CN113113334A - Wet process cleaning equipment and wet process cleaning method - Google Patents
Wet process cleaning equipment and wet process cleaning method Download PDFInfo
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- CN113113334A CN113113334A CN202110375539.5A CN202110375539A CN113113334A CN 113113334 A CN113113334 A CN 113113334A CN 202110375539 A CN202110375539 A CN 202110375539A CN 113113334 A CN113113334 A CN 113113334A
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- 238000004140 cleaning Methods 0.000 title claims abstract description 125
- 238000000034 method Methods 0.000 title claims abstract description 97
- 230000008569 process Effects 0.000 title claims abstract description 69
- 239000007921 spray Substances 0.000 claims abstract description 77
- 230000005540 biological transmission Effects 0.000 claims abstract description 32
- 238000012546 transfer Methods 0.000 claims abstract description 11
- 239000000758 substrate Substances 0.000 claims description 41
- 238000005507 spraying Methods 0.000 claims description 32
- 238000006073 displacement reaction Methods 0.000 claims description 31
- 239000007788 liquid Substances 0.000 claims description 16
- 239000012530 fluid Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 238000007664 blowing Methods 0.000 claims description 5
- 238000013459 approach Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 16
- 238000001514 detection method Methods 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000861 blow drying Methods 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
A wet process cleaning device and a wet process cleaning method are provided, wherein the wet process cleaning device comprises a transfer device, at least one transmission device, at least one first spray head unit and a control unit. The transfer device comprises a first driving unit and a cantilever, and the cantilever can be driven by the first driving unit to move along a first direction. The transmission device is arranged on the cantilever and comprises a sliding seat, a second driving unit and a lifting seat group. The second driving unit drives the sliding seat to move along a second direction. The lifting seat group is provided with a lifting seat and a third driving unit for driving the lifting seat to move. The first spray head unit is arranged on the lifting seat and comprises a plurality of spray heads. The control unit is used for controlling the first driving unit, the second driving unit and the third driving unit and selectively switching the spray head on and off.
Description
Technical Field
The present invention relates to semiconductor devices, and more particularly, to a wet process cleaning device and a wet process cleaning method.
Background
In order to remove residues or particles generated during the semiconductor manufacturing process, a wet cleaning method is usually used to clean the wafer surface to increase the yield.
As shown in fig. 1, a conventional wafer cleaning apparatus places a wafer 10 to be cleaned on a rotary table 11, the rotary table 11 continuously rotates around its axis, and sprays a cleaning solution on the surface of the wafer 10 through a nozzle 12 located above the wafer 10 and moving step by step, and then the cleaning solution is rotated outwards from the center of the wafer 10 by centrifugal force when the rotary table 11 drives the wafer 10 to rotate, so as to clean residues or particles on the wafer 10, thereby achieving a cleaning effect.
However, when the wafer cleaning apparatus is used for cleaning the wafer 10, in order to overcome the problem that the cleaning liquid stays near the center of the wafer 10 for too short time to be cleaned completely, the amount of the cleaning liquid is increased, which results in too high cost of the consumable material of the cleaning liquid.
Disclosure of Invention
The invention aims to provide wet process cleaning equipment which can save material cost and improve cleaning effect.
The wet process cleaning equipment comprises a bearing surface, a transfer device, at least one transmission device, at least one first spray head unit and a control unit.
The transfer device comprises a pair of first guide rails extending along a first direction, a first driving unit arranged on one of the first guide rails, and a cantilever spanning the first guide rails along a second direction, wherein the second direction is substantially perpendicular to the first direction, the first guide rails are spaced in the second direction and surround the bearing surface on the inner side, the cantilever can be driven by the first driving unit to move along the first direction relative to the bearing surface, and the cantilever comprises a second rail extending along the second direction. The transmission device is arranged on the cantilever and comprises a sliding seat, a second driving unit and a lifting seat group. The sliding seat is movably arranged on the second track. The second driving unit is used for driving the sliding seat to move along the second direction. The lifting seat group is arranged on the sliding seat and moves along with the sliding seat, the lifting seat group is provided with a body which is arranged on the sliding seat and is provided with a third track, a lifting seat which is movably arranged on the third track and a third driving unit which is used for driving the lifting seat to move along a third direction, and the third direction, the first direction and the second direction are substantially vertical to each other.
