CN215748565U

CN215748565U - Liquid discharge device and chemical mechanical polishing device

Info

Publication number: CN215748565U
Application number: CN202122408552.4U
Authority: CN
Inventors: 王良华; 胡建平; 于东; 浦兴东; 吴光
Original assignee: Zing Semiconductor Corp
Current assignee: Zing Semiconductor Corp
Priority date: 2021-09-30
Filing date: 2021-09-30
Publication date: 2022-02-08
Anticipated expiration: 2031-09-30

Abstract

The utility model provides a liquid drainage device and a chemical mechanical polishing device, wherein the liquid drainage device comprises a groove body, and a liquid drainage unit is arranged at the bottom of the groove body; the wetting unit is arranged on the inner side wall of the groove body and is used for providing liquid to wet the inner wall of the groove body and the liquid drainage unit. According to the utility model, the wetting unit arranged on the inner side wall of the tank body is utilized to provide liquid to wet the inner side wall of the tank body and the liquid drainage unit when the grinding liquid or the grinding liquid filter is replaced, so that the grinding waste liquid in the tank body is diluted and drained in time, the tank body is not required to be washed manually subsequently, and a better cleaning effect is achieved, thereby improving the convenience of the operation of replacing the grinding liquid.

Description

Liquid discharge device and chemical mechanical polishing device

Technical Field

The utility model relates to the field of semiconductors, in particular to a liquid drainage device and a chemical mechanical polishing device.

Background

The chemical mechanical polishing can be used for removing the surface damage of the wafer during wire cutting in the wafer (silicon wafer) forming process so as to improve the surface roughness of the wafer.

Taking a double-sided chemical mechanical polishing device as an example, the polishing liquid comes out of the filter to perform chemical mechanical polishing on the wafer and then returns to the filter, so that the consumption of the polishing liquid is saved by recycling. When the grinding fluid reaches the expected service life, the grinding fluid is drained from the drain tank, and the filter is replaced periodically during the use of the grinding fluid.

The existing chemical mechanical polishing device is easy to crystallize into large particles when being directly exposed to air because the discharged polishing solution is in a supersaturated state due to the fact that the polishing solution is used for a long time and contains a large amount of ground debris when the polishing solution or the filter is replaced. When the grinding liquid is sprayed or stays on the inner side wall or the bottom of the liquid discharge groove, if the grinding liquid is not washed manually in time, particles formed by grinding liquid crystallization directly block a liquid discharge port of the liquid discharge groove, so that the process of replacing the grinding liquid is not simple and convenient, and the grinding liquid crystallization easily forms particles and is not favorable for air cleanliness of a clean room.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a liquid drainage device and a chemical mechanical polishing device, so as to improve the convenience of the operation of replacing polishing liquid.

To solve the above technical problem, the present invention provides a liquid discharge apparatus, including: the bottom of the tank body is provided with a drainage unit; the wetting unit is arranged on the inner side wall of the groove body and is used for providing liquid to wet the inner wall of the groove body and the liquid drainage unit.

Optionally, the device further comprises a liquid level sensing unit, wherein the liquid level sensing unit is arranged in the tank body and located below the wetting unit, and the liquid level sensing unit is electrically connected with the wetting unit so as to control the closing of the wetting unit according to the inspection result of the liquid level sensing unit.

Optionally, the wetting unit is arranged between 2/3-1 of the height of the groove body.

Optionally, the wetting unit is arranged around the inner side wall of the tank body.

Optionally, the wetting unit includes an annular pipeline and set up in a plurality of shower nozzles on the annular pipeline, the annular pipeline set up in the inner wall of cell body, it is a plurality of the hydrojet direction orientation of shower nozzle the inside wall of cell body.

Optionally, the liquid levels sprayed by two adjacent spray heads are at least partially overlapped with each other.

Optionally, at least one of the nozzles is an atomizing nozzle.

Optionally, the liquid is deionized water.

Optionally, the liquid discharge unit includes at least one liquid discharge port and a filter screen disposed on the liquid discharge port.

According to another aspect of the present invention, the present invention further provides a chemical mechanical polishing apparatus, including a chemical mechanical polishing unit and the liquid drainage apparatus as described above, where the chemical mechanical polishing unit has a liquid outlet for draining polishing liquid into a tank body of the liquid drainage apparatus.

In summary, the liquid discharge apparatus and the chemical mechanical polishing apparatus provided by the utility model have the following advantages: utilize the wetting unit that sets up on the lateral wall in the cell body, provide liquid with the inner wall and the flowing back unit of wetting cell body when changing lapping liquid or lapping liquid filter for the lapping liquid in the dilution cell body in time drains, need not the manual washing cell body and has the cleaning performance of preferred, thereby promotes the convenience of changing the lapping liquid operation.

Drawings

It will be appreciated by those skilled in the art that the drawings are provided for a better understanding of the utility model and do not constitute any limitation to the scope of the utility model. Wherein:

FIG. 1 is a schematic side view of a drain provided in an embodiment of the present application;

fig. 2 is a schematic top view of a drainage device provided in an embodiment of the present application.

