CN208422866U - Etching cleaning machine rinsing bowl - Google Patents
Etching cleaning machine rinsing bowl Download PDFInfo
- Publication number
- CN208422866U CN208422866U CN201820663331.7U CN201820663331U CN208422866U CN 208422866 U CN208422866 U CN 208422866U CN 201820663331 U CN201820663331 U CN 201820663331U CN 208422866 U CN208422866 U CN 208422866U
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- China
- Prior art keywords
- silicon wafer
- rinsing bowl
- cleaning machine
- knife
- high pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004140 cleaning Methods 0.000 title claims abstract description 48
- 238000005530 etching Methods 0.000 title claims abstract description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 120
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 120
- 239000010703 silicon Substances 0.000 claims abstract description 120
- 239000007921 spray Substances 0.000 claims abstract description 52
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 49
- 230000005540 biological transmission Effects 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 6
- 239000002033 PVDF binder Substances 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 4
- -1 polypropylene Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 229920002981 polyvinylidene fluoride Polymers 0.000 claims description 4
- 239000000126 substance Substances 0.000 abstract description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000005516 engineering process Methods 0.000 abstract description 7
- 230000003628 erosive effect Effects 0.000 abstract description 3
- 239000002699 waste material Substances 0.000 description 12
- 239000000243 solution Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000001458 anti-acid effect Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 238000007605 air drying Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 241000521257 Hydrops Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 206010030113 Oedema Diseases 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011010 flushing procedure Methods 0.000 description 1
- 239000008233 hard water Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000020477 pH reduction Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 235000011149 sulphuric acid Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
- 229940095676 wafer product Drugs 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
A kind of etching cleaning machine rinsing bowl is provided in the utility model embodiment, the etching cleaning machine rinsing bowl includes groove body, silicon wafer transmission device and multiple high pressure spray fog knives: the groove body is provided with through silicon wafer entrance and the silicon wafer outlet of side wall；The silicon wafer transmission device is set to inside the groove body, and both ends and silicon wafer entrance and silicon wafer outlet connect；The multiple high pressure spray fog knife is set to the silicon wafer inlet inside the groove body, towards the silicon wafer transmission device；The connecting tube of the high pressure spray fog knife is connected to water supply line.Rinsing bowl in embodiment can rinse silicon chip surface using multiple high pressure spray fog knives, and hydraulic pressure is larger, and cleaning dynamics is high；And since high pressure spray fog knife is set to silicon wafer inlet, silicon wafer can also be rinsed in time after silicon wafer enters rinsing bowl, avoid chemical solutions excessive erosion silicon chip surface.The rinsing bowl solves the problems such as silk screen parallel resistance in last part technology is low, card leakage ratio is high, effectively improves battery production yield.
Description
Technical field
The utility model relates to solar battery sheet production fields, more particularly to a kind of etching cleaning machine rinsing bowl.
Background technique
In field of new energy generation, solar cell power generation occupies consequence.Solar battery can directly by
Electric energy is converted to electric energy, has many advantages, such as that pollution-free, the service life is long, Maintenance free using.Therefore solar battery sheet in recent years
Manufacture production rapidly develop, photovoltaic plant and it is distributed application also demand it is very big.
In the production process of solar battery sheet, the effect of wet etching cleaning machine utilizes HF/HNO3/H2SO4
Mixed liquor corrodes silicon wafer lower surface and edge after diffusion, removes the N-type silicon at edge, so that the upper and lower surface of silicon wafer is mutual
Insulation, to reduce edge current leakage.Wet etching cleaning machine needs largely to use chemicals in technical process, and remaining mixed
Closing solution will affect silicon wafer processing procedure effect, thus all clean preceding road remainingization using sink after chemicals tank in silicon wafer
Product, are recycled using pure water, the cleaning silicon chip surface by the way of flushing, remove the remaining chemical solutions of silicon chip surface.
In currently available technology although the rinsing bowl of etching cleaning machine has cavernous nozzle water knife when rinsing silicon wafer, but its
Silicon wafer is only rinsed with water column, and hydraulic pressure is lower, cannot effectively remove in the first time that silicon wafer enters rinsing bowl and be attached to silicon
Current process requirement is not achieved in the chemicals on piece surface, cleaning effect.And above-mentioned drawback also causes cell piece in last part technology
In the presence of the problems such as such as silk screen parallel resistance is low, card leakage ratio is high, the yield of cell piece production is influenced.
