TWI820940B - Spraying and cleaning system, substrate processing device and cleaning method of nozzle thereof - Google Patents

Abstract

The present application provides a spraying and cleaning system, including: an integrated spray head, a first supply system, and a second supply system. The integrated spray head includes a first nozzle, a second nozzle, and a sleeve. The sleeve is circumferentially disposed outside the first nozzle and the second nozzle, and the second nozzle communicates with a space between the sleeve and the first nozzle. The first supply system is connected to the first nozzle and is configured to supply process liquid. The second supply system is connected to the second nozzle and is configured to provide a substance to clean residues remaining on the first nozzle.

Description

Spraying and cleaning systems, substrate processing devices and cleaning methods for their nozzles

The present disclosure relates to the field of semiconductors, and in particular to a spraying and cleaning system, a substrate processing device and a cleaning method for a nozzle of the substrate processing device.

Semiconductor substrates can be wet etched or cleaned using a single wafer rotating machine. However, after the chemical liquid is sprayed, the chemical liquid easily remains in the nozzle, so that when the substrate is subsequently cleaned, the remaining chemical liquid will contaminate the cleaning solution, thereby affecting the quality of the product.

In view of this, it is necessary to provide a substrate processing device and cleaning method to solve the above technical problems.

In order to solve the problems of the above-mentioned conventional technologies, the purpose of this application is to provide a spraying and cleaning system, a substrate processing device and a cleaning method of a nozzle of the substrate processing device, which integrates the main nozzle cleaning components and the nozzle to avoid nozzle cleaning. The components and the nozzle are separated, resulting in misalignment during cleaning, thereby ensuring that the nozzle can be reliably cleaned.

In order to achieve the above object, the present application provides a spraying and cleaning system, including: an integrated sprinkler head, a first supply system and a second supply system. The integrated nozzle includes a first nozzle, a second nozzle and a sleeve, wherein the sleeve is circumferentially arranged outside the first nozzle and the second nozzle, and the second nozzle is connected to Pass the space between the sleeve and the first nozzle. The first supply system is connected to the first nozzle and configured to provide process liquid. The second supply system is connected to the second nozzle and configured to provide a substance to clean residue remaining on the first nozzle.

In some embodiments, the second supply system includes a negative pressure supply device configured to provide negative pressure to extract the residue remaining on the first nozzle.

In some embodiments, the second supply system includes a cleaning liquid supply configured to provide cleaning liquid to flush and remove the residue remaining on the first nozzle.

In some embodiments, the second supply system includes a gas supply device configured to provide drying gas to remove the residue remaining on the first nozzle and to dry the first nozzle.

In some embodiments, the length of the sleeve is greater than the length of the first nozzle in the vertical direction.

In some embodiments, the second nozzle is provided with a plurality of spout openings, and the plurality of spout openings are annularly disposed in the space between the sleeve and the first nozzle.

This application also provides a substrate processing device, including: a substrate holding part, a spraying and cleaning system as described above, and a moving device. The substrate holding portion holds the substrate. The moving device is connected to the spraying and cleaning system and is used to control the integrated nozzle of the spraying and cleaning system to move between a standby position and a position above the substrate holding part.

The application also provides a method for cleaning a nozzle of a substrate processing device, which includes: providing a substrate processing device, which includes a substrate holding part and a spraying and cleaning system as described above; placing a substrate on the substrate holding part; controlling the The first nozzle of the spraying and cleaning system sprays the process liquid along a path above the substrate; stops spraying the process liquid; and controls the second supply system of the spraying and cleaning system to provide substances to clean the residue remaining on the first nozzle things.

In some embodiments, the second supply system includes a negative pressure supply device, and controlling the supply system to provide the substance includes: providing negative pressure through the negative pressure supply device to extract the residue remaining on the first nozzle. things.

