CN114671489A - Semiconductor cleaning device and method - Google Patents
Semiconductor cleaning device and method Download PDFInfo
- Publication number
- CN114671489A CN114671489A CN202011555122.9A CN202011555122A CN114671489A CN 114671489 A CN114671489 A CN 114671489A CN 202011555122 A CN202011555122 A CN 202011555122A CN 114671489 A CN114671489 A CN 114671489A
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- CN
- China
- Prior art keywords
- cleaning
- concentration
- cleaning liquid
- liquid
- cleaned
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 152
- 239000004065 semiconductor Substances 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims description 51
- 239000007788 liquid Substances 0.000 claims abstract description 123
- 238000003860 storage Methods 0.000 claims abstract description 39
- 239000002699 waste material Substances 0.000 claims abstract description 32
- 239000002351 wastewater Substances 0.000 claims abstract description 21
- 238000007599 discharging Methods 0.000 claims abstract description 4
- 238000004064 recycling Methods 0.000 claims description 6
- 238000005507 spraying Methods 0.000 claims description 3
- 238000005406 washing Methods 0.000 description 8
- 239000000126 substance Substances 0.000 description 6
- 238000004891 communication Methods 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 238000011084 recovery Methods 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F1/00—Treatment of water, waste water, or sewage
- C02F1/38—Treatment of water, waste water, or sewage by centrifugal separation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2103/00—Nature of the water, waste water, sewage or sludge to be treated
- C02F2103/34—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32
- C02F2103/346—Nature of the water, waste water, sewage or sludge to be treated from industrial activities not provided for in groups C02F2103/12 - C02F2103/32 from semiconductor processing, e.g. waste water from polishing of wafers
Abstract
The invention provides a semiconductor cleaning device, comprising: a first discharge pipe for discharging the cleaning liquid; a waste water storage tank for containing low-concentration cleaning liquid; the second discharge pipeline is used for communicating the first discharge pipeline with the wastewater storage tank in a switchable manner; a waste liquid storage tank for containing high-concentration cleaning liquid; the third discharge pipeline is used for communicating the first discharge pipeline with the waste liquid storage tank in a switchable manner; and the concentration measuring sensor is used for measuring the concentration of the cleaning liquid in the first discharge pipeline and controlling the opening and closing of the second discharge pipeline and the third discharge pipeline according to the concentration of the cleaning liquid. The invention can accurately classify the recovered cleaning liquid, improve the resource utilization rate and reduce the pollution.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor cleaning device and a semiconductor cleaning method.
Background
In a semiconductor cleaning process, cleaning liquid is generally recycled, waste of chemical liquid is reduced, resources are saved, discharge of the chemical liquid is reduced, and pollution is reduced. In the prior art, a time control mode is adopted according to the characteristics of a cleaning process, so that the cleaning liquid in the cleaning process in the previous period is recovered to a waste water storage tank, and the cleaning liquid in the cleaning process in the later period is recovered to a waste liquid storage tank.
In the process of implementing the invention, the inventor finds that at least the following technical problems exist in the prior art:
in the prior art, the recovery of the waste water and the waste liquid is realized only by time estimation, and the currently recovered cleaning liquid can not be accurately judged to be the waste water or the waste liquid in real time, so that the resource recycling is not facilitated and the pollution is reduced. When the waste liquid is recycled, sometimes the concentration of the waste liquid is lower than the standard value, and chemical liquid is still added to ensure that the concentration of the waste liquid reaches the standard before the waste liquid is recycled, so that the waste of the chemical liquid is caused.
Disclosure of Invention
The semiconductor cleaning device and the semiconductor cleaning method provided by the invention can accurately classify the recovered cleaning liquid, improve the resource utilization rate and reduce pollution.
