CN112802780A - Multifunctional pickling table device - Google Patents
Multifunctional pickling table device Download PDFInfo
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- CN112802780A CN112802780A CN202110171930.3A CN202110171930A CN112802780A CN 112802780 A CN112802780 A CN 112802780A CN 202110171930 A CN202110171930 A CN 202110171930A CN 112802780 A CN112802780 A CN 112802780A
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- tank
- pickling
- acid
- rinsing
- mechanical arm
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Abstract
The invention provides a multifunctional pickling table device, which comprises an equipment body and a control device, wherein: an operation platform is arranged in the middle of the equipment body, and an acid tank and a rinsing tank are arranged on the operation platform; a mechanical arm for controlling the movement of the sample is arranged above the operating platform; an air exhaust system is arranged on the circumferential side wall of the operating platform; the control device controls the movement of the mechanical arm and controls the cleaning procedures of the acid tank and the rinsing tank. The invention solves the problems of few types of acid tanks of the manual pickling station, single wafer size, incoherent process flow, complicated use process and the like, and greatly improves the safety and convenience when using equipment.
Description
Technical Field
The invention relates to the field of semiconductor wet process, in particular to a multifunctional pickling station device.
Background
In recent years, the semiconductor industry in China has been rapidly developed, and semiconductor chip design, manufacturing and back-end packaging technologies have been continuously innovated. As an important part of semiconductor design and manufacture, the technological innovation of wet etching requires a lot of experiments.
In practical experimental application, the wet etching must be equipped with a corresponding wet device, namely an acid washing station, so as to ensure the safety of personnel and experimental reliability in the production or experimental process. The functions of the pickling station can be divided into two categories: the wafer surface cleaning device comprises an etching function and a cleaning function, wherein the etching function is responsible for using different liquid medicines to react so as to achieve pattern transfer, and the cleaning function is mainly used for cleaning the surface of a wafer, such as particles, organic matters, metal ions and the like.
Due to the nature of the liquid medicine, the traditional laboratory pickling station can be designed with different pickling tanks to prevent other products from influencing the experimental result. The conventional laboratory pickling station has the following disadvantages: the number of pickling tanks of the equipment is small, and the function is single; the size of the groove body is fixed, and the variable quantity of the wafer size is small; the machine station occupies a large area and influences the layout of a laboratory; the operation is complex, and the liquid medicine is easy to be stained, thereby endangering the safety; manual operation, the process time cannot be accurately controlled; and other drying equipment is also needed to be arranged for dry in and wet out.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a multifunctional pickling station device.
The invention provides a multifunctional pickling station device, which comprises an equipment body and a control device, wherein:
an operation platform is arranged in the middle of the equipment body, and an acid tank and a rinsing tank are arranged on the operation platform;
a mechanical arm for controlling the movement of the sample is arranged above the operating platform;
an air exhaust system is arranged on the circumferential side wall of the operating platform;
the control device controls the movement of the mechanical arm and controls the cleaning procedures of the acid tank and the rinsing tank.
Preferably, a heating device is arranged in the acid tank, and the temperature of water in the tank is controlled by the heating device.
Preferably, a beaker fixing bayonet is further arranged in the acid tank, and the beaker is fixed through the beaker fixing bayonet.
Preferably, a hole plate is arranged beside the acid tank, and a leakage-proof disc is arranged below the hole plate.
Preferably, a water tap is arranged beside the acid tank.
Preferably, the rinsing bath includes a PFA bubbling device and/or an ultrasonic vibration device.
Preferably, the top of the apparatus body is provided with an FFU system capable of forming a downward air curtain.
Preferably, the wash tank further comprises a hot nitrogen line.
Preferably, the air extraction system comprises a plurality of air extraction grid openings arranged in the circumferential side wall of the operation platform and an air extraction device arranged in the side wall.
