CN111640689A - Cleaning device and cleaning chamber - Google Patents
Cleaning device and cleaning chamber Download PDFInfo
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- CN111640689A CN111640689A CN201910157192.XA CN201910157192A CN111640689A CN 111640689 A CN111640689 A CN 111640689A CN 201910157192 A CN201910157192 A CN 201910157192A CN 111640689 A CN111640689 A CN 111640689A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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Abstract
The invention provides a cleaning device and a cleaning chamber, which are used for cleaning the surface of a wafer placed on a base and comprise a fixing plate, a plurality of spray heads and a plurality of spray pipelines, wherein the fixing plate is arranged above the base; the plurality of spray heads are arranged on one surface of the fixing plate facing the base and are used for spraying cleaning media towards the surface of the wafer; the plurality of spray lines are used for conveying different types of cleaning media, and each spray line is connected with at least one spray head so as to be capable of selectively spraying one of the cleaning media towards the surface of the wafer through the at least one spray head. The cleaning device and the cleaning chamber provided by the invention can shorten the time for switching between different cleaning media, so that the wafers can be cleaned continuously, the cleaning efficiency is improved, the height of the cleaning chamber can be reduced, the stacking number of the cleaning chamber in the cleaning machine is increased, and the production efficiency of the wafers is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor equipment, in particular to a cleaning device and a cleaning chamber.
Background
Currently, in semiconductor processing, wafers are usually subjected to multiple process steps such as thin film deposition, etching, polishing, etc. The essential of these process steps is the generation of contaminants on the wafer surface, and in order to keep the wafer surface clean and eliminate the contaminants deposited on the wafer surface during the various process steps, the wafer is cleaned after each process step. Therefore, the cleaning process is very important in the semiconductor processing process.
In the existing wafer cleaning machine, a plurality of layers of cleaning chambers are generally stacked, and a rotating platform and a plurality of spray arms arranged around the rotating platform are arranged in the cleaning chambers, wherein the rotating platform is used for placing a wafer, the plurality of spray arms are used for respectively spraying different cleaning agents and drying agents to the surface of the wafer, and can be lifted or swung relative to the rotating platform, in the cleaning process of the wafer, the wafer is placed on the rotating platform and rotates at a certain speed, a first spray arm in the plurality of spray arms is lifted and swung from an initial position to a spray position to spray a first cleaning agent to the surface of the wafer, after the first cleaning agent is sprayed, the first spray arm is lifted and swung to the initial position, then a second spray arm is lifted and swung from the initial position to the spray position to spray a second cleaning agent to the surface of the wafer, after the cleaning step is finished, the spray arm for spraying the drying agent is lifted and swung to a spray position from the initial position, and the drying agent is sprayed on the surface of the wafer, so that the surface of the wafer is cleaned.
In the prior art, however, each spray arm is lifted and swung from an initial position to a spray position before work is performed, and then lifted and swung from the spraying position to the initial position after the work, which results in that during the cleaning process of the wafer, a lot of time is spent on lifting and swinging the spray arm, so that the time of the cleaning process is long, the working efficiency is low, and is not beneficial to the uninterrupted cleaning of the wafer, and one spray arm needs to be staggered with the other spray arm in the lifting and swinging process, to avoid collision among the spray arms, which requires that the spray arms be raised above the height at which they spray, therefore, the height of the cleaning chamber in the stacking direction of the chambers is high, the stacking number of the cleaning chambers in the cleaning machine is limited, the number of the wafers cleaned by the cleaning machine in unit time is limited, and the production efficiency of the wafers is limited.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a cleaning device and a cleaning chamber, which can shorten the time for switching between different cleaning media so as to continuously clean wafers, improve the cleaning efficiency, reduce the height of the cleaning chamber, increase the stacking number of the cleaning chamber in a cleaning machine, and improve the production efficiency of the wafers.
To achieve the object of the present invention, there is provided a cleaning apparatus for cleaning a surface of a wafer placed on a susceptor, comprising a fixing plate, a plurality of spray heads, and a plurality of spray lines, wherein,
the fixing plate is arranged above the base;
the plurality of spray heads are arranged on one surface of the fixing plate facing the base and are used for spraying cleaning media towards the surface of the wafer;
the plurality of spray pipes are used for conveying different cleaning media, and each spray pipe is connected with at least one spray head so as to be capable of selectively spraying one cleaning medium towards the surface of the wafer through at least one spray head.