In a first aspect, a semiconductor cleaning apparatus is provided, including:
a first discharge pipe for discharging the cleaning liquid;
a waste water storage tank for containing low-concentration cleaning liquid;
the second discharge pipeline is used for communicating the first discharge pipeline with the wastewater storage tank in a switchable manner;
a waste liquid storage tank for containing high-concentration cleaning liquid;
the third discharge pipeline is used for communicating the first discharge pipeline with the waste liquid storage tank in a switchable manner;
and the concentration measuring sensor is used for measuring the concentration of the cleaning liquid in the first discharge pipeline and controlling the opening and closing of the second discharge pipeline and the third discharge pipeline according to the concentration of the cleaning liquid.
Optionally, the cleaning device further comprises a process cavity for providing a space for a wafer cleaning process so that the cleaning solution is collected in the process cavity, wherein a nozzle is arranged at the top of the process cavity and used for spraying the cleaning solution to the wafer to be cleaned; and a cleaning liquid outlet is formed in the bottom of the process cavity and communicated with the first discharge pipeline.
Optionally, the cleaning device further comprises a rotating base arranged in the process chamber, wherein the rotating base is used for supporting the wafer to be cleaned and driving the wafer to be cleaned to rotate.
Optionally, the first discharge conduit, the second discharge conduit and the third discharge conduit are in communication by a three-way valve.
In a second aspect, a semiconductor cleaning method is provided, including:
cleaning a wafer to be cleaned, and measuring the concentration of the discharged cleaning solution in real time;
and classifying and recycling the discharged cleaning liquid according to the concentration of the cleaning liquid.
Optionally, the classifying and recovering the discharged cleaning solution according to the concentration of the cleaning solution includes:
recovering the cleaning liquid with the concentration lower than the preset threshold value to a waste water storage tank;
and recovering the cleaning liquid with the concentration higher than the preset threshold value to the waste liquid storage tank.
Optionally, the classifying and recycling the discharged cleaning liquid according to the concentration of the cleaning liquid includes:
and the concentration of the cleaning liquid is measured by adopting a concentration measuring sensor, and the opening and closing of a three-way valve are controlled according to the concentration measured by the concentration measuring sensor, so that the cleaning liquid enters a waste water storage tank or a waste liquid storage tank.
Optionally, the cleaning the wafer to be cleaned, and measuring the concentration of the discharged cleaning solution in real time includes:
and when the wafer to be cleaned is cleaned, cleaning is carried out in the process cavity so that the cleaning solution is collected in the process cavity.
Optionally, the cleaning the wafer to be cleaned, and measuring the concentration of the discharged cleaning solution in real time includes:
when the wafer to be cleaned is cleaned, the wafer to be cleaned is driven to rotate by adopting a rotating base.
According to the technical scheme provided by the invention, the recycled cleaning liquid is classified according to the concentration of the recycled cleaning liquid, the concentration of the recycled cleaning liquid is measured in real time, the cleaning liquid with different concentrations is discharged to the waste water liquid storage tank and the waste liquid storage tank, the recycled cleaning liquid is fully recycled, and the waste of resources and the pollution can be reduced.
Drawings
Fig. 1 is a schematic view of a semiconductor cleaning apparatus according to an embodiment of the present invention.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.
An embodiment of the present invention provides a semiconductor cleaning apparatus, including: a first discharge pipe 1 for discharging the cleaning liquid; a waste water storage tank 3 for containing low-concentration cleaning liquid; the second discharge pipeline 2 is used for communicating the first discharge pipeline 1 with the wastewater storage tank 3 in a switchable manner; a waste liquid storage tank 5 for containing high-concentration cleaning liquid; a third discharge pipe 4 for opening and closing the first discharge pipe 1 and the waste liquid storage tank 5; a concentration measuring sensor 6 for measuring a cleaning liquid concentration of the first discharge conduit 1 and controlling opening and closing of the second discharge conduit 2 and the third discharge conduit 4 according to the cleaning liquid concentration. In this embodiment, the first discharge pipe 1 is a general discharge pipe, and discharges the cleaning solution after the wafer cleaning, and all the cleaning solution needs to be discharged through the first discharge pipe 1. The second discharge pipeline 2 discharges the cleaning liquid with low concentration, when the concentration of the cleaning liquid is lower, the first discharge pipeline 1 is communicated with the second discharge pipeline 2, and the cleaning liquid is discharged to the waste water liquid storage tank 3 through the first discharge pipeline 1 and the second discharge pipeline 2. The third discharge pipeline 4 discharges the cleaning liquid with high concentration, when the concentration of the cleaning liquid is higher, the first discharge pipeline 1 is communicated with the third discharge pipeline 4, and the cleaning liquid is discharged to the waste liquid storage tank 5 through the first discharge pipeline 1 and the third discharge pipeline 4.
