CN110858551A - Semiconductor cleaning device and method - Google Patents
Semiconductor cleaning device and method Download PDFInfo
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- CN110858551A CN110858551A CN201810970875.2A CN201810970875A CN110858551A CN 110858551 A CN110858551 A CN 110858551A CN 201810970875 A CN201810970875 A CN 201810970875A CN 110858551 A CN110858551 A CN 110858551A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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Abstract
The invention provides a semiconductor cleaning device and method capable of improving cleaning effect and efficiency, reducing cleaning material consumption and shortening cleaning time. The technical means is as follows: the device comprises a bearing platform and a cleaning assembly, wherein the bearing platform can be used for bearing a semiconductor chip, the cleaning assembly can be used for carrying out high-pressure washing and air blowing drying on the semiconductor chip, and the bearing platform comprises a bearing table and a main driving device; the cleaning assembly comprises a driving device, a high-pressure nozzle group and an image capturing device. A method aspect, comprising: the method comprises the steps of positioning, phase taking, cleaning and drying.
Description
Technical Field
The present invention relates to a cleaning device structure and an application method thereof in a semiconductor manufacturing process, and more particularly, to a semiconductor cleaning device and a method thereof.
Background
Due to the prevalence of consumer electronics, there is a great demand for portable (portable) and Multi-functional (Multi-function) microelectronic packages, which are gradually moving toward smaller size, higher performance, and lower cost.
Wafer Level Package (WLP) has the advantage of reducing Package size, and can achieve the purpose of greatly reducing cost by matching with upper Panel Level Package (PLP), which just caters to the market trend of mobile electronic products.
In various processes of wafer level packaging, there is a process of cleaning gap (gap), and most of the conventional cleaning machines use a pipeline type cleaning machine and a rotary type cleaning machine.
The flow line type cleaning machine has the advantages of large liquid consumption, limited height and angle of the spray head, large machine table volume, long cleaning time, cleaning gap distance of more than 120 mu m, continuous flow line movement to spray most of liquid medicine or liquid medicine in an invalid area, shutdown of the whole machine during maintenance and great influence on production efficiency.
The rotary cleaning machine takes the liquid medicine or the liquid medicine away from the washed object through centrifugal force, but the centrifugal force has no effect on the circle center, so that the cleaning effect from the circle center to the periphery is different; centrifugal force just can exert great effect under high-speed rotation, need supply liquid medicine in a large number, or liquid medicine, and most liquid medicine under high-speed rotation, or liquid medicine can spray in the invalid area, lead to the liquid medicine, or liquid medicine not get into by the clearance in washing the region yet, will be thrown away, increase consumptive material use amount and cleaning time, and the rotation type cleaning machine all is collocation one or the multiunit removes the swing arm, the swing arm action route is circular-arc, the stroke is limited, can't remove to every position by the washing thing.
The most important problem is that current abluent clearance is mostly less than 120um, and capillary action is big, and liquid medicine in the clearance, or liquid medicine are difficult to discharge, lead to wasing difficult, and cleaning performance between them can not effectively accord with current trade person's application demand, and the promotion help to the yield is low.
Accordingly, it is an objective of the present invention to provide a semiconductor cleaning apparatus and method that can solve the above-mentioned problems, shorten the cleaning time, reduce the consumption of cleaning consumables, and ensure the cleaning effect and efficiency.
Disclosure of Invention
The invention aims to provide a semiconductor cleaning device and a method which can improve the cleaning effect and efficiency, reduce the cleaning material consumption and shorten the cleaning time.
The present invention has been made to solve the above problems, and in order to achieve the object of the present invention, a first technical means in the aspect of the present invention is a semiconductor cleaning apparatus, including a carrying platform and a cleaning assembly disposed at a top end of the carrying platform, wherein the carrying platform can be used for carrying a semiconductor chip, and the cleaning assembly can be used for performing high-pressure rinsing and air-blowing drying on the semiconductor chip, and is characterized in that: the bearing platform comprises a bearing platform and a main driving device; the bearing table can be used for bearing and positioning the semiconductor chip; the main driving device comprises a main longitudinal driving device positioned at the bottom end and a main transverse driving device arranged between the main longitudinal driving device and the bearing table; the main longitudinal driving device can be driven by the main longitudinal driving device to enable the bearing table on the main longitudinal driving device to move longitudinally on a horizontal plane; the main transverse driving device can drive the bearing platform to transversely move on a horizontal plane.
Preferably, the carrying platform further comprises a secondary driving device, which comprises a rotating motor and a support, wherein the rotating motor is arranged between the carrying platform and the primary driving device, the rotating motor can drive the carrying platform to rotate, and the support is positioned outside the rotating motor; the support further comprises three movable telescopic units arranged between the bearing platform and the main driving device in a tripod shape, and the movable telescopic units can drive the bearing platform to deflect in at least one direction by taking a horizontal plane as a reference in a matching manner.
