CN204208853U - Cleaning injection apparatus - Google Patents
Cleaning injection apparatus Download PDFInfo
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- CN204208853U CN204208853U CN201420553337.0U CN201420553337U CN204208853U CN 204208853 U CN204208853 U CN 204208853U CN 201420553337 U CN201420553337 U CN 201420553337U CN 204208853 U CN204208853 U CN 204208853U
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- passage
- gas passage
- injection apparatus
- spray beam
- liquid passage
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Abstract
The utility model provides a kind of cleaning injection apparatus, and this cleaning injection apparatus comprises spray arm, spray beam and nozzle; First liquid passage and the first gas passage is provided with in described spray arm; One end of described spray beam is connected with one end of described spray arm, second liquid passage and the second gas passage is provided with in described spray beam, described second liquid passage is connected with described first liquid passage, described second gas passage is connected with described first gas passage, described spray beam is also provided with the jet be all connected with the second gas passage with described second liquid passage, described nozzle is arranged on described jet.The cleaning injection apparatus that the utility model provides, at spray arm and spray beam upper set fluid passage and gas passage, spray beam arranges nozzle, can reduce the spray beam mechanism quantity of cleaning chamber, simplify the layout of cleaning chamber.
Description
Technical field
The utility model relates to silicon wafer cleaner chemical liquid cleaning field, particularly relates to a kind of cleaning injection apparatus.
Background technology
Along with being growing more intense of semi-conductor market competition, Ge great semiconductor manufacturer requires more and more higher to the performance of equipment and production efficiency.Multiple acid, alkaline liquid and ultra-pure water to be used in the technique of the cleaning of the rotary cleaning equipment of single-wafer, and will the media such as nitrogen be used in dry run.
Liquid, ultra-pure water, N2 are often divided into independently unit by the rotary cleaning equipment of current single-wafer, namely independently rotating spray device is adopted separately, carry out the cleaning of silicon chip, but, multiple independently rotary-jet unit has the following disadvantages in production process: multiple independent rotary-jet unit occupies more cleaning chamber space, add the impact of the laminar winds on cleaning chamber, and multiple independent rotary-jet unit adds the complexity of corresponding control system, adds equipment fault probability of happening.
Utility model content
(1) technical problem that will solve
The technical problems to be solved in the utility model is to provide a kind of cleaning injection apparatus, can reduce the spray beam mechanism quantity of cleaning chamber, simplify the layout of cleaning chamber.
(2) technical scheme
For solving the problems of the technologies described above, the technical solution of the utility model provides a kind of cleaning injection apparatus, comprises spray arm, spray beam and nozzle;
First liquid passage and the first gas passage is provided with in described spray arm;
One end of described spray beam is connected with one end of described spray arm, second liquid passage and the second gas passage is provided with in described spray beam, described second liquid passage is connected with described first liquid passage, described second gas passage is connected with described first gas passage, described spray beam is also provided with the jet be all connected with the second gas passage with described second liquid passage, described nozzle is arranged on described jet.
Further, described first liquid passage is multiple, and described multiple first liquid passage circular row is distributed in described first gas passage periphery.
Further, the junction of described spray arm and described spray beam is provided with the first chamber and the second chamber, described second liquid passage and described multiple first liquid passage are all connected with described first chamber, and described second gas passage and described first gas passage are all connected with described second chamber.
Further, described first chamber is the annular compartment around described second chamber.
Further, described first liquid passage is provided with check valve.
Further, described spray beam and plane-parallel are arranged, and described spray arm and horizontal plane are arranged, and described second gas passage is positioned at above described second liquid passage.
Further, be provided with the 3rd fluid passage be connected with described second liquid passage and the 3rd gas passage be connected with described second gas passage in described nozzle, the end of described nozzle is provided with the immixture chamber be all connected with described 3rd fluid passage and described 3rd gas passage.
Further, described 3rd fluid passage is arranged around described 3rd gas passage.
Further, described nozzle is multiple, and described nozzle is equidistantly arranged in described spray beam.
Further, rotary actuator and lifting executing agency is also comprised;
It is that axis does circumference and moves in the horizontal direction with spray arm that described rotary actuator controls described spray beam, and described in described lifting actuating mechanism controls, spray beam moves at vertical direction.
(3) beneficial effect
The cleaning injection apparatus that the utility model provides, at spray arm and spray beam upper set fluid passage and gas passage, spray beam arranges nozzle, can reduce the spray beam mechanism quantity of cleaning chamber, simplify the layout of cleaning chamber.
Accompanying drawing explanation
Fig. 1 is a kind of schematic diagram cleaning injection apparatus that the utility model embodiment provides;
Fig. 2 is a kind of top view cleaning injection apparatus that the utility model embodiment provides;
Fig. 3 is the front schematic view of a kind of nozzle that the utility model embodiment provides;
Fig. 4 is a kind of nozzle side generalized section that the utility model embodiment provides.
Detailed description of the invention
Below in conjunction with drawings and Examples, detailed description of the invention of the present utility model is described in further detail.Following examples for illustration of the utility model, but are not used for limiting scope of the present utility model.
