CN109065475A - Wafer cleaning device and its method for cleaning wafer - Google Patents
Wafer cleaning device and its method for cleaning wafer Download PDFInfo
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- CN109065475A CN109065475A CN201810811487.XA CN201810811487A CN109065475A CN 109065475 A CN109065475 A CN 109065475A CN 201810811487 A CN201810811487 A CN 201810811487A CN 109065475 A CN109065475 A CN 109065475A
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- count value
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A kind of wafer cleaning device and its method for cleaning wafer, the wafer cleaning device include: cleaning chamber；For placing the wafer susceptor of wafer, it is located in the cleaning chamber；Inlet pipe is connected to the cleaning chamber, inputs cleaning liquid into the cleaning chamber when opening；Feed liquor switch, is located in the inlet pipe, for controlling whether the inlet pipe opens；Liquid outlet is connected to the cleaning chamber, and liquid is discharged via the liquid outlet after the cleaning in the cleaning chamber；Grain count equipment counts the intracorporal particle of liquid after the cleaning of liquid outlet discharge；Feed liquor switch control device is switched with the feed liquor and is coupled, and the feed liquor switch control device controls the feed liquor according to the count value of the grain count equipment and switchs.The present invention program helps to reduce production cost, and improves product yield.
Description
Technical field
The present invention relates to technical field of manufacturing semiconductors more particularly to a kind of wafer cleaning device and its wafer cleaning sides
Method.
Background technique
In existing semiconductor fabrication process, through the surface particles frequently with wafer cleaning technique removal silicon wafer, germanium wafer
(Particle)。
Specifically, it usually needs according to artificial experience or experimental design (Design of Experiments, DOE) result
Determine that cleaning process parameter, the cleaning process parameter for example may include cleaning the type and cleaning duration of medical fluid.Existing
Have in technology, in the same processing step (Step), the wafer (Wafer) of same batch (Lot) is usually set using identical
Cleaning process parameter, namely use identical cleaning duration.
However, the granule number and particle of every platelet circular surfaces stick degree due to having differences property between every wafer
It is not identical, it is easy to cause part wafer that over cleaning occurs using identical cleaning duration, causes to clean medical fluid (Chemical)
Or the waste of deionized water (Deionization Water, DIW)；It is also easy to cause part wafer that cleaning deficiency occurs, cause
Grain defect (Particle Defect) is excessively high, and product yield is influenced when serious.
Summary of the invention
The technical problem to be solved by the present invention is to provide a kind of wafer cleaning device and its method for cleaning wafer, can be according to every
The specific cleaning situation of wafer controls inlet pipe opening time in time, to avoid that over cleaning occurs or clean insufficient ask
Topic helps to reduce production cost, and improves product yield.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of wafer cleaning device, comprising: cleaning chamber；With
In the wafer susceptor for placing wafer, it is located in the cleaning chamber；Inlet pipe is connected to the cleaning chamber, when opening
Cleaning liquid is inputted into the cleaning chamber；Feed liquor switch, is located in the inlet pipe, for controlling the inlet pipe
Whether open；Liquid outlet is connected to the cleaning chamber, and liquid is arranged via the liquid outlet after the cleaning in the cleaning chamber
Out；Grain count equipment counts the intracorporal particle of liquid after the cleaning of liquid outlet discharge；Feed liquor switch controller
Part is switched with the feed liquor and is coupled, and the feed liquor switch control device controls institute according to the count value of the grain count equipment
State feed liquor switch.
Optionally, default less than first when the ratio of the current count value of the grain count equipment and a preceding count value
When percentage, the feed liquor switch control device controls the feed liquor switch and closes the inlet pipe.
Optionally, described in being more than or equal to when the ratio of the current count value of the grain count equipment and a preceding count value
When the first preset percentage, the feed liquor switch control device controls the feed liquor switch and opens the inlet pipe.
Optionally, the wafer cleaning device further include: two-way valve, entrance connect the liquid outlet；Discarded pipeline, with
The first outlet of the two-way valve connects；Recovery pipe is connect with the second outlet of the two-way valve；Wherein, according to described
The count value of grain counting equipment, the entrance of the two-way valve are connected to the first outlet of the two-way valve or second outlet.