Preferably, the cleaning assembly includes a driving device, a high pressure nozzle set, and an image capturing device; the driving device can be used for bearing and driving the high-pressure nozzle group; the high-pressure nozzle group is arranged on the driving device, can be driven by the driving device to do three-dimensional movement in at least one direction, can perform one of high-pressure washing and air blowing drying on the semiconductor chip, and comprises at least one nozzle with an adjustable angle; the image capturing device is arranged above the bearing platform and can capture images of the semiconductor chip borne on the bearing platform so as to set a flushing operation path after calculating a flow channel, and the high-pressure nozzle group can be flushed according to the flushing operation path.
Preferably, the driving device further comprises a longitudinal driving device, a transverse driving device disposed at the bottom end of the longitudinal driving device, and a vertical driving device disposed on the transverse driving device, and the vertical driving device can be used for bearing and driving the high-pressure nozzle set.
The second technical means of the apparatus aspect of the present invention is realized as follows, and is a semiconductor cleaning apparatus, which comprises a bearing platform and a cleaning component arranged at the top end of the bearing platform, wherein the bearing platform can be used for bearing a semiconductor chip, and the cleaning component can be used for performing high-pressure washing and air blowing drying on the semiconductor chip, and is characterized in that: the cleaning assembly comprises a driving device, a high-pressure nozzle group and an image capturing device; the driving device can be used for bearing and driving the high-pressure nozzle group; the high-pressure nozzle group is arranged on the driving device, can be driven by the driving device to do three-dimensional movement in at least one direction, can perform one of high-pressure washing and air blowing drying on the semiconductor chip, and comprises at least one nozzle with an adjustable angle; the image capturing device is arranged above the bearing platform and can capture images of the semiconductor chip borne on the bearing platform so as to set a flushing operation path after calculating a flow channel, and the high-pressure nozzle group can be flushed according to the flushing operation path.
Preferably, the driving device further comprises a longitudinal driving device, a transverse driving device disposed at the bottom end of the longitudinal driving device, and a vertical driving device disposed on the transverse driving device, and the vertical driving device can be used for bearing and driving the high-pressure nozzle set.
Preferably, the carrying platform comprises a carrying platform and a main driving device; the bearing table can be used for bearing and positioning the semiconductor chip; the main driving device comprises a main longitudinal driving device positioned at the bottom end and a main transverse driving device arranged between the main longitudinal driving device and the bearing table; the main longitudinal driving device can be driven by the main longitudinal driving device to enable the bearing table on the main longitudinal driving device to move longitudinally on a horizontal plane; the main transverse driving device can drive the bearing platform to transversely move on a horizontal plane.
Preferably, the carrying platform further comprises a secondary driving device, which comprises a rotating motor and a support, wherein the rotating motor is arranged between the carrying platform and the primary driving device, the rotating motor can drive the carrying platform to rotate, and the support is positioned outside the rotating motor; the support further comprises three movable telescopic units arranged between the bearing platform and the main driving device in a tripod shape, and the movable telescopic units can drive the bearing platform to deflect in at least one direction by taking a horizontal plane as a reference in a matching manner.
The third technical means of the device aspect of the invention is realized as follows, and is a semiconductor cleaning device, which comprises a bearing platform and a cleaning component arranged at the top end of the bearing platform, wherein the bearing platform can be used for bearing a semiconductor chip, and the cleaning component can be used for carrying out high-pressure washing and air blowing drying on the semiconductor chip, and is characterized in that: the bearing platform comprises a bearing platform and a main driving device; the bearing table can be used for bearing and positioning the semiconductor chip; the main driving device comprises a main longitudinal driving device positioned at the bottom end and a main transverse driving device arranged between the main longitudinal driving device and the bearing table; the main longitudinal driving device can be driven by the main longitudinal driving device to enable the bearing table on the main longitudinal driving device to move longitudinally on a horizontal plane; the main transverse driving device can drive the bearing table to transversely move on a horizontal plane; the driving device can be used for bearing and driving the high-pressure nozzle group; the high-pressure nozzle group is arranged on the driving device, can be driven by the driving device to do three-dimensional movement in at least one direction, can perform one of high-pressure washing and air blowing drying on the semiconductor chip, and comprises at least one nozzle with an adjustable angle; the image capturing device is arranged above the bearing platform and can capture images of the semiconductor chip borne on the bearing platform so as to set a flushing operation path after calculating a flow channel, and the high-pressure nozzle group can be flushed according to the flushing operation path.
