CN208861942U - A kind of etching device - Google Patents
A kind of etching device Download PDFInfo
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- CN208861942U CN208861942U CN201821526847.3U CN201821526847U CN208861942U CN 208861942 U CN208861942 U CN 208861942U CN 201821526847 U CN201821526847 U CN 201821526847U CN 208861942 U CN208861942 U CN 208861942U
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- water
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- etching
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Abstract
The utility model provides a kind of etching device, comprising: rack, etching groove, multiple spray equipments and water delivery device.Etching groove is arranged on the rack and includes: through etching groove and multiple idler wheels arranged in parallel inside etching groove, and idler wheel is axially spaced to be evenly provided with multiple grooves；Multiple spray equipments are fixed on the rack, and it is disposed in parallel in above etching groove, there are multiple silicon wafer stations in etching groove, a corresponding spray equipment on each silicon wafer station, and multiple spray equipments are in line parallel with idler wheel, and each spray equipment has the first state of water spray and the second state for not spraying water；Water delivery device is that spray equipment conveys liquid, and water delivery device individually controls a spray equipment and is in first state or the second state.The technical solution of the utility model will not generate the phenomenon that wasting water, and each silicon wafer station can be sprayed in place.
Description
Technical field
The utility model relates to silicon chip erosion technical fields, and in particular to a kind of etching device.
Background technique
Lithographic technique refers to semiconductor fabrication process, wherein wet etching is a pure chemical reaction process, is referred to
The part of not masked membrane material masking is removed using the chemical reaction between solution and pre-embossed corrosion material and reaches etching mesh
's.
Etching device in the prior art is also provided with spray equipment, to avoid there is quarter phenomenon.But this spray
General pipeline device only one water pump and be connected with water pump, general pipeline are reached to be shunted by branch pipe again in equipment, such setting
As long as mode may create the problem that a silicon wafer is sensed that spray equipment just starts to spray, so just by pan feeding inductor
It will cause the waste of water；Liquid is diverted to each silicon wafer station by general pipeline, close to general pipeline close branch pipe due to pressure abundance, spray
It is preferable to drench effect, but the branch pipe of two sides is due to that will generate insufficient pressure, spray incomplete phenomena far from general pipeline.
Utility model content
The main purpose of the utility model is to provide a kind of etching devices, to solve etching device in the prior art
Spray equipment is also easy to produce the problem of wasting water.
To achieve the above object, the utility model provides a kind of etching device, comprising: rack, etching groove, multiple sprays
Device and water delivery device.Etching groove is arranged on the rack and includes: through etching groove and to be located at multiple mutual inside etching groove
Idler wheel disposed in parallel, idler wheel is axially spaced to be evenly provided with multiple grooves；Multiple spray equipments are fixed on the rack, and
It is disposed in parallel in above etching groove, there are multiple silicon wafer stations in etching groove, correspond to a spray equipment on each silicon wafer station,
And multiple spray equipments be in line it is parallel with idler wheel, each spray equipment there is the first state of water spray and do not spray water the
Two-state；Water delivery device is that spray equipment conveys liquid, and water delivery device individually controls a spray equipment and is in the first shape
State or the second state.
Further, water delivery device includes: water tank, multiple water inlet pipes, multiple water inlet pipes, multiple first control valves and multiple
One end of water pump, each water inlet pipe is connected to water tank, and the other end is connected to a spray equipment；Each first control valve setting exists
On one water inlet pipe；Each water pump is arranged on the rack, and is connected to a spray equipment.
Further, spray equipment includes: the connector being arranged on the rack and is fixed on connector and connects with water pump
Logical nozzle.
Further, water delivery device further include: PLC control module and the pan feeding detector being electrically connected with PLC control module,
So that spray equipment is in first state or the second state.
Further, water delivery device further includes the level switch being electrically connected with PLC control module.