In some embodiments, the substrate processing apparatus further includes a moving device configured to control the integrated nozzle of the spraying and cleaning system to move between a standby position and a position above the substrate holding portion. Before spraying the process liquid, the cleaning method further includes: controlling the integrated nozzle of the spraying and cleaning system to move from the standby position to the substrate holding part through the moving device. After stopping spraying the process liquid, the negative pressure supply device is started, and then the integrated nozzle of the spraying and cleaning system is controlled by the moving device to move to the standby position.

In some embodiments, the second supply system includes a cleaning liquid supply device, and controlling the supply system to provide the substance includes: providing cleaning liquid through the cleaning liquid supply device to rinse and remove the residue remaining on the first nozzle. residue.

In some embodiments, the second supply system includes a gas supply device, and controlling the supply system to provide the substance includes: providing dry gas through the gas supply device to remove the residue remaining on the first nozzle and blowing Dry the first nozzle.

Compared with the prior art, this application provides a spraying and cleaning system, a substrate processing device and a cleaning method for a nozzle of the substrate processing device, which can remove residues remaining on the nozzle to avoid substrate contamination or excessive etching. In addition, by integrating the first nozzle for providing the process liquid and the second nozzle for providing the cleaning substance, the distance between the two is kept constant. Therefore, when the second nozzle is used to perform the cleaning operation of the first nozzle, it is ensured that the first nozzle can be aligned and cleaned by the second nozzle, and the cleaning effect will not be reduced due to misalignment between the two. .

10:Substrate processing device

11:Substrate holding part

12: Integrated nozzle

121, 221: first nozzle

122, 222: Casing

123, 223: Second nozzle

13:First supply system

14:Second supply system

141: Negative pressure supply device

142: Cleaning liquid supply device

143:Gas supply device

15, 25: First pipeline

16, 26: Second pipeline

17:Mobile device

171: Rotating lifting column

172:Long arm

18: Positioning parts

2:Substrate

P1: Standby position

A, B: points

O: center point

R: path

V1: first valve

V2: Second valve

V3: The third valve

V4: The fourth valve

Figure 1 shows a schematic diagram of the substrate processing device according to the first embodiment of the present application; Figure 2 shows a partial top view of the substrate processing device of Figure 1; Figure 3 shows a schematic diagram of the integrated nozzle of the spraying and cleaning system of the substrate processing device of Figure 1; FIG. 4 shows a first operational schematic diagram of the substrate processing apparatus according to the embodiment of the present application; FIG. 5 shows a second operational schematic diagram of the substrate processing apparatus according to the embodiment of the present application; FIG. 6 shows the third operational schematic diagram of the substrate processing apparatus according to the embodiment of the present application. Three operational schematic diagrams; Figure 7 shows a fourth operational schematic diagram of the substrate processing device according to the embodiment of the present application; Figure 8 shows a schematic diagram of the integrated nozzle of the spraying and cleaning system according to the second embodiment of the present application.

In order to make the above and other objects, features, and advantages of the present application more obvious and understandable, preferred embodiments of the present application will be cited in the following and described in detail with reference to the attached drawings.

Please refer to FIGS. 1 and 2 . FIG. 1 shows a schematic diagram of a substrate processing device according to a first embodiment of the present application, and FIG. 2 shows a partial top view of the substrate processing device of FIG. 1 . The substrate processing device 10 is used to perform various processes on the substrate, such as wet etching or removing particles on the surface of the substrate. The substrate processing apparatus 10 includes a substrate holding part 11 , an integrated nozzle 12 , a first supply system 13 , a second supply system 14 , a first pipeline 15 , a second pipeline 16 and a moving device 17 . In this embodiment, the integrated nozzle 12, the first supply system 13, the second supply system 14, the first pipeline 15 and the second pipeline 16 together constitute the spraying and cleaning system of the present application. It should be understood that in FIG. 2 , the substrate processing apparatus 10 includes three spraying and cleaning systems. However, other numbers of spraying and cleaning systems may be included in other embodiments, and the invention is not limited thereto.

As shown in FIG. 1 , the substrate holding unit 11 includes a rotating disk for holding the substrate 2 . Alternatively, the substrate can be adsorbed on the rotating disk by vacuum adsorption, or the substrate can be clamped and fixed on the rotating disk by a clamping mechanism, which is not limited thereto.