Preferably, the carrying platform further comprises a secondary driving device, which comprises a rotating motor and a support, wherein the rotating motor is arranged between the carrying platform and the primary driving device, the rotating motor can drive the carrying platform to rotate, and the support is positioned outside the rotating motor; the support further comprises three movable telescopic units arranged between the bearing platform and the main driving device in a tripod shape, and the movable telescopic units can drive the bearing platform to deflect in at least one direction by taking a horizontal plane as a reference in a matching manner.
Preferably, the driving device further comprises a longitudinal driving device, a transverse driving device disposed at the bottom end of the longitudinal driving device, and a vertical driving device disposed on the transverse driving device, and the vertical driving device can be used for bearing and driving the high-pressure nozzle set.
The technical means in the aspect of the method is realized in such a way that the semiconductor cleaning method can be applied together with a semiconductor cleaning device, and comprises the following steps: a positioning step of moving to positioning after loading the semiconductor chip; a phase taking step, namely calculating a flow channel after phase taking, and setting a flushing running path; a cleaning step, namely adjusting the cleaning assembly to enable one or both of the bearing table and the cleaning assembly to do relative linear movement in at least one direction on a horizontal plane to perform primary high-pressure washing; and a drying step of adjusting the cleaning assembly to perform air blowing drying.
Preferably, the cleaning step further includes a tilted cleaning step of performing a high pressure flushing again by linearly moving one or both of the carrier table and the cleaning assembly in at least one direction relative to a horizontal plane after performing a surface deflection in at least one direction with respect to the horizontal plane.
Preferably, the cleaning step further comprises a counter-directional cleaning step of performing a high-pressure flushing again by linearly moving one or both of the carrier table and the cleaning assembly in at least one direction on a horizontal plane but in a direction different from the primary high-pressure flushing direction.
According to the above implementation, the following results can be obtained:
in summary, according to the aspect of the semiconductor cleaning apparatus of the present invention, by using the cooperation of the supporting platform and the cleaning assembly, the semiconductor cleaning apparatus is different from the conventional semiconductor cleaning apparatus, so that the cleaning effect and efficiency can be ensured, the consumption of cleaning consumables can be reduced, and the cleaning time can be shortened; the method is different from the traditional semiconductor cleaning device in that the steps of positioning, phase taking, cleaning and drying are utilized, and in the cleaning step, the movable high-pressure washing is applied, so that various semiconductor processes can be matched, the semiconductor chip can be cleaned really, consumables can not be wasted, and the working time is shortened.
Drawings
Fig. 1 is a perspective view of the present invention.
Fig. 2 is an exploded view of the present invention.
Fig. 3 is an exploded view of the cleaning assembly of fig. 2.
Fig. 4 is an exploded view of the susceptor and the secondary driving device of fig. 2.
Fig. 5 is an exploded view of the main driving device of fig. 2.
Fig. 6 is a schematic perspective view of the main driving device of the present invention.
FIG. 7 is a schematic perspective view of the main driving device of the present invention when the main driving device is actuated in another direction.
Fig. 8 is a schematic perspective view of the secondary driving device of the present invention.
FIG. 9 is a schematic perspective view of the cleaning assembly of the present invention in a longitudinal direction.
FIG. 10 is a schematic perspective view of the cleaning assembly of the present invention in lateral motion.
FIG. 11 is a schematic perspective view of the cleaning assembly of the present invention in vertical operation and adjustment of the spray head.
FIG. 12 is a block diagram of a cleaning method according to the present invention.
FIG. 13 is a schematic diagram of the positioning step and the phase-taking step of the present invention.
FIG. 14 is a schematic view of a first embodiment of the cleaning step of the present invention.
FIG. 15 is a schematic view of a second embodiment of the cleaning step of the present invention.
FIG. 16 is a schematic view of a third embodiment of the cleaning step of the present invention.
FIG. 17 is a schematic diagram of a first embodiment of the skewed cleaning step of the invention.
FIG. 18 is a schematic diagram of a second embodiment of the skewed cleaning step of the invention.
FIG. 19 is a schematic diagram of an implementation of the anisotropic cleaning step of the present invention.
FIG. 20 is a schematic view showing the drying step of the present invention.
Description of reference numerals:
1 bearing table 42 transverse driving device
2 vertical drive of the main drive 43
21 high-pressure nozzle group of main longitudinal driving device 5
22 primary transverse drive 51 spray head
3 secondary driving device 6 image taking device
31 rotary motor 10 semiconductor chip
32 support 100 bearing platform
321 Movable telescoping unit 200 cleaning assembly
4 drive unit A horizontal plane
41 longitudinal drive R flushing path
I after loading the semiconductor chip, move to the position
II calculating flow passage after taking phase and setting flushing operation path
III adjusting the cleaning assembly to make one or both of the bearing table and the cleaning assembly perform at least one direction of relative linear movement on the horizontal plane for one-time high-pressure washing
III-I, after the bearing platform and the cleaning component do surface deflection in at least one direction by taking the horizontal plane as a reference, one or both of the bearing platform and the cleaning component do relative linear movement in at least one direction on the horizontal plane, and high-pressure washing is carried out again
III-II making both the bearing platform and the cleaning assembly, making one or both of the bearing platform and the cleaning assembly do relative linear movement on a horizontal plane in at least one direction, but different from the primary high-pressure washing direction, and carrying out high-pressure washing again
IV adjusting the cleaning assembly for blow drying
Detailed Description
The following is a detailed description of the embodiments according to the drawings. It is to be noted at the outset that in the drawings, identical constituent elements or components are denoted by the same reference numerals as much as possible. In describing the present invention, detailed descriptions of related well-known functions or configurations are omitted so as not to obscure the gist of the present invention.
