Disclosure of Invention
The embodiment of the disclosure provides a substrate drying device, which can solve the problems in the prior art.
According to one aspect of the present disclosure, there is provided a substrate drying apparatus including:
The base is provided with a mounting position of the substrate;
The drying component is suspended above the mounting position, and one side of the drying component facing the mounting position is provided with a plurality of spray heads for spraying high-temperature gas to dry water residues on the substrate;
The sliding assembly comprises a guide rail fixed on the base and a sliding block in sliding connection with the guide rail, wherein the sliding block is fixedly connected with the drying part and is used for driving the drying part to move along the guide rail;
And the driving mechanism is connected with the sliding block and used for driving the sliding block to move.
In some embodiments, the driving mechanism comprises a servo motor and a ball screw connected with the servo motor, wherein the ball screw is arranged on one side of the guide rail and is relatively parallel to the guide rail, and the ball screw is connected with the sliding block.
In some embodiments, the guide rail is provided with a plurality of positioning gratings, and the positioning gratings are uniformly distributed along the guide rail.
In some embodiments, the substrate drying apparatus further comprises a gas line connected to the drying part to supply the high temperature gas to the drying part.
In some embodiments, a heater is provided on the gas line.
In some embodiments, a control valve is mounted on the gas line, the control valve comprising at least one of a switching valve, a pressure regulating valve, or a throttling valve.
In some embodiments, a flow meter and/or pressure gauge is mounted on the gas line.
According to one aspect of the present disclosure, there is also provided a substrate cleaning system including:
the cleaning equipment comprises the substrate drying device;
And the water residue detection device is arranged at the downstream of the cleaning equipment and connected with the driving mechanism of the substrate drying device, so that when the existence of water residues on the substrate is detected, the substrate is conveyed to the substrate drying device, and the drying component is moved to the water residue position to dry the water residues through the operation of the driving mechanism.
In some embodiments, the substrate cleaning system further comprises a detection mechanism for detecting whether the substrate is placed in the cleaning apparatus, so as to supply gas into the gas pipeline of the substrate drying device and preheat the gas when the substrate is placed in the cleaning apparatus.
According to one aspect of the present disclosure, there is also provided a substrate drying method applied to the above substrate cleaning system, the method including:
Detecting whether water residues exist on the substrate by the water residue detection device;
If so, acquiring the position coordinates of each water residue;
conveying the substrate to an installation position of the substrate drying device;
moving a drying part of the substrate drying device to the position coordinates of the water residue through the operation of a driving mechanism of the substrate drying device;
and drying the water residue by high-temperature gas sprayed by the spray header of the drying component.
In some embodiments, the method further comprises:
Acquiring the position coordinates of each water residue;
Obtaining a maximum position coordinate and a minimum position coordinate in the position coordinates;
Calculating the average value of the maximum position coordinate and the minimum position coordinate to determine the average position coordinate of each water residue;
and determining the average position coordinate as the drying position of the water residue.
According to the substrate drying device, the cleaning system and the drying method, the drying component is driven to translate along the guide rail through the sliding component formed by the guide rail and the sliding block, the water residue position can be rapidly and accurately positioned, the water residue on the substrate is timely dried through the corresponding spray header, the performance of cleaning equipment comprising the substrate drying device is improved, the yield of substrate products is ensured, and the utilization rate and the product through rate of detection equipment positioned at the downstream of the substrate drying device are improved; meanwhile, the spray type drying part consisting of a plurality of spray heads is adopted, so that the treatment time of water residues can be increased, and the drying effect of the substrate is enhanced.
Detailed Description
Various aspects and features of the disclosure are described herein with reference to the drawings.
It should be understood that various modifications may be made to the embodiments of the application herein. Therefore, the above description should not be taken as limiting, but merely as exemplification of the embodiments. Other modifications within the scope and spirit of this disclosure will occur to persons of ordinary skill in the art.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and, together with a general description of the disclosure given above and the detailed description of the embodiments given below, serve to explain the principles of the disclosure.
These and other characteristics of the present disclosure will become apparent from the following description of a preferred form of embodiment, given as a non-limiting example, with reference to the accompanying drawings.
