CN112845294B - Injection module and cleaning agent recovery system - Google Patents
Injection module and cleaning agent recovery system Download PDFInfo
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- CN112845294B CN112845294B CN202011627398.3A CN202011627398A CN112845294B CN 112845294 B CN112845294 B CN 112845294B CN 202011627398 A CN202011627398 A CN 202011627398A CN 112845294 B CN112845294 B CN 112845294B
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- cleaning agent
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- cleaning
- nozzle
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B2203/00—Details of cleaning machines or methods involving the use or presence of liquid or steam
- B08B2203/02—Details of machines or methods for cleaning by the force of jets or sprays
- B08B2203/0217—Use of a detergent in high pressure cleaners; arrangements for supplying the same
Abstract
The invention provides a spraying module and a cleaning agent recovery system, wherein on one hand, the spraying module comprises a first input pipeline for inputting a first cleaning agent; the first input pipeline is communicated with a return pipeline; and inputting the first cleaning agent into the return pipeline for recycling before spraying. On the other hand, the recovery component and the recovery processing module which are positioned in the cavity of the cleaning module extract the first cleaning agent for recovery after the sprayed waste liquid is processed. The recovery of the cleaning agent is carried out before the spraying, and the waste liquid after the wafer cleaning is treated and then recovered, so that the recovery rate of the cleaning agent is effectively improved, and the production cost is reduced.
Description
Technical Field
The invention relates to the technical field of wafer manufacturing, in particular to a spraying module and a cleaning agent recovery system.
Background
Wafer refers to the process of cleaning the wafer used for manufacturing silicon semiconductor circuit, and removing the pollutants generated by contacting with various organic matters, particles and metals in the process of continuously processing, shaping and polishing the wafer. Is an important process step in the wafer manufacturing process.
In a semiconductor cleaning process, particularly in the manufacture of high-level wafer products such as logic integrated circuits, storage, power devices and the like, the wafer products are processed by various complicated processes such as photolithography, wet process, deposition, oxidation and the like, and the process of cleaning the substrate is performed before or after each process to remove foreign matters and particles generated in each process, thereby ensuring the accuracy and reproducibility of the subsequent process yield.
When cleaning a wafer, various cleaning agents are often used in combination, however, in the prior art, the recovery rate of the cleaning agents such as sulfuric acid is not high, which causes resource waste and increases the production cost.
Disclosure of Invention
The invention provides a spraying module and a cleaning agent recovery system, and aims to solve the technical problems that the recovery rate of a cleaning agent is low, the production cost is high, and the like in the prior art.
A spray module for cleaning a surface of a wafer, comprising:
a support bar;
the spray head is connected with the upper end of the supporting rod, and a spray nozzle is fixedly connected to the spray head;
the nozzle comprises a first injection channel, and the first injection channel is communicated with a first input pipeline for inputting a first cleaning agent;
the first input pipeline is provided with a first three-way valve which is communicated with a return pipeline;
the first three-way valve comprises a first channel and a second channel and is used for opening the first channel according to an input control command to input the first cleaning agent into the nozzle, closing the first channel according to a return control command, opening the second channel and inputting the first cleaning agent into the return pipeline for recycling.
Further, the nozzle comprises a second injection channel, and the second injection channel is communicated with a second input pipeline for inputting a second cleaning agent;
the nozzle is used for mixing the first cleaning agent and the second cleaning agent and then spraying mixed liquid to the surface of the wafer below.
Further, the first input pipeline, the second input pipeline and the return pipeline are all embedded in the supporting rod and the spray head.
Furthermore, the first three-way valve is arranged inside the spray head.
Furthermore, a driving component is connected to the lower end of the supporting rod, and the driving component is used for driving the supporting rod to perform lifting motion so as to control the relative height between the nozzle and the surface of the wafer, and is also used for driving the supporting rod to perform rotary motion so as to control the nozzle to perform reciprocating rotation to spray the mixed liquid on the wafer.
A cleaning agent recovery system comprises the spraying module for recovering a first cleaning agent used for a wafer, and comprises:
the first acid supply module is used for inputting the first cleaning agent to the nozzle through the first input pipeline;
the return pipeline arranged on the injection module returns the first cleaning agent before injection to the first acid supply module based on the opening of the second channel of the first three-way valve;
the recovery component is positioned in the cavity of the cleaning module and used for recovering the waste liquid after the surface of the wafer is cleaned and conveying the waste liquid to a recovery processing module through a recovery pipeline;
and the recovery processing module is used for processing the waste liquid, and the first cleaning agent obtained after the processing is input into the first acid supply module.
Further, the first acid supply module comprises a first buffer tank for storing the heated first cleaning agent, and the first buffer tank is communicated with the first input pipeline and the return pipeline.
