CN113020088B

CN113020088B - Chip washing device

Info

Publication number: CN113020088B
Application number: CN202110543865.2A
Authority: CN
Inventors: 黎敏清; 陆宜; 蔡渊
Original assignee: Jieyi Technology Beijing Co ltd
Current assignee: Jieyi Technology Beijing Co ltd
Priority date: 2021-05-19
Filing date: 2021-05-19
Publication date: 2021-08-10
Anticipated expiration: 2041-05-19
Also published as: CN113020088A

Abstract

The invention discloses a chip flushing device, which comprises an outer frame body and a flushing pool, wherein the outer frame body is provided with an inner cavity for accommodating the flushing pool, and the flushing pool is arranged to enter or exit the inner cavity of the outer frame body; a washing platform is arranged in the washing pool, and the top of the washing platform is used for loading chips; the top of the outer frame body is provided with a spray head, and the spray head comprises a liquid spray head for spraying flushing liquid to the surface of the chip and a gas spray head for blowing gas to the surface of the chip; the washing tank or the spray head is provided with a position adjusting mechanism which can drive the washing tank or the spray head to move, and the position adjusting mechanism is used for adjusting the relative position of the spray head and the washing platform. This washing unit can wash all sites of chip simultaneously, guarantees that the actual parameter that each site washed is unanimous, and the effect of washing at every turn is the same, and its structural design is reasonable, easily operation and control, operating efficiency are high, can effectively practice thrift flush fluid and gas.

Description

Chip washing device

Technical Field

The invention relates to the technical field of chip washing equipment, in particular to a device for washing chips such as an electrochemical analysis chip, a biological detection chip, a modified electrode chip and the like.

Background

Electrochemical chips generally consist of a substrate and an overlying electrode. The substrate is generally made of non-conductive materials such as glass, ceramics, plastics and the like, and the electrode on the substrate is generally a metal coating. Electrochemical chips generally have three regions above them, electrode regions, lead regions and lead regions. When the liquid detector is used, liquid to be detected is dripped on the electrode area, and the connector and the contact pads on the lead area of the chip are used for deriving signals.

In order to realize a large-flux electrochemical analysis, a plurality of cells are often placed on an electrochemical chip, and each cell independently runs the electrochemical analysis, so that a corresponding electrochemical reaction occurs. Such chips are known as multi-channel electrochemical chips.

Chips such as electrochemical analysis chips, biological detection chips, modified electrode chips, etc. are usually designed in a multi-channel manner, i.e., a plurality of reaction positions, detection sites, and modified electrode areas exist on one chip, and the reaction, detection objects, detection reagents, and electrode modification components at each position are different from each other.

When the chips such as the electrochemical analysis chip, the biological detection chip, the modified electrode chip and the like are used, liquid is usually required to be dripped on a specific area on the surface of the chip, after components in the liquid and the surface of the chip generate physical/chemical reaction, component molecules in the liquid can be attached to the surface of the electrode to form a molecular modified electrode, the dripped liquid is required to be washed away after the reaction is completed, and the surface of the chip is kept dry.

The liquid components dripped on each point of the multi-channel electrochemical chip are different, and once the liquids at different points are mixed or flow through electrodes at other points, the modified electrodes are affected or even damaged, so that how to clean the electrochemical chip is very important.

The traditional cleaning methods mainly comprise the following steps:

one is manual flushing, i.e. a hand-held flushing liquid/gas spray head flushes the surface of the chip. Manual operation is difficult to wash all sites simultaneously, actual parameters for washing all the sites are inconsistent, and the effect of washing each time is different. In addition, the manual flushing has the defects of long operation time, low efficiency, large amount of flushing liquid and gas consumed and the like.

The other is immersion type washing, which usually immerses a chip or a batch of chips in a washing liquid to realize washing, and has the disadvantages that the pollution is difficult to be avoided during washing, in addition, the immersion type washing is also difficult to wash all sites simultaneously, the actual parameters of washing of all sites are inconsistent, and the same effect of washing each time cannot be ensured.

