TWM576079U - Semiconductor cleaning device - Google Patents

Abstract

The present invention provides a semiconductor cleaning device that can improve cleaning efficiency and efficiency, reduce cleaning consumables, and shorten cleaning time. The technical means is: a semiconductor cleaning device comprising a carrying platform and a cleaning assembly, the carrying platform can be used for carrying a semiconductor wafer, and the cleaning component can be used for high-pressure washing and blowing drying of the semiconductor wafer, characterized in that: the carrying platform The utility model comprises a carrying platform and a main driving device; and the cleaning component comprises a driving device, a high-pressure nozzle group and an image capturing device.

Description

Semiconductor cleaning device

The present invention relates to a structure of a cleaning device in a semiconductor process, and more particularly to a semiconductor cleaning device.

At present, due to the prevalence of consumer electronics products, there is a large demand for portable [Portability] and multi-function [Multi-function], so that microelectronics construction is gradually moving toward smaller size, high performance, and lowering costs. .

Wafer Level Package (WLP) has the advantage of reducing the size of the package. With the Panel Level Package (PLP), the cost can be greatly reduced. It just caters to the market trend of mobile electronic products. .

In the various processes of the wafer level assembly, there is generally a process of cleaning the gap [gap]. At present, the conventional cleaning machine generally uses a line cleaning machine and a rotary cleaning machine.

The line-type cleaning machine consumes a large amount of liquid, the nozzle height and angle are limited, the machine is bulky, and the cleaning time is long. The cleaning gap distance needs to be greater than 120 μm. The continuous streamline movement will cause most of the liquid medicine or the syrup to be sprayed ineffective. District, and the whole machine must be shut down during maintenance, which has a great impact on production efficiency.

The rotary cleaning machine removes the chemical liquid or the medicinal water away from the laundry by centrifugal force, but the centrifugal force has no effect at the center of the circle, and the cleaning effect from the center of the circle to the periphery is different; the centrifugal force can play a large role under high-speed rotation, at a high speed. Under the rotation, a large amount of liquid medicine or syrup should be replenished, and most of the liquid medicine or the syrup will be sprayed in the ineffective area at high speed, resulting in the liquid medicine or the medicine water still being sprayed. If you do not enter the gap of the area to be washed, it will be thrown out, increasing the consumption of the consumables and the cleaning time. Moreover, the rotary cleaning machine is equipped with one or more sets of moving swing arms, and the swing arm moves in an arc shape with limited travel. Cannot move to each position of the laundry.

The most important problem is that the gap of the current cleaning is mostly less than 120um, the capillary force is large, the liquid medicine or the medicine in the gap is difficult to discharge, which makes the cleaning difficult, and the cleaning effect of the two cannot effectively meet the application requirements of the current industry. Helps improve the yield.

In view of the above, how to provide a semiconductor cleaning device structure that can solve the aforementioned problems, shorten the cleaning time, reduce the consumption of cleaning consumables, and ensure the cleaning effect and efficiency has become a problem to be improved by the present invention.

The purpose of the present invention is to provide a semiconductor cleaning device capable of improving cleaning efficiency and efficiency, reducing cleaning consumables, and shortening cleaning time.

In order to solve the above problems and achieve the object of the present invention, the first technical means of the novel device is realized by a semiconductor cleaning device comprising a carrying platform (100) and a mounting platform (100). a top cleaning assembly (200) for carrying a semiconductor wafer (10) for high pressure rinsing and blow drying of the semiconductor wafer (10) The utility model is characterized in that: the carrying platform (100) comprises a carrying platform (1) and a main driving device (2); the carrying platform (1) can be used for carrying and positioning the semiconductor wafer (10); The main driving device (2) comprises a main longitudinal driving device (21) at the bottom end, and a main lateral driving device (22) disposed between the main longitudinal driving device (21) and the carrying platform (1) The main longitudinal driving device (21) is capable of driving the main longitudinal driving device (21) such that the loading platform (1) thereon is longitudinally moved on a horizontal plane (A); the main lateral driving device (22), can drive the carrying platform (1) to move laterally on the horizontal plane (A)

More preferably, the carrying platform (100) further includes a drive once The device (3) includes a rotating motor (31) disposed between the carrying platform (1) and the main driving device (2), and a bracket (32) capable of driving the bearing The table (1) rotates, the bracket (32) is located outside the rotating motor (31); the bracket (32) further includes a tripod type disposed on the carrying platform (1) and the main driving device ( 2) Three movable telescopic units (321), which can cooperate to drive the stage (1) to deflect at least one direction based on the horizontal plane (A).