Technical solutions of the utility model have the advantages that in practical work process, idler wheel drives silicon wafer to move to spray
Shower device lower part, if this spray equipment had both been in spray there are silicon wafer on the corresponding silicon wafer station of a spray equipment
The first state of water；If silicon wafer is not present on the corresponding silicon wafer station of spray equipment, spray equipment is then in and does not spray water
The second state.This setup can save many water resources, avoid unnecessary waste.
Detailed description of the invention
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, it is also possible to obtain other drawings based on these drawings.In the accompanying drawings:
Fig. 1 shows the overall structure diagram of the etching device of the utility model.
Wherein, the appended drawing reference in above-mentioned attached drawing are as follows:
1, silicon wafer；10, rack；11, idler wheel；21, water tank；22, water inlet pipe；23, water pump；31, connector；32, nozzle；
40, water-main.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, originally
Field those of ordinary skill every other embodiment obtained without making creative work belongs to practical
Novel protected range.
A kind of etching device as shown in Figure 1, comprising: rack 10, etching groove, eight spray equipments and water delivery device.It carves
Erosion slot is arranged in rack 10 and includes: through etching groove and multiple idler wheels arranged in parallel inside etching groove
11, idler wheel 11 is axially spaced to be evenly provided with multiple grooves；Multiple spray equipments are fixed in rack 10, and are set side by side
Above etching groove, there are multiple silicon wafer stations in etching groove, a spray equipment, and eight are corresponded on each silicon wafer station
Spray equipment is in line parallel with idler wheel 11, and each spray equipment has the first state of water spray and the second shape for not spraying water
State；Water delivery device be spray equipment convey liquid, and water delivery device individually control a spray equipment be in first state or
Second state.
In practical work process, idler wheel 11 drives silicon wafer 1 to move to spray equipment lower part, if a spray equipment pair
There are silicon wafers 1 on the silicon wafer station answered, then this spray equipment had both been in the first state of water spray；If spray equipment is corresponding
Silicon wafer station on be not present silicon wafer 1, then spray equipment is then in the second state that do not spray water.This setup can
Many water resources are saved, unnecessary waste is avoided.
In practical work process, 11 lower part of idler wheel is immersed in liquid medicine, and top is contacted with 1 bottom of silicon wafer, due to being located at
Liquid medicine in groove has certain absorption viscous force, therefore will drive liquid medicine movement during idler wheel 11 rotates, and in a steady stream
Liquid medicine is constantly transported to top from 11 bottom of idler wheel.Since the velocity of rotation of idler wheel 11 is slow, neither will cause
Liquid medicine falls off, and due to excessive velocities liquid medicine will not be splashed, so the band liquid transmission effect of idler wheel 11 is reliable and relatively more steady
It is fixed, 1 bottom surface of silicon wafer and periphery can be performed etching by liquid medicine in this way.This idler wheel 11 with multiple grooves and existing
There is each silicon wafer 1 in technology below only there are four compared with the raised driving wheel contacted with silicon wafer 1, liquid medicine is reacted with silicon wafer 1
More sufficiently, it etches more efficient.
Specifically, water delivery device includes: 21, eight, water tank the first control valve of water inlet pipe 22, eight and eight water pumps 23, often
One end of a water inlet pipe 22 is connected to water tank 21, and the other end is connected to a spray equipment；Each first control valve is arranged one
On a water inlet pipe 22；Each setting of water pump 23 is connected in rack 10, and with a spray equipment.Each first control valve control
The on-off of one water inlet pipe 22, each water inlet pipe 22 are that a spray equipment supplies water, and each water pump 23 can directly be
One spray equipment pumps, and this mode ensure that fluid pressure is sufficient in each spray equipment, therefore will not generate pressure not
Foot, spray incomplete phenomena.
Specifically, spray equipment includes: setting in 10 upper connector 31 of rack and is fixed on connector 31 and water pump 23
The nozzle 32 of connection.For setting connector 31 convenient for nozzle 32 to be fixed on the rack, nozzle is misty nozzle, can make ejection
Liquid is relatively uniform.