Optionally, it is preset when the ratio of the current count value of the grain count equipment and a preceding count value is greater than second
When percentage, the entrance of the two-way valve is connected to the first outlet of the two-way valve；It is current when the grain count equipment
The ratio of count value and a preceding count value be less than or equal to second preset percentage when, the entrance of the two-way valve with it is described
The second outlet of two-way valve is connected to.
Optionally, the wafer cleaning device further include: rotation motor is coupled with the wafer susceptor, described in control
Wafer susceptor rotation；Wherein, the rotation motor adjusts revolving speed according to the count value of the grain count equipment.
Optionally, when the grain count equipment is greater than in the count value of default counts and the ratio of initial count value
When third preset percentage, the rotation motor increases revolving speed；When the grain count equipment is in the counting of default counts
When the ratio of value and initial count value is less than or equal to four preset percentages, the rotation motor reduces revolving speed；Wherein, described first
Beginning count value is for indicating from counting for the first time, the average value or maximum value of the count value of preset times.
Optionally, the grain count equipment intracorporal of liquid after the cleaning that the liquid outlet is discharged in preset duration
Grain is counted.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of wafer cleaning side of above-mentioned wafer cleaning device
Method, comprising: wafer is provided, and the wafer is placed in the wafer susceptor；It is controlled using the feed liquor switch control device
The feed liquor switch opens the inlet pipe, cleaning liquid is inputted to the cleaning chamber by the inlet pipe, with right
The wafer is cleaned, liquid after the cleaning being discharged in the cleaning chamber by the liquid outlet；Using the particle meter
The intracorporal particle of liquid counts after the cleaning that the liquid outlet is discharged in number equipment；The feed liquor switch control device is according to institute
The count value for stating grain count equipment controls the feed liquor switch.
Optionally, the feed liquor switch control device controls the feed liquor according to the count value of the grain count equipment and opens
Pass includes: when the current count value of the grain count equipment and the ratio of a preceding count value are less than the first preset percentage
When, the feed liquor switch is controlled using the feed liquor switch control device and closes the inlet pipe.
Compared with prior art, the technical solution of the embodiment of the present invention has the advantages that
In embodiments of the present invention, the wafer cleaning device includes: cleaning chamber；For placing the wafer base of wafer
Seat is located in the cleaning chamber；Inlet pipe is connected to the cleaning chamber, defeated into the cleaning chamber when opening
Enter cleaning liquid；Feed liquor switch, is located in the inlet pipe, for controlling whether the inlet pipe opens；Liquid outlet, with
The cleaning chamber is connected to, and liquid is discharged via the liquid outlet after the cleaning in the cleaning chamber；Grain count equipment is right
The intracorporal particle of liquid is counted after the cleaning of the liquid outlet discharge；Feed liquor switch control device switchs coupling with the feed liquor
It connects, the feed liquor switch control device controls the feed liquor according to the count value of the grain count equipment and switchs.Using above-mentioned
Scheme is counted by the intracorporal particle of liquid after the cleaning that the liquid outlet is discharged in grain count equipment is arranged, and is arranged
The feed liquor switch control device controls the feed liquor according to the count value of the grain count equipment and switchs, and then by described
Feed liquor switch control inlet pipe can control inlet pipe opening time according to the specific cleaning situation of every wafer in time,
To avoid that the problem of over cleaning or cleaning deficiency occurs, help to reduce production cost, and improve product yield.
Further, according to the count value of the grain count equipment, the of the entrance of the two-way valve and the two-way valve
One outlet or second outlet connection can be subtracted with being respectively communicated to discarded pipeline or recovery pipe in the particle in cleaning liquid
When few, the cleaning liquid is recycled, improves medical fluid utilization rate, reduces production cost.
Further, by the way that rotation motor is arranged, and the rotation motor is according to the count value of the grain count equipment
Revolving speed is adjusted, can stick seriously in particle, when preset duration can't still is washed off clearly, improve the revolving speed of rotation motor, increase is gone
A possibility that except particle, help to improve product yield.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of wafer cleaning device in the prior art；
Fig. 2 is a kind of structural schematic diagram of wafer cleaning device in the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of another wafer cleaning device in the embodiment of the present invention；
Fig. 4 is the structural schematic diagram of another wafer cleaning device in the embodiment of the present invention；
Fig. 5 is a kind of flow chart of the method for cleaning wafer of wafer cleaning device in the embodiment of the present invention.
