CN205084908U - Gas -liquid two -phase flow atomizing belt cleaning device - Google Patents
Gas -liquid two -phase flow atomizing belt cleaning device Download PDFInfo
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- CN205084908U CN205084908U CN201520382346.2U CN201520382346U CN205084908U CN 205084908 U CN205084908 U CN 205084908U CN 201520382346 U CN201520382346 U CN 201520382346U CN 205084908 U CN205084908 U CN 205084908U
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Abstract
The utility model discloses a gas -liquid two -phase flow atomizing belt cleaning device, it connects to be equipped with a clear washing medicine liquid entry joint and two high -pressure gas entrys in portable main part, be equipped with a central gas nozzle below the main part, it is provided with a plurality of atomizing nozzle to have a down dip around its vertical centering control axis symmetry below central gas nozzle, each atomizing nozzle's axis crosses in a bit on the axis of central gas nozzle, every atomizing nozzle connects clearly through a laval spray tube simultaneously, and washing medicine liquid entry connects and a high -pressure gas entry joint, central authorities' gas nozzle is connected another high -pressure gas entry through a laval spray tube and is connected, structure through rational design two -phase flow atomizing nozzle, can realize multistage atomizing in the intersection, the size of granule and the energy that carries effectively reduce to atomize, prevent to cause the damage to the surperficial figure of wafer.
Description
Technical field
The utility model relates to semiconductor cleaning device field, more specifically, relates to a kind of gas-liquid gas-liquid two-phase flow atomization cleaner.
Background technology
Along with the high speed development of semiconductor integrated circuit manufacturing technology, the pattern character size of IC chip has entered into the deep-submicron stage, causes the characteristic size of the crucial pollutant (such as particle) of superfine circuit malfunction or damage on chip also greatly to reduce thereupon.
In the process for making of integrated circuit, semiconductor crystal wafer usually all can through multiple tracks processing steps such as such as thin film deposition, etching, polishings.And these processing steps just become the important place that pollutant produces.In order to keep the clean conditions of crystal column surface, eliminating the pollutant being deposited on crystal column surface in each processing step, cleaning treatment must be carried out to the crystal column surface that subjected to after per pass processing step.Therefore, cleaning becomes processing step the most general in integrated circuit fabrication process, its object is to the contamination level effectively controlling each step, to realize the target of each processing step.
In order to remove the pollutant of crystal column surface, when carrying out monolithic wet clean process, wafer will be placed on the rotation platform (such as rotary chuck) of cleaning equipment, and rotates according to certain speed; Simultaneously to the cleaning liquid of the surface spraying certain flow of wafer, crystal column surface is cleaned.
While reached removal pollutant object by cleaning, the most important thing is will ensure wafer, especially the not damaged of figure crystal column surface figure be cleaned.
Along with reducing of integrated circuit pattern characteristic size, the removal difficulty of the pollutant of crystal column surface smaller szie is also continuing to increase.Therefore, a lot of Novel washing technology has also obtained applying more widely on cleaning equipment.Wherein, on monolithic wet clean equipment, utilize atomization cleaning technology can improve the effect of cleaning further.In atomization cleaning process, atomizing particle can produce an impulsive force to the liquid film of crystal column surface, and in liquid film, form the shock wave of fast propagation.When shock wave is on particulate pollutant, the process that pollutant departs from from crystal column surface can be accelerated on the one hand; On the other hand, shock wave can accelerate the flowing velocity of crystal column surface cleaning liquid, impels particulate pollutant to be taken away crystal column surface along with the flowing of liquid quickly.
But, the atomized particle size that atomization cleaner common at present produces is larger, and the energy that atomizing particle has is also higher, when these atomization cleaners are applied in the wafer cleaning technique in 65 nanometers and following technology generation, be easy to cause the problems such as surfacial pattern damage.
Therefore, need, by carrying out deep design to the structure of atomising device, to reduce the size of atomizing particle further, and reduce the energy entrained by it.
Utility model content
The purpose of this utility model is the above-mentioned defect overcoming prior art existence, a kind of new gas-liquid two-phase flow atomization cleaner is provided, by rational structural design, and corresponding technical arrangement plan, the effect of finer atomization can be reached, realize the not damaged cleaning of crystal column surface, there is simple to operate, reproducible advantage.