The other is an automatic washing and drying mechanism disclosed in CN 206139560U, CN 208146533U, etc., when the chip is washed and dried, water flow and air flow pass through the modified electrode surface, which has a certain destructive effect on the modified molecules attached to the electrode surface, and there is no design to prevent waste liquid from passing through other sites, which is difficult to ensure that no pollution occurs during washing and it is difficult to ensure that all sites on the chip have the same washing effect.

Disclosure of Invention

The invention aims to provide a chip washing device. This washing unit can wash all sites of chip simultaneously, guarantees that the actual parameter that each site washed is unanimous, and the effect of washing at every turn is the same, and its structural design is reasonable, easily operation and control, operating efficiency are high, can effectively practice thrift flush fluid and gas.

In order to achieve the purpose, the invention provides a chip washing device, which comprises an outer frame body and a washing pool, wherein the outer frame body is provided with an inner cavity for accommodating the washing pool, and the washing pool is arranged to enter or exit the inner cavity of the outer frame body; a washing platform is arranged in the washing pool, and the top of the washing platform is used for loading chips; the top of the outer frame body is provided with a spray head, and the spray head comprises a liquid spray head for spraying flushing liquid to the surface of the chip and a gas spray head for blowing gas to the surface of the chip; the washing tank or the spray head is provided with a position adjusting mechanism which can drive the washing tank or the spray head to move, and the position adjusting mechanism is used for adjusting the relative position of the spray head and the washing platform.

Preferably, the top of the washing platform and the upper edge of the washing tank and the side surfaces around the washing platform and the inner wall of the washing tank are spaced at intervals.

Preferably, the inner bottom of the flushing tank is an inclined plane with one end higher than the other end, a waste discharge port is arranged at the lower position, and the flushing platform protrudes upwards from the inclined plane from the central position of the inclined plane.

Preferably, the vertical projection of the washing platform is rectangular, and the top for loading the chip is horizontal.

Preferably, a chip clamp is arranged at the top of the washing platform.

Preferably, the flushing tank is matched with the outer frame body in a drawer mode, the flushing tank enters or exits from the inner cavity of the outer frame body along the drawing direction, and after the flushing tank completely enters the inner cavity of the outer frame body, the flushing platform is located in the relatively closed flushing space.

Preferably, a slide rail is arranged between the flushing tank and the outer frame body, and the outer frame body is provided with a driving mechanism for driving the flushing tank to enter or exit along the slide rail.

Preferably, the moving direction of the spray head is orthogonal to the direction in which the flushing pool enters or exits the outer frame.

Preferably, the top of the outer frame body is provided with a spray head mounting opening; the position adjusting mechanism comprises a transverse moving supporting plate, the spray head is arranged on the transverse moving supporting plate and enters the inner cavity of the outer frame body through the spray head mounting opening, and the spraying direction of the spray head is vertical downward; the transverse moving supporting plate covers the spray head mounting opening and can drive the spray head to transversely move at the top of the outer frame body.

Preferably, the outer frame body is provided with a driving motor for driving the transverse moving supporting plate, and the driving motor is in transmission connection with the transverse moving supporting plate through a transmission mechanism.

Preferably, drive mechanism is including locating lead screw and the slider at outer frame body top, driving motor is connected with the lead screw transmission, the slider pass through the nut with the lead screw cooperatees, the slider is connected through the connecting piece with the lateral shifting layer board.

Preferably, a first transverse linear guide rail is arranged between the sliding block and the outer frame body, a second transverse linear guide rail is arranged between the transverse moving supporting plate and the outer frame body, the first transverse linear guide rail is located at the rear edge of the top of the outer frame body, and the second transverse linear guide rail is located at the front edge of the top of the outer frame body.

Preferably, the first and second electrodes are formed of a metal,

the liquid nozzle is used for washing the chip, including inlet, liquid outlet and intercommunication the runner of inlet and liquid outlet, the quantity of liquid outlet is a plurality of, each the liquid outlet is used for washing each flushing area of dividing on the chip respectively, inlet, runner and liquid outlet construct for when washing each electrode site in the flushing area receives simultaneously erodeing, and is adjacent can between the liquid outlet chip surface formation avoids electrode site's the rivers that assemble, just it follows to collect rivers the outside flow in boundary of flushing area.

Preferably, the liquid outlet is configured such that the electrode site in each flushing area is located on a circumference centered on the liquid outlet in the projection direction.