Preferably, the acid washing device further comprises a discharge system, wherein the discharge system is communicated with the acid tank and the water washing tank and comprises a plurality of discharge pipelines, and switching valve members are arranged among the plurality of discharge pipelines, the acid tank and the water washing tank.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention solves the problems of single type of pickling tank of the pickling station in a laboratory and cross contamination of a mixed tank of a plurality of liquid medicines by using a mode of replacing the beaker, and greatly improves the reliability of the experiment.
2. The traditional single acid tank may use mixed HCL and H2SO4The liquid medicines such as HF and the like influence the actual experimental result, but the specific beaker bears the specific liquid medicine, and only the beaker needs to be replaced for different experimental processes, so that the normal and stable experiment can be ensured even if the experimental mixed acid has various types and different proportions.
3. The invention is suitable for scenes with various experimental varieties and fewer operators.
4. The invention uses the beaker to replace an acid tank, greatly reduces the usage amount of the liquid medicine and solves the problem of high experimental cost.
5. According to the invention, by replacing the sample rack on the mechanical arm, wafer bearing with different sizes can be realized, and wafer compatibility is enriched.
6. According to the invention, after acid mixing action is carried out in the beaker by the control device, the beaker is only required to be clamped into the acid tank, and the sample is placed on the storage rack, so that an automatic program can be started to complete the whole set of pickling, cleaning and drying process, the operation is simple, the risk of human misoperation is reduced, and the safety and the convenience are greatly improved.
7. The invention realizes the dry-in and dry-out of the experiment wet pickling machine, namely, the dry sample is sent into the experiment to obtain the dry experimental sample. Greatly improving the experimental safety and reducing the experimental difficulty.
8. The invention is provided with a plurality of acid tanks, and can be provided with different liquid medicines to realize continuous short process, simulate the actual process flow of a semiconductor wet process machine and perfect the process.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural view of a multi-functional pickling line apparatus.
FIG. 2 is a schematic view of the internal structure of the multi-functional pickling line.
FIG. 3 is a schematic diagram of the discharge system of the multi-functional pickling line apparatus.
Fig. 4 is a control schematic diagram of the control device.
The figures show that:
FFU System 1
Sliding window 2
Air extraction opening 3
Sample holder 5
Hole plate 9
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
As shown in fig. 1 to 4, the multifunctional pickling station apparatus provided by the present invention comprises an apparatus body and a control device, wherein: an operation platform is arranged in the middle of the equipment body, and an acid tank and a rinsing tank are arranged on the operation platform; a mechanical arm for controlling the movement of the sample is arranged above the operating platform; an air exhaust system is arranged on the circumferential side wall of the operating platform; the control device controls the movement of the mechanical arm and controls the cleaning procedures of the acid tank and the rinsing tank.
In more detail, the acid tank of the present invention consists of a water bath heating tank and various beakers of different diameters. The beaker is used for mixing acid, the water bath heating tank can be set with heating temperature, the temperature control of the water temperature in the tank is realized through the heater in the tank, and the temperature control of the acid tank of the beaker is realized by means of heat conduction effect water-proof heating. The acid tank is provided with various beaker fixing buckles to fix beakers with different diameters, so that the wafer cleaning requirements of different diameters are met. The acid tank realizes the temperature control of the water temperature in the tank through the adsorption heater. By replacing the special beakers made of different materials, the wet test of different acid tank liquid medicines is realized, and 8 or 10 liquid medicines can be configured in a group for different liquid medicines (such as SPM SC 1). And water taps are arranged on two sides of the acid tank and used for washing beakers or performing emergency treatment. The other operation area of groove still is provided with the hole board for personnel mix the sour operation, prevent that mistake such as splashing from causing the chemicals and leak. The anti-leakage disc is arranged below the hole plate to facilitate the action of mixing acid.