Fig. 1 is a kind of schematic diagram cleaning injection apparatus that the utility model embodiment provides, and this cleaning injection apparatus comprises spray arm 1, spray beam 5 and nozzle 9;
First liquid passage 2 and the first gas passage 4 is provided with in described spray arm 1;
One end of described spray beam 5 is connected with one end of described spray arm 1, second liquid passage 7 and the second gas passage 6 is provided with in described spray beam 5, described second liquid passage 7 is connected with described first liquid passage 2, described second gas passage 6 is connected with described first gas passage 4, described spray beam is also provided with the jet 8 be all connected with described second liquid passage and the second gas passage, described nozzle 9 is arranged on described jet 8.
The cleaning injection apparatus that the utility model embodiment provides can be used for Wafer Cleaning, wherein, first liquid passage and second liquid passage are for transmitting liquid and ultra-pure water, first gas passage and the second gas passage are used for transport gas, as N2, the length of spray beam can cover the radius of cleaning silicon chip, when cleaning silicon chip, spray beam moves to above silicon chip and keeps motionless, disc High Rotation Speed thus realize cleaning to the whole card of silicon chip.
Preferably, can arrange multiple nozzle in spray beam, and multiple nozzle is equidistantly arranged in described spray beam, thus make spray beam form many Nozzle structures, when spraying, liquid or ultra-pure water or N2 can cover whole silicon chip surface.
The cleaning injection apparatus that the utility model embodiment provides, at spray arm and spray beam upper set fluid passage and gas passage, spray beam arranges multiple nozzle, the spray beam mechanism quantity of cleaning chamber can be reduced, simplify the layout of cleaning chamber, and improve the efficiency of cleaning silicon chip.
See the top view that Fig. 2, Fig. 2 are above-mentioned cleaning injection apparatus, wherein, in spray arm, first liquid passage 2 can be multiple, and the plurality of first liquid passage 2 circular row is distributed in the periphery of described first gas passage 4.Such as, can to distribute six road first liquid passages and middle road first gas passage by rowed rings in this spray arm.
Wherein, see Fig. 2, the first chamber 10 and the second chamber 11 is provided with the junction of described spray beam 5 at described spray arm 1, described second liquid passage 7 and described multiple first liquid passage 2 are all connected with described first chamber 10, and described second gas passage 6 and described first gas passage 4 are all connected with described second chamber 11.Wherein, described first chamber 10 is the annular compartment around described second chamber 11.Particularly, the chemical liquid in each first liquid passage can enter annular compartment 10 by spray arm, and leads to the second liquid passage of medical liquid spraying beam by annular compartment 10.
Preferably, see Fig. 1, described first liquid passage 2 is provided with check valve 3, thus can prevent the liquid in annular compartment from blowing back in first liquid passage.
See Fig. 1, in the cleaning injection apparatus that the utility model embodiment provides, described spray beam 5 can be arranged with plane-parallel, described spray arm 1 can be arranged with horizontal plane, preferably, described second gas passage 6 is positioned at the top of described second liquid passage 7, and namely the second gas passage is positioned at the upper strata of spray beam, and second liquid passage is positioned at the lower floor of spray beam.
Wherein, in the utility model, the shape of nozzle 9 can be as shown in Figure 3, see Fig. 4, be provided with the 3rd fluid passage 91 be connected with described second liquid passage 7 and the 3rd gas passage 92 be connected with described second gas passage 6 in described nozzle, the end of described nozzle is provided with the immixture chamber 93 be all connected with described 3rd fluid passage 91 and described 3rd gas passage 92.Preferably, described 3rd fluid passage 91 is arranged around described 3rd gas passage 92, thus make nozzle be formed as the outer liquid type aerial fog nozzle of interior gas, liquids and gases interact under a certain pressure in nozzle end portion, make the drop that large drop breakup becomes small, then are ejected by nozzle, even if also liquid can be broken for small drop under low flow condition, preferably, nozzle form can be tabular morphology, and arranges at an angle with disc.
Wherein, the cleaning injection apparatus that the utility model embodiment provides also comprises rotary actuator and lifting executing agency;
It is that axis does circumference and moves in the horizontal direction with spray arm that described rotary actuator controls described spray beam, and described in described lifting actuating mechanism controls, spray beam moves at vertical direction.In cleaning process, rotary actuator is used for spray beam in cleaning ready position and the translation of silicon chip top position, lifting executing agency is for moving to the Wafer Cleaning height of setting by spray beam, in Wafer Cleaning process, integrated form washing bar is without the need to swinging, first a kind of spray of liquid is carried out, then or carry out the spray of other kind liquids, after liquid cleaning showers completes the spray of ultra-pure water is carried out subsequently, carry out ultra-pure water spray again, finally use N2 to carry out silicon chip drying.
The cleaning injection apparatus that the utility model embodiment provides, at spray arm and spray beam upper set multiple fluid passage and gas passage, wherein multiple fluid passage can be used for transmission ultra-pure water and number of chemical liquid, gas passage is for transmitting N2, and multiple nozzle that distributes at a certain distance in spray beam, and nozzle have employed gas-liquid mixed structure, utilize pneumatic type atomizing principles, in the immixture chamber of nozzle end, liquid is broken for fine droplet under gases at high pressure effect, realize the high-efficiency washing to silicon chip, avoid the damage to silicon chip structure and figure, compare the form of conventional many spray beam, decrease the spray beam mechanism quantity of cleaning chamber, simplify the layout of cleaning chamber.