Preferably, the plurality of spray heads are divided into a plurality of groups of spray head groups, and the number of the groups of spray head groups is the same as the number of the spray pipelines and corresponds to the spray pipelines one by one; at least one said spray head in each said spray head group; and all the spray heads in each group of spray head groups are connected with the spray pipelines corresponding to the group of spray head groups.
Preferably, each of the spraying pipelines is connected with all of the nozzles.
Preferably, each of the nozzles is uniformly distributed on the fixing plate along a diameter direction corresponding to the base.
Preferably, each nozzle is uniformly distributed on the fixing plate in a circular ring shape corresponding to the center of the circle of the base.
Preferably, the wafer cleaning device further comprises a ring body surrounding the base, a plurality of recovery channels are arranged in the ring body, the recovery channels comprise a plurality of recovery ports arranged along the circumferential direction of the ring body and used for recovering the cleaning medium thrown out of the surface of the wafer under the action of centrifugal force generated by rotation of the base, and the recovery ports of the recovery channels are arranged at intervals along the axial direction of the ring body.
Preferably, the cleaning device further includes a first lifting mechanism, and the first lifting mechanism is configured to drive the ring body to ascend or descend relative to the base, so that the height of the ring body satisfies that different types of cleaning media can enter recovery ports of different recovery channels in a one-to-one correspondence manner.
Preferably, the wafer cleaning device further comprises a recovery tank, wherein the recovery tank is arranged below the pedestal and is used for recovering the cleaning medium flowing out of the surface of the wafer.
Preferably, the cleaning medium comprises a cleaning gas or a cleaning spray;
the cleaning device also comprises an air exhaust channel which is arranged in the fixed plate and/or the ring body and is used for exhausting the cleaning medium sprayed on the surface of the wafer.
Preferably, the fixing device further comprises a second lifting mechanism, and the second lifting mechanism is used for driving the fixing plate to ascend or descend.
Preferably, the edge shower nozzle also comprises a plurality of edge shower nozzles, and the edge shower nozzles are arranged at the included angle between the ring body and the fixed plate at intervals along the circumferential direction of the ring body; or the edge nozzles are arranged at the edge of the fixing plate and are distributed at intervals along the circumferential direction of the fixing plate; or the edge nozzles are arranged at the top edge of the ring body and are distributed at intervals along the circumferential direction of the ring body; the edge shower is used for spraying the cleaning medium towards the edge area of the wafer surface in an inclined mode.
The invention also provides a cleaning chamber comprising the cleaning device.
The invention has the following beneficial effects:
the invention provides a cleaning device, which is used for cleaning a wafer placed on a base and comprises a fixed plate, a plurality of spray heads and a plurality of spray pipelines, wherein the fixed plate is arranged above the base, each spray pipeline is connected with at least one spray head, the plurality of spray heads are arranged on one surface of the fixed plate facing the base and are used for spraying cleaning media towards the surface of the wafer, the plurality of spray pipelines are used for conveying different types of cleaning media, and each spray pipeline is connected with at least one spray head so as to be capable of selectively spraying one cleaning medium towards the surface of the wafer through at least one spray head, compared with the prior art, the cleaning device does not need to be provided with a swinging spray arm, so that the time for switching between different cleaning media can be shortened, the wafers can be cleaned continuously, the cleaning efficiency is improved, the height of the cleaning device in the cleaning chamber can be reduced, the height of the cleaning chamber can be reduced, the stacking quantity of the cleaning chamber in the cleaning machine is increased, and the production efficiency of the wafers is improved.
The cleaning chamber comprises a base and the cleaning device provided by the invention, and is used for cleaning the wafer placed on the base.
Drawings
FIG. 1 is a schematic structural diagram of a cleaning apparatus provided in the present invention;
description of reference numerals:
11-a fixed plate; 12-a spray head; 13-a ring body; 14-a recovery channel; 15-a first lifting mechanism; 16-a second lifting mechanism; 17-edge shower; 21-a base; 22-a wafer; 23-chuck.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the following describes the cleaning device and the cleaning chamber provided by the present invention in detail with reference to the attached drawings.