Preferably, the gas nozzle is used for drying the chip and comprises a gas inlet, a gas outlet and a gas passage communicated with the gas inlet and the gas outlet, the number of the gas outlets is multiple, each gas outlet is respectively used for drying each drying area divided on the chip, the gas inlet, the gas passage and the gas outlet are constructed in such a way that when the chip is dried, electrode sites in each drying area are simultaneously blown, the adjacent gas outlets can form a gathered gas flow avoiding the electrode sites on the surface of the chip, and the gathered gas flow flows outwards along the boundary of the drying areas.

Preferably, the air outlets are configured such that the electrode sites in each of the drying regions are located on a circumference centered around the air outlet in the projection direction.

The chip washing device provided by the invention has the advantages that the washing pool can enter or exit from the inner cavity of the outer frame body, the washing platform is arranged in the washing pool, when washing is carried out, the chip is firstly loaded at the top of the washing platform, then the washing pool enters the outer frame body, then the washing liquid is sprayed on the surface of the chip by the liquid spray nozzle at the top of the outer frame body, so that the washing purpose is achieved, after washing, air is blown to the surface of the chip by the air spray nozzle to dry the chip, liquid residue is avoided, after the chip is dried, the washing pool exits from the outer frame body, finally the chip which is washed is unloaded, the stations of the liquid spray nozzle and the air spray nozzle can be switched by the position adjusting mechanism, in the washing and blowing processes, the liquid spray nozzle and the air spray nozzle can be moved by the position adjusting mechanism, all the sites of the chip can be washed simultaneously, and the actual parameters for washing, the effect of washing at every turn is the same, moreover, its structural design is reasonable, easily operation and control, the operating efficiency is high, can effectively practice thrift flush fluid and gas.

Drawings

FIG. 1 is a schematic structural diagram of a chip washing device according to an embodiment of the present invention when a washing tank enters an outer frame;

FIG. 2 is a schematic structural diagram of a chip washing device according to an embodiment of the present invention when a washing tank exits from an outer frame;

FIG. 3 is a longitudinal sectional view of the chip washing apparatus shown in FIG. 1;

FIG. 4 is a transverse cross-sectional view of the chip washing apparatus shown in FIG. 1;

FIG. 5 is a schematic view of the airflow path between the side of the rinse deck and the interior wall of the rinse bath;

FIG. 6 is a schematic diagram of a liquid path and a gas path of the chip washing apparatus shown in FIG. 1;

FIG. 7 is a schematic view of the liquid jet head forming a collective water stream during flushing;

fig. 8 is a sectional view after the chip, the jig body, and the wash platform are sequentially stacked.

In the figure:

1. the chip cleaning machine comprises an outer frame body 2, a cleaning pool 3, a cleaning platform 4, a chip clamp 5, a liquid spray head 6, a gas spray head 7, an observation window 8, a waste discharge port 9, a slide rail 10, a spray head mounting port 11, a transverse moving supporting plate 12, a driving motor 13, a lead screw 14, a slide block 15, a connecting plate 16, a first transverse linear guide rail 17, a second transverse linear guide rail 18, a concave position 19, a liquid inlet 20, a cleaning pump 21, a cleaning valve 22, a liquid flow meter 23, a gas inlet 24, an air valve 25, a reversing valve 26, a barometer 27, a drainage pump 28, a waste water outlet 29, a vacuum pump 31, a liquid inlet 32, a liquid outlet 33, a clamp body 42, a sealing ring 43, a first positioning column 44, a second positioning column 45, a first vacuumizing channel 46, a second vacuumizing channel 100, a chip 101 and an electrode site.

Detailed Description

In order that those skilled in the art will better understand the disclosure, the invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

In this document, terms such as "upper, lower, left, right" and the like are established based on positional relationships shown in the drawings, and the corresponding positional relationships may vary depending on the drawings, and therefore, they are not to be construed as absolute limitations on the scope of protection; moreover, relational terms such as "first" and "second," and the like, may be used solely to distinguish one element from another element having the same name, without necessarily requiring or implying any actual such relationship or order between such elements.