The number of the first spray head units corresponds to the transmission device, the first spray head units are detachably arranged on the lifting seat and comprise a plurality of spray heads arranged at intervals along the first direction, and the spray heads are driven by the lifting seat to move along the third direction. The control unit is used for controlling the first driving unit, the second driving unit and the third driving unit, and the control unit can selectively open and close the spray head. The control unit drives the second driving unit and enables the sliding seat to move for a stroke displacement in the second direction, and then the control unit drives the first driving unit and enables the cantilever to move back and forth for a preset number of times along the first direction according to a short displacement.
The wet process cleaning equipment provided by the invention has the advantages that the spray heads are arranged at equal intervals, and the short-distance displacement is not more than four times of the distance between two adjacent spray heads and not less than 0.25 time of the distance between two adjacent spray heads.
The wet process cleaning equipment comprises two transmission devices which are spaced in the second direction, and two first spray head units which are arranged on the transmission devices respectively, wherein the transmission devices are used for driving the first spray head units respectively, and each transmission device can move independently.
In the wet process cleaning equipment, the nozzles of the first nozzle unit are inclined towards each other or inclined towards the same side.
The wet process cleaning equipment further comprises at least one second spray head unit, the second spray head unit can be installed on the lifting seat after the first spray head unit is detached from the lifting seat, one of the second spray head unit and the first spray head unit is used for spraying liquid, and the other of the second spray head unit and the first spray head unit is used for blowing out gas.
In the wet process cleaning equipment, each spray head is used for allowing fluid to pass through and form a fan-shaped spraying area, each fan-shaped spraying area is provided with a bottom edge, the lifting seat drives the spray heads to approach the bearing surface along the third direction, the bottom edge of each two adjacent fan-shaped spraying areas is partially overlapped, and the overlapping proportion is more than 0% but not more than 50%.
The wet process cleaning equipment comprises a first sprayer unit, a second sprayer unit, a lifting seat, a first sprayer unit and a second sprayer unit, wherein the lifting seat is provided with an exchange disc, the first sprayer unit further comprises a mounting seat for the sprayer, and the mounting seat is provided with a combining part detachably connected with the exchange disc.
In the wet process cleaning apparatus of the present invention, each of the nozzles has a spraying angle of 30 to 50 °.
Another objective of the present invention is to provide a wet process cleaning method that can save material cost and improve cleaning effect.
The wet process cleaning method of the present invention is suitable for spraying a fluid on a substrate and cleaning the substrate, and comprises the following steps:
step A, providing wet process cleaning equipment, wherein the wet process cleaning equipment is provided with a plurality of spray heads arranged at intervals and a control unit for opening and closing the spray heads.
And step B, determining the number of the nozzles to be opened according to at least one physical parameter of the base material.
And step C, after the spray head moves a stroke displacement along the second direction, the spray head moves back and forth for a preset number of times along the first direction by a short-distance displacement, and the stroke displacement, the short-distance displacement and the preset number of times are determined according to at least one physical parameter of the base material.
And D, repeating the step C.
In the wet process cleaning method of the present invention, the showerhead in the step a is used for spraying liquid, and the wet process cleaning method further includes a step E after the step D of replacing the showerhead with another set of showerhead for blowing gas, and repeating the step C until the substrate is blown dry.
According to the wet process cleaning method, the spray heads are arranged equidistantly, and the short-distance displacement is not more than four times of the distance between two adjacent spray heads and not less than 0.25 time of the distance between two adjacent spray heads.