Furthermore, the first acid supply module further comprises at least one second buffer tank for storing unheated first cleaning agent, each second buffer tank is communicated with the first buffer tank through a pipeline, the second buffer tank is controlled to input the heated first cleaning agent to the first buffer tank when the first cleaning agent in the first buffer tank is lower than a preset lower limit plane, and the first cleaning agent in the first buffer tank is higher than a preset upper limit plane or the first cleaning agent in the second buffer tank is lower than the preset lower limit plane, and is controlled to stop inputting the heated first cleaning agent to the first buffer tank.
Further, the first acid supply module further comprises a recovery buffer tank for recovering the first cleaning agent obtained after the recovery processing module is processed, the recovery buffer tank is communicated with one of the second buffer tank, the recovery buffer tank is used for communicating the first cleaning agent in the second buffer tank, the first cleaning agent is lower than a preset lower limit plane and is controlled to input the first cleaning agent into the second buffer tank, the first cleaning agent in the second buffer tank is higher than a preset upper limit plane or the first cleaning agent in the recovery buffer tank is lower than the preset lower limit plane and is controlled to stop inputting the first cleaning agent into the second buffer tank.
Further, the first cleaning agent is sulfuric acid.
The beneficial technical effects of the invention are as follows: the invention provides a spraying module and a cleaning agent recovery system, which can effectively improve the recovery rate of the cleaning agent and reduce the production cost by recovering the cleaning agent before spraying and recovering the waste liquid after cleaning a wafer after treatment.
Drawings
FIG. 1 is a schematic diagram illustrating an overall structure of an embodiment of an injection module according to the present invention;
FIG. 2 is a schematic view of a nozzle structure of an embodiment of a spray module according to the present invention;
FIG. 3 is a block diagram of one embodiment of a cleaning agent recovery system of the present invention;
FIG. 4 is a schematic diagram of a cleaning agent storage structure of an acid supply module of the cleaning agent recovery system according to the present invention;
FIG. 5 is a schematic structural diagram of an acid supply module according to the present invention;
FIG. 6 is a top view of the cleaning module and the spray module of the present invention;
FIG. 7 is a side view of a cleaning module of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
Referring to fig. 1-2, a spray module for cleaning a surface of a wafer (10) comprises:
a support bar (11);
the spray head (12), the spray head (12) is connected with the upper end of the supporting rod (11), and the spray head (12) is fixedly connected with a spray nozzle (13);
the nozzle (13) comprises a first injection channel (131), and the first injection channel (131) is communicated with a first input pipeline (15) for inputting a first cleaning agent;
the first input pipeline (15) is provided with a first three-way valve (18) which is communicated with a return pipeline (16) through the first three-way valve;
the first three-way valve (18) comprises a first channel and a second channel and is used for opening the first channel according to an input control instruction to input a first cleaning agent into the nozzle (13), closing the first channel according to a return control instruction, opening the second channel and inputting the first cleaning agent into the return pipeline (16) for recovery.
Specifically, when the first cleaning agent is detected to be not qualified, for example, the temperature is not qualified with the spraying standard, and the concentration is not qualified with the spraying standard, the second channel of the first three-way valve (18) is opened to allow the first cleaning agent to flow back. Specifically, the first cleaning agent is sulfuric acid. Specifically, the second cleaning agent is hydrogen peroxide.
Furthermore, the nozzle (13) comprises a second injection channel (132), and the second injection channel (132) is communicated with a second input pipeline (17) for inputting a second cleaning agent;
the nozzle (13) is used for mixing the first cleaning agent and the second cleaning agent and then spraying the mixed liquid to the surface of the wafer below.
Furthermore, the first input pipeline (15), the second input pipeline (17) and the return pipeline (16) are all embedded in the supporting rod (11) and the spray head (12).
Furthermore, the first three-way valve (18) is arranged inside the spray head (12).
Furthermore, the lower end of the support rod (11) is connected with a driving member (14), and the driving member (14) is used for driving the support rod (11) to perform lifting motion so as to control the relative height of the nozzle (13) and the surface of the wafer (10), and is also used for driving the support rod (11) to perform rotation motion so as to control the nozzle (13) to rotate back and forth to spray the mixed liquid on the wafer (10).
Referring to fig. 1-7, the present invention further provides a cleaning agent recycling system, including the aforementioned spray module, for recycling the first cleaning agent used for the wafer, including:
the first acid supply module (2) is used for inputting a first cleaning agent to the nozzle (13) through a first input pipeline (15);
the cleaning agent spraying device comprises a spraying module (1), wherein a return pipeline (16) arranged on the spraying module (1) returns a first cleaning agent before spraying to a first acid supply module (2) based on the opening of a second channel of a first three-way valve (18);
the recycling component is positioned in the cavity of the cleaning module (4) and is used for recycling the waste liquid after the surface of the wafer is cleaned and conveying the waste liquid to a recycling treatment module (5) through a recycling pipeline;
and the recovery processing module (5) is used for processing the waste liquid, and the first cleaning agent obtained after the processing is input into the first acid supply module (2).