More preferably, the cleaning assembly (200) includes a driving device (4), a high pressure head group (5), and an image capturing device (6); the driving device (4) is capable of Carrying the high-pressure nozzle group (5); the high-pressure nozzle group (5) is disposed on the driving device (4), can be driven by the driving device (4) to perform at least one direction of stereoscopic movement, and can Performing an action of one of high pressure rinsing and blowing drying on the semiconductor wafer (10), and including at least one adjustable angle nozzle (51); and the image capturing device (6) disposed on the carrying platform ( 100) above, the semiconductor wafer (10) carried on the carrying platform (100) can be imaged to calculate a flow path and then set a flushing operation path, so that the high pressure nozzle group (5) can be operated according to the flushing operation path. rinse.

More preferably, the driving device (4) further includes a longitudinal driving device (41), a lateral driving device (42) disposed at a bottom end of the longitudinal driving device (41), and a lateral driving device A vertical drive (43) on the device (42), the vertical drive (43) can be used to carry the high pressure spray head set (5).

The second technical means of the novel device is implemented as a semiconductor cleaning device comprising a carrying platform (100) and a cleaning assembly (200) disposed at the top end of the carrying platform (100), the bearing The platform (100) can be used for carrying a semiconductor wafer (10), and the cleaning assembly (200) can be used for high-pressure rinsing and air-drying of the semiconductor wafer (10), characterized in that the cleaning component (200), The utility model comprises a driving device (4), a high-pressure nozzle group (5), and an image capturing device (6); the driving device (4) can be used for carrying the high-pressure nozzle group (5); high pressure a nozzle group (5) disposed on the driving device (4), capable of being driven by the driving device (4) to perform at least one direction of stereoscopic movement, and capable of performing high pressure washing and blowing drying on the semiconductor wafer (10) One of the actions, and includes at least one adjustable angle nozzle (51); the image capturing device (6) is disposed above the carrying platform (100) and can be mounted on the carrying platform (100) The semiconductor wafer (10) carried is imaged to calculate a flow path and then set a flushing operation path, so that the high pressure nozzle group (5) can be flushed according to the aforementioned flushing operation path.

More preferably, the driving device (4) further includes a longitudinal driving device (41), a lateral driving device (42) disposed at a bottom end of the longitudinal driving device (41), and a lateral driving device A vertical drive (43) on the device (42), the vertical drive (43) can be used to carry the high pressure spray head set (5).

More preferably, the carrying platform (100) includes a carrying platform (1) and a main driving device (2); the carrying platform (1) is capable of carrying and positioning the semiconductor wafer (10) The main driving device (2) includes a main longitudinal driving device (21) at the bottom end, and a main lateral driving device disposed between the main longitudinal driving device (21) and the carrying platform (1) (22); the main longitudinal driving device (21) capable of driving the main longitudinal driving device (21) such that the loading platform (1) thereon is longitudinally moved on a horizontal plane (A); The driving device (22) can drive the carrying platform (1) to move laterally on the horizontal plane (A).

More preferably, the carrying platform (100) further includes a primary driving device (3) including a rotating motor disposed between the loading platform (1) and the main driving device (2) 31), and a bracket (32), the rotating motor (31) can drive the loading platform (1) to rotate, the bracket (32) is located outside the rotating motor (31); the bracket (32), which is further The utility model comprises three movable telescopic units (321) arranged on the tripod type between the carrying platform (1) and the main driving device (2), and the movable telescopic unit (321) can cooperate to drive the loading platform (1) The horizontal plane (A) is the reference, and the surface deflection of at least one direction is performed.