Utility model content
A kind of etching cleaning machine rinsing bowl is provided in the utility model embodiment, to effective cleaning silicon chip remained on surface
Chemicals mixed solution, promoted cell piece production yield, the etching cleaning machine rinsing bowl includes groove body, silicon wafer transmission device
With multiple high pressure spray fog knives, in which:
The groove body is provided with through silicon wafer entrance and the silicon wafer outlet of side wall；
The silicon wafer transmission device is set to inside the groove body, and both ends and silicon wafer entrance and silicon wafer outlet connect；
The multiple high pressure spray fog knife is set to the silicon wafer inlet inside the groove body, transmits and fills towards the silicon wafer
It sets；The connecting tube of the high pressure spray fog knife is connected to water supply line.
In one embodiment, the rinsing bowl includes 2 high pressure spray fog knives, and 2 high pressure sprays fog knife is vertical
To being placed in silicon wafer transmission device two sides on direction.
In one embodiment, the etching cleaning machine rinsing bowl further includes connecing liquid box and overflow port, described to connect the setting of liquid box
In the underface of the multiple high pressure spray fog knife, it is connected to the overflow port.
In one embodiment, the liquid box that connects is obliquely installed in the underface of the multiple high pressure spray fog knife, bottom
Minimum point and overflow open height maintain an equal level.
In one embodiment, the high pressure spray fog knife is provided with 16 high-pressure nozzles laterally arranged along cutter hub.
In one embodiment, the etching cleaning machine rinsing bowl further includes valve, and the valve is set to connecting tube and supplies
The connectivity part of waterpipe.
In one embodiment, the valve is polypropylene material valve.
In one embodiment, the etching cleaning machine rinsing bowl further includes multiple cavernous nozzle water knives, the cavernous nozzle
Water knife is set to inside the groove body, is intended for the silicon wafer transmission device.
In one embodiment, the etching cleaning machine rinsing bowl further includes air knife, and the air knife is set in the groove body
The silicon wafer exit in portion is intended for the silicon wafer transmission device.
In one embodiment, the connecting tube is 3.5 millimeters of diameter of PVDF material water pipe.
The etching cleaning machine rinsing bowl provided in the utility model embodiment, for removing silicon chip surface in remaining chemistry
Product solution, the rinsing bowl include groove body, silicon wafer transmission device and multiple high pressure spray fog knives；Silicon wafer entrance is provided on groove body side wall
And silicon wafer outlet, the both ends of silicon wafer transmission device and silicon wafer entrance and silicon wafer outlet connect, multiple high pressure spray fog knives are set to
Silicon wafer inlet inside groove body, the spray head of water knife is towards silicon wafer transmission device, the connecting tube and water supplying pipe of high pressure spray fog knife
Road connection.Rinsing bowl in the utility model embodiment rinses silicon chip surface using multiple high pressure spray fog knives, and hydraulic pressure is larger, can
To effectively remove the chemicals for being attached to silicon chip surface；It, can also be and since high pressure spray fog knife is set to silicon wafer inlet
Silicon wafer rinses silicon wafer after entering rinsing bowl in time, avoids chemical solutions excessive erosion silicon chip surface, influences last part technology.The water
Washing trough solves the problems such as silk screen parallel resistance in last part technology is low, card leakage ratio is high, effectively improves battery production yield.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it is also possible to obtain other drawings based on these drawings.In the accompanying drawings:
Fig. 1 is the structural schematic diagram of etching cleaning machine rinsing bowl in the utility model embodiment；
Fig. 2 is the structural schematic diagram of the utility model embodiment mesohigh spray water knife.
Specific embodiment
It is right with reference to the accompanying drawing for the objectives, technical solutions, and advantages of the embodiments of the present invention are more clearly understood
The utility model embodiment is described in further details.Here, the illustrative embodiments and their description of the utility model are for solving
The utility model is released, but is not intended to limit the scope of the present invention.
As shown in Figure 1 and Figure 2, a kind of etching cleaning machine rinsing bowl is provided in the utility model embodiment, to effectively clear
The remaining chemicals mixed solution of silicon chip surface is washed, promotes cell piece production yield, the etching cleaning machine rinsing bowl includes slot
Body 100, silicon wafer transmission device 102 and multiple high pressure spray fog knives 101, in which:
The groove body 100 is provided with through silicon wafer entrance and the silicon wafer outlet of side wall；
The silicon wafer transmission device 102 is set to inside the groove body 100, and both ends connect with silicon wafer entrance and silicon wafer outlet
It connects；
The multiple high pressure spray fog knife 101 is set to the silicon wafer inlet inside the groove body 100, towards the silicon wafer
Transmission device 102；The connecting tube 202 of the high pressure spray fog knife 101 is connected to water supply line.