Please refer to FIG. 3 , which shows a schematic diagram of an integrated nozzle of the spraying and cleaning system of the substrate processing device of FIG. 1 . The integrated nozzle 12 includes a first nozzle 121 , a sleeve 122 and a second nozzle 123 . The sleeve 122 is set outside the first nozzle 121 and the second nozzle 123 . Specifically, the first nozzle 121 and the second nozzle 123 extend in the vertical direction. The sleeve 122 includes an annular wall extending in a vertical direction and first and second ends located on opposite sides of the annular wall. The first end of the sleeve 122 is provided with a top wall, and the top wall is provided with two small openings. The second end of sleeve 122 is an open channel without physical shielding. The annular wall of the sleeve 122 is arranged circumferentially outside the first nozzle 121 and the second nozzle 123 . The first nozzle 121 and the second nozzle 123 respectively extend to the interior of the sleeve 122 through two small openings at the first end of the sleeve 122 . The gas or liquid sprayed by the first nozzle 121 and the second nozzle 123 is discharged from the second end of the sleeve 122 . The first nozzle 121 is disposed close to the central axis in the casing 122 , and the second nozzle 123 is disposed between the first nozzle 121 and the annular wall of the casing 122 . That is, the second nozzle 123 communicates with the space between the sleeve 122 and the first nozzle 121 . It should be noted that in the vertical direction, the length of the sleeve 122 is greater than the length of the first nozzle 121 , so the opening caliber of the second end of the sleeve 122 can limit the spray range of the first nozzle 121 to avoid the sprayed process liquid in the Excessive spatter on substrate 2. Furthermore, within the sleeve 122 , compared with the position of the discharge outlet of the first nozzle 121 , the discharge outlet of the second nozzle 123 is relatively close to the first end of the sleeve 122 . Similarly, compared with the position of the spray outlet of the second nozzle 123 , the spray outlet of the first nozzle 121 is relatively close to the second end of the sleeve 122 . Therefore, the gas or liquid sprayed by the second nozzle 123 will reach the outer wall and end of the first nozzle 121 .

As shown in FIGS. 1 and 3 , the first supply system 13 is connected to the first nozzle 121 through the first pipeline 15 , and the second supply system 14 is connected to the second nozzle 123 through the second pipeline 16 . first supply system 13 is configured to provide process liquid, such as etching liquid, etc. The second supply system 14 is configured to provide a substance to clean residue remaining on the first nozzle 121 . As shown in FIG. 1 , the second supply system 14 includes a negative pressure supply device 141 , a cleaning liquid supply device 142 and a gas supply device 143 . The negative pressure supply device 141 can provide negative pressure. The cleaning liquid supply device 142 may provide cleaning liquid, such as deionized water. The gas supply device 143 can provide dry gas, such as clean dry air or nitrogen.

It should be understood that the second nozzle 123 serves as a component that mainly applies the substance that cleans the first nozzle 121 . That is to say, the relative distance between the first nozzle 121 and the second nozzle 123 will directly affect the cleaning effect of the first nozzle 121 . In this application, since the first nozzle 121 and the second nozzle 123 are integrated together, the distance between them remains fixed. Therefore, when the second nozzle 123 performs the cleaning operation of the first nozzle 121, it is ensured that the first nozzle 121 can be aligned and cleaned by the second nozzle 123, and will not be damaged due to alignment deviation between the two. Resulting in reduced cleaning effect.

