CN202356338U - Wafer surface cleaning device - Google Patents
Wafer surface cleaning device Download PDFInfo
- Publication number
- CN202356338U CN202356338U CN 201120458587 CN201120458587U CN202356338U CN 202356338 U CN202356338 U CN 202356338U CN 201120458587 CN201120458587 CN 201120458587 CN 201120458587 U CN201120458587 U CN 201120458587U CN 202356338 U CN202356338 U CN 202356338U
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- wafer surface
- wafer
- turning arm
- platform
- shower nozzle
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Abstract
The utility model discloses a wafer surface cleaning device and relates to the process technical field of semiconductor wafers. The wafer surface cleaning device comprises a platform, at least one main sprayer and at least one auxiliary sprayer, wherein the at least one main sprayer is arranged on the platform, and the at least one auxiliary sprayer is arranged on the platform and is used for spraying a cleaning solution to the wafer surface to be cleaned so as to form a buffer layer covering the wafer surface. Before the cleaning solution is sprayed on the wafer surface to be cleaned by the main sprayer of the wafer surface cleaning device, and in the process of cleaning, the cleaning solution is sprayed by the auxiliary sprayer at intervals so as to ensure that the wafer surface to be cleaned is completely covered by the liquid buffer layer; through the liquid buffer layer, the condition that high-speed nanoscale liquid drops directly to impact patterns on the wafer is avoided, thereby reducing the damage on the wafer.
Description
Technical field
The utility model relates to semiconductor wafer technology field, particularly a kind of wafer surface cleaning apparatus.
Background technology
Along with the integrated circuit characteristic size enters into the deep-submicron stage, the cleanliness factor of desired silicon chip surface is more and more harsher in the IC wafer manufacturing process, and cleaning also develops into one chip gradually and cleans.In the one chip cleaning process; Cleaning fluid is sprayed on wafer by the shower nozzle that is positioned at the wafer top; The centrifugal force that the rotation of impulsive force at a high speed and below wafer produces makes cleaning fluid leave wafer surface, simultaneously pollutants such as some particles is taken away, thereby is reached cleaning performance.But along with the size of wafer figure is more and more littler, the high velocity jet fluid can not be ignored the infringement of figure.In order to reduce the infringement to figure, all in research nanometer spraying technique, the fluid that promptly ejects is vaporific, is made up of various nano level drops now.As shown in Figure 1, the drop of shower nozzle 1 ejection drops on wafer surface, and the pollutant 3 on the patterning 2 of wafer surface is washed.Compare big drop or continuous fluid; The nanometer spraying technique can reduce the infringement to figure really to a certain extent; But the vaporific nano-liquid droplet that ejects is to be ejected on the wafer than higher speed, if these nano-liquid droplets at a high speed directly contact with figure, because drop size is little equally; Get into the inside of wafer feature size more easily, may cause deeper damage.And the fluid that sprays also not all is that vertical the injection fallen on the wafer, and the fluid of oblique incidence can cause bigger damage to the sidewall and the corner of figure again like this.Therefore, reducing into jet body is present problem demanding prompt solution to the damage of wafer surface.
The utility model content
The technical problem that (one) will solve
The technical problem that the utility model will solve is: in the process of clean wafers, how to reduce the damage of nanoscale drop at a high speed to wafer.
(2) technical scheme
For solving the problems of the technologies described above; The utility model provides a kind of wafer surface cleaning apparatus; Comprise: platform, be arranged at least one the main jet head on the said platform; Comprise that also at least one is arranged on the auxiliary shower nozzle on the said platform, be used for, make to form the fluid cushion layer that one deck covers said wafer surface to wafer surface hydrojet to be cleaned.
Wherein, said main jet head and auxiliary shower nozzle include: turning arm, nozzle, liquid conduits, said nozzle are fixed on an end of said liquid conduits, and said liquid conduits is fixed on the turning arm, and said turning arm one end rotatably is fixed on the said platform.
Wherein, said turning arm is a hollow structure, and said liquid conduits is positioned at turning arm inside.
Wherein, said turning arm is a solid construction, and said liquid conduits is fixed on the turning arm outside.
Wherein, said main jet head and auxiliary shower nozzle turning arm separately evenly distribute with respect to the circumference at wafer place on platform.
(3) beneficial effect
The utility model makes formation and keeps one deck to cover the fluid cushion layer of wafer surface to be cleaned fully through at auxiliary shower nozzle spraying liquid, avoids nanoscale drop at a high speed directly to impact the pattern on the wafer, thereby has reduced the damage to wafer.
