CN208127151U - Wafer cleaning device - Google Patents
Wafer cleaning device Download PDFInfo
- Publication number
- CN208127151U CN208127151U CN201820149214.9U CN201820149214U CN208127151U CN 208127151 U CN208127151 U CN 208127151U CN 201820149214 U CN201820149214 U CN 201820149214U CN 208127151 U CN208127151 U CN 208127151U
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- CN
- China
- Prior art keywords
- spray head
- pipe
- wafer
- valve
- cleaning device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 69
- 239000007921 spray Substances 0.000 claims abstract description 74
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000008367 deionised water Substances 0.000 claims abstract description 30
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 30
- 239000013078 crystal Substances 0.000 claims abstract description 18
- 239000012459 cleaning agent Substances 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000012864 cross contamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000006210 lotion Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to technical field of manufacturing semiconductors more particularly to a kind of wafer cleaning devices.The wafer cleaning device further includes spray head and controller including the cavity for accommodating wafer；The controller connects the spray head, for judging whether the cavity alarms, deionized water is sprayed to the wafer being contained in the cavity if so, controlling the spray head, to remove the remaining cleaning agent of the crystal column surface.The utility model realizes the automation to crystal column surface residual cleaner, intelligent removing, avoids because cleaning agent is the problem of crystal column surface residual leads to wafer loss.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors more particularly to a kind of wafer cleaning devices.
Background technique
Wafer refers to silicon wafer used in silicon semiconductor production of integrated circuits, since its shape is circle, therefore referred to as wafer.
In wafer fabrication processes, need to remove as needed the remaining organic matter of crystal column surface, particle, metal impurities, natural oxidizing layer,
The pollutants such as quartz, plastics, and the surface characteristic of wafer is not destroyed.For this purpose, needing in the manufacturing process of wafer by multiple
Cleaning step.However, the requirement to wet clean process in wafer manufacturing process is increasingly with the continuous diminution of characteristic size
It is high.Wet-cleaning generallys use chemical liquid and deionized water as cleaning agent, by a series of cleaning process step, with reality
Now to the removal of wafer surface pollutant.Wafer wet cleaning in the prior art is divided into slot type cleaning and one chip cleaning.With
Requirement to crystal column surface cleanliness it is higher and higher, and one chip cleaning can reduce cross contamination in cleaning process, mention
High finished product rate, therefore, existing wet-cleaning are gradually cleaned to one chip from traditional slot type and clean transition.
But existing wafer cleaning device, during cleaning wafer, wafer to be cleaned is placed in wafer cleaning
In the cavity of device, when occurring to stop the failure of cavity manufacturing process for cleaning, wafer cleaning device will alarm.It is described
Most of alarm is all since crystal column surface residual chemical agents are excessively caused.At this point, engineer needs to fill wafer cleaning
It sets shutdown, begin to speak, and the wafer alarmed is cleaned manually.The mode of Manual-cleaning on the one hand operate it is relatively complicated,
Cleaning efficiency is lower；Another aspect Manual-cleaning takes a long time, and chemical reagent remains the report for easily causing product wafer for a long time
Useless, the mode of Manual-cleaning also easily causes to damage to product wafer, influences the yield of product wafer.
Therefore, the yield of product wafer scrapped, improve product wafer how is reduced, while simplifying the behaviour of wafer cleaning
Make, is a technical problem to be solved urgently.
Utility model content
The utility model provides a kind of wafer cleaning device, to solve existing wafer cleaning device in the process of cleaning
The problem of easily causing product wafer to scrap improves the yield of product wafer, while simplifying the operation of wafer cleaning.
To solve the above-mentioned problems, the utility model provides a kind of wafer cleaning device, including for accommodating wafer
Cavity further includes spray head and controller；The controller connects the spray head, for judging whether the cavity alarms,
Deionized water is sprayed to the wafer being contained in the cavity if so, controlling the spray head, it is residual to remove the crystal column surface
The cleaning agent stayed.
It preferably, further include first pipe and the first valve；The spray head is set to the open at one end of the first pipe
Place, the deionized water are sprayed through the first pipe from the spray head；First valve, is set in first pipe, and
The controller is connected, whether is led for controlling the first pipe according to the control signal of the controller with the spray head
It is logical.
Preferably, first valve is normal close valve door.
It preferably, further include the second valve；Second valve, is installed between the first pipe and the spray head,
And the connection controller, for adjusting what the deionized water was sprayed from the spray head according to the control signal of the controller
Flow.