As an optional implementation manner, the cleaning device further includes a process chamber 8, configured to provide a space for a wafer cleaning process, so that the cleaning solution is collected in the process chamber, a nozzle 10 is disposed at a top of the process chamber 8, and the nozzle 10 is configured to spray the cleaning solution to the wafer to be cleaned; and a cleaning liquid outlet is formed in the bottom of the process cavity 8 and communicated with the first discharge pipeline 1. In the cleaning process, the cleaning liquid is required to be sprayed by the nozzle 10, so that the cleaning liquid is uniformly sprayed on the surface of the wafer. Since the cleaning liquid is easily splashed when sprayed by the nozzle 10, not only the environment is polluted, but also the resource waste is easily caused, and therefore, the process cavity 8 is adopted to wrap the outer side.
As an optional embodiment, the cleaning device further comprises a rotating base 9 disposed in the process chamber 8, wherein the rotating base 9 is configured to support a wafer to be cleaned and rotate the wafer to be cleaned. In order to uniformly clean the surface of the wafer and discharge the reaction product and the chemical solution after cleaning by using centrifugal force, the wafer is rotated by using the spin base 9.
As an alternative embodiment, the first discharge conduit 1, the second discharge conduit 2 and the third discharge conduit 4 are connected by a three-way valve 7. The three-way valve 7 has one inlet and two outlets, the inlet being able to communicate with only one of the outlets at a time. The three-way valve 7 is adopted to control the communication and the closing of the three pipelines, and the communication mode of the three pipelines can be changed by only adjusting one valve, so that the operation is simple and convenient.
Among the technical scheme that this embodiment provided, classify according to the washing liquid concentration of retrieving, through the washing liquid concentration of real-time measurement recovery, discharge the washing liquid of different concentrations to waste water liquid storage pot 3 and waste liquid storage pot 5, carry out abundant recycle to the washing liquid that can recycle, can reduce the waste of resource and reduce pollution.
The embodiment provides a semiconductor cleaning method, which comprises the following steps: cleaning a wafer to be cleaned, and measuring the concentration of the discharged cleaning solution in real time; and classifying and recycling the discharged cleaning liquid according to the concentration of the cleaning liquid. The concentration of the cleaning liquid is measured in real time while the cleaning liquid is discharged, so that the concentration of the cleaning liquid can be mastered in real time.
As an alternative embodiment, the classifying and recovering the discharged cleaning liquid according to the concentration of the cleaning liquid includes: recovering the cleaning liquid with the concentration lower than a preset threshold value to a waste water storage tank; and recovering the cleaning liquid with the concentration higher than the preset threshold value to the waste liquid storage tank. In this embodiment, the predetermined threshold value may be determined according to the specific cleaning liquid type and cleaning process. And cleaning liquid is stored in different liquid storage tanks according to the preset threshold value, so that the subsequent recycling process is facilitated.