Description of drawings
Sketch map when Fig. 1 is existing cleaning device clean wafers;
Fig. 2 is a kind of wafer surface cleaning apparatus structural representation of the utility model embodiment;
Fig. 3 is the side schematic view of the device of Fig. 2;
Fig. 4 adopts the wafer surface sketch map behind the preceding formation of the device cleaning fluid cushion layer among Fig. 2;
Fig. 5 is the wafer surface sketch map that adopts when device cleans among Fig. 2;
Fig. 6 is that device auxiliary shower nozzle of main jet head rotation in cleaning process does not rotate sketch map among employing Fig. 2;
Fig. 7 is the sketch map that adopts device among Fig. 2 main jet head and auxiliary shower nozzle in cleaning process to rotate.
The specific embodiment
Below in conjunction with accompanying drawing and embodiment, the specific embodiment of the utility model is described in further detail.Following examples are used to explain the utility model, but are not used for limiting the scope of the utility model.
Like Fig. 2, shown in 3 and 4, the wafer surface cleaning apparatus of the utility model comprises: platform 11, be fixed at least one main jet head 5, at least one auxiliary shower nozzle 8 on the platform 11, the situation of a main jet head and an auxiliary shower nozzle has been shown among Fig. 2.Main jet head 5 is used to spray cleaning fluid, and auxiliary shower nozzle 8 makes the fluid cushion layer 4 that forms one deck cover wafers 6 surfaces to wafer to be cleaned 6 surperficial hydrojets.
Preferably; Main jet head 5 includes with auxiliary shower nozzle 8: turning arm, nozzle, liquid conduits; Turning arm one end rotatably is fixed on the platform 11; Nozzle is fixed on an end of liquid conduits, and liquid conduits is connected (being not limited to this two kinds of connected modes) with nozzle through spiral or the cutting ferrule structure that cooperatively interacts.Liquid conduits is fixed on the turning arm, can rotate with turning arm, thereby make nozzle above wafer 6, move, and makes hydrojet arrive bigger scope.Turning arm can be hollow structure, and liquid conduits is positioned at turning arm inside; Liquid conduits can also be positioned at the turning arm outside.
Preferably; In order to keep spraying equably cleaning; The turning arm separately of main jet head 5 and auxiliary shower nozzle 8 evenly distributes with respect to the circumference at wafer 6 places on platform 11, and can be spaced apart, for the situation of having only a main jet head 5 and an auxiliary shower nozzle 8; The rotating shaft 7 of the turning arm of two shower nozzles and wafer 6 lays respectively at rotating shaft 7 both sides of wafer 6 at grade.
Owing to formed one deck fluid cushion layer 4 on the surface of wafer 6; Can directly not impact the patterned surfaces of wafer 6 from the drop of the high-speed nano of main jet head 5 ejection, as shown in Figure 5, but drop on the fluid cushion layer 4; Simultaneously wafer 6 itself is also along with rotating shaft 7 is rotated; Thereby cause fluid cushion layer 4 concussion, the chemical action of mechanism and chemical cleaning solution of utilizing this concussion has reached the purpose of not damaging wafer 6 picture on surface simultaneously together with the pollutant removal on the wafer 6.
Preferably, as shown in Figure 6 for clean wafers 6 more fully, when cleaning, main jet head 5 can move above wafer 6 around the turning arm of self, and main jet head 5 moves along track 9 among the figure.Simultaneously also avoided resting on a place for a long time, made the impulsive force accumulation at this place, this place is difficult to form fluid cushion layer 4.
Preferably, for guaranteeing fluid cushion layer 4 surface of cover wafers 6 fully, auxiliary shower nozzle 8 is moving in the region covered at self under the effect of turning arm, and is as shown in Figure 7, and auxiliary shower nozzle 8 moves along track 10, and main jet head 5 also moves along track 9 simultaneously.
Preferably; For guaranteeing fluid cushion layer 4 surface of cover wafers 6 fully; According to the size of wafer a plurality of main jet head 5, auxiliary shower nozzle 8 hydrojet simultaneously is installed above wafer, simultaneously a plurality of main jet head 5, auxiliary shower nozzle 8 can also can move in the region covered at self under the effect of turning arm.
The operation principle of the utility model is following:
Before cleaning, auxiliary shower nozzle shift to an earlier date a period of time with lower speed to the wafer atomizing of liquids, make wafer surface moistening, wafer surface has one deck fluid cushion layer when main jet head atomizing of liquids, thereby prevents that the wafer graphic structure directly receives the impact of high-velocity fluid.In cleaning process, auxiliary shower nozzle also with certain speed to the wafer hydrojet, the speed of its hydrojet will with the hydrojet speed of main jet head to cooperating, make it possible to keep forming the fluid cushion layer on complete cover wafers surface.