According to the wet process cleaning method, the wet process cleaning equipment further comprises two transmission devices capable of moving independently and two first spray head units arranged on the transmission devices respectively, wherein the first spray head units are used for arranging the spray heads respectively.
In the wet process cleaning method of the present invention, the first nozzle unit moves simultaneously when performing the step C.
In the wet process cleaning method of the present invention, the spraying angle of each nozzle is between 30 ° and 50 °.
The invention has the beneficial effects that: after the second driving unit of the wet process cleaning equipment drives the sliding seat to move the stroke displacement in the second direction, the first driving unit drives the cantilever to move back and forth along the first direction for the preset times according to the short distance displacement, so that the wet process cleaning method can increase the contact time of fluid and the base material, reduce the consumption of cleaning fluid and improve the cleaning effect by a cleaning mode that the spray head moves for a short distance along the first direction and then moves back and forth for a plurality of times along the first direction for a short distance along the second direction.
Drawings
Other features and effects of the present invention will be apparent from the embodiments with reference to the accompanying drawings, in which:
FIG. 1 is a schematic diagram of a conventional wafer cleaning apparatus;
FIG. 2 is a schematic view of a wet process cleaning apparatus for cleaning a substrate according to a first embodiment of the present invention;
FIG. 3 is a schematic perspective view of the first embodiment;
FIG. 4 is a circuit block diagram of the first embodiment;
FIG. 5 is a fragmentary rear view of the first embodiment;
FIG. 6 is a fragmentary side elevation illustrating the intermittent movement of the two actuators of the first embodiment by a stroke displacement amount;
fig. 7 is a schematic top view illustrating a cantilever of a transfer device of the first embodiment moving back and forth by a short displacement;
FIG. 8 is a schematic perspective view illustrating that two first showerhead units and two second showerhead units of the first embodiment can be used interchangeably;
FIG. 9 is another circuit block diagram of the first embodiment;
FIG. 10 is a flow chart of a wet process cleaning method of the present invention;
FIG. 11 is a schematic perspective view illustrating wet process cleaning of the substrate using the first embodiment of the wet process cleaning apparatus of the present invention;
FIG. 12 is a side view of the first head unit with nozzles spraying cleaning solution, each nozzle forming a fan-shaped spraying area;
FIGS. 13-15 are schematic diagrams illustrating the wet process cleaning method according to the present invention;
FIG. 16 is a schematic perspective view of a wet process cleaning apparatus according to a second embodiment of the present invention;
FIG. 17 is a schematic perspective view of a wet bench cleaning apparatus according to a third embodiment of the present invention;
FIG. 18 is a schematic side view of the third embodiment; and
FIG. 19 is a schematic perspective view illustrating another operation of the wet cleaning method of the present invention.
Detailed Description
Before the present invention is described in detail, it should be noted that in the following description, similar components are denoted by the same reference numerals.
Referring to fig. 2 to 4, a first embodiment of the wet cleaning apparatus according to the present invention is adapted to spray a fluid onto a substrate 91 and clean the substrate 91, the substrate 91 is formed with a plurality of chips 911 (see fig. 11) arranged in sequence, and the substrate 91 may be a wafer, a chip on a wafer on a substrate, a wafer level package assembly, a chip carried on a tray, or other semiconductor material. The wet process cleaning equipment comprises a machine base 2, a bearing platform 21, a transfer device 3, two transmission devices 4, two first spray head units 5, a control unit 6 and an optical detection device 7.
The bearing table 21 is disposed on the base 2 and has a bearing surface 211.