A third technical means for the novel device is realized as a semiconductor cleaning device comprising a carrying platform (100) and a cleaning assembly (200) disposed at the top end of the carrying platform (100), the bearing The platform (100) can be used for carrying a semiconductor wafer (10), and the cleaning assembly (200) can be used for high-pressure rinsing and air-drying of the semiconductor wafer (10), characterized in that: the carrying platform (100), The utility model comprises a carrying platform (1) and a main driving device (2); the carrying platform (1) is capable of carrying and positioning the semiconductor wafer (10); the main driving device (2) comprises There is a main longitudinal driving device (21) at the bottom end, and a main lateral driving device (22) disposed between the main longitudinal driving device (21) and the carrying platform (1); the main longitudinal driving device (21) The main longitudinal driving device (21) can be driven to longitudinally move the loading platform (1) on the horizontal plane (A); the main lateral driving device (22) can drive the loading platform (1) Moving laterally on the horizontal plane (A); the cleaning assembly (200) comprising a drive (4) a high pressure nozzle group (5), and an image capturing device (6); the driving device (4) capable of carrying the high pressure nozzle group (5) for carrying; the high pressure nozzle group (5) And being disposed on the driving device (4), capable of being driven by the driving device (4) to perform at least one direction of stereoscopic movement, and capable of performing high pressure washing and blowing drying on the semiconductor wafer (10). Acting, and including at least one adjustable angle nozzle (51); the image capturing device (6) disposed above the carrying platform (100), capable of carrying the semiconductor on the carrying platform (100) The wafer (10) is imaged to calculate a flow path and then set a flushing operation path so that the high pressure head group (5) can be flushed according to the aforementioned flushing operation path.

More preferably, the carrying platform (100) further includes a primary driving device (3) including a rotating motor disposed between the loading platform (1) and the main driving device (2) 31), and a bracket (32), the rotating motor (31) can drive the loading platform (1) to rotate, the bracket (32) is located outside the rotating motor (31); the bracket (32), which is further The utility model comprises three movable telescopic units (321) arranged on the tripod type between the carrying platform (1) and the main driving device (2), and the movable telescopic unit (321) can cooperate to drive the loading platform (1) The horizontal plane (A) is the reference, and the surface deviation of at least one direction is made. turn.

More preferably, the driving device (4) further includes a longitudinal driving device (41), a lateral driving device (42) disposed at a bottom end of the longitudinal driving device (41), and a lateral driving device A vertical drive (43) on the device (42), the vertical drive (43) can be used to carry the high pressure spray head set (5).

Compared with the prior art, the effects of the present invention are as follows: In summary, according to the novel semiconductor cleaning device, in order to utilize the cooperation of the carrying platform (100) and the cleaning assembly (200), it is different from the conventional semiconductor cleaning device. It can ensure the cleaning effect and efficiency, reduce the consumption of cleaning consumables, and shorten the cleaning time. It is different from the traditional semiconductor cleaning device, mobile high-pressure flushing, can cooperate with various semiconductor processes, so that the semiconductor wafer (10) can be reliably cleaned. But it will not waste consumables and shorten working hours.

1‧‧‧bearing station

2‧‧‧Main drive unit

21‧‧‧Main longitudinal drive

22‧‧‧Main transverse drive

3‧‧‧Secondary drive

31‧‧‧Rotary motor

32‧‧‧ bracket

321‧‧‧ movable telescopic unit

4‧‧‧ drive

41‧‧‧Longitudinal drive

42‧‧‧Transverse drive

43‧‧‧Vertical drive

5‧‧‧High pressure nozzle group

51‧‧‧ sprinkler

6‧‧‧Image capture device

10‧‧‧Semiconductor wafer

100‧‧‧Loading platform

200‧‧‧ cleaning components

A‧‧‧ water level

Figure 1: A perspective view of the novel.

Figure 2: An exploded view of the novel.

Figure 3: is an exploded view of the cleaning assembly in Figure 2.

Fig. 4 is an exploded perspective view of the carrier and the secondary driving device in Fig. 2.