For achieving the above object, the technical solution of the utility model is as follows:
A kind of gas-liquid two-phase flow atomization cleaner, for carrying out atomization cleaning to the wafer be placed on cleaning equipment rotation platform, described cleaning device comprises:
Main body, above the rotation platform being movably suspended at described cleaning equipment or oblique upper;
First ~ three inlet attack, is located in described main body, and described first inlet attack is used for passing into cleaning liquid, and second, third inlet attack described is used for passing into gases at high pressure respectively;
Nozzle, be located at below described main body, comprise a central gas nozzle and some atomizers, each described atomizer to have a down dip setting around its vertical centering control axisymmetrical below described central gas nozzle, the axis of each described atomizer is intersected in a bit on the axis of described central gas nozzle, each described atomizer connects first, second inlet attack by a Laval jet pipe simultaneously, and described central gas nozzle connects the 3rd inlet attack by a 2nd Laval jet pipe;
Wherein, the gases at high pressure that the cleaning liquid passed into by described first inlet attack and described second inlet attack pass into, gas-liquid two-phase flow first order atomization liquid is formed after the porch of each described Laval jet pipe is converged, and from each described atomizer ejection after a described Laval jet pipe accelerates, produce collision rift in intersection and form second level atomization liquid, simultaneously, the gases at high pressure passed into by described 3rd inlet attack spray from described central gas nozzle after described 2nd Laval jet pipe accelerates, be atomized liquid in intersection and the second level to produce collision rift and form the third level and be atomized liquid, and accelerate to move downwardly to crystal column surface, to carry out mobile atomization cleaning.
Preferably, first, second main cavity is provided with in described main body, described first inlet attack is connected to the entrance of each described Laval jet pipe respectively by described first main cavity, and described second inlet attack is connected to the entrance of each described Laval jet pipe respectively by described second main cavity.
Preferably, described first main cavity is connected to the entrance of each described Laval jet pipe respectively by first passage, and described second main cavity is connected to the entrance of each described Laval jet pipe respectively by second channel.
Preferably, the quantity of described atomizer is at least two, and is circumferentially uniformly distributed in level.
Preferably, the below of described main body is provided with guiding jet pipe, for leading to the third level atomization liquid formed.
Preferably, described guiding jet pipe is circular, square or strip.
Preferably, the 3rd Laval jet pipe is provided with in described guiding jet pipe.
Preferably, described main body connects the spray support of described cleaning equipment.
Preferably, described main body connects the spray support of described cleaning equipment by fixed support.
Preferably, the rotation and lifting driven by motor that described main body connects by described spray support, does scanning at crystal column surface mobile.
The utility model has the following advantages:
1, by the structure of appropriate design two-phase flow atomizer, can multistage atomizing be realized, efficiently reduce the size of atomization liquor granule, also reduce the energy that particle carries simultaneously, thus the damage to crystal column surface figure can be prevented;
2, by acceleration and the orientation of central gas nozzle, make the direction of motion of atomization liquor granule perpendicular to crystal column surface, the energy preventing atomizing particle to have produces the damage that cross shear causes crystal column surface figure in the horizontal direction;
3, compared to traditional monolithic cleaning way, adopt two-phase flow atomization cleaning while improve particulate pollutant removal efficiency, also can reduce the consumption of cleaning liquid and deionized water, thus save production cost.
Accompanying drawing explanation
Fig. 1 is the contour structures schematic diagram of a kind of gas-liquid two-phase flow atomization cleaner of the utility model one preferred embodiment;
Fig. 2 is the structure elevational schematic view of a kind of gas-liquid two-phase flow atomization cleaner of the utility model one preferred embodiment;
Fig. 3 is the structure cross-sectional schematic in a kind of gas-liquid two-phase flow atomization cleaner first direction of the utility model one preferred embodiment;
Fig. 4 is the structure cross-sectional schematic in a kind of gas-liquid two-phase flow atomization cleaner second direction of the utility model one preferred embodiment.
Detailed description of the invention
Below in conjunction with accompanying drawing, detailed description of the invention of the present utility model is described in further detail.
It should be noted that, in following detailed description of the invention, when describing embodiment of the present utility model in detail, in order to clearly represent structure of the present utility model so that explanation, special to the structure in accompanying drawing not according to general scale, and carried out partial enlargement, distortion and simplify processes, therefore, should avoid being understood in this, as to restriction of the present utility model.
