CN103805998B - Silicon chip wet-method etching equipment and lithographic method thereof - Google Patents
Silicon chip wet-method etching equipment and lithographic method thereof Download PDFInfo
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- CN103805998B CN103805998B CN201410075181.4A CN201410075181A CN103805998B CN 103805998 B CN103805998 B CN 103805998B CN 201410075181 A CN201410075181 A CN 201410075181A CN 103805998 B CN103805998 B CN 103805998B
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- silicon chip
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- reactant liquor
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Abstract
The present invention relates to a kind of silicon chip wet-method etching equipment and lithographic method thereof, including conveying roller, liquid storage box and input duct, there is in liquid storage box liquid storage cavity, liquid storage box is arranged on the top of conveying roller, reactant liquor enters liquid storage box by input duct, and the bottom of liquid storage box arranges the spray hole of the upper surface of multiple silicon chip being sprayed to by reactant liquor and being carried by conveying roller.Reactant liquor uniformly sprays to by silicon chip below from the spray hole of the liquid storage box above silicon chip, makes reactant liquor in silicon chip surface overflow.The invention has the beneficial effects as follows: by spraying reactant liquor, make reactant liquor in silicon chip surface overflow, namely improve the reaction rate of reactant liquor and silicon chip, in turn ensure that etching homogeneity.
Description
Technical field
The present invention relates to silicon chip erosion technical field, particularly a kind of silicon chip wet-method etching equipment and lithographic method thereof.
Background technology
In prior art, silicon chip wet etching technique is divided into two kinds, is dropping liquid and paint-on technique respectively.
Dropping liquid technology: be that reactant liquor (for etching silicon wafer surface) is dropped in silicon chip surface, silicon chip is slowly moved ahead by the roller transmitted.This technical advantage is that silicon chip surface etching homogeneity is good, but the transfer rate of silicon chip can not be too fast, and otherwise the reactant liquor of silicon chip surface is easy to be shaken, and causes silicon chip surface etching uneven.
Paint-on technique: by installing a set of coating roller under dropper additional, medicinal liquid contacts with silicon chip on coating roller, etching silicon wafer.The transfer rate of this kind of technology silicon chip can be accelerated, but etches uneven.Because the medicinal liquid of absorption is not as uniform on coating roller.
Summary of the invention
The technical problem to be solved is: provide a kind of silicon chip wet-method etching equipment and lithographic method thereof, while accelerating silicon chip surface etching speed, it is ensured that the uniformity of etching.
The technical solution adopted for the present invention to solve the technical problems is: a kind of silicon chip wet-method etching equipment, including conveying roller, liquid storage box and input duct, there is in liquid storage box liquid storage cavity, liquid storage box is arranged on the top of conveying roller, reactant liquor enters liquid storage box by input duct, and the bottom of liquid storage box arranges the spray hole of the upper surface of multiple silicon chip being sprayed to by reactant liquor and being carried by conveying roller.
More fast from the flow velocity of the reactant liquor of spray hole outflow, the flow direction of reactant liquor is more unstable, very easily occur that several strands of reactant liquors merge, forming turbulent flow, if there is turbulent flow, then the uniformity of the reactant liquor of silicon chip surface will be deteriorated, after avoiding reactant liquor to flow out from spray hole, will not merge with the reactant liquor of other spray hole, limit further, the annular groove being arranged around the fluid for isolate spray hole ejection concentric with spray hole of each spray hole.
Limiting further, the cross section of annular groove is V-arrangement.
Limiting further, arrange one and more than one separatory pipeline in liquid storage box, input duct is connected with separatory pipeline, and the reactant liquor in input duct passes through separatory pipeline separatory.
Limiting further, arrange two row's spray holes bottom liquid storage box, two row's spray hole staggered relative are arranged, and the orientation often arranging spray hole is vertical with the conveying direction of silicon chip.
The silicon chip wet etching method of this silicon chip wet-method etching equipment is: silicon chip is fed forward by conveying roller, and reactant liquor uniformly sprays to by silicon chip below from the spray hole of the liquid storage box above silicon chip, makes reactant liquor in silicon chip surface overflow.
By regulating the liquid level height in liquid storage box, regulate the flow velocity that reactant liquor flows out from spray hole.