Referring to fig. 1 to 11, regarding the aspect of the cleaning device, a first technical solution of the present invention is a semiconductor cleaning device, which includes a carrying platform 100 and a cleaning assembly 200 disposed at the top end of the carrying platform 100, wherein the carrying platform 100 can be used for carrying a semiconductor chip 10, the cleaning assembly 200 can be used for performing high-pressure rinsing and air-blowing drying on the semiconductor chip 10, and the carrying platform 100 includes a carrying platform 1 and a main driving device 2; the bearing table 1 can be used for bearing and positioning the semiconductor chip 10; the main driving device 2 comprises a main longitudinal driving device 21 positioned at the bottom end and a main transverse driving device 22 arranged between the main longitudinal driving device 21 and the bearing table 1; the main longitudinal driving device 21 can drive the main longitudinal driving device 21 to make the bearing table 1 on the main longitudinal driving device move longitudinally on the horizontal plane A; the main transverse driving device 22 can drive the bearing table 1 to move transversely on the horizontal plane a.
By applying the bearing platform 100, the bearing platform 1 is used for bearing and positioning the semiconductor chip 10, the main driving device 2 is used for driving the bearing platform 1, the main longitudinal driving device 21 and the main transverse driving device 22 are used for driving the bearing platform 1 and the secondary driving device 3 to move longitudinally and transversely, so that the cleaning action can be diversified, different cleaning requirements are matched, the application range is prevented from being limited, the semiconductor chip 10 on the bearing platform 1 can be smoothly washed and dried by the cleaning assembly 200 under high pressure, and the semiconductor chip 10 can be smoothly dried by complete air blowing.
Secondly, the semiconductor cleaning device of the invention has no problem in application, can reduce the consumption of cleaning consumables and shorten the cleaning time while ensuring the cleaning effect and efficiency, does not need to stop the whole machine during maintenance, and has little influence on the production efficiency.
Referring to fig. 1 to 11, regarding the aspect of the cleaning device, a second technical solution of the present invention is a semiconductor cleaning device, which includes a carrying platform 100 and a cleaning assembly 200 disposed at the top end of the carrying platform 100, wherein the carrying platform 100 can be used for carrying a semiconductor chip 10, the cleaning assembly 200 can be used for performing high-pressure rinsing and air-blowing drying on the semiconductor chip 10, and the cleaning assembly 200 includes a driving device 4, a high-pressure nozzle set 5, and an image capturing device 6; the driving device 4 can be used for bearing and driving the high-pressure nozzle group 5; the high-pressure nozzle group 5 is arranged on the driving device 4, can be driven by the driving device 4 to perform at least one-direction three-dimensional movement, can perform one of high-pressure washing and air blowing drying on the semiconductor chip 10, and comprises at least one nozzle 51 with an adjustable angle; the image capturing device 6 is disposed above the supporting platform 100, and is capable of capturing an image of the semiconductor chip 10 supported on the supporting platform 100 to calculate a flow channel and then set a flushing operation path R, so that the high-pressure nozzle group 5 can flush according to the flushing operation path R.
Wherein, through the application of this kind of cleaning assembly 200, utilize drive arrangement 4 to drive high pressure nozzle group 5 and remove, with complete clean semiconductor chip 10, utilize high pressure nozzle group 5, carry out high pressure washing and jet-propelled drying to semiconductor chip 10, utilize and get for instance device 6 and get for instance to the semiconductor chip 10 that bears on load-bearing platform 100, with set for out behind the calculation runner and wash operation route R, wash according to washing operation route R, guarantee that the cleaning at every turn is normal operation, for traditional semiconductor cleaning device, can cooperate present application demand, clean efficiency is higher.