Above embodiment is only for illustration of the utility model; and be not limitation of the utility model; the those of ordinary skill of relevant technical field; when not departing from spirit and scope of the present utility model; can also make a variety of changes and modification; therefore all equivalent technical schemes also belong to category of the present utility model, and scope of patent protection of the present utility model should be defined by the claims.
Claims (10)
1. a cleaning injection apparatus, is characterized in that, comprises spray arm, spray beam and nozzle;
First liquid passage and the first gas passage is provided with in described spray arm;
One end of described spray beam is connected with one end of described spray arm, second liquid passage and the second gas passage is provided with in described spray beam, described second liquid passage is connected with described first liquid passage, described second gas passage is connected with described first gas passage, described spray beam is also provided with the jet be all connected with the second gas passage with described second liquid passage, described nozzle is arranged on described jet.
2. cleaning injection apparatus according to claim 1, is characterized in that, described first liquid passage is multiple, and described multiple first liquid passage circular row is distributed in described first gas passage periphery.
3. cleaning injection apparatus according to claim 2, it is characterized in that, the junction of described spray arm and described spray beam is provided with the first chamber and the second chamber, described second liquid passage and described multiple first liquid passage are all connected with described first chamber, and described second gas passage and described first gas passage are all connected with described second chamber.
4. cleaning injection apparatus according to claim 3, is characterized in that, described first chamber is the annular compartment around described second chamber.
5. cleaning injection apparatus according to claim 2, is characterized in that, described first liquid passage is provided with check valve.
6. cleaning injection apparatus according to claim 1, is characterized in that, described spray beam and plane-parallel are arranged, and described spray arm and horizontal plane are arranged, and described second gas passage is positioned at above described second liquid passage.
7. cleaning injection apparatus according to claim 1, it is characterized in that, be provided with the 3rd fluid passage be connected with described second liquid passage and the 3rd gas passage be connected with described second gas passage in described nozzle, the end of described nozzle is provided with the immixture chamber be all connected with described 3rd fluid passage and described 3rd gas passage.
8. cleaning injection apparatus according to claim 7, is characterized in that, described 3rd fluid passage is arranged around described 3rd gas passage.
9. cleaning injection apparatus according to claim 1, is characterized in that, described nozzle is multiple, and described nozzle is equidistantly arranged in described spray beam.
10. according to the arbitrary described cleaning injection apparatus of claim 1-9, it is characterized in that, also comprise rotary actuator and lifting executing agency;
It is that axis does circumference and moves in the horizontal direction with spray arm that described rotary actuator controls described spray beam, and described in described lifting actuating mechanism controls, spray beam moves at vertical direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420553337.0U CN204208853U (en) | 2014-09-24 | 2014-09-24 | Cleaning injection apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420553337.0U CN204208853U (en) | 2014-09-24 | 2014-09-24 | Cleaning injection apparatus |
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| Publication Number | Publication Date |
|---|---|
| CN204208853U true CN204208853U (en) | 2015-03-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420553337.0U Active CN204208853U (en) | 2014-09-24 | 2014-09-24 | Cleaning injection apparatus |
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| CN (1) | CN204208853U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110743722A (en) * | 2019-11-06 | 2020-02-04 | 徐州徐工精密工业科技有限公司 | Pressure-adjustable quick spray knife |
| CN111229688A (en) * | 2020-01-19 | 2020-06-05 | 北京北方华创微电子装备有限公司 | Cleaning spray head in wafer cleaning equipment, wafer cleaning method and equipment |
| CN112693228A (en) * | 2020-12-30 | 2021-04-23 | 大族激光科技产业集团股份有限公司 | Rotary liquid injection device and laser processing device |
| WO2022083125A1 (en) * | 2020-10-20 | 2022-04-28 | 长鑫存储技术有限公司 | Nozzle assembly and semiconductor device using same |
-
2014
- 2014-09-24 CN CN201420553337.0U patent/CN204208853U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110743722A (en) * | 2019-11-06 | 2020-02-04 | 徐州徐工精密工业科技有限公司 | Pressure-adjustable quick spray knife |
| CN111229688A (en) * | 2020-01-19 | 2020-06-05 | 北京北方华创微电子装备有限公司 | Cleaning spray head in wafer cleaning equipment, wafer cleaning method and equipment |
| WO2022083125A1 (en) * | 2020-10-20 | 2022-04-28 | 长鑫存储技术有限公司 | Nozzle assembly and semiconductor device using same |
| CN112693228A (en) * | 2020-12-30 | 2021-04-23 | 大族激光科技产业集团股份有限公司 | Rotary liquid injection device and laser processing device |
| CN112693228B (en) * | 2020-12-30 | 2022-04-19 | 大族激光科技产业集团股份有限公司 | Rotary liquid injection device and laser processing device |
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