The rinsing bath of the present invention is cleaned by rinsing the rinsing bath with deionized water (DIW). Still be provided with spraying system: the solid conical adjustable spray head can be sprayed to all wafers; the PFA bubbling system is arranged to ensure clean washing; a zigzag four-side overflow structure; internal impurities are taken away quickly by customizing the quick discharge valve; the ultrasonic vibration plate is arranged at the bottom of the tank, and the tank is driven to vibrate in a water-proof vibration mode, so that the cleaning effect is enhanced. The invention is provided with three rinsing tanks, wherein the middle rinsing tank is washed and cleaned by rinsing tank deionized water (DIW) to realize final cleaning, a water resistance value can be added to detect the cleaning effect, and a hot nitrogen pipeline is arranged to realize hot nitrogen purging and drying and realize dry in and out of a cleaning object.
The invention is provided with a plurality of acid tanks and rinsing tanks, and realizes short-process experiments by the combination of different acid tanks and rinsing tanks.
The mechanical arm drives the wafer sample to enter the pickling or rinsing bath through rotation and lifting. The sample rack is made of acid and alkali resistant materials, and the bottom platform is provided with a hole for bearing a sample to enter the pickling beaker or the water tank; according to the types and sizes of wafer samples, the sample holders with different diameters can be configured for replacement, and the requirements of wafers with multiple sizes are met. The mechanical arm is controlled to rotate by a motor, the mechanical arm is controlled to lift by a cylinder to drive the wafer sample to be cleaned, etched or washed, a PLC (programmable logic controller) is programmed in advance to control different rotating angles to enter different functional slot positions, and after the preset time is reached, the wafer is automatically lifted to switch different slot positions.
The air extraction system comprises a plurality of air extraction grid openings arranged on the side wall of the machine table, so that acid gas accumulation is avoided; the FFU system at the top of the device is matched with each other, the top FFU system integrates multiple groups of FFUs, a downward air curtain is formed to ensure that acid gas does not leak, the FFU system is matched with an air pumping system to form laminar flow, the acid gas is driven to be discharged, the leakage of the acid gas is inhibited, and the safety of experimenters is protected.
The discharging system is provided with different valves for controlling acid liquor discharging and switching to switch the acid discharging pipeline through programs. The acid tank is matched with the corresponding rinsing tank, and when acid is discharged, the preset program automatically switches the valve to select the acid discharge pipeline, so that special acid discharge is realized, and the liquid medicine is prevented from being mixed to form crystals. The control device comprises a PLC control system, a visual cleaning step interface is provided, a user writes a cleaning flow according to the use requirement, the PLC controls the water area to heat and control the temperature, and the mechanical arm and each valve piece in the tank to act, so that the continuous cleaning function is realized. The current configuration can realize 2 sour 2 water consecutive rinses, also can be according to current design theory, through increasing the sour water trench, satisfies more pickling demands.
According to the invention, after the acid mixing action is completed, a person clamps the beaker into the acid tank, places the sample on the storage rack, and starts the PLC to start the wet process. The invention solves the problems of few types of acid tanks of the manual pickling station, single wafer type, incoherent process flow, complicated use process and the like, and greatly improves the safety and convenience when using equipment.
In addition, the bottom area of the equipment is also provided with an emergency stop button, the equipment can be emergently stopped when an accident happens, and the equipment further comprises a PLC operation panel for a personnel operation interface. Still be provided with articles for use groove: inside are N2 guns and DI guns for purging and flushing. The bottom is provided with the austral window, sliding sash, and the maintenance operation is maintained to convenient the below emission pipeline etc..
The present invention will be described more specifically below with reference to preferred examples.