Referring to fig. 1 to 11, regarding the aspect of the cleaning device, a third technical solution of the present invention is a semiconductor cleaning device, which includes a carrying platform 100 and a cleaning assembly 200 disposed at the top end of the carrying platform 100, wherein the carrying platform 100 can be used for carrying a semiconductor chip 10, the cleaning assembly 200 can be used for performing high-pressure rinsing and air-blowing drying on the semiconductor chip 10, and the carrying platform 100 includes a carrying platform 1 and a main driving device 2; the bearing table 1 can be used for bearing and positioning the semiconductor chip 10; the main driving device 2 comprises a main longitudinal driving device 21 positioned at the bottom end and a main transverse driving device 22 arranged between the main longitudinal driving device 21 and the bearing table 1; the main longitudinal driving device 21 can drive the main longitudinal driving device 21 to make the bearing table 1 on the main longitudinal driving device move longitudinally on the horizontal plane A; the main transverse driving device 22 can drive the bearing table 1 to transversely move on a horizontal plane A; the driving device 4 can be used for bearing and driving the high-pressure nozzle group 5; the high-pressure nozzle group 5 is arranged on the driving device 4, can be driven by the driving device 4 to perform at least one-direction three-dimensional movement, can perform one of high-pressure washing and air blowing drying on the semiconductor chip 10, and comprises at least one nozzle 51 with an adjustable angle; the image capturing device 6 is disposed above the supporting platform 100, and is capable of capturing an image of the semiconductor chip 10 supported on the supporting platform 100 to calculate a flow channel and then set a flushing operation path R, so that the high-pressure nozzle group 5 can flush according to the flushing operation path R.
The first and second technical solutions of the present invention are integrated to form a third technical solution of the present invention, and the carrier platform 100 of the first technical solution and the cleaning assembly 200 of the second technical solution are combined more effectively, so that the semiconductor cleaning apparatus of the present invention can be applied more widely, and can be applied to different cleaning methods to increase the overall applicability.
Referring to fig. 5 to 7, the carrying platform 100 further includes a secondary driving device 3, which includes a rotating motor 31 disposed between the carrying platform 1 and the primary driving device 2, and a support 32, wherein the rotating motor 31 can drive the carrying platform 1 to rotate, and the support 32 is located outside the rotating motor 31; the support 32 further includes three movable telescopic units 321 disposed between the platform 1 and the main driving device 2 in a tripod manner, and the movable telescopic units 321 can cooperate to drive the platform 1 to perform plane deflection in at least one direction with a horizontal plane a as a reference.
Wherein, the rotation motor 31 of the secondary driving device 3 is applied to the bracket 32 to rotate the carrier 1, so as to dry more effectively and avoid the problem of poor drying.
Secondly, the movable telescopic unit 321 provided in the form of a tripod can provide stable support and control the surface deflection of the platform 1, so that the operation can be adapted to various application requirements without worrying about the problem of being unable to be applied.
Referring to fig. 3, 9 to 11, the driving device 4 further includes a longitudinal driving device 41, a transverse driving device 42 disposed at a bottom end of the longitudinal driving device 41, and a vertical driving device 43 disposed on the transverse driving device 42, wherein the vertical driving device 43 can be used for carrying and driving the high pressure nozzle set 5.
The vertical driving device 41 can drive the high-pressure nozzle group 5 to move longitudinally, the horizontal driving device 42 can drive the high-pressure nozzle group 5 to move horizontally, and the vertical driving device 43 can drive the high-pressure nozzle group 5 to move vertically to adjust the pressure for cleaning the semiconductor chip 10, so that the position of the high-pressure nozzle group 5 can be adjusted quickly and freely, the whole cleaning process can be flushed under high pressure, and the image can be taken clearly and accurately.
Referring to fig. 12-16 and 19, a cleaning method aspect of the present invention is a semiconductor cleaning method, which can be applied with a semiconductor cleaning apparatus, comprising: a positioning step I, namely moving to positioning after loading the semiconductor chip; a phase taking step II, calculating a flow channel after the phase taking, and setting a flushing running path; a cleaning step III, in which one or both of the bearing table and the cleaning assembly are subjected to relative linear movement in at least one direction on a horizontal plane for primary high-pressure washing in order to adjust the cleaning assembly; and a drying step IV, in order to adjust the cleaning component to carry out air blowing drying.
By applying the cleaning method, the positioning step I can ensure that the positioning can be correct each time; the phase taking step II can be matched with the loading of the semiconductor chip, so that the cleaning in each time can be enough and more efficient; the cleaning step III is different from the traditional semiconductor cleaning device because of the matched semiconductor cleaning device, so that real high-pressure flushing can be carried out during cleaning, and more accurate cleaning can be carried out; the investment of the drying step IV can improve the overall processing speed and shorten the working hours so as to facilitate the treatment of the next stage.
Secondly, the cleaning method of the invention is characterized in that the preparation of the cleaning step III is matched with the application requirements through different cleaning modes.
Application example one: in the positioning step and phase-taking step shown in fig. 13, in cooperation with the cleaning step of the first embodiment shown in fig. 14, the high-pressure nozzle set 5 can be operated according to the rinsing operation path R to perform rinsing in cooperation with the stationary stage 1, and finally, the drying step shown in fig. 20 is added to complete the semiconductor chip cleaning.