Fig. 5 is an exploded perspective view of the main driving device in Fig. 2.

Fig. 6 is a perspective view showing the three-dimensional implementation of the main driving device in the present invention.

Fig. 7 is a perspective view showing the three-dimensional implementation of the main driving device in the other direction.

Fig. 8 is a perspective view showing the three-dimensional implementation of the driving device of the present invention.

Fig. 9 is a perspective view showing the three-dimensional implementation of the cleaning assembly in the longitudinal direction of the present invention.

Fig. 10 is a perspective view showing the three-dimensional implementation of the cleaning assembly in the lateral movement of the present invention.

Figure 11: Schematic diagram of the three-dimensional implementation of the cleaning assembly in the vertical movement and adjustment of the nozzle.

The following is a detailed description of the embodiment shown in the drawings. Referring to FIG. 1 to FIG. 11 , with respect to the cleaning device, the first technical solution of the present invention is a semiconductor cleaning device including a carrying platform (100). And a cleaning assembly (200) disposed on a top end of the carrying platform (100), the carrying platform (100) being capable of carrying a semiconductor wafer (10), the cleaning assembly (200) being capable of being used for the semiconductor wafer (10) Carrying out high pressure washing and blowing drying, characterized in that: the carrying platform (100) comprises a carrying platform (1), and a main driving device (2); the carrying platform (1), which can For carrying and positioning the semiconductor wafer (10); the main driving device (2) comprises a main longitudinal driving device (21) at the bottom end, and a main longitudinal driving device (21) and the carrying table (1) a main lateral drive unit (22); the main longitudinal drive unit (21) capable of driving the main longitudinal drive unit (21) such that the stage (1) on the horizontal plane (A) Performing a longitudinal movement; the main lateral drive device (22) can drive the carrier (1) at Make lateral movement on a plane (A).

Through the application of the carrying platform (100), the carrying platform (1) is used to carry the positioning semiconductor wafer (10), and the main driving device (2) is used to drive the carrying platform (1) through the main longitudinal driving device (21). ) and the application of the main lateral driving device (22), can drive the carrying platform (1) and the secondary driving device (3) for longitudinal and lateral movement, so that the cleaning action can be diversified to meet different cleaning needs and avoid the application range. Restricted, the semiconductor wafer (10) on the carrying table (1) can be smoothly washed by high pressure and blown by the cleaning assembly (200), and the semiconductor wafer (10) can be smoothly blown dry.

Secondly, the novel semiconductor cleaning device is different from the conventional semiconductor cleaning device in that it has no problem in application, can reduce the cleaning consumable consumption while ensuring the cleaning effect and efficiency, and shortens the cleaning time, and does not require a whole shutdown during maintenance, and the production efficiency The impact is very small.

Please refer to Figures 1 to 11, for the second aspect of the cleaning device. The technical solution is a semiconductor cleaning device comprising a carrying platform (100) and a cleaning assembly (200) disposed at a top end of the carrying platform (100), the carrying platform (100) capable of carrying a semiconductor wafer (10) The cleaning assembly (200) can be used for high pressure rinsing and air drying of the semiconductor wafer (10), characterized in that the cleaning assembly (200) comprises a driving device (4) and a high pressure nozzle. a group (5), and an image capturing device (6); the driving device (4) capable of carrying the high pressure head group (5) for carrying; the high pressure head group (5) disposed on the driving The device (4) can be driven by the driving device (4) to perform at least one direction of stereoscopic movement, and can perform high-pressure flushing and air-drying of the semiconductor wafer (10), and includes at least one An angle-adjustable nozzle (51); the image capturing device (6) is disposed above the carrying platform (100), and can capture the semiconductor wafer (10) carried on the carrying platform (100), After the flow path is calculated, the flushing operation path is set, so that the high pressure nozzle group (5) can enter according to the aforementioned flushing operation path. Rinse.