As shown in FIGS. 1 to 3 , the moving device 17 is connected to the spraying and cleaning system, and is used to control the integrated nozzle 12 of the spraying and cleaning system to move between a standby position P1 and a position above the substrate holding portion 11 . The moving device 17 includes a rotating lifting column 171 and a long arm 172 . As shown in FIG. 3 , the integrated nozzle 12 is fixed to one end of the long arm 172 through the positioning member 18 , and the other end of the long arm 172 is connected to the rotating lifting column 171 . As shown in FIG. 2 , the rotating lifting column 171 is provided around the outside of the substrate holding part 11 and is spaced apart from the substrate holding part 11 . When the rotating lifting column 171 rotates, the long arm 172 can drive the integrated nozzle 12 to move together. For example, the moving device 17 can control the integrated nozzle 12 to move from the standby position P1 to the substrate holding part 11 , so that the first nozzle 121 sprays the corresponding process liquid along a path R above the substrate 2 . The path R consists of movement from a point A on the edge of the substrate 2 towards a center point O of the substrate 2 and then from the center point O of the substrate 2 towards another point B on the edge of the substrate 2 . In some embodiments, the rotating lifting column 171 is connected to the rotating driving part and the lifting driving part respectively, wherein the rotating driving part and the lifting driving part may adopt the method of dividing the rotating lifting column 171 into two parts. It can be implemented by connecting with two different driving devices (such as motors), or by integrating the rotating driving part and the lifting driving part on the same driving device and further connecting with the rotating lifting column 171 . The rotating lifting column 171 can be driven to rotate around a rotating axis by driving the rotating driving part, thereby driving the long arm 172 to drive the integrated nozzle 12 to move along the path R on the horizontal plane. Furthermore, by driving the lifting driving part, the rotating lifting column 171 can be driven to perform a vertical lifting movement in a direction perpendicular to the horizontal plane, thereby changing the horizontal height of the integrated nozzle 12 .

The present application also provides a method for cleaning a nozzle of a substrate processing device, which integrates the main nozzle cleaning component with the first nozzle 121, and uses the second nozzle 123 and the second supply system 14 to provide corresponding substances to realize the second nozzle cleaning method. The cleaning of the nozzle 121, the specific spraying and cleaning steps, and the specific configuration of each component will be described in detail later.

Please refer to FIGS. 1, 2 and 4. FIG. 4 shows a first operational schematic diagram of the substrate processing apparatus according to the embodiment of the present application. When the substrate processing device 10 processes a substrate, the substrate processing device 10 as shown in FIG. 1 is first provided. It should be understood that the specific structures of each component of the substrate processing apparatus 10 are as described above and will not be described again here. Next, the substrate 2 is placed on the substrate holding portion 11 . As shown in FIG. 2 , after the substrate 2 is held in the substrate holding part 11 , the integrated nozzle 12 of the spraying and cleaning system is controlled by the moving device 17 to move from the standby position P1 to above the substrate holding part 11 along a path R. Perform reciprocating motion. As shown in Figure 4, at this time, the first valve V1 on the first pipeline 15 is opened, and the second valve V2, the third valve V3 and the fourth valve V4 on the second pipeline 16 are closed. The first supply system 13 provides the process liquid to the first nozzle 121 through the first pipeline 15 , and the first nozzle 121 sprays the process liquid onto the substrate 2 . Furthermore, since the valve on the second line 16 is closed, the second supply system 14 does not provide substance to the second nozzle 123 . That is to say, in this step, the first nozzle 121 is controlled by the moving device 17 to spray the process liquid along the path R above the substrate 2 to perform various processes on the substrate 2 , such as wet etching.

Please refer to FIG. 5 , which shows a second operational schematic diagram of the substrate processing device according to the embodiment of the present application. After the first nozzle 121 sprays for a period of time, the first valve V1 on the first pipeline 15 closes and stops spraying the process liquid. At this time, in order to prevent the process liquid remaining on the inner wall of the first nozzle 121 and the sleeve 122 from dripping on the substrate 2 , the negative pressure supply device 141 of the second supply system 14 is started. Specifically, the second valve V2 on the second pipeline 16 is opened, and the remaining valves on the first pipeline 15 and the second pipeline 16 are closed. At this time, since the length of the casing 122 is greater than the length of the first nozzle 121, the negative pressure supply device 141 provides negative pressure, and the vacuum force can be used to smoothly extract the residue on the inner wall of the first nozzle 121 and the casing 122. residues to prevent the residues from dripping on the surface of the substrate 2 and to prevent the substrate 2 from being contaminated by chemical liquid or over-etched. During this step, residues include process fluids and/or other possible contaminants.