The invention has the beneficial effects as follows: by spraying reactant liquor, make reactant liquor in silicon chip surface overflow, improve the reaction rate of reactant liquor and silicon chip, in turn ensure that etching homogeneity.
By testing, the speed of silicon chip output rises to 3000Pcs/H from 2200Pcs/H, and the uniformity performance of silicon chip surface is good.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the present invention is further described；
Fig. 1 is the structural representation of the silicon chip wet-method etching equipment of the present invention；
Fig. 2 is the polycrystalline substance schematic diagram of the liquid storage box of the present invention；
Fig. 3 is the I place enlarged drawing of Fig. 2；
Fig. 4 is the structural representation of the spray hole of the present invention
In figure, 1. conveying roller, 2. liquid storage box, 3. input duct, 4. silicon chip, 5. spray hole, 6. annular groove, 7. separatory pipeline.
Detailed description of the invention
As shown in Fig. 1,2,3 and 4, a kind of silicon chip wet-method etching equipment, including conveying roller 1, liquid storage box 2 and input duct 3, there is in liquid storage box 2 liquid storage cavity, liquid storage box 2 is arranged on the top of conveying roller 1, and reactant liquor enters liquid storage box 2 by input duct 3, arranges one and more than one separatory pipeline 7 in liquid storage box 2, input duct 3 is connected with separatory pipeline 7, and the reactant liquor in input duct 3 passes through separatory pipeline 7 separatory.The bottom of liquid storage box 2 arranges the spray hole 5 of the upper surface of multiple silicon chip 4 being sprayed to by reactant liquor and being carried by conveying roller 1, and spray hole 5 is divided into two rows, and two row's spray hole 5 staggered relative are arranged, and the orientation often arranging spray hole 5 is vertical with the conveying direction of silicon chip 4.The annular groove 6 being arranged around the fluid for isolate spray hole 5 ejection concentric with spray hole 5 of each spray hole 5.The cross section of annular groove 6 is V-arrangement, forms bellmouth orifice around spray hole, and V-ring groove 6 is easy to process, and isolation effect is good.
A kind of silicon chip wet etching method, silicon chip 4 is fed forward by conveying roller 1, and reactant liquor enters liquid storage box 2 from input duct 3, and the spray hole 5 of the liquid storage box 2 above silicon chip 4 uniformly sprays to by silicon chip 4 below, makes reactant liquor at silicon chip 4 surface overflow.For accelerating the speed of etching reaction, need to accelerating the speed that reactant liquor flows out, the reactant liquor height in the liquid storage cavity of liquid storage box 2 is more high, and the reactant liquor flow velocity flowed out by spray hole 5 is more big, and the etching reaction of silicon chip surface is also more fast.The annular groove 6 of the surrounding of spray hole 5 ensures that liquid will not mix with the reactant liquor in other hole after flowing out in hole.
In actual production, in order to improve production capacity, it is possible to strengthened by the rotating speed of conveying roller 1, and the spacing of silicon chip and liquid storage box 2 is set to be relatively fixed, coordinate the rotating speed of conveying roller 1 by adjusting the height of reactant liquor in liquid storage box 2.
Claims (7)
1. a silicon chip wet-method etching equipment, it is characterized in that: include conveying roller (1), liquid storage box (2) and input duct (3), liquid storage box has liquid storage cavity in (2), liquid storage box (2) is arranged on the top of conveying roller (1), reactant liquor enters liquid storage box (2) by input duct (3), and the bottom of liquid storage box (2) arranges the spray hole (5) of the upper surface of multiple silicon chip (4) being sprayed to by reactant liquor and being carried by conveying roller (1).
2. silicon chip wet-method etching equipment according to claim 1, is characterized in that: each spray hole (5) be arranged around the annular groove (6) that be used for isolate fluid that spray hole (5) spray concentric with spray hole (5).
3. silicon chip wet-method etching equipment according to claim 2, is characterized in that: the cross section of described annular groove (6) is V-arrangement.
4. silicon chip wet-method etching equipment according to claim 1, it is characterized in that: one and more than one separatory pipeline (7) are set in described liquid storage box (2), input duct (3) is connected with separatory pipeline (7), and the reactant liquor in input duct (3) passes through separatory pipeline (7) separatory.