As an alternative embodiment, the classifying and recovering the discharged cleaning liquid according to the concentration of the cleaning liquid includes: and the concentration of the cleaning liquid is measured by adopting a concentration measuring sensor, and the opening and closing of a three-way valve are controlled according to the concentration measured by the concentration measuring sensor, so that the cleaning liquid enters a waste water liquid storage tank or a waste liquid storage tank. A three-way valve has one inlet and two outlets, the inlet being able to communicate with only one of the outlets at a time. The three-way valve is adopted to control the communication and the closing of the three pipelines, and the communication mode of the three pipelines can be changed by only adjusting one valve, so that the operation is simple and convenient. The concentration measurement sensor can measure the concentration of the cleaning liquid in real time, the concentration obtained by measuring the concentration measurement sensor can control the three-way valve, the linkage of the concentration measurement sensor and the three-way valve can reduce the labor consumption in the control process, and the control process is simple, convenient, accurate and fast.
As an optional implementation, the cleaning the wafer to be cleaned and measuring the concentration of the discharged cleaning solution in real time includes: and when the wafer to be cleaned is cleaned, cleaning is carried out in the process cavity so that the cleaning solution is collected in the process cavity. In the cleaning process, the cleaning solution is required to be sprayed by a nozzle, so that the cleaning solution is uniformly sprayed on the surface of the wafer. Because the nozzle is adopted for spraying, the splashing of the cleaning liquid is easily caused, the environmental pollution is caused, the resource waste is also easily caused, and therefore, the process cavity is adopted for wrapping on the outer side.
As an optional implementation, the cleaning the wafer to be cleaned and measuring the concentration of the discharged cleaning solution in real time includes: when the wafer to be cleaned is cleaned, the wafer to be cleaned is driven to rotate by adopting a rotating base. In order to uniformly clean the surface of the wafer and discharge the reaction product and the chemical solution after cleaning by using centrifugal force, the wafer is driven to rotate by using a rotating base.
Among the technical scheme that this embodiment provided, classify according to the washing liquid concentration of retrieving, through the washing liquid concentration of real-time measurement recovery, discharge the washing liquid of different concentrations to waste water liquid storage pot and waste liquid storage pot, carry out abundant recycle to the washing liquid that can recycle, can reduce the waste and the pollution abatement of resource.
In the above description, the technical details of patterning, etching, and the like of each layer are not described in detail. It will be appreciated by those skilled in the art that layers, regions, etc. of the desired shape may be formed by various technical means. In addition, in order to form the same structure, the person skilled in the art can also design a method which is not exactly the same as the method described above. In addition, although the embodiments are described separately above, this does not mean that the measures in the embodiments cannot be used in advantageous combination.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (9)
1. A semiconductor cleaning apparatus, comprising:
a first discharge pipe for discharging the cleaning liquid;
a waste water storage tank for containing low-concentration cleaning liquid;
the second discharge pipeline is used for communicating the first discharge pipeline with the wastewater storage tank in a switchable manner;
a waste liquid storage tank for containing high-concentration cleaning liquid;
the third discharge pipeline is used for communicating the first discharge pipeline with the waste liquid storage tank in a switchable manner;
and the concentration measuring sensor is used for measuring the concentration of the cleaning liquid in the first discharge pipeline and controlling the opening and closing of the second discharge pipeline and the third discharge pipeline according to the concentration of the cleaning liquid.
2. The semiconductor cleaning device according to claim 1, further comprising a process chamber for providing a space for a wafer cleaning process so that the cleaning solution is collected in the process chamber, wherein a nozzle is disposed at the top of the process chamber and used for spraying the cleaning solution to the wafer to be cleaned; and a cleaning liquid outlet is formed in the bottom of the process cavity and communicated with the first discharge pipeline.
3. The semiconductor cleaning apparatus according to claim 2, further comprising a spin base disposed in the process chamber, the spin base configured to support and rotate the wafer to be cleaned.
4. The semiconductor cleaning apparatus according to claim 1, wherein the first discharge conduit, the second discharge conduit and the third discharge conduit are communicated by a three-way valve.