As shown in FIG. 2 , after the first nozzle 121 stops spraying the process liquid, the moving device 17 controls the integrated nozzle 12 to move to the standby position P1 . The standby position P1 is provided with a tank. It should be noted that the movement of the integrated nozzle 12 to the standby position P1 and the activation of the negative pressure supply device 141 can be started at the same time, or can be performed sequentially after a period of time. However, when the two actions occur at different time points, it is better to start the negative pressure supply device 141 first and then move the integrated nozzle 12. This can avoid the remaining process liquid being thrown off due to moving the integrated nozzle 12 first.

Please refer to FIG. 6 , which shows a third operational schematic diagram of the substrate processing device according to the embodiment of the present application. As shown in Figure 6, when the control integrated nozzle 12 is positioned at the standby position P1, the first valve V1 on the first pipeline 15 remains closed, the third valve V3 on the second pipeline 16 is opened, and the second pipeline The remaining valves on 16 are closed. At this time, the cleaning liquid supply device 142 of the second supply system 14 is turned on. The cleaning liquid supply device 142 provides cleaning liquid to the second nozzle 123 through the second pipeline 16, and the second nozzle 123 sprays the cleaning liquid onto the first nozzle 121 and the inner wall of the sleeve 122, thereby flushing and removing the residue on the first nozzle 122. squirt Residues on the inner walls of mouth 121 and sleeve 122. Residues include, for example, process liquids and crystals thereof. It can be understood that the sprayed cleaning liquid and residue can be collected and discharged through the tank located at the standby position P1.

Please refer to FIG. 7 , which shows a fourth operational schematic diagram of the substrate processing device according to the embodiment of the present application. The cleaning liquid supply device 142 stops outputting cleaning liquid, and closes the third valve V3 on the second pipeline 16 . Then, the first valve V1 on the first line 15 remains closed, the fourth valve V4 on the second line 16 is opened, and the remaining valves on the second line 16 are closed. At this time, the gas supply device 143 of the second supply system 14 is turned on. The gas supply device 143 provides dry gas to the second nozzle 123 through the second pipeline 16, and the second nozzle 123 applies the dry gas to the first nozzle 121 and the inner wall of the sleeve 122, thereby removing the residue on the first nozzle 121 and the inner wall of the sleeve 122. The first nozzle 121 blows away the residue on the inner wall of the casing 122 . Residues include, for example, process liquid, cleaning liquid, foreign particles, etc.

Please refer to FIG. 8 , which shows a schematic diagram of an integrated nozzle of a spraying and cleaning system according to a second embodiment of the present application. The integrated nozzle of this embodiment includes a first nozzle 221, a sleeve 222 and a second nozzle 223. The sleeve 222 is arranged circumferentially outside the first nozzle 221 and the second nozzle 223 . The first nozzle 221 is connected to the first pipeline 25 , and the second nozzle 223 is connected to the second pipeline 26 . The integrated nozzle of the second embodiment is substantially the same as the integrated nozzle of the first embodiment. The difference lies in that the second nozzle 223 of the second embodiment is provided with a plurality of ejection ports. The spray outlets are annularly arranged in the space between the sleeve 222 and the first nozzle 221 . Through the design of multiple nozzles, the second nozzle 223 can evenly apply the substance to the space between the sleeve 222 and the first nozzle 221 to improve the efficiency of cleaning residues.

Compared with the prior art, this application provides a spraying and cleaning system, a substrate processing device and a cleaning method for a nozzle of the substrate processing device, which can remove residues remaining on the nozzle to avoid substrate contamination or excessive etching. In addition, by integrating the first nozzle for providing the process liquid and the second nozzle for providing the cleaning substance, the distance between the two is kept constant. Therefore, when through the second When the nozzle performs the cleaning operation of the first nozzle, it is ensured that the first nozzle can be aligned and cleaned by the second nozzle, and the cleaning effect will not be reduced due to misalignment between the two.