The working principle of etching cleaning machine rinsing bowl in the utility model embodiment are as follows: silicon wafer is completed etching or pickling etc. and changed
After product process, enter inside groove body 100 via silicon wafer entrance, silicon wafer is then sent to by silicon by silicon wafer transmission device 102
Piece exports and enters back segment process；It when silicon wafer is inside groove body, needs effectively to rinse the surface of silicon wafer, removes surface
Chemicals: enter the first time of groove body in silicon wafer, the high pressure spray fog knife 101 of showerhead face phase silicon wafer soon rinses silicon wafer
Surface washes away the chemical solutions for being attached to silicon chip surface completely in time, avoids chemicals excessive corrosion silicon wafer.
In actual test, compared with existing rinsing bowl, rinsing quality is obviously improved the rinsing bowl in the present embodiment, can be with
Effectively promote cell piece yield: silk screen parallel resistance RSH is promoted than before, promotes till now 310 by original 250 ohm
Ohm；The leakage of silk screen card is on a declining curve, drops to present 0.4% by original 0.5%；Cell piece yield is promoted, by original
97.78% promoted till now 98.91%.
In one embodiment, the installation number of high pressure spray fog knife 101 can be there are many embodiment.For example, the water
Washing trough may include 2 high pressure spray fog knives 101.In implementation, the installation site of 2 high pressure spray fog knives 101 can equally have
Multiple embodiments.For example, as shown in Figure 1, in order at the first time can be to the upper and lower of silicon wafer after silicon wafer enters groove body 100
Surface is rinsed simultaneously, and 2 high pressure spray fogs knife 101 can be in the vertical direction to being placed in the silicon wafer transmission device
102 two sides.In implementation, a high pressure spray fog knife 101 is respectively set in silicon wafer inlet, about 102 silicon wafer transmission device, not only
High pressure can be also saved to greatest extent in the upper and lower surface for first time effective cleaning silicon wafer that silicon wafer enters groove body 100
The installation number of spray water knife 101 reduces the improvement cost of rinsing bowl.
In one embodiment, in order to avoid rinsing the recirculated water for 100 lower part of waste liquor contamination groove body that silicon wafer generates, protect always
The cleaning of recirculated water is held, waste water discharging device can be set inside rinsing bowl.The setting of waste water discharging device can there are many
Embodiment, for example, as shown in Figure 1, the etching cleaning machine rinsing bowl can also include meeting liquid box 103 and overflow port 104, institute
It states and connects the underface that liquid box 103 is set to the multiple high pressure spray fog knife 101, be connected to the overflow port 104.In implementation,
The underface that liquid box 103 is located at multiple high pressure spray fog knives 101 is connect, the waste liquid for rinsing silicon wafer generation can be accepted and passes through overflow
Groove body 100 is discharged in the waste liquid that mouth 104 will directly be mixed with chemicals.
In one embodiment, the setting for connecing liquid box 103 can be there are many embodiment.For example, as shown in Figure 1, in order to make
The waste liquid for connecing the undertaking of liquid box 103 can smoothly after undertaking first time discharge rinsing bowl, avoid waste liquid from connecing liquid box 103
Middle spilling, pollute lower section recirculated water, liquid box 103 can be docked, certain tilt angle is set, thus it is described connect liquid box 103 can
To be obliquely installed in the underface of multiple high pressure spray fog knives 101；And in order to allow waste liquid that rinsing bowl is all discharged, it avoids
Hydrops in liquid box 103 is connect, the minimum point for connecing 103 bottom of liquid box can highly maintain an equal level with overflow port 104.In implementation, further
Liquid box 103 is connect in order to prevent, waste liquid is overflowed or splashed out during accepting waste liquid, can will connect liquid box 103 and be set as disk
Shape connects 103 edge protuberance of liquid box, intermediate slightly lower compared with edge, plays the role of liquid splashing prevention effect, discharge.
In one embodiment, the setting of high-pressure nozzle 201 can be there are many embodiment party on 101 cutter hub of high pressure spray fog knife
Case.For example, in order to the chemicals waste liquid to silicon chip surface wash away it is more thorough, can on the cutter hub of water knife laterally be arranged it is more
A high-pressure nozzle 201 towards silicon wafer transmission device 102, in implementation, as shown in Fig. 2, in order to guarantee that it is clean that silicon wafer washes away
Under the premise of save cost as far as possible, 16 high-pressure nozzles laterally arranged along cutter hub can be set in the high pressure spray fog knife 101
201。
In one embodiment, the etching cleaning machine rinsing bowl in present invention implementation is also provided with high pressure spray fog knife
101 control device.The selection of control device can there are many embodiments, for example, as shown in Fig. 2, control device can be
Valve 203, the valve 203 are set to connecting tube 202 and water supply line connectivity part, for controlling high pressure spray fog knife 101
Switch and pressure.