5. silicon chip wet-method etching equipment according to claim 1, it is characterized in that: in described liquid storage box (2) bottom, two row's spray holes (5) are set, two row's spray hole (5) staggered relative are arranged, and the orientation often arranging spray hole (5) is vertical with the conveying direction of silicon chip (4).
6. the silicon chip wet etching method of the silicon chip wet-method etching equipment described in a claim 1, it is characterized in that: silicon chip (4) is fed forward by conveying roller (1), reactant liquor uniformly sprays to by silicon chip (4) below from the spray hole (5) of the liquid storage box (2) of silicon chip (4) top, makes reactant liquor at silicon chip (4) surface overflow.
7. silicon chip wet etching method according to claim 6, is characterized in that: by regulating the liquid level height in liquid storage box (2), regulate the flow velocity that reactant liquor flows out from spray hole (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410075181.4A CN103805998B (en) | 2014-03-03 | 2014-03-03 | Silicon chip wet-method etching equipment and lithographic method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410075181.4A CN103805998B (en) | 2014-03-03 | 2014-03-03 | Silicon chip wet-method etching equipment and lithographic method thereof |
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| Publication Number | Publication Date |
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| CN103805998A CN103805998A (en) | 2014-05-21 |
| CN103805998B true CN103805998B (en) | 2016-07-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410075181.4A Active CN103805998B (en) | 2014-03-03 | 2014-03-03 | Silicon chip wet-method etching equipment and lithographic method thereof |
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| CN (1) | CN103805998B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106449492B (en) * | 2016-12-15 | 2023-05-26 | 常州亿晶光电科技有限公司 | Water film dewatering device for etched silicon wafer |
| CN109119368B (en) * | 2018-10-08 | 2023-09-29 | 广西中科蓝谷半导体科技有限公司 | Control device for wafer production etching uniformity |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85202323U (en) * | 1985-06-19 | 1986-12-10 | 耿文学 | Shower nozzle with flow in drops |
| CN1925723A (en) * | 2005-08-31 | 2007-03-07 | 显示器生产服务株式会社 | Substrate processing device |
| CN200964439Y (en) * | 2006-10-20 | 2007-10-24 | 扬博科技股份有限公司 | Etching device for circuit board |
| CN201579135U (en) * | 2009-12-16 | 2010-09-15 | 深圳成霖洁具股份有限公司 | Low-flow and efficient shower nozzle |
| CN203754809U (en) * | 2014-03-03 | 2014-08-06 | 常州天合光能有限公司 | Silicon wafer wet-etching equipment |
-
2014
- 2014-03-03 CN CN201410075181.4A patent/CN103805998B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN85202323U (en) * | 1985-06-19 | 1986-12-10 | 耿文学 | Shower nozzle with flow in drops |
| CN1925723A (en) * | 2005-08-31 | 2007-03-07 | 显示器生产服务株式会社 | Substrate processing device |
| CN200964439Y (en) * | 2006-10-20 | 2007-10-24 | 扬博科技股份有限公司 | Etching device for circuit board |
| CN201579135U (en) * | 2009-12-16 | 2010-09-15 | 深圳成霖洁具股份有限公司 | Low-flow and efficient shower nozzle |
| CN203754809U (en) * | 2014-03-03 | 2014-08-06 | 常州天合光能有限公司 | Silicon wafer wet-etching equipment |
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| CN103805998A (en) | 2014-05-21 |
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Address after: 213031, No. 2, Tianhe Road, Xinbei Industrial Park, Jiangsu, Changzhou Patentee after: TRINA SOLAR Co.,Ltd. Address before: 213031, No. 2, Tianhe Road, Xinbei Industrial Park, Jiangsu, Changzhou Patentee before: trina solar Ltd. Address after: 213031, No. 2, Tianhe Road, Xinbei Industrial Park, Jiangsu, Changzhou Patentee after: trina solar Ltd. Address before: 213031, No. 2, Tianhe Road, Xinbei Industrial Park, Jiangsu, Changzhou Patentee before: CHANGZHOU TRINA SOLAR ENERGY Co.,Ltd. |