Referring to fig. 1 and fig. 2, fig. 1 is a schematic structural diagram of a chip washing apparatus according to an embodiment of the present invention when a washing pool enters an outer frame; fig. 2 is a schematic structural diagram of a chip washing device disclosed by the embodiment of the invention when a washing pool exits from an outer frame body.

As shown in the drawings, in an embodiment, the chip washing apparatus provided by the present invention mainly comprises an outer frame 1 and a washing tank 2, wherein the outer frame 1 is a rectangular frame structure and has a left side wall, a right side wall, a rear side wall and a top portion, the front side and the bottom portion are open, an inner cavity for accommodating the washing tank 2 is formed inside the outer frame, the washing tank 2 is in a rectangular shape with an upward opening, a drawing and matching structure similar to a drawer is formed with the outer frame 1, the washing tank 2 can enter or exit the inner cavity of the outer frame 1 along a drawing and pulling direction, after completely entering the outer frame 1, the washing tank 2 forms a relatively closed environment with the outer frame 1 and a below-mentioned transverse moving pallet 11, which can ensure that as little liquid as possible escapes, and after washing, the washing tank 2 can be drawn out like a drawer to take and place the chip 100.

The inside of washing tank 2 is equipped with washing platform 3, and washing platform 3's vertical projection is the rectangle, and its top that is used for loading the chip is the horizontality to avoid waiting to wash the liquid drop on chip 100 because of the slope removal before washing, washing platform 3's top is equipped with chip anchor clamps 4 that are used for loading the chip, can make chip 100 pinpoint through chip anchor clamps 4, and fix on washing platform 3. Of course, in other embodiments, the chip 100 may be naturally placed by gravity, or an elastic clip may be disposed on the washing platform 3 to fix the chip 100, or a magnetic attraction method may be used to fix the chip 100.

Chip clamp 4 includes anchor clamps body 41, the anchor clamps body is equipped with the portion of bearing that is used for placing chip 100, the periphery of bearing the portion is equipped with the bellied sealing ring 42 of round, the shape of sealing ring 42 is unanimous with the outline of chip 100, chip 100 lower surface all around can attach in the upper surface of sealing ring 42, anchor clamps body 41 is equipped with two first location posts 43 in sealing ring 42 periphery, first location post 43 is used for mutually the joint cooperation of draw-in groove through its inboard cylinder and chip 100 both ends to restrict the plane degree of freedom of chip 100 (see fig. 8).

The bottom of the fixture body 41 is provided with a positioning hole, which is a vacuum-pumping interface for vacuuming the carrier to absorb the chip 100 and is communicated to the carrier through an air hole.

The top of the washing platform 3 is provided with a second positioning column 44 corresponding to the positioning hole, and a first vacuum-pumping channel 45 for vacuumizing the area between the washing platform 3 and the clamp body 41 is arranged inside the second positioning column 44.

In addition, the bearing part and the top of the washing platform 3 are provided with labyrinth grooves for vacuum adsorption, wherein the inside of the washing platform 3 is provided with a second vacuumizing channel 46 communicated with the labyrinth grooves at the top of the washing platform 3, and the first vacuumizing channel 45 and the second vacuumizing channel 46 are communicated to the vacuum pump 29 through vacuum adsorption pipelines.

The top of outer frame 1 is equipped with the shower nozzle, the shower nozzle divide into and is used for spraying the liquid shower nozzle 5 of flush fluid and the gas shower nozzle 6 that is used for blowing to the chip surface, the shower nozzle is equipped with the position adjustment mechanism that can drive its removal, position adjustment mechanism is used for adjusting the shower nozzle and washes platform 3 relative position, in this embodiment, the moving direction of shower nozzle and the direction mutual quadrature that washing pool 2 got into or withdrawed from outer frame 1, in order to avoid washing pool 2 to interfere with the shower nozzle at the in-process of business turn over outer frame 1, washing pool 2 is equipped with the breach that is used for dodging the shower nozzle in the last edge department of inner end wall, washing pool 2 then can be equipped with observation window 7 in the outer end.

Referring to fig. 3 and 4 together, fig. 3 is a longitudinal sectional view of the chip washing apparatus shown in fig. 1; fig. 4 is a transverse sectional view of the chip washing apparatus shown in fig. 1.