5. A method of cleaning a semiconductor, comprising:
cleaning a wafer to be cleaned, and measuring the concentration of the discharged cleaning solution in real time;
and classifying and recycling the discharged cleaning liquid according to the concentration of the cleaning liquid.
6. The semiconductor cleaning method according to claim 5, wherein the classifying and recovering the discharged cleaning liquid according to the concentration of the cleaning liquid comprises:
recovering the cleaning liquid with the concentration lower than the preset threshold value to a waste water storage tank;
and recovering the cleaning liquid with the concentration higher than the preset threshold value to the waste liquid storage tank.
7. The semiconductor cleaning method according to claim 5, wherein the classifying and recovering the discharged cleaning liquid according to the concentration of the cleaning liquid comprises:
and the concentration of the cleaning liquid is measured by adopting a concentration measuring sensor, and the opening and closing of a three-way valve are controlled according to the concentration measured by the concentration measuring sensor, so that the cleaning liquid enters a waste water storage tank or a waste liquid storage tank.
8. The semiconductor cleaning method according to claim 5, wherein the cleaning the wafer to be cleaned and the measuring the concentration of the discharged cleaning liquid in real time comprises:
and when the wafer to be cleaned is cleaned, cleaning is carried out in the process cavity so that the cleaning solution is collected in the process cavity.
9. The semiconductor cleaning method according to claim 5, wherein the cleaning the wafer to be cleaned and the measuring the concentration of the discharged cleaning liquid in real time comprises:
when the wafer to be cleaned is cleaned, the wafer to be cleaned is driven to rotate by adopting a rotating base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011555122.9A CN114671489A (en) | 2020-12-24 | 2020-12-24 | Semiconductor cleaning device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011555122.9A CN114671489A (en) | 2020-12-24 | 2020-12-24 | Semiconductor cleaning device and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN114671489A true CN114671489A (en) | 2022-06-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011555122.9A Pending CN114671489A (en) | 2020-12-24 | 2020-12-24 | Semiconductor cleaning device and method |
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| Country | Link |
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| CN (1) | CN114671489A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115945434A (en) * | 2022-12-28 | 2023-04-11 | 安徽富乐德长江半导体材料股份有限公司 | Wafer cleaning quick-discharging tank capable of recycling deionized water |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104014496A (en) * | 2014-06-04 | 2014-09-03 | 深圳市华星光电技术有限公司 | Liquid drainage method and device for washing chamber |
| CN107346755A (en) * | 2017-06-29 | 2017-11-14 | 华进半导体封装先导技术研发中心有限公司 | Thin wafer cleaning device and cleaning method of the wafer scale with TSV through hole |
| CN109065475A (en) * | 2018-07-23 | 2018-12-21 | 德淮半导体有限公司 | Wafer cleaning device and its method for cleaning wafer |
| CN111640689A (en) * | 2019-03-01 | 2020-09-08 | 北京北方华创微电子装备有限公司 | Cleaning device and cleaning chamber |
-
2020
- 2020-12-24 CN CN202011555122.9A patent/CN114671489A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104014496A (en) * | 2014-06-04 | 2014-09-03 | 深圳市华星光电技术有限公司 | Liquid drainage method and device for washing chamber |
| CN107346755A (en) * | 2017-06-29 | 2017-11-14 | 华进半导体封装先导技术研发中心有限公司 | Thin wafer cleaning device and cleaning method of the wafer scale with TSV through hole |
| CN109065475A (en) * | 2018-07-23 | 2018-12-21 | 德淮半导体有限公司 | Wafer cleaning device and its method for cleaning wafer |
| CN111640689A (en) * | 2019-03-01 | 2020-09-08 | 北京北方华创微电子装备有限公司 | Cleaning device and cleaning chamber |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115945434A (en) * | 2022-12-28 | 2023-04-11 | 安徽富乐德长江半导体材料股份有限公司 | Wafer cleaning quick-discharging tank capable of recycling deionized water |
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Application publication date: 20220628 |