In the drawings:

10-a tank body; 11-a liquid discharge unit;

20-a wetting unit; 21-a spray head; 22-ring line;

30-a liquid level sensing unit; 40-a chemical mechanical polishing unit; 41-liquid outlet.

Detailed Description

To further clarify the objects, advantages and features of the present invention, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It is to be noted that the drawings are in greatly simplified form and are not to scale, but are merely intended to facilitate and clarify the explanation of the embodiments of the present invention. Further, the structures illustrated in the drawings are often part of actual structures. In particular, the drawings may have different emphasis points and may sometimes be scaled differently.

It will be understood that when an element or layer is referred to as being "on" …, "or" connected to "other elements or layers, it can be directly on, connected to, or intervening elements or layers may be present. In contrast, when an element is referred to as being "directly on …", "directly connected to" other elements or layers, there are no intervening elements or layers present. Although the terms first, second, third, etc. may be used to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present invention. Spatial relationship terms such as "below … …", "below", "lower", "above … …", "above", "upper", and the like may be used herein for ease of description to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, then elements or features described as "below" … …, or "beneath" would then be oriented "on" other elements or features. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatial descriptors used herein interpreted accordingly. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and/or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. As used herein, the term "and/or" includes any and all combinations of the associated listed items.

Fig. 1 is a side view of a liquid discharge apparatus provided in an embodiment of the present application, and fig. 2 is a top view of the liquid discharge apparatus provided in the embodiment of the present application.

As shown in fig. 1 and fig. 2, the liquid discharge apparatus provided in this embodiment can be used in a chemical mechanical polishing process, and includes a tank 10, a wetting unit 20, and a liquid level sensing unit 30. The bottom of the tank 10 is provided with a liquid discharge unit 11. The wetting unit 20 is disposed on the inner sidewall of the tank body 10. The liquid level sensing unit 30 is disposed in the tank body 10 and below the wetting unit, and the liquid level sensing unit 30 is electrically connected to the wetting unit 20.

The tank 10 may be made of any suitable material having corrosion resistance against the polishing liquid, such as stainless steel, organic glass, plastic, etc. A liquid discharge unit 11 is provided at the bottom of the tank 10, and the liquid discharge unit 11 is used to discharge the waste slurry. The drainage unit 11 may, for example, comprise at least one drainage port and a screen disposed on the drainage port. Specifically, the liquid outlet may be located in the middle of the bottom of the tank body 10, and the filter aperture of the filter screen should be relatively large to prevent the filter screen from being blocked by the crystal particles of the grinding fluid.

Referring to fig. 1, the tank 10 may be a rectangular parallelepiped, and the wetting unit 20 is disposed on the inner sidewall of the tank 10 for providing liquid to wet the inner wall of the tank 10 and the liquid discharging unit 11. Preferably, the wetting unit 20 utilizes the liquid film formed on the inner wall of the tank 10 and the liquid discharge unit 11 to achieve a better wetting effect. The height of the wetting unit 20 disposed on the inner wall of the tank 10 is 2/3-1 of the height of the tank 10, so as to increase the wetting area and provide a better wetting effect. Optionally, the wetting unit 20 is disposed on the top of the sidewall of the tank 10 to facilitate the cooperation with the cmp unit 40.

Further, referring to fig. 2, the wetting unit 20 surrounds the inner wall of the tank 10 and contacts with the inner wall of the tank 10, so as to provide a complete wetting effect for the inner wall of the tank 10 under the wetting unit 20 and save the space of the tank 10. The shape of the wetting unit 20 is matched to the sectional shape of the tank body 10. Specifically, in the present embodiment, the wetting unit 20 includes a circular pipeline 22 and a plurality of nozzles 21 disposed on the circular pipeline 22. The annular pipeline 22 may be fixedly connected to the inner side wall of the tank 10, and may be, for example, rectangular, the plurality of nozzles 21 may be uniformly disposed on the annular pipeline 22, the liquid level sprayed from all the nozzles 21 all face the corresponding inner side wall of the tank 10, and the liquid levels sprayed from two adjacent nozzles 21 are at least partially overlapped with each other, so as to wet the side wall and the bottom wall of the tank 10 with the liquid sprayed from the nozzles 21, form a liquid film on the inner wall of the tank 10, and then converge into the liquid discharge unit 11 to wet the liquid discharge port and the filter screen and then discharge the liquid film. In practice, the liquid level sprayed from the spray head 21 may incline towards the inner side wall of the tank body 10, so as to enlarge the liquid level sprayed from the spray head, thereby forming a more uniform liquid film covering the inner side wall of the tank body 10.

Preferably, the spray heads 21 of the wetting unit 20 may be an atomizer to spray a large liquid surface using the atomizer to reduce the number of the spray heads 21 and provide uniformity of the liquid film. The liquid in the ring-shaped pipe 22 may be, for example, deionized water (DIW), wherein the temperature of the deionized water may be normal temperature, or slightly higher than the temperature of the polishing slurry (slightly higher than normal temperature) to further improve the dilution and dissolution effects.