Preferably, the spray head is connect with the first pipe by an extensible member, and the extensible member can be along described
The axial of first pipe carries out stretching motion.
Preferably, the spray head can rotate in a preset range around the tie point of itself and the extensible member.
Preferably, the spray head is arc-shaped, and multiple spray orifices are provided on the spray head, described in the deionized water warp
First pipe is sprayed from the spray orifice on the spray head.
It preferably, further include third valve and second pipe；The second pipe, be set to first valve with it is described
Between second valve, and it is connect with the first pipe；The third valve, is set in the second pipe, for controlling
Whether the first pipe is connected with the second pipe.
Preferably, the third valve is normally opened valve.
Preferably, the spray head is placed in the containment portion, and an opening is provided at the top of the cavity, and the spray head sprays
Deionized water through it is described opening reach the crystal column surface.
Wafer cleaning device provided by the utility model is used for by adding spray head and controller when controller detects
When the cavity of receiving wafer is alarmed, control spray head sprays deionized water to the wafer being contained in the cavity, realizes
Automation, intelligent removing to crystal column surface residual cleaner, avoiding leads to crystalline substance due to cleaning agent is in crystal column surface residual
The problem of circle is scrapped, decreases the influence because of artificial cleaning operation to product wafer yield；Wafer cleaning device report is occurring
When alert, it is no longer necessary to be shut down to board, begin to speak to safeguard, simplify the operation of wafer cleaning, improve wafer production efficiency.
Detailed description of the invention
Attached drawing 1 is the structural schematic diagram of wafer cleaning device in specific embodiment of the present invention.
Specific embodiment
It elaborates with reference to the accompanying drawing to the specific embodiment of wafer cleaning device provided by the utility model.
Present embodiment provides a kind of wafer cleaning device, and attached drawing 1 is in specific embodiment of the present invention
The structural schematic diagram of wafer cleaning device.As shown in Figure 1, the wafer cleaning device that present embodiment provides, including be used for
Accommodate the cavity 10 of wafer 21.It specifically, include the supporting table 102 for being set to 10 bottom of cavity in the cavity 10,
Wafer 21 to be cleaned is placed in the supporting table 102.When being cleaned to the wafer 21, by 21 table of wafer
Face jet cleaner removes the impurity on 21 surface of wafer.However, cleaning agent generally is acidic chemical reagent, for a long time
In the residual of crystal column surface, it will affect wafer quality, even result in wafer loss.In order to avoid this problem, this specific implementation
The wafer cleaning device that mode provides further includes spray head 11 and controller 12；The controller 12 connects the spray head 11, is used for
Judge whether the cavity 10 alarms, if so, controlling the spray head 11 to the wafer 21 being contained in the cavity 10
Deionized water 20 is sprayed, to remove the wafer 21 cleaning agent remained on surface.The alarm refers in the appearance of cavity 10
The alarm signal only issued when the failure of manufacturing process for cleaning.Present embodiment by when the cavity 10 is alarmed, and
When deionized water 20 sprayed to the wafer 21 by the spray head 11, it is clear to rapidly remove the chemistry remained on surface of the wafer 21
Lotion is realized and is cleaned in emergency situations to the automation of wafer, avoids scrapping for product wafer, improve product wafer
Yield, also greatly simplify the operation of wafer cleaning, improve the efficiency of wafer cleaning.
In order to simplify the overall structure of the wafer cleaning device, it is preferred that as shown in Figure 1, present embodiment mentions
The wafer cleaning device of confession further includes first pipe 13 and the first valve 14；The spray head 11 is set to the first pipe 13
Place open at one end, the deionized water 20 are sprayed through the first pipe 13 from the spray head 11；First valve 14, setting
In first pipe 13, and the controller 12 is connected, for according to the control signal of the controller 12 control described first
Whether pipeline 13 is connected with the spray head 11.In Fig. 1, arrow indicates the flow direction of deionized water 20.It is furthermore preferred that described
First valve 14 is normal close valve door.