Specific embodiment
In existing semiconductor fabrication process, through the surface particles frequently with wafer cleaning technique removal silicon wafer, germanium wafer.
In the same processing step, usually setting uses identical cleaning process parameter with a batch of wafer, namely using identical
Cleaning duration.
Referring to Fig.1, Fig. 1 is a kind of structural schematic diagram of wafer cleaning device in the prior art.The wafer cleaning device
It may include: cleaning chamber 100, inlet pipe 110, inlet pipe 120 and liquid outlet 130.
Specifically, it is also provided with wafer susceptor 102 in the cleaning chamber 100, for placing wafer 104, with right
Wafer 104 is cleaned.
The inlet pipe 110 and inlet pipe 120 can be connected to the cleaning chamber 100, when opening to institute
It states and inputs cleaning liquid in cleaning chamber 100.
In specific implementation, the inlet pipe 110 and inlet pipe 120 can be set to same inlet pipe,
A piece inlet pipe is only set；The inlet pipe 110 can also be set and inlet pipe 120 is isolated inlet tube
Road, such as in a kind of concrete application of the embodiment of the present invention, can be inputted using inlet pipe 110 into cleaning chamber 100
Deionized water and nitrogen (N2), the medical fluid for cleaning is inputted into cleaning chamber 100 using inlet pipe 120.
The liquid outlet 130 can be connected to the cleaning chamber 100, liquid after the cleaning in the cleaning chamber 100
It is discharged via the liquid outlet 130.
In the prior art, can simultaneously more wafers 104 are cleaned, can also individually to every wafer 104 into
Row cleaning, however for the wafer of same technique 104, identical cleaning formula is often used, for example, by using identical cleaning
Liquid and identical cleaning duration.
The present inventor has found after study, due to having differences property between every wafer, every platelet circular surfaces
It is not identical that granule number and particle stick degree, is easy to cause part wafer that over cleaning occurs using identical cleaning duration,
Lead to the waste for cleaning medical fluid or deionized water；It is also easy to cause part wafer that cleaning deficiency occurs, causes grain defect excessively high,
Product yield is influenced when serious.
In embodiments of the present invention, the wafer cleaning device includes: cleaning chamber；For placing the wafer base of wafer
Seat is located in the cleaning chamber；Inlet pipe is connected to the cleaning chamber, defeated into the cleaning chamber when opening
Enter cleaning liquid；Feed liquor switch, is located in the inlet pipe, for controlling whether the inlet pipe opens；Liquid outlet, with
The cleaning chamber is connected to, and liquid is discharged via the liquid outlet after the cleaning in the cleaning chamber；Grain count equipment is right
The intracorporal particle of liquid is counted after the cleaning of the liquid outlet discharge；Feed liquor switch control device switchs coupling with the feed liquor
It connects, the feed liquor switch control device controls the feed liquor according to the count value of the grain count equipment and switchs.Using above-mentioned
Scheme is counted by the intracorporal particle of liquid after the cleaning that the liquid outlet is discharged in grain count equipment is arranged, and is arranged
The feed liquor switch control device controls the feed liquor according to the count value of the grain count equipment and switchs, and then by described
Feed liquor switch control inlet pipe can control inlet pipe opening time according to the specific cleaning situation of every wafer in time,
To avoid that the problem of over cleaning or cleaning deficiency occurs, help to reduce production cost, and improve product yield.
It is understandable to enable above-mentioned purpose of the invention, feature and beneficial effect to become apparent, with reference to the accompanying drawing to this
The specific embodiment of invention is described in detail.
Referring to Fig. 2, Fig. 2 is a kind of structural schematic diagram of wafer cleaning device in the embodiment of the present invention.The wafer cleaning
Device may include cleaning chamber 200, inlet pipe 210, inlet pipe 220 and liquid outlet 230.
Specifically, wafer susceptor 202 can be set in the cleaning chamber 200, for placing wafer 204, to crystalline substance
Circle 204 is cleaned；
The inlet pipe 210 and inlet pipe 220 can be connected to the cleaning chamber 200, when opening to institute
It states and inputs cleaning liquid in cleaning chamber 200.