The transfer device 3 is disposed on the machine base 2, and the transfer device 3 includes a pair of first guide rails 31 extending along a first direction X, a first driving unit 32 disposed on one of the first guide rails 31, and a suspension 33 spanning the first guide rail 31 along a second direction Y substantially perpendicular to the first direction X. The first guide rail 31 surrounds the plummer 21 at an interval in the second direction Y. The suspension arm 33 includes two columns 331 extending along a third direction Z and slidably connected to the first guide rails 31, and a beam 332 extending along the second direction Y and connected to the columns 331, wherein the third direction Z, the second direction Y and the first direction X are substantially perpendicular to each other. As shown in fig. 3, the first direction X is a left-right direction, the second direction Y is a front-back direction, and the third direction Z is a top-bottom direction. The cross member 332 has a second rail 333 extending along the second direction Y. The suspension arm 33 can be driven by the first driving unit 32 to move along the first guide rail 31 and move relative to the bearing surface 211. In the first driving unit 32 of the first embodiment, a motor 321 drives a screw to rotate so as to drive the cantilever 33 to move left and right along the first direction X, but the first driving unit 32 may also adopt other transmission mechanisms such as a motor and a belt, a motor and a chain, a linear motor, an electric cylinder, etc., and can also drive the cantilever 33 to move left and right along the first direction X, and the transmission manner is not limited by the present invention.
The actuators 4 are disposed at intervals along the second direction Y on the cantilever 33 and move along with the cantilever 33, the structure of the actuators 4 is the same, and each actuator 4 can move independently. The transmission 4 is described in detail below.
Referring to fig. 2, 3 and 5, the transmission device 4 includes a sliding seat 41 movably disposed on the second rail 333, a second driving unit 42 for driving the sliding seat 41 to move along the second rail 333, and a lifting seat set 43 disposed on the sliding seat 41 and moving along with the sliding seat 41. The second driving unit 42 of the first embodiment drives a belt (not shown) to rotate by a motor 421 to drive the sliding base 41 to move back and forth along the second direction Y, but other transmission manners can be adopted as mentioned above, which is not a limitation of the present invention. The lifter base group 43 has a body 432 disposed on the sliding base 41 and formed with a third rail 431, a lifter base 433 movably disposed on the third rail 431, and a third driving unit 434 for driving the lifter base 433 to move along the third direction Z. Thereby, the lifting base 433 can be lifted along the third direction Z and can move back and forth along the second direction Y. The lifting base 433 has a base 435 slidably disposed on the third rail 431, and a plate 436 fixedly connected to the base 435 and extending downward, wherein the plate 436 is substantially L-shaped and has a switch board 437 formed on a bottom side.
The first nozzle units 5 are respectively installed on the lifting seat 433 of the transmission device 4 and driven by the transmission device 4, and the number of the first nozzle units 5 corresponds to the number of the transmission device 4. Each of the first head units 5 is detachably disposed on the exchange plate 437 of the corresponding lifting seat 433, each of the first head units 5 includes a mounting seat 51 detachably coupled to the corresponding exchange plate 437, and a plurality of heads 52 disposed on the mounting seat 51 at intervals along the first direction X, and the mounting seat 51 has a coupling portion 511 detachably coupled to the exchange plate 437. The nozzles 52 are high-pressure nozzles and are equidistantly arranged, and driven by the lifting base 433 to be lifted along the third direction Z and moved back and forth along the second direction Y, and the nozzles 52 are also driven by the transfer device 3 to move left and right along the first direction X. The heads 52 of the first head unit 5 of the first embodiment are inclined toward the same side and used to spray any combination of cleaning liquids, chemical agents, organic solvents, surfactants, water, etc., and the heads 52 can be independently opened and closed and can simultaneously use cleaning liquids of the same or different compositions.
The spraying angle α of each of the nozzles 52 is defined as an angle between a normal line of each of the nozzles and the top surface of the substrate 91, and it is to be noted that different spraying angles α affect the cleaning effect, and the results of the different spraying angles α and the cleaning effect are summarized in the following table 1 under the same condition of the liquid pressure of 1000 psi.