As shown in fig. 1, the present embodiment provides a cleaning apparatus for cleaning a surface of a wafer 22 placed on a susceptor 21, comprising a fixed plate 11, a plurality of shower heads 12 and a plurality of shower lines, wherein the fixed plate 11 is disposed above the susceptor 21; a plurality of spray heads 12 are arranged on one surface of the fixed plate 11 facing the base 21 and used for spraying cleaning media towards the surface of the wafer 22; a plurality of spray lines are used to deliver different types of cleaning media, and each spray line is connected to at least one showerhead 12 to enable selective spraying of one of the cleaning media through the at least one showerhead 12 toward the surface of the wafer 22.
The cleaning device provided by the embodiment only needs to convey different types of cleaning media by means of the plurality of spraying pipelines in the process of switching between different types of cleaning media, so that one type of cleaning media can be selectively sprayed towards the surface of the wafer 22 through the at least one spray head 12.
Specifically, in the process of switching between different cleaning media, the cleaning device provided in this embodiment can switch between different cleaning media without adjusting the position of the spray head 12 or the spray pipe, and only by changing the type of the cleaning medium sprayed by the cleaning device through at least one spray head 12, so as to shorten the time for switching between different cleaning media, so as to continuously clean the wafer 22, and improve the cleaning efficiency, and because the fixing plate 11 and the spray head 12 are disposed above the base 21, and do not need to be moved, the fixing plate 11 and the spray head 12 can be directly disposed at the spraying position, so as to reduce the height of the cleaning device in the vertical direction, and also reduce the height of the cleaning device in the cleaning chamber, so that the height of the cleaning chamber has a reduced space, and by lowering the height of the cleaning chamber, the number of cleaning chambers stacked in the washer can be increased to increase the number of wafers 22 cleaned per unit time by a single washer, thereby increasing the production efficiency of the wafers 22.
In this embodiment, the cleaning medium is not limited to cleaning the wafer 22, and the wafer 22 may be dried by spraying saturated steam of water onto the surface of the wafer 22 through the showerhead 12 when the cleaning medium is saturated steam of water.
In practical applications, the showerhead 12 sprays only one of different cleaning media onto the surface of the wafer 22 at a time to avoid interaction between the cleaning media and affect the processing performance of the wafer 22. The type of cleaning medium can be adjusted according to the process requirements.
In the present embodiment, the plurality of nozzles 12 are divided into a plurality of groups of nozzles 12, and the number of the groups of the nozzles 12 is the same as the number of the spraying pipes, and the groups correspond to one another; each group of spray heads 12 has at least one spray head 12; and all the spray heads 12 in each group of spray heads 12 are connected with the corresponding spray pipelines of the group of spray heads 12. Specifically, each group of nozzles 12 is connected to its corresponding spray line, and when cleaning media are switched, the spray line for delivering the cleaning media is selected and connected to the corresponding group of nozzles 12 to change the cleaning media sprayed from the nozzles 12 to the surface of the wafer 22, thereby implementing switching between different cleaning media, and this design can avoid the different cleaning media reacting with each other in the nozzles 12 to block the nozzles 12 and affect the normal operation of the nozzles 12.
Optionally, each spray line is connected to all of the spray heads 12 so that cleaning medium delivered by any one of the spray lines can be sprayed toward the surface of the wafer 22 by selectively connecting the spray line. Specifically, when cleaning media are switched, a spray pipeline for conveying the required cleaning media is selected, and the selected spray pipeline is communicated with all the spray heads 12 to change the cleaning media sprayed from the spray heads 12 to the surface of the wafer 22, so that switching between different types of cleaning media is realized, more cleaning media can be sprayed at the same time by the design mode, and the efficiency of cleaning the surface of the wafer 22 is improved.
In practical applications, the shower pipe may be disposed in the fixed ceiling, and the shower head 12 may be embedded in the fixed plate 11 to reduce the height of the cleaning apparatus in the vertical direction. The cleaning media conveyed by each spray pipeline to the corresponding spray head 12 group are different, or part of the spray pipelines are the same cleaning media, so that the requirement that the plurality of spray pipelines include all the cleaning media required by the process can be met.
In practical applications, the base 21 is further provided with a chuck 23 for fixing the substrate relative to the base 21, and a device for cleaning the back surface of the wafer 22 can be further provided between the base 21 and the chuck 23 to improve the cleaning effect of the wafer 22.
In the present embodiment, the nozzles 12 are uniformly distributed on the fixed plate 11 in the diameter direction of the corresponding susceptor 21.