In order to improve the cleaning flexibility of the wafer cleaning device, it is preferred that the wafer that present embodiment provides
Cleaning device further includes the second valve 15；Second valve 15 is installed between the first pipe 13 and the spray head 11,
And the connection controller 12, for adjusting the deionized water 20 from the spray head according to the control signal of the controller 12
11 flows sprayed.In this way, the amount etc. of the remaining cleaning agent of the type of the cleaning agent according to used in cleaning wafer, crystal column surface
Actual conditions are improving removal crystal column surface residual the flow of the deionized water 20 sprayed from the spray head 11 is adjusted flexibly
While cleaning agent efficiency, it can also save scavenging period, reduce cleaning cost.
In order to deionized water accurately be sprayed to crystal column surface, it is preferred that the spray head 11 and first pipe
Road 13 is connected by an extensible member, and the extensible member can carry out stretching motion along the axial of the first pipe 13.It is more excellent
Choosing, the spray head 11 can rotate in a preset range around the tie point of itself and the extensible member.In this way, can basis
The specific size of wafer and/or the size of cavity adjust the spray head 11 and the wafer 21 by the stretching motion of extensible member
Distance, enable from the spray head 11 spray deionized water 20 fall in 21 surface of wafer, avoid deionized water
Waste；Meanwhile by rotating the spray head 11, the angle that adjustment deionized water 20 is sprayed from the spray head 11, so that going
Ionized water can accurately fall in the center of the wafer 21, further improve and remove the 21 remained on surface cleaning agent of wafer
Effect.Alternatively, it is furthermore preferred that the spray head 11 is arc-shaped, and multiple spray orifices are provided on the spray head 11, it is described go from
Sub- water 20 is sprayed through the first pipe 13 from the spray orifice on the spray head 11.Using the nozzle structure of arc-shaped, and described
Multiple spray orifices are set on spray head 11, the deionized water 20 can be increased in the drop point site on 21 surface of wafer, thus more
Effectively raise the effect for removing the 21 remained on surface cleaning agent of wafer.
Preferably, the wafer cleaning device that present embodiment provides further includes third valve 17 and second pipe 16；
The second pipe 16 is set between first valve 14 and second valve 15, and is connected with the first pipe 13
It connects；The third valve 17 is set in the second pipe 16, for controlling the first pipe 13 and the second pipe
Whether 16 be connected.The deionized water discharged through the second pipe 16, the water that may finally be connected to the second pipe 16
Case 22 is collected, to realize the recycling of deionized water, save the cost.It is furthermore preferred that the third valve 17 is normally opened valve.
The setting of the third valve 17, it can be ensured that the discharge of 20 circulation loop of deionized water prevents the first pipe 13
The growth of middle organic matter avoids polluting wafer.
It is impacted in order not to the normal flow to wafer cleaning, it is preferred that the wafer 21 is placed in the cavity 10
Portion, the spray head 11 are placed in outside the cavity 10, and an opening 101 is provided at the top of the cavity 10, and the spray head 11 sprays
Deionized water 20 101 reach 21 surface of wafer through the opening.In this way, under normal wash process, due to spray head 11
It is placed in outside the cavity 10, the process of cleaning agent cleaning wafer will not be impacted, only alarmed in the cavity 10
When, 20 ability of deionized water is sprayed from the spray head 11,21 surface of wafer is reached through the opening 101, to realize to wafer
Urgent cleaning.
The wafer cleaning device that present embodiment provides, by adding spray head and controller, when controller detects
When cavity for accommodating wafer is alarmed, control spray head sprays deionized water to the wafer being contained in the cavity, real
The automation to crystal column surface residual cleaner, intelligent removing are showed, have avoided and led due to cleaning agent is in crystal column surface residual
The problem of causing wafer loss, decreases the influence because of artificial cleaning operation to product wafer yield；Wafer cleaning dress is occurring
When setting alarm, it is no longer necessary to be shut down to board, begin to speak to safeguard, simplified the operation of wafer cleaning, improve wafer production
Efficiency.
The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art
Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications
Also it should be regarded as the protection scope of the utility model.
Claims (10)
1. a kind of wafer cleaning device, including the cavity for accommodating wafer, which is characterized in that further include spray head and controller；
The controller connects the spray head, for judging whether the cavity alarms, if so, controlling the spray head to appearance
The wafer injection deionized water being contained in the cavity, to remove the remaining cleaning agent of the crystal column surface；The alarm refers to
There is the alarm signal for stopping to issue when the failure of manufacturing process for cleaning in the cavity.
2. wafer cleaning device according to claim 1, which is characterized in that further include first pipe and the first valve；Institute
The place open at one end that spray head is set to the first pipe is stated, the deionized water is sprayed through the first pipe from the spray head
Out；First valve, is set in first pipe, and connects the controller, for being believed according to the control of the controller
Whether number control first pipe is connected with the spray head.