As shown in the figure, the inner bottom of the washing tank 2 is a slope with one end higher than the other end, and a waste discharge port 8 is arranged at a low position to ensure that the waste liquid to be washed is guided to the waste discharge port 8, and the washing platform 3 protrudes upwards from the center of the slope, that is, the washing platform 3 is a boss protruding upwards from the slope.

Slide rails 9 are respectively arranged between the left side and the right side of the washing tank 2 and the outer frame body, in this embodiment, an asymmetric slide rail arrangement mode is adopted, the left slide rail 9 and the right slide rail 9 are staggered in height, the left slide rail 9 is deviated from the upper part, the right slide rail 9 is deviated from the lower part, the outer frame body 1 is provided with a driving mechanism (not shown in the figure) for driving the washing tank 2 to enter or exit along the slide rails 9, and specifically, the driving mechanism can be a motor, a gear and rack mechanism, or a linear motor and the like.

In the washing and drying process, the spray head can move in a plane, so that water flow and air flow can cover all positions needing washing.

Specifically, the liquid ejection head 5 is used for washing a chip, and has a liquid inlet 31, a liquid outlet 33, and a flow channel 32 communicating the liquid inlet and the liquid outlet, where the number of the liquid outlets 33 is plural, each liquid outlet 33 is used for washing each washing area divided on the chip 100, the liquid inlet 31, the flow channel 32, and the liquid outlet 33 are configured such that when washing, the electrode sites 101 in each washing area are simultaneously washed, a converged water flow avoiding the electrode sites 101 can be formed on the surface of the chip 100 between adjacent liquid outlets 33, and the converged water flow flows outward along the boundary of the washing areas (see fig. 7).

The liquid outlet 33 is configured such that the electrode sites 101 in each flushing area are located on a circumference centered on the liquid outlet 33 in the projection direction.

If the number of the electrode sites 101 on the chip 100 is even, every two of the electrode sites can be divided into a group of flushing areas, and the liquid outlets 33 of each flushing area are configured to respectively correspond to the central position of a connecting line between the two electrode sites 101; alternatively, every four flushing areas are divided into a group, and the liquid outlets of the flushing areas are configured to correspond to the symmetric centers of the four electrode sites 101, respectively.

Or, the electrode sites 101 on the chip 100 include physical sites on the chip and virtual sites outside the chip, the number of the physical sites is odd, and the sum of the number of the physical sites and the number of the virtual sites is even; two electrode sites are divided into a group of flushing areas, and liquid outlets of the flushing areas are configured to correspond to the central position of a connecting line between the two electrode sites respectively; or, every four electrode sites are divided into a group of flushing areas, and the liquid outlets of the flushing areas are configured to respectively correspond to the symmetric centers of the four electrode sites.

The flow path 32 includes a main flow path and branch flow paths branched from the main flow path, and the configuration and design parameters of the branch flow paths are the same in the same stage. The design parameters include geometry, including length and cross-sectional dimensions, and internal surface roughness.

The pressure and the flow rate of the water flow ejected from the liquid outlets 33 are the same, and the same flow field can be formed on the surface of the chip below each liquid outlet 33.

The flow channel 32 may be configured to provide laminar flow of the water exiting the outlet. The section of the flow channel 32 is greatly reduced along the water flow direction, the diameter of the liquid outlet 33 is smaller than that of the liquid inlet, and the diameter of the liquid outlet 33 can be 1/3-1/5 of that of the liquid inlet 31, so that the flow field is converted from turbulent flow to laminar flow; and/or a flow rectifying component is arranged in the flow channel so as to convert the flow field from turbulent flow to laminar flow.

Bubblers may also be provided in the flow path 32 to create a stream of bubbles to avoid splashing.

The gas nozzle 6 is used for drying the chip 100, and includes a gas inlet, a gas outlet and a gas passage communicating the gas inlet and the gas outlet, the number of the gas outlets is plural, each gas outlet is used for drying each drying area divided on the chip 100, the gas inlet, the gas passage and the gas outlet are configured such that electrode sites in each drying area are blown simultaneously when drying, convergent gas flows avoiding the electrode sites can be formed on the chip surface between adjacent gas outlets, the convergent gas flows outwards along the boundary line of the drying areas, the rest structures are substantially the same as the liquid nozzle, and the description is not repeated here.