In specific implementation, the inlet pipe 210 and inlet pipe 220 can be set to same inlet pipe,
One or one group of inlet pipe are only set；The inlet pipe 210 can also be set and inlet pipe 220 be separation into
Liquid pipeline, such as in a kind of concrete application of the embodiment of the present invention, it can be using inlet pipe 210 into cleaning chamber 200
Input deionized water and nitrogen (N2), the medical fluid for cleaning is inputted into cleaning chamber 200 using inlet pipe 220.
More specifically, it is different according to particulate matter to be cleaned, different medical fluids can be used.Such as dilute hydrofluoric can be used
The medical fluids such as (Dilute Hydro-fluoric, DHF) acid, ICC1 cleaning solution, ICC2 cleaning solution clean wafer 204.
Wherein, the ingredient of the ICC1 cleaning solution for example may include ammonium hydroxide (NH3·H2) and hydrogen peroxide (H O2O2), it is described
The ingredient of ICC2 cleaning solution for example may include hydrochloric acid (HCl) and hydrogen peroxide.
The wafer cleaning device can also include feed liquor switch 221 and feed liquor switch control device 224, wherein into
Liquid switch 221 can be located in the inlet pipe 220, for controlling whether the inlet pipe 220 opens.
The liquid outlet 230 can be connected to the cleaning chamber 200, liquid after the cleaning in the cleaning chamber 200
It is discharged via the liquid outlet 230.
In embodiments of the present invention, the wafer cleaning device can also include grain count equipment 240, to the liquid out
The intracorporal particle of liquid is counted after the cleanings of 230 discharge of mouth.
Specifically, the grain count equipment 240 can for example be realized using laser as detection light source to liquid particles
On-line counting is carried out, for different class of particles, liquid particles can also be carried out using ultraviolet light, near infrared ray technology
Line counts.
In embodiments of the present invention, the grain count equipment 240 can be set to every preset duration to the liquid out
The intracorporal particle of liquid is counted after the cleanings of 230 discharge of mouth, is counted compared in random times, is implemented using the present invention
The scheme of example, is counted every preset duration, facilitates the variation tendency of the intracorporal particle of liquid after more accurately judging to clean.
In specific implementation, the grain count equipment 240 can be connected to the liquid outlet in a manner of piping connection
230, it can also be coupled in a manner of external with the liquid outlet 230, to realize liquid after the cleaning that the liquid outlet 230 is discharged
Interior particle is counted.
The feed liquor switch control device 224 is coupled with the feed liquor switch 221, the feed liquor switch control device 224
The feed liquor switch 221 is controlled according to the count value of the grain count equipment 240.
It is possible to further be switched and controlled using the feed liquor according to the variation of the count value of the grain count equipment 240
Device 224 processed controls the feed liquor switch 221 and opens or closes, to whether control the inlet pipe 220 to the cleaning
Cleaning liquid is inputted in cavity 200.
Specifically, when the ratio of the current count value of the grain count equipment 240 and a preceding count value is less than first
When preset percentage, the feed liquor switch control device 224 can control the feed liquor switch 221 and close the inlet pipe
220。
In specific implementation, with being cleaned to the particle on wafer 204, after the cleaning that the liquid outlet 230 is discharged
The particle contained in liquid should be reduced with the increase of scavenging period.
In embodiments of the present invention, when the ratio of the current count value of the grain count equipment 240 and a preceding count value
When example is less than the first preset percentage, it can indicate that amounts of particles has had been reduced to a certain degree, at this time by described in control
Feed liquor switch 221 closes the inlet pipe 220, it is possible to reduce the input of cleaning liquid can be effectively reduced cleaning cost.
It should be pointed out that first preset percentage should not be excessively high, otherwise slight become can occur in amounts of particles
When change, it is mistaken for cleaning and completes, close inlet pipe 220 in advance, cause to clean sordid situation；The first default percentage
Than should not be too low, otherwise it can still be mistaken for needing to continue to clean, slowly be not related to when amounts of particles is decreased very more
The case where closing inlet pipe 220, leading to over cleaning.
Preferably, first preset percentage can be set to 20%~50%.