In one embodiment, the material selection of the valve 203 can be there are many embodiment.For example, due to polypropylene
The mechanical property that material has is strong, and chemical stability is strong, is not easy by the characteristic of acid liquid corrosion, and rinsing bowl Long Term Contact acidification
Product, thus the service life in order to guarantee valve 203, the valve 203 can be polypropylene material matter valve.
In one embodiment, the setting for washing trough inner water knife can be there are many embodiment.For example, as shown in Figure 1, in order to
Residual solution can be removed with big flow water column after high pressure washing silicon wafer, the etching cleaning machine rinsing bowl can also include more
A cavernous nozzle water knife 105, the multiple cavernous nozzle water knife 105 are set to inside the groove body 100, are intended for the silicon wafer
Transmission device 102.
It,, can be in groove body in order to remove the residual water mark of silicon chip surface after flushed to silicon wafer in one embodiment
Air-drying device is arranged in 100 inside.The selection of air-drying device can be there are many embodiment, for example, the etching cleaning machine is washed
Slot further includes air knife 106, and the air knife 106 is set to the silicon wafer exit inside the groove body 100, is intended for the silicon wafer and passes
Send device 102.
In one embodiment, the selection of connecting tube 202 can be there are many embodiment.For example, due to the circulation of rinsing bowl
Doped with a small amount of acid-base waste fluid in water, thus connecting tube 202 is corroded by acid-base waste fluid in order to prevent, guarantees connecting tube 202
Service life, the connecting tube 202 can be antiacid buck pipe.
In one embodiment, the selection of antiacid buck pipe can be there are many embodiment.For example, due to PVDF material water pipe
With intensity height, the characteristic of acid/alkali-corrosion-resistant, thus the antiacid buck pipe can be PVDF material water pipe.
In one embodiment, the setting of 202 size of connecting tube can be there are many embodiment.For example, it is contemplated that total to board
Hydraulic pressure but fixed range value, and water consumption can be increased by installing high pressure spray fog knife 101 additional, and original water knife can because shunt and
The case where decompression, thus the connecting tube 202 of high pressure spray fog knife 101 can be protected with the connection pipe diameter of water supply line and raw water knife
It holds unanimously, i.e., the described connecting tube 202 can be formed by connecting by the hard water pipe of 3.5 millimeters of multiple diameters, 75.5 centimetres of length.
In implementation, the rinsing bowl in the present embodiment be can be set in etching groove back segment or descaling bath back segment.Due to being set to
The recirculated water of the rinsing bowl lower part of descaling bath back segment is the ultrapure water DI-Water directly accessed by factory service end, and cleannes are high, i.e.,
It falls into the waste liquid for rinsing silicon chip surface chemicals in recirculated water, the cleaning effect of recirculated water will not be influenced, thus described set
The rinsing bowl for being placed in descaling bath back segment, which need not add, connects liquid box, it is only necessary to multiple high pressure spray fog knives are added inside rinsing bowl
101 can effectively promote the cleaning effect to silicon wafer.And the recirculated water of etching groove back segment rinsing bowl is washed by descaling bath back segment
The recirculated water of slot accesses, thus cleannes are poor, and such as addition connects liquid box 103 inside it, can be obviously improved cleaning effect.
In conclusion the etching cleaning machine rinsing bowl provided in the utility model embodiment, exists for removing silicon chip surface
Remaining chemical solutions, the rinsing bowl include groove body, silicon wafer transmission device and multiple high pressure spray fog knives；It is opened on groove body side wall
There are silicon wafer entrance and silicon wafer outlet, the both ends of silicon wafer transmission device and silicon wafer entrance and silicon wafer outlet to connect, multiple high-pressure fogs
Water knife is set to the silicon wafer inlet inside groove body, and the spray head of water knife is towards silicon wafer transmission device, the connection of high pressure spray fog knife
Pipe is connect with water supply line.Rinsing bowl in the utility model embodiment rinses silicon chip surface using multiple high pressure spray fog knives,
Hydraulic pressure is larger, can effectively remove the chemicals for being attached to silicon chip surface；And since high pressure spray fog knife is set to silicon wafer entrance
Place, can also rinse in time silicon wafer after silicon wafer enters rinsing bowl, chemical solutions excessive erosion silicon chip surface be avoided, after influencing
Segment process.The rinsing bowl solves the problems such as silk screen parallel resistance in last part technology is low, card leakage ratio is high, effectively improves electricity
Pond production yield.