It should also be understood that, although the present disclosure has been described with reference to some specific examples, those skilled in the art can certainly realize many other equivalent forms of the present disclosure.
The above and other aspects, features and advantages of the present disclosure will become more apparent in light of the following detailed description when taken in conjunction with the accompanying drawings.
Specific embodiments of the present disclosure will be described hereinafter with reference to the accompanying drawings; however, it is to be understood that the disclosed embodiments are merely examples of the disclosure, which may be embodied in various forms. Well-known and/or repeated functions and constructions are not described in detail to avoid obscuring the disclosure in unnecessary or unnecessary detail. Therefore, specific structural and functional details disclosed herein are not intended to be limiting, but merely serve as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present disclosure in virtually any appropriately detailed structure.
Fig. 1 and 2 show a schematic structural view of a substrate drying apparatus according to an embodiment of the present disclosure. As shown in fig. 1 and 2, an embodiment of the present disclosure provides a substrate drying apparatus 10, including:
a base 1, wherein a mounting position 11 of a substrate 100 is arranged on the base 1;
A drying part 2 suspended above the mounting position 11, wherein a plurality of spray heads 21 are arranged on one side of the drying part 2 facing the mounting position 11, and are used for spraying high-temperature gas and drying water residues (residual water drops 200) on the substrate 100;
The sliding assembly comprises a guide rail 31 fixed on the base 1 and a sliding block 32 in sliding connection with the guide rail 31, wherein the sliding block 32 is fixedly connected with the drying part 2 and is used for driving the drying part 2 to move along the guide rail 31;
And the driving mechanism is connected with the sliding block 32 and is used for driving the sliding block 32 to move.
According to the substrate drying device 10 provided by the embodiment of the disclosure, the sliding component formed by the guide rail 31 and the sliding block 32 drives the drying component 2 to translate along the guide rail 31, so that the water residue position can be quickly and accurately positioned, the water residue on the substrate 100 can be timely dried through the corresponding spray header 21, the performance of cleaning equipment comprising the substrate drying device 10 is improved, the performance of a substrate 100 product is ensured, and the utilization rate and the product through rate of detection equipment (such as a water residue detection device) positioned at the downstream of the substrate drying device 10 are improved; meanwhile, the spray type drying part 2 consisting of a plurality of spray heads 21 can increase the treatment time of water residues, enhance the drying effect of the substrate and further improve the performance of the cleaning equipment.
Wherein, the utilization rate refers to the ratio of the actual production quantity of a piece of machine equipment to the possible production quantity; product through rate = (number of incoming processes- (rework + return) number of outgoing) 100% process number, through rate is used to describe certain conditions of production quality, working quality or test quality. The specific meaning is that 100 sets of materials are put into a production line, and all the tested good product numbers pass the process for the first time. The substrate 100 is preferably an oled glass substrate.
Specifically, as shown in fig. 1 and 2, the drying member 2 is a bar-shaped member, and is disposed between two oppositely disposed guide rails 31, and the conveying direction of the substrate 100 is perpendicular to the translation direction of the drying member 2. The treatment time t=l/V of the water residue, where L is the effective length of the shower head 21, V is the substrate conveying speed, and the treatment time of the water residue can be increased by the strip-shaped drying part 2 and the shower heads 21 provided on the drying part 2, thereby improving the drying effect. The substrate 100 is transported to the mounting site 11 or taken out of the mounting site 11 by a dedicated transporting apparatus. In a specific implementation, when the substrate 100 is completely placed in the mounting position 11, the corresponding shower heads 21 may be turned on to dry, or during the conveying process of the substrate 100, the corresponding shower heads 21 may be turned on in sequence to dry.
In some embodiments, the driving mechanism includes a servo motor 41 and a ball screw 42 connected to the servo motor 41, the ball screw 42 being provided on one side of the guide rail 31 and being disposed opposite to and parallel to the guide rail 31, the ball screw 42 being connected to the slider 32.
The ball screw 42 comprises a screw and a nut sleeved on the screw, the nut is fixedly connected with the slider 32, the servo motor 41 is connected with the screw, and the servo motor 41 works to drive the nut to move along the screw, so that the slider 32 is driven to move along the guide rail 31, and the drying part 2 is driven to move to a water residue position along the guide rail 31.