The appearance structures of the first acid supply module (2) and the recovery processing module (5) are shown in fig. 5. In the cleaning system of the wafer, the cleaning system further comprises a second acid supply module (3) for providing a second cleaning agent for the injection assembly (1), wherein the second cleaning agent is hydrogen peroxide. The appearance structure of the second acid supply module (3) is shown in fig. 5.
The cleaning module (4) and the spray module (1) are structured as shown in fig. 6 in a plan view, the cleaning module (4) is structured as shown in fig. 7 in a sectional view, the wafer (10) is placed on a carrying platform of the cleaning module (4), the cleaning module (4) includes a recovery member such as a recovery ring for recovering the waste liquid after cleaning sprayed to the upper surface of the wafer, and the cleaning module has a plurality of recovery rings for the rest of the waste liquid after cleaning.
Wash the return line intercommunication recovery ring of module (4), the return line sets up second three way valve (6), and to the first cleaner that needs the recovery, the first passageway of second three way valve (6) is opened, lets waste liquid flow in recovery processing module (5), and to all the other waste liquids, the second passageway of second three way valve (6) is opened, and first passageway is closed, gets rid of all the other waste liquids.
The recovery system has simple structural design and high recovery rate.
Further, the first acid supply module (2) comprises a first buffer tank (21) for storing the heated first cleaning agent, and the first buffer tank (21) is communicated with the first input pipeline (15) and the return pipeline (16).
The first buffer tank (21) is used for directly conveying a first cleaning agent to the injection module (1), and the return pipeline (16) directly returns the sulfuric acid before injection to the first buffer tank (21) in a recovery way, so that the sulfuric acid can be directly used for cleaning the wafer again. Compared with the traditional cleaning device for recovering the cleaned wafer, the recovery rate of the sulfuric acid is improved, the utilization rate of the sulfuric acid is further improved, and the production cost is reduced. And the frequency of supplying sulfuric acid to the first buffer tank (21) is reduced, and the cleaning efficiency is improved.
Furthermore, the first acid supply module (2) further comprises at least one second buffer tank (22) used for storing unheated first cleaning agents, each second buffer tank (22) is communicated with the first buffer tank (21) through a pipeline, the second buffer tanks (22) are controlled to input the heated first cleaning agents into the first buffer tanks (21) when the first cleaning agents in the first buffer tanks (21) are lower than a preset lower limit plane, and the first cleaning agents in the first buffer tanks (21) are controlled to stop inputting the heated first cleaning agents into the first buffer tanks (21) when the first cleaning agents are higher than a preset upper limit plane or the first cleaning agents in the second buffer tanks (22) are lower than the preset lower limit plane.
The sulfuric acid discharged from the second buffer tank (22) is heated by a heating member and then a first cleaning agent having a certain temperature, such as sulfuric acid, is supplied to the first buffer tank (21).
Further, first confession sour module (2) still includes one and retrieves dashpot (23), be used for retrieving the first cleaner that obtains after retrieving processing module (5) and handle, retrieve dashpot (23) and communicate one of them second dashpot (22), retrieve dashpot (23) and be arranged in the first cleaner in second dashpot (22) of intercommunication to be less than a predetermined lower limit plane and be controlled to input first cleaner to second dashpot (22), first cleaner in second dashpot (22) is higher than the predetermined upper limit plane or is retrieved first cleaner in dashpot (23) and is controlled to stop to input first cleaner to second dashpot (22) when being less than the predetermined lower limit plane.
Further, the first cleaning agent is sulfuric acid, and specifically, the second cleaning agent is hydrogen peroxide.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (8)
1. A spray module for cleaning a surface of a wafer (10), comprising:
a support bar (11);
the spray head (12), the spray head (12) is connected with the upper end of the supporting rod (11), and a spray nozzle (13) is fixedly connected to the spray head (12);
the nozzle (13) comprises a first injection channel (131), and the first injection channel (131) is communicated with a first input pipeline (15) for inputting a first cleaning agent;
a first three-way valve (18) is arranged on the first input pipeline (15) and is communicated with a return pipeline (16) through the first three-way valve;
the first three-way valve (18) comprises a first channel and a second channel and is used for opening the first channel according to an input control instruction to input the first cleaning agent into the nozzle (13), closing the first channel according to a return control instruction, opening the second channel and inputting the first cleaning agent into the return pipeline (16) for recovery; the nozzle (13) comprises a second injection channel (132), and the second injection channel (132) is communicated with a second input pipeline (17) for inputting a second cleaning agent;
the nozzle (13) is used for mixing the first cleaning agent and the second cleaning agent and then spraying a mixed solution to the surface of the wafer below;
the first input pipe (15), the second input pipe (17) and the return pipe (16) are embedded in the support rod (11) and the spray head (12).