The above are only preferred embodiments of the present disclosure. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of the present disclosure. These improvements and modifications should also be regarded as part of the present disclosure. scope of protection.

10:Substrate processing device

11:Substrate holding part

12: Integrated nozzle

13:First supply system

14:Second supply system

141: Negative pressure supply device

142: Cleaning liquid supply device

143:Gas supply device

15:First pipeline

16:Second pipeline

17:Mobile device

171: Rotating lifting column

172:Long arm

2:Substrate

Claims (12)

A spraying and cleaning system includes: an integrated spray head, including a first nozzle, a second nozzle and a sleeve, wherein the sleeve is circumferentially arranged outside the first nozzle and the second nozzle, and the third Two nozzles communicate with the space between the sleeve and the first nozzle, and the second nozzle is aligned with the first nozzle; a first supply system connected to the first nozzle and configured to provide a process liquid; and a first supply system connected to the first nozzle and configured to provide a process liquid; The second supply system is connected to the second nozzle and is configured to provide a substance to clean a residue remaining on the first nozzle; wherein the process liquid is an etching liquid. The spraying and cleaning system of claim 1, wherein the second supply system includes a negative pressure supply device configured to provide a negative pressure to extract the residue remaining on the first nozzle. The spraying and cleaning system of claim 1, wherein the second supply system includes a cleaning liquid supply device configured to provide a cleaning liquid to rinse and remove the residue remaining on the first nozzle. The spraying and cleaning system of claim 1, wherein the second supply system includes a gas supply device configured to provide a dry gas to remove the residue remaining on the first nozzle and blow dry the first nozzle. The spraying and cleaning system of claim 1, wherein the length of the sleeve is greater than the length of the first nozzle in a vertical direction. The spraying and cleaning system of claim 1, wherein the second nozzle is provided with a plurality of spray outlets, and the plurality of spray outlets are annularly arranged in the space between the sleeve and the first nozzle. A substrate processing device including: A substrate holding part for holding a substrate; the spraying and cleaning system as described in any one of claims 1 to 6; and a moving device connected to the spraying and cleaning system for controlling the spraying and cleaning system An integrated nozzle moves between a standby position and a position above the substrate holding part. A method for cleaning a nozzle of a substrate processing device, including: providing a substrate processing device, the substrate processing device including a substrate holding part and the spraying and cleaning system as described in any one of claims 1 to 6; in the substrate holding part Place a substrate on the substrate; control the first nozzle of the spraying and cleaning system to spray the process liquid along a path above the substrate; stop spraying the process liquid; and control the second supply system of the spraying and cleaning system to provide the substance To clean the residue remaining on the first nozzle. The cleaning method of a nozzle of a substrate processing device as claimed in claim 8, wherein the second supply system includes a negative pressure supply device, and controlling the supply system to provide the substance includes: providing a negative pressure through the negative pressure supply device to extract Remove the residue remaining on the first nozzle. The cleaning method of a nozzle of a substrate processing device as claimed in claim 9, wherein the substrate processing device further includes a moving device configured to control an integrated nozzle of the spraying and cleaning system between a standby position and the substrate holding part. Move between upper positions; wherein before spraying the process liquid, the cleaning method further includes: controlling the integrated nozzle of the spraying and cleaning system through the moving device to move from the standby position to above the substrate holding part; and The negative pressure supply device is started after the spraying of the process liquid is stopped, and then the integrated nozzle of the spraying and cleaning system is controlled by the moving device to move to the standby position. The cleaning method of a nozzle of a substrate processing device as claimed in claim 8, wherein the second supply system includes a cleaning liquid supply device, and controlling the supply system to provide the substance includes: providing a cleaning liquid for flushing through the cleaning liquid supply device and remove the residue remaining on the first nozzle. The cleaning method of a nozzle of a substrate processing device as claimed in claim 8, wherein the second supply system includes a gas supply device, and controlling the supply system to provide the substance includes: providing a dry gas through the gas supply device to remove residual The residue on the first nozzle and blow dry the first nozzle.

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