In this embodiment, the drying component 2 is suspended above the mounting position 11, and the sliding component composed of the guide rail 31 and the sliding block 32 drives the drying component 2 to move, so that foreign matters in the mounting position 11 caused by friction can be reduced, and damage to the substrate 100 is avoided; meanwhile, compared with the substrate bearing roller, the sliding component is better in stability and reliability.
In some embodiments, the guide rail 31 is provided with a plurality of positioning gratings 5, and the positioning gratings 5 are uniformly distributed along the guide rail 31 to accurately determine the position of the water residue.
In some embodiments, the substrate drying apparatus 10 further includes a gas line 6 connected to the drying part 2 to provide high temperature gas to the drying part 2. The high temperature gas is preferably high temperature compressed air.
Further, the gas pipeline 6 is provided with a heater for heating the high-temperature gas in the gas pipeline 6 so as to improve the drying efficiency and the drying effect.
In some embodiments, a control valve is mounted on the gas line 6, the control valve comprising at least one of a switching valve, a pressure regulating valve, or a throttle valve. The control valve is preferably an electromagnetic valve, and the control is accurate and convenient.
The opening and closing of the gas pipeline 6 can be automatically controlled through the switch valve; the pressure in the gas pipeline 6 can be controlled by a pressure regulating valve; the flow rate of the gas in the gas pipeline 6 can be controlled through the throttle valve, so that the accurate control of the high-temperature gas is realized.
Preferably, a flowmeter and/or a pressure gauge is also mounted on the gas line 6 to monitor the gas flow and the gas pressure in real time.
Fig. 3 and 4 show schematic structural diagrams of a substrate cleaning system according to an embodiment of the present disclosure (an arrow direction in fig. 4 is a process flow direction of a substrate), and as shown in fig. 3 and 4, the embodiment of the present disclosure further provides a substrate cleaning system, including:
A cleaning apparatus 20, the cleaning apparatus 20 including the above-described substrate drying device 10;
The water residue detection device 30 is provided downstream of the cleaning apparatus 20 and connected to a driving mechanism of the substrate drying device 10 so as to convey the substrate 100 to the substrate drying device 10 and move the drying member 2 to a water residue position by operation of the driving mechanism to dry the water residue when detecting the presence of the water residue on the substrate 100.
The cleaning apparatus 20 may be wet cleaning apparatus such as a developing machine, an etching machine, a film peeling machine, a cleaning machine, etc.
The substrate cleaning system further includes a control unit 40, in this embodiment, the control unit 40 is preferably a Computer Integrated Manufacturing (CIM) control unit, and can be used as an engineering product management system of the whole substrate cleaning system to control the operations of the cleaning apparatus 20 and the water residue detection device 30.
The water residue detection device 30 can detect the position coordinates of the water residue and send the position coordinates to the control unit 40, the control unit 40 receives the position coordinates of the water residue and sends the position coordinates to the cleaning equipment 20, and the PLC of the cleaning equipment 20 can control the action of the driving mechanism of the substrate drying device 10 according to the position coordinates of the water residue, so that the drying component 2 translates to the corresponding position, and accurate positioning of the water residue is realized.
The position coordinates of the water residue may be expressed as (X, Y), where X is the same coordinates as the transport direction of the substrate 100 and Y is the same coordinates as the moving direction of the drying part 2. That is, a rectangular coordinate system is established with the transport direction of the substrate 100 as the X direction and the moving direction of the drying member 2 as the Y direction, and the position coordinates of the water residue are determined.
Table 1 shows information about the position of the water residue detected by the water residue detecting device 30, and as shown in table 1, the water residue detecting device 30 can write the position coordinates of the water residue into a common address bit, and the cleaning apparatus 20 (for example, a developing machine) can collect the position coordinates of the water residue according to the common address bit and control the driving mechanism to perform corresponding operations. The common address bit comprises a water residue detection device address, a CIM address and a developing machine address, so that a user can accurately extract corresponding water residue position coordinates.