Specifically, the susceptor 21 is rotated on its own axis during the cleaning process, and the heads 12 are disposed on the fixed plate 11 and uniformly distributed along the diameter direction of the susceptor 21, so that the heads 12 can pass through the circumference around the center of the susceptor 21 during the rotation of the susceptor 21, thereby improving the uniformity of cleaning of the wafer 22 by the heads 12.
In practical applications, the center of the wafer 22 is usually overlapped with the center of the susceptor 21, and the center of the fixing plate 11 may also be overlapped with the susceptor 21, so that all the nozzles 12 in each group of nozzles 12 may be arranged along the same diameter direction of the circumference with the center of the fixing plate 11 as the center of the circle, so as to reduce the processing difficulty.
In the present embodiment, the nozzles 12 are uniformly distributed on the fixing plate 11 in a circular shape corresponding to the center of the susceptor 21, and the nozzles 12 may pass through the circumference of the susceptor 21 as the center of the susceptor 21 during the rotation of the susceptor 21, thereby improving the uniformity of cleaning the wafer 22 by the nozzles 12.
In practical application, a plurality of groups of nozzles may be arranged to be uniformly distributed with respect to the center of a circle, that is, the intervals between adjacent groups of nozzles 12 are the same, so as to improve the uniformity of cleaning the wafer 22, and in addition, the intervals between adjacent nozzles 12 in each group of nozzles 12 may be the same, so as to improve the uniformity of cleaning the wafer 22.
In this embodiment, the cleaning apparatus further includes a ring 13 surrounding the base 21, and a plurality of recovery channels 14 are provided in the ring 13, the plurality of recovery channels 14 include a plurality of recovery ports provided along the circumference of the ring 13 for recovering the cleaning medium thrown from the surface of the wafer 22 under the action of the centrifugal force generated by the rotation of the base 21, and the recovery ports of the plurality of recovery channels 14 are provided at intervals along the axial direction of the ring 13; and the number of the plurality of discharge channels is the same as the number of kinds of the cleaning media.
Specifically, the inner peripheral wall of the ring body 13, the lower surface of the fixing plate 11 and the upper surface of the base 21 form a semi-closed or fully-closed space. With such a design, the cleaning device and the base 21 can be used as independent chambers to clean and dry the surface of the wafer 22, so that the structure of the cleaning device is compact, and the space occupied by the cleaning device is reduced. In addition, a lift gate for moving the wafer 22 in and out may be provided in the ring body 13, so that the cleaning apparatus itself can form an independent cleaning chamber. Furthermore, the cleaning medium is recovered by the plurality of recovery channels 14 arranged in the ring body 13, so that the cleaning medium can be prevented from polluting parts such as the cleaning chamber or the base 21, the utilization rate of the ring body 13 can be improved, and compared with the prior art, the height of the cleaning device can be further reduced by arranging the recovery groove below the base 21. In addition, the circumferences of the recovery ports of the plurality of recovery channels 14 are arranged at intervals along the axial direction of the ring body 13; also, the number of the plurality of discharge passages is the same as the number of kinds of the cleaning medium, that is, the recovery ports of the plurality of recovery passages 14 are arranged at intervals in the vertical direction along the height of the ring body 13.
In practical application, recovery channel 14 can also be the annular groove that sets up along the circumference of ring body 13 to set up a plurality of recovery mouths that communicate with the external world along the circumference interval of ring body 13 in the annular groove, cleaning medium is thrown to the annular groove under the rotatory centrifugal force effect that produces of base 21, and the area of annular groove is great, can improve the probability that cleaning medium got into recovery channel 14, avoids cleaning medium flow to other places.
In this embodiment, the cleaning device further comprises a first lifting mechanism 15, and the first lifting mechanism 15 is used for driving the ring body 13 to ascend or descend relative to the base 21, so that the height of the ring body 13 is enough to enable different types of cleaning media to enter the recovery ports of different recovery channels 14 in a one-to-one correspondence manner.
In practical application, the first lifting mechanism 15 drives the ring body 13 to ascend or descend relative to the base 21, so that the cleaning medium is thrown into the recovery ports of the recovery channels 14 arranged at intervals in the axial direction of the ring body 13 under the action of centrifugal force generated by rotation of the base 21, and the cleaning media of different types are prevented from reacting with each other in the recovery ports of the recovery channels 14 to block the recovery ports of the recovery channels 14, so that the recovery of the cleaning medium is prevented from being influenced.