3. wafer cleaning device according to claim 2, which is characterized in that first valve is normal close valve door.
4. wafer cleaning device according to claim 2, which is characterized in that further include the second valve；Second valve,
It is installed between the first pipe and the spray head, and connects the controller, for being believed according to the control of the controller
The flow that number adjustment deionized water is sprayed from the spray head.
5. wafer cleaning device according to claim 2, which is characterized in that the spray head and the first pipe pass through one
Extensible member connection, and the extensible member can carry out stretching motion along the axial of the first pipe.
6. wafer cleaning device according to claim 5, which is characterized in that the spray head can stretch around it with described
The tie point of part rotates in a preset range.
7. wafer cleaning device according to claim 5, which is characterized in that the spray head is arc-shaped, and the spray head
On be provided with multiple spray orifices, the deionized water is sprayed through the first pipe from the spray orifice on the spray head.
8. wafer cleaning device according to claim 4, which is characterized in that further include third valve and second pipe；Institute
Second pipe is stated, is set between first valve and second valve, and connect with the first pipe；The third
Whether valve is set in the second pipe, be connected for controlling the first pipe with the second pipe.
9. wafer cleaning device according to claim 8, which is characterized in that the third valve is normally opened valve.
10. wafer cleaning device according to claim 1, which is characterized in that the spray head is placed in the containment portion, institute
It states and is provided with an opening at the top of cavity, the deionized water that the spray head sprays reaches the crystal column surface through the opening.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820149214.9U CN208127151U (en) | 2018-01-29 | 2018-01-29 | Wafer cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820149214.9U CN208127151U (en) | 2018-01-29 | 2018-01-29 | Wafer cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208127151U true CN208127151U (en) | 2018-11-20 |
Family
ID=64206358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820149214.9U Expired - Fee Related CN208127151U (en) | 2018-01-29 | 2018-01-29 | Wafer cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208127151U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112320753A (en) * | 2020-10-29 | 2021-02-05 | 武汉高芯科技有限公司 | MEMS wafer cleaning method |
| CN112786492A (en) * | 2020-12-30 | 2021-05-11 | 上海至纯洁净系统科技股份有限公司 | Spraying equipment for wafer cleaning and wafer cleaning method |
| WO2021223586A1 (en) * | 2020-05-06 | 2021-11-11 | 长鑫存储技术有限公司 | Wet treatment device and control method therefor, storage medium, and electronic device |
| TWI785995B (en) * | 2022-02-25 | 2022-12-01 | 億力鑫系統科技股份有限公司 | Nozzle device |
| CN117238754A (en) * | 2023-11-16 | 2023-12-15 | 迈为技术(珠海)有限公司 | Wafer de-bonding cleaning method and liquid spraying cleaning equipment |
-
2018
- 2018-01-29 CN CN201820149214.9U patent/CN208127151U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021223586A1 (en) * | 2020-05-06 | 2021-11-11 | 长鑫存储技术有限公司 | Wet treatment device and control method therefor, storage medium, and electronic device |
| CN112320753A (en) * | 2020-10-29 | 2021-02-05 | 武汉高芯科技有限公司 | MEMS wafer cleaning method |
| CN112320753B (en) * | 2020-10-29 | 2024-04-26 | 武汉高芯科技有限公司 | MEMS wafer cleaning method |
| CN112786492A (en) * | 2020-12-30 | 2021-05-11 | 上海至纯洁净系统科技股份有限公司 | Spraying equipment for wafer cleaning and wafer cleaning method |
| CN112786492B (en) * | 2020-12-30 | 2023-01-10 | 上海至纯洁净系统科技股份有限公司 | Spraying equipment for wafer cleaning and wafer cleaning method |
| TWI785995B (en) * | 2022-02-25 | 2022-12-01 | 億力鑫系統科技股份有限公司 | Nozzle device |
| CN117238754A (en) * | 2023-11-16 | 2023-12-15 | 迈为技术(珠海)有限公司 | Wafer de-bonding cleaning method and liquid spraying cleaning equipment |
| CN117238754B (en) * | 2023-11-16 | 2024-04-12 | 迈为技术(珠海)有限公司 | Wafer de-bonding cleaning method and liquid spraying cleaning equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181120 |