The top of outer frame 1 has shower nozzle installing port 10, liquid nozzle 5 and gas nozzle 6 install on lateral shifting layer board 11 and get into the inner chamber of outer frame 1 via shower nozzle installing port 10, its injection direction is perpendicular downwards, lateral shifting layer board 11 covers shower nozzle installing port 10, the lower surface of lateral shifting layer board 11 can cooperate or the little clearance fit with the upper surface contact of outer frame 1, also can install the sealing member additional between the two, cooperate with the form of movive seal at the removal in-process.

The top of the outer frame body 1 is provided with a driving motor 12 for driving the transverse moving supporting plate 11, the driving motor 12 is in transmission connection with the transverse moving supporting plate 11 through a transmission mechanism, and the driving motor 12 can drive the nozzle to transversely move at the top of the outer frame body 1 through the transmission mechanism.

In this embodiment, the transmission mechanism mainly comprises a screw 13 and a slider 14 which are arranged on the top of the outer frame 1, the driving motor 12 is in transmission connection with the screw 13, the slider 14 is matched with the screw 13 through a nut to convert the rotation motion of the driving motor 12 into the linear motion of the slider 14, the slider 14 is connected with the transverse moving supporting plate 11 through a zigzag connecting plate 15, a first transverse linear guide rail 16 is arranged between the slider 14 and the outer frame 1, a second transverse linear guide rail 17 is arranged between the transverse moving supporting plate 11 and the outer frame 1, the first transverse linear guide rail 16 is arranged on the rear edge of the top of the outer frame 1, the second transverse linear guide rail 17 is arranged on the front edge of the top of the outer frame 1, a rectangular concave 18 is arranged on the front edge of the top of the outer frame 1, and the second transverse linear guide rail 17 is arranged in the rectangular concave 18.

With continued reference to fig. 5, fig. 5 is a schematic view of the airflow path between the side surface of the rinsing platform and the inner wall of the rinsing pool.

As shown in the figure, the washing tank 2 can contain waste liquid generated in the washing and drying processes, the top of the washing platform 3 and the upper edge of the washing tank 2 are spaced, namely the surface of the chip is lower than the upper edge of the washing tank 2, and the peripheral side surfaces of the washing platform 3 and the inner wall of the washing tank 2 are also spaced.

The surface of chip 100 is less than the last edge of flushing tank 2, can guarantee as much as possible to contain and wash the water droplet and the water smoke that produce when weathering, the bottom surface of flushing tank 2 is far away from the chip surface, sufficient distance has between the two, liquid contact bottom surface splashes back to the chip surface when avoiding washing, the air current blows back the remaining liquid of bottom surface to the chip surface when also avoiding weathering, the side of flushing tank 2 also has far away distance with chip 100, the vortex that the air current produced when can avoiding weathering, blow back the remaining liquid of bottom surface to the chip surface.

In order to avoid the waste liquid from being blown back to the surface of the chip during the drying process, in other embodiments, an air guide groove, a baffle plate or an air suction device may be installed in the rinsing tank 2.

Referring to FIG. 6, FIG. 6 is a schematic diagram of a liquid path and a gas path of the chip washing apparatus shown in FIG. 1.

As shown in the figure, a liquid inlet 19, a flushing pump 20, a flushing valve 21 and a liquid flow meter 22 are sequentially arranged on a liquid inlet pipeline of the liquid spray head 5, a gas inlet 23, a gas valve 24, a reversing valve 25 and a gas pressure gauge 26 are sequentially arranged on a gas inlet pipeline of the gas spray head 6, wherein a second outlet of the reversing valve 25 is connected with a bypass of the liquid inlet pipeline, and a drain pipeline of the waste discharge port 8 is provided with a drain pump 27 and a waste water outlet 28.

The specific working process is as follows:

1) after the chip clamp 4 with the chip 100 is placed into the washing platform 3 of the washing tank 2, the vacuum adsorption pump is started, the chip clamp 4 is adsorbed on the top of the washing platform 3, and the driving mechanism takes in and closes the washing tank 2.