In following detailed description of the invention of the present utility model, refer to Fig. 1, Fig. 1 is the contour structures schematic diagram of a kind of gas-liquid two-phase flow atomization cleaner of the utility model one preferred embodiment.As shown in Figure 1, a kind of gas-liquid two-phase flow atomization cleaner of the present utility model, can be applicable to such as monolithic wet clean equipment, carries out atomization cleaning to the wafer be placed on rotation platform.Cleaning device of the present utility model comprises a main body 3, and described main body 3 is suspended at rotation platform (figure omits, please refer to prior art is understood) top or the oblique upper of described cleaning equipment in a movable manner.As an optional embodiment, described main body 3 is connected to the mobile spray support (figure omits, please refer to prior art is understood) of described cleaning equipment by a fixed support 1.Such as, fixed support 1 can adopt such as perpendicular type, and its one end adopts bolt and main body 3 to be fixedly installed togather by retaining thread hole 7; The other end by be spirally connected, cohere or other fixed form with spray support fix.Spray support is connected with rotation and lifting motor (figure omits, please refer to prior art is understood), therefore, main body 3 can under the drive of rotation and lifting motor, side does scanning motion on the wafer surface, and by coordinating with the rotary motion of wafer, realize the uniform fold to crystal column surface.
Please continue to refer to Fig. 1.Three gas/liquid inlet attacks are housed in the upper end of main body 3, are respectively the first ~ three inlet attack 2,6,5.Wherein, the first inlet attack 2 as cleaning liquid inlet attack, for passing into cleaning liquid; Second inlet attack 6 as pressurized gas inlet joint, for passing into gases at high pressure; 3rd inlet attack 5, as central gas inlet joint, is positioned at the upper center of main body 3, also for passing into gases at high pressure individually.
Refer to Fig. 2 and combine and consult Fig. 1, Fig. 2 is the structure elevational schematic view of a kind of gas-liquid two-phase flow atomization cleaner of the utility model one preferred embodiment.As shown in Figure 1, 2, some nozzles 4,8 are housed in the lower end of main body 3, comprise the central gas nozzle 8 be positioned in the middle part of main body 3 lower end, and be positioned at below around described central gas nozzle 8, around described central gas nozzle 8 vertical centering control axis and the symmetrically arranged some atomizers 4 of the certain angle that has a down dip.The axis of each described atomizer 4 is intersected in a bit on the axis of described central gas nozzle 8, and also namely each central axis of described atomizer 4 and the central axis of central gas nozzle 8 intersect at same point.In order to reach desirable multistage atomizing effect, the quantity of described atomizer 4 should be symmetrical at least two.As a preferred embodiment, the quantity of described atomizer 4 have employed four, and is circumferentially uniformly distributed in level.
Refer to Fig. 3 and Fig. 4, Fig. 3 is the structure cross-sectional schematic in a kind of gas-liquid two-phase flow atomization cleaner first direction of the utility model one preferred embodiment, and Fig. 4 is the structure cross-sectional schematic in a kind of gas-liquid two-phase flow atomization cleaner second direction of the utility model one preferred embodiment.As shown in Figure 3 and Figure 4, the jet pipe (namely referring to that sectional area first shrinks the nozzle structure expanded gradually more gradually) that has Laval structure has been installed in each nozzle 4,8.Wherein, each atomizer 4 connects first, second inlet attack 2,6 by a Laval jet pipe 13 simultaneously, and central gas nozzle 8 connects the 3rd inlet attack 5 by a 2nd Laval jet pipe 11.
As shown in Figure 3, as an optional embodiment, the first main cavity 10 and the second main cavity 9 can be processed further in main body 3, described first inlet attack 2 is made to be connected to the entrance of each described Laval jet pipe 13 respectively by the first main cavity 10, meanwhile, described second inlet attack 6 is made to be connected to the entrance of each described Laval jet pipe 13 respectively by the second main cavity 9.
As shown in Figure 4, further preferably, described first main cavity 10 is connected to the entrance of each described Laval jet pipe 13 respectively by first passage 12, and described second main cavity 9 is connected to the entrance of each described Laval jet pipe 13 respectively by second channel 14.First, second passage 12,14 described can adopt the form directly processing runner in inside configuration to carry out being communicated with between main cavity with a Laval jet pipe.Enter the liquid in the first main cavity 10 and the gases at high pressure entered in the second main cavity 9 carry out supercharging further by passage 12,14, to realize when the porch of a Laval jet pipe 13 is converged being atomized well.
Central gas nozzle 8 is connected directly to the 3rd inlet attack 5 by the 2nd Laval jet pipe 11, because only needing to realize further supercharging to gas, accelerating function within it.