It should be noted that the wetting unit 20 may be opened before replacing the slurry or the slurry filter to wet the inner sidewall of the tank 10 and the liquid discharge unit 11, that is, a liquid film is formed on the inner sidewall of the tank 10 and the surface of the liquid discharge unit 11, so that the slurry waste liquid discharged from the cmp unit 40 may be quickly diluted and dissolved and discharged when being discharged into the tank 10, and then the switch of the wetting unit 20 may be closed after replacing the slurry or the slurry filter. It should be understood that, unlike the longer the time that the slurry waste liquid remains on the inner wall of the tank 10 or the liquid discharge unit 11, the larger and more firmly the particles formed by the crystallization of the slurry waste liquid are, and the higher the difficulty of the subsequent washing is, in this embodiment, the liquid film formed on the inner wall of the tank 10 and the liquid discharge unit 11 in advance is utilized to dilute and discharge the slurry waste liquid in time, which is relatively simple and trouble-saving. In addition, compared with the manual flushing, the wetting unit 20 of the present embodiment consumes only a small amount of water (liquid volume), and can achieve the purpose of saving water.

Referring to fig. 1, the liquid discharging device of the present embodiment further includes a liquid level sensing unit 30, the liquid level sensing unit 30 is disposed in the tank 10 and below the wetting unit 20, and the liquid level sensing unit 30 is electrically connected to the wetting unit. The wetting unit 20 may further include an electromagnetic valve, and the liquid level sensing unit 30 is electrically connected to the electromagnetic valve of the wetting unit 20, and the liquid flows into the annular pipeline 22 and the spray head 21 through the electromagnetic valve. In particular, the liquid level sensing unit 30 and the wetting unit 20 may be configured to: when the liquid level sensing unit 30 detects the liquid level, it sends a signal to the solenoid valve of the wetting unit 20 and closes the solenoid valve to prevent the liquid level from rising too high when the liquid discharge unit 11 is clogged.

Referring to fig. 1, the present invention further provides a chemical mechanical polishing apparatus for performing a chemical mechanical polishing process on a wafer (silicon wafer), the chemical mechanical polishing apparatus includes a chemical mechanical polishing unit 40 and the above-mentioned liquid discharge device. Specifically, the liquid discharge device includes a tank 10 and a wetting unit 20, the wetting unit 20 is disposed on an inner sidewall of the tank 10 for providing a liquid to wet the inner wall of the tank 10, and the chemical mechanical polishing unit 40 may be any suitable polishing unit, for example, double-sided polishing in a process of forming a silicon wafer, single-sided polishing or polishing of a dielectric layer material in a process of forming a semiconductor device, polishing of a conductive material, and the like. Specifically, the cmp unit 40 is provided with a liquid outlet 41, the liquid outlet 41 is located at the bottom of the cmp unit 40, for example, and is used for discharging the waste grinding fluid (grinding fluid) into the tank 10, and the liquid outlet 41 is located in the tank 10 of the liquid discharging device and below the wetting unit 20, so that the wetting unit 20 provides the liquid to wet the waste grinding fluid, which may contact the inner wall of the tank 10.

The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.

Claims

1. A drain, comprising:

the bottom of the tank body is provided with a drainage unit;

the wetting unit is arranged on the inner side wall of the groove body and is used for providing liquid to wet the inner wall of the groove body and the liquid drainage unit.

2. The drain of claim 1, further comprising a liquid level sensing unit disposed in the tank below the wetting unit, the liquid level sensing unit being electrically connected to the wetting unit to control the closing of the wetting unit according to a result of the inspection by the liquid level sensing unit.

3. The drainage device as claimed in claim 1, wherein the wetting unit is arranged between 2/3-1 of the height of the groove body.

4. The drain of claim 1, wherein the wetting cell is disposed around an interior side wall of the tank.

5. The drainage device as claimed in claim 4, wherein the wetting unit comprises a ring-shaped pipeline and a plurality of nozzles arranged on the ring-shaped pipeline, the ring-shaped pipeline is arranged on the inner wall of the tank body, and the liquid spraying directions of the nozzles face to the inner side wall of the tank body.

6. The drain of claim 5, wherein the liquid levels emitted by two adjacent jets at least partially overlap one another.

7. The drain of claim 6, wherein at least one of the spray heads is an atomizing spray head.

8. The drain of any one of claims 1-7, wherein the liquid is deionized water.

9. The drain of claim 1, wherein the drain unit comprises at least one drain port and a screen disposed over the drain port.

10. A chemical mechanical polishing apparatus comprising a chemical mechanical polishing unit and the liquid discharge apparatus of any one of claims 1 to 9, wherein the chemical mechanical polishing unit has a liquid outlet for discharging a polishing liquid into a tank of the liquid discharge apparatus.