2) After the circuit confirms that the rinse bath 2 is in place, the liquid ejecting head 5 is moved to a region other than the region above the chip 100, the rinse valve 21 is opened, the rinse pump 20 is started, and the liquid ejecting head 5 is closed after being filled with liquid.

3) After the liquid nozzle 5 is moved above the chip 100 and the circuit confirms that the liquid nozzle 5 reaches the designated position, the flushing valve 21 is opened, the flushing pump 20 is started, flushing liquid (generally deionized water) is sprayed onto the chip 100 through the liquid nozzle 5, the residual liquid on the chip 100 begins to be flushed, and the waste liquid flows into the waste discharge port 8 from the inclined surface below the flushing tank and is recovered through the drainage pump 27 and the waste water outlet 28.

4) After the flushing is completed, the liquid ejecting head 5 is moved to a region other than the region above the chip 100, and the liquid ejecting head 5 is inflated to discharge the remaining liquid in the pipe.

5) The gas shower head 6 is moved above the chip 100, and the circuit confirms that the gas shower head 6 reaches the designated position, and then slowly opens the gas valve 24.

6) After the gas valve 24 is opened to the maximum opening, the gas nozzle 6 is slowly moved to blow off the residual liquid on the chip 100 and the surface of the jig.

7) After the drying is completed, the gas valve 24 is closed and the gas shower 6 is moved to an area other than the area above the chip 100.

8) The driving mechanism extends the rinsing bath 2, turns off the vacuum suction pump, and waits for the chip 100 to be taken out.

The system for washing and drying adopts a closed-loop design, the liquid flow and the air pressure are monitored in real time when the system for washing and drying is used for washing and drying, the opening degree of a pump and a valve can be adjusted in real time under the condition that the pressure flow of water supply and air supply fluctuates, so that the actual sprayed flow and pressure accord with a set value, the parameter for washing at every time is ensured by an electric control system, the parameter can be adjusted according to the requirement by the washing parameter, and the water and air can be adjusted and optimized to avoid waste.

The above embodiments are merely preferred embodiments of the present invention, and are not limited thereto, and on the basis of the above embodiments, various embodiments can be obtained by performing targeted adjustment according to actual needs. For example, the degree of freedom of movement of the spray head can be increased according to the structure of the chip and the requirements of washing and drying, the spray head can move in X, Y, Z three directions in the space by increasing the number of linear moving platforms, the spray head can be rotated by increasing a rotating shaft mechanism, or the relative position can be adjusted by keeping the washing tank 2 stationary and the outer frame 1 and the spray head to translate or rotate relative to the washing tank 2, and the like. This is not illustrated here, since many implementations are possible.

The invention can flush all the sites of the chip simultaneously, ensures that the actual parameters for flushing each site are consistent, has the same flushing effect every time, has reasonable structural design, easy operation and control and high operating efficiency, and can effectively save flushing liquid and gas.

The chip washing device provided by the invention is described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the core concepts of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

Claims

1. The chip flushing device is characterized by comprising an outer frame body (1) and a flushing pool (2), wherein the outer frame body (1) is provided with an inner cavity for accommodating the flushing pool (2), and the flushing pool (2) is arranged to enter or exit the inner cavity of the outer frame body (1); a washing platform (3) is arranged in the washing pool (2), and the top of the washing platform (3) is used for loading chips; the top of the outer frame body (1) is provided with a spray head, and the spray head comprises a liquid spray head (5) for spraying flushing liquid to the surface of the chip and a gas spray head (6) for blowing gas to the surface of the chip; the flushing tank (2) or the spray head is provided with a position adjusting mechanism which can drive the flushing tank or the spray head to move, and the position adjusting mechanism is used for adjusting the relative position of the spray head and the flushing platform (3); the liquid spray head (5) is used for washing chips and comprises a liquid inlet (31), a plurality of liquid outlets (33) and a flow channel (32) communicated with the liquid inlet (31) and the liquid outlets (33), wherein the liquid outlets (33) are in a plurality, each liquid outlet (33) is respectively used for washing each washing area divided on the chip, the liquid inlet (31), the flow channel (32) and the liquid outlets (33) are constructed in such a way that electrode sites in each washing area are washed simultaneously when the chips are washed, converged water flow avoiding the electrode sites (101) can be formed on the surface of the chip between the adjacent liquid outlets (33), and the converged water flow flows outwards along the boundary of the washing areas; gas shower nozzle (6) are used for weathering the chip, include air inlet, gas outlet and intercommunication the air flue of air inlet and gas outlet, the quantity of gas outlet is a plurality of, each the gas outlet is used for respectively weathering each of division on the chip and blows dry the district, air inlet, air flue and gas outlet structure are for when weathering each blow dry electrode site (101) in the district and receive simultaneously and blow, adjacent can be in between the gas outlet the chip surface forms the air current that assembles of avoiding electrode site (101), just it follows to assemble the air current blow the boundary line of drying the district and outwards flow.