Preferred example 1:
the pickling station comprises an acid tank, a rinsing tank, a mechanical arm and a PLC system. The experimental personnel is positioned in an operation area and uses a sulfuric acid special beaker to carry out acid mixing action to prepare the sulfuric acid hydrogen peroxide solution, and uses an ammonia water special beaker to carry out acid mixing action to prepare the ammonia water hydrogen peroxide solution. And (3) placing the ammonia water hydrogen peroxide solution in the right acid tank for limiting, referring to fig. 2, placing the sulfuric acid hydrogen peroxide solution in the left acid tank for limiting, and heating in a water bath. And (3) placing the wafer on a sample placing table until the temperature of the hydrogen peroxide sulfate solution is stabilized at a set temperature. After the procedure needing cleaning (or etching) is confirmed to be correct, a cleaning button is started, the PLC controls the mechanical arm according to a preset program to drive the wafer to be immersed into the sulfuric acid beaker to start a wet process, and after the process time is up, the mechanical arm automatically takes out the wafer and enters the left water washing tank to start cleaning. And after the cleaning time is up, controlling the mechanical arm to drive the wafer to be immersed into the ammonia hydrogen peroxide solution beaker to start the wet process. And after the processing time is up, controlling the mechanical arm to drive the wafer to be immersed into the right rinsing bath to start cleaning. And after the cleaning time is up, controlling the mechanical arm to drive the wafer to be immersed into the intermediate rinsing bath for final cleaning, introducing hot nitrogen for drying after the cleaning is finished, and transferring the wafer sample to an operation area by the mechanical arm after the drying for a person to take down. After the completion, the staff pours the liquid medicine into respective acid tank, starts the acid discharge function, discharges to respective acid discharge pipeline, and cleans respective beaker, discharges respective pipeline again.
Preferred example 2:
the pickling station comprises an acid tank, a rinsing tank, a mechanical arm and a PLC system. A process related to the removal of the silicon dioxide layer is planned to be performed. The experimenter uses a hydrofluoric acid special beaker to perform acid mixing action in the operation area, matches hydrofluoric acid aqueous solution, uses an ammonia water special beaker to perform acid mixing action, and matches ammonia water hydrogen peroxide aqueous solution. Placing the hydrofluoric acid solution in the left acid tank for limiting; and (4) placing the ammonia water hydrogen peroxide solution in the right acid tank for limiting, and heating in a water bath. And (3) placing the wafer on a sample placing table until the temperature of the ammonia water and hydrogen peroxide solution is stabilized at a set temperature. After the procedure needing cleaning (or etching) is confirmed to be correct, a cleaning button is started, the PLC controls the mechanical arm according to a preset program to drive the wafer to be immersed into the hydrofluoric acid solution beaker to start a wet process, and after the process time is up, the mechanical arm automatically takes the wafer out and enters the left water washing tank to start cleaning. And after the cleaning time is up, controlling the mechanical arm to drive the wafer to be immersed into the ammonia hydrogen peroxide solution beaker to start the wet process. And after the processing time is up, controlling the mechanical arm to drive the wafer to be immersed into the right rinsing bath to start cleaning. And after the cleaning time is up, controlling the mechanical arm to drive the wafer to be immersed into the intermediate rinsing bath for final enzyme, introducing hot nitrogen for drying after the cleaning is finished, and transferring the wafer sample to an operation area by the mechanical arm after the drying for a person to take down. After the completion, the staff pours the liquid medicine into respective acid tank, starts the acid discharge function, discharges to respective acid discharge pipeline, and cleans respective beaker, discharges respective pipeline again.