TABLE 1
| Spraying angle alpha | Cleaning Effect (%) |
| 70° | 50 |
| 60° | 90 |
| 50° | 100 |
| 40° | 100 |
| 30° | 100 |
| 20° | 95 |
| 10° | 70 |
As can be seen from table 1, the cleaning effect of the spray angle α is good between 20 ° and 60 °, and particularly the cleaning effect is optimal between 30 ° and 50 °.
Referring to fig. 3 and 4, the control unit 6 is configured to control the first driving unit 32, the second driving unit 42 and the third driving unit 434, so that the first head unit 5 can move in three axes, i.e., the first direction X, the second direction Y and the third direction Z.
Referring to fig. 4, 6 and 7, after the control unit 6 drives the second driving unit 42 and moves the sliding seat 41 by a stroke displacement P in the second direction Y, the control unit 6 drives the first driving unit 32 and moves the cantilever 33 back and forth along the first direction X by a short displacement D for a predetermined number of times, so that the nozzle 52 moves back and forth along the first direction X for a short distance several times, thereby increasing the time for contacting the fluid with the substrate 91, reducing the amount of the cleaning solution and improving the cleaning effect. It should be noted that the stroke displacement P refers to a displacement of each sliding seat 41 that stops after moving forward or backward by a certain distance, and the short displacement D refers to a distance of the cantilever 33 moving back and forth at the left and right ends. Preferably, the short-distance displacement D is not greater than four times the distance between two adjacent nozzles 52, and is not less than 0.25 times the distance between two adjacent nozzles 52. The control unit 6 is further selectively used to open and close the spray head 52, so that the spray head 52 is partially opened or fully opened according to actual requirements.
The optical detection device 7 is in signal connection with the control unit 6, and is used for optically detecting the substrate 91 to obtain at least one physical parameter of the substrate 91, such as but not limited to substrate length, substrate width, substrate thickness, chip size in the substrate, chip thickness, and chip pitch. The optical detection device 7 is for example but not limited to a CCD, a video camera. The optical detection device 7 transmits the detected physical parameters to the control unit 6, and the control unit 6 can determine the cleaning operation conditions such as the number of the nozzles 52, the operating height of the nozzles 52, the pressure of the cleaning liquid, and the amount of the cleaning liquid.
It can be understood that the first embodiment can also omit the optical detection device 7 and obtain the required values from a database (not shown) in which various physical parameters of the substrate 91 are established, or can determine the cleaning operation conditions.
Referring to fig. 8 and 9, the wet process cleaning apparatus may further include two second showerhead units 5' respectively placed on the two stacks 92, each of the second showerhead units 5' also includes the mounting seat 51 and the showerhead 52 except that the showerhead 52 of the second showerhead unit 5' is used to blow a gas such as nitrogen, thereby blow-drying the substrate 91 (see fig. 7). The second head unit 5' may be installed on the lifting base 433 after the first head unit 5 is detached from the lifting base 433. Similarly, the control unit 6 is also selectively used to open and close the nozzles 52 of the second nozzle unit 5', so that the nozzles 52 can be partially opened or fully opened according to actual requirements, thereby determining dry operating conditions such as the number of the nozzles 52 to be opened, gas pressure, and air intake amount.
Referring to fig. 10, a method for performing wet process cleaning and a drying process using the first embodiment of the present invention is described as follows:
In step 83, at least one physical parameter of the substrate 91 is detected by the optical detection device 7 and transmitted to the control unit 6.
In the wet process cleaning method of the present invention, the nozzle 52 moves a short distance along the second direction Y and then moves back and forth a plurality of times along the first direction X, thereby increasing the contact time between the fluid and the substrate 91, reducing the amount of the cleaning solution and improving the cleaning effect. Meanwhile, in the first embodiment, the length L of the bottom edge of every two adjacent fan-shaped spraying areas F is overlapped, so that the using amount of the cleaning liquid can be saved, and the cleaning effect can be improved. In addition, the first embodiment also utilizes the design of the two sets of the transmission devices 4 and the first nozzle unit 5, which can save half of the cleaning time.
