipeline and water influent pipeline keep flow constant, can make to there is higher speed, to improve cleaning efficiency from the atomizing particle of device end outlet injection.
2, when atomizing particle exit has vertical inner wall structure, the vertically-guided effect produced by atomizing particle exit, can make in technical process airflow direction and crystal column surface perpendicular, promote that the impurity in surface grooves figure is to the transmission of bodies of fluid, improve the efficiency of cleaning, improve cleaning performance, and the cross shear of atomizing particle to crystal column surface figure structure can be reduced, prevent the damage of crystal column surface figure structure; Meanwhile, be conducive to saving cleaning liquid.
3, size uniformity can be formed, adjustable atomizing particle rinses crystal column surface, because the quality of atomizing particle is little, but also crystal column surface can be made to be pre-existing in one deck sprayed the cleaning liquid film formed with large discharge by liquid rinse pipeline, thus the impulsive force that can reduce crystal column surface structure, and the damage to crystal column surface figure structure can be reduced; Simultaneously, the shock wave produced when atomizing particle can be utilized to clash into cleaning liquid film is on particulate pollutant, the process that pollutant departs from from crystal column surface can be accelerated on the one hand, on the other hand, shock wave can accelerate the flowing velocity of crystal column surface cleaning liquid, impels particulate pollutant to be taken away crystal column surface along with the flowing of liquid quickly.
4, carrying out in two-phase flow atomized spray cleaning process, protective gas, from the ejection of protective gas outlet-inclined impeller vane, forms Buchholz protection, can prevent the oxygen reaction in wafer and chamber atmosphere above wafer; In dry run; the water influent pipeline of two-phase flow atomizer is closed; air inlet pipeline and protective gas outlet are held open; serve and dry object is carried out fast to crystal circle center and edge integral surface; independent jet drying gas can be replaced to carry out dry existing spray arm form, cleaning equipment chamber structure is simplified.
Above-describedly be only preferred embodiment of the present utility model; described embodiment is also not used to limit scope of patent protection of the present utility model; therefore the equivalent structure that every utilization specification of the present utility model and accompanying drawing content are done changes, and in like manner all should be included in protection range of the present utility model.
Claims (10)
1. have a two-phase flow atomized spray cleaning device for Buchholz protection, for cleaning the wafer be placed in cleaning chambers on rotation platform and drying, it is characterized in that, described cleaning device comprises:
Nozzle body, its inside is provided with liquid line, gas piping is provided with around liquid line, nozzle body lower end is provided with gas-liquid guiding parts, gas-liquid guiding parts is provided with the multichannel separating liquid pipeline being communicated with liquid line with certain symmetric relation level, there is between each separating liquid pipeline the web plate of giving vent to anger being communicated with gas piping, web plate of giving vent to anger vertically is provided with the outlet of densely covered majority gas channeling, and being provided with nozzle body axis along each separating liquid pipeline is that the majority guiding fluid that has a down dip of predetermined angle exports;
Water influent pipeline and air inlet pipeline, be connected on a spray arm, and be communicated with liquid line, gas piping in nozzle body respectively, and described spray arm drives nozzle body to do the circular arc reciprocating motion in the wafer center of circle;
Atomizing particle exit, around being located at below gas-liquid guiding parts, it is Laval nozzle structure or has vertical inwall;
Buchholz protection unit, around being located at lower body part, it is provided with around atomizing particle exit and the protective gas outlet arranged that has a down dip toward the outer side, the gas atmosphere inlet that described protective gas outlet Buchholz protection unit is provided with;
When wherein cleaning, the cleaning liquid being exported ejection by guiding fluid with exported by gas channeling that the gas sprayed is crossing below gas-liquid guiding parts forms atomizing particle, and under the acceleration or vertically-guided effect of atomizing particle exit, spray to crystal column surface downwards carry out atomization cleaning, simultaneously, the protective gas sprayed by protective gas outlet-inclined impeller vane forms gas blanket above wafer, prevents wafer from contacting with the oxygen in chamber; Time dry, close water influent pipeline, the dry gas sprayed by atomizing particle exit and the protective gas by protective gas outlet ejection carry out rapid draing to wafer integral surface jointly.
2. cleaning device according to claim 1, is characterized in that, described Buchholz protection cell rings is provided with protective gas cushion chamber around atomizing particle exit, and it is connective protection gas vent and gas atmosphere inlet respectively.
3. cleaning device according to claim 1 and 2, is characterized in that, described protective gas outlet is the pore that a circle continuous print air gap or a circle are evenly arranged.
4. cleaning device according to claim 1 and 2, is characterized in that, described gas atmosphere inlet arranges one to several at Buchholz protection unit.
5. cleaning device according to claim 1 and 2, is characterized in that, described protective gas outlet is obliquely installed towards the drop point direction of crystal round fringes.
6. cleaning device according to claim 5, is characterized in that, described protective gas outlet is obliquely installed towards the drop point direction apart from crystal round fringes 1 ~ 5cm.
7. cleaning device according to claim 1, is characterized in that, the Laval nozzle structure of described atomizing particle exit comprises collapsible tube, narrow larynx and convergent divergent channel from top to bottom successively.
8. cleaning device according to claim 1, it is characterized in that, the multichannel separating liquid pipeline of described gas-liquid guiding parts is common connectivity points with liquid line lower end, and by uniform spoke-like setting, the web plate of giving vent to anger of almost fan is formed between adjacent liquid distribution pipeline, the guiding fluid outlet of each separating liquid pipeline is positioned at below web plate of giving vent to anger, and the downward-sloping setting of gas channeling Way out of web plate of giving vent to anger towards its corresponding side.
9. cleaning device according to claim 8, is characterized in that, it is the end face that predetermined angle has a down dip that described separating liquid pipeline has with the vertical axis of nozzle body, and described guiding fluid outlet is vertically drawn by this end face.
10. cleaning device according to claim 1, is characterized in that, also comprises a liquid rinse pipeline, is located in cleaning chambers, its be positioned at rotation platform oblique upper, export and arrange towards the center of rotation platform; Or liquid rinse pipeline is connected on spray arm, its outlet is positioned at described nozzle body side, and arranges vertically downward.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521028612.8U CN205140937U (en) | 2015-12-10 | 2015-12-10 | Belt cleaning device is sprayed in two -phase flow atomizing with gas protection |
| US15/083,290 US10304705B2 (en) | 2015-12-10 | 2016-03-29 | Cleaning device for atomizing and spraying liquid in two-phase flow |
| TW105122338A TWI632001B (en) | 2015-12-10 | 2016-07-15 | Cleaning device for atomizing and spraying liquid in two-phase flow |
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| CN201521028612.8U CN205140937U (en) | 2015-12-10 | 2015-12-10 | Belt cleaning device is sprayed in two -phase flow atomizing with gas protection |
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| CN205140937U true CN205140937U (en) | 2016-04-06 |
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| CN201521028612.8U Active CN205140937U (en) | 2015-12-10 | 2015-12-10 | Belt cleaning device is sprayed in two -phase flow atomizing with gas protection |
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| CN (1) | CN205140937U (en) |
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| CN105513999A (en) * | 2015-12-10 | 2016-04-20 | 北京七星华创电子股份有限公司 | Two-phase flow atomization injection cleaning apparatus with gas protection, and cleaning method |
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