2. An injection module according to claim 1, characterised in that said first three-way valve (18) is arranged inside said nozzle head (12).
3. A spraying module according to claim 1, wherein the lower end of the supporting rod (11) is connected to a driving member (14), the driving member (14) is used for driving the supporting rod (11) to perform an up-and-down motion to control the relative height between the nozzle (13) and the surface of the wafer (10), and is also used for driving the supporting rod (11) to perform a rotation motion to control the nozzle (13) to perform a reciprocating rotation to spray the mixed liquid onto the wafer (10).
4. A cleaning agent recycling system, comprising a spray module as claimed in any one of claims 1 to 3, for recycling a first cleaning agent used for a wafer, comprising:
the first acid supply module (2) is used for inputting the first cleaning agent to the nozzle (13) through the first input pipeline (15);
the return pipeline (16) arranged on the injection module (1) returns a first cleaning agent before injection to the first acid supply module (2) based on the opening of the second channel of the first three-way valve (18);
the recovery component is positioned in the cavity of the cleaning module (4) and used for recovering waste liquid after the surface of the wafer is cleaned and conveying the waste liquid to a recovery processing module (5) through a recovery pipeline;
and the recovery processing module (5) is used for processing the waste liquid, and inputting a first cleaning agent obtained after processing into the first acid supply module (2).
5. A cleaning agent recovery system according to claim 4, wherein the first acid supply module (2) comprises a first buffer tank (21) for storing the heated first cleaning agent, the first buffer tank (21) communicating the first inlet conduit (15) and the return conduit (16).
6. A cleaning agent recovery system according to claim 5, wherein the first acid supply module (2) further comprises at least one second buffer tank (22) for storing unheated first cleaning agent, each second buffer tank (22) being in communication with the first buffer tank (21) via a pipe, the second buffer groove (22) is controlled to input the heated first cleaning agent to the first buffer groove (21) when the first cleaning agent in the first buffer groove (21) is lower than a preset lower limit plane, when the first cleaning agent in the first buffer groove (21) is higher than a preset upper limit plane or the first cleaning agent in the second buffer groove (22) is lower than the preset lower limit plane, the first cleaning agent is controlled to stop inputting the heated first cleaning agent into the first buffer groove (21).
7. A cleaning agent recovery system according to claim 6, wherein the first acid supply module (2) further comprises a recovery buffer tank (23), used for recovering the first cleaning agent obtained after the treatment of the recovery treatment module (5), the recovery buffer groove (23) is communicated with one of the second buffer grooves (22), the recovery buffer tank (23) is used for controlling the first cleaning agent in the communicated second buffer tank (22) to be input into the second buffer tank (22) when the first cleaning agent is lower than a preset lower limit plane, when the first cleaning agent in the second buffer groove (22) is higher than the preset upper limit plane or the first cleaning agent in the recovery buffer groove (23) is lower than the preset lower limit plane, the first cleaning agent is controlled to stop inputting the first cleaning agent into the second buffer groove (22).
8. The cleaning agent recovery system of claim 4, wherein the first cleaning agent is sulfuric acid.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011627398.3A CN112845294B (en) | 2020-12-30 | 2020-12-30 | Injection module and cleaning agent recovery system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011627398.3A CN112845294B (en) | 2020-12-30 | 2020-12-30 | Injection module and cleaning agent recovery system |
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| CN112845294A CN112845294A (en) | 2021-05-28 |
| CN112845294B true CN112845294B (en) | 2022-06-24 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114054421A (en) * | 2021-11-04 | 2022-02-18 | 至微半导体(上海)有限公司 | Spray head mechanism for SPM cleaning process and using method thereof |
| CN114054234A (en) * | 2021-11-04 | 2022-02-18 | 至微半导体(上海)有限公司 | Multifunctional spray head mechanism for SPM cleaning process |
| CN114405072A (en) * | 2021-12-31 | 2022-04-29 | 至微半导体(上海)有限公司 | Spraying system suitable for chemical etching is used |
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| CN108787558A (en) * | 2018-04-26 | 2018-11-13 | 云南龙帜环境工程有限公司 | A kind of chemistry on-line cleaning system |
| CN111834259A (en) * | 2020-07-17 | 2020-10-27 | 中国科学院微电子研究所 | Cleaning assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10562078B2 (en) * | 2013-07-01 | 2020-02-18 | Ecp Incorporated | Vacuum spray apparatus and uses thereof |
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| CN101740450A (en) * | 2008-11-26 | 2010-06-16 | 细美事有限公司 | Substrate supporting unit, and apparatus and method for polishing substrate using the same |
| CN104827769A (en) * | 2014-02-07 | 2015-08-12 | 精工爱普生株式会社 | Liquid ejecting apparatus |
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