Referring to fig. 16, a second embodiment of the wet process cleaning apparatus of the present invention is adapted to spray fluid onto the substrate 91 in a tray configuration, which is similar to the first embodiment, with the main differences being:
the number of the transmission device 4 and the first nozzle unit 5 of the wet process cleaning equipment is one. The transfer device 3 and the transmission device 4 can also drive the lifting base 433 to move in three axial directions, i.e., the first direction X, the second direction Y, and the third direction Z. In the second embodiment, after moving a short distance along the second direction Y, the nozzle 52 will move back and forth several times along the first direction X, which can also increase the contact time between the fluid and the substrate 91, thereby saving the amount of the cleaning fluid and improving the cleaning effect.
Referring to fig. 17 and 18, a third embodiment of the wet process cleaning apparatus of the present invention is adapted to spray fluid onto the substrate 91 in a tray configuration, which is similar to the first embodiment with the main differences:
the heads 52 of the first head unit 5 are inclined toward each other, that is, the first head unit 5 is used to clean both opposite sides of the chip 911 within the base material 91, and both sides of the chip 911 can be cleaned by the above cleaning.
It should be noted that the first head units 5 may be moved from the front and rear sides of the susceptor 21 toward the center, or both may be moved from the rear side of the susceptor 21 toward the front side at the same time to clean the rear half and the front half of the substrate 91, respectively, and similarly, the substrate 91 can be cleaned and half of the cleaning time can be saved, and the movement of the first head units 5 in the opposite direction or the same direction is not a limitation of the present invention.
Referring to fig. 19, when the edge of the substrate 91 is cleaned by the wet process cleaning method of the present invention, since the number of the chips 911 is small, the bottom side lengths L of the fan-shaped spraying areas F of every two adjacent spraying heads 52 can be overlapped with each other only by turning on the second, third, and fourth spraying heads 52 of the first spraying head unit 5, so as to also save the amount of the cleaning solution and improve the cleaning effect.
The above description is only an example of the present invention, and the scope of the present invention should not be limited thereby, and the invention is still within the scope of the present invention by simple equivalent changes and modifications made according to the claims and the contents of the specification.
Claims (14)
1. A wet process cleaning apparatus, comprising: comprises the following steps:
a bearing surface;
the transfer device comprises a pair of first guide rails extending along a first direction, a first driving unit arranged on one of the first guide rails, and a cantilever spanning the first guide rails along a second direction, wherein the second direction is substantially perpendicular to the first direction, the first guide rails are spaced in the second direction and surround the bearing surface on the inner side, the cantilever can be driven by the first driving unit to move along the first direction relative to the bearing surface, and the cantilever comprises a second rail extending along the second direction;
at least one transmission device, set up in the cantilever, transmission device includes:
a sliding seat movably arranged on the second track,
a second driving unit for driving the sliding seat to move along the second direction, an
The lifting seat group is arranged on the sliding seat and moves along with the sliding seat, the lifting seat group is provided with a body which is arranged on the sliding seat and is provided with a third track, a lifting seat which is movably arranged on the third track and a third driving unit which is used for driving the lifting seat to move along a third direction, and the third direction, the first direction and the second direction are substantially perpendicular to each other;
the number of the first spray head units corresponds to that of the transmission devices, the first spray head units are detachably arranged on the lifting seat and comprise a plurality of spray heads arranged at intervals along the first direction, and the spray heads are driven by the lifting seat to move along the third direction; and
and the control unit is used for controlling the first driving unit, the second driving unit and the third driving unit, selectively opening and closing the spray head, driving the second driving unit and enabling the sliding seat to move for a stroke displacement in the second direction, and then driving the first driving unit and enabling the cantilever to move back and forth for a preset number of times along the first direction according to a short distance displacement.
2. The wet process cleaning apparatus of claim 1, wherein: the shower nozzle equidistance sets up, the short distance displacement volume is not more than adjacent two the quadruple of shower nozzle interval, and is not less than adjacent two 0.25 times of shower nozzle interval.