Work as the current count value of the grain count equipment 240 and the ratio of a preceding count value it is possible to further be arranged
When example is more than or equal to first preset percentage, the feed liquor switch control device 224 can control the feed liquor switch 221
Open the inlet pipe 220.
It should be pointed out that the control feed liquor switch 221 is opened the inlet pipe 220 and be can be used to indicate that
When cleaning wafer 204, the feed liquor switch 221 is controlled so that 220 duration of the inlet pipe is open-minded.Namely in certain scenes
In, for example, replacement wafer 204 when or the cleaning chamber 200 in without wafer 204 when, be not cleaning wafer 204 when
It carves, the inlet pipe 220 will not input cleaning liquid into cleaning chamber.
In embodiments of the present invention, when the ratio of the current count value of the grain count equipment 240 and a preceding count value
When example is more than or equal to the first preset percentage, it can indicate that amounts of particles is still constantly cleaned out, pass through control at this time
It makes the feed liquor switch 221 and opens the inlet pipe 220, input cleaning liquid can be continued, help to improve the clear of cleaning
Cleanliness.
In embodiments of the present invention, by the way that liquid after the cleaning that the liquid outlet 230 is discharged of grain count equipment 240 is arranged
Intracorporal particle is counted, and the feed liquor switch control device 224 is arranged according to the counting of the grain count equipment 240
Value controls the feed liquor switch 221, so that inlet pipe 220 is controlled, it can be timely according to the specific cleaning situation of every wafer
The opening time of inlet pipe 220 is controlled, to avoid occurring the problem of over cleaning or cleaning deficiency, helps to reduce being produced into
This, and improve product yield.
It is the structural schematic diagram of another wafer cleaning device in the embodiment of the present invention referring to Fig. 3, Fig. 3.Show compared to Fig. 2
Wafer cleaning device out, the another kind wafer cleaning device can also include two-way valve 351, discarded pipeline 332, recovery tube
Road 334 and storage equipment 361.
Wherein, the entrance of the two-way valve 351 can connect the liquid outlet 230, and the discarded pipeline 332 can be with institute
The first outlet connection of two-way valve 351 is stated, the recovery pipe 334 can be connect with the second outlet of the two-way valve 351.
It should be pointed out that the grain count equipment 240 is still in liquid after the cleaning of the liquid outlet 230 discharge
Particle counted.
According to the count value of the grain count equipment 240, the entrance of the two-way valve 351 can be with the two-way valve
351 first outlet connection, by liquid guide flow after the cleaning to the discarded pipeline 332 or the two-way valve 351
Entrance can also be connected to the second outlet of the two-way valve 351, by liquid guide flow after the cleaning to the recovery pipe
334, and then flow into the storage equipment 361.
Further, when the ratio of the current count value of the grain count equipment 240 and a preceding count value is greater than the
When two preset percentages, the entrance of the two-way valve 351 can be connected to the first outlet of the two-way valve 351；When described
When the current count value of grain counting equipment 240 and the ratio of a preceding count value are less than or equal to second preset percentage, institute
The entrance for stating two-way valve 351 can be connected to the second outlet of the two-way valve 351.
It should be pointed out that second preset percentage should not be excessively high, otherwise can be completed in not yet cleaning, discharge
When liquid endoparticle quantity is still higher after cleaning, medical fluid is recycled in advance, leads to the case where polluting cleaning liquid；It is described
Second preset percentage should not be too low, otherwise can be completed in not yet cleaning, liquid endoparticle quantity is non-after the cleaning of discharge
When often low, still slowly fail to recycle medical fluid, leads to the case where wasting cleaning liquid.
Preferably, second preset percentage can be set to 10%~60%.
In embodiments of the present invention, can according to the count value of the grain count equipment 240, the two-way valve 351
Entrance is connected to the first outlet of the two-way valve 351 or second outlet, to be respectively communicated to discarded pipeline 332 or recovery pipe
334, the cleaning liquid can be recycled, medical fluid utilization rate is improved, reduce life when the particle in cleaning liquid is reduced
Produce cost.
Referring to Fig. 4, Fig. 4 is the structural schematic diagram of another wafer cleaning device in the embodiment of the present invention.Show compared to Fig. 3
Wafer cleaning device out, another described wafer cleaning device can also include rotation motor 471.