2. The chip washing device according to claim 1, wherein there are spaced distances between the top of the washing platform (3) and the upper edge of the washing tank (2) and between the sides of the washing platform (3) around and the inner wall of the washing tank (2).

3. The chip rinsing device according to claim 1, wherein the inner bottom of the rinsing bath (2) is formed as an inclined surface with one end higher than the other end, and is provided with a waste discharge port (8) at a lower position, and the rinsing platform (3) protrudes upward from the inclined surface substantially from the center of the inclined surface.

4. A chip washing device according to claim 3, characterized in that the vertical projection of the washing platform (3) is rectangular, and the top for loading the chip is horizontal.

5. The chip washing device according to claim 1, characterized in that the top of the washing platform (3) is provided with a chip gripper (4).

6. The chip washing device according to claim 1, characterized in that the washing tank (2) is matched with the outer frame body (1) in a drawer manner, the washing tank (2) enters or exits the inner cavity of the outer frame body (1) along the drawing direction, and after the washing tank (2) completely enters the inner cavity of the outer frame body (1), the washing platform (3) is positioned in a relatively closed washing space.

7. The chip flushing device according to claim 6, wherein a slide rail (9) is arranged between the flushing tank (2) and the outer frame body (1), and the outer frame body (1) is provided with a driving mechanism for driving the flushing tank (2) to enter or exit along the slide rail (9).

8. The chip washing device according to claim 1, wherein the moving direction of the spray head is orthogonal to the direction in which the washing tank (2) enters or exits the outer frame (1).

9. The chip washing device according to claim 1, wherein the top of the outer frame (1) has a nozzle mounting opening (10); the position adjusting mechanism comprises a transverse moving supporting plate (11), the spray head is installed on the transverse moving supporting plate (11) and enters the inner cavity of the outer frame body (1) through the spray head installing opening (10), and the spraying direction of the spray head is vertical downward; the transverse moving supporting plate (11) covers the spray head mounting opening (10) and can drive the spray head to transversely move at the top of the outer frame body (1).

10. The chip washing device according to claim 9, wherein the outer frame (1) is provided with a driving motor (12) for driving the transverse moving pallet (11), and the driving motor (12) is in transmission connection with the transverse moving pallet (11) through a transmission mechanism.

11. The chip flushing device according to claim 10, wherein the transmission mechanism comprises a lead screw (13) and a slide block (14) which are arranged at the top of the outer frame body (1), the driving motor (12) is in transmission connection with the lead screw (13), the slide block (14) is matched with the lead screw (13) through a nut, and the slide block (14) is connected with the transverse moving supporting plate (11) through a connecting piece.

12. The chip flushing device according to claim 11, characterized in that a first transverse linear guide (16) is arranged between the slider (14) and the outer frame (1), a second transverse linear guide (17) is arranged between the transverse moving pallet (11) and the outer frame (1), the first transverse linear guide (16) is located at the rear edge of the top of the outer frame (1), and the second transverse linear guide (17) is located at the front edge of the top of the outer frame (1).

13. The chip rinsing device according to claim 1, wherein the liquid outlet (33) is configured such that the electrode sites (101) in each rinsing zone are located on a circumference centered on the liquid outlet (33) in a projection direction.

14. The chip washing apparatus according to claim 1, wherein the gas outlets are arranged such that the electrode sites (101) in each of the blow-dry regions are on a circumference centered on the gas outlet in the projection direction.