Wherein, through the application of the cleaning assembly (200), the driving device (4) is used to drive the high-pressure nozzle group (5) to move to completely clean the semiconductor wafer (10), and the high-voltage nozzle group (5) is used to 10) performing high pressure rinsing and air jet drying, taking image of the semiconductor wafer (10) carried on the carrying platform (100) by using the image capturing device (6), and calculating a flow path to set a flushing operation path according to the rinsing operation path. Rinse to ensure that every cleaning is working properly, compared to traditional semiconductor cleaning devices, can meet the needs of today's applications, cleaning efficiency is higher.

Referring to FIGS. 1 to 11 , a third aspect of the present invention relates to a semiconductor cleaning device including a carrier platform (100) and a top portion of the carrier platform (100). A cleaning assembly (200) for carrying a semiconductor wafer (10) for performing high pressure rinsing and blow drying of the semiconductor wafer (10), characterized in that: The carrying platform (100) includes a carrying platform (1) and a main driving device (2); the carrying platform (1) can be used for carrying and positioning the semiconductor wafer (10); a driving device (2) comprising a main longitudinal driving device (21) at the bottom end, and a device a main lateral driving device (22) between the main longitudinal driving device (21) and the carrying platform (1); the main longitudinal driving device (21) capable of driving the main longitudinal driving device (21) The loading platform (1) is longitudinally moved on a horizontal plane (A); the main lateral driving device (22) can drive the loading platform (1) to move laterally on the horizontal plane (A); the cleaning assembly (200), comprising a driving device (4), a high pressure nozzle group (5), and an image capturing device (6); the driving device (4) capable of carrying the high pressure nozzle group (5) The high-pressure nozzle group (5) is disposed on the driving device (4), can be driven by the driving device (4) to perform at least one direction of stereoscopic movement, and can perform high voltage on the semiconductor wafer (10) Flushing, blowing and drying one of the actions, and including at least one adjustable angle nozzle (51); the image capturing device (6) is disposed above the carrying platform (100), the loading platform can be The semiconductor wafer (10) carried on (100) is imaged, and the flushing operation path is set after calculating the flow channel, so that the high pressure nozzle group (5) can be based on the front Rinse rinse running path.

The first and second technical solutions of the present invention are integrated into the third technical solution of the present invention, and the carrying platform (100) in the first technical solution and the cleaning component (200) in the second technical solution are The more effective combination allows the new semiconductor cleaning device to be used in a wider range of applications, and can be used in conjunction with different cleaning methods to increase overall application.

Referring to FIG. 5 to FIG. 7 , the carrying platform (100) further includes a primary driving device (3), which is disposed between the loading platform (1) and the main driving device (2). a rotating motor (31), and a bracket (32), the rotating motor (31) can drive the loading platform (1) to rotate, the bracket (32) is located outside the rotating motor (31); 32), further comprising three movable telescopic units (321) disposed on the tripod type between the carrying platform (1) and the main driving device (2), the movable telescopic unit (321) can cooperate to drive the bearing The stage (1) is deflected in at least one direction based on the horizontal plane (A).

Among them, the application of the rotating motor (31) of the secondary driving device (3) and the bracket (32) allows the carrying table (1) to be rotated to more effectively dry, avoiding the problem of poor drying.

Secondly, the application of the movable telescopic unit (321) provided by the tripod type can not only provide stable support, but also facilitate the control of the surface deflection of the carrying platform (1), so that the operation can meet various application needs, and there is no need to worry about There are problems that cannot be applied.

Referring to FIG. 3, FIG. 9 to FIG. 11, the driving device (4) further includes a longitudinal driving device (41) and a lateral driving device (42) disposed at a bottom end of the longitudinal driving device (41). And a vertical driving device (43) disposed on the lateral driving device (42), the vertical driving device (43) being capable of carrying the high pressure nozzle group (5).

Wherein, the application of the longitudinal driving device (41) can drive the high-pressure nozzle group (5) for longitudinal movement, and the application of the lateral driving device (42) can drive the high-pressure nozzle group (5) for lateral movement, and the vertical driving device The application of (43) can drive the high-pressure nozzle group (5) to move vertically to adjust the pressure when cleaning the semiconductor wafer (10), so that the position of the high-pressure nozzle group (5) can be quickly and freely adjusted. It can realize high-pressure washing in the whole process of cleaning, and clearer and more accurate image taking.