In this embodiment, the cleaning apparatus further includes a recovery tank disposed below the susceptor 21 for recovering the cleaning medium flowing out from the surface of the wafer 22. In practice, the cleaning medium must never enter the recovery channel 14, but flows down the interior of the annulus 13, recovering this part of the cleaning medium through the recovery tank, in order to avoid contamination of the cleaning chamber by the cleaning medium.
In this embodiment, the cleaning medium comprises a cleaning gas or cleaning spray; the cleaning apparatus further comprises an air exhaust channel provided in the fixed plate 11 and/or the ring body 13 for exhausting the cleaning medium after spraying the surface of the wafer 22. Specifically, when the cleaning medium is the cleaning gas or the cleaning mist, the cleaning medium cannot be completely discharged from the recovery passage 14 by the centrifugal force generated by the rotation of the base 21, and the cleaning gas or the cleaning mist can be pumped out through the pumping passage to prevent the cleaning medium from remaining or contaminating the cleaning chamber. In addition, the air exhaust channel can also play a role in adjusting the direction of air flow in the cleaning cavity.
In practical applications, Fan Filter Units (FFUs) may be provided in the stationary plate 11 and/or the ring body 13 for extracting the cleaning gas or cleaning spray.
In this embodiment, a second lifting mechanism 16 is further included, and the second lifting mechanism 16 is used for driving the fixing plate 11 to ascend or descend. The second lifting mechanism 16 may include a motor and a lead screw, and may also include a cylinder and a lift rod, but is not limited thereto, and in practical applications, the distance between the fixing plate 11 and the wafer 22 may be adjusted according to process requirements, so as to adjust the distance between the showerhead 12 and the wafer 22, thereby achieving process effects.
In the embodiment, the distance between the surface of the fixing plate 11 facing the susceptor 21 and the surface of the susceptor 21 for supporting the wafer 22 is in the range of 1cm to 5cm, but the distance is not limited thereto and can be adjusted according to the process requirements.
In this embodiment, the types of cleaning media include at least one of isopropyl alcohol liquid, saturated steam of water, nitrogen gas, and inert gas.
In practical application, the device on the wafer 22 itself has a thin film pattern with a width of tens to hundreds of nanometers, when drying, if water is directly sprayed on the wafer 22, the water will generate a large capillary force in the pattern, and pull the pattern towards the middle, causing a part of the pattern to distort and deform, the magnitude of the capillary force is related to the surface tension between the cleaning medium itself and the pattern and the air, and the damage to the pattern of the wafer 22 can be reduced by using a medium with a surface tension smaller than that of water, such as isopropyl alcohol (IPA) for drying; the saturated steam drying using water can increase the surface tension between the pattern and the air, and also can reduce the influence of the damage of the pattern due to the surface tension during drying.
In this embodiment, the cleaning device further includes a plurality of edge nozzles 17, the edge nozzles 17 are disposed at an angle between the ring body 13 and the fixing plate 11 at intervals along the circumferential direction of the ring body 13; alternatively, a plurality of edge nozzles 17 are disposed at the edge of the fixing plate 11 and distributed at intervals along the circumferential direction of the fixing plate 11; alternatively, the edge nozzles 17 are arranged at the top edge of the ring body 13 and are distributed at intervals along the circumferential direction of the ring body 13; the edge shower 17 is used to spray cleaning medium obliquely toward the edge region of the surface of the wafer 22.
In practical applications, the edge region of the wafer 22 is difficult to be cleaned completely, and the edge shower head 17 sprays the cleaning medium toward the edge region of the surface of the wafer 22 from a direction inclined with respect to the edge region of the surface of the wafer 22, that is, toward the edge region of the surface of the wafer 22 where the edge shower head 17 is inclined, thereby improving the effect of cleaning the edge region of the surface of the wafer 22
The embodiment also provides a cleaning chamber, which comprises a base 21 and the cleaning device provided by the embodiment, and is used for cleaning the surface of the wafer 22 placed on the base 21.