Preferred example 3:
as shown in fig. 1, the pickling station includes an acid tank, a rinsing tank, a robot arm, and a PLC system. The related process of removing the metal layer is planned to be implemented. The experimenter is located the operation area and uses the special beaker of aluminium corrosive liquid to mix the acid action, ratio aluminium corrosive liquid aqueous solution, uses the special beaker of aqueous ammonia to mix the acid action, ratio aqueous ammonia hydrogen peroxide solution. Placing the aluminum corrosive liquid solution in the left acid tank for limiting, and heating in a water bath; the ammonia water hydrogen peroxide solution is placed in the right acid tank for limiting, and is heated in a water bath. And (3) placing the wafer on a sample placing table until the temperatures of the aluminum corrosive liquid and the ammonia water hydrogen peroxide solution are stabilized at the set temperature. After the procedure needing cleaning (or etching) is confirmed to be correct, a cleaning button is started, the PLC controls the mechanical arm according to a preset program to drive the wafer to be immersed into the aluminum corrosive liquid beaker to start a wet process, and after the process time is up, the mechanical arm automatically takes out the wafer and enters the left water washing tank to start cleaning. And after the cleaning time is up, controlling the mechanical arm to drive the wafer to be immersed into the ammonia hydrogen peroxide solution beaker to start the wet process. And after the processing time is up, controlling the mechanical arm to drive the wafer to be immersed into the right rinsing bath to start cleaning. And after the cleaning time is up, controlling the mechanical arm to drive the wafer to be immersed into the intermediate rinsing bath for final enzyme, introducing hot nitrogen for drying after the cleaning is finished, and transferring the wafer sample to an operation area by the mechanical arm after the drying for a person to take down. After the completion, the staff pours the liquid medicine into respective acid tank, starts the acid discharge function, discharges to respective acid discharge pipeline, and cleans respective beaker, discharges respective pipeline again.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (10)
1. The utility model provides a multi-functional pickling station device which characterized in that, includes equipment body and controlling means, wherein:
an operation platform is arranged in the middle of the equipment body, and an acid tank and a rinsing tank are arranged on the operation platform;
a mechanical arm for controlling the movement of the sample is arranged above the operating platform;
an air exhaust system is arranged on the circumferential side wall of the operating platform;
the control device controls the movement of the mechanical arm and controls the cleaning procedures of the acid tank and the rinsing tank.
2. The multifunctional pickling line set forth in claim 1 wherein a heater is disposed in the pickling tank, and the temperature of the water in the pickling tank is controlled by the heater.
3. The multifunctional pickling station device of claim 1, wherein a beaker fixing bayonet is further arranged in the acid tank, and the beaker is fixed through the beaker fixing bayonet.
4. The multifunctional pickling line device as claimed in claim 1, wherein a hole plate is further arranged beside the acid tank, and a leakage-proof disc is arranged below the hole plate.
5. The multi-functional pickling line set forth in claim 1 wherein a water tap is further provided beside said pickling line.
6. The multi-functional pickling station apparatus of claim 1, wherein said rinsing bath comprises a PFA bubbling device and/or an ultrasonic vibration device.
7. The multifunctional pickling line device as claimed in claim 1, wherein the FFU system is arranged on the top of the device body and can form a downward air curtain.
8. The multi-functional pickling station apparatus of claim 1 wherein said rinsing bath further comprises a hot nitrogen line.
9. The multi-functional pickling line assembly of claim 1 wherein said gas evacuation system comprises a plurality of gas evacuation grid openings in a peripheral sidewall of the work platform and gas evacuation devices disposed within the sidewall.
10. The multifunctional pickling station device of claim 1, further comprising a discharge system, wherein the discharge system is communicated with the acid tank and the rinsing tank, the discharge system comprises a plurality of discharge pipelines, and switching valves are arranged among the plurality of discharge pipelines, the acid tank and the rinsing tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110171930.3A CN112802780A (en) | 2021-02-08 | 2021-02-08 | Multifunctional pickling table device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110171930.3A CN112802780A (en) | 2021-02-08 | 2021-02-08 | Multifunctional pickling table device |
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| Publication Number | Publication Date |
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| CN112802780A true CN112802780A (en) | 2021-05-14 |
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| CN202110171930.3A Pending CN112802780A (en) | 2021-02-08 | 2021-02-08 | Multifunctional pickling table device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113567621A (en) * | 2021-07-14 | 2021-10-29 | 燕山大学 | Intelligent test platform for surface pickling and use method |
| CN115295402A (en) * | 2022-10-09 | 2022-11-04 | 广州粤芯半导体技术有限公司 | Wafer cleaning method and cleaning equipment |
-
2021
- 2021-02-08 CN CN202110171930.3A patent/CN112802780A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113567621A (en) * | 2021-07-14 | 2021-10-29 | 燕山大学 | Intelligent test platform for surface pickling and use method |
| CN115295402A (en) * | 2022-10-09 | 2022-11-04 | 广州粤芯半导体技术有限公司 | Wafer cleaning method and cleaning equipment |
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