Like this, the cleaning liquid passed into by the first inlet attack 2 flows downward to the first main cavity 10, enters the first passage 12 connecting each atomizer the one Laval jet pipe 13 subsequently; The gases at high pressure passed into by the second inlet attack 6, flow downward to the second main cavity 9, enter the second channel 14 connecting each atomizer the one Laval jet pipe 13 subsequently.Cleaning liquid and gases at high pressure produce interaction at first passage 12 and the exit of second channel 14, the i.e. porch of a Laval jet pipe 13 after converging, and form the first order atomization liquid of gas-liquid two-phase flow, complete the first order atomization process of cleaning liquid.Subsequently, under the continuation of gases at high pressure drives, first order atomization liquid moves downward the Laval nozzle structure 13 entering atomizer 4, after the acceleration of a Laval nozzle structure 13, atomization liquor granule sprays from atomizer 4 together with gases at high pressure, and there is sharp impacts in the central axis intersection of each atomizer 4, form second level atomization liquid, complete second level atomization process.
Meanwhile, the gases at high pressure passed into by the 3rd inlet attack 5 move downward and enter central gas nozzle 8, and after the acceleration of the 2nd Laval nozzle structure 11 in central gas nozzle 8, gases at high pressure can be accelerated to velocity of sound, even supersonic condition.Gases at high pressure through accelerating move downward from described central gas nozzle 8 ejection, each atomizer 4 central axis intersection with complete atomization liquor granule that the second level is atomized and interact to produce and collide, realize more meticulous third level atomization process, define third level atomization liquid, the gases at high pressure sprayed from described central gas nozzle 8 also can be the acceleration of third level atomization liquor granule, move downwardly to crystal column surface, to carry out mobile atomization cleaning to crystal column surface.
As a further preferred embodiment, atomizing particle guiding jet pipe (figure slightly) optionally can also be installed in the below of main body 3, its effect is led to gases at high pressure spray from central gas nozzle 8 and the atomizing particle that formed after third level atomization, only retains the atomizing particle in special exercise direction (such as vertical with crystal column surface or be special angle).Alternatively, the jet pipe that leads can be circular, square or the various shape such as strip.Also can in guiding jet pipe inside other structure additional, such as Laval nozzle structure (i.e. the 3rd Laval jet pipe), carries out accelerator further to atomizing particle.These additional structures can be selected according to actual needs.
When using above-mentioned gas-liquid two-phase flow atomization cleaner of the present utility model, process can comprise: connect main body 3, fixed support 1 and spray support; Adjustment main body 3 and atomizer 4 are apart from the height of crystal column surface, and the spray swing speed of support and the rotary speed of wafer; Adjust the flow of cleaning liquid on each pipeline 2,6,5 and gases at high pressure, to form the finer atomization particle of size uniformity below main body 3; By the fluid flow of change cleaning liquid spray main line (not shown in FIG.), change the thickness of crystal column surface cleaning liquid liquid film, the vibration of liquid in liquid film is effectively caused when enabling atomizing particle arrive crystal column surface, thus realize the removal of fine granular, ensure that the figure of crystal column surface does not damage simultaneously.
In sum, the utility model is by rational structural design, and corresponding technical arrangement plan, can reach the effect of finer atomization, and realize the not damaged cleaning of crystal column surface, it is simple to operate, reproducible, and has the following advantages:
1, by the structure of appropriate design two-phase flow atomizer, can multistage atomizing be realized, efficiently reduce the size of atomization liquor granule, also reduce the energy that particle carries simultaneously, thus the damage to crystal column surface figure can be prevented;
2, by acceleration and the orientation of central gas nozzle, make the direction of motion of atomization liquor granule perpendicular to crystal column surface, the energy preventing atomizing particle to have produces the damage that cross shear causes crystal column surface figure in the horizontal direction;
3, compared to traditional monolithic cleaning way, adopt two-phase flow atomization cleaning while improve particulate pollutant removal efficiency, also can reduce the consumption of cleaning liquid and deionized water, thus save production cost.
Above-describedly be only preferred embodiment of the present utility model; described embodiment is also not used to limit scope of patent protection of the present utility model; therefore the equivalent structure that every utilization description of the present utility model and accompanying drawing content are done changes, and in like manner all should be included in protection domain of the present utility model.