3. The wet process cleaning apparatus of claim 1, wherein: the wet process cleaning equipment comprises two transmission devices which are arranged at intervals in the second direction, and two first spray head units which are respectively arranged on the transmission devices, wherein the transmission devices are respectively used for driving the first spray head units, and each transmission device can independently move.
4. The wet process cleaning apparatus of claim 3, wherein: the heads of the first head unit are inclined toward each other or inclined toward the same side.
5. The wet process cleaning apparatus of claim 1, wherein: the wet process cleaning equipment further comprises at least one second spray head unit, the second spray head unit can be installed on the lifting seat after the first spray head unit is detached from the lifting seat, one of the second spray head unit and the first spray head unit is used for spraying liquid, and the other of the second spray head unit and the first spray head unit is used for blowing out gas.
6. The wet process cleaning apparatus of claim 1, wherein: each spray head is used for allowing fluid to pass through and form a fan-shaped spraying area, each fan-shaped spraying area is provided with a bottom edge, the lifting seat drives the spray heads to approach the bearing surface along the third direction, the bottom edge of each two adjacent fan-shaped spraying areas is partially overlapped, and the overlapping proportion is more than 0% but not more than 50%.
7. The wet process cleaning apparatus of claim 1, wherein: the lifting seat is provided with an exchange disc, the first spray head unit further comprises a mounting seat for the spray head, and the mounting seat is provided with a combining part detachably connected with the exchange disc.
8. The wet process cleaning apparatus of claim 1, wherein: the spraying angle of each spray head ranges from 30 degrees to 50 degrees.
9. A wet process cleaning method adapted to spray a fluid onto a substrate and clean the substrate, comprising: the wet process cleaning method comprises the following steps:
step A, providing wet process cleaning equipment, wherein the wet process cleaning equipment is provided with a plurality of spray heads which are arranged at intervals and used for spraying fluid, and a control unit used for opening and closing the spray heads;
b, determining the number of the opened nozzles according to at least one physical parameter of the base material;
step C, after the spray head moves a stroke displacement along the second direction, the spray head moves back and forth for a preset number of times along the first direction by a short-distance displacement, and the stroke displacement, the short-distance displacement and the preset number of times are determined according to at least one physical parameter of the base material; and
and D, repeating the step C.
10. The wet process cleaning method of claim 9, further comprising: the showerhead in step a is used to spray liquid, and the wet process cleaning method further comprises step E after step D, replacing the showerhead with another set of showerheads for blowing gas, and repeating step C until the substrate is blow dried.
11. The wet process cleaning method of claim 9, further comprising: the shower nozzle sets up equidistantly, the short distance displacement volume is not more than adjacent two the quadruple of shower nozzle interval and be not less than adjacent two 0.25 times of shower nozzle interval.
12. The wet process cleaning method of claim 9, further comprising: the wet process cleaning equipment further comprises two transmission devices capable of moving independently and two first spray head units arranged on the transmission devices respectively, wherein the first spray head units are used for arranging the spray heads respectively.
13. The wet process cleaning method of claim 12, further comprising: and C, simultaneously moving the first spray head units when the first spray head units carry out the step C.
14. The wet process cleaning method of claim 9, further comprising: the spraying angle of each spray head ranges from 30 degrees to 50 degrees.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110375539.5A CN113113334A (en) | 2021-04-08 | 2021-04-08 | Wet process cleaning equipment and wet process cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110375539.5A CN113113334A (en) | 2021-04-08 | 2021-04-08 | Wet process cleaning equipment and wet process cleaning method |
Publications (1)
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Cited By (1)
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| CN114812111A (en) * | 2022-04-22 | 2022-07-29 | 京东方科技集团股份有限公司 | Substrate drying device, cleaning system and drying method |
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Application publication date: 20210713 |