Application example two: in the positioning step and phase-taking step shown in fig. 13, in combination with the cleaning step of the second embodiment shown in fig. 15, the carrier 1 can be moved along the rinsing path R to perform rinsing in combination with the stationary high-pressure nozzle set 5, and finally, the drying step shown in fig. 20 is added to complete the semiconductor chip cleaning.
Application example three: with the positioning step and the phase-taking step as shown in fig. 13, in cooperation with the cleaning step of the third embodiment as shown in fig. 16, the carrier 1 and the carrier 1 can be moved according to the rinsing path R to perform rinsing, and finally, the drying step as shown in fig. 20 is added to complete the semiconductor chip cleaning.
Referring to fig. 12, 17 and 18, the cleaning step iii further includes a tilted cleaning step iii-i, in which after the carrier and the cleaning assembly are tilted in at least one direction with respect to the horizontal plane, one or both of the carrier and the cleaning assembly are relatively moved linearly in at least one direction on the horizontal plane to perform a high pressure cleaning again.
In the cleaning step III, the allocation of the inclined cleaning step III-I is added, so that the cleaning effect can be improved, and the cleaning requirement of the semiconductor chip needing to be cleaned more carefully is met.
Application example one: with the positioning step and phase-taking step as shown in fig. 13, in cooperation with the cleaning step of the first embodiment as shown in fig. 14, the high-pressure nozzle set 5 can be operated according to the rinsing operation path R to perform rinsing in cooperation with the stationary stage 1, and then the cleaning step of the first embodiment as shown in fig. 17 is performed, and finally the drying step as shown in fig. 20 is performed to complete the cleaning of the semiconductor chip.
Application example two: with the positioning step and phase extraction step shown in fig. 13 in combination with the cleaning step of the second embodiment shown in fig. 15, the carrier 1 can be moved along the rinsing path R to perform rinsing with the stationary high pressure nozzle set 5, followed by the inclined cleaning step of the second embodiment shown in fig. 18 and finally the drying step shown in fig. 20 to complete the semiconductor chip cleaning.
Referring to fig. 12 and 19, the cleaning step iii further includes a counter-directional cleaning step iii-ii in which one or both of the carrier and the cleaning assembly are moved linearly in a direction different from the primary high-pressure cleaning direction on a horizontal plane, and a secondary high-pressure cleaning is performed.
In the cleaning step III, the allocation of the anisotropic cleaning steps III-II is added, so that the cleaning effect can be improved, the cleaning of the semiconductor chip which is not suitable for inclined cleaning is matched, and the application range is enlarged.
Application example: in the positioning step and phase-taking step shown in fig. 13, in combination with the cleaning step of the second embodiment shown in fig. 15, the carrier 1 can be moved along the rinsing path R to perform rinsing in combination with the stationary high-pressure nozzle set 5, and then the anisotropic cleaning step shown in fig. 19 is performed, and finally the drying step shown in fig. 20 is performed to complete the semiconductor chip cleaning.
Finally, it should be noted that in the drying step shown in fig. 20, although not shown, the carrier 1 can be used to blow dry the semiconductor chip only through the high pressure nozzle set 5 without rotating.
The construction, features and functions of the present invention have been described in detail with reference to the embodiments shown in the drawings, but the present invention is not limited to the embodiments shown in the drawings, and all equivalent embodiments modified or modified by the spirit and scope of the present invention should be protected without departing from the spirit of the present invention.
Claims (14)
1. A semiconductor cleaning device comprises a bearing platform (100) and a cleaning component (200) arranged at the top end of the bearing platform (100), wherein the bearing platform (100) can be used for bearing a semiconductor chip (10), the cleaning component (200) can be used for carrying out high-pressure washing and air blowing drying on the semiconductor chip (10), and the semiconductor cleaning device is characterized in that:
the bearing platform (100) comprises a bearing platform (1) and a main driving device (2);
the bearing table (1) can be used for bearing and positioning the semiconductor chip (10);
the main driving device (2) comprises a main longitudinal driving device (21) positioned at the bottom end and a main transverse driving device (22) arranged between the main longitudinal driving device (21) and the bearing table (1);
the main longitudinal driving device (21) can drive the main longitudinal driving device (21) to enable the bearing table (1) on the main longitudinal driving device to move longitudinally on a horizontal plane (A);
the main transverse driving device (22) can drive the bearing platform (1) to transversely move on a horizontal plane (A).