Particular embodiments described above has carried out into one the purpose of this utility model, technical scheme and beneficial effects
Step is described in detail, it should be understood that being not used to limit this foregoing is merely specific embodiment of the utility model
The protection scope of utility model, within the spirit and principle of the utility model, any modification for being made, changes equivalent replacement
Into etc., it should be included within the scope of protection of this utility model.
Claims (10)
1. a kind of etching cleaning machine rinsing bowl, which is characterized in that the etching cleaning machine rinsing bowl includes groove body (100), silicon wafer
Transmission device (102) and multiple high pressure spray fog knives (101), in which:
The groove body (100) is provided with through silicon wafer entrance and the silicon wafer outlet of side wall；
The silicon wafer transmission device (102) is set to the groove body (100) inside, both ends and silicon wafer entrance and silicon wafer outlet connects
It connects；
The multiple high pressure spray fog knife (101) is set to the internal silicon wafer inlet of the groove body (100), towards the silicon wafer
Transmission device (102)；The connecting tube (202) of the high pressure spray fog knife (101) is connected to water supply line.
2. etching cleaning machine rinsing bowl as described in claim 1, which is characterized in that the rinsing bowl includes 2 high-pressure fogs
Water knife (101), 2 high pressure spray fogs knife (101) is in the vertical direction to being placed in the silicon wafer transmission device (102) two
Side.
3. etching cleaning machine rinsing bowl as described in claim 1, which is characterized in that the etching cleaning machine rinsing bowl further includes
Connect liquid box (103) and overflow port (104), it is described connect liquid box (103) be set to the multiple high pressure spray fog knife (101) just under
Side, is connected to the overflow port (104).
4. etching cleaning machine rinsing bowl as claimed in claim 3, which is characterized in that it is described connect liquid box (103) be obliquely installed in
The underface of the multiple high pressure spray fog knife (101), the minimum point of bottom and overflow port (104) height maintain an equal level.
5. etching cleaning machine rinsing bowl as described in claim 1, which is characterized in that high pressure spray fog knife (101) setting
There are 16 high-pressure nozzles laterally arranged along cutter hub (201).
6. etching cleaning machine rinsing bowl as described in claim 1, which is characterized in that the etching cleaning machine rinsing bowl further includes
Valve (203), the valve (203) are set to the connectivity part of connecting tube (202) and water supply line.
7. etching cleaning machine rinsing bowl as claimed in claim 6, which is characterized in that the valve (203) is polypropylene material
Valve.
8. etching cleaning machine rinsing bowl as described in any one of claim 1 to 7, which is characterized in that the etching cleaning machine water
Washing trough further includes multiple cavernous nozzle water knives (105), and the multiple cavernous nozzle water knife (105) is set to the groove body (100)
Inside is intended for the silicon wafer transmission device (102).
9. etching cleaning machine rinsing bowl as described in any one of claim 1 to 7, which is characterized in that the etching cleaning machine water
Washing trough further includes air knife (106), and the air knife (106) is set to the internal silicon wafer exit of the groove body (100), is intended for institute
State silicon wafer transmission device (102).
10. etching cleaning machine rinsing bowl as described in any one of claim 1 to 7, which is characterized in that the connecting tube (202)
For 3.5 millimeters of diameter of PVDF material water pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820663331.7U CN208422866U (en) | 2018-05-04 | 2018-05-04 | Etching cleaning machine rinsing bowl |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820663331.7U CN208422866U (en) | 2018-05-04 | 2018-05-04 | Etching cleaning machine rinsing bowl |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208422866U true CN208422866U (en) | 2019-01-22 |
Family
ID=65116770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820663331.7U Active CN208422866U (en) | 2018-05-04 | 2018-05-04 | Etching cleaning machine rinsing bowl |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208422866U (en) |
-
2018
- 2018-05-04 CN CN201820663331.7U patent/CN208422866U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220711 Address after: 314417 No. 1 Jisheng Road, Jiaxing City, Zhejiang Province Patentee after: Zhengtai Xinneng Technology Co.,Ltd. Address before: 310053 No. 1335 Bin'an Road, Binjiang District, Hangzhou City, Zhejiang Province Patentee before: CHINT SOLAR (ZHEJIANG) Co.,Ltd. |
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| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 314417 No. 1 Jisheng Road, Jiaxing City, Zhejiang Province Patentee after: Zhengtai Xinneng Technology Co.,Ltd. Address before: 314417 No. 1 Jisheng Road, Jiaxing City, Zhejiang Province Patentee before: Zhengtai Xinneng Technology Co.,Ltd. |