The cleaning chamber provided by the embodiment of the invention can shorten the time for switching between different cleaning media for cleaning the wafer 22 continuously, thereby improving the cleaning efficiency, reducing the height of the cleaning chamber, and increasing the stacking number of the cleaning chambers in the cleaning machine, thereby improving the production efficiency of the wafer 22.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (12)
1. A cleaning apparatus for cleaning the surface of a wafer placed on a susceptor, comprising a fixing plate, a plurality of spray heads and a plurality of spray lines, wherein,
the fixing plate is arranged above the base;
the plurality of spray heads are arranged on one surface of the fixing plate facing the base and are used for spraying cleaning media towards the surface of the wafer;
the plurality of spray pipes are used for conveying different cleaning media, and each spray pipe is connected with at least one spray head so as to be capable of selectively spraying one cleaning medium towards the surface of the wafer through at least one spray head.
2. The cleaning device according to claim 1, wherein a plurality of the spray heads are divided into a plurality of groups of spray heads, and the number of the groups of the spray heads is the same as the number of the spray pipelines and corresponds to one another; at least one said spray head in each said spray head group; and all the spray heads in each group of spray head groups are connected with the spray pipelines corresponding to the group of spray head groups.
3. The cleaning apparatus defined in claim 1, wherein each of the spray lines is connected to all of the spray heads.
4. The cleaning apparatus as claimed in claim 1, wherein each of the nozzles is uniformly distributed on the fixing plate in a diameter direction corresponding to the base.
5. The cleaning device as claimed in claim 1, wherein each of the nozzles is uniformly distributed in a circular ring shape on the fixing plate corresponding to a center of the base.
6. The cleaning apparatus as claimed in any one of claims 1 to 5, further comprising a ring surrounding the susceptor, and a plurality of recovery channels are provided in the ring, the plurality of recovery channels include a plurality of recovery ports provided along a circumferential direction of the ring for recovering the cleaning medium thrown from the surface of the wafer by a centrifugal force generated by rotation of the susceptor, and the recovery ports of the plurality of recovery channels are provided at intervals along an axial direction of the ring at a circumference thereof.
7. The cleaning device of claim 6, further comprising a first lifting mechanism for driving the ring to ascend or descend relative to the base so that the height of the ring is sufficient to enable different types of cleaning media to enter recovery ports of different recovery channels in a one-to-one correspondence.
8. The cleaning apparatus as claimed in claim 6, further comprising a recovery tank disposed below the susceptor for recovering the cleaning medium flowing from the surface of the wafer.
9. The cleaning device of claim 6, wherein the cleaning medium comprises a cleaning gas or a cleaning spray;
the cleaning device also comprises an air exhaust channel which is arranged in the fixed plate and/or the ring body and is used for exhausting the cleaning medium sprayed on the surface of the wafer.
10. The cleaning apparatus as claimed in claim 1, further comprising a second elevating mechanism for driving the fixed plate to ascend or descend.
11. The cleaning device of claim 6, further comprising a plurality of edge nozzles, wherein the edge nozzles are arranged at an included angle between the ring body and the fixing plate at intervals along the circumferential direction of the ring body; or the edge nozzles are arranged at the edge of the fixing plate and are distributed at intervals along the circumferential direction of the fixing plate; or the edge nozzles are arranged at the top edge of the ring body and are distributed at intervals along the circumferential direction of the ring body; the edge shower is used for spraying the cleaning medium towards the edge area of the wafer surface in an inclined mode.
12. A cleaning chamber comprising a cleaning device according to any one of claims 1 to 13.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910157192.XA CN111640689A (en) | 2019-03-01 | 2019-03-01 | Cleaning device and cleaning chamber |
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| CN201910157192.XA CN111640689A (en) | 2019-03-01 | 2019-03-01 | Cleaning device and cleaning chamber |
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| CN112201593A (en) * | 2020-09-23 | 2021-01-08 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment |
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| CN112509946A (en) * | 2020-12-01 | 2021-03-16 | 宁波瑞曼特新材料有限公司 | Multifunctional wafer etching and cleaning device and use method |
| CN113140488A (en) * | 2021-04-21 | 2021-07-20 | 瀚天天成电子科技（厦门）有限公司 | Wafer cleaning device |
| CN114643223A (en) * | 2022-03-31 | 2022-06-21 | 北京北方华创微电子装备有限公司 | Cleaning device |
| CN114671489A (en) * | 2020-12-24 | 2022-06-28 | 中国科学院微电子研究所 | Semiconductor cleaning device and method |
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