The structure, features and effects of the present invention are described in detail above with reference to the embodiments shown in the drawings. However, the above description is only a preferred embodiment of the present invention, but the present invention does not limit the scope of implementation as shown in the drawings. Modification changes consistent with the meaning of the present invention are intended to fall within the scope of the present invention as long as they are within the scope of equal effect.

Claims (11)

A semiconductor cleaning device includes a carrying platform (100) and a cleaning assembly (200) disposed at a top end of the carrying platform (100), the carrying platform (100) being capable of carrying a semiconductor wafer (10) for cleaning The assembly (200) can be used for high pressure rinsing and air drying of the semiconductor wafer (10), characterized in that the carrying platform (100) comprises a carrying platform (1) and a main driving device (2) a loading platform (1) capable of carrying a positioning of the semiconductor wafer (10); the main driving device (2) comprising a main longitudinal driving device (21) at the bottom end, and a a main lateral driving device (22) between the main longitudinal driving device (21) and the carrying platform (1); the main longitudinal driving device (21) capable of driving the main longitudinal driving device (21) thereon The carrying platform (1) is longitudinally moved on a horizontal plane (A); the main transverse driving device (22) is capable of driving the carrying platform (1) to move laterally on the horizontal plane (A). The semiconductor cleaning device of claim 1, wherein the carrying platform (100) further includes a primary driving device (3) including a mounting platform (1) and the primary driving device (2) a rotating motor (31), and a bracket (32), the rotating motor (31) can drive the carrying platform (1) to rotate, the bracket (32) is located outside the rotating motor (31); The bracket (32) further includes three movable telescopic units (321) disposed between the loading platform (1) and the main driving device (2) in a tripod configuration, and the movable telescopic unit (321) can The carrier platform (1) is driven to perform surface deflection in at least one direction based on the horizontal plane (A). The semiconductor cleaning device of claim 2, wherein the cleaning assembly (200) includes a driving device (4), a high pressure head group (5), and an image capturing device (6); a driving device (4) capable of carrying the high pressure nozzle group (5) for carrying; The high-pressure nozzle group (5) is disposed on the driving device (4), can be driven by the driving device (4) to perform three-dimensional movement in at least one direction, and can perform high-pressure flushing on the semiconductor wafer (10). The action of blowing one of the drying, and including at least one adjustable angle nozzle (51); the image capturing device (6) is disposed above the carrying platform (100), and the loading platform (100) The semiconductor wafer (10) carried on the image is taken to calculate a flow path and then set a flushing operation path so that the high pressure head group (5) can be flushed according to the aforementioned flushing operation path. The semiconductor cleaning device of claim 3, wherein the driving device (4) further comprises a longitudinal driving device (41) and a lateral driving device (42) disposed at a bottom end of the longitudinal driving device (41). And a vertical driving device (43) disposed on the lateral driving device (42), the vertical driving device (43) being capable of carrying the high pressure nozzle group (5). A semiconductor cleaning device includes a carrying platform (100) and a cleaning assembly (200) disposed at a top end of the carrying platform (100), the carrying platform (100) being capable of carrying a semiconductor wafer (10) for cleaning The component (200) can be used for high-pressure rinsing and air-drying of the semiconductor wafer (10), characterized in that the cleaning component (200) comprises a driving device (4) and a high-pressure nozzle group (5). And an image capturing device (6); the driving device (4) capable of carrying the high pressure head group (5); the high pressure head group (5) disposed on the driving device (4) The driving device (4) can be driven to perform at least one direction of stereoscopic movement, and the semiconductor wafer (10) can be subjected to high pressure washing, air drying, and at least one adjustable angle. a nozzle (51); the image capturing device (6) is disposed above the carrying platform (100), capable of taking images of the semiconductor wafer (10) carried on the carrying platform (100) to calculate a flow path The flushing operation path is set so that the high pressure nozzle group (5) can be flushed according to the aforementioned flushing operation path. The semiconductor