Specifically, the rotation motor 471 can be coupled with the wafer susceptor 202, to control the wafer susceptor 202
Rotation.Wherein, the rotation motor 471 can adjust revolving speed according to the count value of the grain count equipment 240.
Specifically, the revolving speed of the wafer susceptor 202 can be increased by rotation motor 471, to be easier removal institute
The particle on wafer 204 is stated, the revolving speed of the wafer susceptor 202 can also be reduced by rotation motor 471, to reduce rotation
Power helps to reduce production cost.
Further, when the grain count equipment 240 is in the count value of default counts and the ratio of initial count value
When example is greater than third preset percentage, the rotation motor 471 increases revolving speed；When the grain count equipment 240 is pre-designed
When the ratio of several count values and initial count value is less than or equal to four preset percentages for several times, the rotation motor 471 is reduced
Revolving speed；Wherein, the initial count value is for indicating from counting for the first time, the average value or maximum of the count value of preset times
Value.
It is understood that the third preset percentage should be above the 4th default percentage for same cleaning process
Than improving the revolving speed of rotation motor 471 to fail in the case where the more washing the more few in the case where particle is difficult to clean；It is adopting
In the case where can also particle be removed with normal wash technique, the revolving speed of rotation motor 471 is reduced.
It should be pointed out that the third preset percentage should not be excessively high, otherwise can also be removed in normal wash
In the case where grain, the revolving speed of rotation motor 471 is improved；4th preset percentage should not be too low, otherwise can be in particle
It is difficult to clean, when needing to increase revolving speed, slowly fails to improve revolving speed.
In specific implementation, whenever replacing wafer, revolving speed can be reset, to avoid the particle feelings of preceding wafer
Influence of the condition to rear wafer.
It completes, when liquid endoparticle quantity is still higher after the cleaning of discharge, medical fluid is recycled in advance, causes to pollute
The case where cleaning liquid；Second preset percentage should not be too low, otherwise can be completed in not yet cleaning, the cleaning of discharge
When liquid endoparticle quantity is very low afterwards, still slowly fail to recycle medical fluid, leads to the case where wasting cleaning liquid.
In embodiments of the present invention, by the way that rotation motor 471 is arranged, and the rotation motor 471 is according to the particle
The count value of counting equipment 240 adjusts revolving speed, can stick seriously in particle, when preset duration can't still is washed off clearly, improves and turns
The revolving speed of dynamic motor 471, increases a possibility that removing particle, helps to improve product yield.
Referring to Fig. 5, Fig. 5 is a kind of flow chart of the method for cleaning wafer of wafer cleaning device in the embodiment of the present invention.Institute
The method for cleaning wafer for stating wafer cleaning device may include step S31 to step S34:
Step S31: wafer is provided, and the wafer is placed in the wafer susceptor；
Step S32: the feed liquor switch is controlled using the feed liquor switch control device and opens the inlet pipe, is passed through
The inlet pipe is arranged with cleaning to the wafer by the liquid outlet to cleaning chamber input cleaning liquid
Liquid after cleaning in the cleaning chamber out；
Step S33: the intracorporal particle of liquid carries out after the cleaning that the liquid outlet is discharged using the grain count equipment
It counts；
Step S34: the feed liquor switch control device controls the feed liquor according to the count value of the grain count equipment
Switch.
Further, the feed liquor switch control device controls the feed liquor according to the count value of the grain count equipment
Switch includes: when the current count value of the grain count equipment and the ratio of a preceding count value are less than the first preset percentage
When, the feed liquor switch is controlled using the feed liquor switch control device and closes the inlet pipe.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (10)
1. a kind of wafer cleaning device characterized by comprising
Cleaning chamber；
For placing the wafer susceptor of wafer, it is located in the cleaning chamber；
Inlet pipe is connected to the cleaning chamber, inputs cleaning liquid into the cleaning chamber when opening；
Feed liquor switch, is located in the inlet pipe, for controlling whether the inlet pipe opens；
Liquid outlet is connected to the cleaning chamber, and liquid is discharged via the liquid outlet after the cleaning in the cleaning chamber；
Grain count equipment counts the intracorporal particle of liquid after the cleaning of liquid outlet discharge；
Feed liquor switch control device is switched with the feed liquor and is coupled, and the feed liquor switch control device is according to the grain count
The count value of equipment controls the feed liquor switch.