2. The semiconductor cleaning apparatus according to claim 1, wherein: the bearing platform (100) further comprises a secondary driving device (3) which comprises a rotating motor (31) and a support (32), wherein the rotating motor (31) is arranged between the bearing platform (1) and the primary driving device (2), the rotating motor (31) can drive the bearing platform (1) to rotate, and the support (32) is positioned outside the rotating motor (31);
the support (32) further comprises three movable telescopic units (321) arranged between the bearing platform (1) and the main driving device (2) in a tripod shape, and the movable telescopic units (321) can drive the bearing platform (1) to deflect in at least one direction by taking a horizontal plane (A) as a reference in a matching manner.
3. The semiconductor cleaning apparatus according to claim 2, wherein: the cleaning assembly (200) comprises a driving device (4), a high-pressure nozzle group (5) and an image capturing device (6);
the driving device (4) can be used for bearing and driving the high-pressure nozzle group (5);
the high-pressure nozzle group (5) is arranged on the driving device (4), can be driven by the driving device (4) to do three-dimensional movement in at least one direction, can perform one of high-pressure washing and air blowing drying on the semiconductor chip (10), and comprises at least one nozzle (51) with an adjustable angle;
the image capturing device (6) is arranged above the bearing platform (100) and can capture images of the semiconductor chip (10) borne on the bearing platform (100) so as to calculate a flow channel and then set a flushing running path (R), so that the high-pressure nozzle group (5) can be flushed according to the flushing running path (R).
4. The semiconductor cleaning apparatus according to claim 3, wherein: the driving device (4) further comprises a longitudinal driving device (41), a transverse driving device (42) arranged at the bottom end of the longitudinal driving device (41), and a vertical driving device (43) arranged on the transverse driving device (42), wherein the vertical driving device (43) can be used for bearing and driving the high-pressure nozzle group (5).
5. A semiconductor cleaning device comprises a bearing platform (100) and a cleaning component (200) arranged at the top end of the bearing platform (100), wherein the bearing platform (100) can be used for bearing a semiconductor chip (10), the cleaning component (200) can be used for carrying out high-pressure washing and air blowing drying on the semiconductor chip (10), and the semiconductor cleaning device is characterized in that:
the cleaning assembly (200) comprises a driving device (4), a high-pressure nozzle group (5) and an image capturing device (6);
the driving device (4) can be used for bearing and driving the high-pressure nozzle group (5);
the high-pressure nozzle group (5) is arranged on the driving device (4), can be driven by the driving device (4) to do three-dimensional movement in at least one direction, can perform one of high-pressure washing and air blowing drying on the semiconductor chip (10), and comprises at least one nozzle (51) with an adjustable angle;
the image capturing device (6) is arranged above the bearing platform (100) and can capture images of the semiconductor chip (10) borne on the bearing platform (100) so as to calculate a flow channel and then set a flushing running path (R), so that the high-pressure nozzle group (5) can be flushed according to the flushing running path (R).
6. The semiconductor cleaning apparatus according to claim 5, wherein: the driving device (4) further comprises a longitudinal driving device (41), a transverse driving device (42) arranged at the bottom end of the longitudinal driving device (41), and a vertical driving device (43) arranged on the transverse driving device (42), wherein the vertical driving device (43) can be used for bearing and driving the high-pressure nozzle group (5).
7. The semiconductor cleaning apparatus according to claim 6, wherein: the bearing platform (100) comprises a bearing platform (1) and a main driving device (2);
the bearing table (1) can be used for bearing and positioning the semiconductor chip (10);
the main driving device (2) comprises a main longitudinal driving device (21) positioned at the bottom end and a main transverse driving device (22) arranged between the main longitudinal driving device (21) and the bearing table (1);
the main longitudinal driving device (21) can drive the main longitudinal driving device (21) to enable the bearing table (1) on the main longitudinal driving device to move longitudinally on a horizontal plane (A);
the main transverse driving device (22) can drive the bearing platform (1) to transversely move on a horizontal plane (A).
8. The semiconductor cleaning apparatus according to claim 7, wherein: the bearing platform (100) further comprises a secondary driving device (3) which comprises a rotating motor (31) and a support (32), wherein the rotating motor (31) is arranged between the bearing platform (1) and the primary driving device (2), the rotating motor (31) can drive the bearing platform (1) to rotate, and the support (32) is positioned outside the rotating motor (31);
the support (32) further comprises three movable telescopic units (321) arranged between the bearing platform (1) and the main driving device (2) in a tripod shape, and the movable telescopic units (321) can drive the bearing platform (1) to deflect in at least one direction by taking a horizontal plane (A) as a reference in a matching manner.