cleaning device of claim 5, wherein the driving device (4) further The utility model comprises a longitudinal driving device (41), a lateral driving device (42) disposed at a bottom end of the longitudinal driving device (41), and a vertical driving device (43) disposed on the lateral driving device (42), the vertical The driving device (43) can be used for carrying the high pressure nozzle group (5). The semiconductor cleaning device of claim 6, wherein the carrying platform (100) comprises a carrying platform (1) and a main driving device (2); the carrying platform (1) capable of For carrying and positioning the semiconductor wafer (10); the main driving device (2) comprises a main longitudinal driving device (21) at the bottom end, and a main longitudinal driving device (21) and the carrying table (1) a main lateral drive unit (22); the main longitudinal drive unit (21) capable of driving the main longitudinal drive unit (21) such that the stage (1) on the horizontal plane (A) The longitudinal movement is performed; the main lateral driving device (22) can drive the loading platform (1) to move laterally on the horizontal plane (A). The semiconductor cleaning device of claim 7, wherein the carrying platform (100) further includes a primary driving device (3) including a mounting platform (1) and the primary driving device (2) a rotating motor (31), and a bracket (32), the rotating motor (31) can drive the carrying platform (1) to rotate, the bracket (32) is located outside the rotating motor (31); The bracket (32) further includes three movable telescopic units (321) disposed between the loading platform (1) and the main driving device (2) in a tripod configuration, and the movable telescopic unit (321) can The carrier platform (1) is driven to perform surface deflection in at least one direction based on the horizontal plane (A). A semiconductor cleaning device includes a carrying platform (100) and a cleaning assembly (200) disposed at a top end of the carrying platform (100), the carrying platform (100) being capable of carrying a semiconductor wafer (10) for cleaning The component (200) can be used for high pressure rinsing and blow drying of the semiconductor wafer (10), characterized in that: The carrying platform (100) includes a carrying platform (1) and a main driving device (2); the carrying platform (1) can be used for carrying and positioning the semiconductor wafer (10); a driving device (2) comprising a main longitudinal driving device (21) at the bottom end, and a main lateral driving device (22) disposed between the main longitudinal driving device (21) and the carrying platform (1); The main longitudinal driving device (21) is capable of driving the main longitudinal driving device (21) such that the loading platform (1) thereon is longitudinally moved on a horizontal plane (A); the main lateral driving device (22) , the loading platform (1) can be laterally moved on the horizontal plane (A); the cleaning assembly (200) includes a driving device (4), a high pressure nozzle group (5), and an image capturing device ( 6); the driving device (4), which can be used to carry the high-pressure nozzle group (5); the high-pressure nozzle group (5) is disposed on the driving device (4), and can be driven by the driving device (4) driving the three-dimensional movement in at least one direction, and performing high-pressure flushing and blowing drying on the semiconductor wafer (10), including An angle-adjustable nozzle (51); the image capturing device (6) is disposed above the carrying platform (100) and can be used to take the semiconductor wafer (10) carried on the carrying platform (100) For example, after the flow path is calculated, the flushing operation path is set, so that the high pressure nozzle group (5) can be flushed according to the aforementioned flushing operation path. The semiconductor cleaning device of claim 9, wherein the carrying platform (100) further includes a primary driving device (3) including a mounting platform (1) and the primary driving device (2) a rotating motor (31), and a bracket (32), the rotating motor (31) can drive the carrying platform (1) to rotate, the bracket (32) is located outside the rotating motor (31); The bracket (32) further includes three movable telescopic units (321) disposed between the loading platform (1) and the main driving device (2) in a tripod configuration, and the movable telescopic unit (321) can Cooperate The stage (1) is deflected in at least one direction based on the horizontal plane (A). The semiconductor cleaning device of claim 10, wherein the driving device (4) further comprises a longitudinal driving device (41) and a lateral driving device (42) disposed at a bottom end of the longitudinal driving device (41). And a vertical driving device (43) disposed on the lateral driving device (42), the vertical driving device (43) being capable of carrying the high pressure nozzle group (5).