2. wafer cleaning device according to claim 1, which is characterized in that when the current count of the grain count equipment
When the ratio of value and a preceding count value is less than the first preset percentage, the feed liquor switch control device controls the feed liquor and opens
Close the inlet pipe.
3. wafer cleaning device according to claim 2, which is characterized in that when the current count of the grain count equipment
When the ratio of value and a preceding count value is more than or equal to first preset percentage, the feed liquor switch control device controls institute
It states feed liquor switch and opens the inlet pipe.
4. wafer cleaning device according to claim 1, which is characterized in that further include:
Two-way valve, entrance connect the liquid outlet；
Discarded pipeline, connect with the first outlet of the two-way valve；
Recovery pipe is connect with the second outlet of the two-way valve；
Wherein, according to the count value of the grain count equipment, the first outlet of the entrance of the two-way valve and the two-way valve
Or second outlet connection.
5. wafer cleaning device according to claim 4, which is characterized in that
When the ratio of the current count value of the grain count equipment and a preceding count value is greater than the second preset percentage, institute
The entrance for stating two-way valve is connected to the first outlet of the two-way valve；
When the current count value of the grain count equipment and the ratio of a preceding count value are less than or equal to described second default hundred
Point than when, the entrance of the two-way valve is connected to the second outlet of the two-way valve.
6. wafer cleaning device according to claim 1, which is characterized in that further include:
Rotation motor is coupled with the wafer susceptor, to control the wafer susceptor rotation；
Wherein, the rotation motor adjusts revolving speed according to the count value of the grain count equipment.
7. wafer cleaning device according to claim 6, which is characterized in that
When the grain count equipment is greater than third default hundred in the count value of default counts and the ratio of initial count value
Point than when, the rotation motor increases revolving speed；
When the grain count equipment is less than or equal to the 4th in advance in the count value of default counts and the ratio of initial count value
If when percentage, the rotation motor reduces revolving speed；
Wherein, the initial count value is for indicating from counting for the first time, the average value or maximum value of the count value of preset times.
8. wafer cleaning device according to any one of claims 1 to 7, which is characterized in that the grain count equipment is every
The intracorporal particle of liquid counts after the cleaning that the liquid outlet is discharged in preset duration.
9. a kind of method for cleaning wafer based on the described in any item wafer cleaning devices of claim 1 to 7, which is characterized in that
Include:
Wafer is provided, and the wafer is placed in the wafer susceptor；
The feed liquor switch is controlled using the feed liquor switch control device and opens the inlet pipe, passes through the inlet pipe
Cleaning liquid is inputted to the cleaning chamber, to clean to the wafer, the cleaning chamber is discharged by the liquid outlet
Liquid after intracorporal cleaning；
The intracorporal particle of liquid counts after the cleaning that the liquid outlet is discharged using the grain count equipment；
The feed liquor switch control device controls the feed liquor according to the count value of the grain count equipment and switchs.
10. the method for cleaning wafer of wafer cleaning device according to claim 9, which is characterized in that the feed liquor switch
Control device controls the feed liquor switch according to the count value of the grain count equipment
When the ratio of the current count value of the grain count equipment and a preceding count value is less than the first preset percentage, adopt
The feed liquor switch, which is controlled, with the feed liquor switch control device closes the inlet pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810811487.XA CN109065475A (en) | 2018-07-23 | 2018-07-23 | Wafer cleaning device and its method for cleaning wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810811487.XA CN109065475A (en) | 2018-07-23 | 2018-07-23 | Wafer cleaning device and its method for cleaning wafer |
Publications (1)
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| CN112864050A (en) * | 2020-12-24 | 2021-05-28 | 长江存储科技有限责任公司 | Wafer cleaning device, control method, controller and system |
| CN113414165A (en) * | 2021-06-22 | 2021-09-21 | 北京北方华创微电子装备有限公司 | Liquid inlet device and semiconductor cleaning equipment |
| CN114671489A (en) * | 2020-12-24 | 2022-06-28 | 中国科学院微电子研究所 | Semiconductor cleaning device and method |
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Application publication date: 20181221 |