Table 1 information table relating to the position of water residue detected by water residue detecting means
In some embodiments, the substrate cleaning system further comprises a detection mechanism for detecting whether the substrate 100 is placed in the cleaning apparatus 20, so as to supply the gas into the gas line 6 of the substrate drying apparatus 10 and preheat the gas when the substrate 100 is placed in the cleaning apparatus 20.
Specifically, when the detection mechanism detects that the substrate 100 is placed in the cleaning apparatus 20, it may be determined that the cleaning apparatus 20 is to be cleaned, at this time, the control valve on the gas pipeline 6 may be controlled to be opened, gas may be filled into the gas pipeline 6 and preheated by the heater, high-temperature gas may be provided, after the substrate 100 is cleaned by the cleaning apparatus 20, the high-temperature gas is conveyed to the mounting position 11 of the substrate drying device 10, and the preheated high-temperature gas is used to dry the water residue on the substrate 10, so that the working time of the whole substrate cleaning system may be shortened, and energy saving and consumption reduction may be realized.
The embodiment of the disclosure also provides a substrate drying method applied to the substrate cleaning system, the method comprising:
S101: detecting whether or not water residue is present on the substrate 100 by the water residue detecting means 30;
s102: if so, acquiring the position coordinates of each water residue;
S103: transporting the substrate 100 to the mounting position 11 of the substrate drying apparatus 10;
S104: moving the drying part 2 of the substrate drying apparatus 10 to the position coordinates of the water residue by the operation of the driving mechanism of the substrate drying apparatus 10;
S105: the water residue is dried by the high-temperature gas discharged from the shower head 21 of the drying unit 2.
Specifically, when the water residue detection device 30 detects that water residues exist on the substrate 100, the position coordinates (X, Y) of the water residues are sent to the CIM control unit, the CIM control unit sends the position coordinates (X, Y) to the cleaning device 20, the driving mechanism of the substrate drying device 10 of the cleaning device 20 acts to drive the sliding block 32 to move along the guide rail 31, so that the drying part 2 is driven to move to the position coordinates for positioning, and then the drying part 2 ejects high-temperature gas under the action of the control valve to dry the water residues.
In some embodiments, as shown in fig. 3, the method further comprises:
s201: acquiring the position coordinates of each water residue;
S202: obtaining a maximum position coordinate and a minimum position coordinate in the position coordinates;
S203: calculating the average value of the maximum position coordinate and the minimum position coordinate to determine the average position coordinate of each water residue;
S204: and determining the average position coordinate as the drying position of the water residue.
When the number of water residues is multiple, the CIM control unit sends the position coordinates of each water residue to the cleaning device 20, the PLC of the cleaning device 20 compares the position coordinates to obtain the maximum position coordinate and the minimum position coordinate thereof, then obtains the average value of the absolute value of the maximum position coordinate and the absolute value of the minimum position coordinate, determines the average value as the drying position (drying range) of the water residue, and the drying component 2 moves to the position under the action of the driving mechanism, and can dry the water residue by starting the corresponding spray header 21 without drying according to the position coordinate of each water residue, thereby effectively improving the drying efficiency and the drying effect.
In particular, in the present embodiment, since the drying part 2 moves in the Y direction, when determining the position coordinates of the water residues, only the Y coordinates of the respective water residues may be acquired and compared, and Y max and Y min are selected for calculation, resulting in the drying position s= (|y max|+|Ymin |)/2 of the water residues.
In the above embodiment, the CIM control unit automatically determines the drying position of the water residue, and in a specific implementation, the user may manually determine the drying position of the water residue.
In particular, the cleaning apparatus 20 may simultaneously clean a plurality of substrates 100, and thus, the cleaning apparatus 20 may compare the position coordinates of the water residues of the plurality of substrates 100, thereby determining the water residue drying positions of the plurality of substrates 100.
The above embodiments are merely exemplary embodiments of the present disclosure, which are not intended to limit the present disclosure, the scope of which is defined by the claims. Various modifications and equivalent arrangements of parts may be made by those skilled in the art, which modifications and equivalents are intended to be within the spirit and scope of the present disclosure.