Specifically, water delivery device further includes PLC control module and the pan feeding detector being electrically connected with PLC control module, with
Spray equipment is set to be in first state or the second state.When pan feeding detector has detected that silicon wafer 1 is located on silicon wafer station,
PLC control module output order controls spray equipment corresponding with this station and is in first state, the duration length of spray
It can be set by man-machine interface；Likewise, if pan feeding detector has been not detected silicon wafer 1 and has been located on silicon wafer station, PLC control
Molding block just will not output order, spray equipment corresponding with this station is in the second state at this time.
Specifically, water delivery device further includes the level switch being electrically connected with PLC control module.Total water in water delivery device
Pipe 40 is the water supply of water tank 21, has the second control valve on water-main 40, when level switch detects that the water level in water tank 21 is low
When the lowest water level of setting, PLC control module output order, and the second control valve is opened, the water in water-main 40 flows into water
In case 21；When level switch detects that the water level in water tank 21 is higher than highest setting water level, the output of PLC control module refers to
It enables, and the second control valve, cannot flow into water tank 21 in water-main 40.It as a result, can be so that the water in water tank 21 be in and sets
Determine in altitude range.
Specifically, the length of the process section in etching groove for impregnating silicon wafer 1 is 900mm, since the use of roller bearing improves
The efficiency of etching, the so shorter process section of use can reach original etching effect.Just make the loss of acid big in this way
Amplitude reduction has saved cost, while the area that shorter process section length contacts acid with the external world is reduced, sour volatilization
Reduce, and then increases the utilization rate of acid.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes among the protection scope created still in the utility model.
Claims (5)
1. a kind of etching device characterized by comprising
Rack (10)；
Etching groove is arranged on the rack (10) and includes: through the etching groove and to be located at more inside the etching groove
A idler wheel (11) arranged in parallel, the idler wheel (11) is axially spaced to be evenly provided with multiple grooves；
Multiple spray equipments are fixed on the rack (10), and are disposed in parallel in above the etching groove, the etching groove
It is interior that there is multiple silicon wafer stations, a corresponding spray equipment on each silicon wafer station, and multiple spray dresses
Set be in line it is parallel with the idler wheel (11), each spray equipment have water spray first state and do not spray water second
State；
Water delivery device conveys liquid for the spray equipment, and the water delivery device individually controls the spray equipment
In the first state or second state.
2. etching device according to claim 1, which is characterized in that the water delivery device includes:
Water tank (21)；
One end of multiple water inlet pipes (22), each water inlet pipe (22) is connected to the water tank (21), the other end and an institute
State spray equipment connection；
Multiple first control valves, each first control valve are arranged on a water inlet pipe (22)；
Multiple water pumps (23), each water pump (23) are arranged on the rack (10), and connect with a spray equipment
It is logical.
3. etching device according to claim 2, which is characterized in that the spray equipment includes: to be arranged in the rack
(10) connector (31) on and the nozzle (32) for being fixed on the connector (31) and being connected to the water pump (23).
4. etching device according to claim 1, which is characterized in that the water delivery device further include: PLC control module and
The pan feeding detector being electrically connected with the PLC control module, so that spray equipment is in first state or the second state.
5. etching device according to claim 4, which is characterized in that the water delivery device further includes controlling with the PLC
The level switch of module electrical connection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821526847.3U CN208861942U (en) | 2018-09-18 | 2018-09-18 | A kind of etching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821526847.3U CN208861942U (en) | 2018-09-18 | 2018-09-18 | A kind of etching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208861942U true CN208861942U (en) | 2019-05-14 |
Family
ID=66418433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821526847.3U Active CN208861942U (en) | 2018-09-18 | 2018-09-18 | A kind of etching device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208861942U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110556321A (en) * | 2019-09-12 | 2019-12-10 | 常州时创能源科技有限公司 | water film device |
-
2018
- 2018-09-18 CN CN201821526847.3U patent/CN208861942U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110556321A (en) * | 2019-09-12 | 2019-12-10 | 常州时创能源科技有限公司 | water film device |
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