9. A semiconductor cleaning device comprises a bearing platform (100) and a cleaning component (200) arranged at the top end of the bearing platform (100), wherein the bearing platform (100) can be used for bearing a semiconductor chip (10), the cleaning component (200) can be used for carrying out high-pressure washing and air blowing drying on the semiconductor chip (10), and the semiconductor cleaning device is characterized in that:
the bearing platform (100) comprises a bearing platform (1) and a main driving device (2);
the bearing table (1) can be used for bearing and positioning the semiconductor chip (10);
the main driving device (2) comprises a main longitudinal driving device (21) positioned at the bottom end and a main transverse driving device (22) arranged between the main longitudinal driving device (21) and the bearing table (1);
the main longitudinal driving device (21) can drive the main longitudinal driving device (21) to enable the bearing table (1) on the main longitudinal driving device to move longitudinally on a horizontal plane (A);
the main transverse driving device (22) can drive the bearing table (1) to transversely move on a horizontal plane (A);
the driving device (4) can be used for bearing and driving the high-pressure nozzle group (5);
the high-pressure nozzle group (5) is arranged on the driving device (4), can be driven by the driving device (4) to do three-dimensional movement in at least one direction, can perform one of high-pressure washing and air blowing drying on the semiconductor chip (10), and comprises at least one nozzle (51) with an adjustable angle;
the image capturing device (6) is arranged above the bearing platform (100) and can capture images of the semiconductor chip (10) borne on the bearing platform (100) so as to calculate a flow channel and then set a flushing running path (R), so that the high-pressure nozzle group (5) can be flushed according to the flushing running path (R).
10. The semiconductor cleaning apparatus according to claim 9, wherein: the bearing platform (100) further comprises a secondary driving device (3) which comprises a rotating motor (31) and a support (32), wherein the rotating motor (31) is arranged between the bearing platform (1) and the primary driving device (2), the rotating motor (31) can drive the bearing platform (1) to rotate, and the support (32) is positioned outside the rotating motor (31);
the support (32) further comprises three movable telescopic units (321) arranged between the bearing platform (1) and the main driving device (2) in a tripod shape, and the movable telescopic units (321) can drive the bearing platform (1) to deflect in at least one direction by taking a horizontal plane (A) as a reference in a matching manner.
11. The semiconductor cleaning apparatus according to claim 10, wherein: the driving device (4) further comprises a longitudinal driving device (41), a transverse driving device (42) arranged at the bottom end of the longitudinal driving device (41), and a vertical driving device (43) arranged on the transverse driving device (42), wherein the vertical driving device (43) can be used for bearing and driving the high-pressure nozzle group (5).
12. A semiconductor cleaning method, which can be applied in conjunction with a semiconductor cleaning device, comprises:
a positioning step (I), namely moving to positioning after loading the semiconductor chip;
a phase taking step (II) for calculating a flow channel after the phase taking and setting a flushing running path;
a cleaning step (III) of adjusting the cleaning assembly to enable one or both of the bearing table and the cleaning assembly to do relative linear movement in at least one direction on a horizontal plane for primary high-pressure washing; and
and (IV) drying, namely adjusting the cleaning component to carry out air blowing drying.
13. The semiconductor cleaning method according to claim 12, characterized in that: after the cleaning step (III), a skew cleaning step is further included: after the bearing table and the cleaning assembly are subjected to surface deflection in at least one direction by taking the horizontal plane as a reference, one or both of the bearing table and the cleaning assembly are subjected to relative linear movement in at least one direction on the horizontal plane to perform high-pressure washing again.
14. The semiconductor cleaning method according to claim 12, characterized in that: after the cleaning step (III), a counter-directional cleaning step is also included: the two bearing tables and the cleaning assembly are arranged, one or both of the bearing tables and the cleaning assembly do relative linear movement on the horizontal plane in at least one direction, but different from the primary high-pressure washing direction, and the secondary high-pressure washing is carried out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810970875.2A CN110858551A (en) | 2018-08-24 | 2018-08-24 | Semiconductor cleaning device and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810970875.2A CN110858551A (en) | 2018-08-24 | 2018-08-24 | Semiconductor cleaning device and method |
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| Publication Number | Publication Date |
|---|---|
| CN110858551A true CN110858551A (en) | 2020-03-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810970875.2A Pending CN110858551A (en) | 2018-08-24 | 2018-08-24 | Semiconductor cleaning device and method |
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| Country | Link |
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| CN (1) | CN110858551A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113020088A (en) * | 2021-05-19 | 2021-06-25 | 捷仪科技(北京)有限公司 | Chip washing device |
| CN113113334A (en) * | 2021-04-08 | 2021-07-13 | 杨智仁 | Wet process cleaning equipment and wet process cleaning method |
-
2018
- 2018-08-24 CN CN201810970875.2A patent/CN110858551A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113113334A (en) * | 2021-04-08 | 2021-07-13 | 杨智仁 | Wet process cleaning equipment and wet process cleaning method |
| CN113020088A (en) * | 2021-05-19 | 2021-06-25 | 捷仪科技(北京)有限公司 | Chip washing device |
| CN113020088B (en) * | 2021-05-19 | 2021-08-10 | 捷仪科技(北京)有限公司 | Chip washing device |
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