Claims (10)
1. a gas-liquid two-phase flow atomization cleaner, for carrying out atomization cleaning to the wafer be placed on cleaning equipment rotation platform, is characterized in that, described cleaning device comprises:
Main body, above the rotation platform being movably suspended at described cleaning equipment or oblique upper;
First ~ three inlet attack, is located in described main body, and described first inlet attack is used for passing into cleaning liquid, and second, third inlet attack described is used for passing into gases at high pressure respectively;
Nozzle, be located at below described main body, comprise a central gas nozzle and some atomizers, each described atomizer to have a down dip setting around its vertical centering control axisymmetrical below described central gas nozzle, the axis of each described atomizer is intersected in a bit on the axis of described central gas nozzle, each described atomizer connects first, second inlet attack by a Laval jet pipe simultaneously, and described central gas nozzle connects the 3rd inlet attack by a 2nd Laval jet pipe;
Wherein, the gases at high pressure that the cleaning liquid passed into by described first inlet attack and described second inlet attack pass into, gas-liquid two-phase flow first order atomization liquid is formed after the porch of each described Laval jet pipe is converged, and from each described atomizer ejection after a described Laval jet pipe accelerates, produce collision rift in intersection and form second level atomization liquid, simultaneously, the gases at high pressure passed into by described 3rd inlet attack spray from described central gas nozzle after described 2nd Laval jet pipe accelerates, be atomized liquid in intersection and the second level to produce collision rift and form the third level and be atomized liquid, and accelerate to move downwardly to crystal column surface, to carry out mobile atomization cleaning.
2. gas-liquid two-phase flow atomization cleaner according to claim 1, it is characterized in that, first, second main cavity is provided with in described main body, described first inlet attack is connected to the entrance of each described Laval jet pipe respectively by described first main cavity, and described second inlet attack is connected to the entrance of each described Laval jet pipe respectively by described second main cavity.
3. gas-liquid two-phase flow atomization cleaner according to claim 2, it is characterized in that, described first main cavity is connected to the entrance of each described Laval jet pipe respectively by first passage, and described second main cavity is connected to the entrance of each described Laval jet pipe respectively by second channel.
4. gas-liquid two-phase flow atomization cleaner according to claim 1, is characterized in that, the quantity of described atomizer is at least two, and is circumferentially uniformly distributed in level.
5. gas-liquid two-phase flow atomization cleaner according to claim 1, is characterized in that, the below of described main body is provided with guiding jet pipe, for leading to the third level atomization liquid formed.
6. gas-liquid two-phase flow atomization cleaner according to claim 5, is characterized in that, described guiding jet pipe is circular, square or strip.
7. the gas-liquid two-phase flow atomization cleaner according to claim 5 or 6, is characterized in that, is provided with the 3rd Laval jet pipe in described guiding jet pipe.
8. gas-liquid two-phase flow atomization cleaner according to claim 1, is characterized in that, described main body connects the spray support of described cleaning equipment.
9. gas-liquid two-phase flow atomization cleaner according to claim 8, is characterized in that, described main body connects the spray support of described cleaning equipment by fixed support.
10. gas-liquid two-phase flow atomization cleaner according to claim 8 or claim 9, is characterized in that, the rotation and lifting driven by motor that described main body connects by described spray support, does scanning mobile at crystal column surface.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201520382346.2U CN205084908U (en) | 2015-06-04 | 2015-06-04 | Gas -liquid two -phase flow atomizing belt cleaning device |
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| CN201520382346.2U CN205084908U (en) | 2015-06-04 | 2015-06-04 | Gas -liquid two -phase flow atomizing belt cleaning device |
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| CN205084908U true CN205084908U (en) | 2016-03-16 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104874500A (en) * | 2015-06-04 | 2015-09-02 | 北京七星华创电子股份有限公司 | Two-phase flow atomizing cleaner |
| CN110153074A (en) * | 2019-05-08 | 2019-08-23 | 上海航天设备制造总厂有限公司 | A kind of supersonic speed gas-liquid mixed cleaning device and cleaning method |
-
2015
- 2015-06-04 CN CN201520382346.2U patent/CN205084908U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104874500A (en) * | 2015-06-04 | 2015-09-02 | 北京七星华创电子股份有限公司 | Two-phase flow atomizing cleaner |
| CN104874500B (en) * | 2015-06-04 | 2017-02-01 | 北京七星华创电子股份有限公司 | Two-phase flow atomizing cleaner |
| CN110153074A (en) * | 2019-05-08 | 2019-08-23 | 上海航天设备制造总厂有限公司 | A kind of supersonic speed gas-liquid mixed cleaning device and cleaning method |
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