Spray in the process of cleaning fluid to wafer surface to be cleaned at the main jet head, guaranteeing that the fluid cushion layer covers under the situation of wafer surface to be cleaned fully, auxiliary shower nozzle compartment of terrain spraying liquid is to avoid unnecessary liquid waste.
Preferably, for guaranteeing the fluid cushion layer surface of cover wafers fully, and can clean better.In cleaning process, one of said main jet head and auxiliary shower nozzle or all move in the regional extent above said wafer to be cleaned.As shown in Figure 6, main jet head 5 moves along track 9.As shown in Figure 7; With the turning arm of two shower nozzles and wafer rotating shaft at grade, and the wafer rotating shaft situation that is positioned at both sides is an example respectively, and a begins rotation to main jet head 5 from the position; B finishes (being positioned at the c place among the figure) to the position; When main jet head 5 began to rotate, a ' began rotation to auxiliary shower nozzle 8 from the position, and b ' finishes (being positioned at c ' among the figure locates) to the position.Two shower nozzle rotating speeds are consistent, and that is to say, when main jet head 5 and two shower nozzle rotating shaft central points were wired to the α angle, auxiliary shower nozzle 8 and two shower nozzle rotating shaft central points were wired to the β angle, and the α angle is identical with the β angle.In cleaning process, the liquid phase that main jet head 5 and auxiliary shower nozzle 8 spray for the incident angle of wafer surface to be cleaned greater than 0 ° smaller or equal to 90 °.
The liquid of auxiliary shower nozzle ejection comprises: water, with the cleaning fluid of the first appearance of main jet or the liquid of other discord cleaning fluid reaction.
Above embodiment only is used to explain the utility model; And be not the restriction to the utility model; The those of ordinary skill in relevant technologies field under the situation of spirit that does not break away from the utility model and scope, can also be made various variations and modification; Therefore all technical schemes that are equal to also belong to the category of the utility model, and the scope of patent protection of the utility model should be defined by the claims.
Claims (5)
1. wafer surface cleaning apparatus comprises: platform, be arranged at least one the main jet head on the said platform, it is characterized in that, comprise that also at least one is arranged on the auxiliary shower nozzle on the said platform.
2. wafer surface cleaning apparatus as claimed in claim 1; It is characterized in that; Said main jet head and auxiliary shower nozzle include: turning arm, nozzle, liquid conduits; Said nozzle is fixed on an end of said liquid conduits, and said liquid conduits is fixed on the turning arm, and said turning arm one end rotatably is fixed on the said platform.
3. wafer surface cleaning apparatus as claimed in claim 2 is characterized in that, said turning arm is a hollow structure, and said liquid conduits is positioned at turning arm inside.
4. wafer surface cleaning apparatus as claimed in claim 2 is characterized in that, said turning arm is a solid construction, and said liquid conduits is fixed on the turning arm outside.
5. like each described wafer surface cleaning apparatus in the claim 2～4, it is characterized in that said main jet head and auxiliary shower nozzle turning arm separately evenly distribute with respect to the circumference at wafer place on platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120458587 CN202356338U (en) | 2011-11-17 | 2011-11-17 | Wafer surface cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120458587 CN202356338U (en) | 2011-11-17 | 2011-11-17 | Wafer surface cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202356338U true CN202356338U (en) | 2012-08-01 |
Family
ID=46567555
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201120458587 Expired - Lifetime CN202356338U (en) | 2011-11-17 | 2011-11-17 | Wafer surface cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202356338U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102416391A (en) * | 2011-11-17 | 2012-04-18 | 北京七星华创电子股份有限公司 | Device and method for cleaning surface of wafer |
| CN112275696A (en) * | 2020-09-16 | 2021-01-29 | 华中科技大学 | Device and method for removing nano-scale particles adsorbed on surface of silicon wafer |
-
2011
- 2011-11-17 CN CN 201120458587 patent/CN202356338U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102416391A (en) * | 2011-11-17 | 2012-04-18 | 北京七星华创电子股份有限公司 | Device and method for cleaning surface of wafer |
| CN112275696A (en) * | 2020-09-16 | 2021-01-29 | 华中科技大学 | Device and method for removing nano-scale particles adsorbed on surface of silicon wafer |
| CN112275696B (en) * | 2020-09-16 | 2022-02-15 | 华中科技大学 | Device and method for removing nano-scale particles adsorbed on surface of silicon wafer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120801 |
|
| CX01 | Expiry of patent term |